TWI327637B - - Google Patents
Download PDFInfo
- Publication number
- TWI327637B TWI327637B TW096129520A TW96129520A TWI327637B TW I327637 B TWI327637 B TW I327637B TW 096129520 A TW096129520 A TW 096129520A TW 96129520 A TW96129520 A TW 96129520A TW I327637 B TWI327637 B TW I327637B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- hole
- heat sink
- gap
- heat pipe
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096129520A TW200907276A (en) | 2007-08-10 | 2007-08-10 | Heat dissipation device and its fabrication method |
US12/187,819 US20090038777A1 (en) | 2007-08-10 | 2008-08-07 | Heat sink and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096129520A TW200907276A (en) | 2007-08-10 | 2007-08-10 | Heat dissipation device and its fabrication method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200907276A TW200907276A (en) | 2009-02-16 |
TWI327637B true TWI327637B (fr) | 2010-07-21 |
Family
ID=40345373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096129520A TW200907276A (en) | 2007-08-10 | 2007-08-10 | Heat dissipation device and its fabrication method |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090038777A1 (fr) |
TW (1) | TW200907276A (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101932221B (zh) * | 2009-06-23 | 2014-08-20 | 富准精密工业(深圳)有限公司 | 散热装置 |
KR200468290Y1 (ko) | 2010-05-26 | 2013-08-12 | 충-시엔 후앙 | 냉각 장치 |
CN102538557B (zh) * | 2012-02-07 | 2014-03-05 | 魏辉 | 一种挤压式换热单元及其制作方法 |
CN114687892B (zh) | 2017-06-28 | 2024-04-26 | 巴斯夫公司 | 蒸发排放装置和吸附剂 |
US11624340B2 (en) | 2018-07-16 | 2023-04-11 | Basf Corporation | Evaporative emission control articles including activated carbon |
JP7489958B2 (ja) | 2018-07-16 | 2024-05-24 | ビーエーエスエフ コーポレーション | 活性炭を含む蒸発排出制御物品 |
CN114505411B (zh) * | 2022-01-21 | 2024-07-09 | 东莞汉旭五金塑胶科技有限公司 | 成串的散热鳍片组与热导管的紧配铆合结构及铆合方法 |
-
2007
- 2007-08-10 TW TW096129520A patent/TW200907276A/zh not_active IP Right Cessation
-
2008
- 2008-08-07 US US12/187,819 patent/US20090038777A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20090038777A1 (en) | 2009-02-12 |
TW200907276A (en) | 2009-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI327637B (fr) | ||
TW200926945A (en) | Cylindrical heat dissipater equipped with cooling fins | |
WO2013016998A1 (fr) | Dispositif de dissipation de chaleur du type à ailettes | |
TW201129307A (en) | Manufacturing method of heat pipe type heat-dissipating device | |
TW200848994A (en) | Heat dissipation device | |
CN101149235B (zh) | 一种热管散热器及其制造方法 | |
CN2845166Y (zh) | 热管散热器及其散热片 | |
TWI313203B (fr) | ||
TW201137301A (en) | Firm assembly structure of radiator cooling fin and heat pipe | |
TWM268111U (en) | Structure for punch rivet set of radiator and heat tube | |
CN2819475Y (zh) | 热管散热器及其散热片 | |
TWI270339B (en) | Heat conduits and method for forming heat-dissipating fins by squeeze-shaping | |
TWI322258B (fr) | ||
CN217181751U (zh) | 一种石墨烯聚丙烯的led显示屏 | |
TWM271365U (en) | Improvement of heat dissipation device and heat dissipation fin | |
CN213238575U (zh) | 一种热管用换热器及其换热器组 | |
TW200907279A (en) | Method and fixture for manufacturing heat dissipation device | |
JP3163968U (ja) | フィン構造及びその放熱装置 | |
CN206524227U (zh) | 一种用于油浸式的变压器散热器 | |
CN204316860U (zh) | 一种具有高导热高韧性结构的铝基板 | |
TW200740358A (en) | Three-in-one heat dissipation device and manufacturing method thereof | |
TW201026209A (en) | Fin heat sink structure and the assembly method thereof | |
CN108716660A (zh) | 一种契合拼装式led灯散热装置及其拼装方法 | |
CN202274467U (zh) | Led灯具散热结构及led灯具 | |
TWM278219U (en) | Heat pipe radiator and cooling fins thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |