TWI321159B - Solder alloy for producing sputtering target and sputtering target using the same - Google Patents

Solder alloy for producing sputtering target and sputtering target using the same Download PDF

Info

Publication number
TWI321159B
TWI321159B TW095121366A TW95121366A TWI321159B TW I321159 B TWI321159 B TW I321159B TW 095121366 A TW095121366 A TW 095121366A TW 95121366 A TW95121366 A TW 95121366A TW I321159 B TWI321159 B TW I321159B
Authority
TW
Taiwan
Prior art keywords
alloy
solder alloy
target
bonding
solder
Prior art date
Application number
TW095121366A
Other languages
English (en)
Chinese (zh)
Other versions
TW200643193A (en
Inventor
Naoki Ono
Taizo Morinaka
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200643193A publication Critical patent/TW200643193A/zh
Application granted granted Critical
Publication of TWI321159B publication Critical patent/TWI321159B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
TW095121366A 2005-06-15 2006-06-15 Solder alloy for producing sputtering target and sputtering target using the same TWI321159B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005175628 2005-06-15

Publications (2)

Publication Number Publication Date
TW200643193A TW200643193A (en) 2006-12-16
TWI321159B true TWI321159B (en) 2010-03-01

Family

ID=37518842

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095121366A TWI321159B (en) 2005-06-15 2006-06-15 Solder alloy for producing sputtering target and sputtering target using the same

Country Status (3)

Country Link
KR (1) KR100785208B1 (ko)
CN (1) CN100590213C (ko)
TW (1) TWI321159B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102409300B (zh) * 2011-09-07 2013-08-14 三峡大学 氧化物陶瓷溅射靶及其制备方法和所用的钎焊合金
CN103785911B (zh) * 2012-10-30 2016-03-09 宁波江丰电子材料股份有限公司 靶材组件的焊接方法
JP5773335B2 (ja) * 2013-12-09 2015-09-02 三菱マテリアル株式会社 Ｉｎ又はＩｎ合金スパッタリングターゲット及びその製造方法
TWI612025B (zh) * 2015-09-23 2018-01-21 住華科技股份有限公司 製作濺鍍靶材的銲料及其應用方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69524912T2 (de) * 1994-09-30 2002-08-22 AT & T CORP., NEW YORK Bleifreie Legierungen zum Weichlöten
JP3319740B2 (ja) * 2000-06-02 2002-09-03 株式会社日鉱マテリアルズ ロウ材塗布装置

Also Published As

Publication number Publication date
CN1880492A (zh) 2006-12-20
KR100785208B1 (ko) 2007-12-11
CN100590213C (zh) 2010-02-17
KR20060131625A (ko) 2006-12-20
TW200643193A (en) 2006-12-16

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