TWI295313B - Surface treatment method of wiring board and manufacturing method for electric device - Google Patents

Description

1295313 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a technique for loading electrical parts on a wiring board, and a 1-inch surface treatment technology for the wiring board. [Prior Art] Conventionally, before the semiconductor element is mounted on a wiring board such as a flexible wiring board by an adhesive, surface treatment is required to improve the affinity between the wiring board and the adhesive. The method used for the surface treatment of the white is to arrange the wiring board in the vacuum chamber to form a vacuum atmosphere in the vacuum chamber. In this state, the electric discharge i is generated by glow discharge, and the surface is processed by the electric discharge. . The known glow discharge method not only has a high manufacturing cost of the processing apparatus, but also requires a vacuum evacuation process to be applied to the inside, so that the working time becomes long. In the surface treatment method using plasma, there is a method in which plasma is generated in the process of being connected to the atmosphere, and the object to be treated is exposed to the plasma. According to the method 1, the plasma atmosphere does not need to be formed when the plasma is generated. Therefore, the manufacturing cost of the clothes set is low and the working time is short (for example, refer to Patent Document 1). If the plasma is generated in a state where the processing chamber is connected to the atmosphere, it can be as large as the corrosion of Mengzi. In particular, when the metal wiring is composed of copper, nitrogen in the crucible reacts with copper to form copper nitrate on the surface of the metal wiring. In other words, if the wiring portion formed by the narrow portion of the Meng wiring is formed of nitric acid, the wiring portion may be broken. [Patent Document 曰 曰 特 10 10 10 10 10 10 10 12 12 12 12 12 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 953 In order to solve the above problems, a surface treatment method for a wiring board according to the present invention includes a substrate, and a metal wiring layer which is patterned on a substrate and patterned in a predetermined planar shape, and is at least a metal wiring layer. On the partial surface, a protective layer patterned in a planar shape substantially equal to the metal wiring layer is disposed, and a laminated film is formed by the protective layer and the metal wiring layer, and the surface of the substrate is exposed between the laminated films to laminate the wiring board After the side surface is exposed to the plasma, the protective layer is removed from the metal wiring layer. The surface treatment method of the present invention is after removing the protective layer, on the surface of the metal wiring layer after removing the protective layer, and between the metal wiring layers. The adhesive is disposed on the surface of the substrate. In the surface treatment method of the wiring board of this month, the patterned metal wiring layer is patterned on the substrate. After the patterned metal ruthenium layer is disposed, the patterned protective layer is placed on the metal wiring layer, and the metal wiring layer exposed between the protective layers is etched and removed. The surface treatment method of the wiring board of the present invention, the wiring The board has a base material and a metal wiring layer disposed on the base material, and a coating film is provided on the surface on the side where the metal wiring layer is disposed to remove a part of the coating film, and the wiring board is partially exposed, and other portions are exposed. Covering with a coating film, the surface of the wiring board on the side of the coating film is exposed to the plasma. The surface treatment method of the wiring board of the present invention is to remove the coating film after exposing the wiring board to electric water. The adhesive is disposed on the surface of the local metal wiring layer and the surface of the substrate exposed between the metal wiring layers. I295313 In the surface treatment method of the wiring board of the present invention, the substrate is made of a resin film. The surface treatment method of the board is to place the substrate between the first and second openings (to the inside of the electrode tip), and to attach the processing gas to the wiring board from the electrode nozzle, the counter electrode A voltage is applied to form a plasma near the surface of the wiring board. The surface treatment method of the wiring board of the present invention is to spray a processing gas together with a moisture gas on a wiring board to form a plasma. In the manufacturing method, an electrical component is provided on an adhesive surface of a wiring board, and an electrical component is manufactured by connecting an electrical component and a wiring board through an adhesive; the wiring board has a substrate and is patterned in a predetermined planar shape. The metal wiring layer on the substrate is provided with a protective layer of a planar shape substantially equal to the metal wiring layer, and a protective layer and a metal wiring layer are formed on at least a part of the surface of the metal wiring layer to form a laminated film. After the film is separated from the surface of the substrate, the laminated film forming side surface of the wiring board is exposed to the plasma, and after the protective layer is removed from the metal wiring layer, the surface of the metal wiring layer after the protective layer is removed, and the metal wiring is located. An adhesive is disposed on the surface of the substrate between the layers. The manufacturing method of the electric device of the present invention is to provide an electrical component on the adhesive dispensing surface of the wiring board, and to connect the electrical component and the wiring board through the adhesive to manufacture an electrical device; the wiring board has a substrate and is disposed in A metal wiring layer on the substrate is provided with a coating film on the surface on the metal wiring layer side, and the other portion of the coating film 1295313 is removed, and the coating film surface is exposed to the plasma, and between the metal wiring layers. In some cases, a part of the wiring board is exposed and covered. The adhesive is disposed on the surface of the substrate on which the surface of the partial metal wiring layer after the coating film is removed from the surface on which the coating film is disposed. According to the above configuration, when the surface (4) of the metal wiring layer is formed as a protective layer, the metal wiring layer is protected by the protective layer when the surface of the wiring board is exposed to the plasma: the metal wiring layer is not deteriorated by the plasma. According to the surface treatment method of the present invention, a protective layer is formed on all the metal wiring layers at the time of plasma treatment. For example, a portion where the coating agent is not applied without being subjected to plasma treatment exposes the metal wiring layer. Generally, if the surface of the substrate is adhered to a contaminant such as oil, the adhesion of the substrate to the coating agent is used. Will change i. According to the present invention, in the wiring board process, even if the surface of the substrate is contaminated by the adhesion of the substrate, the surface of the substrate exposed between the laminated films is exposed to the plasma to decompose the pollutants. Therefore, the wiring board and the adhesive after the plasma treatment are highly improved. * According to the surface treatment method of the present invention, when the surface of the resin film is subjected to plasma treatment, since the metal wiring layer is protected by the grease film, the metal wiring layer = corrosion. Further, in the metal wiring layer, only the wide portion for connection is exposed from the coating film, and the narrow portion of the metal wiring layer is covered with the coating film. If the plasma treatment is performed in this state, the narrow portion is not plasma-treated. Since it is corroded, the metal wiring layer wiring portion formed in the narrow portion does not break. Therefore, according to the present invention, since the surface treatment can be performed so as not to deteriorate the metal wiring layer, it is possible to obtain an electrical device having high connection reliability by connecting the electrical components to the wiring board after the surface treatment. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The symbol η of the drawing represents a substrate constituting a metal wiring layer 14 composed of a film formed of a long resin film. In order to produce a wiring board, a coating liquid for a photoresist containing a photosensitive resin is applied onto the surface of the metal wiring layer 14 and after heating to form a protective layer of a tree layer: exposure and development are performed using a photomask to pattern the protective layer. The shape is fixed. Since the substrate 11 is longer than the reticle, the area in which the sub-exposure can be exposed is limited, so that the exposure and development using the reticle are repeated, and the protective layer is uniformly exposed and developed, and then the respective regions on the metal wiring layer 14 are formed. A protective layer having the same pattern. The reference numeral 18 of Fig. 1(b) represents a protective layer patterned in a predetermined planar shape, and the metal wiring layer 14 is exposed between the patterned protective layers 18. Next, by the residual etching process, the metal wiring layer 14 exposed between the protective layers is left until the substrate η is exposed, so that the Meng wiring layer 14 is patterned into a planar shape and a protective layer. a is the same. Reference numeral 15 in Fig. 1 (4) denotes a patterned metal ruthenium wiring layer, and the wiring pattern is formed by the patterned smectic wiring; | 15 and the substrate u. The protective layer 18 remains on the metal wiring layer 15, and the laminated film 13 is formed from the patterned metal wiring layer η and the protective layer 18 remaining on the metal wiring sound 1 $ μ '5, from which the laminated film is formed. 13 exposed substrates ^. The tiger 1 in Fig. 3 represents a place where the wiring board 〇 is subjected to electropolymerization. The rupture processing apparatus 1 has a processing chamber 3 in the side wall shape 1295313 of the processing chamber 31 to form first and second openings Μ, 33. Via the first, the first one, the processing chamber 3 1 & *, the second opening 3 2, 3 3,

The inner helium space is connected to the atmosphere in which the process I is in the process chamber h + to the outside of 31. 3 1 Internal configuration electrode mouth 3 6 plate 1 〇 is rolled and stretched next σ Ρ electrode 3 7, wiring is placed in the processing device 卜 ^ (to laminate 臈 13 shape # ^, the outer end of the brother line 1 〇 The portion of the chemical conversion surface facing the electrode tip 36 is passed through the first -f1 $ , the 攸 distribution plate reel and then between the first gate mouth 36 and the lower electrode 37, and the 弟n brother-opening 33 is in the processing chamber wire plate (7). That is, it is a crossover of the first and the third, and it is arranged in such a state. The younger-openings are arranged in the 32nd and the 33rd, and the shape of the opening is in the outside of the processing chamber 3, and the west is already high. 4 Bu added gas and moon with the clumps of the genus 4, painted to ': by crying yf " σσ, processing oxygen body high pressure container 41 part = rational "directly sent to the electrode * 36, the other part through the bubbler = The % nozzle 36, the additive gas system of the gas high pressure vessel is directly sent to the nozzle 36, that is, the gas supplied to the electrode nozzle 36 contains: a processing gas, a gas addition, and a moisture added to the processing gas by bubbling (4) Gas. mm (four) 36 of the processing gas, the mixed gas of the additive gas and the moisture gas 'from the electrode nozzle 36 The discharge port is ejected toward the wiring board 1'. The atmosphere between the wiring 1 and the electrode tip 36 is extruded by the mixed gas. The atmosphere extruded between the wiring board 10 and the electrode tip 36 is connected to the processing chamber 3. The internal residual atmosphere is simultaneously extruded toward the outside of the processing chamber 31 along the flow potential of the mixed gas. Therefore, the atmospheric concentration inside the processing chamber 31 becomes low. Further, the mixed mixed gas flow can prevent the atmosphere from intruding into the wiring board. Since the space between the first electrode and the electrode tip 36 is small, the atmospheric concentration of the space 1295313 between the wiring board 电极 and the electrode tip 36 is extremely low. In this state, the reel is wound and the wiring board 1 〇 is advanced in the longitudinal direction. 1. The second openings 32, 33 are not closed when the wiring board 1 is traveling. Since the inside of the processing chamber 31 is in communication with the outside atmosphere, the accompanying traveling of the wiring board may entrain the atmosphere into the processing chamber 3, but When the wiring board 丨〇 travels, the mixed gas is still ejected from the electrode nozzle 36, so that the atmosphere that has entered the inside of the processing chamber 31 is discharged to the outside of the processing chamber 3. The P is led by the wiring board 1 ,, when the wiring board 1 〇 The area to be treated is located at the electrode mouth 36 and the lower part When the number of the poles is 37, the wiring board 1 is made static. When the wiring board 10 is stationary, a mixed gas is ejected from the electrode nozzle 36, and a voltage is applied between the electrode tip 36 and the lower electrode 37. A plasma of a mixed gas is generated between the electrode 10 and the electrode tip 36. The symbol 28 of Fig. 1(d) represents a plasma of a mixed gas, and as described above, the surface of the substrate n is exposed from the laminated film 13 to adhere to the substrate. u The oil and other pollutants on the surface will be decomposed by the plasma, and the resin constituting the substrate n will react with the plasma, and a functional group will be formed on the surface of the substrate (i (plasma treatment) in the plasma treatment, The surface of the metal wiring layer 15 is covered by the protective layer ,, so that the surface of the metal wiring layer 15 is protected by the protective layer 18. Therefore, when the metal wiring layer 15 is made of steel, even if there is atmospheric intrusion inside the processing chamber 31, no nitrate steel (reactant with atmospheric components) is formed on the surface of the metal germanium layer 15 due to electropolymerization. Does not cause rot of the metal wiring layer. & When the wiring board 10 is subjected to plasma processing for a predetermined period of time, the application of the electric power to the nozzle 36 is stopped, and the plasma processing is terminated. Then, when the unprocessed area of the wiring board ίο reaches between the electrode tip 36 and the lower electrode 37, the wiring board is turned back to the left side, and the above-described electropolymerization process is performed. In this way, by repeating the plasma treatment, it is possible to perform plasma treatment in a necessary region of the elongated wiring board. Under. |^ Electrode 37 is provided with a solid dielectric film 38% of the electrode of the lower electrode 37: when the film is processed, the lower electrode 37 and the electrode nozzle 36 are not: therefore, in the plasma, there is no cause of "Arc" Discharge, damage to the wiring board 1 due to the argon arc. The enamel sheath 18 is exposed to the electrical equipment during the plasma processing process, so its adhesion to the metal wiring layer 15 is quite good; The shovel can be easily removed by the removal method described later, and the surface of the 曰15 is removed. Fig. 1(e) shows the removal of the protective layer 18, which is the surface of the wiring layer 15 and is located between the metal wiring layers. The surface of the substrate 11 is exposed. The method for removing the 4 layers 18 can be carried out by using a conventionally used wet etching solution, such as an alkaline etching solution, in the t Μ ^ 红 j沄 temple, but a relatively simple method. The influence of the electric (four) plane on the surface of the substrate 11 between the lesser layers 15 is greater. The method is to prepare a tape (the adhesion between the layer 18 and the protective layer 18 is between the 8 and the metal wiring layer 15). Adhesive force), the tape is peeled off from the metal wiring layer 15. The adhesion layer 18 is transferred to the tape and the method is replaced by the method. The chemically active (4) liquid, such as a liquid with a high chemical activity, is used to remove the protective layer 18 by contacting the protective layer 18, etc. 12 1295313

Reference numeral 19 in Fig. 1(f) denotes an adhesive film formed with a film-like adhesive, and the adhesive film 19 is placed on the metal wiring of the wiring board 1G as shown by Ug), and the electric connection is shown in the wiring board 1 (). The symbol 20 of the process 1 of the part represents the semiconductor component of the electrical component. The semiconductor element 2 includes an element body 21 and a bump-like connection disposed on one surface of the element body 21, and the sub-section 25 is disposed such that the connection terminal 25 of the half-body element 2G faces the adhesive film 19 on the wiring board 10. After the connection terminal 25 is positioned to face the predetermined position of the metal wiring layer, the semiconductor element 2 is placed on the adhesive film 19. In this state, while the semiconductor element 2 is heated while being pressed, the adhesive film 19 is softened by heat, and the softened adhesive film 19 is pressed apart, so that the front end of the connection terminal 25 abuts on the surface of the metal wiring layer 15, The softened adhesive film 19 is adhered to the surface of the metal wiring layer 15 and the surface of the substrate 11 located between the metal wiring layers 15. The adhesive constituting the adhesive film 19 contains an epoxy resin-like thermosetting tree, and the adhesive film 19 is in a state of close contact when the connection terminal 25 is in contact with the metal wiring layer 15 and is in a close contact state (closed). The surface of the metal wiring layer 15 and the surface of the substrate 位于 between the metal wiring layers 15 are cured. The surface of the substrate between the metal wiring layers 15 can remove not only contaminants but also functional groups on the surface via the above-described electro-incineration treatment. For example, when the substrate Π is composed of a polyimide resin, when the substrate 1 is exposed to the plasma of the mixed gas, the polyimide resin on the surface of the substrate u reacts with the moisture gas in the mixed gas, and A functional group such as a hydroxyl group G〇H), a carboxyl group (_C〇〇H), and a 13 1295313 carbonyl group (0 = CH) is formed. Due to the affinity of these functional groups and the adhesive constituting the adhesive film 19, the adhesion between the substrate 11 and the adhesive film 19 is high, and the conductive member 20 is firmly bonded to the wiring board. The symbol 2 of the second figure (b) represents the electric device on the wiring board 10, and the wiring board 1 of the electric device 2: "the wiring board 1 described above on the conductor element" The metal wiring layer 丨5 of the crucible is not suitable for the treatment of σ^ water, so the electrical reliability is good. 曰 The above description is directed to the case where the protective layer 18' is disposed on the crucible before patterning. The metal wiring layer 14 is patterned to form the laminated film 13, but the present invention is not limited thereto. For example, after the metal wiring layer is placed on the substrate 11, the a wiring layer is placed on the metal wiring layer. After the formation of the protective film 18 (which is substantially the same as the formation of the metal wiring layer) and the formation of the laminated film 13, the above-mentioned plasma treatment is performed.

Further, the protective layer 18 is not limited to the case of a resin, and may be formed by any material such as (4) or metal, as long as it can be removed from the metal wiring layer. In the case described above, the electric paddle treatment is performed in a state in which the metal wiring layer is covered with the protective layer 18, but the present invention is not limited thereto. The symbol 唬50 represents a wiring board used in another surface treatment method of the present invention. The wiring board 5 〇 includes a substrate 5 made of a resin film and a metal wiring layer 55 placed on the surface of the substrate W, and the substrate η A coating film 52 made of a resin is bonded to the surface of the metal wiring layer w. The soil wiring layer 55 is patterned to form a narrow portion 56 and a wide portion 14 1295313 57 narrow portion 56 is connected to the wide portion 57. After the coating film 52 is bonded to the surface of the metal wiring layer 55 of the distribution plate 50, the opening 52 is cut so as to expose the wide portion π to form an opening 59 (half-cut). The surface of the wide portion 57 is exposed to the surface of the substrate 51 located around the wide portion 57. However, the narrow portion 56 of the metal wiring layer 55 is covered with the covered crucible 52. In order to surface-treat the wiring board 50, the wiring board 5 is placed between the first and second openings 32 and 33 of the processing apparatus 1 to process the chamber; the internal air atmosphere is connected to the electrode nozzle 36. The mixture is sprayed toward the wiring board 5: a mixed gas of a gas, a moisture gas, and an additive gas, and the plasma of the gas-producing gas is decontaminated from the substrate 51 exposed on the bottom surface of the opening 59. The substrate 5 and the reaction reaction core form a functional group on the surface of the substrate 51. 56 is covered by the coating film 52. In the case of a different atmospheric intrusion treatment surface, a broken line such as nitric acid or the like is formed. At this time, the narrow portion of the metal wiring layer 55 is therefore, when the metal wiring layer 55 is made of copper, and the inside of the 31 is still not in the reactant of the narrow portion of the surface component, so that the narrow portion plasma treatment is not performed, as long as the wiring is used. The opening 59 of the board 1 is formed as a part of the station, and as described above, the electrical parts of the semiconductor 1 and the like 20 can be formed far away, and the opening 59 forms part of the substrate 51 by: processing: The contaminant is removed, and the Luyue & base is formed on the surface of the substrate 5, so that the adhesion of the adhesive to the substrate 51 is good, and the semi-conductive member 20 can be firmly fixed to the surface. Wiring board 2〇. Further, as described above, since the narrow portion is not broken due to the plasma treatment, it is possible to connect the 15 I2953l3 electric device with good reliability.

In the case of the above, in the case of B, the film 52 is removed from the wiring board 5, and the coating film 52 is bonded to the blade to form the opening 59. However, the present invention does not open the bottom surface of the D. An opening is formed in advance in the broken film, and the wide portion is exposed to the arrangement surface. In the case where the W 忒 coating is bonded to the metal wiring layer of the wiring board, the η portion of the retort 隹疋 is provided only for the fixed dielectric film 38 in the following example, and the case of the = side, but for example, solid The dielectric film can also be placed on the electrode tip % or = the lower electrode 37 side and the electrode tip % side to fly? Chlorine gas, such as diamine gas, gas, and other rare gases. Rose = use two as an additive gas to increase the plasma formation time: The gas to be added is not limited to oxygen. As long as a voltage is applied to the electrode tip, a gas which generates a chemical reaction on the surface of the substrate 11 is removed, and π wood is subjected to various reactive gases such as hydrogen rolling or helium gas. ^ "The gas mixture may be sprayed from the electrode nozzle 36 without using an additive gas to form a mixed gas composed of the emulsion of the air knife. In the case described above, the electric device 2 is manufactured by using an adhesive film called an adhesive to form a film. However, the present invention can apply a paste adhesive to the wiring board. 10 and the semiconductor element, for example, or both, through the adhesive, the wiring board and the semi-conductive element 20 are assembled to produce an electrical device. The resin constituting the substrate 11 is not limited to a polyimide resin, and the substrate U can be formed of various resins such as a polyester resin. The substrate n is not limited to the tree 2 film, and various materials such as a glass substrate can also be used. When the substrate] is composed of a pliable 16 1295313 resin film and the film thickness of the metal wiring layer is thin to the flexibility of the substrate 11 , the wiring board 10 as a whole has an optional sharpness. The so-called flexible wiring board. The electric component to be bonded to the wiring board 10 is not limited to the semiconductor element 20. For example, two types of electrical disaster devices such as other flexible wiring boards and rigid substrates can be bonded to each other to constitute the electric device 2. The (four) agent used in the method for producing an electric device according to the present invention is not particularly limited. When considering the connection reliability of the electric device 2, the isotropic conductive adhesive agent in which the conductive particles are dispersed in the adhesive (four) is good. The thermosetting resin used in the adhesive is not limited to an epoxy resin, and can also be used: melamine (tetra), _resin, etc. A resin other than the thermosetting resin, a aging preventive agent, and a coloring additive may be added to the adhesive. For the adhesive, in addition to those containing a thermosetting resin, use a photopolymerizable resin containing an acrylic vinegar. "b In the case of the above description, the metal wiring layer is copper, but the present invention is not limited thereto, and the 钔 constituting the μ* and the earth wiring layer 15 can also be used for various conductive materials of aluminum and Hejin Temple. Kelai constitutes. 'Metal wiring layer, for example, ώ其# 7 ^士方'm > "The film is formed by vapor deposition or the like on the surface of the soil material 11 (4). It is also a metal film. The layer 'in the metal foil and the genus 4 is placed in a 1 W soil resin composition and fired to form a substrate u made of a resin film. The electrode is also 从 γ when the wiring board is 0. In addition, the present invention is not limited to this, and it is possible to reduce the consumption of the mixed gas to a low cost, and it is also possible to stop the discharge of the mixed gas on the wiring board 1 () 17 1295313, and stop at the wiring board 10 The discharge of the mixed gas during the traveling is started. The processing chamber 31 used in the present invention can be connected to the exhaust system, and the exhaust system discharges the mixed gas from the inside of the processing chamber 31 while exhausting. The discharge amount of the entire mixed gas discharged from the inside of the processing chamber 31. [Simplified description of the drawings] Fig. 1(a) to (g) show the surface treatment steps of the wiring board of the present invention.

Fig. 2 (4) and (b) are cross-sectional views showing the steps of the manufacturing method of the electric device, which are exemplified by the method of the present invention. ^~The wiring used by the Lidon j-face processing method

Fig. 4 is a plan view showing another panel of the present invention. [Description of main component symbols] Bu··Processing device 2···Electrical device

10···酉, H Π...Resin film (substrate) 1 5...metal, wiring layer 20...electric parts (semiconductor element) 2 1...element body 25...connection terminal 28···plasma 31...processing chamber ] 8 1295313 3 2...first opening 33...second opening 3 6...electrode mouth

Claims (1)

t曰修(more) jE本1295313 X. Patent application scope: 1. A surface treatment method for a wiring board, the wiring board having: a substrate, and a metal wiring layer patterned in a predetermined planar shape and disposed on the substrate Providing a protective layer patterned in a planar shape substantially equal to the metal wiring layer on at least a part of the surface of the wiring layer, forming a laminated film by the protective layer and the metal wiring layer, and exposing the substrate between the laminated films After the surface of the laminated film forming side of the wiring board is exposed to the plasma, the protective layer is removed from the metal wiring layer. 2. The surface treatment method of the wiring board according to the first aspect of the patent application is characterized in that after the protective layer is removed, an adhesive is disposed on the surface of the metal wiring layer after removing the protective layer and the surface of the substrate between the metal wiring layers. 3. The surface treatment method of the wiring board according to the first or second aspect of the patent application, wherein the patterning of the metal wiring layer is performed by patterning the metal wiring layer of the patterned seven on the substrate, and then patterning The protective layer is located on the metal wiring layer to etch and remove the metal wiring layer exposed between the protective layers. 4. A surface treatment method for a wiring board, comprising: a substrate, and a metal wiring layer disposed on the substrate, wherein a coating film is provided on a surface on the side of the metal wiring layer, and the coating film is removed In some cases, a part of the wiring board is exposed, and other portions are covered with a coating film, and the surface on the side of the coating film on the wiring board is exposed to the plasma. 5. The surface treatment method of the wiring board according to item 4 of the patent application is the substrate exposed on the surface of the partial metal wiring layer and the metal wiring layer after the wiring board is exposed to the plasma after removing the coating film. On the surface, the adhesive is placed. The method of surface treatment of a wiring board according to any one of the claims 2, 4, and 5, wherein the substrate is composed of a resin film. The method of the wiring board of any one of the first, second, fourth, and fifth items of the towel month patent 聋11 is to set the substrate to the first to the right of the processing chamber (with the electrode tip inside) The wiring board sprays the processing gas, and applies a voltage to the electrode tip to form a battery in the vicinity of the surface of the wiring board. For example, the surface treatment method of the wiring board of the patent application 帛7 is to attach the processing body I and the moisture gas 11 to the wiring board, thereby forming a plasma, and a manufacturing method of the electrical device is performed in the wiring. An electrical component is disposed on an adhesive placement surface of the board, and an electrical device is manufactured by connecting an electrical component and a wiring board through an adhesive; the wiring board has a base material and a metal wiring layer patterned in a predetermined planar shape and disposed on the substrate Providing a protective layer patterned in a planar shape substantially equal to the metal wiring layer on at least a part of the surface of the metal wiring layer, forming a laminated film by the protective layer and the metal wiring layer, and exposing the surface of the substrate between the laminated films After the laminated film forming side surface of the wiring board is exposed to the plasma, the protective layer is removed from the metal wiring layer, and then the surface of the metal wiring layer after the protection is removed and the surface of the substrate between the metal wiring layers are disposed. Adhesive. 10. A method of manufacturing an electrical device, wherein an electrical component is provided on an adhesive placement surface of a wiring board, and an electrical component is manufactured by connecting an electrical component and a wiring board through an adhesive; the wiring board has: a substrate, and is disposed on the substrate In the upper metal wiring layer, 21 1295313, a part of the coating film is placed on the surface of the metal wiring layer arrangement side, and the wiring board is covered by the "back gland, and the coating film of the wiring board is g-out, and other parts are After the partial metal is removed by the coating film and the surface is exposed to the plasma, the surface of the exposed substrate and the metal wiring layer are disposed on the surface of the exposed substrate. · Secondary page 22 1295313 VII. Designation of representative representatives: (1) The representative representative of the case is: (1〇)~(g)). (2) A brief description of the component symbols of this representative diagram: 1 0 · · · 酉 良 良 良 ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... Layer 19... Adhesive film 28··· Plasma 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: