TW200737478A - Method for forming semiconductor package substrate - Google Patents

Method for forming semiconductor package substrate

Info

Publication number
TW200737478A
TW200737478A TW095111392A TW95111392A TW200737478A TW 200737478 A TW200737478 A TW 200737478A TW 095111392 A TW095111392 A TW 095111392A TW 95111392 A TW95111392 A TW 95111392A TW 200737478 A TW200737478 A TW 200737478A
Authority
TW
Taiwan
Prior art keywords
layer
forming
chip placement
circuit board
conductive
Prior art date
Application number
TW095111392A
Other languages
English (en)
Chinese (zh)
Other versions
TWI296438B (enrdf_load_stackoverflow
Inventor
Pao-Hung Chou
Original Assignee
Phoenix Prec Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology filed Critical Phoenix Prec Technology
Priority to TW095111392A priority Critical patent/TW200737478A/zh
Publication of TW200737478A publication Critical patent/TW200737478A/zh
Application granted granted Critical
Publication of TWI296438B publication Critical patent/TWI296438B/zh

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW095111392A 2006-03-31 2006-03-31 Method for forming semiconductor package substrate TW200737478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095111392A TW200737478A (en) 2006-03-31 2006-03-31 Method for forming semiconductor package substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095111392A TW200737478A (en) 2006-03-31 2006-03-31 Method for forming semiconductor package substrate

Publications (2)

Publication Number Publication Date
TW200737478A true TW200737478A (en) 2007-10-01
TWI296438B TWI296438B (enrdf_load_stackoverflow) 2008-05-01

Family

ID=45068766

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111392A TW200737478A (en) 2006-03-31 2006-03-31 Method for forming semiconductor package substrate

Country Status (1)

Country Link
TW (1) TW200737478A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115483116A (zh) * 2021-06-16 2022-12-16 先丰通讯股份有限公司 封装结构及其制造方法、电路板及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115483116A (zh) * 2021-06-16 2022-12-16 先丰通讯股份有限公司 封装结构及其制造方法、电路板及其制造方法

Also Published As

Publication number Publication date
TWI296438B (enrdf_load_stackoverflow) 2008-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees