TWI313511B - Method of fabricating strained si soi wafers - Google Patents

Method of fabricating strained si soi wafers Download PDF

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Publication number
TWI313511B
TWI313511B TW093134665A TW93134665A TWI313511B TW I313511 B TWI313511 B TW I313511B TW 093134665 A TW093134665 A TW 093134665A TW 93134665 A TW93134665 A TW 93134665A TW I313511 B TWI313511 B TW I313511B
Authority
TW
Taiwan
Prior art keywords
semiconductor layer
crystalline semiconductor
layer
annealing
annealing step
Prior art date
Application number
TW093134665A
Other languages
English (en)
Chinese (zh)
Other versions
TW200529422A (en
Inventor
Stephen W Bedell
Guy M Cohen
Huajie Chen
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200529422A publication Critical patent/TW200529422A/zh
Application granted granted Critical
Publication of TWI313511B publication Critical patent/TWI313511B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Recrystallisation Techniques (AREA)
  • Element Separation (AREA)
TW093134665A 2003-12-05 2004-11-12 Method of fabricating strained si soi wafers TWI313511B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/728,519 US6972247B2 (en) 2003-12-05 2003-12-05 Method of fabricating strained Si SOI wafers

Publications (2)

Publication Number Publication Date
TW200529422A TW200529422A (en) 2005-09-01
TWI313511B true TWI313511B (en) 2009-08-11

Family

ID=34633733

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093134665A TWI313511B (en) 2003-12-05 2004-11-12 Method of fabricating strained si soi wafers

Country Status (7)

Country Link
US (1) US6972247B2 (https=)
EP (1) EP1695377A2 (https=)
JP (1) JP4939224B2 (https=)
KR (1) KR100940748B1 (https=)
CN (1) CN100505163C (https=)
TW (1) TWI313511B (https=)
WO (1) WO2005055290A2 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005112129A1 (ja) * 2004-05-13 2005-11-24 Fujitsu Limited 半導体装置およびその製造方法、半導体基板の製造方法
US7488670B2 (en) * 2005-07-13 2009-02-10 Infineon Technologies Ag Direct channel stress
FR2890489B1 (fr) * 2005-09-08 2008-03-07 Soitec Silicon On Insulator Procede de fabrication d'une heterostructure de type semi-conducteur sur isolant
US8319285B2 (en) * 2005-12-22 2012-11-27 Infineon Technologies Ag Silicon-on-insulator chip having multiple crystal orientations
US7560318B2 (en) * 2006-03-13 2009-07-14 Freescale Semiconductor, Inc. Process for forming an electronic device including semiconductor layers having different stresses
CN100431132C (zh) * 2006-03-30 2008-11-05 上海理工大学 一种采用相变方法实现绝缘体上应变硅的制作方法
DE102006030257B4 (de) * 2006-06-30 2010-04-08 Advanced Micro Devices, Inc., Sunnyvale Teststruktur zum Bestimmen der Eigenschaften von Halbleiterlegierungen in SOI-Transistoren mittels Röntgenbeugung
JP4943820B2 (ja) * 2006-11-10 2012-05-30 信越化学工業株式会社 ＧＯＩ（ＧｅｏｎＩｎｓｕｌａｔｏｒ）基板の製造方法
US8227020B1 (en) * 2007-03-29 2012-07-24 Npl Associates, Inc. Dislocation site formation techniques
US8603405B2 (en) 2007-03-29 2013-12-10 Npl Associates, Inc. Power units based on dislocation site techniques
WO2008156040A1 (en) * 2007-06-20 2008-12-24 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
KR100868643B1 (ko) * 2007-07-20 2008-11-12 주식회사 동부하이텍 이미지센서 및 그 제조방법
US8329260B2 (en) 2008-03-11 2012-12-11 Varian Semiconductor Equipment Associates, Inc. Cooled cleaving implant
FR2931293B1 (fr) 2008-05-15 2010-09-03 Soitec Silicon On Insulator Procede de fabrication d'une heterostructure support d'epitaxie et heterostructure correspondante
US8138066B2 (en) * 2008-10-01 2012-03-20 International Business Machines Corporation Dislocation engineering using a scanned laser
JP2011254051A (ja) * 2010-06-04 2011-12-15 Sumitomo Electric Ind Ltd 炭化珪素基板の製造方法、半導体装置の製造方法、炭化珪素基板および半導体装置
US8486776B2 (en) 2010-09-21 2013-07-16 International Business Machines Corporation Strained devices, methods of manufacture and design structures
TW201227828A (en) * 2010-12-31 2012-07-01 Bo-Ying Chen Wafers for nanometer process and manufacturing method thereof
US8809168B2 (en) 2011-02-14 2014-08-19 International Business Machines Corporation Growing compressively strained silicon directly on silicon at low temperatures
GB201114365D0 (en) 2011-08-22 2011-10-05 Univ Surrey Method of manufacture of an optoelectronic device and an optoelectronic device manufactured using the method
FR3003686B1 (fr) * 2013-03-20 2016-11-04 St Microelectronics Crolles 2 Sas Procede de formation d'une couche de silicium contraint
FR3006438B1 (fr) * 2013-06-04 2015-06-26 Commissariat Energie Atomique Capteur de temperature
FR3014244B1 (fr) * 2013-11-29 2018-05-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede ameliore de realisation d'un substrat semi-conducteur contraint sur isolant
FR3041146B1 (fr) * 2015-09-11 2018-03-09 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de mise en tension d'un film semi-conducteur
FR3050569B1 (fr) * 2016-04-26 2018-04-13 Commissariat A L'energie Atomique Et Aux Energies Alternatives Fabrication amelioree de silicium contraint en tension sur isolant par amorphisation puis recristallisation
FR3091619B1 (fr) * 2019-01-07 2021-01-29 Commissariat Energie Atomique Procédé de guérison avant transfert d’une couche semi-conductrice
CN116092923B (zh) * 2023-01-16 2025-11-04 湖北九峰山实验室 一种基于碳膜的碳化硅欧姆接触结构及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319252A (zh) * 1998-09-25 2001-10-24 旭化成株式会社 半导体衬底及其制造方法、和使用它的半导体器件及其制造方法
US6429061B1 (en) * 2000-07-26 2002-08-06 International Business Machines Corporation Method to fabricate a strained Si CMOS structure using selective epitaxial deposition of Si after device isolation formation
US6593625B2 (en) * 2001-06-12 2003-07-15 International Business Machines Corporation Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing
US6855649B2 (en) * 2001-06-12 2005-02-15 International Business Machines Corporation Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing
US20030077882A1 (en) * 2001-07-26 2003-04-24 Taiwan Semiconductor Manfacturing Company Method of forming strained-silicon wafer for mobility-enhanced MOSFET device
JP2003158250A (ja) * 2001-10-30 2003-05-30 Sharp Corp ＳｉＧｅ／ＳＯＩのＣＭＯＳおよびその製造方法
US6812114B2 (en) * 2002-04-10 2004-11-02 International Business Machines Corporation Patterned SOI by formation and annihilation of buried oxide regions during processing
US6774015B1 (en) * 2002-12-19 2004-08-10 International Business Machines Corporation Strained silicon-on-insulator (SSOI) and method to form the same
US6825102B1 (en) * 2003-09-18 2004-11-30 International Business Machines Corporation Method of improving the quality of defective semiconductor material

Also Published As

Publication number Publication date
JP4939224B2 (ja) 2012-05-23
WO2005055290A3 (en) 2005-09-09
EP1695377A2 (en) 2006-08-30
KR20060123255A (ko) 2006-12-01
US20050124146A1 (en) 2005-06-09
CN100505163C (zh) 2009-06-24
WO2005055290A2 (en) 2005-06-16
CN1890781A (zh) 2007-01-03
US6972247B2 (en) 2005-12-06
JP2007513511A (ja) 2007-05-24
KR100940748B1 (ko) 2010-02-11
TW200529422A (en) 2005-09-01

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