TWI306269B - - Google Patents
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- Publication number
- TWI306269B TWI306269B TW91113908A TW91113908A TWI306269B TW I306269 B TWI306269 B TW I306269B TW 91113908 A TW91113908 A TW 91113908A TW 91113908 A TW91113908 A TW 91113908A TW I306269 B TWI306269 B TW I306269B
- Authority
- TW
- Taiwan
- Prior art keywords
- data
- processing
- processed
- processing result
- operation data
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001194762 | 2001-06-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWI306269B true TWI306269B (ko) | 2009-02-11 |
Family
ID=19032842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW91113908A TWI306269B (ko) | 2001-06-27 | 2002-06-25 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4220378B2 (ko) |
TW (1) | TWI306269B (ko) |
WO (1) | WO2003003437A1 (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6616759B2 (en) | 2001-09-06 | 2003-09-09 | Hitachi, Ltd. | Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor |
WO2003098677A1 (fr) | 2002-05-16 | 2003-11-27 | Tokyo Electron Limited | Procede de prediction d'etat de dispositif de traitement ou de resultat de traitement |
JP4363861B2 (ja) * | 2003-02-04 | 2009-11-11 | 株式会社日立ハイテクノロジーズ | 半導体製造装置 |
JP4707421B2 (ja) * | 2005-03-14 | 2011-06-22 | 東京エレクトロン株式会社 | 処理装置,処理装置の消耗部品管理方法,処理システム,処理システムの消耗部品管理方法 |
US7291285B2 (en) * | 2005-05-10 | 2007-11-06 | International Business Machines Corporation | Method and system for line-dimension control of an etch process |
KR101286240B1 (ko) | 2007-10-23 | 2013-07-15 | 삼성전자주식회사 | 반도체 구조물의 형상을 예정하는 공정 파라 메타의 예측시스템, 상기 공정 파라 메타의 예측 시스템을 가지는반도체 제조 장비 및 그 장비의 사용방법 |
JP4836994B2 (ja) * | 2008-06-11 | 2011-12-14 | 株式会社日立製作所 | 半導体処理装置 |
JP5643528B2 (ja) | 2009-03-30 | 2014-12-17 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5782226B2 (ja) | 2010-03-24 | 2015-09-24 | 東京エレクトロン株式会社 | 基板処理装置 |
KR102112130B1 (ko) * | 2013-10-23 | 2020-05-19 | 주식회사 디엠에스 | 샤워헤드 장치 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04212414A (ja) * | 1990-08-16 | 1992-08-04 | Fuji Electric Co Ltd | プラズマ処理装置 |
JP3300816B2 (ja) * | 1992-02-27 | 2002-07-08 | 株式会社日立国際電気 | 半導体製造装置管理方法及びその装置 |
US5442562A (en) * | 1993-12-10 | 1995-08-15 | Eastman Kodak Company | Method of controlling a manufacturing process using multivariate analysis |
US6197116B1 (en) * | 1996-08-29 | 2001-03-06 | Fujitsu Limited | Plasma processing system |
JPH10223499A (ja) * | 1997-02-06 | 1998-08-21 | Hitachi Ltd | 物品の製造方法、物品の製造システムおよび複数の加工処理装置の運用方法 |
US6368975B1 (en) * | 1999-07-07 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for monitoring a process by employing principal component analysis |
-
2002
- 2002-06-25 JP JP2003509517A patent/JP4220378B2/ja not_active Expired - Fee Related
- 2002-06-25 WO PCT/JP2002/006348 patent/WO2003003437A1/ja active Application Filing
- 2002-06-25 TW TW91113908A patent/TWI306269B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2003003437A1 (en) | 2003-01-09 |
JP4220378B2 (ja) | 2009-02-04 |
JPWO2003003437A1 (ja) | 2004-10-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |