TWI304656B - - Google Patents

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Publication number
TWI304656B
TWI304656B TW94129722A TW94129722A TWI304656B TW I304656 B TWI304656 B TW I304656B TW 94129722 A TW94129722 A TW 94129722A TW 94129722 A TW94129722 A TW 94129722A TW I304656 B TWI304656 B TW I304656B
Authority
TW
Taiwan
Prior art keywords
wafer
substrate
image sensing
passive component
spacer
Prior art date
Application number
TW94129722A
Other languages
English (en)
Chinese (zh)
Other versions
TW200709457A (en
Inventor
Qing-Zhong Ceng
zhong-qi Yang
xiu-zhong Lin
Wang-Zhang Xie
Jia-Hong Lin
Ming-Lun Xu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW094129722A priority Critical patent/TW200709457A/zh
Publication of TW200709457A publication Critical patent/TW200709457A/zh
Application granted granted Critical
Publication of TWI304656B publication Critical patent/TWI304656B/zh

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  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW094129722A 2005-08-30 2005-08-30 Package structure of image-sensing device TW200709457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094129722A TW200709457A (en) 2005-08-30 2005-08-30 Package structure of image-sensing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094129722A TW200709457A (en) 2005-08-30 2005-08-30 Package structure of image-sensing device

Publications (2)

Publication Number Publication Date
TW200709457A TW200709457A (en) 2007-03-01
TWI304656B true TWI304656B (enExample) 2008-12-21

Family

ID=45070987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129722A TW200709457A (en) 2005-08-30 2005-08-30 Package structure of image-sensing device

Country Status (1)

Country Link
TW (1) TW200709457A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8212352B2 (en) 2007-03-28 2012-07-03 Stats Chippac Ltd. Integrated circuit package system with heat sink spacer structures
CN108766974A (zh) * 2018-08-08 2018-11-06 苏州晶方半导体科技股份有限公司 一种芯片封装结构以及芯片封装方法
CN115514863B (zh) * 2021-06-04 2023-10-27 同欣电子工业股份有限公司 无焊接式感测镜头

Also Published As

Publication number Publication date
TW200709457A (en) 2007-03-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees