TWI293365B - Electronic parts inspection system - Google Patents

Electronic parts inspection system Download PDF

Info

Publication number
TWI293365B
TWI293365B TW095106160A TW95106160A TWI293365B TW I293365 B TWI293365 B TW I293365B TW 095106160 A TW095106160 A TW 095106160A TW 95106160 A TW95106160 A TW 95106160A TW I293365 B TWI293365 B TW I293365B
Authority
TW
Taiwan
Prior art keywords
electronic component
electronic
electronic components
alignment
camera
Prior art date
Application number
TW095106160A
Other languages
Chinese (zh)
Other versions
TW200636756A (en
Inventor
Han-Jong Yoon
Dong-Hyun Kim
Eui-Jong Ahn
Jin-Suk Kim
Da-Hun Jung
Te-Bok Kim
Dong-Jae Jeong
Original Assignee
Win Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Win Tech Co Ltd filed Critical Win Tech Co Ltd
Publication of TW200636756A publication Critical patent/TW200636756A/en
Application granted granted Critical
Publication of TWI293365B publication Critical patent/TWI293365B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/0882Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such

Description

1293365 九、發明說明: 【發明所屬之技術領域】 本發明有關於一種電子部件(electronic parts)檢測系 統,尤其是有關於自動對準電子部件,進行優劣判斷,並 根據判斷結果排出、分類電子部件的電子部件對準裝置、 電子部件排出裝置及電子部件檢測系統。 【先前技術】 電子部件檢測系統是對多層陶瓷電容器(MLCC: multilayer ceramic capacit〇r)或類似的電子部件進行對準 及攝影,並且利用拍攝的影像判斷電子部件的優劣,之後 根據判斷結果,喷射壓縮空氣,自動分類電子部件的系統。 通常,如MLCC等電子部件都在上市之前必須進行尺 寸褎紋、鍍金量、鍍金面積等方面的優劣判斷。 如上用於電子部件的質量判斷的電子部件檢測系統的 現有技術已在韓國發明專利公開號及 2 0 0 4 - 8 2 5 6 4 所公開。 4疋現有的電子部件檢測系統的問題在於,在對電 子部件進行對進μ^ Λ 因此u ♦的過程中電子部件-直都處於振動狀態, 口此電子部件报難在穩定的狀態下對準。 ”並且’針對要檢測的電子部件物彳,根據-次性攝影 mm卩件的優劣,因此還存在t 斷的可選性較低的問題。 |仵貝里“ 爲了在根據電子部件優劣判斷結果排出電子部件而喷 5 1293365 射壓縮空氣的情況下,需要使用喷嘴,而空氣的移動路徑 較長,因此存在著從電磁(s〇lenoid)閥門到電子部件爲止所 發生壓縮空氣的時間延遲的問題。 【發明内容】 爲瞭解決上述問題,本發明提供一種電子産品對準裝 置及電子部件檢測系統,在電子部件供應部和對準機1293365 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic parts detecting system, and more particularly to automatically aligning electronic components, judging the advantages and disadvantages, and discharging and classifying electronic components according to the judgment result. The electronic component alignment device, the electronic component discharge device, and the electronic component detection system. [Prior Art] The electronic component detecting system aligns and photographs a multilayer ceramic capacitor (MLCC: multilayer ceramic capacit〇r) or the like, and judges the advantages and disadvantages of the electronic component by using the captured image, and then ejects according to the judgment result. Compressed air, a system that automatically classifies electronic components. Usually, electronic components such as MLCC must be judged before and after the market in terms of size, gold plating, and gold plating area. The prior art of the electronic component detecting system for the quality judgment of the electronic component as described above is disclosed in Korean Patent Publication No. WO-A No. 2000-82. 4. The problem with the existing electronic component inspection system is that during the process of aligning the electronic components, the electronic components are in a state of vibration, and the electronic components are difficult to align in a stable state. . "And 'for the electronic components to be detected, according to the advantages and disadvantages of the ------------------------------------------------------------------------------------------------------------------------------------------------------------------ When discharging electronic components and spraying 5 1293365 to emit compressed air, it is necessary to use a nozzle, and the moving path of air is long, so there is a problem of time delay of compressed air generated from an electromagnetic valve to an electronic component. . SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides an electronic product alignment device and an electronic component detecting system, in an electronic component supply portion and an alignment machine

(Aligner)之間形成無振動空間,使得電子産品在無振動狀 態下移送到對準機。 本發明的另一目的在於提供一種電子部件檢測系統, 根據在不同角度和照明條件下連續2次以上拍攝的同一電 子部件的影像,判斷該電子産品的優劣。 本發明的又一目的在於提供一種電子部件排出裝置及 電子部件檢測系統,省略了噴射壓縮空氣的噴嘴,以縮短 壓縮空氣從電磁閥門到電子部件的移動路徑。 本發明的其他目的及優點將在以下進行說明,並通過 實施例詳細說m,本發明的目的及優點也將能通過 申請專利範圍中的裝置及組合——實現。 爲了達到上述目的,本發明提供一種電子部件檢測系 統,其特點在於,包括··供應部,包括:纟納作爲優劣判 :的物件的多個電子部件的料斗;及至少—個依#振動依 人移运所述料斗提供的電子部件的送件部,·對準部,依靠 ^他電子。卩件的移動力以無振動狀態將所述供應部提供的 電子。卩件私运並對準;破璃圓盤,排列有通過所述對準部 6 1293365 對準的電子部件,並依靠發動機旋轉;位置檢測部,在排 列在所述玻璃圓盤上的電子部件通過時生成觸發信號,即 時生成隨著所述玻璃圓盤的旋轉而變化的編碼值·攝像 部,包括:攝像頭,拍攝所述玻璃圓盤上的電子部件的上 下左右四面;照明裝置,安裝在所述攝像頭上,給拍攝物 件電子部件提供照明;排出部,將形成有通孔的排出端相 鄰設置於所述電子部件,通過所述通孔選擇性噴射壓縮空 氣’分類並收集脫離玻璃圓盤的電子部件;控制部,利用 所述電子部件位置檢測部提供的觸發信號和編竭值,控制 所述攝像頭當所述電子部件到達電子部件攝像部的各個攝 像頭位置時依次拍攝電子部件的四面,獲得電子部件四面 的拍攝影像,通過拍攝影像判斷電子部件的優劣狀態,並 根據判斷結果控制所述排出部對所述電子部件進行分類。 所述電子部件對準部包括:無振動斜槽送件部 (chute),形成有接收所述電子部件供應部提供的電子部件 的線形槽;對準機,包括在同一水平面上以_定間隔相對 設置的兩個夾具,以引導並對準所述無振動斜槽送件部移 送的電子部件。 並且’所述夾具間間隔可根據所述電子部件的尺寸調 整。 所述對準機的夾具包括:對準端,其相對面的彎曲度 與玻璃圓盤的彎曲度相同,引導端,相對面的末端形成有 間隔大於所述對準端間隔的引導面,將所述無振動斜槽送 件部移送的電子部件引導到對準端。 7A vibration-free space is formed between the (Aligner) so that the electronic product is transferred to the alignment machine in a vibration-free state. Another object of the present invention is to provide an electronic component detecting system for judging the merits and demerits of the electronic component based on images of the same electronic component photographed two times or more under different angles and illumination conditions. Still another object of the present invention is to provide an electronic component discharge device and an electronic component detecting system, which omits nozzles for injecting compressed air to shorten a moving path of compressed air from an electromagnetic valve to an electronic component. Other objects and advantages of the present invention will be described in the following, and in detail, by way of example, the objects and advantages of the present invention will be realized by the means and combinations thereof. In order to achieve the above object, the present invention provides an electronic component detecting system, comprising: a supply unit, comprising: a hopper of a plurality of electronic components of Cannes as an object of good or bad; and at least one The person transports the delivery portion of the electronic component provided by the hopper, and the alignment portion depends on the electron. The moving force of the element transmits the electrons supplied from the supply portion in a vibration-free state. The slap is smuggled and aligned; the glass disc is arranged with electronic components aligned through the alignment portion 6 1293365 and is rotated by the engine; the position detecting portion is arranged on the electronic components of the glass disc When the trigger signal is generated, the code value and the imaging unit that change with the rotation of the glass disk are generated in real time, and include: a camera that captures the upper, lower, left, and right sides of the electronic component on the glass disk; and the illumination device is mounted on Illuminating the electronic component of the photographing object on the camera; and discharging the discharge end formed with the through hole adjacent to the electronic component, and selectively discharging the compressed air through the through hole to classify and collect the glass circle The electronic component of the disk; the control unit controls the camera to sequentially capture the four sides of the electronic component when the electronic component reaches the respective camera positions of the electronic component imaging unit by using the trigger signal and the edit value provided by the electronic component position detecting unit. Obtaining the image of the four sides of the electronic component, judging the pros and cons of the electronic component by shooting the image, and judging according to the judgment As a result, the discharge portion is controlled to classify the electronic components. The electronic component aligning portion includes: a vibration-free chute feeder portion formed with a linear groove for receiving an electronic component provided by the electronic component supply portion; and an aligning machine including _ spaced at a same horizontal plane Two clamps are disposed opposite to guide and align the electronic components transferred by the vibration-free chute delivery portion. And the inter-clamp spacing can be adjusted according to the size of the electronic component. The fixture of the alignment machine includes: an alignment end, the curvature of the opposite surface is the same as the curvature of the glass disk, and the leading end, the end of the opposite surface is formed with a guiding surface spaced apart from the spacing of the alignment end, The electronic component transferred by the vibration-free chute delivery portion is guided to the alignment end. 7

I293365 所述電子部件攝像部的照明裝置包括··半球形 板,形成有中空;多個發光器件端,沿著圍繞所述反 内部的中空的同心圓設置。 上述設置在位於玻璃圓盤外圓周外側的攝像頭上 明装置中,位於破璃圓盤下方的反射板部分與玻璃圓 方的反射板部分相比靠後設置。 上述發光器件由組合紅色LED、白色LED及藍色 的多個發光器件端組成。 並且,上述控制部具有2n種照明狀態,n =發光器 數。 並且,所述控制部可以通過控制所述電子部件攝 的各個攝像頭,在不同的角度將所述旋轉的玻璃圓盤 電子部件連續拍攝2次以上。 並且,所述控制部通過控制所述電子部件攝像部 明裝置,使得每次連續拍攝時都呈現不同的照明狀態 所述排出部包括:至少一個電磁閥門,用於控制 二氣的流動,送氣管’連接於所述電磁閥門;排出端 口連接於所述送氣管,出口形成有向所述玻璃圓盤上 子部件嘴射壓縮空氣的通孔;及收納盒,利用壓縮空 集脫離玻璃圓盤的電子部件。 爲了達到上述目的,本發明提供一種電子部件對 置,對準排列在電子部件檢測系統中旋轉的玻璃圓盤 電子部件,該電子部件對準裝置包括:無振動斜槽送卡 形成有接收所述電子部件供應部提供的電子部件的 反射 射板 的照 盤上 LED 件端 像部 上的 的照 〇 壓縮 ,入 的電 氣收 準襞 上的 1部, 線形 8 1293365 槽;對準機,包括在同一水平面上以一定間隔相對設置的 兩個夾具,以引導並對準所述無振動斜槽送件部移送的電 子部件,位於所述線形槽内的電子部件依靠因振動而移動 的其他電子部件的移動力,以無振動狀態移送。 爲暸解決上述目的,本發明提供一種電子部件排出裝 置,用於在電子部件檢測系統中根據電子産品的優劣判斷 結果排出排列板上的電子部件,該電子部件排出裝置包括 兩個以上排出模組,該排出模組包括:至少一個電磁闊門, 用於控制塵縮空氣的流動;送氣管,連接於所述電磁闊門; 排出端,入口連接於所述送氣管,出口形成有向所述玻璃 圓盤上的電子部件噴射壓縮空氣的通孔;及收納盒,利用 壓縮空氣收集脫離玻璃圓盤的電子部件,所述排出端上的 通孔與所述排列板上的電子部件相鄰,通過所述通孔選擇 性喷射壓縮空氣。 電子部件排出裝置及電 本發明的電子部件對準裝置、 子部件檢測系統的功效如下: 第一,在電子部件供應部和對準機之間形成無振動區 間’使得電子産品在無振動狀態下移送到對準機,因此可 以更穩定地實現對準’㈣使得電子部件的攝像及排出等 電 而 子部件優劣判斷更加容易。 第二,以在不同的角度和照明條 電子部件的影像爲根據,進行電子 可提局電子部件優劣判斷的選擇性 件下連續2次拍攝同 産品優劣的判斷,從 〇The illumination device of the electronic component imaging unit of I293365 comprises a hemispherical plate formed with a hollow; a plurality of light emitting device ends disposed along a hollow concentric circle surrounding the opposite inner portion. The above arrangement is provided in the camera upper device located outside the outer circumference of the glass disk, and the portion of the reflecting plate located below the glass disk is disposed later than the portion of the reflecting plate of the glass circle. The above-mentioned light emitting device is composed of a plurality of light emitting device terminals combining a red LED, a white LED and blue. Further, the control unit has 2n illumination states, and n = the number of illuminators. Further, the control unit may continuously scan the rotating glass disk electronic component twice or more at different angles by controlling the respective cameras captured by the electronic component. And the control unit controls the electronic component imaging unit to display different illumination states each time the continuous shooting is performed. The discharging portion includes: at least one electromagnetic valve for controlling the flow of the two gases, the air supply pipe Connecting to the electromagnetic valve; the discharge port is connected to the air supply pipe, the outlet is formed with a through hole for emitting compressed air to the nozzle of the glass disk; and the storage box is separated from the glass disk by the compressed air set Electronic components. In order to achieve the above object, the present invention provides a glass disk electronic component that is opposite to an electronic component and that is aligned and rotated in an electronic component detecting system. The electronic component aligning device includes: a vibrationless chute card is formed to receive the The electronic component supply unit provides the reflection plate of the electronic component on the illumination plate of the LED device, and the image on the image of the end of the LED device is compressed, and the upper portion of the electrical registration plate is arranged in a linear shape, and the alignment device is included in the alignment machine. Two clamps disposed at opposite intervals on the same horizontal surface to guide and align the electronic components transferred by the vibration-free chute delivery portion, and the electronic components located in the linear grooves depend on other electronic components that move due to vibration The moving force is transferred without vibration. In order to solve the above object, the present invention provides an electronic component discharge device for discharging an electronic component on an alignment board according to a judgment result of an electronic product in an electronic component detecting system, the electronic component discharge device including two or more discharge modules The discharge module includes: at least one electromagnetic wide door for controlling the flow of the dust-reduced air; an air supply pipe connected to the electromagnetic wide door; a discharge end, the inlet is connected to the air supply pipe, and the outlet is formed to be An electronic component on the glass disk ejects a through hole of the compressed air; and a storage box that collects the electronic component that is detached from the glass disk by using compressed air, and the through hole on the discharge end is adjacent to the electronic component on the aligning plate, The compressed air is selectively injected through the through holes. The electronic component discharge device and the electronic component alignment device and the sub-component detection system of the present invention have the following effects: First, a vibration-free section is formed between the electronic component supply portion and the alignment machine so that the electronic product is in a vibration-free state. It is transferred to the alignment machine, so that the alignment can be more stably achieved. (4) It is easier to judge the advantages and disadvantages of the sub-components by imaging and discharging the electronic components. Secondly, based on the image of the electronic components at different angles and lighting strips, the judgement of the quality of the electronic components can be judged in two consecutive times.

省略了噴射壓縮空氣的噴嘴 縮短了從電磁閥 9The nozzle that sprays compressed air is omitted, and the slave solenoid valve is shortened.

1293365 門到電子部件的壓縮空氣的移動路徑,從而提高了排出反 應速度,可穩定地排出並收集電子部件。 【實施方式】 以下參照附圖將具體說明本發明的實施例。本說明書 及申請專利範圍第項中使用的用語或單詞並不限定在通用 或詞典中的意義,應在發明人以最佳方法說明技術方案並 適*地定義各種用語的概念的原則下,解釋爲符合本發明 的技術方案的意義和概念。 並且’本發明說明書中的實施例和附圖中的各種結構 僅爲最佳實施例,並不能限定本發明的技術思想,而且可 以進行各種變形和替換。 第1圖爲本發明中一實施例的電子部件檢測系統的平 面不意圖。如圖所示,電子部件檢測系統包括··電子部件 供應部100、電子部件對準部200、玻璃圓盤300、電子部 件位置檢測部、電子部件攝像部500、電子部件排出部6〇〇 及控制部(未圖示)。 在此’電子部件爲多層陶瓷電容器(MLCC : Multilayer ceramic capacitor)及類似的晶片類型的陶瓷零部件。檢測 則是根據晶片外露(c h i ρ 〇 u t s)、裂紋(c r a c k s)等陶兗缺陷 (ceramic defects)、刮痕(scratches)等端子缺陷(termination defects)及因長度、厚度、幅度誤差而發生的尺寸缺陷 (dimension defects)等電子部件上的各種缺陷,判斷電子部 件的優劣而進行分類的工作。 10 1293365 上述電子部件供應部100是依次提供(feeding)作爲優 】斷的物件的多個電子部件的結構,包括·容納多個電 子部件的料斗(h〇Pper)11G;及至少一個利用振動依次移動 由料斗110提供的電子産品的送件部(fader)12()、13〇。 在本貝施例中提供的電子部件供應部丨〇 〇包括:根據 磁鐵的吸力及排斥力實現振動的振動送件部(B〇wi feeder)120和直線送件部(Unear feeder)13〇,但該供應部 1 〇〇的結構也並不限定於此,也可以利用可同時依次提供 多個電子部件的其他提供手段。直線提供裝置13〇包括蓋 體1 3 2 ’以防止部件在移動過程中因振動而脫離爲佳。 上述電子部件對準邬丨2〇是以無振動狀態將電子部件 供應部1 00提供的電子部件進行對準排列的結構,包括無 振動斜槽送件部(chute)(如第2圖中的21〇)和由兩個夾具 (jig)構成地對準機(如第2圖中的22〇)。在本實施例中僅圖 示0又置有一個電子部件對準機1 2 〇的情況,但是如果電子 部件對準的精確度較高,則也可以設置一個以上的電子部 件對準部1 20。電子部件對準部的結構及動作將結合第2 圖及第3圖進行具體說明。 上述玻璃圓盤300用於放置通過電子部件對準機12〇 對準的電子部件,利用發動機(未圖示)以一定的速度旋 轉。隨著玻璃圓盤300的旋轉,排列在玻璃圓盤3 〇〇上的 電子部件也隨之旋轉,玻璃圓盤300上的電子部件的上下 左右四面的狀態可以被設置在適當位置上的電子部件攝像 部5 00拍攝。1293365 The moving path of the compressed air from the door to the electronic component, thereby increasing the discharge reaction speed and stably discharging and collecting electronic components. [Embodiment] Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. The terms or words used in the specification and the scope of the patent application are not limited to the meanings in the general or the dictionary, and should be explained under the principle that the inventor best describes the technical solutions and appropriately defines the concepts of various terms. In order to comply with the meaning and concept of the technical solution of the present invention. And the various structures in the embodiments of the present invention and the drawings are merely preferred embodiments, and the technical idea of the present invention is not limited, and various modifications and substitutions are possible. Fig. 1 is a plan view showing an electronic component detecting system in accordance with an embodiment of the present invention. As shown in the figure, the electronic component detecting system includes an electronic component supply unit 100, an electronic component alignment unit 200, a glass disk 300, an electronic component position detecting unit, an electronic component imaging unit 500, and an electronic component discharging unit 6 Control unit (not shown). Here, the electronic component is a ceramic component of a multilayer ceramic capacitor (MLCC: Multilayer ceramic capacitor) and the like. The detection is based on chip defects such as ceramic defects such as chi ρ 〇 uts, cracks, and the like. Termination defects such as scratch defects and length, thickness, and amplitude errors. Various defects in electronic components such as defects and defects, and the work of classifying the quality of the electronic components. 10 1293365 The above-described electronic component supply unit 100 is configured to sequentially feed a plurality of electronic components as excellent objects, including a hopper (h〇Pper) 11G accommodating a plurality of electronic components; and at least one using vibration sequentially The faders 12(), 13〇 of the electronic product provided by the hopper 110 are moved. The electronic component supply unit 提供 provided in the embodiment of the present invention includes a vibration feeding unit (120) and an unear feeder (13) which are vibrated according to the suction and repulsive force of the magnet. However, the configuration of the supply unit 1 is not limited thereto, and other means for providing a plurality of electronic components in order may be used. The linear providing means 13 includes a cover 1 3 2 ' to prevent the components from being detached by vibration during the movement. The electronic component alignment unit 结构2〇 is configured to align the electronic components provided by the electronic component supply unit 100 in a vibration-free state, and includes a vibration-free chute feeder portion (as shown in FIG. 2). 21〇) and an alignment machine consisting of two jigs (such as 22〇 in Fig. 2). In the present embodiment, only the case where one electronic component is aligned with the machine 1 2 is placed, but if the accuracy of the alignment of the electronic components is high, more than one electronic component alignment portion 1 20 may be provided. . The structure and operation of the electronic component alignment portion will be specifically described with reference to FIGS. 2 and 3 . The glass disk 300 is used to place electronic components aligned by the electronic component aligning machine 12, and is rotated at a constant speed by an engine (not shown). As the glass disk 300 rotates, the electronic components arranged on the glass disk 3 are also rotated, and the upper, lower, left, and right sides of the electronic components on the glass disk 300 can be placed in appropriate positions. The imaging unit takes a picture of 500.

I293365 電子部件的底面是指接觸於玻璃 子部件的頂面是與底面相反的一面, 從破璃圓盤3 00的外圓周面外側觀察 的右面爲左面的相反一面。 上述電子部件位置怜測部用於生 3 0 〇上的電子部件位置的信號,傳送每 成觸發信號的觸發感測器400和即時 (未圖示)。 編碼值是對應玻璃圓盤3 〇 〇的旋葬 衝數,提供可以判斷電子部件的位置、 像頭的位置及排出電子部件的通孔的必 可以以基準點(例如觸發感測器400爲 3〇〇的旋轉角度的增加而逐漸增加。免 度可以根據電子部件的尺寸進行調節。 另一方面,電子部件攝像部500的 部件排出部6 0 0的通孔(出口)位置Ί (offset pulse)數來進行限定。例如,第 可以觸發感測器4 0 〇爲准,賦予1 ο 〇個 也就是說’觸發感测器400在排列 的電子部件通過觸發感測器4〇〇時生成 控制邛,編碼即時向控制部傳送相當於 轉角度的脈衝數。 心电于邵件攝像部500用 電子部件的上下力 卜左右四面,包栝 1盤300的一面,電 t子部件的左面是可 J的一面,電子部件 成可判斷玻璃圓盤 ^控制部,包括:生 •生成編碼值的編碼 速度提前分配的脈 拍攝電子部件的攝 [置的資訊。脈衝數 基準)隨著玻璃圓盤 ‘配脈衝數的旋轉角 f攝像頭位置及電子 T以通過偏移脈衝 一個攝像頭的位置 脈衝的偏移.° 在玻璃圓盤300上 觸發信號,傳送給 玻璃圓盤300的旋 玻璃圓盤300上的 攝像頭;及設置於 12 1293365 象頭上’給要拍攝的電子部件提供照明的照明裝置 圖中52〇)。電子部件攝像部500應設置在適合拍 電子邛件的上下左右四面的恰當位置上。 象碩每秘可獲# 1 20幀的影像,可連續2次高速拍 /、子。P件的所需拍攝面爲佳。此時,通過連續拍攝可以 θ八Μ在旋轉的玻璃圓盤3〇〇上的電子部件的需拍攝面 在其他角度上的拍攝效果。,p,連續拍攝的影像可以提高 對電子部件優劣性的判斷效果。 攝像頭可以^ 640 x彻像素(pixels)的电荷搞合器 —(D Charge coupkd device)。但是,攝像頭並沒有限The bottom surface of the I293365 electronic component means that the top surface contacting the glass sub-assembly is opposite to the bottom surface, and the right side viewed from the outer side of the outer circumferential surface of the glass disc 300 is the opposite side to the left. The electronic component position measuring unit is configured to generate a signal of the position of the electronic component on the 30 〇, and transmit the trigger sensor 400 and the instant (not shown) for each of the trigger signals. The coded value is the number of blasting impulses corresponding to the glass disk 3 ,, providing a reference point for determining the position of the electronic component, the position of the image head, and the through hole for discharging the electronic component (for example, the trigger sensor 400 is 3) The degree of rotation of the crucible is gradually increased. The degree of freedom can be adjusted according to the size of the electronic component. On the other hand, the through hole (outlet) position Ί (offset pulse) of the component discharge portion 600 of the electronic component imaging unit 500. For example, the sensor 4 0 触发 can be triggered to give 1 ο 〇, that is, the trigger sensor 400 generates control when the arranged electronic components pass the trigger sensor 4 邛The code immediately transmits the number of pulses corresponding to the rotation angle to the control unit. The electrocardiogram is applied to the left and right sides of the electronic component by the upper and lower sides of the electronic component, and the left side of the electric t sub-assembly is J. On one side, the electronic component can be judged by the glass disc ^ control section, including: the generation of the pulsed electronic component of the coded speed of the generated code value is assigned in advance [set information. Pulse number reference) The glass disk 'equalizes the rotation angle of the pulse number f camera position and the electron T to offset the pulse of the position of one camera by the offset pulse. The trigger signal on the glass disk 300 is transmitted to the glass circle of the glass disk 300 The camera on the disc 300; and 52 〇 in the illuminating device on the 12 1293365 head that provides illumination for the electronic components to be photographed. The electronic component imaging unit 500 should be placed at an appropriate position on the upper, lower, left, and right sides of the electronic component. Like Shuo, you can get #1 20 frames of images, and you can take 2 shots at a high speed. The desired shooting surface of the P piece is preferred. At this time, by continuous shooting, the photographing surface of the electronic component on the rotating glass disk 3〇〇 can be photographed at other angles. , p, continuous shooting images can improve the judgment of the advantages and disadvantages of electronic components. The camera can be a 640 x pixel charge collector (D Charge coupkd device). However, the camera is not limited

疋;此根據電子部件的尺寸及玻璃圓盤3 〇〇的旋轉速度 適當選擇。日召明劈:gL …、、的'、、σ構及運行將在以下結合第4圖及 第5圖具體說明。 上述電子部件排出部6〇〇用於根據控制部的優劣判斷 W ’利用壓縮空氣排出並分類電子部件,包括··控制壓 縮工氣的肌動的電磁閥門(如第7圖中612广送氣管(第7 圖中1 4) ’形成由通孔的排出端6 1 6及收集被排出的電子 部件的收納盒(第6圖中618)。電子部件排出部的結構及 運行情況將結合第6圖至第8圖具體說明。 上述控制部(未圖示)基於電子部件位置檢測部發送的 ‘號&制電子邛件攝像部5 〇〇的攝像頭、照明裝置及電 子邠件排出邠600的電磁閥門,可以是包括:控制攝像頭 而ί又取拍攝衫像的影像處理器;接收觸發信號,旋轉玻璃 圓盤300的發動機(未圖示);送件部(12〇、13〇);控制照 13疋; this is appropriately selected according to the size of the electronic component and the rotational speed of the glass disk 3 〇〇. The call of the Japanese syllabus: the ', σ structure and operation of gL ..., , will be specifically described below in conjunction with Figs. 4 and 5. The electronic component discharge unit 6 is configured to determine, according to the merits of the control unit, W 'discharge and classify the electronic components by using compressed air, including: an electromagnetic valve that controls the movement of the compressed working gas (such as the 612 wide air supply pipe in FIG. 7) (1 4 in Fig. 7) 'The storage case (the 618 in Fig. 6) which is formed by the discharge end of the through hole and the electronic component to be discharged is formed. The structure and operation of the electronic component discharge unit will be combined with the sixth. The control unit (not shown) is based on the camera, the illumination device, and the electronic component discharge port 600 of the 'number & electronic component imaging unit 5' transmitted by the electronic component position detecting unit. The electromagnetic valve may be an image processor including: a camera for controlling the camera and a camera image; an engine (not shown) that receives the trigger signal, rotates the glass disk 300; and a delivery unit (12〇, 13〇); Photo 13

1293365 明裝置及電磁閥門的輸入/輸出(ι/ο)控制器;接收 碼發送的編碼值的編碼前臺部;及提供使用者介 器的電腦。 控制部利《 t子部件位置檢測部發送的觸發 碼值控制電子部件攝像部500的各個攝像頭,使 的:子部件到達電子部件攝像部5〇〇的各個攝偉 :-人拍攝電子部件的四面,根據拍攝影像判斷電 俊劣It况,並根據判斷結果控制電子部件排出部 、閥門將電子部件收集到收納盒内進行分類。 更具體地說明攝像頭控制,則控制部將接收 置檢測σ卩發送的觸發信號時的編碼值設定爲要 子部件的編碼值,在設定的該編碼值基礎上,如 相當於分配給電子部件攝像部500的各個攝像頭 偏移編碼值的數值,則控制電子部件攝像部500: 利用相同的方法也可以控制電磁閥門。即, ^部件的編碼值基礎上,增加相當於分配給電子 j 600的各個通孔出口位置的偏移⑽編碼僅 部控制電子部件排出部6〇〇的電磁閥門,從相應 口噴射壓縮空氣。 ^下將具體說明電子部件對準部的結構及運^ 第2圖爲本發明一實施例的電子部件對準部 圖所不,電子部件對準部2 〇 〇位於玻璃圓盤上 動斜槽送件部21〇可與對準機22〇相鄰設置。對 的夾具221、222的設置位置低於(靠近玻璃圓盤面 並處理編 面的顯示 信號和編 .得要拍攝 -頭位置後 :子部件的 ί 600的電 .電子部件 -拍攝的電 果增加了 位置上的 ΐ行拍攝。 在相應電 部件排出 〔,則控制 通孔的出 r亍情況。 示意圖。 方,無振 準機220 1 )無振動 141293365 Input/output (ι/ο) controller for the display unit and solenoid valve; coded foreground unit for receiving the coded value of the code; and computer for providing the user interface. The control unit controls the respective camera positions of the electronic component imaging unit 500 by the trigger code value transmitted by the t sub-component position detecting unit, so that the sub-components reach the respective cameras of the electronic component imaging unit 5: the four sides of the human-captured electronic component According to the captured image, the electric condition is judged, and the electronic component discharge unit and the valve are controlled according to the judgment result, and the electronic component is collected in the storage box for classification. More specifically, the control unit sets the code value when the trigger signal for detecting σ卩 is received as the code value of the sub-component, and based on the set code value, the image is assigned to the electronic component. When the respective cameras of the unit 500 shift the value of the encoded value, the electronic component imaging unit 500 is controlled: the electromagnetic valve can be controlled by the same method. Namely, based on the code value of the component, an offset (10) corresponding to the position of each of the through holes of the electron j 600 is added to encode an electromagnetic valve which only controls the electronic component discharge portion 6A, and the compressed air is ejected from the corresponding port. The structure and operation of the electronic component aligning portion will be specifically described. FIG. 2 is a view showing the alignment of the electronic component according to an embodiment of the present invention. The electronic component aligning portion 2 is located on the glass disk. The delivery portion 21A can be disposed adjacent to the alignment machine 22A. The set positions of the pair of clamps 221, 222 are lower than (close to the glass disk surface and process the display signal of the braided surface and edited to be photographed - after the head position: the electric component of the sub-component ί 600. The electronic component - the electric fruit photographed Increased the position of the limp shooting. Discharge the corresponding electrical components [, then control the outflow of the through hole. Schematic. Square, no vibrator 220 1) no vibration 14

1293365 斜槽送件部2 1 〇的直線槽2 1 2爲佳。 無振動斜槽送件部21〇和對準機22〇可 上移動並選擇位置,爲此還可以包括可調整 調節螺釘。 無振動斜槽送件部210的直線槽212接 供應部利用振動移送過來的電子部件。此時 斜槽送件部210的直線槽212内的電子部件 應部不同,是以無振動狀態被移送。 也就是說’位於直線槽2 1 2的電子部件 件供應部依次移送的其他電子部件,即位於 部的電子部件的移動力,以無振動狀態被移 下的電子部件移送相比,無振動狀態的電 月&穩定地將電子部件供應給對準機2 2 〇。 電子部件受到後方電子部件的推力通過 件部2 1 0的直線槽2丨2之後,落在低於直線 圓盤上’隨著玻璃圓盤的旋轉而通過對準機 對準機220包括在同一水平面上具有一 设置的兩個夾具(jig)22 1、222,引導並對準 送件部210移送過來的電子部件。夾具221、 隔可以根據要檢測的電子部件的尺寸進行調 以下將更具體地說明對準機的結構及電 準機後被對準的過程。 第3圖爲構成對準機的兩個夾具的橫向 所示,對準機的夾具221、222包括:引導降 在X Y Z 3車由向 3轴向移動的 收由電子部件 ,位於無振動 與電子部件供 根據從電子部 電子部件供應 送。與振動狀 子部件移送更 無振動斜槽送 槽2 1 2的玻璃 220 〇 定間隔、相對 從無振動斜槽 2 22之間的間 整。 子部件通過對 截面圖。如圖 落的電子部件 151293365 The chute feed unit 2 1 〇 linear groove 2 1 2 is preferred. The vibration-free chute delivery portion 21A and the alignment machine 22A can be moved up and selected for position, and an adjustable adjustment screw can also be included for this purpose. The linear groove 212 of the vibration-free chute delivery portion 210 is connected to an electronic component that is supplied by the supply portion by vibration. At this time, the electronic component in the linear groove 212 of the chute feeding portion 210 is different in the portion to be transferred, and is transferred without vibration. That is to say, the other electronic components that are sequentially transferred by the electronic component supply portion of the linear groove 2 1 2, that is, the moving force of the electronic component located at the portion, are transferred without being vibrated compared to the electronic component that is removed without vibration. The electric moon & steadily supplies the electronic components to the alignment machine 2 2 〇. After the electronic component is subjected to the thrust of the rear electronic component through the linear groove 2丨2 of the member portion 210, it falls on the lower linear disk. The same is included in the same through the alignment machine alignment machine 220 as the glass disk rotates. There are two jigs 22 1 and 222 disposed on the horizontal surface to guide and align the electronic components transferred from the feeder portion 210. The jig 221 and the partition can be adjusted in accordance with the size of the electronic component to be detected. Hereinafter, the structure of the aligning machine and the process of alignment after the motor are more specifically explained. Figure 3 is a horizontal view of the two clamps constituting the alignment machine. The clamps 221, 222 of the alignment machine include: a receiving electronic component that is guided to move in the XYZ 3 vehicle from the axial direction to the third direction, and is located in the absence of vibration and electrons. The components are supplied in accordance with the electronic components supplied from the electronic part. More vibration-free sub-assembly transfer. Non-vibration chute feed slot 2 1 2 glass 220 〇 Interval, relative from the vibration-free chute 2 22 between the two. The subassembly passes through the cross section. As shown in the figure, the electronic components 15

1293365 10的引導端225、226和對準電子部件的對準端223、224。 引導端225、226在相對一面的末端形成其間隔大於對 準端223、224之間的間隔的引導面,以將電子部件1〇引 導到對準端223、224。從無振動斜槽送件部降落到玻璃圓 盤3 00的電子部件10隨著玻璃圓盤300的旋轉到達對準端 的引導端225、226,引導端225、226的引導面起到將降 落時脫離正常執迹的電子部件正確引導到對準端223、224 的作用。 並且,對準端223、224的相對面具有與玻璃圓盤3〇〇 的彎曲度相同的彎曲度。這樣,電子部件1 0在通過對準端 22 3、224時隨著與玻璃圓盤300具有相同彎曲度的軌迹對 準排列在玻璃圓盤300上。 以下具體說明電子部件攝像部中照明裝置的結構及運 行原理。 第4圖爲第1圖中電子部件檢測系統的電子部件攝像 部照明裝置的示意圖。如圖所示,照明裝置5 2 0包括:形 成有中空部528的半球形反射板527和設置在反射板527 内部的多個發光器件端(521至526)。在此,發光器件端(521 至5 26)是沿著反射板527内部的圍繞中空528的同心圓設 置有如LED的多個發光器件。 發光器件端(521至526)可以爲多個,發光器件端(52 } 至5 26)的LED可以是紅色、白色或藍色LED。之所以以 紅色、白色、藍色LED構成發光器件端(521至526)使得 各個發光器件端(521至526)呈現不同的照明效果,是因爲 16 1293365 檢測物件電子部件的顏色及缺點在特定顏色的照明下會更 加明顯。 例如,電子部件10的本體顏色爲白色或者灰色系,則 在紅色照明狀態下其缺陷會更加明顯,如果電子部件ι〇 的本體顏色爲黑色系,則在白色照明狀態下其缺陷更加明 顯0 在本實施例中例舉了從外圓周到中空部528爲止而形 成由1端到6端的發光器件端(521至526)的情況。如果照 明裝置具有六端發光器件端(521至526),則各個發光器件 端(521至526)可以開關(0N/0FF)而組合的照明狀態有/ =64(2n,n =發光器件端數)種。在此,照明狀態是指通過 各個發光器件端(521至526)的開關(〇N/OFF)組合呈現的 照明的量度、色度等狀態。 知、明裝置的照明狀態可以通過可調型(v〇lume type)的 手動凋節方式和利用控制部的自動調節方式進行控制,根 據測試值和檢測物件電子部件10,選擇最佳狀態。 另一方面’控制部可以控制攝像頭在不同的角度將排 :在旋轉的玻璃圓盤30G上的電子部件1〇分別連續拍攝2 人以上’控制照明褒置在每個拍攝時期都呈現不同的照明 丁僻啄邵照明裝置中位於玻璃圓盤外圓 周面外側(電子部杜 牛右側)的照明裝置進行說明。此時,照 明裝置以玻璃圓盤爲 上… 為准,位於破璃圓盤下方的反射板部分 相對玻璃圓盤上方的 的反射板部分靠後設置爲佳。這是爲了 17 1293365The leading ends 225, 226 of the 1293365 10 and the alignment ends 223, 224 of the alignment electronics. The leading ends 225, 226 are formed at the ends of the opposite side with a guiding surface spaced apart from the spacing between the alignment ends 223, 224 to direct the electronic component 1 to the alignment ends 223, 224. The electronic component 10 that has descended from the non-vibration chute portion to the glass disk 3 00 reaches the leading end of the guiding end 225, 226 as the glass disk 300 rotates, and the guiding faces of the guiding ends 225, 226 are to be lowered. The electronic components that are out of normal behavior are properly guided to the alignment ends 223, 224. Further, the opposite faces of the alignment ends 223, 224 have the same degree of curvature as the curvature of the glass disk 3''. Thus, the electronic component 10 is aligned on the glass disk 300 as it passes through the alignment ends 22 3, 224 with the same curvature as the glass disk 300. The structure and operation principle of the illumination device in the electronic component imaging unit will be specifically described below. Fig. 4 is a view showing the illumination device of the electronic component imaging unit of the electronic component detecting system in Fig. 1. As shown, the illumination device 520 includes a hemispherical reflecting plate 527 formed with a hollow portion 528 and a plurality of light emitting device ends (521 to 526) disposed inside the reflecting plate 527. Here, the light emitting device terminals (521 to 526) are a plurality of light emitting devices such as LEDs disposed along concentric circles around the hollow 528 inside the reflecting plate 527. The light emitting device terminals (521 to 526) may be plural, and the LEDs of the light emitting device terminals (52 } to 5 26) may be red, white or blue LEDs. The reason why the red, white, and blue LEDs constitute the light emitting device terminals (521 to 526) is that the respective light emitting device terminals (521 to 526) exhibit different illumination effects because 16 1293365 detects the color and defects of the object electronic components in a specific color. The lighting will be more obvious. For example, if the body color of the electronic component 10 is white or gray, the defect is more obvious in the red illumination state. If the body color of the electronic component is black, the defect is more obvious in the white illumination state. In the present embodiment, the case where the light-emitting device terminals (521 to 526) from the one end to the sixth end are formed from the outer circumference to the hollow portion 528 is exemplified. If the illumination device has six-terminal light emitting device terminals (521 to 526), the respective light emitting device terminals (521 to 526) can be switched (0N/0FF) and the combined illumination state is /=64 (2n, n = number of light emitting devices ) kind. Here, the illumination state refers to a state of measurement, chromaticity, and the like of the illumination which is presented by a combination of switches (〇N/OFF) of the respective light emitting device terminals (521 to 526). The illumination state of the device can be controlled by the manual mode of the adjustable type and the automatic adjustment mode of the control unit, and the optimum state is selected based on the test value and the electronic component 10 of the detection object. On the other hand, the control unit can control the camera to be arranged at different angles: the electronic components 1 on the rotating glass disk 30G are continuously shot for 2 or more people respectively. The control lighting device displays different illuminations at each shooting time. The illuminating device located on the outer side of the outer circumferential surface of the glass disk (the right side of the electronic section Du Niu) in the Dinggeo Shao lighting device will be described. At this time, the illumination device is based on the glass disk, and the portion of the reflector located below the glass disk is preferably disposed rearward relative to the portion of the reflector above the glass disk. This is for 17 1293365

校正破螭圓盤下方的反射板部分的照明遂過玻璃圓盤照射 電子部件時産生的透射光折射現象。第5圖示出了電子部 件攝像部的照明裝置中位於玻璃圓盤外圓周外側(電子部 件右側)的照明裝置。在遺裏,L是下方反射板部分與上方 反射板部分靠後設置的距離。 以下具體說明電子部件排出部的結構及運行原理。 第6圖爲本發明一實施例中電子部件排出部的示意 圖,第7圖爲電子部件排出部的正面示意圖;第8圖爲第 7圖所示電子部件排出部的A-A,截面圖。參照第6圖至第 8圖,電子部件排出部6 〇 〇可以包括2個以上的排出模組 6 1 〇 ’分別分配給優良品或不良品。排出模組6丨〇包括:電 磁闕門612、排出端616、送氣管614及收納盒618。 電磁閥門612控制由外部提供的壓縮空氣(air)的流 I。排出端616形成由通孔617,通孔617的入口通過送 氣管614連接於電磁閥門612,通孔617的出口與排列在 玻璃圓盤300上的電子部件1〇相鄰。通孔617的出口設置 有收集電子部件的收納盒6 1 8。 控制部(未圖示)根據分配給相應電子部件1〇 的編石馬 值、分配給通孔 617的出口的編碼偏移值(offset encoder v a 1 u e)及對該電子部件 電磁閥門612。通過控 間,壓縮空氣隨著送氣 1 〇的優劣判斷結果,選擇性地控制 制部的控制開放電磁閥門612的瞬 管614流入通孔616的入口,從出 口喷射出來。壓縮空氣噴射時,設置於通孔的出 子部件1 0被收集到收納盒6丨8。 前的電 18The illumination of the portion of the reflector below the tamper disc is corrected for the transmitted light refraction that occurs when the glass disc illuminates the electronic component. Fig. 5 is a view showing an illumination device located outside the outer circumference of the glass disk (on the right side of the electronic component) in the illumination device of the electronic component imaging unit. In the past, L is the distance behind the lower reflector portion and the upper reflector portion. The structure and operation principle of the electronic component discharge portion will be specifically described below. Fig. 6 is a schematic view showing an electronic component discharge portion according to an embodiment of the present invention, Fig. 7 is a front view showing the electronic component discharge portion, and Fig. 8 is a cross-sectional view taken along line A-A of the electronic component discharge portion shown in Fig. 7. Referring to Figs. 6 to 8, the electronic component discharge portion 6 〇 〇 may include two or more discharge modules 6 1 〇 ' respectively assigned to a good product or a defective product. The discharge module 6A includes an electromagnetic pickup 612, a discharge end 616, an air supply pipe 614, and a storage case 618. The solenoid valve 612 controls the flow I of the compressed air supplied from the outside. The discharge end 616 is formed by a through hole 617, and the inlet of the through hole 617 is connected to the electromagnetic valve 612 through a gas supply pipe 614, and the outlet of the through hole 617 is adjacent to the electronic component 1A arranged on the glass disk 300. The outlet of the through hole 617 is provided with a storage case 618 for collecting electronic components. The control unit (not shown) outputs a code offset value (offset encoder v a 1 u e) assigned to the outlet of the through hole 617 and an electromagnetic valve 612 to the electronic component based on the coded horse value assigned to the corresponding electronic component 1A. Through the control, the compressed air is selectively judged as a result of the merit of the air supply 1 ,, and the instantaneous tube 614 of the control open electromagnetic valve 612 is selectively controlled to flow into the inlet of the through hole 616 to be ejected from the outlet. At the time of the compressed air injection, the outlet member 10 provided in the through hole is collected to the storage case 6丨8. Front electricity 18

1293365 並且在本實施例中,排出端6 1 6與現有技術不同,並 不是通過另外設置的喷嘴喷射壓縮空氣,通過形成在排出 端616的通孔617直接喷射壓縮空氣。通孔617的出口與 玻璃圓盤3 00上的電子部件1 0相鄰,則與現有技術相比, 壓縮空氣移動的路徑縮短相當於包括喷嘴的長度的距離。 即,可以縮短從電磁閥門6 1 2到物件電子部件1 0的壓縮空 氣到達時間。 如上情況下,電磁閥門6 1 2 —打開,則壓縮空氣被喷 射可立即排出電子部件1 〇,因此可以提高排出速度及排出 的準確性。 形成於排出端6 1 6的通孔6 1 7的尺寸可以根據電子部 件1 0的尺寸適當選擇,考慮到通孔的鑽孔工作的方便性, 通孔61 7的出口側末端可以與玻璃圓盤3 00形成小於20 度的角度。 排出模組6 1 0的數量應適合根據控制部物件電子部件 1 0的判斷結果,即重新檢查(1個排出模組)、不良(2個排 出模組)、優良(1個排出模組)情況,分別分配一嗰以上排 出模組。並且,根據使用者的選擇,還可以設置強制排出 所需的排出模組。 並且,爲了順利排出被判斷爲不良或優良的電子部 件,分配給不良或優良的排出模組可以具備一個以上的電 磁閥門。如果排出模組具有兩個電磁閥門,則可以通過選 擇性地控制一個或兩個電磁閥門調整喷射空氣的壓力,並 且可以維持穩定的空氣壓力。 191293365 Also in the present embodiment, the discharge end 61 is different from the prior art, and the compressed air is not directly injected through the nozzles provided separately, and the compressed air is directly injected through the through holes 617 formed at the discharge end 616. The exit of the through hole 617 is adjacent to the electronic component 10 on the glass disk 300, and the path of the compressed air movement is shortened by a distance corresponding to the length of the nozzle as compared with the prior art. That is, the compressed air arrival time from the electromagnetic valve 61 to the object electronic component 10 can be shortened. In the above case, the electromagnetic valve 6 1 2 - is opened, and the compressed air is ejected to immediately discharge the electronic component 1 〇, so that the discharge speed and the discharge accuracy can be improved. The size of the through hole 6 17 formed at the discharge end 6 16 can be appropriately selected according to the size of the electronic component 10, and the outlet side end of the through hole 61 7 can be rounded with the glass in consideration of the convenience of the drilling operation of the through hole. Disk 3 00 forms an angle of less than 20 degrees. The number of the discharge modules 610 should be suitable according to the judgment result of the electronic component 10 of the control unit, that is, re-examination (1 discharge module), defective (2 discharge modules), and excellent (1 discharge module). In the case, more than one discharge module is allocated. Further, depending on the user's selection, it is also possible to set a discharge module required for forced discharge. Further, in order to smoothly discharge the electronic components judged to be defective or excellent, one or more electromagnetic valves may be provided for the defective or excellent discharge module. If the discharge module has two solenoid valves, the pressure of the injected air can be adjusted by selectively controlling one or two solenoid valves, and a stable air pressure can be maintained. 19

1293365 如上所述,雖然僅利用幾個實施例和附圖進行了說 明,但是本發明並不限定於此,本發明所屬技術領域的普 通技術人員可以在本發明的技術思想和申請專利範圍第項 保護的範圍内進行一定的修改及變形。 【圖式簡單說明】 第1圖爲本發明中一實施例的電子部件檢測系統的平 面不意圖, 第2圖爲第1圖中電子部件檢測系統的電子部件對準 示意圖; 第3圖爲第2圖中電子部件對準中兩個夾具(jig)的橫 向截面圖; 第4圖爲第1圖中電子部件檢測系統的電子部件攝影 部中的照明裝置示意圖; 第5圖爲第4圖的照明裝置當中設置在電子部件右側 方的照明裝置示意圖 第6圖爲第1圖所示電子部件檢測系統中電子部件排 出部的示意圖; 第7圖爲第1圖所示電子部件檢測系統的電子部件排 出部的正面示意圖; 第8圖爲第7圖所示電子部件檢測系統的電子部件排 出部的A-A’截面圖。 【主要元件符號說明】 20 1293365 1 0電子部件 100電子部件供應部 11 0料斗 200電子部件對準部 210無振動斜槽送件部 2 1 2直線槽 221夾具 222夾具 223對準端 224對準端 225引導端 226引導端 300玻璃圓盤 400觸發感測器 5 00電子部件攝像部 5 20照明裝置 52 1 -526發光器件端 527反射板 528 中空部 600電子部件排出部 6 1 0排出模組 6 1 2電磁闊門 6 1 4送氣管 616排出端 1293365 6 1 7通孔 6 1 8收納盒1293365 As described above, although only a few embodiments and the accompanying drawings have been described, the present invention is not limited thereto, and those skilled in the art to which the present invention pertains may be in the technical idea of the present invention and the scope of the patent application. Certain modifications and modifications are made within the scope of protection. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of an electronic component detecting system according to an embodiment of the present invention, and Fig. 2 is a schematic view showing the alignment of electronic components of the electronic component detecting system of Fig. 1; 2 is a transverse cross-sectional view of two jigs in the alignment of electronic components in the figure; FIG. 4 is a schematic view of the illumination device in the electronic component photographing section of the electronic component detecting system in FIG. 1; FIG. 5 is a view of FIG. FIG. 6 is a schematic diagram of an illumination device disposed on the right side of an electronic component in the illumination device. FIG. 6 is a schematic diagram of an electronic component discharge portion in the electronic component detection system shown in FIG. 1. FIG. 7 is an electronic component of the electronic component detection system shown in FIG. Fig. 8 is a cross-sectional view taken along line A-A' of the electronic component discharge portion of the electronic component detecting system shown in Fig. 7. [Description of main component symbols] 20 1293365 1 0 Electronic component 100 Electronic component supply part 11 0 Hopper 200 Electronic component alignment part 210 No vibration chute delivery part 2 1 2 Linear groove 221 Clamp 222 Clamp 223 Alignment end 224 alignment End 225 Guide End 226 Guide End 300 Glass Disc 400 Trigger Sensor 500 Electronic Component Camera 5 20 Illumination Device 52 1 - 526 Light Emitting Terminal 527 Reflector 528 Hollow 600 Electronic Component Discharge 6 1 0 Discharge Module 6 1 2 electromagnetic wide door 6 1 4 air supply pipe 616 discharge end 1293365 6 1 7 through hole 6 1 8 storage box

Claims (1)

1293365 /h 1 in ^ 號麵案弘年月修贩 —----------------------—.:‘·...... - .'_, 十、申請專利範園: 1、一種電子部件檢測系統,至少包含: 供應部’包括:料斗,容納作爲優劣判斷的物件的多 個電子部件;及至少一個送件部,依靠振動依次移送所述 料斗提供的電子部件;1293365 /h 1 in ^ No. No. Hiroshi repairs ------------------------::'·...... '_, X. Application for Patent Park: 1. An electronic component inspection system, comprising at least: The supply department' includes: a hopper, which accommodates a plurality of electronic components as objects for judging advantages and disadvantages; and at least one delivery part, which is in turn by vibration Transferring electronic components provided by the hopper; 對準部’包括:無振動斜槽送件部,接收所述供應部 提供的電子部件,形成有直線槽’依靠其他電子部件的移 動力以無振動狀態移送;對準機,具有兩個以一定距離相 對設置的夾具,以引導所述無振動斜槽送件部移送的電子 部件進行對準; 玻璃圓盤,排列有通過所述對準部對準的電子部件, 並依靠發動機旋轉; 位置檢測部,當排列在所述玻璃圓盤上的電子部件通 過時生成觸發信號,即時生成隨著所述玻璃圓盤旋轉而變 化的編碼值; 攝像部,包括··攝像頭,拍攝所述玻璃圓盤上的電子 部件的上下左右四面;照明裝置,安裝在所述攝像頭上, 具有形成中空狀的反射板和圍繞所述反射板内部的中空設 置的多種顏色發光器件,以給被連續拍攝的電子部件提供 不同顏色的照明; 排出部,其形成有通孔的排出端與所述電子部件相鄰 設置,通過所述通孔選擇性噴射壓縮空氣,分類並收集脫 離玻璃圓盤的電子部件; 控制部,利用所述電子部件位置檢測部提供的觸發信 23 1293365 Λ* Μ /日修(更)正替換頁 號和編碼值,控制所述攝像頭, ^ 田尸#逑雷+都从y» 部件攝像部的各個攝像頭置 十 ° 4達電子 w饥罝時,依次拍攝 面,並從不同角度將所 β 電子。ρ件的四 τ π迷電子部件的各個面 以上;控制所述照明I w ± ^ π拍攝兩次 顏色組合呈現不同的昭明能扭祕+ X先态件的 狀態,根據電子部件各個面在π 同角度和不同照明下遠嬙妞 回在不 績拍攝的衫像判斷電子部白 狀態之後,根據判斷έ士杲批连 / 曼良 進行分類。 ^ ^ op#The alignment portion includes: a vibration-free chute delivery portion that receives the electronic components provided by the supply portion, and is formed with a linear groove 'transferred by a moving force of other electronic components in a vibration-free state; the alignment machine has two a pair of oppositely disposed clamps for guiding the electronic components transferred by the vibration-free chute delivery portion; the glass disk is arranged with electronic components aligned by the alignment portion and is rotated by the engine; a detecting unit that generates a trigger signal when an electronic component arranged on the glass disk passes, and generates an encoded value that changes as the glass disk rotates; an imaging unit, including a camera, photographs the glass circle An upper and lower left and right sides of the electronic component on the disk; an illumination device mounted on the camera, having a hollow reflecting plate and a plurality of color light emitting devices disposed around the hollow of the reflecting plate to give continuous shooting electrons The component provides illumination of different colors; the discharge portion, the discharge end formed with the through hole is disposed adjacent to the electronic component, passes through The through hole selectively ejects compressed air, classifies and collects electronic components that are detached from the glass disk; and the control unit uses the trigger signal provided by the position detecting unit of the electronic component 23 1293365 Λ* Μ / 日修 (more) is replacing the page number And the code value, control the camera, ^ Tian corpse #逑雷+ are all from the y» parts camera section of the camera set ten ° 4 up to the electronic w hunger, in order to shoot the surface, and the beta electrons from different angles. The four τ π 迷 各个 各个 ; ; ; ; ; ; ; ; ; ; ; 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制At the same angle and under different illuminations, the girl who returned to the photo was judged to be classified according to the judgment of the gentleman 杲 Lianlian/Manliang after judging the white state of the electronic part. ^ ^ op# 2、根據申請專利範圍第1項所述的電子部件檢測系統,其 中所述攝像頭設置在破璃圓盤外圓周外側,所述攝像頭上 的所述照明裝置中,破璃圓盤下方的反射板部分相對於玻 璃圓盤上方的反射板部分靠後設置。 3、 根據申請專利範圍第2項所述的電子部件檢測系統,其 中所述發光器件包括紅色LED、白色LED及藍色led組合的 多個發光器件端。 4、 根據申請專利範圍第3項所述的電子部件檢測系統,其 中所述控制部具有2n種照明狀態,n =發光器件端數。 5、根據申請專利範園第i項所述的電子部件檢測系統,其 中所述排出部至少包含: 至少一個電磁閥門,控制麈縮空氣的流動; 242. The electronic component detecting system according to claim 1, wherein the camera is disposed outside the outer circumference of the glass disc, and in the lighting device on the camera, the reflecting plate below the glass disc The portion is disposed rearward relative to the portion of the reflector above the glass disk. 3. The electronic component detecting system according to claim 2, wherein the light emitting device comprises a plurality of light emitting device terminals of a combination of a red LED, a white LED and a blue LED. 4. The electronic component detecting system according to claim 3, wherein the control unit has 2n kinds of illumination states, and n = number of light-emitting device terminals. 5. The electronic component inspection system according to claim i, wherein the discharge portion comprises at least: at least one electromagnetic valve for controlling the flow of the collapsed air; 1293365 送氣管,連接於所述電磁閥門; 排出端,入口連接於所述送氣管,出口形成有向所述 玻璃圓盤上的電子部件喷射壓縮空氣的通孔;及 收納盒,利用壓縮空氣收集脫離玻璃圓盤的電子部 件0a 1293365 air supply pipe connected to the electromagnetic valve; a discharge end, an inlet connected to the air supply pipe, an outlet formed with a through hole for injecting compressed air to the electronic component on the glass disk; and a storage box, which is collected by compressed air Electronic component from the glass disc 0 25 1293365 七、指定代表圖: (一) 本案指定代表圖為:第3圖。 (二) 本代表圖之元件符號簡單說明·· 1 〇 電子部件 221夾具 222 夾具25 1293365 VII. Designated representative map: (1) The representative representative of the case is: Figure 3. (2) A brief description of the component symbols of this representative figure·· 1 〇 Electronic components 221 Fixture 222 Fixture 223 對準端 224對準端 225引導端 226 引導端 300玻璃圓盤 八、本案若有化學式時,請揭示最能顯示 發明特徵的化學式:223 Alignment end 224 Alignment end 225 Guide end 226 Guide end 300 glass disc 8. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention:
TW095106160A 2005-02-28 2006-02-23 Electronic parts inspection system TWI293365B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050016383A KR100527211B1 (en) 2005-02-28 2005-02-28 Electronic parts inspection system

Publications (2)

Publication Number Publication Date
TW200636756A TW200636756A (en) 2006-10-16
TWI293365B true TWI293365B (en) 2008-02-11

Family

ID=36946812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106160A TWI293365B (en) 2005-02-28 2006-02-23 Electronic parts inspection system

Country Status (4)

Country Link
JP (1) JP4282675B2 (en)
KR (1) KR100527211B1 (en)
CN (1) CN100547415C (en)
TW (1) TWI293365B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100691455B1 (en) 2006-04-14 2007-03-12 (주)알티에스 Part align apparatus of in a apparatus for dual electronic part inspection
JP5015660B2 (en) * 2007-05-25 2012-08-29 日本特殊陶業株式会社 Work inspection method
EP2214467B1 (en) * 2009-02-03 2012-01-04 ISMECA Semiconductor Holding SA Method and device for filling carrier tapes with electronic components
TWI421488B (en) 2011-03-28 2014-01-01 Youngtek Electronics Corp Multitrack detection system for detecting the appearance of electronic elements
CN102749333A (en) * 2011-04-18 2012-10-24 久元电子股份有限公司 Multi-track detection system for detecting appearances of multiple electronic components
CN102590224A (en) * 2012-01-18 2012-07-18 肇庆市宏华电子科技有限公司 Chip type electronic element appearance inspection machine
CN103398654A (en) * 2013-08-13 2013-11-20 天津三星电机有限公司 Measuring device for linearity degree of detection wheels
KR101592901B1 (en) * 2014-05-30 2016-02-11 세계정밀(주) Apparatus for asembling syringe
CN104076225B (en) * 2014-07-12 2017-09-01 东莞市瑾耀精密设备有限公司 The method of testing and test machine of a kind of sheet component short-time overload
CN106370666A (en) * 2015-07-23 2017-02-01 台达电子工业股份有限公司 Electronic component appearance detection apparatus and electronic component appearance detection method
CN105118698A (en) * 2015-09-18 2015-12-02 益阳市和天电子有限公司 Full-automatic detection pin cutter for capacitors
CN105817431B (en) * 2016-05-07 2019-03-08 肇庆市宏华电子科技有限公司 A kind of intelligence open defect high-speed detecting machine
JP6974699B2 (en) 2017-06-19 2021-12-01 シンフォニアテクノロジー株式会社 Vibration transfer device
KR102590329B1 (en) * 2022-11-21 2023-10-17 주식회사 에스엠에스 MLCC Handler for sorting good and defective products

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0654226B2 (en) * 1988-03-31 1994-07-20 ティーディーケイ株式会社 Automatic visual inspection machine for chip parts
JPH0777882B2 (en) * 1991-06-24 1995-08-23 ティーディーケイ株式会社 Method and apparatus for automatically loading electronic components in storage case
JP3020089U (en) * 1995-06-30 1996-01-19 武士 寺田 Light source device for product inspection
JP2000283924A (en) * 1999-03-29 2000-10-13 Toshiba Corp Work inspection method and device
JP2002048731A (en) * 2000-08-01 2002-02-15 Matsushita Electric Ind Co Ltd Mounted base board visual inspection device and its visual inspection method
JP4038993B2 (en) * 2001-03-29 2008-01-30 オムロン株式会社 Illumination device for curved surface property inspection device
JP3855733B2 (en) * 2001-10-30 2006-12-13 株式会社村田製作所 Electronic component visual inspection apparatus and visual inspection method
JP2004279236A (en) * 2003-03-17 2004-10-07 Nec Semiconductors Kyushu Ltd Appearance inspection device and method
KR100504334B1 (en) * 2003-03-19 2005-07-27 (주)바른기술 A method and electronic part inspection apparatus for vision system
KR20040089798A (en) * 2003-04-15 2004-10-22 (주)바른기술 Method and electronic part inspection apparatus for continues image purchase
KR100529404B1 (en) * 2003-04-22 2005-11-17 윈텍 주식회사 Electronic part inspection apparatus for vision system

Also Published As

Publication number Publication date
JP4282675B2 (en) 2009-06-24
JP2006242952A (en) 2006-09-14
CN1828321A (en) 2006-09-06
KR100527211B1 (en) 2005-11-08
CN100547415C (en) 2009-10-07
TW200636756A (en) 2006-10-16

Similar Documents

Publication Publication Date Title
TWI293365B (en) Electronic parts inspection system
KR100725485B1 (en) Electronic parts inspection system
JP2008520984A (en) Inspection device
JP2007530934A (en) Optical system for producing illumination formations
US20060023229A1 (en) Camera module for an optical inspection system and related method of use
TW201312192A (en) Filter lens light source module for optical image capturing device and the image capturing device
CN111781215A (en) Viscidity dust collector
JP2005233730A (en) Component inspection device
CN111781216A (en) Dust removing device
CN1439873A (en) Parts appearance testers
US6700658B2 (en) Method and apparatus for circuit pattern inspection
JP6491000B2 (en) Screw inspection device
KR100575896B1 (en) Method for inspecting electronic parts
KR100402253B1 (en) Test apparatus of electronic parts using vision system
RU2468872C1 (en) Grain sorting device
KR100646863B1 (en) Lighting apparatus, testing apparatus and testing method for improving selection rate of electronic parts
CN213529998U (en) Viscidity dust collector
KR102057118B1 (en) Appearance inspecting apparatus of camera module using multi camera
JP4447360B2 (en) Component mounting device
CN108924549B (en) Camera motor test fixture
TWI338130B (en) Part align apparatus and electronic part discharge method of in a apparatus for dual electronic part inspection
CN213121642U (en) Surface detection vision device and detection system
CN212693623U (en) Viscidity dust collector
TW200419162A (en) Apparatus for inspecting electric products using vision system
CN213121664U (en) Dust removing device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees