TWI298551B - - Google Patents

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Publication number
TWI298551B
TWI298551B TW095103280A TW95103280A TWI298551B TW I298551 B TWI298551 B TW I298551B TW 095103280 A TW095103280 A TW 095103280A TW 95103280 A TW95103280 A TW 95103280A TW I298551 B TWI298551 B TW I298551B
Authority
TW
Taiwan
Prior art keywords
light
power supply
layer
substrate
transmitting
Prior art date
Application number
TW095103280A
Other languages
English (en)
Chinese (zh)
Other versions
TW200729540A (en
Inventor
San-Bao Lin
Original Assignee
Asda Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asda Technology Co Ltd filed Critical Asda Technology Co Ltd
Priority to TW095103280A priority Critical patent/TW200729540A/zh
Priority to US11/653,315 priority patent/US20070176186A1/en
Publication of TW200729540A publication Critical patent/TW200729540A/zh
Application granted granted Critical
Publication of TWI298551B publication Critical patent/TWI298551B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/06102—Disposition the bonding areas being at different heights
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H01L2224/1701—Structure
    • H01L2224/1703—Bump connectors having different sizes, e.g. different diameters, heights or widths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
TW095103280A 2006-01-27 2006-01-27 Improvement of brightness for light-emitting device TW200729540A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095103280A TW200729540A (en) 2006-01-27 2006-01-27 Improvement of brightness for light-emitting device
US11/653,315 US20070176186A1 (en) 2006-01-27 2007-01-16 Light emitting device for enhancing brightness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095103280A TW200729540A (en) 2006-01-27 2006-01-27 Improvement of brightness for light-emitting device

Publications (2)

Publication Number Publication Date
TW200729540A TW200729540A (en) 2007-08-01
TWI298551B true TWI298551B (cg-RX-API-DMAC7.html) 2008-07-01

Family

ID=38321179

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103280A TW200729540A (en) 2006-01-27 2006-01-27 Improvement of brightness for light-emitting device

Country Status (2)

Country Link
US (1) US20070176186A1 (cg-RX-API-DMAC7.html)
TW (1) TW200729540A (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009048704A2 (en) * 2007-10-08 2009-04-16 3M Innovative Properties Company Light emitting diode with bonded semiconductor wavelength converter
WO2011107928A1 (en) * 2010-03-02 2011-09-09 Koninklijke Philips Electronics N.V. Led with transparent package
TW201320253A (zh) * 2011-11-01 2013-05-16 Walsin Lihwa Corp 封裝結構及其製造方法
WO2014011419A1 (en) * 2012-07-10 2014-01-16 Toshiba Techno Center, Inc. Submount for led device package
US8960969B2 (en) * 2012-09-28 2015-02-24 Lsi Corporation Semiconductor structure with waveguide
JP6201480B2 (ja) * 2013-07-23 2017-09-27 日亜化学工業株式会社 発光装置及び照明装置
EP3975272A1 (en) * 2014-05-29 2022-03-30 Suzhou Lekin Semiconductor Co., Ltd. Light emitting device package
KR102209035B1 (ko) * 2014-08-22 2021-01-28 엘지이노텍 주식회사 발광소자 패키지
JP6537259B2 (ja) * 2014-12-05 2019-07-03 シチズン電子株式会社 発光装置

Also Published As

Publication number Publication date
TW200729540A (en) 2007-08-01
US20070176186A1 (en) 2007-08-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees