TWI291395B - Apparatus and method for measuring the degradation of a tool - Google Patents

Apparatus and method for measuring the degradation of a tool Download PDF

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Publication number
TWI291395B
TWI291395B TW092105203A TW92105203A TWI291395B TW I291395 B TWI291395 B TW I291395B TW 092105203 A TW092105203 A TW 092105203A TW 92105203 A TW92105203 A TW 92105203A TW I291395 B TWI291395 B TW I291395B
Authority
TW
Taiwan
Prior art keywords
tool
sampling
light
spectral
condition
Prior art date
Application number
TW092105203A
Other languages
English (en)
Chinese (zh)
Other versions
TW200417721A (en
Inventor
Michael Roesner
Manfred Schneegans
David Wallis
Original Assignee
Freescale Semiconductor Inc
Qimonda Dresden Gmbh & Co Ohg
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc, Qimonda Dresden Gmbh & Co Ohg, Infineon Technologies Ag filed Critical Freescale Semiconductor Inc
Publication of TW200417721A publication Critical patent/TW200417721A/zh
Application granted granted Critical
Publication of TWI291395B publication Critical patent/TWI291395B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B23Q17/0904—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool before or after machining
    • B23Q17/0909—Detection of broken tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B24B49/183—Wear compensation without the presence of dressing tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/65—Raman scattering

Landscapes

  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
TW092105203A 2001-06-08 2003-03-11 Apparatus and method for measuring the degradation of a tool TWI291395B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/877,531 US6633379B2 (en) 2001-06-08 2001-06-08 Apparatus and method for measuring the degradation of a tool

Publications (2)

Publication Number Publication Date
TW200417721A TW200417721A (en) 2004-09-16
TWI291395B true TWI291395B (en) 2007-12-21

Family

ID=25370164

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092105203A TWI291395B (en) 2001-06-08 2003-03-11 Apparatus and method for measuring the degradation of a tool

Country Status (7)

Country Link
US (1) US6633379B2 (ja)
EP (1) EP1399291B1 (ja)
JP (1) JP4238130B2 (ja)
KR (1) KR20040039201A (ja)
DE (1) DE60227807D1 (ja)
TW (1) TWI291395B (ja)
WO (1) WO2002100592A1 (ja)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6808345B2 (en) * 2001-10-16 2004-10-26 Toshiba Kikai Kabushiki Kaisha Tool, tool holder, and machine tool
US6741342B2 (en) * 2002-04-10 2004-05-25 Hewlett-Packard Development Company, L.P. Using a laser beam to indicate roller wear
US6752694B2 (en) * 2002-11-08 2004-06-22 Motorola, Inc. Apparatus for and method of wafer grinding
WO2005072332A2 (en) * 2004-01-26 2005-08-11 Tbw Industries, Inc. Chemical mechanical planarization process control utilizing in-situ conditioning process
US7489856B2 (en) * 2004-06-25 2009-02-10 Nokia Corporation Electrical device for automatically adjusting operating speed of a tool
US7090560B2 (en) 2004-07-28 2006-08-15 3M Innovative Properties Company System and method for detecting abrasive article orientation
US20060025047A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Grading system and method for abrasive article
US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
EP1688215B1 (en) * 2005-02-08 2008-03-26 Mikron Agie Charmilles AG Device checking method for machine tool
JP5060808B2 (ja) * 2007-03-27 2012-10-31 オリンパス株式会社 外観検査装置
CH701168B1 (de) * 2007-08-17 2010-12-15 Kellenberger & Co Ag L Verfahren und Bearbeitungsmaschine zur Behandlung von Werkstücken.
JP2009210423A (ja) * 2008-03-04 2009-09-17 Sony Corp テラヘルツ分光装置
US8419508B2 (en) * 2010-05-28 2013-04-16 Corning Incorporated Methods of fabricating a honeycomb extrusion die from a die body
JP5603175B2 (ja) * 2010-09-03 2014-10-08 株式会社ディスコ 切削装置の切削ブレード検出機構
US20120270474A1 (en) * 2011-04-20 2012-10-25 Nanya Technology Corporation Polishing pad wear detecting apparatus
US8760668B1 (en) 2011-08-03 2014-06-24 Us Synthetic Corporation Methods for determining wear volume of a tested polycrystalline diamond element
CN102426119A (zh) * 2011-08-25 2012-04-25 上海华碧检测技术有限公司 一种小尺寸晶圆样品结构截面观察的样品制备方法
WO2013102900A1 (en) * 2012-01-04 2013-07-11 Mike Goldstein Inspection device for mechanical instruments and uses thereof
WO2014035423A1 (en) 2012-08-31 2014-03-06 Halliburton Energy Services, Inc. System and method for analyzing cuttings using an opto-analytical device
US10012067B2 (en) 2012-08-31 2018-07-03 Halliburton Energy Services, Inc. System and method for determining torsion using an opto-analytical device
WO2014035426A1 (en) 2012-08-31 2014-03-06 Halliburton Energy Services, Inc. System and method for detecting vibrations using an opto-analytical device
CA2883253C (en) 2012-08-31 2019-09-03 Halliburton Energy Services, Inc. System and method for measuring gaps using an opto-analytical device
WO2014035424A1 (en) * 2012-08-31 2014-03-06 Halliburton Energy Services, Inc. System and method for measuring temperature using an opto-analytical device
US10167718B2 (en) 2012-08-31 2019-01-01 Halliburton Energy Services, Inc. System and method for analyzing downhole drilling parameters using an opto-analytical device
CA2883243C (en) 2012-08-31 2019-08-27 Halliburton Energy Services, Inc. System and method for detecting drilling events using an opto-analytical device
JP2014092437A (ja) * 2012-11-02 2014-05-19 Hitachi Chemical Co Ltd 複合材料の分析方法
JP6068209B2 (ja) * 2013-03-12 2017-01-25 株式会社ディスコ 切削方法
DE102013209963A1 (de) * 2013-05-28 2014-12-18 Siemens Aktiengesellschaft Anordnung zum Aufrakeln eines Pulvers
JP6521687B2 (ja) * 2015-03-23 2019-05-29 株式会社ディスコ 切削ブレードの検査方法
DE102017206179A1 (de) * 2017-04-11 2018-10-11 Homag Bohrsysteme Gmbh Schleifvorrichtung
CH713798A1 (de) * 2017-05-19 2018-11-30 Reishauer Ag Maschine zur Feinbearbeitung von verzahnten Werkstücken sowie Verfahren zur Vermessung von Kenngrössen eines Feinbearbeitungswerkzeugs.
EP3511101B1 (de) * 2018-01-10 2020-09-23 Klingelnberg GmbH Verfahren zum prüfen eines schleifwerkzeugs und entsprechende vorrichtung
DE102018105134A1 (de) * 2018-03-06 2019-09-12 Karl Heesemann Maschinenfabrik Gmbh & Co. Kg Verfahren zum Betreiben einer Schleifvorrichtung und Schleifvorrichtung
DE102018105133A1 (de) 2018-03-06 2019-09-12 Karl Heesemann Maschinenfabrik Gmbh & Co. Kg Verfahren zum Betreiben einer Schleifvorrichtung
KR102175530B1 (ko) * 2019-07-04 2020-11-09 강원대학교 산학협력단 드릴 상태 모니터링 시스템
US11904428B2 (en) * 2019-10-25 2024-02-20 Vitaly Tsukanov Systems for blade sharpening and contactless blade sharpness detection
JP7420571B2 (ja) * 2020-01-29 2024-01-23 株式会社ディスコ 切削装置
TWI717302B (zh) * 2020-07-30 2021-01-21 頂極科技股份有限公司 半導體製程零配件的質變檢測系統及方法
EP3950223A1 (en) * 2020-08-07 2022-02-09 Schneider GmbH & Co. KG Apparatus and method for processing optical workpieces
WO2023018917A2 (en) * 2021-08-11 2023-02-16 Bedrock Surgical, Inc Infrared imaging for damage detection in surgical instruments
CN114260813B (zh) * 2021-12-29 2023-06-23 西安奕斯伟材料科技有限公司 水平度调整装置、抛光设备及水平度调整方法
CN115127597B (zh) * 2022-08-25 2022-12-09 江苏京创先进电子科技有限公司 刀片安装状态检测方法及系统

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3809870A (en) * 1972-06-08 1974-05-07 Gleason Works Method and apparatus for monitoring condition of cutting blades
GB8300792D0 (en) * 1983-01-12 1983-02-16 Production Eng Res Monitoring tool life
US4786220A (en) 1984-06-18 1988-11-22 Borg-Warner Corporation Cutting tool wear monitor
JPS61252051A (ja) 1985-04-30 1986-11-10 Mitsubishi Heavy Ind Ltd 切削機械の刃欠検出装置
DE3725652A1 (de) * 1987-08-03 1989-02-16 Kadia Diamant Werkzeug zur spanabhebenden bearbeitung
DD270142A1 (de) 1988-03-11 1989-07-19 Komb Pumpen Und Verdichter Veb Verfahren und vorrichtung zur kontinuierlichen erfassung des momentanverschleisses an spanwerkzeugen
FR2645782B1 (fr) 1989-04-14 1995-01-27 Aerospatiale Systeme de controle de bris d'outil sur centre d'usinage
DK164621C (da) 1989-10-09 1992-12-07 Kirk Acoustics As Elektrodynamisk transducer
DE4003696C1 (ja) * 1990-02-07 1990-12-13 Petzetakis, George Aristovoulos, Piraeus, Gr
JPH04189447A (ja) * 1990-03-26 1992-07-07 Ntn Corp 切削機械の制御装置
JP3119308B2 (ja) * 1991-03-12 2000-12-18 ヤマザキマザック株式会社 マシニングセンタ
JPH05148089A (ja) * 1991-12-03 1993-06-15 Sumitomo Electric Ind Ltd 切削工具用ダイヤモンド膜
EP0752293B1 (en) 1995-07-05 1999-10-20 Ngk Spark Plug Co., Ltd Diamond coated article and process for its production
JPH0985587A (ja) * 1995-09-28 1997-03-31 Mitsubishi Materials Corp 回転切削工具による切削状態の検出装置および検出方法
US5718615A (en) 1995-10-20 1998-02-17 Boucher; John N. Semiconductor wafer dicing method
BR9612735A (pt) * 1996-08-22 1999-08-24 Eastman Chem Co Processo para monitorar quantitativamente in situ pela espectrometria de raman um ou mais constituintes selecionados de uma composi-Æo qu¡mica
US5929986A (en) 1996-08-26 1999-07-27 Kaiser Optical Systems, Inc. Synchronous spectral line imaging methods and apparatus
US5934974A (en) 1997-11-05 1999-08-10 Aplex Group In-situ monitoring of polishing pad wear
GB9819732D0 (en) 1998-09-11 1998-11-04 Renishaw Plc Tool conditioning monitoring
US6033288A (en) 1998-10-29 2000-03-07 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
US6348943B1 (en) * 1998-10-30 2002-02-19 Industrial Technology Research Institute Digital non-contact blade position detection apparatus

Also Published As

Publication number Publication date
US20020186370A1 (en) 2002-12-12
EP1399291B1 (en) 2008-07-23
DE60227807D1 (de) 2008-09-04
WO2002100592A1 (en) 2002-12-19
KR20040039201A (ko) 2004-05-10
JP2004530886A (ja) 2004-10-07
JP4238130B2 (ja) 2009-03-11
EP1399291A1 (en) 2004-03-24
US6633379B2 (en) 2003-10-14
TW200417721A (en) 2004-09-16

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MM4A Annulment or lapse of patent due to non-payment of fees