TWI316040B - Packing box for glass substrate and a package structure of a glass substrate using the same - Google Patents

Packing box for glass substrate and a package structure of a glass substrate using the same

Info

Publication number
TWI316040B
TWI316040B TW095141783A TW95141783A TWI316040B TW I316040 B TWI316040 B TW I316040B TW 095141783 A TW095141783 A TW 095141783A TW 95141783 A TW95141783 A TW 95141783A TW I316040 B TWI316040 B TW I316040B
Authority
TW
Taiwan
Prior art keywords
glass substrate
same
packing box
package structure
glass
Prior art date
Application number
TW095141783A
Other languages
English (en)
Other versions
TW200821234A (en
Inventor
Shu Hui Kao
Cheng Doul Chuang
Wen Kai Chung
Hung Wen Yang
Original Assignee
Innolux Display Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innolux Display Corp filed Critical Innolux Display Corp
Priority to TW095141783A priority Critical patent/TWI316040B/zh
Priority to US11/985,259 priority patent/US20080110795A1/en
Publication of TW200821234A publication Critical patent/TW200821234A/zh
Application granted granted Critical
Publication of TWI316040B publication Critical patent/TWI316040B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Buffer Packaging (AREA)
TW095141783A 2006-11-10 2006-11-10 Packing box for glass substrate and a package structure of a glass substrate using the same TWI316040B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095141783A TWI316040B (en) 2006-11-10 2006-11-10 Packing box for glass substrate and a package structure of a glass substrate using the same
US11/985,259 US20080110795A1 (en) 2006-11-10 2007-11-13 Packing case for substrates of flat display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095141783A TWI316040B (en) 2006-11-10 2006-11-10 Packing box for glass substrate and a package structure of a glass substrate using the same

Publications (2)

Publication Number Publication Date
TW200821234A TW200821234A (en) 2008-05-16
TWI316040B true TWI316040B (en) 2009-10-21

Family

ID=39368170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141783A TWI316040B (en) 2006-11-10 2006-11-10 Packing box for glass substrate and a package structure of a glass substrate using the same

Country Status (2)

Country Link
US (1) US20080110795A1 (zh)
TW (1) TWI316040B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM467168U (zh) * 2013-04-09 2013-12-01 Gudeng Prec Ind Co Ltd 防靜電之基板收納容器
KR101617275B1 (ko) * 2013-05-28 2016-05-02 코닝정밀소재 주식회사 기판 반송용 박스
CN103708127B (zh) * 2013-12-24 2015-09-09 京东方科技集团股份有限公司 一种显示面板的包装结构及包装方法
TWI610863B (zh) * 2017-07-14 2018-01-11 友達光電股份有限公司 包裝箱
CN107792475B (zh) * 2017-10-27 2019-12-03 友达光电（苏州）有限公司 包装结构

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT8120590V0 (it) * 1981-01-26 1981-01-26 Meschi Ind Grafica Confezione apribile, in particolare per materiali in foglio.
US4566839A (en) * 1983-05-18 1986-01-28 Microglass, Inc. Semiconductor wafer diffusion boat and method
JPS6166338U (zh) * 1984-10-04 1986-05-07
US5025926A (en) * 1987-07-07 1991-06-25 Empak, Inc. Package
US5330053A (en) * 1991-02-07 1994-07-19 Dai Nippon Printing Co., Ltd. Case for photomask
JP2552625B2 (ja) * 1993-11-09 1996-11-13 淀川化成株式会社 ガラス基板搬送用ボックス
TW296361B (zh) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk
US5857573A (en) * 1998-01-15 1999-01-12 Advanced Micro Devices, Inc. Tray for shipping PCMCIA cards
FR2785270B1 (fr) * 1998-10-30 2001-01-19 St Microelectronics Sa Cassette de transport de plaquettes de semiconducteur
US6962476B2 (en) * 2002-01-15 2005-11-08 Cardinal Ig Company Methods and apparatus for handling fragile bars
US7463338B2 (en) * 2003-07-08 2008-12-09 Hoya Corporation Container for housing a mask blank, method of housing a mask blank, and mask blank package
TWI337160B (en) * 2003-10-09 2011-02-11 Entegris Inc Shipper with tooth design for improved loading
JP4584023B2 (ja) * 2005-05-17 2010-11-17 信越ポリマー株式会社 基板収納容器及びその製造方法

Also Published As

Publication number Publication date
US20080110795A1 (en) 2008-05-15
TW200821234A (en) 2008-05-16

Similar Documents

Publication Publication Date Title
EP2045187A4 (en) TRANSPORT DEVICE AND CONTAINER PACKING DEVICE THEREWITH
TWI319615B (en) Package substrate and manufacturing method thereof
TWI351087B (en) Package substrate and method for fabricating the same
EP2201615B8 (en) Led package and method for manufacturing the led package
GB2451565B (en) Biochip package and biochip packaging substrate
GB0512013D0 (en) Packing box for packaging and display
TWI316040B (en) Packing box for glass substrate and a package structure of a glass substrate using the same
GB2433774B (en) Packaging box
SG117541A1 (en) Packaging for optoelectronic devices
ZAA200501713S (en) Packaging box
TWI368303B (en) Packaging substrate structure
EP2043146A4 (en) HOOD OR HOUSING FOR ENABLING THE SEALING OF AN INTEGRATED CIRCUIT BOX AND METHOD OF MAKING THE COVER OR HOUSING
TWI349995B (en) A tenon-and-mortise packaging structure and manufacturing method of the same
TWI368302B (en) Surface structure of package substrate and method of manufacturing the same
TWI349991B (en) Semiconductor packaging tape
TWI340449B (en) Packaging substrate surface structure and method for fabricating the same
GB2454830B (en) Extended package substrate
TWI348212B (en) Packaging substrate structure and method thereof
TWI348206B (en) A tenon-and-mortise package structure and manufacturing method of the same
GB0522657D0 (en) Packaging box
TWM301212U (en) Panel packing box
TWI366905B (en) Packaging substrate structure
TWM298584U (en) Packing box structure
HK1086440A2 (en) A packaging box
TWI349987B (en) Packaging substrate structure and method for manufacturing the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees