KR100529404B1 - Electronic part inspection apparatus for vision system - Google Patents

Abstract

The present invention relates to an electronic component inspection apparatus, the present invention is a feeder means for supplying electronic components in sequence, a transfer unit for transferring the electronic components to the position for inspection in the vacuum suction state, the transfer unit An inspection unit for inspecting the shape of each surface of the electronic parts to be formed by a camera, an index unit for classification of the quantity of the inspected electronic parts, and the transfer unit includes at least one rotating plate having vacuum holes through which one surface of the electronic parts is vacuum-adsorbed; It has a cover for reducing the vacuum adsorption area of the vacuum holes.

Description

ELECTRONIC PART INSPECTION APPARATUS FOR VISION SYSTEM

The present invention relates to an apparatus for inspecting abnormality of an electronic component finally completed by using a vision system, and more particularly, to an electronic component inspection apparatus capable of inspecting fine electronic components.

In general, it is essential to work to check the status by performing a defect inspection of the electronic components before being installed in semiconductor equipment or electronic devices.

However, most of the conventional inspection of the electronic component is carried out by several people in the workplace using a device such as a microscope, but it takes a long time to inspect a large amount of electronic components, there is a limit in accuracy There is a problem in that workability is inferior to the inspection.

In order to solve the above problem, two circular plates (drums) made of stainless material are used to adsorb with vacuum at the side of the circular plate, and then rotate and another circular plate is adsorbed at the end of the rotation. A device for inspecting was developed.

However, this inspection device must drill a vacuum hole for adsorbing electronic components on a circular plate. Currently, the hole (end mill) can be drilled to a diameter of 0.5 mm, and holes below it are not possible. Do. For example, when machining vacuum holes with a diameter of 0.5 mm, it is difficult to process so that 3-4 machining tools (end mills) are broken. Due to this difficulty in vacuum hole processing, the existing inspection apparatus can only inspect 1005 (1.0 * 0.5mm) chips, and in the case of fine chips (0603 chips or 0402 chips-chips under development in Japan) having sizes smaller than that There is a problem that the chip is sucked into the vacuum hole.

As such, the existing inspection apparatus has a disadvantage in that it is impossible to inspect the microelectronic component because hole processing for adsorbing the microelectronic component (0603 chip or 0402 chip), which is currently being developed and mass produced, is not possible.

SUMMARY OF THE INVENTION The present invention has been made to solve such a conventional problem, and an object thereof is to provide a new type of electronic component inspection apparatus capable of vacuum adsorption of fine electronic components.

Yet another object is to provide a new type of electronic component inspection apparatus that can cope with various chip sizes.

In order to achieve the above object, the present invention provides a feeder means for sequentially supplying electronic parts, and a transfer part for transferring the electronic parts to a position for inspection in a vacuum-adsorbed state and an electronic part transferred by the transfer part. An inspection unit for inspecting the shape of each surface of the device by a camera, an index unit for classification of the quantity of inspected electronic components, and the transfer unit includes at least one rotating plate having vacuum holes in which one surface of the electronic components is vacuum-adsorbed; It has a cover for adjusting the vacuum adsorption area of the vacuum holes.

For example, the embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. These examples are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 12. In addition, in the drawings, the same reference numerals are denoted together for components that perform the same function.

1 is a block diagram illustrating the present invention, FIG. 2 is a conceptual diagram illustrating the device configuration of the present invention, and FIG. 3 is an arrangement of electronic components. FIG. 4 is a flowchart illustrating an alignment method by the alignment device of the present invention. FIG.

1 and 2, the inspection apparatus 100 of the present invention is an apparatus for inspecting a completed electronic component before being installed in a semiconductor device or an electronic device.

Dividing the configuration into large, the feeder means 110, the conveying means 120, the inspection means 150, the index means 160 is included.

Electronic components are sequentially supplied to the transfer means 120 by the feeder means 110.

The electronic parts are moved to a position for inspection (photographing) in a state where they are vacuum-adsorbed by the transfer means 120.

The conveying means 120 is composed of a first rotating unit 122 and a second rotating unit 130. The first rotating unit 122 includes a first rotating disc 124, a cover 170, a first housing 126, and a driving motor 128 having a rotating shaft. The second rotating unit 130 includes a second rotating disc 134, a cover 170, a second housing 136, and a driving motor 138 having a rotating shaft.

3 to 5, the first rotating disc 124 has fifty first vacuum holes 125 formed at equal intervals on an upper surface edge thereof. The second rotating disc 134 has fifty second vacuum holes 135 formed at equal intervals on the bottom edge thereof. The first and second vacuum holes 125 and 135 are provided with a vacuum pressure through respective vacuum lines 190 connected to the housings 126 and 136. The vacuum holes 125 and 135 may be processed into 0.5 mm * 1.0 mm by a machining tool (end mill).

A cover 170 is attached to an upper surface of the first rotating disc 124. The cover 170 is sized to cover a portion of the vacuum holes 125. The first vacuum holes 125 have the vacuum adsorption area (size) reduced by half by the cover 170, and thus vacuum adsorption of 1005 (1.0 * 0.5 * 0.5mm size) chips is possible, in particular, the cover If the vacuum suction area of the vacuum hole 125 is adjusted by changing the size of 170, the structure can easily cope with various chip sizes. For example, the cover 170 is preferably made of stainless steel.

On the other hand, the cover 170 preferably has a height lower than the height of the electronic component (1). The reason is that in the process of injecting air into the electronic component 1 through the air nozzle 162 to remove the electronic component 1 from the second vacuum hole 135, as shown in FIG. This is to prevent the block 170 from being blocked.

The cover 170 is also attached to the bottom surface of the second rotating disc 134. The cover 170 attached to the second rotating disc 134 also has the same structure and function as above, and thus detailed description thereof will be omitted.

FIG. 7 illustrates a modified example of the cover. As shown in FIG. 7, the cover 170a may have a sawtooth edge. The sawtooth concave portion 172 of the cover 170a is preferably formed to correspond to the vacuum holes 125 and 135, and the electronic component 1 is located in the recessed portion 172. As such, the edge of the cover 170a is changed into a sawtooth shape so that the electronic component 1 can be stably and accurately fixed to the vacuum holes 125 and 135. The electronic component 1 is positioned one by one in the sawtooth recessed portion 172.

Reference numeral 194 denotes an aligner for aligning electronic components, and reference numeral 196 denotes a misalignment ejector for ejecting and extracting a product having an unstable adsorption to the first vacuum hole 125.

The inspection means 150 is for inspecting four surfaces of the electronic components aligned through the aligner 194, and the inspection means 150 includes the cameras 152a, 152b, 152c, and 152d and the lighting unit 154. And a control unit 156. The cameras include a front camera 152a, a top camera 152b, a rear camera 152c, and a bottom camera 152d, and the lighting unit 154 is installed in each of these cameras. The controller 156 controls the lighting unit 154.

The four cameras are respectively installed adjacent to the electronic component transfer paths of the first rotating disc 124 and the second rotating disc 134.

The lighting unit 154 is mounted to the end of the camera. The lighting unit 154 has a body 155 having a hole 155a formed at the center thereof, and a plurality of light emitting elements 158 installed inside the body 155. As the light emitting device 158, a light emitting diode (LED) is used. Each of the LEDs may be connected to a controller by a power cable (not shown). The controller 156 emits LEDs individually or in groups and adjusts the amount of light. The controller 156 is connected to the microcomputer.

The microcomputer 170 has an image board and a motor controller.

In the present invention, LEDs of various colors may be used to detect all of various defects. For example, red, green, and blue LEDs may be used in this embodiment. They can be installed in groups, each in a certain position. Depending on the defect type of the semiconductor chip, only one color of LED may be emitted or two or more colors of LED may be emitted at the same time. In addition, the amount of light of the LEDs 158 can be adjusted, respectively, or grouped. The group may be made according to the colors of the LEDs 158 or according to the installation position of the LEDs 158.

As shown in FIG. 10, the lighting unit 154 may have a structure having a reflector 159 for reflecting illumination of an LED or a light emitter to provide indirect lighting to the electronic component.

11 to 12 show an example of the installation position of the LEDs 140 according to the color. Referring to FIG. 11, red (R), green (G), and blue (B) LEDs may be arranged to form concentric circles among the same colors inside the body of the lighting unit. In addition, as shown in FIG. 12, the inside of the body 156 may be divided into six zones, and the red, green, and blue LEDs may be disposed in an area facing each other. As such, the number and location of the LEDs may vary.

The index means 160 is a discharge container for holding the air injection nozzles (162a, 164a, 166a) controlled by the microcomputer 170, and the electronic components (1) bounced by the air injected from the air injection nozzles (162b, 164b, 166b). The indexing means divides the electronic components 1 into re-inspected products, defective products, and good products according to the signal of the microcomputer 170, and classifies the electronic components 1 into discharge containers 162b, 164b, and 166b.

On the other hand, the present invention can be variously modified in the inspection apparatus 100 for the electronic component (1) having the above configuration and may take various forms. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the above description, but rather includes all modifications, equivalents and substitutions within the spirit and scope of the invention as defined by the appended claims. It should be understood to do.

The following describes the operational relationship of the present invention for inspecting completed electronic components prior to installation in semiconductor equipment or electronic devices.

Referring to FIGS. 1 to 4, a switch (not shown) for holding a plurality of completed electronic components 1 through the hopper (not shown) and then supplying power and a start button for operating the same It operates by turning ON (not shown). In this case, the electronic component 1 contained in the hopper is moved to the feeder means 110, and the feeder means 110 supplies the electronic component 1 to the first rotating disc 124 sequentially. Done. The electronic component 1 is vacuum-adsorbed to the first vacuum hole 125 formed in the first rotating disc 124.

The electronic components 1 are aligned (corrected) past the aligner 194. The electronic parts 1 arranged as described above are rotated together with the first rotating disc 124 and are photographed by the front camera 152a and the top camera 152b. The electronic component is moved from the first rotating disc 124 to the second rotating disc 134 to photograph the rear and the bottom. Referring to FIG. 5, when the electronic component 1 reaches the position where the electronic component 1 is turned over, the vacuum of the first vacuum hole 125 of the first rotating disc 124 is blocked and air is provided. . In addition, while a vacuum is formed in the second vacuum hole 135 of the second rotation disc 134, the electronic component 1 is vacuum-adsorbed on the bottom surface of the second rotation disc 134. The electronic component moved to the second rotating disc 134 is photographed by the rear camera 152c and the bottom camera 152d. As such, the information photographed through the cameras is sent to the image board connected to the microcomputer 170. The microcomputer 170 analyzes the image information to determine whether it is a good product, a defective product, or a product requiring re-inspection. The microcomputer 170 controls the nozzles of the indexing means 160 according to the inspection result of the electronic component 1 and the position information of the electronic component. That is, in the case of a retest product, when the part is located in front of the retest product nozzle 162a, air is injected through the nozzle to discharge the electronic component to the retest product discharge container 162b. And it is classified in the same way in the case of good and defective products. It is determined whether to repeat this inspection process to determine whether to terminate.

When the inspection process is repeatedly performed, the edge portion x of the cover shown in FIG. 5 is damaged. However, in the present invention, since only the cover 170 may be easily replaced and then used, there is an advantage that the cost and maintenance cost can be significantly reduced.

 The electronic component 1 represents a micro component, such as a microlayer ceramic capacitor (MLCC) chip or an MLCL chip, for example, and the rotation of the component is performed by driving a motor. Omit the description.

In addition, the inspection of the electronic component 1 may include breakage, cracking, electrode exposure, chipping, external electrode spreading, external electrode breakage, no electrode, excess electrode, short electrode, peeling electrode, and misalignment. Items such as cutting, poor size, poor blown, poor chipping, pin hole, foreign matter, external electrode bubble generation, electrode lifting, external electrode discoloration, thickness defect and plating discoloration can be performed simultaneously.

In the above, the configuration and operation of the inspection apparatus according to the present invention is shown in accordance with the above description and drawings, but this is merely an example, and various changes and modifications are possible without departing from the technical spirit of the present invention. to be.

According to the present invention, the vacuum adsorption of 1005 (1.0 * 0.5 * 0.5mm), 0603 (0.6 * 0.3 * 0.3mm size) chip or 0402 (0.4 * 0.2 * 0.2mm size) chip is possible, as well as cover If only the size of is changed, there is an advantage that it can easily correspond to various chip sizes. Therefore, there is an advantage that can significantly reduce the production cost and maintenance costs. In addition, since the LEDs of various colors are used according to the defect type of the semiconductor chip, it is possible to easily and accurately detect various defect types.

1 is a conceptual diagram showing the device configuration of the present invention;

2 is a side view showing a device configuration of the present invention;

3 is a view for explaining a first rotating disk and the second rotating disk;

4 is a plan view of the first rotating disc;

5 is an enlarged view for explaining a process of moving from a first rotating disc to a second rotating disc of an electronic component;

6 shows an indexing means for discharging an electronic component;

7 shows a variant of the cover;

8 is a block diagram for explaining the present invention;

9 is a sectional view of a lighting unit for explaining the lighting unit;

10 to 12 are views showing various modifications of the lighting unit.

* Explanation of symbols for the main parts of the drawings

110: feeder means

120: transfer means

124: first rotating disc

134: second rotating disc

150: inspection means

160: index means

170: cover

Claims (7)

A feeder for sequentially supplying electronic components; A transfer unit for transferring the electronic component to a position for inspection in a vacuum suction state; An inspection unit for inspecting a shape of each surface of the electronic component transferred by the transfer unit by a camera; And An index unit for classification of the quantity of the inspected electronic component; The transfer unit includes: a first rotating disc having vacuum holes at the edge thereof for vacuum suction of one surface of the electronic component; A second rotating disc having vacuum holes for vacuum-adsorbing the other surface of the electronic part at an edge thereof to receive the electronic component from the first rotating disc, and the vacuum hole attached to the first and second rotating discs Consists of covers for adjusting the vacuum adsorption zone of the substrate; Edges of the first and second rotating disc is configured to overlap each other, the electronic component inspection device. The method of claim 1, The cover is a disc having a constant diameter, the electronic component inspection device, characterized in that a part of the vacuum holes are blocked by the disc. The method of claim 1, And the cover has a sawtooth shape having a concave portion formed to correspond to the vacuum holes. delete The method of claim 1, The inspection unit Cameras for photographing the shape of each surface of the electronic components; An illumination unit installed in each of the cameras and composed of a plurality of LEDs for accurate photographing of the electronic component; And a controller for emitting the LEDs of the lighting unit for each group or for controlling the amount of light. The method of claim 5, The lighting unit And a reflector for reflecting the illumination of the LEDs to provide indirect illumination to the electronic component. The method of claim 5, The lighting unit is composed of a combination of blue LEDs, green LEDs and red LEDs and the electronic component inspection device, characterized in that arranged in a concentric circle around the passage for the camera shooting.