AU2003282532A1 - Method and apparatus for removeably coupling a heat rejection device with a heat producing device - Google Patents

Method and apparatus for removeably coupling a heat rejection device with a heat producing device

Info

Publication number
AU2003282532A1
AU2003282532A1 AU2003282532A AU2003282532A AU2003282532A1 AU 2003282532 A1 AU2003282532 A1 AU 2003282532A1 AU 2003282532 A AU2003282532 A AU 2003282532A AU 2003282532 A AU2003282532 A AU 2003282532A AU 2003282532 A1 AU2003282532 A1 AU 2003282532A1
Authority
AU
Australia
Prior art keywords
heat
removeably coupling
producing device
heat rejection
heat producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003282532A
Other versions
AU2003282532A8 (en
Inventor
Kenneth Goodson
Thomas William Kenny Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cooligy Inc
Original Assignee
Cooligy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc filed Critical Cooligy Inc
Publication of AU2003282532A8 publication Critical patent/AU2003282532A8/en
Publication of AU2003282532A1 publication Critical patent/AU2003282532A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
AU2003282532A 2002-10-22 2003-10-07 Method and apparatus for removeably coupling a heat rejection device with a heat producing device Abandoned AU2003282532A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US42055702P 2002-10-22 2002-10-22
US60/420,557 2002-10-22
US10/366,122 2003-02-12
US10/366,122 US20040076408A1 (en) 2002-10-22 2003-02-12 Method and apparatus for removeably coupling a heat rejection device with a heat producing device
PCT/US2003/032021 WO2004038302A2 (en) 2002-10-22 2003-10-07 Method and apparatus for removeably coupling a heat rejection device with a heat producing device

Publications (2)

Publication Number Publication Date
AU2003282532A8 AU2003282532A8 (en) 2004-05-13
AU2003282532A1 true AU2003282532A1 (en) 2004-05-13

Family

ID=32095792

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003282532A Abandoned AU2003282532A1 (en) 2002-10-22 2003-10-07 Method and apparatus for removeably coupling a heat rejection device with a heat producing device

Country Status (4)

Country Link
US (1) US20040076408A1 (en)
AU (1) AU2003282532A1 (en)
TW (1) TWI301884B (en)
WO (1) WO2004038302A2 (en)

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US8833435B2 (en) * 2008-08-05 2014-09-16 Pipeline Micro, Inc. Microscale cooling apparatus and method
US10043730B2 (en) * 2015-09-28 2018-08-07 Xilinx, Inc. Stacked silicon package assembly having an enhanced lid
CN113130727B (en) * 2019-12-31 2022-10-11 Tcl科技集团股份有限公司 LED chip mounting and pasting method
US11373929B1 (en) 2020-02-03 2022-06-28 Xilinx, Inc. Thermal heat spreader plate for electronic device

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Also Published As

Publication number Publication date
US20040076408A1 (en) 2004-04-22
AU2003282532A8 (en) 2004-05-13
TW200413683A (en) 2004-08-01
TWI301884B (en) 2008-10-11
WO2004038302A3 (en) 2004-10-21
WO2004038302A2 (en) 2004-05-06

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase