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Application filed by Hannstar Board CorpfiledCriticalHannstar Board Corp
Priority to TW94131998ApriorityCriticalpatent/TWI287963B/en
Publication of TW200714184ApublicationCriticalpatent/TW200714184A/en
Application grantedgrantedCritical
Publication of TWI287963BpublicationCriticalpatent/TWI287963B/en
Insulated Metal Substrates For Printed Circuits
(AREA)
Abstract
The present invention relates to a printed circuit board that forms a through groove in a heat-dissipating substrate, thereby separating the heat-dissipating substrate into two electrode isolation zones. Dielectric material and copper film are sequentially pressed to attach to upper and lower surfaces of the heat-dissipating substrate. Conductive elements are respectively arranged in the two electrode isolation zones in order to electrically connect the copper films of the upper and lower surfaces. Thereafter, circuit pattern etching process is applied to the copper films of the upper and lower surfaces of heat-dissipating substrate in order to complete the circuit structure. After the circuit structure is completed, the dielectric material of the circuit structure is removed by laser to expose the heat-dissipating substrate, thereby forming a printed circuit board with good heat-dissipating performance.
TW94131998A2005-09-162005-09-16Heat-dissipating type printed circuit board and manufacturing process thereof
TWI287963B
(en)