KR100988541B1 - Surface treatment method for wiring board and manufacturing method for electrical apparatus - Google Patents

Abstract

In the surface treatment method of the present invention, since the wiring board 10 is exposed to the plasma 28 in a state where the patterned metal wiring layer 15 is covered with the protective layer 18, the substrate 11 exposed between the laminated films 13. ) Surface is plasma treated, but the metal wiring layer 15 is not exposed to the plasma 28. Therefore, in the case where the metal wiring layer 15 is made of copper, even if air enters the space for generating plasma, copper nitrate is not formed on the surface of the metal wiring layer 15, and the metal wiring layer 15 is deteriorated. Since no electrical component is connected to the wiring board 10 after the surface treatment, highly reliable electrical apparatus is obtained.

Description

SURFACE TREATMENT METHOD FOR WIRING BOARD AND MANUFACTURING METHOD FOR ELECTRICAL APPARATUS

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for mounting an electrical component on a wiring board, and more particularly to a technique for surface treatment of a wiring board.

Conventionally, before mounting a semiconductor element to an wiring board like a flexible wiring board via an adhesive agent, surface treatment for improving the affinity of a wiring board and an adhesive agent is performed.

As a conventional surface treatment, a method is used in which a wiring board is placed in a vacuum chamber, a plasma is generated by glow discharge in a state where a vacuum atmosphere is formed in the vacuum chamber, and the surface treatment is performed by the plasma. However, in the conventional glow discharge, the manufacturing cost of the processing apparatus is high, and the working time becomes longer as the vacuum exhaust in the processing chamber is required.

As a surface treatment method using plasma, there is a method of generating a plasma in a processing chamber connected to the atmosphere and exposing the object to the plasma. According to this method, it is not necessary to form a vacuum atmosphere during plasma generation. The manufacturing cost of the device is low, and the working time is also shortened (see Patent Document 1, for example).

However, when plasma is generated in a state where the processing chamber is connected to the atmosphere, metal wiring may corrode. In particular, when the metal wiring is made of copper, nitrogen gas in the atmosphere and copper react to form copper nitrate on the surface of the metal wiring. In particular, when copper nitrate is formed in the wiring portion formed of the narrow portion of the metal wiring, the wiring portion may be disconnected.

[Patent Document 1] Japanese Patent Application Laid-Open No. 10-154598

The present invention has been made to solve the above problems of the prior art, and an object thereof is to provide a technique for performing surface treatment of a wiring board without corroding metal wiring.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention has a base material and the metal wiring layer patterned in the predetermined planar shape, arrange | positioned on the said base material, On the at least one surface of the said metal wiring layer, substantially planar shape similar to the said metal wiring layer A patterned protective layer is disposed, a laminated film is formed from the protective layer and the metal wiring layer, and the surface of the wiring board on which the surface of the substrate is formed is exposed between the laminated film and exposed to the plasma, It is a surface treatment method of the wiring board which removes the said protective layer from the said metal wiring layer.

After removing the said protective layer, this invention is a surface treatment method of the wiring board which arrange | positions an adhesive agent on the surface of the metal wiring layer from which the said protective layer was removed, and the said substrate surface located between the said metal wiring layer.

According to the present invention, the patterning of the metallization layer is performed after disposing the metallization layer before patterning on the substrate, placing the patterned protective layer on the metallization layer, and etching the metallization layer exposed between the protection layers. It is a surface treatment method of the wiring board.

This invention has a base material and the metal wiring layer arrange | positioned by predetermined | prescribed patterning, and arrange | positioned on the said base material, the cover film is arrange | positioned at the surface of the side where the said metal wiring layer is arrange | positioned, a part of said cover film is removed, and a part The surface treatment method of the wiring board which exposes the surface of the wiring board in which the said cover film was arrange | positioned to plasma is exposed.

The present invention is a surface treatment method of a wiring board in which an adhesive is disposed on the surface of the substrate exposed between the metal wiring surface and the metal wiring layer of a portion where the cover film is removed after the wiring board is exposed to plasma.

This invention is the surface treatment method of the wiring board which comprises the said base material with a resin film.

In the present invention, the wiring board is positioned between the first and second openings of the processing chamber having the electrode nozzles therein, the processing gas is injected toward the wiring board from the electrode nozzles, and a voltage is applied to the electrode nozzles. This is a surface treatment method of a wiring board which forms a plasma in the vicinity of the surface of the wiring board.

This invention is the surface treatment method of the wiring board which forms said plasma, injecting a moisture gas to the said wiring board with the said processing gas.

According to the present invention, a protective layer having a substrate and a metal wiring layer patterned in a predetermined planar shape and disposed on the substrate, and patterned in a substantially planar shape similar to the metal wiring layer on at least part of the surface of the metal wiring layer, A laminated film is formed from the protective layer and the metal wiring layer, and the surface of the wiring board on which the laminated film is formed is exposed to the plasma on the wiring board on which the substrate surface is exposed between the laminated film, and the protective layer is exposed to the metal wiring layer. After removing from the phase, an adhesive is disposed on the surface of the metal wiring layer from which the protective layer has been removed and the surface of the substrate positioned between the metal wiring layer, and an electrical component is disposed on the surface of the wiring board where the adhesive is disposed. It is a manufacturing method of the electric device which connects the said electrical component and the said wiring board through an adhesive agent.

This invention has a base material and the metal wiring layer arrange | positioned by predetermined | prescribed patterning, and arrange | positioned on the said base material, the cover film is arrange | positioned at the surface of the side where the said metal wiring layer is arrange | positioned, a part of said cover film is removed, and a part After exposing the surface of the wiring board on which the cover film is disposed, to the plasma, an adhesive is disposed on the surface of the metal wiring layer of the portion where the cover film is removed and the surface of the substrate exposed between the metal wiring layer. The electrical component is arranged on the surface of the wiring board on which the adhesive is disposed, and the electrical component is connected to the wiring board through the adhesive.

According to the present invention, when the protective layer is formed on the surface of the metal wiring layer, the metal wiring layer is protected by the protective layer when the surface of the wiring board is exposed to the plasma. No deterioration by

In addition, according to the surface treatment method of the present invention, it is not necessary to form the protective layers on all the metal wiring layers when performing the plasma treatment. For example, it is not necessary to apply the adhesive, and the metal wiring layer may be exposed at the portion not subjected to the plasma treatment.

Generally, when contaminants such as oil and the like adhere to the surface of the substrate, the adhesion between the substrate and the adhesive becomes poor. According to the surface treatment method of the present invention, even if contaminants adhere to the surface of the substrate in the manufacturing process of the wiring board, the substrate surface exposed between the laminated films is exposed to the plasma, so that the contaminants are decomposed and removed. Adhesiveness with an adhesive agent becomes high.

[Effects of the Invention]

According to the surface treatment method of the present invention, since the metal wiring layer is protected by the resin layer when the surface of the resin film is subjected to plasma treatment, the metal wiring layer does not corrode. In addition, if only a wide portion of the metal wiring layer used for the connection is exposed from the cover film, and the plasma treatment is performed in a state in which the narrow portion of the metal wiring layer is covered with the cover film, the narrow portion is formed by the plasma. Since corrosion does not occur, the wiring part of the metal wiring layer comprised by the narrow part is not disconnected. Therefore, according to the present invention, the surface treatment is performed without deterioration of the metal wiring layer. Therefore, when the electrical components are connected to the wiring board after the surface treatment, an electrical device with high connection reliability can be obtained.

1 (a) to 1 (g) are cross-sectional views illustrating a step of surface treating a wiring board according to the present invention.

2 (a) and 2 (b) are cross-sectional views illustrating the process of manufacturing the electric device.

3 is a cross-sectional view illustrating an example of a treatment apparatus used in the surface treatment method of the present invention.

4 is a plan view illustrating a wiring board used in the surface treatment method of another example of the present invention.

(Explanation of symbols for the main parts of the drawing)

One … Processor 2. Electrical equipment

10... Wiring board 11. Resin film

28. Plasma 15... Metallization layer

20... Electrical components (semiconductor elements) 21. Element body

25…. Connection terminal 31. Treatment room

32…. First opening 33... Second opening

36. Electrode nozzle

EMBODIMENT OF THE INVENTION Hereinafter, with reference to drawings, embodiment of this invention is described. Reference numeral 11 in FIG. 1A denotes a substrate made of a resin film having a long shape, and a metal wiring layer 14 made of a thin film of metal is formed on the surface of the substrate 11.

First, in order to manufacture a wiring board, the coating liquid for resist containing photosensitive resin is apply | coated to the surface of the metal wiring layer 14, and it heats and forms the protective layer which consists of resin, and it exposes using a mask, develops, and protects. The layer is patterned into a predetermined planar shape.

Since the base material 11 is longer than the mask, the area exposed by one exposure is limited. When the exposure with the mask and the development are repeatedly performed, all of the protective layers are exposed and developed, and a predetermined amount is provided on the metal wiring layer 14. A protective layer having the same pattern is formed for each region.

Reference numeral 18 in FIG. 1B denotes a protective layer patterned in a predetermined planar shape, and the surface of the metal wiring layer 14 is exposed between the patterned protective layers 18.

Next, when the metal wiring layer 14 exposed between the protective layers 18 while the protective layer 18 remains by the etching process is etched away until the surface of the base material 11 is exposed, the metal wiring layer 14 ) Is patterned in the same planar shape as the protective layer 18.

Reference numeral 15 in FIG. 1C denotes a patterned metal wiring layer, and the wiring board 10 is composed of the patterned metal wiring layer 15 and the substrate 11. The protective layer 18 remains on the metal wiring layer 15, and the laminated film 13 is composed of the patterned metal wiring layer 15 and the protective layer 18 remaining on the metal wiring layer 15. If it is, the surface of the base material 11 is exposed between the laminated films 13.

Reference numeral 1 in FIG. 3 shows a processing apparatus that performs the plasma processing described later on the wiring board 10, and the processing apparatus 1 has a processing chamber 31. First and second openings 32 and 33 are formed on the sidewall of the processing chamber 31, and the interior space of the processing chamber 31 is formed outside the processing chamber 31 by the first and second openings 32 and 33. The atmosphere is connected to the atmosphere.

The electrode nozzle 36 and the lower electrode 37 are arrange | positioned inside the processing chamber 31, and the above-mentioned wiring board 10 is wound in roll shape, it mounts to the processing apparatus 1, and the outer peripheral edge part of the wiring board 10 is carried out. Is taken out of the roll of the wiring board 10, the first opening 32 is inserted and the electrode nozzle 36 and the lower electrode 37 are faced with the surface on which the laminated film 13 is formed facing the electrode nozzle 36. ), And when the 2nd opening 33 is inserted through and wound up outside the process chamber 31, the wiring board 10 will be arrange | positioned between the 1st, 2nd openings 32 and 33. FIG. .

The processing gas cylinder 41, the additional gas cylinder 42, and the bubbler 45 are disposed outside the processing chamber 31, and a part of the processing gas of the processing gas cylinder 41 is disposed in the electrode nozzle 36. Is sent directly to the electrode nozzle 36 via the bubbler 45, the additive gas of the additive gas cylinder is sent directly to the electrode nozzle 36, and to the electrode nozzle 36 a process gas. WHEREIN: The additive gas and the moisture gas added to the process gas by the bubbler 45 are supplied.

The mixed gas of the processing gas, the additive gas, and the water gas supplied to the electrode nozzle 36 is blown toward the wiring board 10 from the jet port formed in the electrode nozzle 36, and the wiring board 10 and the electrode nozzle 36 are discharged. From there, the atmosphere is extruded by the mixed gas.

The air extruded from between the wiring board 10 and the electrode nozzle 36 is extruded out of the processing chamber 31 along with the flow of the mixed gas together with the air remaining inside the processing chamber 31, and thus the atmosphere inside the processing chamber 31. The concentration is low.

In addition, since air flow is prevented from entering the space between the wiring board 10 and the electrode nozzle 36 by the flow of the mixed gas, the atmospheric concentration of the space between the wiring board 10 and the electrode nozzle 36 is very low. do.

In that state, the roll is wound to run the wiring board 10 in the longitudinal direction. The first and second openings 32 and 33 are not closed when the wiring board 10 travels, and since the inside of the processing chamber 31 is connected to an external atmosphere, according to the running of the wiring board 10, Although the atmosphere is mixed in the processing chamber 31, the mixed gas is blown out of the electrode nozzle 36 even when the wiring board 10 is running, and the air which has penetrated into the processing chamber 31 is discharged to the outside of the processing chamber 31.

By traveling of the wiring board 10, the wiring board 10 is stopped in a region where the area to be processed of the wiring board 10 is located between the electrode nozzle 36 and the lower electrode 37.

If a voltage is applied between the electrode nozzle 36 and the lower electrode 37 while blowing the mixed gas from the electrode nozzle 36 while the wiring board 10 is stopped, the wiring board 10 and the electrode nozzle 36 Plasma of the mixed gas is generated in between.

Reference numeral 28 in FIG. 1D denotes a plasma of the mixed gas, and as described above, since the surface of the base material 11 is exposed between the laminated films 13, it is attached to the surface of the base material 11. Contaminants such as oil and the like are decomposed by the plasma, and the resin constituting the substrate 11 reacts with the plasma to form functional groups on the surface of the substrate 11 (plasma treatment).

In the plasma treatment, since the surface of the metal wiring layer 15 is covered with the protective layer 18, the surface of the metal wiring layer 15 is protected by the protective layer 18. Therefore, in the case where the metal wiring layer 15 is made of copper, even if the air enters the inside of the processing chamber 13, a reactant with an atmospheric component such as copper nitrate is formed on the surface of the metal wiring layer 15 by plasma. It is difficult, and the metal wiring layer 15 is hard to corrode.

In the place where the wiring board 10 was plasma-processed for predetermined time, voltage application to the electrode nozzle 36 is stopped and plasma processing is complete | finished. Next, the wiring board 10 is driven, and the wiring board 10 is stopped at the place where the untreated area of the wiring board 10 is disposed between the electrode nozzle 36 and the lower electrode 37, thereby performing the above-described plasma processing. Do it. By repeating the plasma treatment in this manner, the plasma treatment can be performed on the entire required region of the long wiring board 10.

In addition, since the solid dielectric film 38 is disposed on the lower electrode 37, and the solid dielectric film 38 covers all of the surfaces of the lower electrode 37 that face the electrode nozzles 36, the solid dielectric film 38 covers the surface of the lower electrode 37. Arc discharge does not occur between the lower electrode 37 and the electrode nozzle 36, and the wiring board 10 is not damaged by the arc discharge.

The protective layer 18 is exposed to the plasma in the plasma treatment process, thereby weakening the adhesive force with the metal wiring layer 15, and is easily removed from the surface of the metal wiring layer 15 by a removal method described later. FIG. 1E shows a state where the protective layer 18 is removed, and the surface of the metal wiring layer 15 and the surface of the substrate 11 positioned between the metal wiring layer 15 are exposed.

As the method of removing the protective layer 18, various conventionally used methods such as a wet etching method using an alkaline etching solution can be used, but the plasma-treated plasma on the surface of the substrate 11 positioned between the metal wiring layers 15 can be used. The method with less influence on a process surface is preferable.

Specifically,

After the adhesive force with the protective layer 18 prepares the adhesive tape larger than the adhesive force between the protective layer 18 and the metal wiring layer 15, and adheres the adhesive tape to the surface of the protective layer 18, Peeling, the protective layer (18) is affixed on an adhesive tape, and the method is peeled from the metal wiring layer (15).

A method of removing a protective layer (18) by contacting a protective layer (18) with an etching liquid having a low chemical activity, such as an aqueous etching liquid, instead of an etching liquid having a high chemical activity such as an alkaline etching liquid.

Etc.

Reference numeral 19 in FIG. 1 (f) denotes an adhesive film in which an adhesive is formed into a film, and as shown in FIG. 1 (g), the metal wiring layer 15 of the wiring board 10 is disposed on the adhesive film 19. On the side of the finished side.

Next, the process of connecting an electrical component to this wiring board 10 is demonstrated. Reference numeral 20 in FIG. 2A denotes a semiconductor element which is an electrical component. The semiconductor element 20 has an element body 21 and a bumpy connection terminal 25 disposed on one surface of the element body 21, and a surface on which the connection terminal 25 of the semiconductor element 20 is disposed. Is positioned toward the adhesive film 19 on the wiring board 10, the connection terminal 25 is aligned so as to face a predetermined position of the metal wiring layer 15, and then the semiconductor element 20 is attached to the adhesive film 19. Load on

In such a state, when the semiconductor element 20 is heated while pressing, the adhesive film 19 is softened by heating, the softened adhesive film 19 is pushed by pressing, and the tip of the connection terminal 25 is pushed through the metal wiring layer. In addition to contacting the surface of (15), the softened adhesive film 19 is in close contact with the surface of the metal wiring layer 15 and the surface of the substrate 11 positioned between the metal wiring layer 15.

The adhesive constituting the adhesive film 19 contains a thermosetting resin such as an epoxy resin, and when the connection terminal 25 continues to be heated in a state of being in contact with the metal wiring layer 15, the adhesive film 19 is made of metal. It hardens in the state which contact | adhered to the surface of the wiring layer 15 and the surface of the base material 11 located between the metal wiring layer 15. FIG.

As for the surface of the base material 11 located between the metal wiring layers 15, not only the contaminant is removed by the above-mentioned plasma process, but the functional group is formed in the surface. For example, when the substrate 1 is made of a polyimide resin, when the substrate 11 is exposed to the plasma of the mixed gas, the polyimide resin reacts with the water gas in the mixed gas on the surface of the substrate 11. Functional groups, such as a hydroxyl group (-OH), a carboxyl group (-COOH), and a carbonyl group (O = CH), are formed.

Since such a functional group has high affinity with the adhesive agent which comprises the adhesive film 19, the base material 11 has high adhesiveness with the adhesive film 19, and as a result, the semiconductor element 20 is attached to the wiring board 10 as a result. It is firmly attached.

Reference numeral 2 in FIG. 2 (b) shows an electric device in which the semiconductor element 20 is attached to the wiring board 10. The electric device 2 is hard to peel off the wiring board 10. Likewise, since the metal wiring layer 15 of the wiring board 10 does not corrode during the plasma treatment, the electrical reliability is also high.

As mentioned above, although the protective layer 18 was arrange | positioned on the metal wiring layer 14 before patterning, and the said metal wiring layer 14 was patterned, the case where the laminated | multilayer film 13 is formed is demonstrated, However, this invention has For example, the patterned metal wiring layer is positioned on the substrate 11, and then the protective layer 18 patterned in the same shape as the metal wiring layer is disposed on the metal wiring layer to form the laminated film 13. After formation, the above-described plasma treatment may be performed.

In addition, the protective layer 18 is not limited to the case of resin, If the protective layer 18 is removed from the metal wiring layer after plasma processing, the protective layer 18 can be comprised with various materials, such as a ceramic and a metal.

As mentioned above, although the case where plasma processing was performed in the state which covered the metal protective layer 15 with the protective layer 18 was demonstrated, this invention is not limited to this. Reference numeral 50 in Fig. 4 shows a wiring board used in another surface treatment method of the present invention. This wiring board 50 has the base material 51 which consists of a resin film, and the metal wiring layer 55 arrange | positioned at the surface of the base material 51, and the side of the side where the metal wiring layer 55 of the base material 51 is arrange | positioned. The cover film 52 which consists of resin is stuck to the surface.

The metal wiring layer 55 is patterned to form a narrow portion 56 and a wide portion 57, and one end of the narrow portion 56 is connected to the wide portion 57. have. The cover film 52 is pasted to the surface of the wiring board 50 on which the metal wiring layer 55 is disposed, and then cut out so that at least a part of each wide portion 57 is exposed, and an opening 59 is formed. (Half cut), the surface of the wide part 57 and the surface of the base material 51 positioned around the wide part 57 are exposed in the opening 59, but the metal wiring layer 55 is exposed. The narrow part 56 of () is covered with the cover film 52.

In order to surface-treat the wiring board 50, the wiring board 50 is disposed between the first and second openings 32 and 33 of the processing apparatus 1 described above, and the inside of the processing chamber 31 is placed in an air atmosphere. The substrate exposed to the bottom surface of the opening 59 when the plasma of the mixed gas is generated while blowing the mixed gas of the processing gas, the moisture gas, and the additive gas from the electrode nozzle 36 toward the wiring board 50 while being connected to the substrate. Contaminants are removed from the surface of 51 and the resin constituting the substrate 51 reacts with the plasma to form functional groups on the surface of the substrate 51.

At this time, the narrow portion 56 of the metal wiring layer 55 is covered with the cover film 52. Therefore, in the case where the metal wiring layer 55 is made of copper, even if the air enters the inside of the processing chamber 31, a reactant with an air component such as copper nitrate is formed on the surface of the narrow portion 56. There is no work, and the narrow part 56 is not disconnected.

After the plasma treatment, the adhesive is disposed in the portion where the opening 59 of the wiring board 10 is formed, and as described above, an electrical component such as the semiconductor element 20 can be connected to the wiring board 50. Also in this case, since the contaminant is not only removed from the substrate 51 at the portion where the opening 59 is located, but also functional groups are formed on the surface of the substrate 51, the adhesive and the substrate 51 Has high adhesiveness, and the semiconductor element 20 is firmly fixed to the wiring board 50. In addition, since the narrow portion 56 is not disconnected by the plasma treatment as described above, an electrical device with high connection reliability is obtained.

As mentioned above, although attaching the cover film 52 to the wiring board 50, the case where the part of the cover film 52 was removed and the opening 59 was formed was demonstrated, but this invention is not limited to this. An opening may be formed in the cover film in advance, and the cover film may be pasted to the surface of the side on which the metal wiring layer of the wiring board is disposed so that a wide portion is exposed on the bottom surface of the opening.

In the above, the case where the solid dielectric film 38 is provided only on the lower electrode 37 side has been described. For example, the solid dielectric film 38 has the electrode nozzle 36 side, or the lower electrode 37 side and the electrode nozzle 36. You may install in both sides. As the treatment gas, various rare gases such as argon gas, helium gas, and xenon gas can be used.

For example, when oxygen gas is used as the additive gas, the discharge stability when forming the plasma is improved. The additive gas is not limited to oxygen gas, and various reactive gases such as hydrogen gas and nitrogen gas can be used as long as it does not polymerize when a voltage is applied to the electrode nozzle, but causes a chemical reaction on the surface of the substrate 11. have.

It is also possible to perform a plasma treatment while blowing a mixed gas of the processing gas and the moisture gas from the electrode nozzle 36 to the wiring board without using the additive gas.

As mentioned above, although the case where the electrical device 2 was manufactured using the adhesive film 19 by which the adhesive agent was formed into the film form was demonstrated, this invention is not limited to this, The paste adhesive agent is a wiring board 10 ) And the semiconductor element 20, and the wiring board 10 and the semiconductor element 20 may be attached to each other through the adhesive to manufacture the electric device 2.

Resin which comprises the base material 11 is not limited to polyimide resin, The base material 11 can be comprised by various resins, such as polyester resin. The base material 11 is not limited to the resin film, and various materials such as glass substrates can be used. When the base material 11 is comprised from the resin film which has flexibility, and when the film thickness of a metal wiring layer is so thin that it does not impair the flexibility of the base material 11, the whole wiring board 10 has flexibility, It becomes what is called a flexible wiring board.

The electrical component attached to the wiring board 10 is not limited to the semiconductor element 20. For example, the electrical apparatus 2 can be comprised by attaching various electrical components, such as another flexible wiring board and a rigid board | substrate.

Although the adhesive agent used for the manufacturing method of the electrical apparatus of this invention is not specifically limited, In consideration of the connection reliability of the electrical apparatus 2, it is preferable to use the anisotropic conductive adhesive which electroconductive particle disperse | distributed in the adhesive agent.

The thermosetting resin used for the adhesive is not limited to the epoxy resin, and various kinds such as melamine resin and phenol resin can be used. Moreover, additives, such as resin other than thermosetting resins, such as a thermoplastic resin, an antioxidant, and a coloring agent, can also be added to an adhesive agent. As the adhesive, in addition to containing a thermosetting resin, one containing a photopolymerizable resin such as an alkali resin can be used.

As mentioned above, although the case where the metal wiring layer 15 was comprised from copper was demonstrated, this invention is not limited to this, The metal wiring layer 15 can be comprised with various electrically-conductive materials, such as aluminum and an alloy.

The metal wiring layer is composed of, for example, a metal thin film formed on the surface of the substrate 11 by a film formation method such as a vapor deposition method. In addition, a metal wiring layer may be formed of metal foil, a resin composition may be coated on the surface of the metal foil, and then baked to form a base material 11 made of a resin film.

As mentioned above, although the case where the mixed gas is blown out from the electrode nozzle 36 even when the wiring board 10 is running was demonstrated, this invention is not limited to this, In order to save consumption of a mixed gas and to reduce manufacturing cost, When the wiring board 10 runs, the blowing of the mixed gas may be stopped, and the blowing of the mixed gas may be restarted where the running of the wiring board 10 has stopped.

Moreover, even if it connects an exhaust system to the process chamber 31 used for this invention, exhausts the mixed gas, exhausts the inside of the process chamber 31 by the exhaust system, and adjusts the discharge amount discharged from the mixed gas or the process chamber 31 inside. do.

Claims (13)

Forming a metal wiring layer on the surface of the substrate, Forming a protective layer patterned in a predetermined planar shape on at least part of the surface of the metallization layer, The metal wiring layer is patterned in the same planar shape as the protective layer to form a laminated film with the patterned protective layer and the metal wiring layer. After exposing the surface of the wiring board in which the said substrate surface is exposed between the said laminated films in the side in which the said laminated film was formed to plasma, And removing the protective layer from the metal wiring layer. The surface treatment of a wiring board according to claim 1, wherein after the protective layer is removed, an adhesive is disposed on the surface of the metal wiring layer from which the protective layer is removed and the surface of the base material positioned between the metal wiring layer. Way. The surface treatment method of a wiring board according to claim 1 or 2, wherein the patterning of the metal wiring layer comprises etching away the metal wiring layer exposed between the patterned protective layers. A metal wiring layer patterned in a predetermined shape is disposed on the surface of the substrate, The cover film is disposed on the side of the side on which the metal wiring layer is disposed, After removing a portion of the cover film to expose a portion of the wiring board, The surface treatment method of the wiring board of the wiring board which the said one part was exposed exposes the surface of the side where the cover film is arrange | positioned to plasma. 5. The wiring board according to claim 4, wherein after the wiring board is exposed to plasma, an adhesive is disposed on the surface of the metal wiring layer in the portion where the cover film is removed and the surface of the substrate exposed between the metal wiring layer. Surface treatment method. The surface treatment method of a wiring board according to any one of claims 1, 2, 4 or 5, wherein the base material is made of a resin film. The said wiring board is located between the 1st, 2nd opening of the process chamber which has an electrode nozzle inside, and is located in any one of Claim 1, 2, 4 or 5, Process gas is sprayed toward the said wiring board from the said electrode nozzle, a voltage is applied to the said electrode nozzle, and a plasma is formed in the vicinity of the surface of the said wiring board, The surface treatment method of the wiring board. The surface treatment method of a wiring board according to claim 7, wherein the plasma is formed while injecting a moisture gas to the wiring board together with the processing gas. Forming a metal wiring layer on the surface of the substrate, Forming a protective layer patterned in a predetermined planar shape on at least part of the surface of the metallization layer, The metal wiring layer is patterned in the same planar shape as the protective layer to form a laminated film with the patterned protective layer and the metal wiring layer. After exposing the surface of the wiring board on which the substrate surface is exposed between the laminated films, on the side where the laminated film is formed, to the plasma, After removing the protective layer from the metal wiring layer, An adhesive is disposed on the surface of the metal wiring layer from which the protective layer has been removed and on the surface of the substrate positioned between the metal wiring layer, The electrical component is arrange | positioned on the surface where the adhesive agent of the said wiring board is arrange | positioned, and the said electrical component and the said wiring board are connected through the said adhesive agent, The manufacturing method of the electrical device characterized by the above-mentioned. A metal wiring layer patterned in a predetermined shape is disposed on the surface of the substrate, The cover film is disposed on the side of the side on which the metal wiring layer is disposed, After removing a portion of the cover film to expose a portion of the wiring board, After exposing the surface of the side of the wiring board on which the part is exposed to the plasma, An adhesive is disposed on the surface of the metal wiring layer of the portion where the cover film is removed and the surface of the substrate exposed between the metal wiring layer, The electrical component is arrange | positioned on the surface where the adhesive agent of the said wiring board is arrange | positioned, and the said electrical component and the said wiring board are connected through the said adhesive agent, The manufacturing method of the electrical device characterized by the above-mentioned. 4. The surface treatment method of a wiring board according to claim 3, wherein said base material is composed of a resin film. The said wiring board is located between the 1st, 2nd opening of the process chamber which has an electrode nozzle inside, Process gas is sprayed toward the said wiring board from the said electrode nozzle, a voltage is applied to the said electrode nozzle, and a plasma is formed in the vicinity of the surface of the said wiring board, The surface treatment method of the wiring board. The said wiring board is located between the 1st, 2nd opening of the process chamber which has an electrode nozzle inside, Process gas is sprayed toward the said wiring board from the said electrode nozzle, a voltage is applied to the said electrode nozzle, and a plasma is formed in the vicinity of the surface of the said wiring board, The surface treatment method of the wiring board.

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