TWI289494B - Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution - Google Patents

Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution Download PDF

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Publication number
TWI289494B
TWI289494B TW092101247A TW92101247A TWI289494B TW I289494 B TWI289494 B TW I289494B TW 092101247 A TW092101247 A TW 092101247A TW 92101247 A TW92101247 A TW 92101247A TW I289494 B TWI289494 B TW I289494B
Authority
TW
Taiwan
Prior art keywords
honing
positioning ring
substrate
apex
edge
Prior art date
Application number
TW092101247A
Other languages
English (en)
Chinese (zh)
Other versions
TW200402348A (en
Inventor
Gerard S Moloney
Jiro Kajiwara
Original Assignee
Multi Planar Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multi Planar Technologies Inc filed Critical Multi Planar Technologies Inc
Publication of TW200402348A publication Critical patent/TW200402348A/zh
Application granted granted Critical
Publication of TWI289494B publication Critical patent/TWI289494B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW092101247A 2002-01-22 2003-01-21 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution TWI289494B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35167102P 2002-01-22 2002-01-22

Publications (2)

Publication Number Publication Date
TW200402348A TW200402348A (en) 2004-02-16
TWI289494B true TWI289494B (en) 2007-11-11

Family

ID=27613520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092101247A TWI289494B (en) 2002-01-22 2003-01-21 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution

Country Status (5)

Country Link
US (1) US7118456B2 (enExample)
JP (1) JP2005515904A (enExample)
KR (1) KR20040091626A (enExample)
TW (1) TWI289494B (enExample)
WO (1) WO2003061904A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
TWI375294B (en) 2003-02-10 2012-10-21 Ebara Corp Elastic membrane
RU2240280C1 (ru) 2003-10-10 2004-11-20 Ворлд Бизнес Ассошиэйтс Лимитед Способ формирования упорядоченных волнообразных наноструктур (варианты)
US7768018B2 (en) * 2003-10-10 2010-08-03 Wostec, Inc. Polarizer based on a nanowire grid
US20050126708A1 (en) * 2003-12-10 2005-06-16 Applied Materials, Inc. Retaining ring with slurry transport grooves
US7255771B2 (en) 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
KR20080031870A (ko) * 2005-05-24 2008-04-11 엔테그리스, 아이엔씨. Ｃｍｐ 리테이닝 링
US7520795B2 (en) * 2005-08-30 2009-04-21 Applied Materials, Inc. Grooved retaining ring
US7326105B2 (en) 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
JP2008177248A (ja) * 2007-01-16 2008-07-31 Tokyo Seimitsu Co Ltd 研磨ヘッド用リテーナリング
US7520796B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
DE102007026292A1 (de) * 2007-06-06 2008-12-11 Siltronic Ag Verfahren zur einseitigen Politur nicht strukturierter Halbleiterscheiben
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD634719S1 (en) 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD711330S1 (en) 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
KR101775464B1 (ko) * 2011-05-31 2017-09-07 삼성전자주식회사 화학 기계적 연마 장치의 리테이너 링
WO2013006077A1 (en) 2011-07-06 2013-01-10 Wostec, Inc. Solar cell with nanostructured layer and methods of making and using
JP5840294B2 (ja) 2011-08-05 2016-01-06 ウォステック・インコーポレイテッドＷｏｓｔｅｃ， Ｉｎｃ ナノ構造層を有する発光ダイオードならびに製造方法および使用方法
WO2013089578A1 (en) 2011-12-12 2013-06-20 Wostec, Inc. Sers-sensor with nanostructured surface and methods of making and using
WO2013109157A1 (en) 2012-01-18 2013-07-25 Wostec, Inc. Arrangements with pyramidal features having at least one nanostructured surface and methods of making and using
US9050700B2 (en) 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
US9134250B2 (en) 2012-03-23 2015-09-15 Wostec, Inc. SERS-sensor with nanostructured layer and methods of making and using
US9500789B2 (en) 2013-03-13 2016-11-22 Wostec, Inc. Polarizer based on a nanowire grid
EP3161857B1 (en) 2014-06-26 2021-09-08 Wostec, Inc. Method of forming a wavelike hard nanomask on a topographic feature
US10672427B2 (en) 2016-11-18 2020-06-02 Wostec, Inc. Optical memory devices using a silicon wire grid polarizer and methods of making and using
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
WO2018156042A1 (en) 2017-02-27 2018-08-30 Wostec, Inc. Nanowire grid polarizer on a curved surface and methods of making and using
CN113276018B (zh) * 2021-06-15 2022-10-04 北京烁科精微电子装备有限公司 一种化学机械抛光用保持环
WO2024049890A1 (en) * 2022-09-01 2024-03-07 Applied Materials, Inc. Retainer for chemical mechanical polishing carrier head

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2826009A (en) * 1954-12-10 1958-03-11 Crane Packing Co Work holder for lapping machines
US5597346A (en) 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5643061A (en) * 1995-07-20 1997-07-01 Integrated Process Equipment Corporation Pneumatic polishing head for CMP apparatus
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
US6241582B1 (en) * 1997-09-01 2001-06-05 United Microelectronics Corp. Chemical mechanical polish machines and fabrication process using the same
US5944593A (en) * 1997-09-01 1999-08-31 United Microelectronics Corp. Retainer ring for polishing head of chemical-mechanical polish machines
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
US6267643B1 (en) * 1999-08-03 2001-07-31 Taiwan Semiconductor Manufacturing Company, Ltd Slotted retaining ring for polishing head and method of using
DE60138343D1 (de) 2000-07-31 2009-05-28 Ebara Corp Substrathalter und Poliervorrichtung

Also Published As

Publication number Publication date
WO2003061904A1 (en) 2003-07-31
WO2003061904B1 (en) 2003-10-09
US7118456B2 (en) 2006-10-10
US20030171076A1 (en) 2003-09-11
TW200402348A (en) 2004-02-16
KR20040091626A (ko) 2004-10-28
JP2005515904A (ja) 2005-06-02

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MM4A Annulment or lapse of patent due to non-payment of fees