TWI284971B - Multichip stack structure - Google Patents

Multichip stack structure Download PDF

Info

Publication number
TWI284971B
TWI284971B TW095103006A TW95103006A TWI284971B TW I284971 B TWI284971 B TW I284971B TW 095103006 A TW095103006 A TW 095103006A TW 95103006 A TW95103006 A TW 95103006A TW I284971 B TWI284971 B TW I284971B
Authority
TW
Taiwan
Prior art keywords
wafer
stack
carrier
stack structure
semiconductor
Prior art date
Application number
TW095103006A
Other languages
English (en)
Other versions
TW200729446A (en
Inventor
Kun-Chen Liu
Chien-Chih Chen
Chung-Pao Wang
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW095103006A priority Critical patent/TWI284971B/zh
Priority to US11/591,973 priority patent/US20070170572A1/en
Application granted granted Critical
Publication of TWI284971B publication Critical patent/TWI284971B/zh
Publication of TW200729446A publication Critical patent/TW200729446A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Description

1284971 九、發明說明： 【發明所屬之技術領域】 種關於 、—本發明係有關於-種多晶騎疊結構，尤指 稷數具皁邊銲墊之晶片的堆疊結構。 【先前技術】 力產品之微小化以及高運作速度需求的择 二車一半導體封裝結構之性能 子產品小型化之需求，半導體封裳件 才口電 (Muhichip paekage)乃成^θ 于裝 之半導體晶片相入乂„0 男悍错此將兩個或兩個以上 日日片、、且δ在早一封裝結構中，以 積，並提昇電性功能。亦即，多晶片封 == 個或兩個以上之晶片組合在 筹Τ糟由將兩 作速度之限制最小化。此外曰：：二二來使系統運 間連，線路之長度而降低訊號延遲以及存取時間。 ^ ^ 1Μ t ί I " 2r " # ^ ^ # ^ (side-by'side) 於一共同基^之主要^ =個以上之晶片彼此並排地安裝 造之缺點為封裝二:二因:=式多晶片封裝構 片數目的增加而加大。H同基板之面積會隨著晶 所辦f解決上述習知問題，近年來常使用堆疊方法來安裝 rl:的晶片，其堆疊的方式按照其晶片之設計及打線製 旦沾ϋ不同。如5己^、卡結構即為—種整合複數晶片之高容 1的快閃記憶體電路模組，其内之快閃記憶體晶片(fiash memory chlp)係將其表面之鲜塾設計成集中於一邊，因 5 19267 1284971. T ’於晶片堆疊時係採用階梯狀方式進行堆疊，藉以使該 ^堆疊之晶片得以外露出設於其—邊之銲塾，以便於 進行打線作業。 、 —π麥閱第1圖’係為美國專利第6，则，528號所揭示 -種多晶片堆疊結構，其係在晶片承載件10上堆疊了複 ^曰片’以將第一晶片U安裝於晶片承載件10上，第二 曰曰片12以一偏移之距離而不妨礙第一晶片η銲墊11〇之 > 作業為原則下堆疊於該第-晶片u上，第三晶片13 為原距離而不妨礙第二晶片12銲墊12G之打線作業 最：厂堆登於該第二晶片12上，以形成階梯狀之晶片堆 構；接著再進行打線作業，以利用複數銲線14而使該 1_弟二及第三晶片n，12，13電性連接至該晶片承載件。 則述梯狀之晶片堆疊結構雖較並排晶片方式節省 ^壯且可先行堆疊晶#後，再—次進行打線作業，並透 勝“=壓製程以形成用以包覆該堆疊晶片及銲線之封裝 ^产對製程作業；其中為減少於料模壓製程之 該封心ϊ Γ擊造成線弧傾倒(sweep)或斷裂(br°ken)， 才攻杈壓製程之注模口 (moldgate) :方:r’而其可能之實施態樣即如第…上 吏/、鋅線端遠離注模口 G(如第2A圖所示 線^朝向注模口 G(如第2B圖所示）。 次使J干 於封=二第Γ圖所示’當鲜線端遠離注模口0，而 覆該階梯二自該注模口 〇注入封農樹脂以形成包 梯狀曰曰片堆豐結構之封裝膠體時，因封襄樹脂模流 19267 6 1284971 會直接衝擊該階梯狀晶片堆疊結構中上層晶片之懸空部 分，如此，將容易造成上層晶片發生制離問題（如虛線所 示）。 相對地，如第2B圖所示，當銲線端朝向注模口 G， 而於封裝模壓製程中，自該注模口 〇注入封㈣脂以形成 包覆㈣梯狀晶片堆疊結構之封農膠體時，因受模流回流 衫響，即容易在該階梯狀晶片堆疊結構之懸空部分形成氣 洞v，甚而導致於後續熱處理 ^ 賴度測试產生爆米花 (popcorn)效應，造成封裝產品不良問題的產生。 安再者’請參閱第3圖’係為美國專利第M40,622 f卢 案所揭示之半導體梦罟伞而-立 儿 •等電子產。圖’為提升如前述記憶卡 .1 Γ 電性功能’勢必於«結射增設如電容元 % -般係散佈於=之:邊動了 35 ’惟該些被動元件 面尺寸之增加。之兩邊’如此將造成封裝結構平 ^制甚如何提供一種可避免多晶片堆疊結構於封事桓 :，同時可有效提供被動元件接著區 成之目標。 λ馬目刖亟待達 【發明内容】 鑑於以上習知缺點，本發明 晶片堆疊結構， 、係‘供一種多 μ %以避免於封裝模壓製程中堆晶 ▲衝擊造成剝離之問題。 定之日日片受模 本發明之再—日M ^ 、系提供-種多晶片堆疊結構，以避 19267 7 1284971 免於封裝模壓製程中產生氣洞問題。 分提ίίS的係提供―種多晶片堆疊結構’可充 刀棱供被動7G件之接著區域。 傅J兄 為達上揭及其他目的，本 構，其係包含：-晶…：揭路一種多晶片堆疊結 梯狀方六曰7?载件，稷數半導體晶片，係以階 罘狀方式依序堆豐於該晶片 件，係接詈料曰h f戰件上，以及至少-被動元 继曰片中上對應於該階梯狀堆昼之半導 == 卜懸出半導趙晶片之下方。該些半導懸晶 有早邊鋅墊且呈階梯狀 方晶片不致擋到下方晶片件上’使得上 線製程，以供該此半導體曰片域’而不妨礙打 .晶片承載件。 日片、“複數條銲線電性連接至 :發明之多晶片堆疊結構主要係在階梯狀晶片堆疊 i被動=晶片承载件上對應於外懸出晶片之—側預先設 晶=俾在封裝製程中，對應該階梯狀晶片堆 ·=:鲜線端係平行朝向注模口時，即可利_^ 乍為、=件以避免氣洞之產生；相對地，當料端是對 J仃通離於注模口時，即可利用該被動元件作為阻播件 以避免模流直接衝擊晶片’而造成晶片剝離問題；同時由 於《亥被動元件係接置於該晶片承載件上對應於堆疊晶片外 up刀之下方，藉以充分提供被動元件接著區域，避免習 =被動元件散佈設於晶片兩側所造成使用面積之增加，而 得縮減封裝結構之平面尺寸。 【實施方式】 19267 8 1284971 乂下係藉由特疋的具體實施例並配合圖式說明本發 明之實施方式，熟習此技藝之人士可由本說明書所揭示之 内容輕易地瞭解本發明之其他優點與功效。 請參閱第4A及4B圖，係為本發明之多晶片堆疊結構 之剖面及平面示意圖。如圖所示，該多晶片堆疊結構係包 ^ · 一晶片承載件40 ;複數半導體晶片41，係以階梯狀方 式依序堆疊於該晶片承載件4〇上；以及至少一被動元件 曾係接置於5亥晶片承載件4〇上對應於該階梯狀堆疊之半 ’導體晶片中外懸出半導體晶片之下方。 該晶片承載件4 〇係例如為一基板結構。該進行堆属 半導體晶片41係例如為快閃記憶體晶片，其平面且尺 寸、.、勺略相同，且於單邊設有複數鮮塾41〇， 導體晶片41以其具銲墊41〇之_ 、層之丰 片Μ 一預先設定之距離，並使Jim下^之半導體晶 致擔到下層之半導體曰月^于 導體晶片41不 “…田 之銲墊410直向上區域，而依 丨序進仃堆豐各該半導體晶片41，萨以 一 之階梯狀晶片堆疊結構，且外；^/成-早故晶片外懸 塾41〇,進而供該些半導體晶二^ 片4 1件以猎由複數條错綠4 4 而電性連接至該晶片承載件4 〇。 *數仏鋅線4 4 於本實施例中，該銲線4 多晶片堆疊結構時所注人封與供封裝該 態，且該銲線端係對庫設於 曰/拉口0呈平行狀
該階梯狀堆疊晶片之；主模口 G之-㈣ 之-側。 卜心日日片部分係對應朝向該注模口 G 19267 9 1284971 等，以動二45係如電容元件、電阻元件或電感元件 ^ ^ ^ 4Τ φ ； ^7?^# 4 0 ^ ^ ^ ^ ^ ^ ^ + V體日日片41中外懸出晶片之下方。 如此士，不僅可藉由該被動元件45提升整體結構電性 功此，同蚪亦可利用該被動元件45作為阻擋件，以 裝樹脂模流直接衝擊該階梯狀之晶片堆疊 剝離問題。 再^珉日日片 •閱ί 51，係為本發明之多晶片堆叠結構第二 二=1。本實施例之多晶片堆疊結構係與前述 Λ施例大致相同，主要差里力於 要差異在於该銲線端係對應設於朝向 扭之—側，亦即該階梯狀堆疊晶片之外懸晶片部 分係對應遠離該注模口 G之一側，a + _ 恭技Mu 側，如此，該接置於晶片承 載件40上，且對應於該階梯狀堆疊之半導體晶片中外 晶片下方之被動元件45,係可作用為填充件， _ 模壓製程中氣洞的產生。 ι兄封衣 '•晶二:ί過本發！之多晶片堆疊結構主要係在階梯狀 曰且、、^構，係在晶片承載件上對應於外懸出晶片之— 側預先設置至少-被動元件，俾在封裝模壓製程中，對應 該階梯狀晶片堆疊結構之銲線端係平行朝向注模口時，: 可利用該被動元件作為填充件以避免氣洞之產生；相對 地，當銲線端是對應平行遠離於注模口時，即可利用該 動元件作為阻播件以避免模流直接衝擊晶片，而造成^ 剝離問題；同時由於該被動元件係接置於該晶片承裁件上 對應於堆疊晶片外懸部分之下方，藉以充分提供被動元件 19267 10 1284971 接著區域’避免習知被動元件散佈設於晶片兩侧所造成使 用面積之增加，而得縮減封裝結構之平面尺寸。 惟以上所述之具體實施例，僅係用以例釋本發明之特 點及功效，而非用以限定本發明之可實施範疇，在未脫離 本發明上揭之精神與技術範疇下，任何運用本發明所揭示 内容而完成之等效改變及修飾，均仍應為下述之申請專利 範圍所涵蓋。 【圖式簡單說明】 田第1圖係為美國專利第6,9⑼，528號所揭示之多晶片 堆豐結構之剖面示意圖； 第2 A圖係為習知多晶片堆疊結構於封裝模壓製程時 ^生上層晶片剝離問題之剖面示意圖； 第2B圖係為習知多晶片堆疊結構於封裝模壓製程時 兔生氣洞問題之剖面示意圖； _ =圖^美國專利第6，_，622號所揭示之半導體 衣置平面示意圖； 第4A及4B圖係為本發明 之剖面及平面示意圖；以及 第5圖係為本發明之多晶 示意圖； 之多晶片堆疊結構第一實施 片堆疊結構第二實施之剖面 【主要元件符號說明】 晶片承載件 繁一曰 Η 牙7 曰曰乃 望一曰fci 外一日日乃 19267 11 10 1284971 13 弟二晶片 110,120 銲墊 14 銲線 31 半導體晶片 35 被動元件 40 晶片承載件 41 半導體晶片 410 銲墊 # 44 鲜線 45 被動元件

Claims (1)

1284971 ι· # 3· 4· 5. 、申請專利範圍： 一種多晶片堆疊結構，其係包含： 一晶片承載件； 複數半導體晶片，係以階 片承载件上；以及 _狀方式依序堆疊於該晶 該二二:!動：件’係接置於該晶片承載件上對應於 方梯狀堆登之半導體晶片中外懸出半導體晶片之下 如申請專利範圍第1項之容曰 晶片承#株成^ 、之夕日日片堆豐結構，其中，該 曰曰月承载件為一基板結構。 範圍第1項之多晶片堆疊結構，其中，該 + V肢晶片為快閃記憶體晶片。 如申請專利範圍第i項之多曰ΰ协田 半導體”置、夕曰曰片堆豐結構，其中，該 片：邊t有複數銲塾，且在依序堆疊該半導 二ΓΓ传出各該半導體晶片之銲墊，藉以 4#早心4外懸之階梯狀 如申請專利範圍第4項之多晶片堆二：構： 半導I#曰片夕祕田从 隹®、、、口構’其中，該牛V體曰曰片之堆璧結射，上、下 墊係位於同一側，且卜层主 、日日片之如 體晶片預定之距離，以僻If ^ 墊直向上區域，以㈣層半導體晶片之薛 電性連接至該晶#承载件。 错料線而 :"倉專利範圍第i項之多晶片堆叠結構，” +導體晶片係藉由複數條銲線而電性連接至該晶片承〆 19267 13 1284971 載件。 .7.如申請專利範圍第6項之多晶片堆疊結構，盆中，节 銲線之佈設方向係與供封裝該多晶片堆疊結構時岐 入封裝樹脂之注模σ呈平㈣g。 ^主 8· t申料利範圍第7項之多晶片堆疊結構，其中，該 在干線鳊係對應設於遠離該注模口之一側 9. ?請專利範圍第7項之多晶片堆疊結構，其中，該 =梯=堆豐晶片之外懸晶片部分係對應朝向 擊之一側。 10. 如申請專利範圍第7項之多晶片堆疊結構，其中，該 崔干線端係對應設於朝向該注模口之一侧。α χ u.如申請專利範圍第7項之多晶片堆最社構， 階梯狀堆疊晶片之外科曰片邻—構”中，该 之一側。 夕卜懸曰曰U分係對應遠離該注模口 19267 14
TW095103006A 2006-01-26 2006-01-26 Multichip stack structure TWI284971B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095103006A TWI284971B (en) 2006-01-26 2006-01-26 Multichip stack structure
US11/591,973 US20070170572A1 (en) 2006-01-26 2006-11-01 Multichip stack structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095103006A TWI284971B (en) 2006-01-26 2006-01-26 Multichip stack structure

Publications (2)

Publication Number Publication Date
TWI284971B true TWI284971B (en) 2007-08-01
TW200729446A TW200729446A (en) 2007-08-01

Family

ID=38284736

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103006A TWI284971B (en) 2006-01-26 2006-01-26 Multichip stack structure

Country Status (2)

Country Link
US (1) US20070170572A1 (zh)
TW (1) TWI284971B (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100764682B1 (ko) * 2006-02-14 2007-10-08 인티그런트 테크놀로지즈(주) 집적회로 칩 및 패키지.
US8723332B2 (en) * 2007-06-11 2014-05-13 Invensas Corporation Electrically interconnected stacked die assemblies
TW200917391A (en) * 2007-06-20 2009-04-16 Vertical Circuits Inc Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabrication
US8704379B2 (en) 2007-09-10 2014-04-22 Invensas Corporation Semiconductor die mount by conformal die coating
WO2009114670A2 (en) 2008-03-12 2009-09-17 Vertical Circuits, Inc. Support mounted electrically interconnected die assembly
US7863159B2 (en) 2008-06-19 2011-01-04 Vertical Circuits, Inc. Semiconductor die separation method
US9153517B2 (en) 2008-05-20 2015-10-06 Invensas Corporation Electrical connector between die pad and z-interconnect for stacked die assemblies
US8552566B1 (en) 2008-05-30 2013-10-08 Maxim Integrated Products, Inc. Integrated circuit package having surface-mount blocking elements
TWI570879B (zh) 2009-06-26 2017-02-11 英維瑟斯公司 半導體總成及晶粒堆疊總成
US8476749B2 (en) * 2009-07-22 2013-07-02 Oracle America, Inc. High-bandwidth ramp-stack chip package
US8552546B2 (en) 2009-10-06 2013-10-08 Samsung Electronics Co., Ltd. Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure
US9147583B2 (en) 2009-10-27 2015-09-29 Invensas Corporation Selective die electrical insulation by additive process
TWI544604B (zh) 2009-11-04 2016-08-01 英維瑟斯公司 具有降低應力電互連的堆疊晶粒總成
US9082632B2 (en) 2012-05-10 2015-07-14 Oracle International Corporation Ramp-stack chip package with variable chip spacing
CN103928416B (zh) * 2014-03-24 2016-09-07 三星半导体(中国)研究开发有限公司 具有无源器件的半导体封装件及其堆叠方法
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
US9825002B2 (en) 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9490195B1 (en) 2015-07-17 2016-11-08 Invensas Corporation Wafer-level flipped die stacks with leadframes or metal foil interconnects
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
US9595511B1 (en) 2016-05-12 2017-03-14 Invensas Corporation Microelectronic packages and assemblies with improved flyby signaling operation
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3575001B2 (ja) * 1999-05-07 2004-10-06 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
US20060267173A1 (en) * 2005-05-26 2006-11-30 Sandisk Corporation Integrated circuit package having stacked integrated circuits and method therefor

Also Published As

Publication number Publication date
TW200729446A (en) 2007-08-01
US20070170572A1 (en) 2007-07-26

Similar Documents

Publication Publication Date Title
TWI284971B (en) Multichip stack structure
US7598617B2 (en) Stack package utilizing through vias and re-distribution lines
US7312519B2 (en) Stacked integrated circuit package-in-package system
US8617924B2 (en) Stacked integrated circuit package-in-package system and method of manufacture thereof
US6703713B1 (en) Window-type multi-chip semiconductor package
TWI415201B (zh) 多晶片堆疊結構及其製法
US8729687B2 (en) Stackable integrated circuit package system
US20070164403A1 (en) Semiconductor package structure and fabrication method thereof
US8680686B2 (en) Method and system for thin multi chip stack package with film on wire and copper wire
US8659175B2 (en) Integrated circuit package system with offset stack
US20070085184A1 (en) Stacked die packaging system
US8809118B2 (en) Chip on leads
TW200807682A (en) Semiconductor package and method for manufacturing the same
TW544894B (en) Chip carrier with dam bar
KR20090113679A (ko) 스택 패키지
US20080237831A1 (en) Multi-chip semiconductor package structure
KR101219086B1 (ko) 패키지 모듈
JP2010087403A (ja) 半導体装置
TWI230447B (en) Multi-chips package
KR20110123505A (ko) 반도체 패키지
US20080303130A1 (en) Package on package structure
KR20060133800A (ko) 칩 스택 패키지
KR20090077580A (ko) 멀티 칩 패키지
CN106971981A (zh) 半导体封装、半导体装置及制造半导体封装的方法
TWI328274B (en) Multi-chip stack package