TWI313875B - - Google Patents
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- Publication number
- TWI313875B TWI313875B TW93100263A TW93100263A TWI313875B TW I313875 B TWI313875 B TW I313875B TW 93100263 A TW93100263 A TW 93100263A TW 93100263 A TW93100263 A TW 93100263A TW I313875 B TWI313875 B TW I313875B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal foil
- substrate
- layer
- resistor
- forming
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims description 88
- 239000002184 metal Substances 0.000 claims description 88
- 239000011888 foil Substances 0.000 claims description 85
- 239000010410 layer Substances 0.000 claims description 71
- 239000000758 substrate Substances 0.000 claims description 60
- 239000004020 conductor Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 22
- 125000006850 spacer group Chemical group 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 238000002679 ablation Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052770 Uranium Inorganic materials 0.000 claims description 3
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000002955 isolation Methods 0.000 claims description 2
- 238000003698 laser cutting Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 2
- 230000004888 barrier function Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- YAFRYXYYPHSFSZ-UHFFFAOYSA-N copper manganese Chemical group [Mn].[Cu].[Cu].[Cu] YAFRYXYYPHSFSZ-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 33
- 235000012431 wafers Nutrition 0.000 description 28
- 238000007650 screen-printing Methods 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000976 ink Substances 0.000 description 6
- 238000004377 microelectronic Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- HPDFFVBPXCTEDN-UHFFFAOYSA-N copper manganese Chemical compound [Mn].[Cu] HPDFFVBPXCTEDN-UHFFFAOYSA-N 0.000 description 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- -1 nickel-chromium-aluminum Chemical compound 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000012812 sealant material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical class [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000004591 urethane sealant Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93100263A TW200523955A (en) | 2004-01-06 | 2004-01-06 | Method for manufacturing surface-mounted metal foil chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93100263A TW200523955A (en) | 2004-01-06 | 2004-01-06 | Method for manufacturing surface-mounted metal foil chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200523955A TW200523955A (en) | 2005-07-16 |
| TWI313875B true TWI313875B (ja) | 2009-08-21 |
Family
ID=45072851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93100263A TW200523955A (en) | 2004-01-06 | 2004-01-06 | Method for manufacturing surface-mounted metal foil chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200523955A (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101412951B1 (ko) | 2012-08-17 | 2014-06-26 | 삼성전기주식회사 | 칩 저항기 및 이의 제조 방법 |
-
2004
- 2004-01-06 TW TW93100263A patent/TW200523955A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200523955A (en) | 2005-07-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |