TWI348212B - Packaging substrate structure and method thereof - Google Patents

Packaging substrate structure and method thereof

Info

Publication number
TWI348212B
TWI348212B TW096130122A TW96130122A TWI348212B TW I348212 B TWI348212 B TW I348212B TW 096130122 A TW096130122 A TW 096130122A TW 96130122 A TW96130122 A TW 96130122A TW I348212 B TWI348212 B TW I348212B
Authority
TW
Taiwan
Prior art keywords
substrate structure
packaging substrate
packaging
substrate
Prior art date
Application number
TW096130122A
Other languages
Chinese (zh)
Other versions
TW200908267A (en
Inventor
Wen Hung Hu
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW096130122A priority Critical patent/TWI348212B/en
Publication of TW200908267A publication Critical patent/TW200908267A/en
Application granted granted Critical
Publication of TWI348212B publication Critical patent/TWI348212B/en

Links

TW096130122A 2007-08-15 2007-08-15 Packaging substrate structure and method thereof TWI348212B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096130122A TWI348212B (en) 2007-08-15 2007-08-15 Packaging substrate structure and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096130122A TWI348212B (en) 2007-08-15 2007-08-15 Packaging substrate structure and method thereof

Publications (2)

Publication Number Publication Date
TW200908267A TW200908267A (en) 2009-02-16
TWI348212B true TWI348212B (en) 2011-09-01

Family

ID=44723627

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096130122A TWI348212B (en) 2007-08-15 2007-08-15 Packaging substrate structure and method thereof

Country Status (1)

Country Link
TW (1) TWI348212B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10433413B2 (en) 2014-08-15 2019-10-01 Unimicron Technology Corp. Manufacturing method of circuit structure embedded with heat-dissipation block
CN109065509A (en) * 2018-08-10 2018-12-21 付伟 Chip-packaging structure and preparation method thereof with single cofferdam and outer Mobile Communication hole

Also Published As

Publication number Publication date
TW200908267A (en) 2009-02-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees