WO2008123488A1 - Radiator for semiconductor device and method of producing the same - Google Patents

Radiator for semiconductor device and method of producing the same Download PDF

Info

Publication number
WO2008123488A1
WO2008123488A1 PCT/JP2008/056288 JP2008056288W WO2008123488A1 WO 2008123488 A1 WO2008123488 A1 WO 2008123488A1 JP 2008056288 W JP2008056288 W JP 2008056288W WO 2008123488 A1 WO2008123488 A1 WO 2008123488A1
Authority
WO
WIPO (PCT)
Prior art keywords
radiator
fixation
section
fixed
producing
Prior art date
Application number
PCT/JP2008/056288
Other languages
French (fr)
Japanese (ja)
Inventor
Takumi Koyama
Tadashi Yoshimura
Yousuke Watanabe
Mitsuya Miyamoto
Original Assignee
Mizutani Electric Ind.Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mizutani Electric Ind.Co., Ltd. filed Critical Mizutani Electric Ind.Co., Ltd.
Priority to JP2009509241A priority Critical patent/JP5368973B2/en
Publication of WO2008123488A1 publication Critical patent/WO2008123488A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A radiator for a semiconductor device and a method of producing the radiator. The radiator (1A) is composed mainly of a support base plate (10) and radiation fins (20). The support base plate (10) has fixation grooves (13) in its upper surface (11). Projections (14) are formed in the fixation grooves (13). Further, the radiator (1A) has first bent sections (15a) and second bent sections (15b) (fin fixation section) formed by pressing the projections (14). A second section (25) to be fixed of one radiation fin (20) is fixed by a first bent section (15a) to a fixation groove (13), and a first section (24') to be fixed of another radiation fin (20') is fixed by a second bent section (15b) to a fixation groove (13). The method of producing the radiator (1A) includes a base plate production step, a fin forming step, and a fixation step. The radiator is produced using a reduced number of parts, has a simple structure, and is of low cost.
PCT/JP2008/056288 2007-03-30 2008-03-31 Radiator for semiconductor device and method of producing the same WO2008123488A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009509241A JP5368973B2 (en) 2007-03-30 2008-03-31 Semiconductor device radiator and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007091855 2007-03-30
JP2007-091855 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123488A1 true WO2008123488A1 (en) 2008-10-16

Family

ID=39830966

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056288 WO2008123488A1 (en) 2007-03-30 2008-03-31 Radiator for semiconductor device and method of producing the same

Country Status (2)

Country Link
JP (1) JP5368973B2 (en)
WO (1) WO2008123488A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010006875A1 (en) * 2008-06-23 2010-01-21 Amer S.P.A. Improved heat sink, frequency converter comprising said heat sink and method for producing said heat sink
JP2010219428A (en) * 2009-03-18 2010-09-30 Delong Chen Structure of led heat radiator
EP2503593A1 (en) * 2009-11-17 2012-09-26 Mitsubishi Electric Corporation Heat dissipating device and method for manufacturing heat dissipating device
JP2015099904A (en) * 2013-11-18 2015-05-28 崇賢 ▲黄▼ Heat sink
KR101654052B1 (en) * 2016-04-05 2016-09-05 주식회사 금오산업 Assembling type heat sink
CN111902020A (en) * 2020-07-16 2020-11-06 深圳市飞荣达科技股份有限公司 Heat dissipation assembly and installation method thereof
WO2024024372A1 (en) * 2022-07-25 2024-02-01 ローム株式会社 Semiconductor device, electric power conversion unit and method for manufacturing semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07193383A (en) * 1993-12-27 1995-07-28 Nippon Light Metal Co Ltd Heat sink, and its manufacture and its working jig
JPH08111480A (en) * 1994-08-18 1996-04-30 Fuji Electric Co Ltd Cooling fin and its forming method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617039U (en) * 1984-06-19 1986-01-16 住友軽金属工業株式会社 heat sink
JP3033066U (en) * 1996-07-01 1997-01-17 水谷電機工業株式会社 Radiator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07193383A (en) * 1993-12-27 1995-07-28 Nippon Light Metal Co Ltd Heat sink, and its manufacture and its working jig
JPH08111480A (en) * 1994-08-18 1996-04-30 Fuji Electric Co Ltd Cooling fin and its forming method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010006875A1 (en) * 2008-06-23 2010-01-21 Amer S.P.A. Improved heat sink, frequency converter comprising said heat sink and method for producing said heat sink
JP2010219428A (en) * 2009-03-18 2010-09-30 Delong Chen Structure of led heat radiator
EP2503593A1 (en) * 2009-11-17 2012-09-26 Mitsubishi Electric Corporation Heat dissipating device and method for manufacturing heat dissipating device
EP2503593A4 (en) * 2009-11-17 2014-01-15 Mitsubishi Electric Corp Heat dissipating device and method for manufacturing heat dissipating device
US9134076B2 (en) 2009-11-17 2015-09-15 Mitsubishi Electric Corporation Radiator and method of manufacturing radiator
JP2015099904A (en) * 2013-11-18 2015-05-28 崇賢 ▲黄▼ Heat sink
KR101654052B1 (en) * 2016-04-05 2016-09-05 주식회사 금오산업 Assembling type heat sink
WO2017175940A1 (en) * 2016-04-05 2017-10-12 주식회사 금오산업 Assemblable heat radiating body
CN111902020A (en) * 2020-07-16 2020-11-06 深圳市飞荣达科技股份有限公司 Heat dissipation assembly and installation method thereof
WO2024024372A1 (en) * 2022-07-25 2024-02-01 ローム株式会社 Semiconductor device, electric power conversion unit and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
JP5368973B2 (en) 2013-12-18
JPWO2008123488A1 (en) 2010-07-15

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