WO2004038302A3 - Method and apparatus for removeably coupling a heat rejection device with a heat producing device - Google Patents

Method and apparatus for removeably coupling a heat rejection device with a heat producing device Download PDF

Info

Publication number
WO2004038302A3
WO2004038302A3 PCT/US2003/032021 US0332021W WO2004038302A3 WO 2004038302 A3 WO2004038302 A3 WO 2004038302A3 US 0332021 W US0332021 W US 0332021W WO 2004038302 A3 WO2004038302 A3 WO 2004038302A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heating element
producing device
thermal interface
interface material
Prior art date
Application number
PCT/US2003/032021
Other languages
French (fr)
Other versions
WO2004038302A2 (en
Inventor
Thomas William Kenny Jr
Kenneth Goodson
Original Assignee
Cooligy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc filed Critical Cooligy Inc
Priority to AU2003282532A priority Critical patent/AU2003282532A1/en
Publication of WO2004038302A2 publication Critical patent/WO2004038302A2/en
Publication of WO2004038302A3 publication Critical patent/WO2004038302A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A method and apparatus for removeably coupling a heat rejecting device with a heat producing device, wherein a thermal interface material having a predetermined phase change temperature is between the heat rejecting device and the heat producing device, the method comprising: configuring the heat rejecting device to include at least one heating element; and energizing the at least one heating element of a predetermined amount of time through at least one electrical contact, wherein a current applied to the at least one heating element heats the at least one heating element until the thermal interface material substantially reaches the predetermined phase change temperature. The at least one heating element is located on an interface surface in contact with the thermal interface material, although alternatively on an opposite surface, or within the apparatus.
PCT/US2003/032021 2002-10-22 2003-10-07 Method and apparatus for removeably coupling a heat rejection device with a heat producing device WO2004038302A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003282532A AU2003282532A1 (en) 2002-10-22 2003-10-07 Method and apparatus for removeably coupling a heat rejection device with a heat producing device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US42055702P 2002-10-22 2002-10-22
US60/420,557 2002-10-22
US10/366,122 2003-02-12
US10/366,122 US20040076408A1 (en) 2002-10-22 2003-02-12 Method and apparatus for removeably coupling a heat rejection device with a heat producing device

Publications (2)

Publication Number Publication Date
WO2004038302A2 WO2004038302A2 (en) 2004-05-06
WO2004038302A3 true WO2004038302A3 (en) 2004-10-21

Family

ID=32095792

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/032021 WO2004038302A2 (en) 2002-10-22 2003-10-07 Method and apparatus for removeably coupling a heat rejection device with a heat producing device

Country Status (4)

Country Link
US (1) US20040076408A1 (en)
AU (1) AU2003282532A1 (en)
TW (1) TWI301884B (en)
WO (1) WO2004038302A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8833435B2 (en) * 2008-08-05 2014-09-16 Pipeline Micro, Inc. Microscale cooling apparatus and method
US10043730B2 (en) * 2015-09-28 2018-08-07 Xilinx, Inc. Stacked silicon package assembly having an enhanced lid
CN113130727B (en) * 2019-12-31 2022-10-11 Tcl科技集团股份有限公司 LED chip mounting and pasting method
US11373929B1 (en) 2020-02-03 2022-06-28 Xilinx, Inc. Thermal heat spreader plate for electronic device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6308429B1 (en) * 1999-04-01 2001-10-30 Linear Measurement Instruments, Corp. Portable seal gap gage system
US6396706B1 (en) * 1999-07-30 2002-05-28 Credence Systems Corporation Self-heating circuit board
US20020134543A1 (en) * 2001-03-20 2002-09-26 Motorola, Inc Connecting device with local heating element and method for using same

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2273505A (en) * 1942-02-17 Container
US596062A (en) * 1897-12-28 Device for preventing bursting of freezing pipes
US2039593A (en) * 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US3771219A (en) * 1970-02-05 1973-11-13 Sharp Kk Method for manufacturing semiconductor device
DE2102254B2 (en) * 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS
FR2216537B1 (en) * 1973-02-06 1975-03-07 Gaz De France
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
DE2658720C3 (en) * 1976-12-24 1982-01-28 Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5300 Bonn Latent heat storage for holding a heat-storing medium
US4574876A (en) * 1981-05-11 1986-03-11 Extracorporeal Medical Specialties, Inc. Container with tapered walls for heating or cooling fluids
US4485429A (en) * 1982-06-09 1984-11-27 Sperry Corporation Apparatus for cooling integrated circuit chips
US4467861A (en) * 1982-10-04 1984-08-28 Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr Heat-transporting device
GB8323065D0 (en) * 1983-08-26 1983-09-28 Rca Corp Flux free photo-detector soldering
JPH0673364B2 (en) * 1983-10-28 1994-09-14 株式会社日立製作所 Integrated circuit chip cooler
US4893174A (en) * 1985-07-08 1990-01-09 Hitachi, Ltd. High density integration of semiconductor circuit
US5126919A (en) * 1985-10-04 1992-06-30 Fujitsu Limited Cooling system for an electronic circuit device
US4903761A (en) * 1987-06-03 1990-02-27 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
US4896719A (en) * 1988-05-11 1990-01-30 Mcdonnell Douglas Corporation Isothermal panel and plenum
US4866570A (en) * 1988-08-05 1989-09-12 Ncr Corporation Apparatus and method for cooling an electronic device
US5009760A (en) * 1989-07-28 1991-04-23 Board Of Trustees Of The Leland Stanford Junior University System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
US5179500A (en) * 1990-02-27 1993-01-12 Grumman Aerospace Corporation Vapor chamber cooled electronic circuit card
US5858188A (en) * 1990-02-28 1999-01-12 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US6176962B1 (en) * 1990-02-28 2001-01-23 Aclara Biosciences, Inc. Methods for fabricating enclosed microchannel structures
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5043797A (en) * 1990-04-03 1991-08-27 General Electric Company Cooling header connection for a thyristor stack
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
JPH07114250B2 (en) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション Heat transfer system
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5161089A (en) * 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
US5228502A (en) * 1991-09-04 1993-07-20 International Business Machines Corporation Cooling by use of multiple parallel convective surfaces
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
JPH05217121A (en) * 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> Method and apparatus for coupling of thermo- sensitive element such as chip provided with magnetic converter, etc.
US5239443A (en) * 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5308429A (en) * 1992-09-29 1994-05-03 Digital Equipment Corporation System for bonding a heatsink to a semiconductor chip package
DE4240082C1 (en) * 1992-11-28 1994-04-21 Erno Raumfahrttechnik Gmbh Heat pipe
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5269372A (en) * 1992-12-21 1993-12-14 International Business Machines Corporation Intersecting flow network for a cold plate cooling system
JP3477781B2 (en) * 1993-03-23 2003-12-10 セイコーエプソン株式会社 IC card
US5459352A (en) * 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
US5380956A (en) * 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5544696A (en) * 1994-07-01 1996-08-13 The United States Of America As Represented By The Secretary Of The Air Force Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
US6126723A (en) * 1994-07-29 2000-10-03 Battelle Memorial Institute Microcomponent assembly for efficient contacting of fluid
US5585069A (en) * 1994-11-10 1996-12-17 David Sarnoff Research Center, Inc. Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis
DE19514548C1 (en) * 1995-04-20 1996-10-02 Daimler Benz Ag Method of manufacturing a micro cooler
US5548605A (en) * 1995-05-15 1996-08-20 The Regents Of The University Of California Monolithic microchannel heatsink
US5705018A (en) * 1995-12-13 1998-01-06 Hartley; Frank T. Micromachined peristaltic pump
JP3029792B2 (en) * 1995-12-28 2000-04-04 日本サーボ株式会社 Multi-phase permanent magnet type rotating electric machine
US6039114A (en) * 1996-01-04 2000-03-21 Daimler - Benz Aktiengesellschaft Cooling body having lugs
CN1072060C (en) * 1996-02-13 2001-10-03 瑞典通用电器勃朗勃威力公司 Device for casting in a mould
US5768104A (en) * 1996-02-22 1998-06-16 Cray Research, Inc. Cooling approach for high power integrated circuits mounted on printed circuit boards
US5675473A (en) * 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5740013A (en) * 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
US5800690A (en) * 1996-07-03 1998-09-01 Caliper Technologies Corporation Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forces
US5801442A (en) * 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
US5763951A (en) * 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US5835345A (en) * 1996-10-02 1998-11-10 Sdl, Inc. Cooler for removing heat from a heated region
DE19643717A1 (en) * 1996-10-23 1998-04-30 Asea Brown Boveri Liquid cooling device for a high-performance semiconductor module
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US5964092A (en) * 1996-12-13 1999-10-12 Nippon Sigmax, Co., Ltd. Electronic cooling apparatus
JPH10190071A (en) * 1996-12-20 1998-07-21 Aisin Seiki Co Ltd Multistage electronic cooling device
US5993750A (en) * 1997-04-11 1999-11-30 Eastman Kodak Company Integrated ceramic micro-chemical plant
US5921087A (en) * 1997-04-22 1999-07-13 Intel Corporation Method and apparatus for cooling integrated circuits using a thermoelectric module
WO1998049548A1 (en) * 1997-04-25 1998-11-05 Caliper Technologies Corporation Microfluidic devices incorporating improved channel geometries
WO1998049549A1 (en) * 1997-04-30 1998-11-05 Orion Research, Inc. Capillary electrophoretic separation system
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
EP0980446A4 (en) * 1997-05-08 2000-08-23 Nanosystems Inc Silicon etching process for making microchannel plates
US6090251A (en) * 1997-06-06 2000-07-18 Caliper Technologies, Inc. Microfabricated structures for facilitating fluid introduction into microfluidic devices
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6001231A (en) * 1997-07-15 1999-12-14 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
US6034872A (en) * 1997-07-16 2000-03-07 International Business Machines Corporation Cooling computer systems
US6907921B2 (en) * 1998-06-18 2005-06-21 3M Innovative Properties Company Microchanneled active fluid heat exchanger
JP4048579B2 (en) * 1997-08-28 2008-02-20 住友電気工業株式会社 Heat dissipating body including refrigerant flow path and manufacturing method thereof
US5842787A (en) * 1997-10-09 1998-12-01 Caliper Technologies Corporation Microfluidic systems incorporating varied channel dimensions
US5945217A (en) * 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
US6174675B1 (en) * 1997-11-25 2001-01-16 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US6140860A (en) * 1997-12-31 2000-10-31 Intel Corporation Thermal sensing circuit
US6100541A (en) * 1998-02-24 2000-08-08 Caliper Technologies Corporation Microfluidic devices and systems incorporating integrated optical elements
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6129260A (en) * 1998-08-19 2000-10-10 Fravillig Technologies Company Solderable structures
US6119729A (en) * 1998-09-14 2000-09-19 Arise Technologies Corporation Freeze protection apparatus for fluid transport passages
US6146103A (en) * 1998-10-09 2000-11-14 The Regents Of The University Of California Micromachined magnetohydrodynamic actuators and sensors
US6032689A (en) * 1998-10-30 2000-03-07 Industrial Technology Research Institute Integrated flow controller module
US6313992B1 (en) * 1998-12-22 2001-11-06 James J. Hildebrandt Method and apparatus for increasing the power density of integrated circuit boards and their components
US6096656A (en) * 1999-06-24 2000-08-01 Sandia Corporation Formation of microchannels from low-temperature plasma-deposited silicon oxynitride
US6131650A (en) * 1999-07-20 2000-10-17 Thermal Corp. Fluid cooled single phase heat sink
US6693320B1 (en) * 1999-08-30 2004-02-17 Micron Technology, Inc. Capacitor structures with recessed hemispherical grain silicon
US6216343B1 (en) * 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
US6210986B1 (en) * 1999-09-23 2001-04-03 Sandia Corporation Microfluidic channel fabrication method
US6301109B1 (en) * 2000-02-11 2001-10-09 International Business Machines Corporation Isothermal heat sink with cross-flow openings between channels
US6253835B1 (en) * 2000-02-11 2001-07-03 International Business Machines Corporation Isothermal heat sink with converging, diverging channels
EP1123739B1 (en) * 2000-02-11 2006-11-29 STMicroelectronics S.r.l. Integrated device for microfluid thermoregulation, and manufacturing process thereof
US6257320B1 (en) * 2000-03-28 2001-07-10 Alec Wargo Heat sink device for power semiconductors

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6308429B1 (en) * 1999-04-01 2001-10-30 Linear Measurement Instruments, Corp. Portable seal gap gage system
US6396706B1 (en) * 1999-07-30 2002-05-28 Credence Systems Corporation Self-heating circuit board
US20020134543A1 (en) * 2001-03-20 2002-09-26 Motorola, Inc Connecting device with local heating element and method for using same

Also Published As

Publication number Publication date
AU2003282532A1 (en) 2004-05-13
AU2003282532A8 (en) 2004-05-13
TW200413683A (en) 2004-08-01
US20040076408A1 (en) 2004-04-22
TWI301884B (en) 2008-10-11
WO2004038302A2 (en) 2004-05-06

Similar Documents

Publication Publication Date Title
PL361744A1 (en) Surface heating device, method for producing the same and heatable object
WO2001018604A3 (en) Method and apparatus for thermal processing a photosensitive element
WO2003052776A3 (en) Method for the production of an electrically conductive resistive layer and heating and/or cooling device
CA2348098A1 (en) Water heater with electronic control
DE19880398T1 (en) Substrate temperature measuring device, substrate temperature measuring method, substrate heating method and heat treatment device
WO2004032187A3 (en) Multi-zone resitive heater
AU2002223167A1 (en) Device and method for the controlled heating in micro channel systems
WO2006025929A3 (en) Thermal device, system, and method, for fluid processing device
WO2002012972A3 (en) Direct temperature control for a component of a substrate processing chamber
WO2006012021A3 (en) Methods and apparatus for optimal temperature control in a plasma processing system
WO2001097570A3 (en) Induction driven power supply for circuits accompanying portable heated items
WO2004050159A3 (en) Method for forming catheter curves
WO2007008734A8 (en) A plate-type heater and a method for the manufacture thereof
CA2451036A1 (en) Method and apparatus for temperature control of an object
WO2004064182A3 (en) Fuel cell stack with passive end cell heater
WO2006023979A3 (en) Water heater and method of providing the same
EP1464933A3 (en) Apparatus for infrared radiation detection
DE60021850D1 (en) CERAMIC HEATING ELEMENT
WO2004057260A3 (en) Heat exchange technique
WO2004038302A3 (en) Method and apparatus for removeably coupling a heat rejection device with a heat producing device
GB9709167D0 (en) Metal bonding
WO2002009162A3 (en) Heated substrate support assembly and method
WO2004102534A3 (en) Method and apparatus for heating a disk drive
WO2003065768A8 (en) High-frequency heating apparatus
DE60307761D1 (en) Device for heating flowable materials during injection molding

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP