1284624 九、發明說明： 【發明所屬之技術領域】 半導艘晶圓通常係由製造商發貨至買受人所在地。在長程運 輸期間必須加以覆蓋而且運輸工具必須經常變換。所以，該等敏 感之半導體晶圓極易遭到損壞。甚至雖無刮傷或破裂所引起之可 見損壞，雜質亦會對該等半導體晶圓造成不良影響或甚至使其無 法充作預期用途，例如：電子元件之製造。 • 【先前技術】 美國專利US 6，131，739之申請專利範圍一項有關許多裝 有半導體晶圓之容器之減震包裝專利，該減震包裝包括兩個泡沫 塑膠半殻且具有若干凹槽，該等凹槽可以完全合適之方式將該等 容器納入。在特殊工業界，可商購之容器習稱••前啟運輸箱 (FOSBs)。舉例言之，美國專利us g,58；^264中曾述及此種 類型之容器。 •此種類型之減震包裝便於減低運輸期間半導體晶圓遭受機 械損害之風險。 【發明内容】 本發明之内容係一種半導體晶圓即期發貨包裝及在包裝作 業中實施半導想晶圓即期發貨包裝之方法。 本發明之目的係提供一種半導體晶圓即期發貨包裝，該即期 發貨包裝可進一步減低損害之風險並可實質上確保其中所運輸之 半導體晶圓自容器内取出時之情況實質上可對應於裝入該容器時 1284624 之半導體晶圓之情況。 本發明之技細容係-半導艘晶圓即期發貨包裝，其中包括 a) 一可關閉塑膠容器，該可關閉塑膠容器内裝有半導體晶圓且 具有-護蓋、-本體，該護蓋與該本體之間有—密及一微粒 過遽器，該微粒過渡器係整合在該容器内，且可使該容器内部空 間與該容器外部環境間實施氣體交換作用； b) -塑膠質第-靭套，套環繞著該容器鋪祕減壓緊靠 在該容器上； d) 用以結合水氣之裝置； e) -塗覆塑膠質之第二勒套’利用―塗層該第二勒套阻止水氣 之通過並藉助於減Μ而緊靠該第-勒套及倚靠該容器； f) 減震性元件類，該等元件係以完全合適之方式嵌入該經鞍套 之容器内；及 _ g) _外包裝’該外包裝以完全合適之方式環繞著該經雙重勒套 及嵌入之容器。 本發明之另一技術内容係如申請專利範圍第丄、2、3或4 項在包裝内實施半導體晶圓即期發貨包裝之方法，該方法包含下 列諸步驟： a)清洗及烘乾許多容器類，該等容器形成一批量； w分析該批中之每個容器是否有微粒類、金屬類及有機物質類 所引起之雜質存在,· 1284624 C)若分析結果顯示各個雜質類低於所界定之極限值，將半導體 晶圓類裝入該批之其他容器内，並用護蓋類將該等容器關起來； d) 用該第一鞍套將該等容器套起來並在該第一鞠套内產生一 減壓直至該第一鞘套緊靠在該等容器上； e) 用該第二個鞘套將該等業經套起來之諸容器套起來，並在該 第一鞘套内產生一減壓直至該第二鞘套緊靠在該等業經套起來之 容器上； f) 至少於該等容器與該第一鞘套之間（於步驟d)期間）或於該 等業經套起來之諸容器與該第二勒套之間（於步称e)期間）送入 用以結合水氣之裝置； g) 將該等雙重套起來之容器嵌入減震諸元件内；及 h) 將該等業經雙重套起來及業經喪入之容器包裝在該外包裝 内並將該外包裝關閉；或若步驟b)内所做之該等分析顯示各個雜 質並非完全低於所界定之極限值，則與本批之其他諸容器形成一 個新批，繼續實施步驟a)。 【實施方式】 本發明之包裝特別適於發貨半導體晶圓類，尤其適於發貨直 徑最低為300公厘之發半導艘晶圓類。其特別顯著之事實是：可 有效地保護該包裝内之半導體晶圓免於遭受振動所引起之損害及 免於任何類型外來物質所造成之污i再者，該包裝之結構可使 該等半導體晶圓在自容器内取出時免於導致該等半導體晶圓受到 Ϊ284624 茲參考用以圏示該包裝特性之圖式將本發明作更詳細之說 明。 半導體晶圓類1係位於可商購之塑膠容器2内，該容器2包 括一本體3及一護蓋4。適當之塑膠以聚碳酸酯（pc)、聚對苯二 甲酸丁二醇酯（PBT)、聚烯彈性艎類（p〇E)及聚乙基乙烯（pEE) 為佳本體3與護蓋4之間最好裝一密封检（尤以一密封環5更 佳），以防開關護蓋4時因摩擦產生微粒並形成一屏障以阻擋外界 微粒之進入。該容器2提供容納許多（通常為25個）半導體晶圓1 之空間。舉例言之，該等半導體晶圓間隔規律、於具有側面導引 條片之狹槽内，且通常係藉簧片使其保持垂直站立位置，在護蓋 關閉後該等簧片即與護蓋結合成一個整體。再者，該容器2具有 至少一個可通氣之開口，該開口可將一留存微粒之過濾器6封閉 起來。該開口可設在該容器之護蓋4或本體3内。 該容器2至少係由兩個鞘套套起來。該第一鞘套7 (該鞘套7 係直接倚靠在該容器上，且以透明塑膠膜質者為佳，尤以聚乙稀 更佳。該膜最好用可以增加撕裂及穿刺抗力之塗層予以加強。尤 以包括一聚醯胺(PA)層或聚對苯二曱酸乙二醇酯（pET)層或該 兩層之組合體更佳。該第二鞘套8係由一經塗覆之塑膠所組成， 該經塗覆之塑膠亦以聚乙烯（PE)為佳，該塗層可增加機械強度 (尤其可增加撕裂及穿刺抗力），且形成一對抗外界水氣之屏障。 其中以塗鋁之塑膠膜為佳，尤以用可以增加撕裂及穿刺抗力之外 9 1284624 層予以額外增強之此類薄膜更佳。該外層以由聚醯胺（PA)或聚對 苯二曱酸乙二醇酯（PET)或該兩層之組合體所組成為佳。為防止 内部水氣，裝一可結合水氣之裝置9，尤以一個或更多個充以可 萃取水氣之紙質或其他材料之小包為佳。該結合水氣裝置9最好 配置在第一鞠套與第二鞘套之間以吸收經由第一鞘套7擴散之水 氣。即使該裝置釋放出微粒亦不受影響，蓋因該等半導體晶圓1 仍繼續受到容器2及第一鞠套7之保護。但，除容器2與第一鞘 套7之間之外，亦可以再增加或變通之方式配置該結合水氣裝置 9。該兩個鞘套及容器可各自設置標籤。 該容器内部與（一方面）容器2及第一鞠套7間之空間及（另 一方面）與第一鞘套7及第二鞠套8間之空間有一壓力差，所以該 等鞘套可與該容器或彼此之間緊靠。如此亦可防止該等元件因其 變形以及業經鞘套容器與該等元件間之可能相對運動（總是會產 生微粒）造成損傷。該壓力差以高達5〇毫巴為佳。最好有兩個減 震元件10置於鞘套容器之相對兩側。該等減震元件10最好係由 泡沫塑膠或具有類似特性之材料所組成，尤以由聚乙烯（PP)、聚 苯乙烯（PS)或聚胺基甲酸酯（PU)製之減震元件更佳。該等元件具 有若干凹槽，該業經鞘套之容器係以完全適合之方式嵌入該等凹 槽内。該等元件之外尺寸對應於外包裝11之内尺寸。同樣以完全 適合之方式，該外包裝11將該等元件1〇及嵌入其内之鞘套容器 2完全包袠起來。所以在運輸該等半導體晶圓1期間該容器2或 10 1284624 元件10不可能在外包裝11内發生移動。該外包裝最好係由硬紙 板材料或輕金屬製成。該外包裝之尺寸最好加以適當選擇俾如此 即可立即發貨且（也許）可堆放在活動貨架上。 在所述即期發貨包裝内該等半導體晶圓係以兩種方式加以 保護免受水氣之作用，亦即内部藉結合水氣之裝置9及外部藉該 第二鞘套8 ’該第二鞠套8形成一屏障以防止水氣之入侵。對防 止微粒入侵所實施之特別保護作用係由該容器2之護蓋4及本體 3間之密封環5及由該容器壁内之過濾器（該過濾器可阻止微粒6 穿過)提供。對防止半導體晶圓受到有機物質、微量金屬及微粒污 染之保護作用係由使用不引起任何污染之容器及鞘套材料所提 供。有關該容器該保護作用係加以嚴格測試。該項測試方法係本 發明方法之一部分，以下將作更詳細之說明。 在該容器裝入半導體晶圓之前，先將其加以清洗及烘乾。實 _ 施清洗之方式是：充以清洗劑之浸沒浴或喷灑清洗劑在該容器上 之裝置。該清洗作用之實施最好歷經一限定之時段並在控制之外 界情況下，尤以業經設定限定溫度及大氣相對濕度之第10級或以 下之清洗室更佳。一經通過品質管制，容器内僅裝入半導體晶圓。 品質管制包括··微粒、微量金屬、微量離子及微量有機雜質之分 析，以及（也許）損傷及缺點之目視檢查，唯獨在分析及檢查結果 顯示未超過所定極限值及無損傷及缺點之情況下始算合格。藉分 析作用所實施之品質管制係對代表一批相同容器類之一個容器實 11 1284624 施。若此^質_絲係無不合格者，即可料雜之其他容 器裝人半導體晶ϋ類。否則，該批之其他容器必須再加以清洗及 烘乾或（也許）將其剔除不予進一步處理。 下列不應超過之極限值適用於·· a)液相微粒計數(LPC)試驗，其中將該容器充以無微粒超純水 並使其在-姉上旋轉，之後取ώ 5Q毫升之試樣，並湘一可商 籲購之雷射散射光量測裝置檢查微粒之存在（液相微粒計數，㈣： 若測定直徑>1微米之微粒，以低於so個微粒為佳尤以低 於10個微粒更佳； ‘ 若測定直徑>0·3微米之微粒，以低於1〇〇〇個微粒為佳， 尤以低於100個微粒更佳； 若測定直徑>0·2微米之微粒，以低於2〇〇〇個微粒為佳， 尤以低於200個微粒更佳； Φ b)微量金屬及金屬離子試驗，其中將該容器充以50毫升無任 何雜質之超純水並使其在一樞轴上旋轉，並藉助於ICP-MS (感應 偶合電衆-質譜儀）或藉助於CE (毛細管電泳)將該試樣加以分析： 在藉ICP_MS測定時，金屬之總量至多為1〇〇奈克，尤以至 多10奈克更佳； 在藉CE測定時，離子之總量至多為200来克，尤以至多100 奈克更佳； C)有機雜質試驗’其中將容器材料加熱至高溫，藉氣相色譜法 12 1284624 將逸出之氣態有機雜質（例如：ε_氨基己内醢胺，四氫呋喃）加以 分析： 在藉氣相色譜法測定時，有機雜質之總濃度<5〇個百萬分 點’尤以<5個百萬分點更佳（以受測容器材料之重量為基準）。 將半導艘晶圓類裝入容許裝貨之容器内並予以關閉。此項工 作最好藉助於一機器人。之後用第一鞘套將該容器加以鞘套，（也 φ 許）於該容器與該鞠套之間放置一水氣萃取包，將該鞘套内部之壓 力予以減低並將該鞘套加以熔焊。該容器内出現之氣體環境最好 包括：空氣、氮、一惰性氣體或前述諸氣體之任何預期混合物。 之後，將該業經鞘套一次之容器再用第二鞘套將其鞘套加以熔 焊，（也許）於第一及第二鞘套之間放置一水氣萃取包，將第二鞠 套内之壓力減低並將該第二鞘套加以熔焊。該第二鞘套内存在之 氣體環境最好包括：空氣、氮、一惰性氣體或該等氣體之任何預 • 期混合物。將依照上述方式業經鞘套兩次之容器置入減震元件 内，將如此形成之包裝包入該外包裝内並將該外包裝關閉。 該即期發貨包裝之品質管制及結構可確保收貨人能將性能 對應於裝入容器時性能之半導體晶圓自包裝中取出。再者，該收 貨人對有關該等半導體晶圓之打開包裝仍具有極大之彈性。舉例 言之，即使在清潔室環境之外仍可移除外包裝，該等減震元件及 該第一勒套。但，該容器之第一鞍套及尤其該容器之護蓋應在收 貨人所在地之清潔室内移除。 13 1284624 本發明可防止在該等半導體晶圓運輸期間有足夠量之揮發 性雜質凝結在半導體晶圓上而對隨後電子元件（尤其線寬低於 0.1微米之電子元件）之製造工作產生不良影響。而且亦防止有殘 留水氣凝結下來（該凝結下來之殘留水氣同樣地對電子元件之製 造造成問題）。同時亦防止該等半導體晶圓在運輸期間受到來自包 裝之微粒污染，該項污染將同樣對電子元件之製造造成問題。再 者’尤其在包裝期間使用減壓可防止該容器因含有空氣而對外包 裝作相對運動，以致在有運輸引發振動之情況下，導致該等半導 趙晶圓跳出簧片固定器，並以不適當之方式變得脆弱（尤其在邊緣 區内），因而增加發生破裂之風險（尤其在電子元件製造中實施有 關熱處理期間）。該無任何活動間隙之包裝亦可防止運輸期間對該 等鞘套造成損傷，因該等損傷可在打開包裝時對該等半導體晶圓 造成污染。 本發明確保：由外界物質所引起、呈局部化光散射點形式 (LPD，光點缺陷）、直徑超過0·05微米、其中在該等半導體晶 圓包裝之前每個側面具有低於10個缺陷之半導體晶圓污染，即使 在該等半導體晶圓業經運輸及打開包裝之後亦不超過該標準。 14 1284624 【圖式簡單說明】 第1圖：本發明包裝特性之示意圖。1284624 Nine, invention description: [Technical field of invention] Semi-guide wafers are usually shipped from the manufacturer to the buyer's location. It must be covered during long-haul transport and the means of transport must change frequently. Therefore, these sensitive semiconductor wafers are extremely susceptible to damage. Even if there is no visible damage caused by scratches or cracks, the impurities may adversely affect the semiconductor wafers or even cause them to be used for the intended purpose, such as the manufacture of electronic components. • [Prior Art] U.S. Patent No. 6,131,739, the entire disclosure of which is incorporated herein by reference in its entirety in its entire entire entire entire entire entire entire entire entire entire entire entire entire entire portion These grooves can be incorporated into the container in a completely suitable manner. In the special industry, commercially available containers are known as •• Front Containers (FOSBs). For example, a container of this type is described in U.S. Patent No. 5,258; • This type of shock absorbing package facilitates reducing the risk of mechanical damage to the semiconductor wafer during transport. SUMMARY OF THE INVENTION The present invention is directed to a semiconductor wafer immediate delivery package and a method of performing semi-conductor wafer immediate delivery packaging in a packaging operation. SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor wafer immediate delivery package that further reduces the risk of damage and substantially ensures that the semiconductor wafer being transported therein is substantially removable from the container. Corresponds to the case of the semiconductor wafer of 1284624 when the container is loaded. The invention relates to a semi-conductor wafer immediate delivery package, which comprises a) a closable plastic container, the detachable plastic container is provided with a semiconductor wafer and has a cover, a body, There is a dense and a particulate filter between the cover and the body, the particle transition device is integrated in the container, and gas exchange between the internal space of the container and the external environment of the container can be performed; b) - plastic a first-vulture sleeve, the sleeve is wrapped around the container and decompressed against the container; d) a device for combining moisture; e) - a second sleeve coated with plastic material a second jacket prevents the passage of moisture and abuts against the container by means of a reduction; and f) a shock absorbing element, the components being embedded in the saddle in a completely suitable manner Inside the container; and _g) _ overpacking 'The outer wrap surrounds the double ferrule and the embedded container in a completely suitable manner. Another technical content of the present invention is a method for implementing a semiconductor wafer immediate delivery package in a package as in the scope of claim 2, 2, 3 or 4, the method comprising the following steps: a) cleaning and drying a plurality of Containers, these containers form a batch; w analyze each container in the batch for the presence of impurities caused by particulates, metals and organic substances, · 1284624 C) If the analysis results show that each impurity is lower than the Defining the limit values, loading the semiconductor wafer into other containers of the batch, and closing the containers with a cover; d) tying the containers with the first saddle and at the first a reduced pressure is generated in the sleeve until the first sheath is in close proximity to the containers; e) the second sheathed sleeve is sheathed by the second sheath and produced in the first sheath a reduced pressure until the second sheath abuts against the nested containers; f) at least between the containers and the first sheath (during step d) or in the industry Between the containers and the second ferrule (during step e) a device for combining moisture; g) embedding the double-stacked containers in the shock absorbing components; and h) packaging the double-wrapped and escaping containers in the outer package and The outer packaging is closed; or if the analysis made in step b) indicates that the individual impurities are not completely below the defined limit values, a new batch is formed with the other containers of the batch and step a) is continued. [Embodiment] The package of the present invention is particularly suitable for the delivery of semiconductor wafers, and is particularly suitable for shipping semi-conducting wafers having a diameter of at least 300 mm. It is particularly remarkable that the semiconductor wafer in the package can be effectively protected from the damage caused by vibration and from the contamination caused by any type of foreign matter, and the structure of the package can make the semiconductor The present invention will be described in greater detail by the fact that the wafers are removed from the container without causing the semiconductor wafers to be referenced by the reference numeral 284,624 for illustrating the packaging characteristics. The semiconductor wafer 1 is housed in a commercially available plastic container 2, which includes a body 3 and a cover 4. Appropriate plastics are made of polycarbonate (pc), polybutylene terephthalate (PBT), polyene elastic oxime (p〇E) and polyethylethylene (pEE). It is preferable to install a seal test (especially a seal ring 5), in order to prevent the particles from being generated by friction when the cover 4 is opened and to form a barrier to block the entry of foreign particles. The container 2 provides a space for accommodating a plurality of (typically 25) semiconductor wafers 1. For example, the semiconductor wafers are regularly spaced in the slots having the side guiding strips, and are typically held in a vertical standing position by the reeds, the reeds and the cover being closed after the cover is closed. Combine into one whole. Further, the container 2 has at least one ventable opening that encloses a filter 6 that retains particulates. The opening can be provided in the cover 4 or body 3 of the container. The container 2 is at least covered by two sheaths. The first sheath 7 (the sheath 7 is directly resting on the container, and is preferably made of a transparent plastic film, especially polyethylene. The film is preferably coated with a tear and puncture resistance. The layer is reinforced, particularly comprising a layer of polyamine (PA) or polyethylene terephthalate (pET) or a combination of the two layers. The second sheath 8 is coated The coated plastic is also made of polyethylene (PE), which increases mechanical strength (especially increases tearing and puncture resistance) and forms a barrier against external moisture. Among them, an aluminum-coated plastic film is preferred, and it is particularly preferable to use a film which is additionally enhanced by a layer of 12 1284624 which can increase the tearing and puncture resistance. The outer layer is made of polyamine (PA) or poly-p-phenylene. Ethylene phthalate (PET) or a combination of the two layers is preferably formed. To prevent internal moisture, a device 9 capable of combining moisture is provided, in particular one or more with extractable moisture. Preferably, a packet of paper or other material is preferred. The combined moisture device 9 is preferably disposed between the first sleeve and the second sheath The water vapor diffused through the first sheath 7 is absorbed. Even if the device releases the particles, the cover is still protected by the container 2 and the first sleeve 7 because of the protection. In addition to being between the first sheath 7, the combined water and gas device 9 may be further added or modified. The two sheaths and the container may each be provided with a label. The inside of the container and the container 2 (on the one hand) The space between the first sleeve 7 and (on the other hand) has a pressure difference from the space between the first sheath 7 and the second sleeve 8, so that the sheaths can be in close contact with the container or each other. It is also possible to prevent damage to the elements due to their deformation and possible relative movement between the sheathed container and the elements (which always produces particles). The pressure difference is preferably up to 5 mbar. Preferably two The damping elements 10 are placed on opposite sides of the sheath container. The damping elements 10 are preferably composed of foamed plastic or materials having similar properties, in particular polyethylene (PP), polystyrene (PS). Or a cushioning member made of polyurethane (PU) is preferred. Having a plurality of recesses, the sheathed container is embedded in the recesses in a suitable manner. The outer dimensions of the components correspond to the inner dimensions of the outer package 11. Also in a completely suitable manner, the outer package 11 The components 1 and the sheath container 2 embedded therein are completely enclosed, so that the container 2 or 10 1284624 component 10 is unlikely to move within the outer package 11 during transport of the semiconductor wafers 1. Preferably, it is made of cardboard material or light metal. The size of the outer package is preferably selected as appropriate, so that it can be shipped immediately and (maybe) can be stacked on the movable shelf. The semiconductor wafer is protected from moisture by two means, that is, by means of a device 9 combined with moisture and externally by the second sheath 8', the second sleeve 8 forms a barrier to prevent water Invasion of gas. The special protection against particle intrusion is provided by the seal ring 5 between the cover 4 and the body 3 of the container 2 and by a filter in the wall of the container which prevents the particles 6 from passing through. The protection against contamination of organic wafers, trace metals and particulates by semiconductor wafers is provided by the use of containers and sheath materials that do not cause any contamination. This protection is strictly tested for the container. This test method is part of the method of the present invention and will be described in more detail below. The container is cleaned and dried before it is loaded into the semiconductor wafer. _ The method of cleaning is: a immersion bath filled with a cleaning agent or a device for spraying a cleaning agent on the container. Preferably, the cleaning action is carried out for a limited period of time and in the case of control outside the boundary, particularly in the cleaning chamber of the 10th or lower level which sets the defined temperature and the relative humidity of the atmosphere. Once quality control is in place, only the semiconductor wafer is loaded into the container. Quality control includes analysis of particulates, trace metals, trace ions and trace organic impurities, and (perhaps) visual inspection of damages and defects, except that the analysis and inspection results show that the specified limits are not exceeded and that no damage or defects are present. The next calculation is qualified. The quality control implemented by the analysis is applied to a container representing a group of identical containers. If there is no unqualified one, the other containers can be loaded with semiconductor wafers. Otherwise, the other containers in the batch must be washed and dried or (maybe) removed for further processing. The following limit values should not be exceeded for a liquid phase particle count (LPC) test in which the container is filled with ultra-pure ultrapure water and rotated on a crucible, followed by a sample of 5 Q ml. And the laser scattered light measuring device purchased by Xiang Yi can be used to check the presence of particles (liquid phase particle count, (4): If the particle diameter > 1 micron is measured, it is better to be lower than so particles. 10 particles are better; 'If the particle diameter > 0·3 micron is determined, preferably less than 1 particle, especially less than 100 particle; if diameter is determined > 0.2 micron The particles are preferably less than 2 particles, especially less than 200 particles; Φ b) trace metal and metal ion test, wherein the container is filled with 50 ml of ultrapure water without any impurities And rotating it on a pivot and analyzing the sample by means of ICP-MS (Inductively Coupled Mass Spectrometer) or by means of CE (Capillary Electrophoresis): Total amount of metal when measured by ICP_MS At most 1 〇〇Nike, especially 10 ng is better; when measured by CE, the total amount of ions is at most 20 0 gram, especially 100 ng better; C) Organic impurity test 'where the container material is heated to a high temperature, by gas chromatography 12 1284624 will escape the gaseous organic impurities (for example: ε_aminohexine oxime Amine, tetrahydrofuran) was analyzed: The total concentration of organic impurities was determined by gas chromatography to be < 5 百万 million parts, especially <5 parts per million (in terms of the material of the tested container) Weight is the basis). The semi-guided wafers are loaded into containers that are allowed to be loaded and closed. This work is best done with the help of a robot. Then, the container is sheathed with a first sheath, and (also φ) a moisture extraction bag is placed between the container and the cuff, the pressure inside the sheath is reduced, and the sheath is melted. weld. Preferably, the gaseous environment present within the vessel comprises: air, nitrogen, an inert gas or any desired mixture of the foregoing gases. Thereafter, the sheathed sleeve is then welded to the sheath by the second sheath, and (may) a water vapor extraction bag is placed between the first and second sheaths, and the second sheath is placed inside. The pressure is reduced and the second sheath is welded. Preferably, the gaseous environment present in the second sheath comprises: air, nitrogen, an inert gas or any pre-mixture of such gases. A container that has been sheathed twice in the manner described above is placed into the cushioning element, and the thus formed package is wrapped into the outer package and the outer package is closed. The quality control and structure of the immediate delivery package ensures that the consignee can remove the semiconductor wafer from the package with performance corresponding to the performance of the container. Furthermore, the consignee is still extremely resilient to the unpacking of such semiconductor wafers. For example, the outer package, the cushioning elements and the first ferrule can be removed even outside the clean room environment. However, the first saddle of the container and in particular the cover of the container should be removed in the clean room where the consignee is located. 13 1284624 The present invention prevents a sufficient amount of volatile impurities from condensing on a semiconductor wafer during transport of such semiconductor wafers, thereby adversely affecting the manufacturing of subsequent electronic components, particularly electronic components having a line width of less than 0.1 micron. . Moreover, it is also prevented that residual moisture is condensed (the condensed residual moisture also causes problems in the manufacture of electronic components). At the same time, these semiconductor wafers are also prevented from being contaminated by particles from the package during transportation, which will also cause problems in the manufacture of electronic components. In addition, the use of decompression during the packaging process prevents the container from moving relative to the outer package due to the inclusion of air, so that the semi-conductive wafer jumps out of the reed holder in the event of vibration caused by transportation, and is improper. The way becomes fragile (especially in the marginal zone), thus increasing the risk of cracking (especially during the implementation of heat treatment in the manufacture of electronic components). The packaging without any active clearance also prevents damage to the sheath during transport, which can contaminate the semiconductor wafers when the package is opened. The invention ensures that, in the form of localized light scattering dots (LPD, spot defects), having a diameter exceeding 0·05 micrometers, which have less than 10 defects on each side before packaging of the semiconductor wafers Semiconductor wafer contamination does not exceed this standard even after the semiconductor wafer industry has been shipped and opened for packaging. 14 1284624 [Simple description of the drawings] Fig. 1: Schematic diagram of the packaging characteristics of the present invention.
元件編號說明： 1 半導體晶圓 2 容器 3 本體 4 護蓋 5 密封環 6 過濾器 7 第一鞘套 8 第二鞘套 9 結合水氣裝置（包) 10 減震元件 11 外包裝 15Component number description: 1 Semiconductor wafer 2 Container 3 Body 4 Cover 5 Sealing ring 6 Filter 7 First sheath 8 Second sheath 9 Combined water and gas device (package) 10 Damping element 11 Outer packaging 15