HK1091086A1 - Surface treating method for wiring board and method for manufacturing electrical device - Google Patents

Surface treating method for wiring board and method for manufacturing electrical device

Info

Publication number
HK1091086A1
HK1091086A1 HK06111516.6A HK06111516A HK1091086A1 HK 1091086 A1 HK1091086 A1 HK 1091086A1 HK 06111516 A HK06111516 A HK 06111516A HK 1091086 A1 HK1091086 A1 HK 1091086A1
Authority
HK
Hong Kong
Prior art keywords
wiring board
electrical device
surface treating
manufacturing electrical
treating method
Prior art date
Application number
HK06111516.6A
Inventor
Masaru Ugajin
Original Assignee
Sony Chemicals & Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals & Information Device Corp filed Critical Sony Chemicals & Information Device Corp
Publication of HK1091086A1 publication Critical patent/HK1091086A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Plasma Technology (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
HK06111516.6A 2003-12-22 2006-10-19 Surface treating method for wiring board and method for manufacturing electrical device HK1091086A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003424027A JP2005183751A (en) 2003-12-22 2003-12-22 Surface processing method for wiring board and method for manufacturing electric apparatus
PCT/JP2004/018898 WO2005062686A1 (en) 2003-12-22 2004-12-17 Surface treating method for wiring board and method for manufacturing electrical device

Publications (1)

Publication Number Publication Date
HK1091086A1 true HK1091086A1 (en) 2007-01-05

Family

ID=34708773

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06111516.6A HK1091086A1 (en) 2003-12-22 2006-10-19 Surface treating method for wiring board and method for manufacturing electrical device

Country Status (6)

Country Link
JP (1) JP2005183751A (en)
KR (1) KR100988541B1 (en)
CN (1) CN1768558B (en)
HK (1) HK1091086A1 (en)
TW (1) TWI295313B (en)
WO (1) WO2005062686A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216468A (en) * 2005-02-04 2006-08-17 Toyohashi Univ Of Technology Plasma surface treatment method, plasma generation apparatus, and plasma surface treatment apparatus
WO2016179458A1 (en) * 2015-05-06 2016-11-10 Hutchinson Technology Incorporated Plasma treatments for flexures of hard disk drives
JP2022523709A (en) 2019-01-29 2022-04-26 ラム リサーチ コーポレーション Sacrificial protective layer for the environment-sensitive surface of the substrate
KR102665933B1 (en) 2020-05-12 2024-05-20 램 리써치 코포레이션 Controlled Degradation of Stimuli-Responsive Polymer Membranes
CN111770634B (en) * 2020-06-08 2022-04-29 上达电子（深圳）股份有限公司 Manufacturing method of FPC
US20240312778A1 (en) * 2020-09-10 2024-09-19 Lam Research Corporation Temporary capping material for oxide prevention in low temperature direct metal-metal bonding

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2681851B2 (en) * 1991-07-26 1997-11-26 東京応化工業株式会社 Method for manufacturing multilayer printed wiring board
JPH11214838A (en) 1998-01-27 1999-08-06 Matsushita Electric Works Ltd Production of circuit board
CN1174461C (en) * 2000-09-18 2004-11-03 友达光电股份有限公司 Plasma display
JP4089198B2 (en) * 2001-10-05 2008-05-28 凸版印刷株式会社 Manufacturing method of substrate for semiconductor device

Also Published As

Publication number Publication date
WO2005062686A1 (en) 2005-07-07
JP2005183751A (en) 2005-07-07
TWI295313B (en) 2008-04-01
KR20060113843A (en) 2006-11-03
KR100988541B1 (en) 2010-10-20
TW200521204A (en) 2005-07-01
CN1768558B (en) 2011-08-03
CN1768558A (en) 2006-05-03

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