JP3933822B2 - Printed wiring board and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed wiring board, and more particularly to a printed wiring board called a “multilayer board” in which a plurality of wiring patterns and an insulating board are laminated in the thickness direction of the board, and a manufacturing method thereof.
[0002]
[Prior art]
Conventionally, as a method for manufacturing a multilayer board, there is known a method of drilling through holes called through holes in the thickness direction of a printed wiring board.
[0003]
FIG. 6 is a vertical sectional view showing a manufacturing process of a multilayer board using through holes.
[0004]
As shown in FIG. 6A, in this method, a through hole 204 is formed in the thickness direction of the insulating substrate 201, and a metal layer 205 is formed by plating the inner wall surface of the through hole 204. In addition, electrical continuity is achieved between the wiring pattern 202 on the upper surface side of the insulating substrate 201 and the wiring pattern 203 on the lower surface side through the metal layer 205. In the method of forming a through hole in this way, a through hole in which the inner wall surface of the through hole 204 is plated remains in the completed printed wiring board because the through hole 204 is drilled and the inner wall surface thereof is plated.
[0005]
By the way, some multilayer boards require a large current to flow. In that case, since the amount of heat generation increases due to resistance when electricity flows through the thin wiring pattern, it is necessary to attach a metal plate for heat dissipation called a heat suppressor from the outside of the printed wiring board 210.
[0006]
FIG. 6A shows a state in which a heat suppressor is disposed on the lower side of the insulating substrate 201 in the drawing. As shown in FIG. 6A, an adhesive sheet 206 is disposed on the lower side of the printed wiring board 210, and a heat suppressor 207 is further disposed and pressed to place the heat suppressor 207 under the printed wiring board 210. On the side.
[0007]
[Problems to be solved by the invention]
However, in the conventional method, since the printed wiring board 210 itself has through holes (through holes) in the thickness direction, when the printed wiring board 210, the adhesive layer 206, and the heat suppressor 207 are pressed, the adhesive layer 206 adheres. The agent may flow into the through hole 204. Thus, the adhesive that has flowed into the through hole 204 overflows to the upper surface side of the printed wiring board 210 via the through hole 204 and protrudes to a position higher than the conductive layer 202 on the upper surface side of the printed wiring board 210 or the conductive layer 202. May cover the surface.
[0008]
The conductor layer 202 needs to be subjected to processing such as etching in order to form a wiring pattern. Further, it is necessary to attach a semiconductor element or the like to the wiring pattern, and when the adhesive protrudes to a position higher than the wiring pattern 202, it is necessary to scrape the adhesive, resulting in an increase in the number of manufacturing steps.
[0009]
On the other hand, even when pressed, the adhesive of the adhesive layer 206 may not flow into the through hole 204, but in this case, the metal layer 205 on the inner wall surface of the through hole 204 is exposed. Therefore, when the conductor layer 202 is etched, the metal layer 205 is removed by contact with the etching solution, and the electrical continuity between the conductor layer 202 and the conductor layer 203 is destroyed. In order to prevent this, it is necessary to fill the through hole 204 with resin or the like to close the hole, but there is a problem that additional steps such as resin filling and subsequent molding are required and the number of manufacturing steps increases.
[0010]
The present invention has been made to solve the above conventional problems. That is, an object of the present invention is to provide a printed wiring board manufacturing method capable of manufacturing a high-quality printed wiring board with a small number of steps, and a printed wiring board obtained by such a manufacturing method.
[0011]
As another problem, there is a problem that a manufacturing process for multilayering a printed wiring board is long.
[0012]
That is, in the conventional method, the layers are sequentially stacked as shown in FIG. That is, a wiring pattern is formed by etching the upper and lower conductive layers of the core material 301, and a through hole 322 is drilled, and the inner wall surface of the through hole 322 is plated to electrically connect the upper and lower wiring patterns (FIG. 21 (a)).
[0013]
Next, insulating substrates 310 and 320 are laminated on the upper and lower sides of the core material 301, and conductor layers 311 and 321 are further laminated thereon (FIG. 21C). Holes 323 and 324 are formed from above the conductor layers 311 and 321 with a laser beam or the like, and a metal layer is formed by plating the inner wall surfaces of these holes 323 and 324 to achieve electrical conduction in the thickness direction. Similarly, the insulating substrates 327 and 328 and the conductor layers 329 and 330 are stacked one by one by performing a series of processes including laser drilling and plating.
[0014]
However, in this method, since it is necessary to form the multilayer structure one by one in order to form a multilayer structure, there is a problem that the number of steps is long and it takes too much time for manufacturing.
[0015]
The present invention has been made to solve the above conventional problems. That is, an object of the present invention is to provide a printed wiring board manufacturing method capable of manufacturing a high-quality printed wiring board with a small number of steps, and a printed wiring board obtained by such a manufacturing method.
[0016]
[Means for Solving the Problems]
The printed wiring board of the present invention includes an insulating substrate, a first wiring pattern formed on the first surface of the insulating substrate, and a second wiring formed on the second surface of the insulating substrate. A pattern, a conductor bump embedded in the insulating substrate and electrically connecting the first wiring pattern and the second wiring pattern, and an adhesive layer laminated on the second wiring pattern; And a heat dissipating material layer laminated on the adhesive layer.
[0017]
In the printed wiring board, heat transfer bumps may be embedded in the adhesive layer to connect the second wiring pattern and the heat dissipation material layer so that heat transfer is possible.
[0018]
Moreover, in the printed wiring board, at least one or more insulating substrates are laminated between the second wiring pattern and the adhesive layer, and the whole is composed of a plurality of insulating substrates and conductor plates. It may be a multilayer board laminated.
[0019]
The method for manufacturing a printed wiring board of the present invention includes a step of forming a conductor bump on a first conductor plate, and a step of disposing an insulating substrate prepreg on the front end side of the conductor bump formed on the first conductor plate. A step of pressing the first conductive plate and the insulating substrate prepreg to pass the conductive bumps through the insulating substrate prepreg, and a surface of the insulating substrate prepreg through which the conductive bump tips pass. A step of providing a second conductor plate; a step of etching the first conductor plate to form a first wiring pattern; and a step of etching the second conductor plate to form a second wiring pattern. And the step of First or Forming an adhesive layer on the second wiring pattern; and laminating a heat dissipation material layer on the adhesive layer.
[0020]
Another method of manufacturing a printed wiring board according to the present invention includes a step of forming a conductor bump on a first conductor plate, and an insulating substrate prepreg is disposed on the leading end side of the conductor bump formed on the first conductor plate. A step of pressing the first conductive plate and the insulating substrate prepreg to pass the conductive bump through the insulating substrate prepreg, and a surface through which the conductive bump tip of the insulating substrate prepreg penetrated A step of disposing a second conductor plate thereon; a step of etching the first conductor plate to form a first wiring pattern; and a step of etching the second conductor plate to form a second wiring pattern. Forming an adhesive layer on the wiring pattern on the side opposite to the first wiring pattern, and forming an adhesive layer on the wiring pattern on the side opposite to the first wiring pattern. You Comprising a step, a step of laminating the heat dissipation material layer on the adhesive layer.
[0021]
In the present invention, since electrical continuity between a plurality of wiring patterns arranged in the thickness direction of the multilayer board is achieved by using a conductor bump, a through hole such as a through hole does not remain. Therefore, there is no need to drill a through hole or close the through hole, so the number of processes can be reduced.
[0022]
Still another printed wiring board manufacturing method of the present invention includes a step of forming an intermediate board unit having a through hole formed therein and a wiring pattern on the surface, and an upper board unit having a wiring pattern and a conductor bump on the surface. A step of forming a lower substrate unit having a wiring pattern and a conductor bump on the surface, the upper substrate unit, the insulating substrate prepreg, the intermediate substrate unit, the insulating substrate prepreg, and the lower substrate unit. A step of laminating, a step of pressing the upper substrate unit and the lower substrate unit toward the intermediate substrate unit, and a hole in the surface of the upper substrate unit or the lower substrate unit to expose a wiring pattern inside the substrate unit Forming a conductor layer on the surface of the hole obtained by the drilling process, and Characterized by comprising a line pattern, and a step of electrically connecting the wiring pattern the exposed.
[0023]
Still another printed wiring board manufacturing method of the present invention includes a step of forming an upper substrate unit having a wiring pattern and a conductor bump on the surface, and a step of forming an intermediate substrate unit having a wiring pattern on the surface. And laminating the upper substrate unit, the insulating substrate prepreg, the intermediate substrate unit, the insulating substrate prepreg, and the lower substrate unit. A step, a step of pressing the upper substrate unit and the lower substrate unit toward the intermediate substrate unit, a step of forming a hole and a through hole in the stacked upper substrate unit or the lower substrate unit, the hole and Forming a conductor layer in the through hole to electrically connect the wiring patterns.
[0024]
In this method, a known method such as drilling or a method using a laser beam can be used for forming the hole and the through hole.
[0025]
The present invention can be used not only as a printed wiring board but also as a semiconductor package.
[0026]
In the present invention, since electrical continuity between a plurality of wiring patterns arranged in the thickness direction of the multilayer board is achieved by using a conductor bump, a through hole such as a through hole does not remain. Therefore, there is no need to drill a through hole or close the through hole, so the number of processes can be reduced.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
Hereinafter, an embodiment of a printed wiring board and a manufacturing method thereof according to the present invention will be described. FIG. 1 is a process diagram illustrating a manufacturing process of the printed wiring board 11 according to the present embodiment, and FIGS. 2 and 3 are vertical sectional views illustrating the manufacturing process of the printed wiring board 11 according to the present embodiment.
[0028]
First, as shown in FIG. 2A, a conductor plate 1 such as a copper foil is prepared, and a plurality of substantially conical conductor bumps 2, 2,... Are printed on one side of the conductor plate 1 according to a predetermined pattern. It is formed using a technique or the like (FIG. 2B). Next, an insulating substrate prepreg 3 is arranged at a position on the tip side of the conductor bumps 2, 2,... Formed on the surface of the conductor plate 1 (FIG. 2 (c)). In this state, the conductor plate 1 and the insulating substrate prepreg 3 are pressed through, for example, an elastic material. The conductor bumps 2, 2,... Penetrate through the insulating substrate prepreg 3 by this pressing, and the tips of the conductor bumps 2, 2,. When the tip protrudes, the tips of the conductor bumps 2, 2,... Are abutted against the elastic material, so that the tips are rounded and the shape of the conductor bumps 2, 2,. It spreads in any direction and becomes a shape as shown in FIG. A conductive layer 4 is formed by plating or the like on the surface side of the insulating substrate prepreg 3 on the side where the tips of the conductive bumps 2, 2,... Protrude (FIG. 2 (e)). The insulating substrate prepreg 3 is cured by applying a treatment such as heating to the uncured substrate 10 formed in this way to obtain the substrate 10.
[0029]
Next, by etching the upper and lower surfaces of the substrate 10 thus obtained, a wiring pattern is formed to obtain a substrate unit 10a (FIG. 3A).
[0030]
Thereafter, an adhesive sheet 5 as an adhesive layer is disposed on the lower surface side of the substrate unit 10a in the drawing, and a metal plate 6 as a heat radiating plate is disposed below the adhesive sheet 5 (FIG. 3 (b)). To do. The substrate unit 10a and the metal plate 6 are bonded by the adhesive sheet 5 by this pressing.
[0031]
As described in detail above, according to the method of the present invention, the conductor bumps 2, 2,... Are embedded in the insulating substrate prepreg and arranged in the substrate thickness direction through the insulating prepregs 2, 2,. Electrical continuity between a plurality of wiring patterns provided is achieved. Therefore, there is no need to drill through holes, and the number of processes can be reduced by the amount that the process for drilling can be omitted. Further, since no through hole is provided, no through hole is formed in the substrate unit 10a. Therefore, even if the board unit 10a, the adhesive sheet 5 and the metal plate 6 are stacked and pressed, troubles caused by the adhesive of the adhesive sheet 5 entering the through holes are prevented.
[0032]
Further, since no through hole is provided, there is no possibility that the etching liquid flows into the through hole and the electrical connection between both sides of the substrate is cut off when the conductive plate on the upper surface side of the substrate is etched to form a wiring pattern.
[0033]
The scope of the present invention is not limited to the invention described in the above embodiment. For example, although the printed wiring board has been described in the above embodiment, the present invention can be used not only as a printed board but also as a semiconductor package.
[0034]
In the above-described embodiment, the printed wiring board 11 having a structure in which the metal plate 6 is disposed on the lower surface side of one board unit 10a having wiring patterns on the upper and lower surfaces via the adhesive layer 5 has been described. However, the present invention can be similarly applied to a multilayer board laminated in a multilayer structure.
[0035]
FIG. 4 is a vertical sectional view showing a modified example of the printed wiring board of the first embodiment. In this printed wiring board, an adhesive sheet 24 and a metal plate 25 as a heat dissipation material layer are provided on the lower surface side of the multilayer board 20 having a multilayer structure in which a plurality of insulating boards 21 to 23 and a plurality of wiring patterns 24 to 27 are laminated. And a structure in which these are laminated. In this case, only the outermost layer on the side opposite to the side where the metal plate 25 is attached, that is, the insulating substrate 21 located at the uppermost portion in the drawing, is formed with electrical conduction in the substrate thickness direction by the conductor bumps 26, 26,. The electrical conduction of the insulating substrate 22 and the insulating substrate 23 laminated on the inner side may be formed by a conductor bump, through-hole plating, or other known methods. At least the insulating substrate 21 on the outermost layer side has conductor bumps 26, 26,.
If the electrical continuity is formed and the through hole is not drilled, the adhesive will not overflow to the outermost layer side, and the trouble that the etching solution enters the through hole and causes disconnection will occur. This is because it can be prevented.
[0036]
(Second Embodiment)
The second embodiment of the present invention will be described below. Note that, in the second embodiment, the description overlapping with the first embodiment is omitted.
[0037]
FIG. 5 is a vertical cross-sectional view showing the manufacturing process of the printed wiring board according to the second embodiment. In the printed wiring board of the present embodiment, conductor bumps are also embedded in the adhesive layer.
[0038]
Below, the manufacturing method of the printed wiring board of this embodiment is demonstrated.
[0039]
In the method according to this embodiment, first, a metal plate 35 as a heat dissipation material layer is prepared (FIG. 5A), and a heat conductive bump is formed on the surface of the metal plate 35. 32 , 32 ,... Are formed using a printing technique or the like (FIG. 5B). Here, the heat conductive bump may be made of any material as long as it is a bump made of a material that easily transfers heat. Similar to the conductor bumps 2, 2,... Used in the first embodiment, the bumps may be made of a material that easily conducts electricity as well as heat, such as silver paste. . However, in that case, the wiring pattern on which the tip of this bump (conductor bump) is pressed is required to be a wiring pattern that constitutes the grounding portion of the printed wiring board.
[0040]
Next, a substrate unit 10a having wiring patterns 1 and 4 formed on the upper and lower surfaces is prepared as in the first embodiment, and an adhesive sheet as an adhesive layer is provided on the lower surface side of the substrate unit 10a. 34 is disposed, and a metal plate 35 on which the heat conductive bumps 32, 32,... Are formed is disposed on the lower side (FIG. 5C).
[0041]
When the metal plate 35 and the board unit 10a are pressed in this state, the heat conductive bumps 32, 32,... Penetrate through the adhesive sheet 34 as shown in FIG. A printed wiring board in contact with the wiring pattern 1 is obtained.
[0042]
In this printed circuit board, the heat conductive bumps 32, 32,... Penetrate through the adhesive sheet 34 and thermally connect the metal plate 35 and the wiring pattern 1. , ... function as a path of heat. Therefore, since the heat generated in the wiring pattern 1 is released to the metal plate 35 through the heat conductive bumps 32, 32,..., The cooling effect of the wiring pattern 1, and thus the printed wiring board is improved. can get.
[0043]
(Third embodiment)
Next, a third embodiment of the present invention will be described.
[0044]
FIG. 7 is a process diagram illustrating a manufacturing process of the printed wiring board according to the present embodiment. In describing the method for manufacturing a printed wiring board according to this embodiment, first, the manufacture of a core material as an intermediate board unit will be described. FIG. 8 is a vertical sectional view showing the manufacturing process of the core material.
[0045]
In order to manufacture the core material, first, a prepreg (hereinafter referred to as “prepreg”) 50 of an insulating substrate is prepared (FIG. 8A), and the upper and lower surfaces of the prepreg 50 are made of, for example, copper foil. The conductor layers 51 and 52 are laminated and pressed under heating to cure the prepreg 50 (FIG. 8B). During this curing, the conductor layers 51 and 52 and the prepreg 50 are bonded to obtain the core material 53. Next, predetermined wiring patterns 51a and 52a are respectively formed by subjecting the conductor layers 51 and 52 of the core material 53 to an etching process or the like (FIG. 8C). Next, a through hole 54 is drilled in the core material 53 by a known method such as drilling or laser beam (FIG. 8D). Thereafter, the inner wall of the through hole 54 is subjected to electroless plating or the like to form a metal layer 55, and the wiring patterns 51a and 52a are electrically connected via the metal layer 55 (FIG. 8E). ).
[0046]
Next, manufacture of the substrate laminated on the core material 53 will be described.
[0047]
9 and 10 are vertical cross-sectional views showing the manufacturing process of the substrate unit laminated on the core material.
[0048]
First, a laminated plate 63 in which conductor layers 61 and 62 are formed on the upper and lower surfaces of the insulating substrate 60 is prepared (FIG. 9A). The wiring pattern 62a is formed (FIG. 9B). Next, conductor bumps 64, 64,... Are formed on the wiring pattern 62a by using a printing technique or the like to obtain the upper substrate unit 63a (FIG. 9C).
[0049]
Similarly, a laminated board 73 having conductor layers 71 and 72 formed on upper and lower surfaces of the insulating substrate 70 is prepared (FIG. 10A), and the conductor layer 71 on the upper surface side of the laminated board 73 is etched. A predetermined wiring pattern 71a is formed (FIG. 10B). Next, conductor bumps 74, 74,... Are formed on the wiring pattern 71a by using a printing technique or the like to obtain a lower substrate unit 73a (FIG. 10C).
[0050]
Next, an insulating substrate prepreg 65 is disposed between the upper surface side of the core material 53 thus formed and the substrate unit 63a with the conductor bumps 64 facing the lower surface side, and the lower surface side of the core material 53 and the conductor bumps are disposed. An insulating substrate prepreg 66 is disposed between the substrate unit 73a and 74 facing the upper surface (FIG. 11). In this state, the upper substrate unit 63 a and the lower substrate unit 73 a are pressed toward the core material 53.
[0051]
By this pressing, the conductor bumps 64, 64,... Penetrate the insulating substrate prepreg 65 and are pressed against the wiring pattern 51a on the upper surface of the core material 53 to electrically connect the wiring pattern 62a and the wiring pattern 51a. Similarly, the conductor bumps 74, 74,... Penetrate the insulating substrate prepreg 66 and are pressed against the wiring pattern 52a on the lower surface of the core material 53 to electrically connect the wiring pattern 71a and the wiring pattern 52a (FIG. 12). ).
[0052]
Simultaneously with this pressing, the multilayer board 75 is heated to cure the insulating substrate prepregs 65 and 66, and then the uppermost conductor layer 61 and the lowermost conductor layer 72 are patterned by etching or the like to form wiring. Patterns 61a and 72a are formed (FIG. 13).
[0053]
Next, the upper surface of the multilayer board 75 is subjected to processing such as drilling or laser beam irradiation to remove the wiring pattern 61a and the insulating substrate 60 therebelow to form a hole 76, and further lower the wiring. The surface of the pattern 62a is exposed (FIG. 14). In exactly the same manner, the lower surface of the multilayer board 75 is subjected to processing such as drilling or irradiating with a laser beam to remove the wiring pattern 72a and the insulating substrate 70 on the upper side thereof to open a hole 77, and further to the wiring pattern on the upper side. The surface of 71a is exposed (FIG. 14).
[0054]
The hole 76 thus formed is subjected to a treatment such as electroless plating to form a metal layer 78 to electrically connect the wiring pattern 61a and the wiring pattern 62a.
(FIG. 15). Similarly, a process such as electroless plating is performed on the hole 77 to form a metal layer 79, and the wiring pattern 71a and the wiring pattern 72a are electrically connected.
[0055]
As described in detail above, the method of this embodiment combines the conductor bump penetration method with drilling, drilling with a laser beam, and plating process, so the number of processes is less than the conventional method of laminating one layer at a time. Therefore, a printed wiring board can be efficiently manufactured in a short time.
[0056]
In addition, you may affix the metal plate as a thermal radiation material layer further on the lowest layer of the multilayer board of this embodiment through an adhesive sheet. FIG. 16 is a vertical sectional view showing a state in which the metal plate 81 is laminated on the lower surface side of the multilayer board 75 of the present embodiment via the adhesive sheet 80. Thus, heat dissipation can be improved by laminating the metal plate 81.
[0057]
(Fourth embodiment)
The fourth embodiment of the present invention will be described below. In addition, description is abbreviate | omitted about the part which overlaps with the said embodiment. 17 and 18 are vertical sectional views showing the manufacturing process of the multilayer board according to this embodiment. For the substrates 94 and 114 shown in FIG. 17, conductor plates are laminated on both surfaces of the insulating substrate prepregs 90 and 110, respectively, and patterned to form wiring patterns 91 and 92 in the same manner as in the third embodiment. After forming the wiring patterns 111 and 112, the conductor bumps 93, 93,... Are formed on the wiring pattern 92, and the conductor bumps 113, 113,. Further, the core material 103 was obtained by laminating a conductor plate on both surfaces of the insulating substrate prepreg 100 and then heat-curing and patterning to form the wiring patterns 101 and 102.
[0058]
The upper substrate unit 94, the lower substrate unit 114, and the core material 103 obtained in this way are, as shown in FIG. 17, the upper substrate unit 94, the insulating substrate prepreg 120, the core material 103, and the insulating substrate prepreg 121. The lower substrate unit 114 is arranged from the top in this order, and the conductor bumps 93, 93,... And the conductor bumps 113, 113,.
[0059]
In this state, the upper substrate unit 94 and the lower substrate unit 114 are pressed toward the core material 103.
[0060]
By this press, the conductor bumps 93, 93,... Penetrate the insulating substrate prepreg 120, and the tip part comes into contact with the wiring pattern 101. The conductor bumps 93, 93,. (Fig. 18). Exactly in the same manner, the conductor bumps 113, 113,... Penetrate the insulating substrate prepreg 121 by pressing and the tip portion contacts the wiring pattern 102, and the wiring bumps 113, 113,. Are electrically connected (FIG. 18).
[0061]
Simultaneously with this pressing, the multilayer board 130 is heated to cure the insulating substrate prepregs 120 and 121, and a pattern is formed to form wiring patterns 91a and 112a. Thereafter, drilling is performed or a laser beam or the like is applied to the surface of the multilayer board 130 to form the holes 130 and 131 and the through hole 132 is drilled. Next, metal layers 133, 134, and 135 are formed by an electroless plating method or the like. The metal layer 133 electrically connects the wiring pattern 91a and the wiring pattern 92, and the metal layer 134 electrically connects the wiring pattern 111 and the wiring pattern 112a.
[0062]
Further, the wiring patterns 91a, 92, 101, 111, and 112a are electrically connected by the metal layer 135.
[0063]
Thus, according to the method of this embodiment, the conductor bump penetration method is combined with drilling, drilling with a laser beam, and plating process, so the number of processes is smaller than the conventional method of laminating one layer at a time. The printed wiring board can be manufactured efficiently in a short time. In addition, since the metal layers 133, 134, and 132 are formed after the holes 130, 131 and the through-hole 132 are formed using drilling or a laser beam, the metal layers 133, 134, and 132 can be formed at a time. An effect is obtained.
[0064]
【The invention's effect】
According to the present invention, since electrical continuity between a plurality of wiring patterns arranged in the thickness direction of the multilayer board is achieved by using the conductor bumps, no through hole such as a through hole remains. . Therefore, there is no need to drill a through hole or close the through hole, and the number of processes can be reduced.
[Brief description of the drawings]
FIG. 1 is a process diagram showing a manufacturing process of a printed wiring board according to the present invention.
FIG. 2 is a vertical sectional view showing a manufacturing process of the printed wiring board of the present invention.
FIG. 3 is a vertical sectional view showing a manufacturing process of the printed wiring board of the present invention.
FIG. 4 is a vertical sectional view showing a modified example of the printed wiring board of the present invention.
FIG. 5 is a vertical sectional view showing a manufacturing process of the printed wiring board of the present invention.
FIG. 6 is a vertical sectional view showing a manufacturing process of a conventional printed wiring board.
FIG. 7 is a process diagram showing a manufacturing process of the printed wiring board of the present invention.
FIG. 8 is a vertical sectional view showing a manufacturing process of the printed wiring board of the present invention.
FIG. 9 is a vertical sectional view showing a process for manufacturing a printed wiring board according to the present invention.
FIG. 10 is a vertical sectional view showing a manufacturing process of the printed wiring board of the present invention.
FIG. 11 is a vertical sectional view showing a process for manufacturing a printed wiring board according to the present invention.
FIG. 12 is a vertical sectional view showing a process for manufacturing a printed wiring board according to the present invention.
FIG. 13 is a vertical sectional view showing a process for manufacturing a printed wiring board according to the present invention.
FIG. 14 is a vertical sectional view showing a process for manufacturing a printed wiring board according to the present invention.
FIG. 15 is a vertical cross-sectional view showing the manufacturing process of the printed wiring board of the present invention.
FIG. 16 is a vertical sectional view showing a process for manufacturing a printed wiring board according to the present invention.
FIG. 17 is a vertical sectional view showing a process for manufacturing a printed wiring board according to the present invention.
FIG. 18 is a vertical sectional view showing a process for manufacturing a printed wiring board according to the present invention.
FIG. 19 is a vertical sectional view showing a process for manufacturing a printed wiring board according to the present invention.
FIG. 20 is a vertical cross-sectional view showing the manufacturing process of the printed wiring board of the present invention.
FIG. 21 is a vertical sectional view showing a manufacturing process of a conventional printed wiring board.
[Explanation of symbols]
3 ... Insulating substrate,
4 ......... Wiring pattern (first wiring pattern),
1... Wiring pattern (second wiring pattern),
2 ... Conductor bumps
5 ... Adhesive layer
6 ... Metal plate (heat dissipation material layer).

Claims (2)

An insulating substrate;
A first wiring pattern formed on a first surface of the insulating substrate; a second wiring pattern including a grounding wiring pattern formed on a second surface of the insulating substrate; and the insulating substrate. A board unit that is embedded therein and includes a conductor bump that electrically connects the first wiring pattern and the second wiring pattern;
An adhesive layer laminated on the second wiring pattern of the substrate unit;
A heat dissipating metal plate laminated on the adhesive layer;
A printed wiring board comprising: a heat conductive conductor bump protruding from the metal layer for heat dissipation and penetrating through the adhesive layer and in contact with the grounding wiring pattern of the board unit . Forming a conductor bump on the second conductor plate;
Disposing an insulating substrate prepreg on the leading end side of the conductor bump formed on the second conductor plate;
Pressing the second conductive plate and the insulating substrate prepreg to penetrate the conductive bump into the insulating substrate prepreg;
Disposing a first conductor plate on a surface through which the conductive bump tip of the insulating substrate prepreg penetrates;
Curing the insulating substrate prepreg;
Etching the first conductor plate to form a first wiring pattern;
Etching the second conductive plate to form a second wiring pattern including a grounding wiring pattern;
A step of sequentially disposing a metal plate for heat dissipation in which a heat conductive conductor bump protrudes from a surface on the adhesive layer and the adhesive layer side on the second wiring pattern;
And a step of pressing the insulating substrate on which the wiring pattern is formed, an adhesive layer, and a heat-dissipating metal plate, and bringing the heat-conductive conductor bump into contact with the grounding wiring pattern for integration. A method for manufacturing a wiring board.

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