TWI296438B - - Google Patents
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- Publication number
- TWI296438B TWI296438B TW95111392A TW95111392A TWI296438B TW I296438 B TWI296438 B TW I296438B TW 95111392 A TW95111392 A TW 95111392A TW 95111392 A TW95111392 A TW 95111392A TW I296438 B TWI296438 B TW I296438B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- forming
- semiconductor package
- ball
- package substrate
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims description 185
- 229910052751 metal Inorganic materials 0.000 claims description 67
- 239000002184 metal Substances 0.000 claims description 67
- 238000000034 method Methods 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- 239000013078 crystal Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 20
- 230000004888 barrier function Effects 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229920001940 conductive polymer Polymers 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 4
- 238000004528 spin coating Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims 3
- 238000004049 embossing Methods 0.000 claims 2
- -1 (Nl) Chemical compound 0.000 claims 1
- 230000009977 dual effect Effects 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- 238000005065 mining Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005234 chemical deposition Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 206010025482 malaise Diseases 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095111392A TW200737478A (en) | 2006-03-31 | 2006-03-31 | Method for forming semiconductor package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095111392A TW200737478A (en) | 2006-03-31 | 2006-03-31 | Method for forming semiconductor package substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200737478A TW200737478A (en) | 2007-10-01 |
| TWI296438B true TWI296438B (enrdf_load_stackoverflow) | 2008-05-01 |
Family
ID=45068766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095111392A TW200737478A (en) | 2006-03-31 | 2006-03-31 | Method for forming semiconductor package substrate |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200737478A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115483116B (zh) * | 2021-06-16 | 2025-03-28 | 先丰通讯股份有限公司 | 封装结构及其制造方法、电路板及其制造方法 |
-
2006
- 2006-03-31 TW TW095111392A patent/TW200737478A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200737478A (en) | 2007-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |