TWI298658B - - Google Patents

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Publication number
TWI298658B
TWI298658B TW95129450A TW95129450A TWI298658B TW I298658 B TWI298658 B TW I298658B TW 95129450 A TW95129450 A TW 95129450A TW 95129450 A TW95129450 A TW 95129450A TW I298658 B TWI298658 B TW I298658B
Authority
TW
Taiwan
Prior art keywords
copper
copper portion
active
bonding
filler
Prior art date
Application number
TW95129450A
Other languages
English (en)
Chinese (zh)
Other versions
TW200808477A (en
Inventor
Shr-Ying Jang
Li-Jang Liou
Original Assignee
Univ Nat Yunlin Sci & Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Yunlin Sci & Tech filed Critical Univ Nat Yunlin Sci & Tech
Priority to TW95129450A priority Critical patent/TW200808477A/zh
Publication of TW200808477A publication Critical patent/TW200808477A/zh
Application granted granted Critical
Publication of TWI298658B publication Critical patent/TWI298658B/zh

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  • Pressure Welding/Diffusion-Bonding (AREA)
TW95129450A 2006-08-10 2006-08-10 Joined article with active solder filling and its joining method TW200808477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95129450A TW200808477A (en) 2006-08-10 2006-08-10 Joined article with active solder filling and its joining method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95129450A TW200808477A (en) 2006-08-10 2006-08-10 Joined article with active solder filling and its joining method

Publications (2)

Publication Number Publication Date
TW200808477A TW200808477A (en) 2008-02-16
TWI298658B true TWI298658B (ko) 2008-07-11

Family

ID=44766918

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95129450A TW200808477A (en) 2006-08-10 2006-08-10 Joined article with active solder filling and its joining method

Country Status (1)

Country Link
TW (1) TW200808477A (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI446982B (zh) * 2011-12-20 2014-08-01 Ind Tech Res Inst 熱電模組之固液擴散接合結構及其製造方法
TWI465308B (zh) * 2011-09-22 2014-12-21 Univ Nat Yunlin Sci & Tech Aluminum alloy welding method
TWI511827B (zh) * 2011-05-27 2015-12-11 Univ Nat Yunlin Sci & Tech Active soft solder filler composition
TWI829986B (zh) * 2020-12-28 2024-01-21 財團法人工業技術研究院 積層體及積層體的製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477594B (zh) * 2011-09-22 2015-03-21 Univ Nat Yunlin Sci & Tech Composites with high thermal conductivity
CN110026633B (zh) * 2019-04-04 2021-07-16 河北躬责科技有限公司 一种微通道散热器和焊接方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511827B (zh) * 2011-05-27 2015-12-11 Univ Nat Yunlin Sci & Tech Active soft solder filler composition
TWI465308B (zh) * 2011-09-22 2014-12-21 Univ Nat Yunlin Sci & Tech Aluminum alloy welding method
TWI446982B (zh) * 2011-12-20 2014-08-01 Ind Tech Res Inst 熱電模組之固液擴散接合結構及其製造方法
TWI829986B (zh) * 2020-12-28 2024-01-21 財團法人工業技術研究院 積層體及積層體的製造方法

Also Published As

Publication number Publication date
TW200808477A (en) 2008-02-16

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