TWI296286B - Method of manufacturing al and al alloy sputtering target - Google Patents

Method of manufacturing al and al alloy sputtering target Download PDF

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Publication number
TWI296286B
TWI296286B TW094145170A TW94145170A TWI296286B TW I296286 B TWI296286 B TW I296286B TW 094145170 A TW094145170 A TW 094145170A TW 94145170 A TW94145170 A TW 94145170A TW I296286 B TWI296286 B TW I296286B
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Taiwan
Prior art keywords
aluminum
soup
additive
sputtering target
manufacturing
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TW094145170A
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English (en)
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TW200724698A (en
Inventor
Shan Torng
Chune Ching Young
Shih Ying Chen
Po Chun Hsu
Chia Hsiang Peng
Fan Chun Tseng
Ren An Luo
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Chung Shan Inst Of Science
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Priority to TW094145170A priority Critical patent/TWI296286B/zh
Priority to US11/411,757 priority patent/US20070137831A1/en
Publication of TW200724698A publication Critical patent/TW200724698A/zh
Priority to US12/071,935 priority patent/US20080190764A1/en
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Publication of TWI296286B publication Critical patent/TWI296286B/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D21/00Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
    • B22D21/002Castings of light metals
    • B22D21/007Castings of light metals with low melting point, e.g. Al 659 degrees C, Mg 650 degrees C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/001Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
    • B22D11/003Aluminium alloys
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Powder Metallurgy (AREA)

Description

!296286 九、發明說明: 【發明所屬之技術領域】 本發明所屬之技術領域為,半導體及光電產業上薄膜賤鑛所 使用铭及齡金練之製造技術,彻直接冷激麟方式製造出 符合半導體及光電產業之鋁及鋁合金輕材。 【先前技術】 紹合金雜具有高反射率及低電醇之特性 製造光碟之反射層、半導體用導線層及顯示元件用電極在 般係以濺鑛製程為主,所謂濺鑛即利用繼 擊把材,絲材表面軒受縣_並_於基材上,_著、吸 附制表面遷移、成核等雜後,在基板上成長軸_之製程。滅 鍍製備之_性質的優劣’除受職賴台 =之姆本身的品質亦扮演重要角色,乾材特性包=^所 影Ϊ密度及析出物大小等,均對濺鑛薄膜之均勻性、品質 將轉法祕末冶金方為之,溶鑄法係 存在縮孔、氣孔、靖造=二 偏析專問4,所传缺均需再施以後續加工改 民國專利117131號所載,乾材胚料溶鎮織如中華 形,並__理產生觸魏或鍛造使其變 W丄m 現象改#禱造_•粗大情形,並促 進較大讀她化及料分佈;或如_專鑛 ^ 所得之鑄錠利用熱鍛及4-6道次等通道镟 ^ A_ar Extrusion,ECAE)方式加工;^ 角擠製(E_ Channel 處理,使原鑄造組織加ji後發生回復二道次之間並輔以退火 並藉由加工_相細化使其均二==== 6 1296286 以下之晶粒’但缺點在於後續加1程繁複耗時,餘玉成本過高。 卬貝 真專利5細所揭示’利用真城麟煉⑽)配合 1VAR)之獅練製程’改善單_)溶煉時因鑄錠内 製:織均-且析:内部晶粒粗大及較深之縮孔等情形,可產 該法鈦、銅等材質之金屬合金姆,但由於 二二二2境下操作’用於18合金乾材產製上^:備相對 且而一道久熔煉方可達成,將使生產時間加長。 法產減銘合金綺上,其加卫程序均較為繁複, 尚未有製知間便且量產性高之製造方式。 【發明内容】 曾的係提供_種錄符合轉體及光電產業需求高品 、’口=乾材之方式。其特點為不需後續燒結、熱壓或鍛造及乳延 加工’亦不需於真空環境下進行溶煉,即戦鑄出鑄造晶粒小 出,細微且_均質之齡錄材。該製程並具有成品率高、量產 性咼等優點。 本個^採狀缺齡錄·造雜係域接冷激麟法 ^rect-Onll Casting),其原理乃將處理過之金屬熔湯平穩而持 續的注^财冷卻之輯模具巾,纽湯通賴具表面與其接觸 時’,經由熱傳導快速帶走熱f,凝固形成表面固態薄殼層,再利 用冷部水柱衝擊⑽紐表舰魏冷卻内部,形仙態鑄鍵,鱗 鍵並隨洗鑄平台等速移動’直至設定之洗鑄長度為止(立式直接冷 激洗ί) ’若f水平式則可連續生產。躲禱過程不需如雙V製程^ 真空桃下操作’熔鑄後之靶材亦不需如舊有熔鑄方式再進行後續 塑性加工’是-種可產制時具有薄表面成份偏析層及微細禱造晶 粒組織銘合金素材之方式,。 1296286 本發明即利用此法,配合適當之熔湯前處理,可產製單一金 屬銘’或添加選自鋼、锰、石夕、鎂、鋅、鈦、銳、錯、飢、鉻、鐵、 鈷、鋰、銀、釔、铪、钽、碳至少一種不同元素所形成之鋁合金濺 鍍用靶材,所得靶材晶粒尺寸在100微米以下,二次析出相尺寸在 50微米以下’可適用於半導體產業及光電產業所需之高品質鋁合金 革巴材量產。 【實施方式】 有關本發明之具體實施方式,兹以銘鈦合金把材及I呂石夕鎂合金乾 材利用立式直接冷激澆鑄方式製備為例,說明如下。 【實施例一】 將高純度之純鋁錠加入容量500kg級石墨坩堝,利用電熱絲加 熱坩堝方式使鋁錠完全熔融為熔湯後,再加入高純度純鎂錠及鋁矽 母合金,並將鋁湯溫度昇溫至液相線溫度以上,俟原料熔解後進行 鋁湯除渣、除氣及靜置,再將鋁湯傾注入流槽系統,鋁湯流經流槽 時經線上除氣,及多孔陶瓷過濾板過濾後以降低鋁湯内氫氣及非金 屬夾雜物含量,並於液相線溫度以上進行洗鑄,此處洗鑄係使用4 模穴之4Π直接冷激澆鑄模具,澆鑄完成後可得長3米、直徑4,,鋁鈦 合金棒材4枝,經切除料頭料尾各1〇cm(約4”)後即可製成 品率達90%以上。 取 圖1、圖2為所得把材之橫向截面金相組織,由圖中可見該乾材禱 造後主要為晶胞狀鑄造組織,其晶粒尺寸小於1〇〇微米,且内部未 見其它析出相存在。 α 【實施例二】 將高純度之純鋁錠加入容量500kg級石墨坩堝,利用電熱絲加 熱,堝方式使鋁錠完全熔融為熔湯後,再加入高純度純鈦片了並將 叙湯溫度昇溫至M-Ti平衡圖之液相線溫度以上使加入鈦片完全熔 1296286 解,期間通入隋性氣體可避免高溫下鋁湯液面劇烈氧化,俟原料熔 解後進行鋁湯除渣、除氣及靜置,再將鋁湯傾注入流槽系統,鋁湯 流經流槽時經線上除氣,及多孔陶瓷過濾板過濾後以降低鋁湯内氫 氣及非金屬夾雜物含量,並於Ai—Ti平衡圖之液相線溫度以上進行 澆鑄,此處澆鑄係使用4模穴之4”直接冷激澆鑄模具,洗鑄完成後 可得長3米、直徑4Π鋁鈦合金棒材4枝,經切除料頭料尾各i〇cm(約 4Π)後即可製成靶材,成品率達9〇%以上。
圖3、圖4為所得無材之橫向截面金相組織,由圖中可見該乾材鑄 造後主要為等軸晶胞狀鑄造組織,其晶粒尺寸小於1〇〇微米,内部 僅見少量A13Ti析出相,且析出物尺寸多在5〇微米以下。 由實施例一、二顯示本發明之直接冷激澆鑄法所得之靶材在不需 ,續鍛造加工情形下,即可產製晶粒與析出相細小之減成品,其 曰曰粒尺寸小於1〇〇微米、析出物尺寸小於微米。 雖然本,明之較佳實施例揭露如上述,但其並制以限定本發 任何熟習相關技藝者,在不脫離本發明之精神和範圍内,當^ 更動麵飾,财脫本案之專細,因此本發明之專 利保遵粑圍需林_書所載之申料職_界定者為準。 【圖式簡單說明】 直接冷㈣鑄法所得之財鎂合錄材橫向截面金 Γ目L為I直接冷激洗鑄法所得之㈣鎮合金_橫向截面金 =為l直接冷㈣鑄法所得之贼合錄材橫向截面金相 9 1296286 圖4為經直接冷激澆鑄法所得之鋁鈦合金靶材橫向截面金相 組織 【主要元件符號說明】

Claims (1)

  1. 雜 氣 l· 丨 ιιίρΆ 1· 一種鋁及鋁合金濺鑛無材之製造方法,其係包括·· 將純鋁錠加熱成熔融狀態的鋁湯; 〃、 或加入至少一添加物至該熔融狀態的鋁湯,該添加物 鐘、石夕、鎂、鋅、鈦、銃、锆、飢、絡、鐵、始、鐘 銓、叙及碳所組成之群組之任一;及 、 S銘一流㈣錢行直接冷激 如申請專^範圍第1項所述之該鋁及鋁合金濺鍍靶材之製造方 ^,其中該或加入至少一添加物至該熔融狀態的鋁湯中k步驟 中’更包括一添加物合金包括該複數個添加物。 如申請專利範圍第1項所述之該鋁及鋁合金濺鍍靶材之製造方 ΐ二其中該或加入至少一添加物至該熔融狀態的鋁湯之步驟後, 更匕括將鋁湯溫度昇溫至鋁—添加物平衡圖之液相線以上之 溫度,使該添加物充份溶解。 ^申請專利範圍第3項所述之該鋁及鋁合金濺鍍靶材之製造方 :’其中該將銘湯溫度昇溫至铭-添加物平衡圖之液相線以上之溫 ^,使該添加物充份溶解之步驟後,更包括一除渣、一除氣及一 靜置之步驟。 =申請專利範圍第1項所述之該鋁及鋁合金濺鍍靶材之製造方 ΐ拉其中將該鋁湯或具有該添加物的該鋁湯注入該流槽系統進行 予^冷激澆鑄,即得到鋁及鋁合金靶材的步驟中更包括一線上除 乳及一使用至少一多孔陶瓷過濾板過濾之步驟。
TW094145170A 2005-12-20 2005-12-20 Method of manufacturing al and al alloy sputtering target TWI296286B (en)

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US11/411,757 US20070137831A1 (en) 2005-12-20 2006-04-27 Method of manufacturing aluminum and aluminum alloy sputtering targets
US12/071,935 US20080190764A1 (en) 2005-12-20 2008-02-28 Method of manufacturing aluminum and aluminum alloy sputtering targets

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TWI467026B (zh) * 2013-06-27 2015-01-01 China Steel Corp 陽極用鋁合金片及其製造方法
TW201500556A (zh) * 2013-06-30 2015-01-01 Teng-Fei Wu 鈦基複合材料及其製造方法
CN104451566A (zh) * 2014-12-17 2015-03-25 重庆大学 一种高纯铝硅靶材的制备方法
JP6432619B2 (ja) * 2017-03-02 2018-12-05 日立金属株式会社 アルミニウム合金導体、該導体を用いた絶縁電線、および該絶縁電線の製造方法
US10760156B2 (en) 2017-10-13 2020-09-01 Honeywell International Inc. Copper manganese sputtering target
CN108097722B (zh) * 2017-12-08 2019-11-05 宁波江丰电子材料股份有限公司 一种Al-Sc合金靶材成型方法
US11035036B2 (en) 2018-02-01 2021-06-15 Honeywell International Inc. Method of forming copper alloy sputtering targets with refined shape and microstructure
CN111455327B (zh) * 2019-08-08 2022-04-12 湖南稀土金属材料研究院 高钪含量铝钪合金靶材及其制备方法
CN111455223B (zh) * 2019-08-08 2021-10-01 湖南稀土金属材料研究院 铝钪合金靶材及其制备方法
CN112548069B (zh) * 2020-11-04 2022-06-03 深圳市众诚达应用材料科技有限公司 铝钪合金靶材的制备方法
CN114481053B (zh) * 2022-01-25 2024-01-19 北京安泰六九新材料科技有限公司 一种镁锌铝镍钒合金靶材及其制造方法
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