TWI368303B - Packaging substrate structure - Google Patents
Packaging substrate structureInfo
- Publication number
- TWI368303B TWI368303B TW096149219A TW96149219A TWI368303B TW I368303 B TWI368303 B TW I368303B TW 096149219 A TW096149219 A TW 096149219A TW 96149219 A TW96149219 A TW 96149219A TW I368303 B TWI368303 B TW I368303B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate structure
- packaging substrate
- packaging
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096149219A TWI368303B (en) | 2007-12-21 | 2007-12-21 | Packaging substrate structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096149219A TWI368303B (en) | 2007-12-21 | 2007-12-21 | Packaging substrate structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200929467A TW200929467A (en) | 2009-07-01 |
TWI368303B true TWI368303B (en) | 2012-07-11 |
Family
ID=44864492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096149219A TWI368303B (en) | 2007-12-21 | 2007-12-21 | Packaging substrate structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI368303B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI450348B (en) * | 2010-02-25 | 2014-08-21 | Tripod Technology Corp | Electronic device with vertical conductive connectors and method thereof |
TWI562295B (en) | 2012-07-31 | 2016-12-11 | Mediatek Inc | Semiconductor package and method for fabricating base for semiconductor package |
US10991669B2 (en) | 2012-07-31 | 2021-04-27 | Mediatek Inc. | Semiconductor package using flip-chip technology |
CN103681384B (en) | 2012-09-17 | 2016-06-01 | 宏启胜精密电子(秦皇岛)有限公司 | Chip package base plate and structure and making method thereof |
US10763199B2 (en) * | 2018-12-24 | 2020-09-01 | Nanya Technology Corporation | Semiconductor package structure and method for preparing the same |
-
2007
- 2007-12-21 TW TW096149219A patent/TWI368303B/en active
Also Published As
Publication number | Publication date |
---|---|
TW200929467A (en) | 2009-07-01 |
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