TWI366905B - Packaging substrate structure - Google Patents

Packaging substrate structure

Info

Publication number
TWI366905B
TWI366905B TW096144238A TW96144238A TWI366905B TW I366905 B TWI366905 B TW I366905B TW 096144238 A TW096144238 A TW 096144238A TW 96144238 A TW96144238 A TW 96144238A TW I366905 B TWI366905 B TW I366905B
Authority
TW
Taiwan
Prior art keywords
substrate structure
packaging substrate
packaging
substrate
Prior art date
Application number
TW096144238A
Other languages
Chinese (zh)
Other versions
TW200924140A (en
Inventor
Shih Ping Hsu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW096144238A priority Critical patent/TWI366905B/en
Publication of TW200924140A publication Critical patent/TW200924140A/en
Application granted granted Critical
Publication of TWI366905B publication Critical patent/TWI366905B/en

Links

TW096144238A 2007-11-22 2007-11-22 Packaging substrate structure TWI366905B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096144238A TWI366905B (en) 2007-11-22 2007-11-22 Packaging substrate structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096144238A TWI366905B (en) 2007-11-22 2007-11-22 Packaging substrate structure

Publications (2)

Publication Number Publication Date
TW200924140A TW200924140A (en) 2009-06-01
TWI366905B true TWI366905B (en) 2012-06-21

Family

ID=44728894

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096144238A TWI366905B (en) 2007-11-22 2007-11-22 Packaging substrate structure

Country Status (1)

Country Link
TW (1) TWI366905B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103681384B (en) 2012-09-17 2016-06-01 宏启胜精密电子(秦皇岛)有限公司 Chip package base plate and structure and making method thereof

Also Published As

Publication number Publication date
TW200924140A (en) 2009-06-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees