JPS617039U - heat sink - Google Patents
heat sinkInfo
- Publication number
- JPS617039U JPS617039U JP9020884U JP9020884U JPS617039U JP S617039 U JPS617039 U JP S617039U JP 9020884 U JP9020884 U JP 9020884U JP 9020884 U JP9020884 U JP 9020884U JP S617039 U JPS617039 U JP S617039U
- Authority
- JP
- Japan
- Prior art keywords
- heat radiation
- heat sink
- board
- radiation board
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案によるヒートシンクの一実施例を示す
正面図、第２図は第１図のヒートシンクの側面図、第３
図は第１図のＸ−Ｘ線に沿う断面図、第４図は二の考案
における放熱基板の一例を示す拡大した斜視図、第５図
はこの考案における放熱フィンの一例を示す斜視図、第
６図はこの考案によるヒートシンクを組立てる方法を示
す要部拡大断面図、第７図は第６図の方法と異なる組立
て方法を示す同断面図、第８図〜第１１図は従来の各種
型式のヒートシンクをそれぞれ示す図で、−第８図〜第
１０図は斜視図、第１１図は断面図である。
１・・・放熱基板、２・・・フィン、５・・・フィンの
取付け部、７，７′・・・係止片、８・・・凹凸溝、９
・・・突条、１２−・・・半導体、１３・・・凹溝、１
４，１４’・・・打抜き孔、１５・・・ポンチ。Figure 1 is a front view showing an embodiment of the heat sink according to this invention, Figure 2 is a side view of the heat sink in Figure 1, and Figure 3 is a side view of the heat sink in Figure 1.
The figure is a sectional view taken along the line X-X of FIG. 1, FIG. 4 is an enlarged perspective view showing an example of the heat dissipation board in the second invention, and FIG. 5 is a perspective view showing an example of the heat dissipation fin in this invention. Fig. 6 is an enlarged sectional view of the main parts showing a method of assembling the heat sink according to this invention, Fig. 7 is a sectional view of the same showing an assembly method different from the method shown in Fig. 6, and Figs. 8 to 11 are various types of conventional types. 8 to 10 are perspective views, and FIG. 11 is a sectional view. DESCRIPTION OF SYMBOLS 1... Heat dissipation board, 2... Fin, 5... Fin attachment part, 7, 7'... Locking piece, 8... Uneven groove, 9
...Protrusion, 12-...Semiconductor, 13...Concave groove, 1
4,14'...Punching hole, 15...Punch.
Claims (1)
係止片が放熱基板に形成された凹溝内に挿し込まれると
吉もに、放熱フィンの前記取付け部が放熱基板に面接触
された状態となるよう、放熱フィンが放熱基板に置かれ
て、前記係止片が前記凹溝に隣接して設けられてあった
突条により、かしめ止めされていることを特徴とするヒ
ートシンク。When the locking piece of the heat radiation fin, which has a locking piece at the attachment part to the heat radiation board, is inserted into the groove formed in the heat radiation board, the attachment part of the heat radiation fin comes into surface contact with the heat radiation board. The heat sink is characterized in that the heat radiation fins are placed on the heat radiation board so that the heat radiation fins are placed on the heat radiation board, and the locking pieces are caulked by protrusions provided adjacent to the grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9020884U JPS617039U (en) | 1984-06-19 | 1984-06-19 | heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9020884U JPS617039U (en) | 1984-06-19 | 1984-06-19 | heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS617039U true JPS617039U (en) | 1986-01-16 |
| JPH037956Y2 JPH037956Y2 (en) | 1991-02-27 |
Family
ID=30644992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9020884U Granted JPS617039U (en) | 1984-06-19 | 1984-06-19 | heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS617039U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03178399A (en) * | 1989-11-13 | 1991-08-02 | Cemen Tech Inc | Device and method for treatment of sludge |
| JPH08111480A (en) * | 1994-08-18 | 1996-04-30 | Fuji Electric Co Ltd | Cooling fin and its forming method |
| JP2006041435A (en) * | 2004-07-30 | 2006-02-09 | Toshiyuki Arai | Heat sink for electric component |
| JP2011124251A (en) * | 2009-12-08 | 2011-06-23 | Renesas Electronics Corp | Semiconductor device and method of manufacturing the same |
| JP2013135209A (en) * | 2011-12-22 | 2013-07-08 | 崇賢 ▲黄▼ | Heat sink and method for producing the same |
| JP5368973B2 (en) * | 2007-03-30 | 2013-12-18 | 水谷電機工業株式会社 | Semiconductor device radiator and method of manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6560348B2 (en) * | 2015-06-16 | 2019-08-14 | 株式会社東京マルイ | Device for separating the next bullet in a simulated gun |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443479A (en) * | 1977-09-12 | 1979-04-06 | Toshiba Corp | Semiconductor stack |
| JPS5527679A (en) * | 1978-08-18 | 1980-02-27 | Nec Corp | Self-cooled heat sink for semiconductor element |
-
1984
- 1984-06-19 JP JP9020884U patent/JPS617039U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443479A (en) * | 1977-09-12 | 1979-04-06 | Toshiba Corp | Semiconductor stack |
| JPS5527679A (en) * | 1978-08-18 | 1980-02-27 | Nec Corp | Self-cooled heat sink for semiconductor element |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03178399A (en) * | 1989-11-13 | 1991-08-02 | Cemen Tech Inc | Device and method for treatment of sludge |
| JPH08111480A (en) * | 1994-08-18 | 1996-04-30 | Fuji Electric Co Ltd | Cooling fin and its forming method |
| JP2006041435A (en) * | 2004-07-30 | 2006-02-09 | Toshiyuki Arai | Heat sink for electric component |
| JP5368973B2 (en) * | 2007-03-30 | 2013-12-18 | 水谷電機工業株式会社 | Semiconductor device radiator and method of manufacturing the same |
| JP2011124251A (en) * | 2009-12-08 | 2011-06-23 | Renesas Electronics Corp | Semiconductor device and method of manufacturing the same |
| JP2013135209A (en) * | 2011-12-22 | 2013-07-08 | 崇賢 ▲黄▼ | Heat sink and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH037956Y2 (en) | 1991-02-27 |
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