DE69524912T2 - Bleifreie Legierungen zum Weichlöten - Google Patents

Bleifreie Legierungen zum Weichlöten

Info

Publication number
DE69524912T2
DE69524912T2 DE69524912T DE69524912T DE69524912T2 DE 69524912 T2 DE69524912 T2 DE 69524912T2 DE 69524912 T DE69524912 T DE 69524912T DE 69524912 T DE69524912 T DE 69524912T DE 69524912 T2 DE69524912 T2 DE 69524912T2
Authority
DE
Germany
Prior art keywords
lead
soft soldering
free alloys
alloys
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69524912T
Other languages
English (en)
Other versions
DE69524912D1 (de
Inventor
Ho Sou Chen
Mark Thomas Mccormack
Sungho Jin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE69524912D1 publication Critical patent/DE69524912D1/de
Publication of DE69524912T2 publication Critical patent/DE69524912T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
DE69524912T 1994-09-30 1995-09-27 Bleifreie Legierungen zum Weichlöten Expired - Lifetime DE69524912T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31668794A 1994-09-30 1994-09-30

Publications (2)

Publication Number Publication Date
DE69524912D1 DE69524912D1 (de) 2002-02-14
DE69524912T2 true DE69524912T2 (de) 2002-08-22

Family

ID=23230203

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69524912T Expired - Lifetime DE69524912T2 (de) 1994-09-30 1995-09-27 Bleifreie Legierungen zum Weichlöten

Country Status (4)

Country Link
US (1) US5698160A (de)
EP (1) EP0704272B1 (de)
JP (1) JP3533017B2 (de)
DE (1) DE69524912T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10215572B4 (de) * 2001-04-10 2011-03-24 Murata Manufacturing Co., Ltd., Nagaokakyo Elektrischer Anschluss und elektrisches Bauelement damit

Families Citing this family (30)

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Publication number Priority date Publication date Assignee Title
CN1087994C (zh) 1995-09-29 2002-07-24 松下电器产业株式会社 无铅钎料合金
JPH0994687A (ja) * 1995-09-29 1997-04-08 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JP3688429B2 (ja) * 1997-04-25 2005-08-31 株式会社東芝 電子部品実装用基板および電子部品実装基板
US6082610A (en) 1997-06-23 2000-07-04 Ford Motor Company Method of forming interconnections on electronic modules
JP3311282B2 (ja) * 1997-10-13 2002-08-05 株式会社東芝 金属部材の接合方法及び接合体
TW516984B (en) * 1999-12-28 2003-01-11 Toshiba Corp Solder material, device using the same and manufacturing process thereof
JP3721073B2 (ja) * 1999-12-28 2005-11-30 株式会社東芝 ハンダ材及びこれを用いたデバイス又は装置並びにその製造方法
US6503338B1 (en) * 2000-04-28 2003-01-07 Senju Metal Industry Co., Ltd. Lead-free solder alloys
US6896172B2 (en) * 2000-08-22 2005-05-24 Senju Metal Industry Co., Ltd. Lead-free solder paste for reflow soldering
JP2002224880A (ja) * 2000-11-28 2002-08-13 Fujitsu Ltd はんだペースト、および電子装置
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
JP2003338682A (ja) * 2002-01-11 2003-11-28 Nec Infrontia Corp はんだ付け方法及びはんだ接合体
US7681777B2 (en) 2003-04-01 2010-03-23 Senju Metal Industry Co., Ltd. Solder paste and printed circuit board
JP4856362B2 (ja) * 2004-05-20 2012-01-18 Ｔｄｋ株式会社 高電圧セラミックコンデンサ
DE102004039341B3 (de) * 2004-08-12 2005-12-08 Forschungsvereinigung Antriebstechnik E.V. Zinnbad zum Verzinnen von Stützkörpern von Gleitlagern
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
KR100785208B1 (ko) * 2005-06-15 2007-12-11 미쓰이 긴조꾸 고교 가부시키가이샤 스퍼터링 타깃 제조용 땜납 합금 및 이것을 이용한스퍼터링 타깃
EP1749616A1 (de) * 2005-08-05 2007-02-07 Grillo-Werke AG Verfahren zum Lichtbogen- oder Strahllöten/-schweissen von Werkstücken gleicher oder verschiedener Metalle oder Metalllegierungen mit Zusatzwerkstoffen aus Sn-Basis-Legierungen; Draht bestehend aus einer Zinn-Basis-Legierung
KR100793970B1 (ko) 2007-03-12 2008-01-16 삼성전자주식회사 Ｚｎ을 이용하는 솔더링 구조물 및 솔더링 방법
JP5502732B2 (ja) * 2007-07-23 2014-05-28 ヘンケル リミテッド ハンダ用フラックス
US20090242121A1 (en) * 2008-03-31 2009-10-01 Daewoong Suh Low stress, low-temperature metal-metal composite flip chip interconnect
US9735126B2 (en) 2011-06-07 2017-08-15 Infineon Technologies Ag Solder alloys and arrangements
KR101376856B1 (ko) * 2011-11-17 2014-03-21 삼성전기주식회사 무연 솔더 합금의 제조방법
US20140008170A1 (en) * 2012-07-06 2014-01-09 Henry R. Vanderzyden Integrated drive generator disconnect assembly
DE102013006388A1 (de) * 2013-04-15 2014-10-16 Zollern Bhw Gleitlager Gmbh & Co. Kg Gleitlagerlegierung auf Zinnbasis
WO2014179108A1 (en) 2013-05-03 2014-11-06 Honeywell International Inc. Lead frame construct for lead-free solder connections
US20150151387A1 (en) * 2013-12-04 2015-06-04 Honeywell International Inc. Zinc-based lead-free solder compositions
JP2017509489A (ja) 2014-02-20 2017-04-06 ハネウェル・インターナショナル・インコーポレーテッド 鉛フリーはんだ組成物
EP3447846A1 (de) 2017-08-25 2019-02-27 AGC Glass Europe Verglasung mit einem elektrisch leitfähigen verbinder

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH80998A (fr) * 1918-08-09 1920-01-02 Gustave Ferriere Soudure pour l'aluminium
DE806820C (de) * 1949-10-25 1951-06-18 Rau Fa G Weichlot
GB671079A (en) * 1949-11-16 1952-04-30 Richard Chadwick Improvements in or relating to solders
GB747813A (en) * 1951-06-11 1956-04-18 Sheffield Smelting Company Ltd Improvements relating to the soldering of aluminium and aluminium alloys
US4112868A (en) * 1976-05-24 1978-09-12 Asahi Glass Company, Ltd. Soldering apparatus
DE3425290A1 (de) * 1984-07-10 1986-01-16 Atlas Fahrzeugtechnik GmbH, 5980 Werdohl Piezokeramische ventilplatte und verfahren zu deren herstellung
ATE65444T1 (de) * 1986-02-19 1991-08-15 Degussa Verwendung einer weichlotlegierung zum verbinden von keramikteilen.
FR2619101A1 (fr) * 1987-08-05 1989-02-10 Saint Gobain Vitrage Technique de production de microspheres en silice
US5256370B1 (en) * 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium
US5229070A (en) * 1992-07-02 1993-07-20 Motorola, Inc. Low temperature-wetting tin-base solder paste
US5242658A (en) * 1992-07-07 1993-09-07 The Indium Corporation Of America Lead-free alloy containing tin, zinc and indium
US5346775A (en) * 1993-02-22 1994-09-13 At&T Laboratories Article comprising solder with improved mechanical properties
EP0612578A1 (de) * 1993-02-22 1994-08-31 AT&T Corp. Gegenstand, der ein bleifreies Weichlot mit verbesserten mechanischen Eigenschaften enthält
TW251249B (de) * 1993-04-30 1995-07-11 At & T Corp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10215572B4 (de) * 2001-04-10 2011-03-24 Murata Manufacturing Co., Ltd., Nagaokakyo Elektrischer Anschluss und elektrisches Bauelement damit

Also Published As

Publication number Publication date
JPH08118067A (ja) 1996-05-14
EP0704272B1 (de) 2002-01-09
DE69524912D1 (de) 2002-02-14
US5698160A (en) 1997-12-16
JP3533017B2 (ja) 2004-05-31
EP0704272A1 (de) 1996-04-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition