TWI299545B - Dicing die adhesive film for semiconductor - Google Patents

Dicing die adhesive film for semiconductor Download PDF

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Publication number
TWI299545B
TWI299545B TW095119632A TW95119632A TWI299545B TW I299545 B TWI299545 B TW I299545B TW 095119632 A TW095119632 A TW 095119632A TW 95119632 A TW95119632 A TW 95119632A TW I299545 B TWI299545 B TW I299545B
Authority
TW
Taiwan
Prior art keywords
adhesive layer
film
adhesive
layer
semiconductor
Prior art date
Application number
TW095119632A
Other languages
English (en)
Chinese (zh)
Other versions
TW200705603A (en
Inventor
Kyung-Tae Wi
Byoung-Un Kang
Tae-Hyun Sung
Joon-Mo Seo
Dong-Cheon Shin
Jai-Hoon Kim
Original Assignee
Ls Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ls Cable Ltd filed Critical Ls Cable Ltd
Publication of TW200705603A publication Critical patent/TW200705603A/zh
Application granted granted Critical
Publication of TWI299545B publication Critical patent/TWI299545B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW095119632A 2005-06-03 2006-06-02 Dicing die adhesive film for semiconductor TWI299545B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20050047941 2005-06-03
KR1020060046646A KR100765621B1 (ko) 2005-06-03 2006-05-24 반도체용 다이싱 다이 접착필름

Publications (2)

Publication Number Publication Date
TW200705603A TW200705603A (en) 2007-02-01
TWI299545B true TWI299545B (en) 2008-08-01

Family

ID=37730316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119632A TWI299545B (en) 2005-06-03 2006-06-02 Dicing die adhesive film for semiconductor

Country Status (2)

Country Link
KR (1) KR100765621B1 (ko)
TW (1) TWI299545B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100867183B1 (ko) * 2006-12-05 2008-11-06 주식회사 엘지화학 다이싱·다이 본딩용 접착 필름, 이를 사용한 반도체 장치및 그의 제조 방법
KR100917018B1 (ko) * 2007-05-03 2009-09-10 엘에스엠트론 주식회사 이방 도전성 접착필름의 제조방법
KR100864555B1 (ko) * 2007-05-04 2008-10-20 엘에스엠트론 주식회사 다이 접착 필름
KR100882060B1 (ko) 2007-05-14 2009-02-10 엘에스엠트론 주식회사 다이싱 다이 접착 필름
KR100915707B1 (ko) * 2007-06-08 2009-09-04 엘에스엠트론 주식회사 다이싱 다이 접착 필름
KR101047923B1 (ko) * 2007-12-27 2011-07-08 주식회사 엘지화학 버 특성 및 신뢰성이 우수한 다이싱 다이 본딩 필름 및반도체 장치
KR101045262B1 (ko) * 2009-12-21 2011-06-29 제일모직주식회사 스텔스 다이싱용 반도체용 접착 조성물 및 이를 이용한 접착 필름
JP4976531B2 (ja) * 2010-09-06 2012-07-18 日東電工株式会社 半導体装置用フィルム
KR101722137B1 (ko) 2014-01-03 2017-03-31 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
JP2018178002A (ja) * 2017-04-17 2018-11-15 日東電工株式会社 ダイシングダイボンドフィルム
CN107481965B (zh) * 2017-09-06 2023-12-29 武汉市三选科技有限公司 晶圆切割保护膜结构及其制造方法与使用其之切割晶圆
CN117276199A (zh) * 2023-11-20 2023-12-22 佛山市蓝箭电子股份有限公司 一种晶片的切割加工方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4508345B2 (ja) 2000-03-07 2010-07-21 スリーエム イノベイティブ プロパティズ カンパニー 複合基材及び粘着フィルム
JP2003007646A (ja) 2001-06-18 2003-01-10 Nitto Denko Corp ダイシング用粘着シートおよび切断片の製造方法
JP2004095844A (ja) 2002-08-30 2004-03-25 Lintec Corp ウエハダイシング・接着用シートおよび半導体装置の製造方法

Also Published As

Publication number Publication date
TW200705603A (en) 2007-02-01
KR20060126364A (ko) 2006-12-07
KR100765621B1 (ko) 2007-10-09

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MM4A Annulment or lapse of patent due to non-payment of fees