TWI323144B - - Google Patents

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Publication number
TWI323144B
TWI323144B TW95147391A TW95147391A TWI323144B TW I323144 B TWI323144 B TW I323144B TW 95147391 A TW95147391 A TW 95147391A TW 95147391 A TW95147391 A TW 95147391A TW I323144 B TWI323144 B TW I323144B
Authority
TW
Taiwan
Prior art keywords
conductive
high thermal
conductive carrier
thermal conductivity
aluminum plate
Prior art date
Application number
TW95147391A
Other languages
English (en)
Chinese (zh)
Other versions
TW200829090A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW95147391A priority Critical patent/TW200829090A/zh
Publication of TW200829090A publication Critical patent/TW200829090A/zh
Application granted granted Critical
Publication of TWI323144B publication Critical patent/TWI323144B/zh

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW95147391A 2006-12-18 2006-12-18 High thermal and electrical conduction carrying-plate TW200829090A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95147391A TW200829090A (en) 2006-12-18 2006-12-18 High thermal and electrical conduction carrying-plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95147391A TW200829090A (en) 2006-12-18 2006-12-18 High thermal and electrical conduction carrying-plate

Publications (2)

Publication Number Publication Date
TW200829090A TW200829090A (en) 2008-07-01
TWI323144B true TWI323144B (ko) 2010-04-01

Family

ID=44817855

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95147391A TW200829090A (en) 2006-12-18 2006-12-18 High thermal and electrical conduction carrying-plate

Country Status (1)

Country Link
TW (1) TW200829090A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016075549A (ja) * 2014-10-06 2016-05-12 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置

Also Published As

Publication number Publication date
TW200829090A (en) 2008-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees