1287963 九、發明說明： 【發明所屬之技術領域】 j發明係有關-種印刷電路板，尤指—種具備良 熱效能的印刷電路板結構，以及相關的製造流程。 月 【先前技術】 ^ $ 按，印刷電路板（Printed 〇 ^ B o a r d ’ P C B)係由傳遞電訊的電路層（銅膜）扮 演各電子7G件之間的電路聯結，並且將所需電路網华 面並且分佈在印刷電路板層之立體式架構，成就不同 兀件之間聯結的網路；印刷電路板之基礎材料，多係利用 絕緣紙、玻璃纖維布或其他纖維材料經樹脂 (㈣㈣疊和而成的積層板，在高溫高壓下於單'面^ 面覆加銅膜而構成；至於，用以構成印刷電路板上、下表 面電路的導顧可透過粒有導電材料的貫穿孔所構成。、 如圖-A至圖-F所示，係為第一種習用雙層印刷電 路板之製造流程當中’各主要加工步驟的結構剖視圖，首 先如圖一A所示，先在一個以介質層為主體的基板丄2 上、下表面壓合既定厚度的銅膜i 3 i (或稱銅箔），再如 圖一 B所示，在基板1 2的既定區域開設書穿a彳j ] 以及如圖一C所示，在貫穿孔i 4 1中電鍍或灌注導電材 料1 4 2，完成導體1 4的架構，由導體1 4構成基板工 2上、下表面銅膜1 3 1的聯結，接著依序利用曝光、顯 衫、蝕刻加工步驟，將基板1 2上、下表面的銅膜1 3 1 建構成為圖一D所示的電路’或者如圖一E所示，進一步 1287963 對既定區域的銅膜1 3 1表面進行金屬化處理，使該區域 . 的銅膜1 3 1覆蓋既定厚度的電鑛層工3 2而成為用以構 • 封相關電子元件或半導體的焊墊架構，最後如圖一F所 不，在基板1 2其中-個表面的銅膜工3工以外區域塗部 . 導熱膠1 5 1，利用導熱膠1 5 1將散熱片1 5 2黏固在 17亥處’以提升印刷電路板的散熱效果。 如圖- A至圖二F所示，則為另一種習用雙層印刷電 • 路板之製造流程當中，各主要加工步驟的結構剖視圖，其 同樣先如圖二A所示，在-個以介質層為主體的基板工2 上:下表面壓合既定厚度的銅膜1 3工（或稱銅荡），再如 圖二B所示，在基板1 2的既定區域開設貫穿孔1 4工， 、以及如目二C所示，在貫穿孔i 4 χ中電鑛或灌注導電材 料1 42，元成導體1 4的架構，由導體丄4構成基板工 2上、下表面銅膜！ 3 1的聯結，接著依序利用曝光、顯 影、蝕刻加工步驟，將基板1 2上、下表面的銅膜丄3工 • 建構成為圖二D所示的電路，或者如圖二E所示，進一步 對既定區域的銅膜1 3 1表面進行金屬化處理，使該區域 的麵1 3 1覆蓋既定厚度的電錄層工3 2而成為用以構 封相關電子兀件或半導體的焊墊架構，最後如圖二f所 不，在基板1 2其中-個表面完全塗佈導熱膠工5工，利 用導熱膠1 5 1將散熱片！ 5 2黏固在基板工2的表面， 以提升印刷電路板的散熱效果。 在上述兩種習用的雙層印刷電路板結構當中，皆係利 用導熱膠1 5 1將散熱片1 5 2黏固在基板1 2上，以讓 1287963 印刷電路板具有散熱效能，如此的結構設計不但所需耗費 的材料成本（‘熱膠以及散熱片）較高，而且所額外附加 的政…、片月,、、、員:t曰加整體印刷電路板的厚度，將對印刷電路 板的適用性構成嚴重的限制。 【發明内容】 有，:本發明即利用散熱基材做為用以構成印刷 電路板:板在政熱基材的上、下表面建構有利用介質 所構成的電路架構，並且讓電路架構以外的散 二了 / :’俾構成—種直接透過散熱基材將熱源釋放， 又ί:好散熱性能，而且有效降低成本、不會增加厚 度的印刷電路板。 材二2 =係在散熱基材上開設有貫穿槽，使散熱基 質材以及錮2隔、’再依序於散熱基材的上、下表面壓合介 上、 ^ :並且分別在兩個電極區隔處設有用以導通 膜進行電路導體’接著對散熱基材上、下表面的銅 用以播点 」处理，並且留下導體週邊既定區域的銅膜 利用雷射將電卜導通，在電路架構建構完成之後， 的散熱基材外露卜的介f材去除，使電路架構以外 路板。 冓成一種具備良好散熱性能的印刷電 【實施方式】 式，=二委下員清⑽^ 用散路板及其製造流程」，主要係利 巧用以構成印刷電路板之基板，在散熱基材 1287963 的上、下表面建構有利用介質材以及銅膜所構成的電路架 構、，並且讓電路架構以外的散熱基材露出，使構成一種直 •接透過散熱基材將熱源釋放，藉以獲致良好散熱性能，而 且有效降低成本、不會增加厚度的印刷電路板。 . 整個印刷電路板之製造流程，如圖三所示，係包括有 下列幾個主要步驟： a·取得一散熱基材做為基板。 參 b在散熱基材上開設貫穿槽，使散熱基材形成兩個電極 區隔。 c ·在散熱基材的表面（其中一個表面或是上、下表面） 建構有利用介質材以及銅膜所構成的電路架構。 d將電路架構以外的介質材纟除，<吏電路架構以外的散 熱基材外露。 於時實施，如圖四A至圖四Η以及圖四所示，首先係 在散熱基材1 6上開設有貫穿槽1 6 i，使散熱基材工6 Φ 形成電極區隔（如圖四A及圖四B所示），再依序於散熱基 材1 6的上、下表面壓合介質材j 3 3以及銅膜1 3 1 (如 圖四C所示），並且分別在兩個電極區隔處設有用以導通 上、下表面銅膜的導體1 4 (如圖四D及圖四E所示），其 中導體14係可以由貫穿散熱基材16上、下表面銅膜1 3 1的貫穿孔1 4 1，以及在貫穿孔丄4 i中電鍍或灌注 導電材料1 4 2所構成。 接著，對散熱基材1 6上、下表面的銅膜1 3 1依序 透過曝光、顯影、蝕刻加工步驟，建構成為圖四^^所示的 1287963 電路’或者如圖四G所示，進一步對既定區域的銅膜1 3 1表面進行金屬化處理，使該區域的銅膜1 3 1覆蓋既定 厚度的電鑛層132而成為用以構封相關電子元件或半導 體的焊塾架構，並且留下導體1 4週邊既定區域的銅膜1 3 1用以構成上、下層電路的導通；在完成上述電路架構 $刻步驟之後，利用雷射將散熱基材i 6上、下表面所外 路的介質材1 3 3去除，如圖四η所示，使電路架構以外 的放熱基材1 6外露，即構成可以直接透過散熱基材將熱 源釋放的雙層印刷電路板。 再者，如圖五Α至圖五Η所示，係為本發明另一實施 例之雙層f路板整個製造流程#巾，幾個主要加卫步驟之 ，構剖視圖；在本實施例t中’所有的加卫製造流程幾乎 思'上述圖四A至圖四η所示的加1順序完全相同，最大差 j處在於’依序在散熱基材1 6的上、下表面壓合介質 及銅膜i 3 1 (如圖五c所示)，可進一步將介 二的材料灌注到貫穿槽16 1的内部，藉以增加 整體印刷電路板的結構強度。 技術如it本發明提供一較佳可行之印刷電路板製造 刷電路板’爰依法提呈發明專利.：效=雙= 令穿明月图y 明’准，以上之實施 回工不，係本發明較佳實施例者，並# gPP 本發明H舉凡與本發kg、//鮮以此揭限 雷同者，料構1置、特徵等近似、 田门者均應屬本發明之創設目的及申請專利範圍之内。 9 1287963 【圖式簡單說明】 圖一 A至圖一 F係為一種習用雔爲 ^$自用又層印刷電路板之製造流程 §中，各主要加工步驟的結構剖視圖。 圖'一 Α至圖-F係為另一種習镳e CT , 禋白用雙層印刷電路板之製造流 程當中，各主要加工步驟的結構剖視圖。 圖三係為本發明本發明之主要製造流程圖。 圖四A至圖四η係為本發明第—實施例之各主要加工步驟1287963 IX. Description of the invention: [Technical field to which the invention pertains] The invention of the invention relates to a printed circuit board, in particular, a printed circuit board structure having good thermal performance, and a related manufacturing process. Month [Prior Art] ^ $ Press, Printed Circuit Board (Printed 〇^B oard 'PCB) is a circuit layer that transfers telecommunications (copper film) to play the circuit between each electronic 7G piece, and the required circuit is huahua The three-dimensional structure of the printed circuit board layer, which realizes the network connected between different components; the basic materials of the printed circuit board are mostly made of insulating paper, fiberglass cloth or other fiber materials through the resin ((4) (four) stack and The laminated board is formed by coating a copper film on a single surface of the high-temperature and high-pressure layer; as a result, the guide for forming the circuit on the lower surface of the printed circuit board can be penetrated through the through-hole of the conductive material. As shown in Figure-A to Figure-F, it is the structural cross-sectional view of the main processing steps in the manufacturing process of the first conventional two-layer printed circuit board. First, as shown in Figure AA, first in a medium. The upper and lower surfaces of the substrate 丄2, which is the main layer, are pressed against a predetermined thickness of the copper film i 3 i (or copper foil), and as shown in FIG. 1B, a book is opened in a predetermined area of the substrate 12] And as shown in Figure C, in the through hole i 4 1 electroplating or infusion of conductive material 1 4 2, complete the structure of the conductor 14 4, the conductor 14 constitutes the bonding of the upper and lower surface copper film 133 of the substrate 2, and then sequentially exposes, shows, and etches In the step, the copper film 1 3 1 on the upper and lower surfaces of the substrate 1 is constructed as the circuit shown in FIG. 1D or as shown in FIG. 1E, and further 1287963 is used to metallize the surface of the copper film 13 1 in a predetermined area. The copper film 133 of the region is covered with a predetermined thickness of the electric ore layer 3 2 to form a pad structure for sealing the relevant electronic component or semiconductor, and finally, as shown in FIG. Among them, a surface of the copper film workman's work area outside the area. Thermal paste 1 5 1, using the thermal adhesive glue 1 5 1 to fix the heat sink 1 5 2 at 17 Hai' to enhance the heat dissipation effect of the printed circuit board. Figure - A to Figure 2F shows a structural cross-sectional view of each of the main processing steps in the manufacturing process of another conventional double-layer printed circuit board, which is also shown in Figure 2A. The substrate is the main body of the substrate 2: the lower surface is pressed with a predetermined thickness of the copper film 1 (or called copper And, as shown in FIG. 2B, a through hole 1 is formed in a predetermined area of the substrate 12, and as shown in FIG. 2C, the electric ore or the infusion conductive material is in the through hole i 4 1. In the structure of the conductor 14 , the conductor 丄 4 constitutes the bonding of the upper surface and the lower surface copper film ! 3 1 , and then the copper film on the upper and lower surfaces of the substrate 1 is sequentially used by exposure, development, and etching processes.丄3 work • Constructed as the circuit shown in Figure 2D, or as shown in Figure 2E, further metallize the surface of the copper film 133 in a given area, so that the surface 1 3 1 of the area covers a predetermined thickness The electro-recording layer 3 2 becomes a pad structure for enclosing the relevant electronic components or semiconductors. Finally, as shown in FIG. 2f, the surface of the substrate 1 2 is completely coated with a thermal conductive adhesive, and the heat conduction is utilized. Glue 1 5 1 will heat sink! 5 2 is adhered to the surface of the substrate 2 to improve the heat dissipation effect of the printed circuit board. In the above two conventional two-layer printed circuit board structures, the heat sink 15 1 is adhered to the substrate 1 2 by using the thermal conductive adhesive 151 to make the 1287963 printed circuit board have heat dissipation performance. Not only the cost of materials required ('hot glue and heat sinks'), but also the additional additional government, film, month, and, member: t曰 plus the thickness of the overall printed circuit board, will be on the printed circuit board Applicability constitutes a serious limitation. SUMMARY OF THE INVENTION Yes, the present invention utilizes a heat-dissipating substrate as a printed circuit board: a board is constructed on the upper and lower surfaces of a thermal substrate, and a circuit structure composed of a medium is constructed, and the circuit structure is Dispersed two / : '俾 constitutes a kind of printed circuit board that directly releases the heat source through the heat-dissipating substrate, and also has good heat dissipation performance, and effectively reduces the cost and does not increase the thickness. Material 2 2 = is provided with a through-groove on the heat-dissipating substrate, so that the heat-dissipating matrix material and the 锢2 are separated, and then the upper and lower surfaces of the heat-dissipating substrate are press-fitted, ^ : and respectively at the two electrodes The interlayer is provided with a conductive film for conducting the circuit conductor 'subsequently for the copper on the upper and lower surfaces of the heat-dissipating substrate for the spotting", and the copper film leaving the predetermined area around the conductor is turned on by the laser, in the circuit After the construction of the frame is completed, the heat-dissipating substrate is exposed to the exposed material, so that the circuit board is outside the circuit board. It is a kind of printing power with good heat dissipation performance [Embodiment], ==2nd member of the second member of the Qing (10)^ using the diffuser board and its manufacturing process", mainly used to form the substrate of the printed circuit board, in the heat dissipation base The upper and lower surfaces of the material 1288963 are constructed with a circuit structure composed of a dielectric material and a copper film, and the heat-dissipating substrate other than the circuit structure is exposed, so that a heat source is discharged through the heat-dissipating substrate to obtain a good heat. A printed circuit board that dissipates heat and effectively reduces cost without increasing thickness. The manufacturing process of the entire printed circuit board, as shown in Figure 3, includes the following main steps: a. Obtain a heat-dissipating substrate as a substrate. The b) has a through-groove on the heat-dissipating substrate to form a two-electrode spacer for the heat-dissipating substrate. c. On the surface of the heat-dissipating substrate (one surface or the upper and lower surfaces), a circuit structure composed of a dielectric material and a copper film is constructed. d Remove the dielectric material other than the circuit structure, and expose the heat-dissipating substrate outside the circuit structure. When implemented in time, as shown in FIG. 4A to FIG. 4 and FIG. 4, firstly, a through-groove 1 6 i is formed on the heat-dissipating substrate 16 to form an electrode partition of the heat-dissipating substrate 6 Φ ( FIG. 4 ) A and FIG. 4B), and then press the dielectric material j 3 3 and the copper film 13 1 (as shown in FIG. 4C) on the upper and lower surfaces of the heat dissipation substrate 16 and respectively in two The electrode portion is provided with a conductor 14 for conducting the copper film on the upper and lower surfaces (as shown in FIG. 4D and FIG. 4E), wherein the conductor 14 can be made of a copper film 13 on the upper and lower surfaces of the heat dissipation substrate 16. The through hole 141 of 1 is formed by plating or injecting a conductive material 142 into the through hole 丄4 i. Next, the copper film 133 on the upper and lower surfaces of the heat dissipation substrate 16 is sequentially subjected to exposure, development, and etching processing steps, and is constructed as a 1287963 circuit shown in FIG. 4 or as shown in FIG. Metallizing the surface of the copper film 133 of a predetermined region, so that the copper film 133 of the region covers the electrodeposited layer 132 of a predetermined thickness and becomes a soldering structure for constructing related electronic components or semiconductors, and The copper film 133 of a predetermined area around the lower conductor 14 is used to form the conduction of the upper and lower circuits; after completing the above-mentioned circuit structure, the laser is used to dissipate the outer surface of the upper and lower surfaces of the substrate i 6 by using a laser. The dielectric material 133 is removed, as shown in FIG. 4n, and the heat-releasing substrate 16 other than the circuit structure is exposed, that is, a double-layer printed circuit board that can directly discharge the heat source through the heat-dissipating substrate. Furthermore, as shown in FIG. 5A to FIG. 5B, it is a whole manufacturing process of the double-layer f-way board according to another embodiment of the present invention, and several main steps of the reinforcement step, a cross-sectional view; in this embodiment t In the 'all the manufacturing process is almost the same as the above-mentioned Figure 4A to Figure 4n, the order of the addition of 1 is exactly the same, the maximum difference j lies in the sequential pressing of the medium on the upper and lower surfaces of the heat-dissipating substrate 16. And the copper film i 3 1 (as shown in FIG. 5c), the second material can be further poured into the inside of the through-groove 16 1 to increase the structural strength of the overall printed circuit board. The present invention provides a preferred and feasible printed circuit board manufacturing brush circuit board '爰 提 提 提 发明 发明 发明 : : : : : : : : 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 令 令 令 令 令 令 令 令 令 令 令Preferred Embodiments, and #gPP The invention of the present invention is the same as the present invention, and the application of the invention is the same as that of the present invention. Within the scope of the patent. 9 1287963 [Simple description of the diagram] Figure 1 A to Figure 1 is a cross-sectional view of the manufacturing process of the self-use and layered printed circuit board. Fig. 1 to Fig.-F is a cross-sectional view showing the structure of each main processing step in the manufacturing process of the double-layer printed circuit board. Figure 3 is a flow chart showing the main manufacturing of the present invention. Figure 4A to Figure 4 are the main processing steps of the first embodiment of the present invention.
的結構剖視圖。 圖五Α至圖五Η係為本發明第二實施例之各主要加工步驟 的結構剖視圖。 【主要元件代表符號說明】 12 基板 1 3 1 —銅膜 1 3 2 —電鍍層 1 3 3 ~介質材 14--導體 1 4 1 —貫穿孔 1 4 2 ~導電材 1 5 1 —導熱膠 1 5 2〜散熱片 16 散熱基材 1 6 1 —貫穿槽 10A cross-sectional view of the structure. Figure 5 to Figure 5 are structural cross-sectional views showing the main processing steps of the second embodiment of the present invention. [Description of main component representative symbols] 12 Substrate 1 3 1 - Copper film 1 3 2 - Plating layer 1 3 3 ~ Dielectric material 14 - Conductor 1 4 1 - Through hole 1 4 2 ~ Conductive material 1 5 1 - Thermal paste 1 5 2~ heat sink 16 heat sink substrate 1 6 1 - through slot 10