TWI301884B - Method and apparatus for removeably coupling a heat rejection device with a heat producing device - Google Patents

Method and apparatus for removeably coupling a heat rejection device with a heat producing device Download PDF

Info

Publication number
TWI301884B
TWI301884B TW092128238A TW92128238A TWI301884B TW I301884 B TWI301884 B TW I301884B TW 092128238 A TW092128238 A TW 092128238A TW 92128238 A TW92128238 A TW 92128238A TW I301884 B TWI301884 B TW I301884B
Authority
TW
Taiwan
Prior art keywords
heat
interface material
heating element
thermal
thermal interface
Prior art date
Application number
TW092128238A
Other languages
Chinese (zh)
Other versions
TW200413683A (en
Inventor
William Kenny Thomas Jr
E Goodson Kenneth
Original Assignee
Cooligy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc filed Critical Cooligy Inc
Publication of TW200413683A publication Critical patent/TW200413683A/en
Application granted granted Critical
Publication of TWI301884B publication Critical patent/TWI301884B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Description

1301884 五、發明說明（1) 相關申請案 ， 本專利申請案依35 U.S.C· 119(e)主張2002年10月22 曰申請之共同待審美國專利臨時申請案序號60/420, 557 號、標題為、、具有自我附著構件之蒸氣逃逸微通道熱交換 ^ ( VAPOR ESCAPE MICROCHANNEL HEAT EXCHANGER WITH SELF ATTACHMENT MEANS) 〃的優先權。該標題為、、具有 自我附著構件之蒸氣逃逸微通道熱交換器//的2 〇 〇 2年1 〇月 22曰申請美國專利臨時申請案序號6〇/42〇, 557號亦以引用 的方式併入本文中。 發明範疇 本發明大體上關於一種用以使二個或更多裝置相互附著 和分開的方法及設備，明確地說係關於一種用來可抑除地 耦接一排熱裝置與一發熱裝置之方法及設備。 ' 發明背景 高功率積體電路在近幾年内朝向更高之電晶體密度和 鐘速率發展。此趨勢的結果是現代微處理器之 ^:0、 度快速成長且洋現出對於新的冷卻技術的需求。此:、、山 一面向經由包含（但不侷限於）熱管 '具備風扇;題= 液體冷卻器之散熱片（f i η )陣列的新穎排熱裝^^ \士通運 的開發而得到解決。所有此等結構對於將熱輪送3 j吉構 當有效。在所有此等案例中，熱堆積在一液離=處相 態媒體内且該媒體提供藉由傳導或對流作用谁p认二取乳 '^仃的熱傳1301884 V. INSTRUCTIONS INSTRUCTIONS (1) In the related application, the present application claims the copending U.S. Patent Application Serial No. 60/420, No. 557, titled October 25, 2002, filed on 35 USC 119(e) The priority of the VAPOR ESCAPE MICROCHANNEL HEAT EXCHANGER WITH SELF ATTACHMENT MEANS is self-adhesive. The title of the steam escaping microchannel heat exchanger with self-adhesive members is 2 〇〇 2 years 1 〇 22 曰 application for US patent provisional application number 6〇/42〇, 557 is also cited Incorporated herein. FIELD OF THE INVENTION The present invention generally relates to a method and apparatus for attaching and detaching two or more devices to each other, and more particularly to a method for reversibly coupling a row of thermal devices to a heat generating device And equipment. BACKGROUND OF THE INVENTION High power integrated circuits have evolved toward higher transistor densities and clock rates in recent years. The result of this trend is the rapid growth of modern microprocessors and the emergence of new cooling technologies. This:,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, All of these structures are effective for the heat transfer. In all of these cases, the heat is deposited in a liquid phase at a liquid phase and the medium provides a heat transfer by the conduction or convection who recognizes the second milk.

1301884 五、發明說明（2) 輸。 此問題之 一耦接熱介面轉移 1 A中。介於排熱裝 體系統中的 苛限制加諸 力無關。一 裝置之接觸 可以是或不 實際上有 而一^者具有 係由矽（S i 得。在排熱 熱介面材料 熱滑脂經常 )〃且能切 具有局黏度 作中不會分 附接於一矽 示，銅因為 熱膨脹係數 熱裝置膨脹 此外，有 高效能排熱 個關 更基本性面向關係到將熱從一 到排熱裝置内。此構造之 置與發熱電子裝置之間的 鍵層。特定言之，該介面 於系統整體效能，與排熱裝置或 般而言，熱介面包含一定位在發 表面間的材料薄膜，藉此發熱裝 是用具有相同熱膨脹係數的相同 著發熱裝置與排熱結構係由不同 不同熱膨脹係數）的案例。一實 1 icon )製得且排熱裝置係由銅丨 結構之熱膨脹係數不同於電子裝 必須能夠維持兩表面之間的接觸 用在此等應用中，因為滑脂是v' 變而不喪失對任一表面的接觸。 使得發熱裝置及排熱裝置的表面 離或橫向滑動。圖1 A和1 B繪出一 晶片之背側且二者間有一層熱滑 該矽晶片產生的溫度而受熱並膨 大於石夕，晶片與排熱裝置之間的 而不對石夕施力，如圖1 B所示。 可能設計出一種熱膨脹係數與發 結構。具有相同熱膨脹係數的此 電子裝置透過 一概圖繪於圖 熱介面是此整 的特性能將嚴 結構的除熱能 熱裝置與排熱 置及排熱結構 材料製得。 材料製得（因 例為發熱裝置 :Copper )製 置的案例中， 且容許切變。 液態（1 i q u i d 此外，熱滑脂 在發熱裝置運 銅製排熱裝置 脂。如圖1 B所 脹。由於銅的 熱滑脂容許排 熱裝置相符的 二結構容許使1301884 V. Description of invention (2) Loss. One of the problems coupled to the thermal interface transfer is 1 A. The rigorous imposed forces in the heat rejection system are independent. The contact of a device may or may not be actual and the one has a 矽 (S i 得. The thermal grease in the heat-dissipating interface material is often) and can be cut into a local viscosity without being attached to At the same time, copper expands due to the thermal expansion coefficient of the thermal device. In addition, there is a high-efficiency heat-dissipating relationship that is more fundamentally oriented to the heat from one to the heat-discharging device. This configuration is placed between the bond layer and the heat-generating electronic device. In particular, the interface is integral to the overall performance of the system, and the heat sink or, in general, the thermal interface comprises a film of material positioned between the hair surfaces, whereby the heat pack is the same heat generating device and row having the same coefficient of thermal expansion. Thermal structures are based on different thermal expansion coefficients). A real 1 icon ) is made and the heat removal device is made of a copper beryllium structure with a thermal expansion coefficient different from that of the electronic device. It must be able to maintain contact between the two surfaces for use in such applications because the grease is v' changed without losing the pair. Contact on either surface. The surface of the heat generating device and the heat discharging device is slid or laterally slid. 1A and 1B depict the back side of a wafer with a layer of heat that is hot-sliding between the wafers and heated and swelled more than the stone, between the wafer and the heat-dissipating device, without applying force to the stone, As shown in Figure 1 B. It is possible to design a coefficient of thermal expansion and a hair structure. The electronic device having the same thermal expansion coefficient is shown in the figure through the heat transfer surface of the heat-dissipating heat-dissipating device and the heat-dissipating and heat-dissipating structure material. In the case of the material (in the case of a heat generating device: Copper), shear is allowed. Liquid (1 i q u i d In addition, the hot grease transports the copper heat-dissipating device grease in the heating device. As shown in Figure 1 B, the thermal grease of the copper allows the heat-dissipating device to conform to the two structures.

第7頁 1301884 五、發明說明（3) 用熱介面材料，藉此該熱介面材料不切變。此等熱附著物 例如薄固體黏著劑的實例非侷限性包含金屬層、共晶物、 焊料和直接熔融接合。此等固體薄層的熱阻比熱滑脂低。 此外，金屬附著物的熱阻得顯著低於熱滑脂。 然而，在矽裝置與銅製排熱裝置之間使用一薄固體黏著 劑導致銅-矽三明治狀物因矽發熱裝置與銅製排熱裝置之 間的熱膨脹係數不一致而蜷曲。此情況繪於圖1 C。如圖1 C 所示，銅製排熱裝置與矽晶片之間的差別熱膨脹導致雙金 屬彎曲現象，致使矽晶片與電路板之間的凸塊接頭 (bumpbonds )失效 ° 要在矽發熱裝置與金屬型排熱裝置之間使用一金屬、共 晶物、或熔融黏合物有一要點在於在兩裝置之間形成黏合 所需要的高溫。要熔化金屬或共晶物熱介面要求超過電子 裝置或其支撐封裝物之熱極限的溫度。此係為何雖然共晶 物或焊接黏合做為電子裝置與排熱裝置間之熱介面附著物 有著效能優勢但未受廣泛使用的一個原因。此外，將金屬 熱介面熔化會使得發熱裝置與排熱裝置之間的熱介面成為 永久性的且不可修訂。因此，使用一金屬或共晶物做為熱 附著物在業界中對於要求將一排熱裝置重複地移離和接上 一發熱裝置的應用來說並非當前之較佳材料。 當今所需為一種用來輕易地耦接一排熱裝置與一發熱電 子裝置且在該二裝置之間有一熱介面的方法及設備，藉此 該熱介面有一極低熱阻。當今亦需要一種能讓一排熱裝置 可卸除地與一發熱電子裝置耦接的方法及設備，藉此該排Page 7 1301884 V. INSTRUCTIONS (3) A thermal interface material is used whereby the thermal interface material is not sheared. Examples of such thermal attachments such as thin solid adhesives include non-limiting properties including metal layers, eutectics, solder, and direct fusion bonding. These solid thin layers have a lower thermal resistance than hot grease. In addition, the thermal resistance of the metal attachment is significantly lower than that of the hot grease. However, the use of a thin solid adhesive between the crucible device and the copper heat-dissipating device causes the copper-bismuth sandwich to be distorted due to the inconsistent coefficient of thermal expansion between the crucible heating device and the copper heat-dissipating device. This situation is depicted in Figure 1 C. As shown in Fig. 1C, the differential thermal expansion between the copper heat-dissipating device and the germanium wafer causes bimetallic bending, which causes the bump bonds between the germanium wafer and the circuit board to be ineffective. The use of a metal, eutectic, or molten bond between the heat rejection devices has one important point in the high temperatures required to form a bond between the two devices. The temperature at which the metal or eutectic thermal interface is to be melted exceeds the thermal limit of the electronic device or its supporting package. This is one reason why eutectic or solder bonding is a potent advantage of thermal interface attachment between an electronic device and a heat rejection device, but it is not widely used. In addition, melting the metal thermal interface causes the thermal interface between the heat generating device and the heat discharging device to be permanent and uncorrectable. Therefore, the use of a metal or eutectic as a thermal attachment is not currently the preferred material in the industry for applications requiring repeated removal of a row of thermal devices from a heat generating device. What is needed today is a method and apparatus for easily coupling a row of thermal devices to a heat generating electronic device with a thermal interface between the two devices whereby the thermal interface has a very low thermal resistance. There is also a need for a method and apparatus for removably attaching a row of thermal devices to a heat generating electronic device.

第8頁 Ϊ301884 ~~~— --—— ---—-— rar 办 遭^ ^可修訂的且能利用不損及電子農置或封裝物及周 、統的加熱高溫輕易地卸離電子裝置。 · 發明概述Page 8 Ϊ 301884 ~~~— --—— ------ rar can be revised and can be easily removed from the electronics without damaging the heating or high temperature of the electronic farm or package and the Zhou and Tong Device. · Summary of invention

耦發明之一觀點中，一種用來將一排熱裝置可卸除地 該方法—發熱裝置之方法，其包括建構至少一加熱元件。 ^。^含在該排熱裝置與發熱裝置之間施加一熱介面材 上傲2 Μ介面材料建構為容許該排熱裝置在一預定溫度以 加^二接合和脫離。該方法包含經由至少一電接觸件對該 ^二元件施加一電流一段預定時間，其中該加熱元件將該 …介面材料加熱至該預定溫度以上。該方法更包括將該排 熱震置相對於該發熱裝置定位在一預定仇置。該熱介面材 料在一低於該預定溫度之第一溫度與一高於該預定溫度之 第二溫度之間經歷一相變。該排熱裝置與該發熱裝置之間 的接合更包括將该排熱裝置及該熱介面材料相互壓抵至該 熱介面材料之溫度大致處於該第一溫度為止。該排熱裝置 與該發熱裝置的脫離更包括當該熱介面材料之溫度大致處 於該第二溫度時將該排熱裝置及該熱介面材料相互移開。 該至少一加熱元件定位在一與該熱介面材料接觸的交界表 面上，替代選擇為將該至少一加熱元件定位在_反向表面 上、或是在該设備内。该加熱元件在預定區域内加熱該熱 介面材料。該加熱元件以一大致均句方式對該熱介面材料 施熱。該加熱元件藉由複數個熱脈衝對該熱介面材料施 熱，每一熱脈衝持續一預定延續時間。In one aspect of the invention, a method for detaching a row of thermal devices - a method of heating a device, comprising constructing at least one heating element. ^. ^ A thermal interface material is applied between the heat-dissipating device and the heat-generating device. The Aurora 2 interface material is constructed to allow the heat-dissipating device to be joined and detached at a predetermined temperature. The method includes applying a current to the two elements for a predetermined time via at least one electrical contact, wherein the heating element heats the ... interface material above the predetermined temperature. The method further includes positioning the radiant shock relative to the heat generating device at a predetermined recession. The thermal interface material undergoes a phase change between a first temperature below the predetermined temperature and a second temperature above the predetermined temperature. The joining between the heat-dissipating device and the heat-generating device further includes pressing the heat-dissipating device and the heat interface material against each other until the temperature of the heat interface material is substantially at the first temperature. The detachment of the heat venting device from the heat generating device further includes moving the heat absorbing device and the heat interface material away from each other when the temperature of the heat interface material is substantially at the second temperature. The at least one heating element is positioned on a boundary surface in contact with the thermal interface material, alternatively the at least one heating element is positioned on the _reverse surface or within the apparatus. The heating element heats the thermal interface material in a predetermined area. The heating element applies heat to the thermal interface material in a substantially uniform manner. The heating element applies heat to the thermal interface material by a plurality of thermal pulses, each of which continues for a predetermined duration.

第9頁 1301884 五、發明說明（5) 在本發明之另一觀點中，一排熱裝置耦接於一介面 料。該排熱裝置固定於處於-第一相態之該介面材料 建構為可自處於-第二相態之該介面材料移 置包括至…熱元件’該至少一加熱元件對該介面 施加一預定熱1使得該介面材料回應於該加埶元件 = 加之預定熱量而經歷一從該第一相態至該第二相離的^目 變。該熱介面材料在一低於該預定溫度之第一溫度與一言 於该預定溫度之第二溫度之間經歷一相變。該埶介面 藉由壓抵於該排熱裝置至該熱介面材料達到該第'一溫产兔 止接合於該排熱裝置。該熱介面材料藉由當該埶； 面材料處&該第ϋ時將該排熱裝置及該熱彳面^ 互移開的方式脫離該排熱裝置。該至少一加熱元件^ 欲與該熱介面材料接觸，替代選擇為將該 件 在該排熱裴置内。該至少一，勒- 面上或疋 致均勻方式或藉由複數個孰脈在預定區域内以一大 熱脈衝持續一預定】ί;門、脈；4加熱該熱介面材料，每- 疋表面上之至少一電接觸件， ^ 接觸件施加。 /、〒電机係經由邊至少一電 在本發明之另一 _點由 裝置與一發埶種用來可卸除地耦接一排熱 面材ϊΐ 總成中-具有-預定相變溫度之 包括用以保持該排孰裝置發熱裝置之間。該總成 的構件，其中建構在 父界面與該熱；丨面材料接觸 μ父界面上之至少一加熱元件與該熱Page 9 1301884 V. INSTRUCTION DESCRIPTION (5) In another aspect of the invention, a row of thermal devices is coupled to an interface material. The heat dissipating device is fixed to the interface material in the first phase state to be configured to be displaceable from the interface material in the second phase state, wherein the at least one heating element applies a predetermined heat to the interface 1 causing the interface material to undergo a change from the first phase to the second phase in response to the twisting element = plus a predetermined amount of heat. The thermal interface material undergoes a phase change between a first temperature below the predetermined temperature and a second temperature at a predetermined temperature. The crucible interface is joined to the heat rejection device by pressing the heat rejection device to the thermal interface material to achieve the first temperature-producing rabbit. The thermal interface material is separated from the heat removal device by removing the heat removal device and the heat sealing surface when the surface material & The at least one heating element is intended to be in contact with the thermal interface material, alternatively the component is placed within the heat rejection. The at least one, the face-to-face or the uniformity or the plurality of turns of the pulse in the predetermined area is continued with a large heat pulse for a predetermined period of time; the door, the pulse; 4 heats the thermal interface material, each of the surface At least one electrical contact on the top, ^ contact applied. /, the 〒 motor is detachably coupled to a row of hot face material ϊΐ in the other point of the present invention by at least one electric power at the side - having a predetermined phase transition temperature This includes maintaining the heat exchange between the drainage device. a member of the assembly, wherein the parent interface is constructed with the heat; the face material contacts at least one heating element on the parent interface and the heat

第10頁 1301884 五、發明說明（6)Page 10 1301884 V. Description of invention (6)

=面材料接觸。該總成包括用以對該加熱元件供能一段預 疋 >夺1 $構件’其中该至少一加熱元件轉變該熱介面材料 ，，，；1面材料在大致達到預定相變溫度時經歷一相變。 當Ϊ介=材料低於一預定相變溫度，該介面材料處於第一 相，_虽遠介面材料高於該預定相變溫度，該介面材料處 =第了相態。該介面材料在一適當時間量内經歷該第一相 悲與第二相態間之該相變。該至少一加熱元件在預定區域 致均勻方式且/或藉由複數個熱脈衝加熱該介面 料母一熱脈衝持續一預定延續時間。該至少一加熱元 $建構為與該介面材料接觸、定位在該排熱裝置背對於該 材料之一表面上、或是在該排熱裝置内。該排熱裝置 匕^位在一預定表面上之至少一電接觸件，其中電流係經 由該至少一電接觸件施加。= face material contact. The assembly includes means for energizing the heating element, wherein the at least one heating element converts the thermal interface material, and the surface material undergoes a substantially reaching a predetermined phase transition temperature Phase change. When the material = material is below a predetermined phase transition temperature, the interface material is in the first phase, and although the far interface material is above the predetermined phase transition temperature, the interface material is at the first phase. The interface material undergoes the phase transition between the first phase and the second phase for an appropriate amount of time. The at least one heating element heats the interface mother-heat pulse for a predetermined duration in a uniform manner in a predetermined area and/or by a plurality of heat pulses. The at least one heating element is configured to contact the interface material, to be positioned on a surface of the heat rejection device opposite the material, or within the heat removal device. The heat rejection device is configured to at least one electrical contact on a predetermined surface, wherein current is applied by the at least one electrical contact.

在本發明之另一觀點中，一種用來可卸除地麵接一排熱 /、 發熱裝置的方法’其中將一具有一預定相變溫度 之熱介面材料施加在該排熱裝置與該發熱裝置之間。該方 法包括：將該排熱裝置建構為包含至少一加熱元件。該方 法包括對該加熱元件供能一段預定時間，其中一施加於該 加熱7L件之電流使該加熱元件加熱至該熱介面材料之表面 大致達到該預定相變溫度為止。 發明烊細說明 圖2 A繪出依據本發明較佳實施例一排熱裝置分離於一發 熱裝置的概圖。圖2B繪出依據本發明較佳實施例一排熱裝In another aspect of the invention, a method for removing a row of heat/heating devices from the ground, wherein a heat interface material having a predetermined phase transition temperature is applied to the heat rejection device and the heat generation Between devices. The method includes constructing the heat rejection device to include at least one heating element. The method includes energizing the heating element for a predetermined period of time, wherein a current applied to the heated 7L member heats the heating element until the surface of the thermal interface material substantially reaches the predetermined phase transition temperature. DETAILED DESCRIPTION OF THE INVENTION Figure 2A depicts an overview of a heat removal device separated from a heat generating device in accordance with a preferred embodiment of the present invention. 2B depicts a row of hot packs in accordance with a preferred embodiment of the present invention.

第11頁 1301884Page 11 1301884

置耦接於一發熱裝置的概圖。 - 特定言之，圖2A繪出一發熱裝置1〇〇 (例如一電子妒置 由=系列的插腳或凸塊接頭98輕接於一電路板圖 亦，、、、員示一熱介面薄膜1 〇 2施加於電子裝置！ 〇 〇之一頂面 1〇1。如圖2A-2B所示，排熱裝置1〇4或排熱器係建構為經 由熱介面102耦接於電子裝置100。如前所述，排熱器1〇二4 較佳為一容許熱從電子裝置1〇〇透過熱介面102轉此的 ，壑（heat sink )。另一選擇，排熱器104為任何其他熱 父換器。另一選擇’排熱器1 0 4為一揭示於標題為、、，之An overview of the coupling to a heat generating device. - In particular, FIG. 2A depicts a heat generating device 1 (eg, an electronic device is connected to a circuit board by a pin or bump connector 98 of the series), and a thermal interface film 1 is shown. 〇2 is applied to the top surface of the electronic device! 〇〇1. As shown in Figures 2A-2B, the heat-dissipating device 1〇4 or the heat-dissipator is configured to be coupled to the electronic device 100 via the thermal interface 102. As mentioned above, the heat exchangers 1 and 2 are preferably heat sinks that allow heat to be transferred from the electronic device 1 through the thermal interface 102. Alternatively, the heat exchanger 104 is any other hot parent. Converter. Another option 'heat collector 1 0 4 is one revealed in the title, ,,

共同待審美國專利申請案序號____中的蒸汽逃逸熱交 換裔玄案以引用的方式併入本文中。如圖2 a所示，排熱 器104耦接於熱介面102，藉此使電子裝置ι00產生的熱經''' 由對流和傳導作用透過熱介面1 0 2轉移至排熱器丨〇 4。 熱介面1 0 2較佳為一相變材料（例如焊料），藉此一附 著物層1 0 3和熱介面1 〇 2最好在有充分的熱施加於其時經歷 一從固態到液態的相變。另一選擇，整個熱介面1 〇 2在有 充分的熱施加於其時經歷一從固態到液態的相變。熱介面 102具有小熱阻且容許切變而不會經歷雙向彎曲。為了舉 例說明，在本說明書中有關於熱介面1 0 2皆是就焊料來 說，但具有小熱阻且容許排熱器1 〇 4可輕易卸離的任何其 他材料皆可。 如圖2A和2B所示，排熱器104最好在排熱器1〇4之底部表 面108内包含一系列的加熱元件106。另一選擇，如圖2A和 2B所示，加熱元件106’係在排熱裝置104之上表面112上，The steam escaping heat exchange in the co-pending U.S. Patent Application Serial No. ____ is incorporated herein by reference. As shown in FIG. 2a, the heat extractor 104 is coupled to the thermal interface 102, whereby the heat generated by the electronic device ι00 is transferred from the convection and conduction through the thermal interface 1 0 2 to the heat discharge device 经4. . The thermal interface 102 is preferably a phase change material (e.g., solder) whereby an adherent layer 10 3 and a thermal interface 1 〇 2 are preferably subjected to a solid to liquid state when sufficient heat is applied thereto. Phase change. Alternatively, the entire thermal interface 1 〇 2 undergoes a phase change from solid to liquid when sufficient heat is applied thereto. The thermal interface 102 has a small thermal resistance and allows shear without undergoing bidirectional bending. For the purpose of illustration, in this specification, any other material may be used for the thermal interface 1 0 2 in terms of solder, but having a small thermal resistance and allowing the heat extractor 1 〇 4 to be easily detached. As shown in Figures 2A and 2B, the heat extractor 104 preferably includes a series of heating elements 106 within the bottom surface 108 of the heat rejector 1〇4. Alternatively, as shown in Figures 2A and 2B, the heating element 106' is attached to the upper surface 112 of the heat rejection device 104.

第12頁 1301884Page 12 1301884

五、發明說明（8) 藉此使加熱元件丨0 6，施加的熱經由排熱裝置1 〇 4傳播至介· 面108°另一選擇，如圖2A和2B所示，加熱元件106"係在-排熱褒置1 〇4内，藉此使加熱元件1 〇 6 π施加的熱經由排熱 裝置104傳播至介面108。另一選擇，加熱元件1〇6係建構 為在排熱裝置104内、在頂面112上、在底部表面108上、 或以上之任何組合。5. Description of the Invention (8) Thereby, the heat applied by the heating element 丨0 6, propagates through the heat-dissipating device 1 〇4 to the interface 108°, as shown in Figures 2A and 2B, the heating element 106" In the heat-dissipating set 1 〇 4, the heat applied by the heating element 1 〇6 π is thereby propagated to the interface 108 via the heat-dissipating device 104. Alternatively, heating element 1 〇 6 is constructed to be within heat removal device 104, on top surface 112, on bottom surface 108, or any combination thereof.

最好加熱元件1 0 6為具有一或多個電阻器（例如多晶矽 電阻器）的電子電路。另一選擇，加熱元件1 〇 6是金屬絲 加熱器、。另一選擇，加熱元件1〇6運用產生充分之熱量的 {壬何其他適當組件，詳見下文。雖然圖以和2Β中顯示數個 加熱元件1 〇 6，本發明涵蓋任何數量的加熱元件1 〇 6。Preferably, heating element 106 is an electronic circuit having one or more resistors (e.g., polysilicon resistors). Alternatively, heating element 1 〇 6 is a wire heater. Alternatively, the heating element 1 〇 6 utilizes {other suitable components that generate sufficient heat, as detailed below. Although the figures show several heating elements 1 〇 6, the invention covers any number of heating elements 1 〇 6.

此外’如圖2-3所示，排熱裝置1〇4在其一表面上包含二 個電接觸件或端子1 1 〇，此等電接觸件容許電流流到加熱 元件\〇6。電接觸件110較佳具有大約ι〇〇微米的尺寸，但 亦涵蓋其他尺寸的接觸件11 〇。電接觸件11 〇容許一短暫高 電机流到加熱元件1 〇 6，藉此使加熱元件1 〇 6發熱送到熱介 面1 0 2。加熱元件1 〇 6之加熱作用充分地熔化或、、軟化夕介 面材料102而不致加熱整個電子裝置1〇〇。因此，能夠使棑 熱裝置104搞接於電子裝置1〇〇而不致讓電子裝置經歷 可能損害系統的不可接受溫度。 另一選擇，電接觸件110處於排熱裝置1〇4之底部表面 108或側表面或一表面組合内，如圖2α —2Β所示。雖然圖2 和3中僅顯示二個電端子丨丨〇，排熱裝置丨〇4内可有任何數 量的電接觸件。加熱元件1〇6最好是利用標準黏合技術或Further, as shown in Figs. 2-3, the heat discharge device 1〇4 includes two electrical contacts or terminals 1 1 在 on one surface thereof, which allow current to flow to the heating element 〇6. The electrical contact 110 preferably has a size of about 1 micron, but also covers contacts 11 of other sizes. The electrical contact 11 〇 allows a brief high current to flow to the heating element 1 〇 6, whereby the heating element 1 〇 6 is heated to the thermal interface 1 0 2 . The heating action of the heating element 1 〇 6 sufficiently melts or softens the dielectric material 102 without heating the entire electronic device 1〇〇. Therefore, the thermal device 104 can be brought into the electronic device 1 without causing the electronic device to experience an unacceptable temperature that may damage the system. Alternatively, the electrical contact 110 is located in the bottom surface 108 or side surface or a combination of surfaces of the heat rejection device 1〇4, as shown in Fig. 2α-2Β. Although only two electrical terminals 显示 are shown in Figures 2 and 3, there may be any number of electrical contacts in the heat rejection device 丨〇4. Heating element 1〇6 is preferably made using standard bonding techniques or

第13頁 1301884Page 13 1301884

五、發明說明（9) 導體晶圓製造方法造入排熱裝置104的表面内，本， 利月曰：另贅述此等技術或方法。此外，電接觸件ιι〇係 」用初級沈積和微影技術製作在排熱裝置1〇4上或内。另 蓺^電接觸件110係利用絹印、焊料回流或熟習此技 玲^知曉的任何其他習知程序製作在裝置1〇4上或内。 為將排熱裝置i 04耦接於熱接面i 〇2並最終耦接至電子穿 = —電流經由電端子110施加於加熱元件106。該、V. INSTRUCTION OF THE INVENTION (9) The method of manufacturing a conductor wafer is built into the surface of the heat-dissipating device 104. Ben, Leifan: The techniques or methods are further described. In addition, the electrical contacts are fabricated on or in the heat rejection device 1〇4 using primary deposition and lithography techniques. In addition, the electrical contacts 110 are fabricated on or in the device 1〇4 using stenciling, solder reflow, or any other conventional procedure known to those skilled in the art. In order to couple the heat rejection device i 04 to the thermal junction i 〇 2 and finally to the electron through - current is applied to the heating element 106 via the electrical terminal 110. The

Km元件106加熱至一溫度，此溫度最好略高於熱 之:产大絲 點或相變溫度。另一選擇，加熱元件m 用=二梦於熱介面ι〇2之相變溫度。因此，本發明運 埶呢H104當作一導致排熱裝置104與介面形成接合的 二源。此外，熱介面102之特性導致熱介面1〇2在其冷卻或 返回其平衡態時經歷一反相變或、、硬化，，。熱介面1〇2之 硬化因而將排熱裝置1〇4固定保持於發熱裝置1〇〇。 在較佳實施例中，加熱元件1 06加熱至一預定溫度一段 從數微秒到數分鐘的時間，視眾多因子而定。要求之加熱 元件1 0 6脈度輸出取決（但不侷限）於所用熱介面材料i 〇 2 之類型、電子裝置1〇〇與排熱器1〇4之間的熱介面材料量、 以及電子裝置1 0 0與排熱器i 〇4間之期望接合強度。此外， 熱厂面加熱時間取決（但不侷限）於用在電子裝置1 〇 〇與 排熱器104之間的熱介面材料ι〇2類型；施加於加熱元件 1 〇 6之電流量；以及加熱元件1 〇 6之熱輸出能力。但是，加 熱το件106係在電子裝置ι〇〇或插腳98及電路板99變暖之前 加熱至預定溫度。The Km element 106 is heated to a temperature which is preferably slightly higher than the heat: a large filament point or a phase transition temperature. Alternatively, the heating element m uses the phase transition temperature of the thermal interface ι〇2. Accordingly, the present invention operates as a secondary source that causes the heat rejection device 104 to form a bond with the interface. In addition, the characteristics of the thermal interface 102 cause the thermal interface 1〇2 to undergo a reverse phase change or hardening as it cools or returns to its equilibrium state. The hardening of the thermal interface 1〇2 thus fixes the heat-dissipating device 1〇4 to the heat-generating device 1〇〇. In a preferred embodiment, the heating element 106 is heated to a predetermined temperature for a period of time ranging from a few microseconds to a few minutes, depending on a number of factors. The required heating element 1 0 6 pulse output depends on (but not limited to) the type of thermal interface material i 〇 2 used, the amount of thermal interface material between the electronic device 1 〇〇 and the heat eliminator 1 〇 4 , and the electronic device The desired joint strength between 1000 and the heat exchanger i 〇4. In addition, the thermal surface heating time depends on, but is not limited to, the type of thermal interface material ι〇2 used between the electronic device 1 and the heat extractor 104; the amount of current applied to the heating element 1 〇6; The heat output capability of component 1 〇6. However, the heating τ means 106 is heated to a predetermined temperature before the electronic device ι or the pin 98 and the circuit board 99 are warmed.

第14頁 1301884 五、發明說明（ίο) 在較佳實施例中，電流穩定地施加於加熱元件1 〇 6 一段' 適當時間（視眾多因子而定，其中一些因子見於前文）使 加熱元件106加熱成略高於介面102之相變溫度。因此，加 熱元件1 0 6之穩定增加溫度高到足以使介面1 〇 2之附著物層 1 0 3炼化而不容許熱散佈到下層封裝材及電路板g g上的周 遭組件。在替代實施例中，電流係經由電端子1 1 〇施加^ 加熱元件106，藉此加熱元件106受到非常短時間的熱脈、 衝，從數k秒到數分鐘的時間，視前文所述因子而定。在 此實施例中，來自加熱元件丨06之熱脈衝慢到足以加熱介 Φ 面1 0 2之附著物層1 〇 3。但是，熱脈衝也夠短暫且總能量夠 低，使得電子裝置100之活動區不會超過其熱預算致使過 ，二f瞭解到排熱裝置104的本質是消散加熱元件1〇6所造 ”5:因=’熱I衝的f十時係設定為使得熱介面1〇2充 、查釗一巧古π命^ 不致讓電子裝置100和排熱裝置104 所μ t认〜丸人 、Ί β舌說’加熱脈衝的短暫延續時間實 質上短於從熱介面1〇2到電 T J ^ 時間（大約是工秒）。電子装置100之頂面101的熱擴散 最好加熱元件1 〇 6全部加埶 方法導致介面材料102在執；同溫度相同時間量。此 表面上均句-致地經歷相變1面1〇2之附著物層m的整個 區（例如依象限）加熱介面m另—選擇’加熱元件106分 法容許整個介面102因此分之附者物層103。此替代方 容許在單一脈衝中將大量°漸增地形成。此替代方法亦 域，藉此單一熱脈衝具有施加於介面102之一特定區 遂低於使電子裝置100過熱的Page 14 1301884 V. Inventive Description (ίο) In the preferred embodiment, current is applied to the heating element 1 〇6 for a suitable period of time (depending on a number of factors, some of which are found above) to heat the heating element 106 It is slightly higher than the phase transition temperature of the interface 102. Therefore, the steadily increasing temperature of the heating element 106 is high enough to refine the adherent layer 103 of the interface 1 〇 2 without allowing heat to spread to the underlying package and the peripheral components on the board g g . In an alternative embodiment, the current is applied via the electrical terminal 1 1 to the heating element 106, whereby the heating element 106 is subjected to a very short period of heat pulse, from a few k seconds to a few minutes, depending on the factors previously described. And set. In this embodiment, the heat pulse from the heating element 丨06 is slow enough to heat the adherent layer 1 〇 3 of the Φ face 1 0 2 . However, the heat pulse is also short enough and the total energy is low enough, so that the active area of the electronic device 100 does not exceed its thermal budget, and the essence of the heat-dissipating device 104 is that the heat-dissipating heating element 1〇6 is created. :====================================================================================================== The tongue says that the short duration of the heating pulse is substantially shorter than the time from the thermal interface 1〇2 to the electrical TJ ^ time (about seconds). The thermal diffusion of the top surface 101 of the electronic device 100 is preferably the heating element 1 〇6 plus The enthalpy method causes the interface material 102 to be at the same temperature for the same amount of time. The surface of the surface layer of the attachment layer m of the phase change 1 to 1 〇 2 (for example, the quadrant) heating interface m is further selected. The 'heating element 106 division allows the entire interface 102 to be separated by a layer 103. This alternative allows for a large number of ° to be formed incrementally in a single pulse. This alternative method is also local, whereby a single heat pulse is applied to the interface One of the specific areas of 102 is lower than the electronic device 100 is overheated.

第15頁 1301884 五、發明說明（11) -- 溫度。 ，Page 15 1301884 V. INSTRUCTIONS (11) -- Temperature. ,

以下詳細說明耦接排熱裝置與電子裝置之程序。圖^和 3B繪出依據本發明之較佳耦接方法的概圖。如圖3人和3B 所不，安裝工具201與排熱裝置204之下表面208上的端 子210電接觸。另一撰遥，上义上 力 k擇如刚文所述及圖2 A和2 B所示， 電端子係定位在棑熱裝置2〇4之側表面及/或頂面上。此 外圖3 A和3 β中繪出一對彈簧構件2 0 8，藉此該等彈簧構 件容許安裝工具201將排熱装置2〇4押往熱介面2〇2和電子 裝置2 0 0。相似地，彈簧構件2〇8容許安裝工具2〇ι輕易地 將排熱裝置204移離熱介面2〇2和電子裝置2〇〇，詳見下 文。應注意到圖3Α和3Β所示安裝工具2〇1僅為範例，本發 明涵蓋可卸除地耦接排熱裝置2〇4與電子裝置2〇〇之任何不 同類型的安裝工具2 〇 1幾何排列。 圖4繪出一就圖3Α和3Β所示說明、依據本發明較佳實施 例之耦接方法的流程圖。排熱裝置2〇4本身還有電接觸件 ^1 :和加熱：件2 〇 6皆如前文所述利用習知方法製成。在該 权佳方法中，一開始時將電子裝置2〇〇耦接於 藉此由插腳98陣列將電子裝置2〇〇保持在電路 驟300)。另一 #煜，雷；狀罢9Λη及+ &吩板99上（步 ^ ^ ^ w 9ηπ 、擇電子衣置20 0係在熱介面2 02施加於 ::99且排熱裝置204亦已與其輕接之後方耦接於電 接下來，最好將熱介面2 〇 2施加於電子裝置2 (步驟3。…另一選擇，將熱介面2〇2施加置:電 2 0 0之底部。另一選擇，將熱介面2〇2施加於拂熱裝置2〇4The procedure for coupling the heat rejection device to the electronic device will be described in detail below. Figures 2 and 3B depict an overview of a preferred coupling method in accordance with the present invention. As shown in Figures 3 and 3B, the mounting tool 201 is in electrical contact with the terminal 210 on the lower surface 208 of the heat rejection device 204. In addition, as shown in the text and shown in Figures 2A and 2B, the electrical terminals are positioned on the side surface and/or the top surface of the heat-dissipating device 2〇4. Further, a pair of spring members 220 are drawn in Figs. 3A and 3β, whereby the spring members allow the mounting tool 201 to push the heat discharging device 2〇4 to the thermal interface 2〇2 and the electronic device 200. Similarly, the spring member 2〇8 allows the mounting tool 2〇 to easily move the heat removal device 204 away from the thermal interface 2〇2 and the electronic device 2〇〇, as will be described below. It should be noted that the mounting tool 2〇1 shown in Figures 3A and 3B is merely an example, and the present invention covers any different types of mounting tools that are removably coupled to the heat-dissipating device 2〇4 and the electronic device 2〇〇1〇1 geometry arrangement. 4 is a flow chart showing a coupling method in accordance with a preferred embodiment of the present invention, as illustrated in FIGS. 3A and 3B. The heat-dissipating device 2〇4 itself has an electrical contact ^1: and heating: the member 2 〇 6 is produced by a conventional method as described above. In the preferred method, the electronic device 2 is initially coupled to thereby holding the electronic device 2 in an array of pins 98 in circuit step 300). Another #煜,雷; 状时Λ9Λη and + & on the plate 99 (step ^ ^ ^ w 9ηπ, select the electronic clothes set 20 0 in the thermal interface 2 02 applied to ::99 and the heat removal device 204 has also After being connected to the battery, the thermal interface 2 〇 2 is preferably applied to the electronic device 2 (step 3). Alternatively, the thermal interface 2〇2 is applied: the bottom of the battery 200. Alternatively, the thermal interface 2〇2 is applied to the thermal device 2〇4

第16頁 1301884 五、發明說明（12) 之頂面和底部表面（個別施加或合併施加）。如前所述， 熱介面2 0 2係利用習知技術和方法施加於電子裝置2 〇 〇。熱 介面2 0 2 (較佳為焊料）處於固態且在受熱至其相變溫度 時易於相變。 一旦電子裝置200準備好與排熱裝置2〇4接合，外部安裝 工具201 (圖3A和3B)將排熱裝置2 04移動至一預定位置使 排熱裝置2 04耦接於電子裝置2〇〇 (步驟3〇4 )。較佳來 說，排熱裝置204之適當位置為電子裝置2〇〇的上方。另一 選擇，排熱裝置204之適當位置為鄰接於電子裝置2〇〇 後者下方。 、女裝工具201利用一電源220以移動並安置排熱裝置2〇4 並且使排熱裝置204與熱介面202接合。此外，安裝工具 201耦接於一加熱元件電源224，該加熱元件電源經由^接 觸件210'加熱元件2〇6供應一電流。電接觸件21〇完成電 路使加熱元件206發熱且藉此使排熱裝置2〇4與電子裝置 接ο合。另一選擇，電接觸件210如前所述係定位^排熱 二04之頂面或鄰接面上。加熱元件電源224最好耦接於 :起動控制加熱元件2〇6之控制電路22 2。此外，控制電 路22控制加熱元件2〇6的作用時間量以 逐漸地或是以短暫脈衝加熱熱介面2〇2。…疋件2 0 6疋 於示，電子裝置2°°在排熱裝置204卸離時係耦接 99然後ϋ二另一選擇，首先將電子裝置2 0 0移離電路板 定位A I *排熱裝置2〇4。安裝工具201將排熱裝置204 為與熱介面202之附著物層2〇3接觸（步驟3〇6)。電Page 16 1301884 V. The top and bottom surfaces of the invention (12) (individually applied or combined). As previously mentioned, the thermal interface 2 2 2 is applied to the electronic device 2 利用 using conventional techniques and methods. The thermal interface 2 0 2 (preferably solder) is in a solid state and is susceptible to phase change when heated to its phase transition temperature. Once the electronic device 200 is ready to engage with the heat removal device 2〇4, the external mounting tool 201 (Figs. 3A and 3B) moves the heat removal device 204 to a predetermined position to couple the heat removal device 206 to the electronic device 2〇〇. (Step 3〇4). Preferably, the appropriate location of the heat removal device 204 is above the electronic device 2A. Alternatively, the appropriate location of the heat removal device 204 is adjacent to the electronic device 2 below the latter. The dressing tool 201 utilizes a power source 220 to move and house the heat rejection device 2〇4 and engage the heat removal device 204 with the thermal interface 202. In addition, the mounting tool 201 is coupled to a heating element power supply 224 that supplies a current through the heating element 2〇6 via the contact 210'. The electrical contacts 21 〇 complete the circuit to heat the heating element 206 and thereby cause the heat rejection device 2〇4 to interface with the electronic device. Alternatively, the electrical contact 210 is positioned as described above on the top or abutment surface of the heat sink 04. The heating element power supply 224 is preferably coupled to: a control circuit 22 2 that activates the control heating element 2〇6. In addition, control circuit 22 controls the amount of time the heating element 2 〇 6 is to heat the thermal interface 2 〇 2 either gradually or with a brief pulse. ... 疋 2 2 6 疋 , , , , , 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子Device 2〇4. The mounting tool 201 brings the heat rejection device 204 into contact with the attachment layer 2〇3 of the thermal interface 202 (step 3〇6). Electricity

第17頁 !3〇1884Page 17 !3〇1884

五、發明說明（13) 加t加f ΓηΓ電源224發出且經控制電路222控制，藉此對 文ί : +㈤供應電流一段適當時間，此時間量取決於前， 加埶- I 9ηΓ (步驟3〇8 )。流過加熱元件20 6的電流導致 變二^ α I* 生充分熱量將熱介面2 02之溫度提高到其相 驟310)。此溫度提升導致熱介面202經歷 的液體的相變。但是，加熱元件20 6在一段夠短 带】;on /充分熱量使得熱能不會送到並因而損害電子 2n所二ίϊ板"或排熱裝置204。如前所述，加熱元件 Η所產生的熱可經控制電路m控制為—逐漸增溫的均勾 22?H一選擇’加熱元件2 06所產生的熱可經控制電路 222控制為一預定延續時間的短暫脈衝。此外，如前所 =加熱το件206可建構為直接加熱熱介面2〇2或是分象限 或分區加熱熱介面202。 然後利用彈簧2 08將排熱裝置2〇4壓抵於電子裝置2〇〇，V. INSTRUCTION DESCRIPTION (13) Adding t plus f ΓηΓ power supply 224 is issued and controlled by control circuit 222, thereby supplying current to the text: +(f) for a suitable period of time, depending on the front, plus - I 9ηΓ (step 3〇8). The current flowing through the heating element 20 6 causes the heat to increase the temperature of the thermal interface 202 to its phase 310). This temperature increase causes a phase change of the liquid experienced by the thermal interface 202. However, the heating element 20 6 is in a short enough band; on / sufficient heat so that thermal energy is not sent and thus damages the electrons 2 or the heat removal device 204. As mentioned above, the heat generated by the heating element 可 can be controlled by the control circuit m to be a gradual warming of the hook 22? H. The heat generated by the heating element 206 can be controlled by the control circuit 222 to a predetermined continuation. A short pulse of time. In addition, the heating element 206 can be constructed to directly heat the thermal interface 2〇2 or the sub-quadrant or zone heating thermal interface 202. Then, the heat discharging device 2〇4 is pressed against the electronic device 2〇〇 by the spring 208,

藉此使加熱元件2 0 6至少局部地嵌入熱介面材料2〇2内（步 驟312)。熱介面2 02在轉變成液態或軟熔狀態之後容許排 熱裝置204之底部表面輕易地壓下與熱介面2〇2接觸。在適 當加熱時間之後，控制電路222終止對加熱元件2〇6的電流 供應，從而容許加熱元件2 0 6冷卻（步驟314)。電流終止 的效果使得熱介面202之溫度降到相變溫度以下。一旦执 介面202之溫度掉到其相變溫度以下，熱介面2〇2經歷一‘'從 液態回到固態的反相變，最好是在數秒之内發生（步驟 3 1 6 )。應了解到冷卻時間量因熱介面2 〇 2類型、埶介面 2 02之層厚、及前文所述其他因子而異。另一選擇"'，藉由Thereby, the heating element 206 is at least partially embedded in the thermal interface material 2〇2 (step 312). The thermal interface 02 allows the bottom surface of the heat rejection device 204 to be easily pressed into contact with the thermal interface 2A2 after being converted into a liquid or reflow state. After a suitable heating time, control circuit 222 terminates the supply of current to heating element 2〇6, thereby allowing heating element 206 to cool (step 314). The effect of current termination causes the temperature of the thermal interface 202 to drop below the phase transition temperature. Once the temperature of the interface 202 falls below its phase transition temperature, the thermal interface 2〇2 undergoes a reverse phase change from liquid to solid, preferably within a few seconds (step 3 16). It should be understood that the amount of cooling time will vary depending on the type of thermal interface 2 〇 2, the thickness of the tantalum interface 02, and other factors as described above. Another option "', by

1301884 五、發明說明（14) 一風扇或其他冷卻裝置（圖中未示）使熱介面2 〇 2快速冷 卻。 一旦熱介面202冷卻回固態，排熱裝置204變得接合並固 定於電子裝置200。固相熱介面202之特質將排熱裝置204 牢固地保持在定位且因為熱介面2 〇 2之低熱阻而容許熱輕 易地從電子裝置200轉移至排熱裝置204。在此之後，工具 201釋放排熱裝置204，藉以進行系統組裝的後續作業（步 驟 3 1 6 )。 今說明將排熱裝置204卸離電子裝置2〇〇的程序。圖5繪 出一就圖3A和3B所示說明、依據本發明較佳實施例之卸除& 方法的流程圖。為使排熱裝置2 〇4卸離發熱裝置2 〇 〇，安裝 工具201移動並定位為接合排熱裝置2〇4，如圖3β所示（步 驟40 0 )。一旦工具201接合排熱裝置2〇4，工具2〇1之接二 臂上的電極21 1達到與排熱裝置2〇4之底部表面上的電端^ 2 1 0接觸。然後由電源2 2 4對工具2 〇 1供電，藉此使電流通 過電極2 1 1經由電端子1 1 〇送到加熱元件2 〇 6 (步驟4 〇 2 )。 流過加熱元件2 0 6的電流導致加熱元件2〇6產生充分的熱使 熱介面2 0 2的溫度提高到相變溫度以上（步驟4 〇 4 )。如前 所述，加熱元件2 0 6所產生的熱可經控制電路2 22控制二 逐漸增溫的均勾加熱。另一選擇，加熱元件2〇6所產生 f 熱可經控制電路2 2 2控制為一預定延續時間的短暫脈衝。 此外，如前所述，加熱元件2 0 6可建構為直接加埶埶 2 02或是分象限或分區加熱熱介面2〇2。 ...... 溫度的提高導致熱介面2 0 2經歷一從固態到液態的相1301884 V. INSTRUCTIONS (14) A fan or other cooling device (not shown) cools the thermal interface 2 〇 2 quickly. Once the thermal interface 202 has cooled back to the solid state, the heat rejection device 204 becomes engaged and secured to the electronic device 200. The nature of the solid phase thermal interface 202 securely maintains the heat rejection device 204 in position and allows heat to be easily transferred from the electronic device 200 to the heat rejection device 204 due to the low thermal resistance of the thermal interface 2 〇 2 . After that, the tool 201 releases the heat rejection device 204 for subsequent operations of system assembly (step 3 16). The procedure for discharging the heat rejection device 204 from the electronic device 2A will now be described. Figure 5 depicts a flow chart of the Discharge & Method in accordance with the preferred embodiment of the present invention illustrated in Figures 3A and 3B. In order to disengage the heat-dissipating device 2 〇 4 from the heat-generating device 2 〇 , the mounting tool 201 is moved and positioned to engage the heat-dissipating device 2 〇 4 as shown in Fig. 3β (step 406). Once the tool 201 engages the heat rejection device 2〇4, the electrode 21 1 on the second arm of the tool 2〇1 comes into contact with the electrical terminal ^ 2 1 0 on the bottom surface of the heat rejection device 2〇4. The tool 2 〇 1 is then powered by the power source 2 4 4, whereby current is passed through the electrode 2 1 1 to the heating element 2 〇 6 via the electrical terminal 1 1 (step 4 〇 2 ). The current flowing through the heating element 206 causes the heating element 2〇6 to generate sufficient heat to raise the temperature of the thermal interface 220 to above the phase transition temperature (step 4 〇 4 ). As described above, the heat generated by the heating element 206 can be controlled by the control circuit 22 to control the two gradually increasing temperatures. Alternatively, the heat generated by the heating element 2〇6 can be controlled by the control circuit 22 to a brief pulse of a predetermined duration. Furthermore, as previously mentioned, the heating element 206 can be constructed as a direct addition 02 or a sub-quadrant or zoned heating interface 2〇2. ... the increase in temperature causes the thermal interface 2 0 2 to undergo a phase from solid to liquid

1301884 五、發明說明（15) 4 2 Ζ Ϊ則所述，加熱元件2 〇 6在一段夠短的時間内產 或= ί使得送到電子裝置200或排熱裝置204的熱極少 执壯χ ΐ 熱介面2 02相變成液態或軟溶狀態藉以讓排 二除固定接合狀態（步驟4〇6)。圖3Α和3β所示 二面2ί)ίΓ 之安裝臂的彈簧起作用將排熱裝置204拉離熱 ;丨面202，從而使排熱裝置2〇4脫離電子裝置2〇〇。一旦 熱裝置2 04卸離電子裝置200,加熱元件2〇6即不再與&八1301884 V. INSTRUCTIONS (15) 4 2 Ζ 所述 , , , , , , , 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热 加热The hot interface 02 becomes a liquid or soft state to allow the row 2 to be removed from the fixed state (step 4〇6). The springs of the mounting arms shown in Figures 3A and 3β act to pull the heat-dissipating device 204 away from the heat; the surface 202, thereby causing the heat-dissipating device 2〇4 to be detached from the electronic device 2〇〇. Once the thermal device 206 is detached from the electronic device 200, the heating element 2〇6 is no longer associated with &

面202接觸。另一選擇，在熱介面2〇2已變成液體適當、、、時I 後，控制電路222終止對加熱元件2 0 6供電且使排熱^ θ1 204脫離電子裝置2 0 0。對熱介面2 0 2之供熱終止使'得&熱4八 面2 02的溫度下降，藉此熱介面20 2經歷一從液態回f到' 的相變’最好是在數秒之内發生（步驟4〇8) 。 口您 以上已就特定實施例說明本發明且納入細節以協助 本發明之構造和運作的原則。吾人並不希望以本說明$解 於特定實施例及其細節的敘述限制申請專利範圍。熟二對 技藝者會理解到可不脫離本發明之精神和範圍就範你j習此 例做出修改。 歹、實施Face 202 is in contact. Alternatively, after the thermal interface 2〇2 has become liquid, I, the control circuit 222 terminates the supply of the heating element 206 and dissipates the heat rejection θ1 204 from the electronic device 2000. The termination of the heating of the thermal interface 220 causes the temperature of the 'heating & hot 4 octagonal 2 02 to drop, whereby the thermal interface 20 2 undergoes a phase change from liquid to f to ', preferably within a few seconds Occurs (step 4〇8). The invention has been described above with respect to specific embodiments and the details are included to assist the principles of construction and operation of the invention. We do not wish to limit the scope of the patent application in the description of the specific embodiments and the details thereof. It will be appreciated by those skilled in the art that modifications may be made without departing from the spirit and scope of the invention.歹, implementation

第20頁 1301884 圖式簡單說明 "一 圖1 A繪出一銅製排熱裝置附接於一矽晶片之背側，有一‘ 滑脂層介於其間。 圖1B繪出一鋼製排熱裝置附接於一矽晶片之背側，有一熱 滑脂層介於其間且因受熱而膨脹。 圖1 C繪出一銅製排熱裝置附接於一矽晶片之背側，有一熱 滑脂層介於其間且經歷雙金屬彎曲。 圖2 A繪出依據本發明較佳實施例一排熱裝置分離於一發熱 裝置的概圖。 ^ 圖2Β繪出依據本發明較佳實施例一排熱裝置耦接於一發熱 裝置的概圖。 ^ 圖3 Α繪出一依據本發明之較佳耦接方法的概圖。 圖3 B繪出一依據本發明之較佳耦接方法的概圖。 圖4為一描述使排熱裝置與發熱裝置耦接之方法流程圖。 圖5為一描述使排熱裝置與發熱裝置分離之方法流程圖。 元件符號說明 9 8接頭 1 0 1頂面 104排熱裝置 1 0 8底部表面 2 0 0電子裝置 2 0 3附著物層 2 0 8彈簧構件 2 2 0電源 100發熱裝置 1 0 3附著物層 元件 1 1 2上表面 2 0 2熱介面 2 0 6加熱元件 2 1 1電極 2 2 4加熱元件電源 9 9電路板 1 0 2熱介面薄膜 10 6、10 6 ’、1〇 6"加熱 11 0電接觸件或端子 201安裝工具 2 0 4排熱裝置 210端子 2 2 2控制電路Page 20 1301884 Brief Description of the Drawings " Figure 1A depicts a copper heat rejection device attached to the back side of a wafer with a 'slip layer between them. Figure 1B depicts a steel heat rejection device attached to the back side of a wafer with a layer of hot grease interposed therebetween and expanded by heat. Figure 1C depicts a copper heat rejection device attached to the back side of a wafer with a layer of hot grease interposed therebetween and undergoing bimetallic bending. Figure 2A depicts an overview of a heat removal device separated from a heat generating device in accordance with a preferred embodiment of the present invention. Figure 2 is a schematic diagram of a heat-dissipating device coupled to a heat-generating device in accordance with a preferred embodiment of the present invention. ^ Figure 3 depicts an overview of a preferred coupling method in accordance with the present invention. Figure 3B depicts an overview of a preferred coupling method in accordance with the present invention. 4 is a flow chart depicting a method of coupling a heat removal device to a heat generating device. Figure 5 is a flow chart depicting a method of separating a heat rejection device from a heat generation device. Component symbol description 9 8 connector 1 0 1 top surface 104 heat removal device 1 0 8 bottom surface 2 0 0 electronic device 2 0 3 attachment layer 2 0 8 spring member 2 2 0 power supply 100 heat generating device 1 0 3 attachment layer component 1 1 2 upper surface 2 0 2 thermal interface 2 0 6 heating element 2 1 1 electrode 2 2 4 heating element power supply 9 9 circuit board 1 0 2 thermal interface film 10 6 , 10 6 ', 1 〇 6 " heating 11 0 electricity Contact or terminal 201 mounting tool 2 0 4 heat removal device 210 terminal 2 2 2 control circuit

Claims (1)

1301884 六、申請專利範圍 1. 一種可卸除地耦接一排熱裝置與一發熱裝置之方法，# 其包括： - a. 將該排熱裝置建構為包含至少一加熱元件； b. 對該發熱裝置之一交界表面施加一熱介面材料，該棑 熱裝置之一第一表面與該熱介面材料接觸，將該熱介面材 料建構為容許在一預定溫度以上與該排熱裝置接合和脫 離，且 c. 對該至少一加熱元件施加一電流一段預定時間量，其 中該至少一加熱元件將該熱介面材料加熱至該預定溫度以 上。 2. 如申請專利範圍第1項之方法，其更包括將該排熱裝置 相對於該發熱裝置定位在一預定位置。 3. 如申請專利範圍第1項之方法，其中該熱介面材料在一 低於該預定溫度的第一溫度與一高於該預定溫度的第二溫 度之間經歷一相變。 4. 如申請專利範圍第3項之方法，其中該排熱裝置與該發 熱裝置的接合更包括將該排熱裝置和該熱介面材料相互壓 抵至該熱介面材料之溫度大致處於該第一溫度為止。 5. 如申請專利範圍第3項之方法，其中該排熱裝置與該發 熱裝置的脫離更包括在該熱介面材料之溫度大致處於該第 二溫度時將該排熱裝置和該熱介面材料相互移開。 6. 如申請專利範圍第1項之方法，其中該至少一加熱元件 定位在該排熱裝置第一表面上。 7. 如申請專利範圍第1項之方法，其中該至少一加熱元件1301884 6. Patent application scope 1. A method for removably coupling a row of heat devices and a heat generating device, #includes: - a. constructing the heat rejection device to include at least one heating element; b. Applying a thermal interface material to an interface surface of one of the heat generating devices, the first surface of the thermal device being in contact with the thermal interface material, the thermal interface material being constructed to permit engagement and disengagement with the heat removal device above a predetermined temperature, And c. applying a current to the at least one heating element for a predetermined amount of time, wherein the at least one heating element heats the thermal interface material above the predetermined temperature. 2. The method of claim 1, further comprising positioning the heat rejection device relative to the heat generating device at a predetermined location. 3. The method of claim 1, wherein the thermal interface material undergoes a phase transition between a first temperature below the predetermined temperature and a second temperature above the predetermined temperature. 4. The method of claim 3, wherein the joining of the heat-dissipating device to the heat-generating device further comprises pressing the heat-dissipating device and the heat interface material against each other to a temperature of the heat interface material substantially at the first The temperature is up. 5. The method of claim 3, wherein the disengaging of the heat-dissipating device from the heat-generating device further comprises: mutually contacting the heat-dissipating device and the thermal interface material when the temperature of the thermal interface material is substantially at the second temperature Remove. 6. The method of claim 1, wherein the at least one heating element is positioned on the first surface of the heat rejection device. 7. The method of claim 1, wherein the at least one heating element 第22頁 1301884 六、申請專利範圍 定位在一反向於該排熱 8. 如申請專利範圍第1 定位在該排熱裝置内。 9. 如申請專利範圍第1 在預定區域位置加熱該 1 0.如申請專利範圍第 件以一大致均勻方式對 1 1.如申請專利範圍第 件藉由複數個熱脈衝對 一段預定延續時間。 12.如申請專利範圍第 置建構為包含位在一預 該電流係透過該至少一 1 3. —種排熱裝置，其 料，該熱介面材料可建 該排熱裝置，該排熱裝 加於該至少一加熱元件 熱元件内產生充分的熱 度以上。 14. 如申請專利範圍第 料在一低於該預定溫度 第二溫度之間經歷一相 15. 如申請專利範圍第 料經由壓抵於該排熱裝 裝置第一表面之排熱裝置表面。 項之方法，其中該至少一加熱元件 項之方法，其中該至少一加熱元件 熱介面材料。 1項之方法，其中該至少一加熱元 該熱介面材料施熱。 1項之方法，其中該至少一加熱元 該熱介面材料施熱，每一熱脈衝有 1項之方法，其更包括將該排熱裝 定表面上之至少一電接觸件，其中 電接觸件施加。 建構為可卸除地耦接於一熱介面材 構為在一預定溫度以上接合和脫離 置包括至少一加熱元件，其中一施 一段預定時間之電流在該至少一加 以將該熱介面材料加熱至該預定溫 1 3項之排熱裝置，其中該熱介面材 的第一溫度與一高於該預定溫度的 變 〇 1 4項之排熱裝置，其中該熱介面材 置至該熱介面材料達到該第一溫度Page 22 1301884 VI. Scope of Application Patent Positioning in the opposite direction to the heat rejection 8. Positioned in the heat removal device as in the first application scope. 9. If the scope of the patent application is first, the heating is performed at a predetermined area. If the patent application section is in a substantially uniform manner, the pair 1 is applied as a predetermined duration by a plurality of heat pulses. 12. If the scope of the patent application is configured to include a current in the current system through the at least one of the three types of heat-dissipating devices, the heat-exchange material can be constructed to form the heat-dissipating device. A sufficient heat is generated in the at least one heating element thermal element. 14. If the scope of the patent application is to go through a phase between a second temperature below the predetermined temperature, and the surface of the heat dissipating device is pressed against the first surface of the heat dissipating device. The method of the item, wherein the at least one heating element item, wherein the at least one heating element is a thermal interface material. The method of item 1, wherein the at least one heating element applies heat to the thermal interface material. The method of claim 1, wherein the at least one heating element applies heat to the thermal interface material, and each heat pulse has a method of heating, wherein the method further comprises: at least one electrical contact on the surface of the heat-dissipating surface, wherein the electrical contact Apply. Removably coupled to a thermal interface material to engage and disengage at a predetermined temperature or more to include at least one heating element, wherein a current for a predetermined period of time is heated to the at least one of the thermal interface material The heat-dissipating device of the predetermined temperature, wherein the first temperature of the thermal interface material and a heat-dissipating device having a temperature higher than the predetermined temperature, wherein the thermal interface material is disposed to the thermal interface material The first temperature 第23頁 1301884 六、申請專利範圍 為止的方式接合該排熱裝置。 1 1 6 ·如申請專利範圍第1 4項之排熱裝置，其中該熱介面材 料經由在該熱介面材料處於該第二溫度時將該排熱裝置和 該熱介面材料相互移開的方式脫離該棑熱裝置。 1 7.如申請專利範圍第1 3項之排熱裝置，其中該至少一加 熱元件建構為欲與該熱介面材料接觸。 1 8 ·如申請專利範圍第1 3項之排熱裝置，其中該至少一加 熱元件位在該排熱裝置反向於該熱介面材料之一表面上。 1 9 ·如申請專利範圍第1 3項之排熱裝置，其中該至少一加 熱元件位在該排熱裝置内。 20.如申請專利範圍第1 3項之排熱裝置，其中該至少一加 熱元件在預定區域位置加熱該熱介面材料。 2 1.如申請專利範圍第1 3項之排熱裝置，其中該至少一加 熱元件以一大致均勻方式對該熱介面材料施熱。 22. 如申請專利範圍第1 3項之排熱裝置，其中該至少一加 熱元件藉由複數個熱脈衝對該熱介面材料施熱，每一熱脈 衝有一段預定延續時間。 23. 如申請專利範圍第1 3項之排熱裝置，其更包括位在一 預定表面上之至少一電接觸件，其中該電流係透過該至少 一電接觸件施加。 24. —種耦接於一介面材料之排熱裝置，其中該排熱裝置 固定於處於一第一相態之該介面材料且建構為可卸離處於 一第二相態之該介面材料，該排熱裝置包括至少一加熱元 件用以對該介面材料施加預定熱量使得該介面材料回應於Page 23 1301884 6. The method of applying for patents joins the heat removal device. 1 1 6 · The heat removal device of claim 14, wherein the thermal interface material is detached from the heat removal device and the thermal interface material when the thermal interface material is at the second temperature The heat device. 1 7. The heat rejection device of claim 13, wherein the at least one heating element is configured to be in contact with the thermal interface material. 1 8 The heat-dissipating device of claim 13, wherein the at least one heating element is located on a surface of the heat-dissipating device opposite to one of the thermal interface materials. 1 9 The heat-dissipating device of claim 13, wherein the at least one heating element is located in the heat-dissipating device. 20. The heat rejection device of claim 13, wherein the at least one heating element heats the thermal interface material at a predetermined location. 2 1. The heat rejection device of claim 13, wherein the at least one heating element applies heat to the thermal interface material in a substantially uniform manner. 22. The heat rejection device of claim 13, wherein the at least one heating element applies heat to the thermal interface material by a plurality of heat pulses, each heat pulse having a predetermined duration. 23. The heat rejection device of claim 13 wherein the heat removal device further comprises at least one electrical contact on a predetermined surface, wherein the current is applied through the at least one electrical contact. 24. A heat removal device coupled to an interface material, wherein the heat removal device is fixed to the interface material in a first phase state and is configured to be detachable from the interface material in a second phase state, The heat removal device includes at least one heating element for applying a predetermined amount of heat to the interface material such that the interface material responds to 第24頁 1301884 六、申請專利範圍 由該至少一 一相態至該 25.如申請 在低於一預 2 6.如申請 在高於一預 2 7 ·如申請 在一段適當 變 ° 2 8.如申請 熱元件在預 29.如 熱元件 3 0·如 熱元件 有一段 31·如 熱元件 32.如 熱元件 3 3.如 熱元件 34.如 預定表 申請 以一 申請 藉由 預定 申請 建構 申請 位在 申請 位在 申請 面上 加熱元 第二相 專利範 定相變 專利範 定相變 專利範 時間内 專利範 定區域 專利範 大致均 專利範 複數個 延續時 專利範 為欲與 專利範 該排熱 專利範 該排熱 專利範 之至少 件施加於其之預定 態的相變。 圍第2 4項之排熱裝 溫度時係處於該第 圍第2 5項之排熱裝 溫度時係處於該第 圍第24項之排熱裝 經歷該第一相態與 圍第24項 位置加熱 圍第24項 勻方式對 圍第24項 熱脈衝對 間。 圍第24項 該介面材 圍第24項 裝置反向 圍第24項 裝置内。 圍第24項 之排熱裝 該介面材 之排熱裝 該介面材 之排熱裝 該介面材 熱量而經歷一自該第 置，其中該介面材料 一相態。 置，其中該介面材料 二相態。 置，其中該介面材料 該第二相態之間的相 置，其中該至少一加 料。 置，其中該至少一加 料施熱。 置，其中該至少一加 料施熱，每一熱脈衝 之排熱裝置，其中該至少一加 料接觸。 之排熱裝 於該介面 之排熱裝 置，其中該至少一加 材料之一表面上。 置，其中該至少一加 之排熱裝置，其更包括位在一 電接觸件，其中該電流係透過該至少Page 24 1301884 VI. The scope of application for the patent is from the at least one phase to the 25. If the application is below a pre-2 6. If the application is above a pre-2 7 · If the application is in a suitable period ° 2 8. If the application of the thermal element is in advance 29. For example, the thermal element 30. If the thermal element has a section 31, such as the thermal element 32. For example, the thermal element 3 3. For example, the thermal element 34. If the application is scheduled, an application is filed by a predetermined application. In the application position on the application surface, the second phase of the patent, the patent, the phase change, the patent, the patent, the phase change, the patent, the patent, the patent, the patent, the patent, the patent, the patent, the continuation, the patent, the patent, and the patent. The thermal patent is a phase change in which at least a part of the heat rejection patent is applied to its predetermined state. When the hot charging temperature of the 24th item is in the hot charging temperature of the 25th item of the circumference, the hot charging device in the 24th item of the circumference experiences the first phase and the 24th position Heating the 24th item evenly around the 24th heat pulse pair. Section 24 This interface material is in the 24th item of the device. The heat-dissipating device of the 24th item is arranged to dissipate the heat of the interface material, and the interface material is subjected to heat from the interface material, wherein the interface material is in a phase state. Placed, wherein the interface material is in a two-phase state. And wherein the interface material has a phase between the second phase states, wherein the at least one additive. And wherein the at least one additive applies heat. And wherein the at least one additive applies heat to each of the heat pulse heat removal devices, wherein the at least one additive contacts. The heat is disposed on the heat dissipating device of the interface, wherein one of the at least one additive material is on the surface. The at least one heat removal device further includes an electrical contact, wherein the current is transmitted through the at least 第25頁 1301884 六、申請專利範圍 一電接觸件施加。 3 5. —種用以將一棑熱裝置可卸除地耦接於一發熱裝置的 總成，其中一具有一預定相變溫度之熱介面材料施加於該 排熱裝置與該發熱裝置之間，該總成包括： a. 用以保持該排熱裝置之一交界面與該熱介面材料接觸 的構件，其中建構在該交界面上之至少一加熱元件與該熱 介面材料接觸；及 b. 用以對該至少一加熱元件供能一段預定時間的構件， 其中該至少一加熱元件在該熱介面材料大致達到該預定相 變溫度時使該熱介面材料態變而經歷一相變。 3 6. —種可卸除地耦接一排熱裝置與一發熱裝置之方法， 其中一具有一預定相變溫度之熱介面材料處於該排熱裝置 與該發熱裝置之間，該方法包括： a. 將該排熱裝置建構為包含至少一加熱元件；且 b. 對該至少一加熱元件供能一段預定時間，其中一施加 於該至少一加熱元件之電流加熱該至少一加熱元件至該熱 介面材料大致達到該預定相變溫度為止。Page 25 1301884 VI. Scope of application for patents An electrical contact is applied. 3 5. An assembly for removably coupling a thermal device to a heat generating device, wherein a thermal interface material having a predetermined phase transition temperature is applied between the heat dissipating device and the heat generating device The assembly includes: a. a member for maintaining an interface of the heat removal device in contact with the thermal interface material, wherein at least one heating element constructed on the interface is in contact with the thermal interface material; and b. And means for energizing the at least one heating element for a predetermined period of time, wherein the at least one heating element undergoes a phase change when the thermal interface material substantially reaches the predetermined phase transition temperature. 3 6. A method of removably coupling a row of thermal devices and a heat generating device, wherein a thermal interface material having a predetermined phase transition temperature is between the heat dissipating device and the heat generating device, the method comprising: Constructing the heat rejection device to include at least one heating element; and b. energizing the at least one heating element for a predetermined time, wherein a current applied to the at least one heating element heats the at least one heating element to the heat The interface material substantially reaches the predetermined phase transition temperature. 第26頁Page 26
TW092128238A 2002-10-22 2003-10-09 Method and apparatus for removeably coupling a heat rejection device with a heat producing device TWI301884B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42055702P 2002-10-22 2002-10-22
US10/366,122 US20040076408A1 (en) 2002-10-22 2003-02-12 Method and apparatus for removeably coupling a heat rejection device with a heat producing device

Publications (2)

Publication Number Publication Date
TW200413683A TW200413683A (en) 2004-08-01
TWI301884B true TWI301884B (en) 2008-10-11

Family

ID=32095792

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092128238A TWI301884B (en) 2002-10-22 2003-10-09 Method and apparatus for removeably coupling a heat rejection device with a heat producing device

Country Status (4)

Country Link
US (1) US20040076408A1 (en)
AU (1) AU2003282532A1 (en)
TW (1) TWI301884B (en)
WO (1) WO2004038302A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8833435B2 (en) * 2008-08-05 2014-09-16 Pipeline Micro, Inc. Microscale cooling apparatus and method
US10043730B2 (en) * 2015-09-28 2018-08-07 Xilinx, Inc. Stacked silicon package assembly having an enhanced lid
CN113130727B (en) * 2019-12-31 2022-10-11 Tcl科技集团股份有限公司 LED chip mounting and pasting method
US11373929B1 (en) 2020-02-03 2022-06-28 Xilinx, Inc. Thermal heat spreader plate for electronic device

Family Cites Families (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US596062A (en) * 1897-12-28 Device for preventing bursting of freezing pipes
US2273505A (en) * 1942-02-17 Container
US2039593A (en) * 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US3771219A (en) * 1970-02-05 1973-11-13 Sharp Kk Method for manufacturing semiconductor device
DE2102254B2 (en) * 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS
FR2216537B1 (en) * 1973-02-06 1975-03-07 Gaz De France
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
DE2658720C3 (en) * 1976-12-24 1982-01-28 Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5300 Bonn Latent heat storage for holding a heat-storing medium
US4574876A (en) * 1981-05-11 1986-03-11 Extracorporeal Medical Specialties, Inc. Container with tapered walls for heating or cooling fluids
US4485429A (en) * 1982-06-09 1984-11-27 Sperry Corporation Apparatus for cooling integrated circuit chips
US4467861A (en) * 1982-10-04 1984-08-28 Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr Heat-transporting device
GB8323065D0 (en) * 1983-08-26 1983-09-28 Rca Corp Flux free photo-detector soldering
JPH0673364B2 (en) * 1983-10-28 1994-09-14 株式会社日立製作所 Integrated circuit chip cooler
US4893174A (en) * 1985-07-08 1990-01-09 Hitachi, Ltd. High density integration of semiconductor circuit
US5126919A (en) * 1985-10-04 1992-06-30 Fujitsu Limited Cooling system for an electronic circuit device
US4903761A (en) * 1987-06-03 1990-02-27 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
US4896719A (en) * 1988-05-11 1990-01-30 Mcdonnell Douglas Corporation Isothermal panel and plenum
US4866570A (en) * 1988-08-05 1989-09-12 Ncr Corporation Apparatus and method for cooling an electronic device
US5009760A (en) * 1989-07-28 1991-04-23 Board Of Trustees Of The Leland Stanford Junior University System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
US5179500A (en) * 1990-02-27 1993-01-12 Grumman Aerospace Corporation Vapor chamber cooled electronic circuit card
US5858188A (en) * 1990-02-28 1999-01-12 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US6176962B1 (en) * 1990-02-28 2001-01-23 Aclara Biosciences, Inc. Methods for fabricating enclosed microchannel structures
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5043797A (en) * 1990-04-03 1991-08-27 General Electric Company Cooling header connection for a thyristor stack
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
JPH07114250B2 (en) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション Heat transfer system
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5161089A (en) * 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
US5228502A (en) * 1991-09-04 1993-07-20 International Business Machines Corporation Cooling by use of multiple parallel convective surfaces
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
JPH05217121A (en) * 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> Method and apparatus for coupling of thermo- sensitive element such as chip provided with magnetic converter, etc.
US5239443A (en) * 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5308429A (en) * 1992-09-29 1994-05-03 Digital Equipment Corporation System for bonding a heatsink to a semiconductor chip package
DE4240082C1 (en) * 1992-11-28 1994-04-21 Erno Raumfahrttechnik Gmbh Heat pipe
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5269372A (en) * 1992-12-21 1993-12-14 International Business Machines Corporation Intersecting flow network for a cold plate cooling system
JP3477781B2 (en) * 1993-03-23 2003-12-10 セイコーエプソン株式会社 IC card
US5459352A (en) * 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
US5380956A (en) * 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5544696A (en) * 1994-07-01 1996-08-13 The United States Of America As Represented By The Secretary Of The Air Force Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
US6126723A (en) * 1994-07-29 2000-10-03 Battelle Memorial Institute Microcomponent assembly for efficient contacting of fluid
US5585069A (en) * 1994-11-10 1996-12-17 David Sarnoff Research Center, Inc. Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis
DE19514548C1 (en) * 1995-04-20 1996-10-02 Daimler Benz Ag Method of manufacturing a micro cooler
US5548605A (en) * 1995-05-15 1996-08-20 The Regents Of The University Of California Monolithic microchannel heatsink
US5705018A (en) * 1995-12-13 1998-01-06 Hartley; Frank T. Micromachined peristaltic pump
JP3029792B2 (en) * 1995-12-28 2000-04-04 日本サーボ株式会社 Multi-phase permanent magnet type rotating electric machine
JP3090954B2 (en) * 1996-01-04 2000-09-25 ダイムラークライスラー アクチエンゲゼルシャフト Cooling member with pins
ATE192368T1 (en) * 1996-02-13 2000-05-15 Abb Ab DEVICE FOR CASTING INTO A MOLD
US5768104A (en) * 1996-02-22 1998-06-16 Cray Research, Inc. Cooling approach for high power integrated circuits mounted on printed circuit boards
US5675473A (en) * 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5740013A (en) * 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
US5800690A (en) * 1996-07-03 1998-09-01 Caliper Technologies Corporation Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forces
US5801442A (en) * 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
US5763951A (en) * 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US5835345A (en) * 1996-10-02 1998-11-10 Sdl, Inc. Cooler for removing heat from a heated region
DE19643717A1 (en) * 1996-10-23 1998-04-30 Asea Brown Boveri Liquid cooling device for a high-performance semiconductor module
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US5964092A (en) * 1996-12-13 1999-10-12 Nippon Sigmax, Co., Ltd. Electronic cooling apparatus
JPH10190071A (en) * 1996-12-20 1998-07-21 Aisin Seiki Co Ltd Multistage electronic cooling device
US5993750A (en) * 1997-04-11 1999-11-30 Eastman Kodak Company Integrated ceramic micro-chemical plant
US5921087A (en) * 1997-04-22 1999-07-13 Intel Corporation Method and apparatus for cooling integrated circuits using a thermoelectric module
AU727083B2 (en) * 1997-04-25 2000-11-30 Caliper Life Sciences, Inc. Microfluidic devices incorporating improved channel geometries
US6159353A (en) * 1997-04-30 2000-12-12 Orion Research, Inc. Capillary electrophoretic separation system
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
EP0980446A4 (en) * 1997-05-08 2000-08-23 Nanosystems Inc Silicon etching process for making microchannel plates
US6090251A (en) * 1997-06-06 2000-07-18 Caliper Technologies, Inc. Microfabricated structures for facilitating fluid introduction into microfluidic devices
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6001231A (en) * 1997-07-15 1999-12-14 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
US6034872A (en) * 1997-07-16 2000-03-07 International Business Machines Corporation Cooling computer systems
US6907921B2 (en) * 1998-06-18 2005-06-21 3M Innovative Properties Company Microchanneled active fluid heat exchanger
JP4048579B2 (en) * 1997-08-28 2008-02-20 住友電気工業株式会社 Heat dissipating body including refrigerant flow path and manufacturing method thereof
US5842787A (en) * 1997-10-09 1998-12-01 Caliper Technologies Corporation Microfluidic systems incorporating varied channel dimensions
US5945217A (en) * 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
US6174675B1 (en) * 1997-11-25 2001-01-16 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US6140860A (en) * 1997-12-31 2000-10-31 Intel Corporation Thermal sensing circuit
US6100541A (en) * 1998-02-24 2000-08-08 Caliper Technologies Corporation Microfluidic devices and systems incorporating integrated optical elements
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6129260A (en) * 1998-08-19 2000-10-10 Fravillig Technologies Company Solderable structures
US6119729A (en) * 1998-09-14 2000-09-19 Arise Technologies Corporation Freeze protection apparatus for fluid transport passages
US6146103A (en) * 1998-10-09 2000-11-14 The Regents Of The University Of California Micromachined magnetohydrodynamic actuators and sensors
US6032689A (en) * 1998-10-30 2000-03-07 Industrial Technology Research Institute Integrated flow controller module
US6313992B1 (en) * 1998-12-22 2001-11-06 James J. Hildebrandt Method and apparatus for increasing the power density of integrated circuit boards and their components
US6308429B1 (en) * 1999-04-01 2001-10-30 Linear Measurement Instruments, Corp. Portable seal gap gage system
US6096656A (en) * 1999-06-24 2000-08-01 Sandia Corporation Formation of microchannels from low-temperature plasma-deposited silicon oxynitride
US6131650A (en) * 1999-07-20 2000-10-17 Thermal Corp. Fluid cooled single phase heat sink
US6396706B1 (en) * 1999-07-30 2002-05-28 Credence Systems Corporation Self-heating circuit board
US6693320B1 (en) * 1999-08-30 2004-02-17 Micron Technology, Inc. Capacitor structures with recessed hemispherical grain silicon
US6216343B1 (en) * 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
US6210986B1 (en) * 1999-09-23 2001-04-03 Sandia Corporation Microfluidic channel fabrication method
US6301109B1 (en) * 2000-02-11 2001-10-09 International Business Machines Corporation Isothermal heat sink with cross-flow openings between channels
DE60032113T2 (en) * 2000-02-11 2007-06-28 Stmicroelectronics S.R.L., Agrate Brianza Integrated device for microfluidic temperature control and its manufacturing method
US6253835B1 (en) * 2000-02-11 2001-07-03 International Business Machines Corporation Isothermal heat sink with converging, diverging channels
US6257320B1 (en) * 2000-03-28 2001-07-10 Alec Wargo Heat sink device for power semiconductors
US20020134543A1 (en) * 2001-03-20 2002-09-26 Motorola, Inc Connecting device with local heating element and method for using same

Also Published As

Publication number Publication date
WO2004038302A3 (en) 2004-10-21
US20040076408A1 (en) 2004-04-22
AU2003282532A8 (en) 2004-05-13
WO2004038302A2 (en) 2004-05-06
AU2003282532A1 (en) 2004-05-13
TW200413683A (en) 2004-08-01

Similar Documents

Publication Publication Date Title
TW201513245A (en) Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
CN103367181B (en) For the method and apparatus of bonded substrate
JP6533579B2 (en) Heat transfer device for soldering of electrical components
JPS6054785B2 (en) Method of manufacturing integrated circuit assembly
JP2005500672A (en) Flip-free flip chip interconnect
TWI260718B (en) Apparatus and method for die attachment
JP2005509269A (en) Flip chip interconnect using no-clean flux
CN101150102B (en) Semiconductor device and method for manufacturing the same
TWI301884B (en) Method and apparatus for removeably coupling a heat rejection device with a heat producing device
CN1317753C (en) Method and device for holding chip in package
JPH0357230A (en) Brazing method for semiconductor substrate and support sheet
CN106856180B (en) A method of welding IGBT module
JP3505950B2 (en) Heat sink plate
JP4349552B2 (en) Peltier element thermoelectric conversion module, manufacturing method of Peltier element thermoelectric conversion module, and optical communication module
TWI451508B (en) Pre-heating system and method for silicon dies
WO2007105510A1 (en) Thermoelectric module and process for producing the same
WO2003059028A2 (en) Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby
JP3480570B2 (en) Semiconductor chip, method of removing the same, and semiconductor device
US5651495A (en) Thermoelectric cooler assisted soldering
JP2022502837A (en) Bulk type thermoelectric element manufacturing method
JP5259116B2 (en) Die bonder
EP1256409A2 (en) Method and systen for rapid heat-sink soldering
TW200531250A (en) A method of making a microelectronic assembly
JP4023388B2 (en) Manufacturing method of semiconductor device
JPH06275748A (en) Joining member

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent