TWI311024B - - Google Patents

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Publication number
TWI311024B
TWI311024B TW094121692A TW94121692A TWI311024B TW I311024 B TWI311024 B TW I311024B TW 094121692 A TW094121692 A TW 094121692A TW 94121692 A TW94121692 A TW 94121692A TW I311024 B TWI311024 B TW I311024B
Authority
TW
Taiwan
Prior art keywords
disposed
signal processing
processing unit
image sensing
sensing module
Prior art date
Application number
TW094121692A
Other languages
English (en)
Chinese (zh)
Other versions
TW200701774A (en
Inventor
Zung Peter
Tzu Han Lin
Fang Chang Liu
Original Assignee
Visera Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Visera Technologies Co Ltd filed Critical Visera Technologies Co Ltd
Priority to TW094121692A priority Critical patent/TW200701774A/zh
Priority to US11/226,223 priority patent/US20060289733A1/en
Publication of TW200701774A publication Critical patent/TW200701774A/zh
Application granted granted Critical
Publication of TWI311024B publication Critical patent/TWI311024B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
TW094121692A 2005-06-28 2005-06-28 Stack-type image sensor module TW200701774A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094121692A TW200701774A (en) 2005-06-28 2005-06-28 Stack-type image sensor module
US11/226,223 US20060289733A1 (en) 2005-06-28 2005-09-15 Stack-type image sensor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094121692A TW200701774A (en) 2005-06-28 2005-06-28 Stack-type image sensor module

Publications (2)

Publication Number Publication Date
TW200701774A TW200701774A (en) 2007-01-01
TWI311024B true TWI311024B (https=) 2009-06-11

Family

ID=37566210

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121692A TW200701774A (en) 2005-06-28 2005-06-28 Stack-type image sensor module

Country Status (2)

Country Link
US (1) US20060289733A1 (https=)
TW (1) TW200701774A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090032925A1 (en) * 2007-07-31 2009-02-05 England Luke G Packaging with a connection structure
US9231012B2 (en) * 2007-08-01 2016-01-05 Visera Technologies Company Limited Image sensor package
CN102449995B (zh) * 2009-12-24 2015-03-11 京瓷株式会社 摄像装置
TW201137489A (en) 2010-04-28 2011-11-01 Hon Hai Prec Ind Co Ltd Light blocking member, method for making same and lens module having same
US20120281113A1 (en) * 2011-05-06 2012-11-08 Raytheon Company USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATIONS TO YIELD A LOW COST, SMALL SIZE CAMERA ON A CHIP
US9685414B2 (en) 2013-06-26 2017-06-20 Intel Corporation Package assembly for embedded die and associated techniques and configurations
US9679936B2 (en) 2014-02-27 2017-06-13 Semiconductor Components Industries, Llc Imaging systems with through-oxide via connections
CN108140649B (zh) * 2015-10-01 2022-05-06 奥林巴斯株式会社 摄像元件、内窥镜以及内窥镜系统
US10644046B2 (en) * 2017-04-07 2020-05-05 Samsung Electronics Co., Ltd. Fan-out sensor package and optical fingerprint sensor module including the same
TWI668851B (zh) * 2018-01-31 2019-08-11 新加坡商光寶科技新加坡私人有限公司 晶圓級感應模組及其製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6122009A (en) * 1995-05-31 2000-09-19 Sony Corporation Image pickup apparatus fabrication method thereof image pickup adaptor apparatus signal processing apparatus signal processing method thereof information processing apparatus and information processing method
US6809421B1 (en) * 1996-12-02 2004-10-26 Kabushiki Kaisha Toshiba Multichip semiconductor device, chip therefor and method of formation thereof
JP4285966B2 (ja) * 2002-09-27 2009-06-24 三洋電機株式会社 カメラモジュール
US6870208B1 (en) * 2003-09-24 2005-03-22 Kingpak Technology Inc. Image sensor module

Also Published As

Publication number Publication date
TW200701774A (en) 2007-01-01
US20060289733A1 (en) 2006-12-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees