TWI298529B - - Google Patents

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Publication number
TWI298529B
TWI298529B TW95113848A TW95113848A TWI298529B TW I298529 B TWI298529 B TW I298529B TW 95113848 A TW95113848 A TW 95113848A TW 95113848 A TW95113848 A TW 95113848A TW I298529 B TWI298529 B TW I298529B
Authority
TW
Taiwan
Application number
TW95113848A
Other languages
Chinese (zh)
Other versions
TW200742111A (en
Inventor
Bily Wang
Jonnie Chuang
Wen-Kui Wu
Original Assignee
Harvatek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harvatek Corp filed Critical Harvatek Corp
Priority to TW095113848A priority Critical patent/TW200742111A/zh
Priority to JP2007109138A priority patent/JP2007288200A/ja
Priority to KR1020070037879A priority patent/KR100868158B1/ko
Publication of TW200742111A publication Critical patent/TW200742111A/zh
Application granted granted Critical
Publication of TWI298529B publication Critical patent/TWI298529B/zh

Links

TW095113848A 2006-04-18 2006-04-18 LED chip encapsulation structure and method TW200742111A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW095113848A TW200742111A (en) 2006-04-18 2006-04-18 LED chip encapsulation structure and method
JP2007109138A JP2007288200A (ja) 2006-04-18 2007-04-18 発光ダイオードチップの封止構造および発光ダイオードチップ構造のパッケージ方法
KR1020070037879A KR100868158B1 (ko) 2006-04-18 2007-04-18 발광 다이오드 칩의 밀봉 구조 및 그 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095113848A TW200742111A (en) 2006-04-18 2006-04-18 LED chip encapsulation structure and method

Publications (2)

Publication Number Publication Date
TW200742111A TW200742111A (en) 2007-11-01
TWI298529B true TWI298529B (ko) 2008-07-01

Family

ID=38759611

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113848A TW200742111A (en) 2006-04-18 2006-04-18 LED chip encapsulation structure and method

Country Status (3)

Country Link
JP (1) JP2007288200A (ko)
KR (1) KR100868158B1 (ko)
TW (1) TW200742111A (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5390516B2 (ja) * 2008-05-19 2014-01-15 株式会社東芝 線状白色光源ならびにそれを用いたバックライトおよび液晶表示装置
TWI422059B (zh) * 2008-05-23 2014-01-01 Pegatron Corp 發光二極體晶片的封裝結構
TWI411143B (en) 2009-06-26 2013-10-01 Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
WO2012144126A1 (ja) 2011-04-20 2012-10-26 パナソニック株式会社 発光装置、バックライトユニット、液晶表示装置及び照明装置
WO2013153739A1 (ja) * 2012-04-11 2013-10-17 パナソニック株式会社 発光装置及びランプ
JP5991065B2 (ja) 2012-07-31 2016-09-14 日亜化学工業株式会社 発光装置
KR102428681B1 (ko) * 2015-08-13 2022-08-04 주성엔지니어링(주) 조명 장치
JP2016189488A (ja) * 2016-07-07 2016-11-04 日亜化学工業株式会社 発光装置
CN114857511B (zh) 2022-04-11 2024-02-20 厦门普为光电科技有限公司 发光二极管

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6062168A (ja) 1983-09-14 1985-04-10 Toshiba Corp 固体発光表示装置
JP2000261039A (ja) * 1999-03-12 2000-09-22 Mitsubishi Electric Corp 光源装置
KR100419611B1 (ko) * 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
JP2002358035A (ja) * 2001-06-04 2002-12-13 Nichia Chem Ind Ltd Ｌｅｄ照明装置
CN100380685C (zh) * 2002-06-21 2008-04-09 中田仗祐 光电或发光用器件及其制造方法
JP5138145B2 (ja) * 2002-11-12 2013-02-06 日亜化学工業株式会社 蛍光体積層構造及びそれを用いる光源
KR100576865B1 (ko) * 2004-05-03 2006-05-10 삼성전기주식회사 백라이트용 발광 다이오드 어레이 모듈 및 이를 구비한백라이트 유닛

Also Published As

Publication number Publication date
JP2007288200A (ja) 2007-11-01
KR100868158B1 (ko) 2008-11-12
KR20070103319A (ko) 2007-10-23
TW200742111A (en) 2007-11-01

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