TWI368303B - Packaging substrate structure - Google Patents

Packaging substrate structure

Info

Publication number
TWI368303B
TWI368303B TW096149219A TW96149219A TWI368303B TW I368303 B TWI368303 B TW I368303B TW 096149219 A TW096149219 A TW 096149219A TW 96149219 A TW96149219 A TW 96149219A TW I368303 B TWI368303 B TW I368303B
Authority
TW
Taiwan
Prior art keywords
substrate structure
packaging substrate
packaging
substrate
Prior art date
Application number
TW096149219A
Other languages
Chinese (zh)
Other versions
TW200929467A (en
Inventor
Wen Hung Hu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW096149219A priority Critical patent/TWI368303B/en
Publication of TW200929467A publication Critical patent/TW200929467A/en
Application granted granted Critical
Publication of TWI368303B publication Critical patent/TWI368303B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
TW096149219A 2007-12-21 2007-12-21 Packaging substrate structure TWI368303B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096149219A TWI368303B (en) 2007-12-21 2007-12-21 Packaging substrate structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096149219A TWI368303B (en) 2007-12-21 2007-12-21 Packaging substrate structure

Publications (2)

Publication Number Publication Date
TW200929467A TW200929467A (en) 2009-07-01
TWI368303B true TWI368303B (en) 2012-07-11

Family

ID=44864492

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096149219A TWI368303B (en) 2007-12-21 2007-12-21 Packaging substrate structure

Country Status (1)

Country Link
TW (1) TWI368303B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI450348B (en) * 2010-02-25 2014-08-21 Tripod Technology Corp Electronic device with vertical conductive connectors and method thereof
TWI562295B (en) 2012-07-31 2016-12-11 Mediatek Inc Semiconductor package and method for fabricating base for semiconductor package
US10991669B2 (en) 2012-07-31 2021-04-27 Mediatek Inc. Semiconductor package using flip-chip technology
CN103681384B (en) 2012-09-17 2016-06-01 宏启胜精密电子(秦皇岛)有限公司 Chip package base plate and structure and making method thereof
US10763199B2 (en) * 2018-12-24 2020-09-01 Nanya Technology Corporation Semiconductor package structure and method for preparing the same

Also Published As

Publication number Publication date
TW200929467A (en) 2009-07-01

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