JP2019151406A - Silicon packaging bag, silicon packaging body, and silicon packaging method - Google Patents

Abstract

To provide a silicon packaging bag, a silicon packaging body and a silicon packaging method capable of suppressing generation of fine powder derived from a packaging bag due to contact between the packaging bag and lump polycrystalline silicon, and reducing carbon contamination on silicon surface.SOLUTION: A silicon packaging bag 1 for containing the lump polycrystalline silicon, comprises a bottom surface portion 4 and a side surface portion 2, 3 rising from periphery of the bottom surface portion, and also comprises an intervening member 20 contained in the silicon packaging bag and disposed between the lump polycrystalline silicon and the silicon packaging bag, in which the intervening member is arranged at least facing the bottom surface portion when the lump polycrystalline silicon is deemed to be a silicon packaging body stored in the silicon packaging bag.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a silicon packaging bag, a silicon packaging body, and a silicon packaging method for packaging silicon used as a melting raw material when manufacturing single crystal silicon or the like.

  Conventionally, polycrystalline silicon used for silicon semiconductor raw materials, solar cell raw materials, etc. is manufactured in a rod shape by, for example, a gas phase method by the Siemens method, and then cut or crushed so as to be easily used as a raw material. , Bulk polycrystalline silicon (hereinafter sometimes referred to as bulk polycrystalline silicon). The bulk polycrystalline silicon is subjected to processing such as washing and drying, and is packaged or packed before being shipped.

  In recent years, quality requirements for these bulk polycrystalline silicon have increased, and one of the requirements is reduction of metal impurities and carbon impurities on the surface of the bulk polycrystalline silicon. Most of these impurities adhere to the surface by contact or contact with devices, parts, members, etc. containing the impurities in the process of processing bulk polycrystalline silicon. Is removed by washing in the final process, so that the quality is maintained. However, it is difficult to avoid contamination of the surface of the bulk polycrystalline silicon with organic substances. For example, methods described in Patent Documents 1 and 2 are known as methods for suppressing the contamination of the surface of the bulk polycrystalline silicon due to such organic substances.

In the polycrystalline silicon cleaning method described in Patent Document 1, the surface carbon concentration of the bulk polycrystalline silicon is reduced by performing heat treatment at 350 ° C. to 600 ° C. for 30 seconds in an inert gas (eg, argon) atmosphere. I am letting.
In the method for cleaning the surface of polycrystalline silicon described in Patent Document 2, the bulk polycrystalline silicon is subjected to a heat treatment at a temperature in the range of 180 ° C. to 350 ° C. in an inert gas atmosphere. The organic matter on the surface is removed.

As described above, for example, when organic substances on the surface are removed using the methods of Patent Documents 1 and 2 and carbon impurities are removed by washing or the like in the process of treating silicon, the packed bulk polycrystalline silicon is transported. Carbon impurities may be generated. This carbon impurity is generated mainly when a part of plastic or resin made of carbon is in contact with the surface of the bulk polycrystalline silicon and adheres to the surface of the bulk polycrystalline silicon. In particular, lump-like polycrystalline silicon is a brittle material, and when it is cut or crushed, its ends and edges are often sharpened. When contacted, it tends to cause contamination (generation of fine powder of plastic material). In particular, contact between the bulk polycrystalline silicon and the packaging material is unavoidable in the transportation stage after the bulk polycrystalline silicon is wrapped and packed with the packaging material composed of the above-mentioned plastic or resin. As a result, the lump of polycrystalline silicon and the packaging material rub against each other, resulting in the generation of the fine powder.
In order to solve such a problem, as a method of reducing contamination by fine powder due to rubbing between the bulk polycrystalline silicon and the packaging material during transportation, scraping, etc., for example, described in Patent Documents 3, 4 and 5 The method is known.

In the method for transporting polycrystalline silicon described in Patent Document 3, the packaging material and the polycrystalline silicon at the time of transportation are rubbed by transporting the rod-shaped polycrystalline silicon in a state where the rod-shaped polycrystalline silicon is tightly fixed by the gas-permeable film. The generation | occurrence | production of the powder from the packaging material produced by is suppressed.
In addition, in the silicon packing method described in Patent Document 4, massive polycrystalline silicon is packaged in an inner bag of a double-structured packing body composed of an inner bag and an outer bag, and the inner bag is packed with the massive polycrystalline silicon. Is stored in the outer bag by shifting the folding portion, thereby reducing generation of fine powder due to rubbing between the bulk polycrystalline silicon being transported and the packaging bag.
Furthermore, in the method of packing polycrystalline silicon described in Patent Document 5, the fine powder caused by rubbing between the packing material and the bulk polycrystalline silicon is obtained by setting the contact area between the polycrystalline silicon and the packing material to be constant or less per unit weight. Is reduced.

JP2013-170122A Japanese Patent Laid-Open No. 2006-56066 JP 2002-68725 A JP 2010-36981 A JP 2006-143552 A

  However, in the methods described in Patent Documents 3 to 5, the generation level of fine powder generated in the packaging material due to the contact between the packaging bag and the bulk polycrystalline silicon caused by vibration during transportation after the bulk polycrystalline silicon is packaged is suppressed. However, there is no mention of prevention of contamination from the viewpoint of surface carbon contamination of the bulk polycrystalline silicon, although a certain effect of suppressing contamination by it can be obtained.

  This invention was made in view of such a situation, and while suppressing generation | occurrence | production of the fine powder derived from a packaging bag by contact with a packaging bag and lump polycrystal silicon, it is for silicon | silicone which can reduce the carbon impurity contamination on the silicon surface. An object is to provide a packaging bag, a silicon package, and a silicon packaging method.

  The silicon packaging bag of the present invention includes a packaging bag main body for housing the bulk polycrystalline silicon having a bottom surface portion and a side surface portion rising from the peripheral edge of the bottom surface portion, and is accommodated in the packaging bag main body. An inclusion disposed between the silicon and the packaging bag body, and the inclusion is at least when the bulk polycrystalline silicon is a silicon packaging body accommodated in the packaging bag body. It arrange | positions facing the said bottom face part.

  In the present invention, an inclusion is disposed between the bulk polycrystalline silicon accommodated in the packaging bag body and the packaging bag body, and faces the bottom surface of the packaging bag body that is most likely to be rubbed during short-time transportation. Since the inclusion is arranged, it is possible to suppress the massive polycrystalline silicon from coming into contact with the bottom surface portion of the packaging bag body. Therefore, generation | occurrence | production of the fine powder derived from the packaging bag for silicon | silicone by the contact of the bottom face part of a packaging bag main body and lump polycrystal silicon can be suppressed. Thereby, the carbon contamination of the bulk polycrystalline silicon surface which arises when fine powder adheres to the bulk polycrystalline silicon surface can be reduced.

  As a preferred embodiment of the packaging bag for silicon according to the present invention, the inclusion includes the bottom surface portion, the side surface portion, and the side portion when the bulk polycrystalline silicon is a silicon package body accommodated in the packaging bag body. It is good to arrange | position facing each of the top | upper surface part of a silicon | silicone package.

  In the said aspect, since inclusions are arrange | positioned facing each of the bottom face part of a packaging bag main body, a side surface part, and the top | upper surface part of a silicon | silicone packaging body, massive polycrystal silicon contacts the inner surface of a packaging bag main body. Can be suppressed. Therefore, generation | occurrence | production of the fine powder derived from the packaging bag for silicon | silicone by the contact of the inner surface of a packaging bag main body and lump polycrystalline silicon can be suppressed. Thereby, carbon contamination of the massive polycrystalline silicon surface caused by the fine powder adhering to the massive polycrystalline silicon surface can be further reduced.

As a preferable aspect of the silicon packaging bag of the present invention, the inclusions may be formed in a plate shape.
In the above aspect, since the inclusion is formed in a plate shape, the massive polycrystalline silicon accommodated in the packaging bag receives an impact from the outside of the packaging bag through the inclusion, that is, directly receives the impact. Therefore, the packaging bag is not easily pierced and broken, and damage to the packaging bag can be reduced.

  The silicon package of the present invention is formed by containing silicon in the silicon packaging bag and sealing it.

  The silicon packaging method of the present invention includes a bulky polycrystal silicon and a bulk polycrystal silicon between the bulk polycrystal silicon and the packaging bag main body in a packaging bag main body having a bottom surface portion and a side surface portion rising from the periphery of the bottom surface portion. The inclusions to be arranged are accommodated and sealed, and the inclusions are arranged in the packaging bag body so as to face at least the bottom surface.

  As a preferable aspect of the silicon packaging method of the present invention, the inclusion is such that the inclusion is opposed to each of the bottom surface portion, the side surface portion, and the top surface portion formed after the bulk polycrystalline silicon is accommodated. It is good to arrange in.

  According to the packaging bag for silicon of the present invention, generation of fine powder derived from the packaging bag due to contact between the packaging bag and massive polycrystalline silicon can be suppressed, and contamination of carbon impurities on the silicon surface can be reduced.

It is a perspective view of the packaging bag for silicon | silicone which concerns on 1st Embodiment of this invention. It is a perspective view of the packaging bag main body which comprises the packaging bag for silicon | silicone in the said embodiment. It is a figure explaining the procedure at the time of accommodating the silicon | silicone in the said embodiment in the packaging bag for silicon | silicone. It is a perspective view of the packaging bag for silicon | silicone which concerns on 2nd Embodiment of this invention. It is a perspective view which shows the inclusion of the state arrange | positioned in the packaging bag main body in the said embodiment.

Hereinafter, embodiments of a silicon packaging bag, a silicon packaging body, and a silicon packaging method according to the present invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 is a perspective view showing a silicon packaging bag 1 of the present embodiment.
In this embodiment, the packaging bag 1 for silicon | silicone is comprised by the one packaging bag main body 10 and the inclusion 20 accommodated in this packaging bag main body 10, as shown in FIG.
[Configuration of the packaging bag body]
The packaging bag main body 10 of the packaging bag 1 for silicon is comprised from transparent films, such as synthetic resins, such as polyethylene, for example, and as shown in FIG. 2, four side surface parts 2,2,3,3 and the bottom face part 4 are comprised. The packaging bag 1 can be folded small into a pair of opposing side surface portions 3 and 3 among the four side surface portions 2, 2, 3 and 3. In order to do so, a crease is provided inward. When not in use, the packaging bag main body 10 is folded along the crease to be compact, and is formed into a bag shape by spreading when used.

In this packaging bag body 10, the bottom surface portion 4 is overlapped at one end of the film so that the inner surfaces of the end portions of the pair of side surface portions 2 are joined together, and these are sealed by a sealing device. A seal portion 6 is formed.
In the present embodiment, bulk polycrystalline silicon W, which is a raw material for single crystal silicon, is mainly targeted for packing.

[Composition of inclusions]
As shown in FIG. 1, the inclusion 20 is a member that is accommodated in the packaging bag body 10 and disposed between the bulk polycrystalline silicon W and the packaging bag body 10. As shown in FIG. 1, the inclusion 20 has a bottom surface portion 4, four pieces of the packaging bag body 10 when the bulk polycrystalline silicon W is formed into the silicon package 100 accommodated in the packaging bag body 10. It arrange | positions facing each of the side part 2,2,3,3 and the top | upper surface part 5 of the silicon | silicone package 100 (refer FIG.3 (c)).

  Such inclusions 20 are made of plate-like silicon having a thickness of about 3 mm to about 7 mm. As shown in FIG. 3A, the bottom plate 21 facing the bottom surface portion 4, the four side surface portions 2. , 2, 3, 3 are arranged on the side plates 22 to 25 and the top plate 26 facing the top surface 5. Specifically, each of the plates 21 to 26 is formed in a rectangular shape, and is arranged so that one side of each of the side plates 22 to 25 is along each side of the bottom plate 21. A top plate 26 is disposed above the side plates 22 to 25.

[Packaging method for bulk polycrystalline silicon]
Next, a specific procedure of the packaging method for the bulk polycrystalline silicon W will be described. First, as shown in FIG. 3A, the inclusion 20 is stored in the packaging bag body 10. At this time, the bottom plate 21 of the inclusion 20 is disposed at a position facing the bottom surface portion 4 of the packaging bag body 10. Thereafter, the side plates 22, 23, 24, and 25 are sequentially disposed at positions facing the side surface portions 2 and 3 of the packaging bag body 10 along the sides of the bottom plate 21. At this time, a space surrounded by the inclusions 20 is formed in the packaging bag body 10. Then, a predetermined amount (for example, 5 kg) of massive polycrystalline silicon W is filled so that the inner surface of the packaging bag body 10 is not rubbed as much as possible. After the massive polycrystalline silicon W is introduced, the top plate 26 of the inclusion 20 is disposed on the upper side of each side plate 22-25. Thereby, the contact of the massive polycrystalline silicon W to the inner surface of the packaging bag body 10 is suppressed.

Next, as shown in FIG.3 (b), in the opening part of the upper end of the packaging bag main body 10, it overlaps so that the inner side surfaces of a pair of side surface parts 2 and 2 which are not creased may be palm-joined, and a surplus length part 8 is formed. Then, the packaging bag main body 10 is sealed by heat-sealing along the horizontal direction of the upper end part of the extra length part 8. FIG. Then, as shown in FIG. 4 (c), a plurality of the extra length portions 8 are folded to form a band-like folded portion 9, and the filling procedure of the bulk polycrystalline silicon W into the packaging bag body 10 is completed.
In this way, when the bulk polycrystalline silicon W is accommodated in the silicon packaging bag 1, the silicon package 100 is formed.
In addition, in the packaging method for the bulk polycrystalline silicon W, the size of the bottom plate 21 can be appropriately selected according to the size of the bottom surface portion 4 of the packaging bag body 10 with respect to the size of the inclusions 20 to be arranged. Further, the sizes of the side plates 22 to 25 to be arranged can be appropriately selected according to the filling amount of the bulk polycrystalline silicon W filled in the packaging bag body 10 and the size of the bottom plate 21. Similarly, the size of the top plate 26 can be appropriately selected according to the size of the bottom plate 21.
Moreover, it is preferable that the inclusion 20 (each board 21-26) arrange | positioned in the packaging bag main body 10 is chamfered at the edge part of the inner surface side of the packaging bag main body 10. FIG. By chamfering the edge portion, when the inclusion 20 is placed in the packaging bag main body 10, fine particles etc. are generated in the packaging bag main body 10 due to contact of the inclusion 20 with the inner surface of the packaging bag main body 10. Since it becomes difficult to occur, adhesion to the accommodated bulk polycrystalline silicon W can also be avoided.

  In the present embodiment, the inclusion 20 is disposed between the bulk polycrystalline silicon W accommodated in the packaging bag main body 10 and the packaging bag main body 10, and the inclusion 20 is the bottom surface portion 4 and the side surface portion of the packaging bag main body 10. Since 2, 2, 3, 3 and the top surface portion 5 of the silicon package 100 are arranged to face each other, it is possible to suppress the massive polycrystalline silicon W from contacting the surface of the packaging bag body 10. Therefore, generation | occurrence | production of the fine powder derived from the packaging bag 1 for silicon | silicone by the contact with the packaging bag main body 10 and the lump polycrystalline silicon W can be suppressed. Further, by suppressing the generation of fine powder, carbon contamination of the surface of the bulk polycrystalline silicon W caused by the fine powder adhering to the surface of the bulk polycrystalline silicon W can be reduced.

  Further, since the inclusion 20 is formed in a plate shape, the massive polycrystalline silicon W accommodated in the silicon packaging bag 1 receives an impact from the outside of the silicon packaging bag 1 through the silicon packaging bag 1. That is, since the impact is not directly received, the silicon packaging bag 1 (packaging bag body 10) is not easily pierced and broken, and damage to the packaging bag body 10 can be reduced. Further, since the bottom plate 21 is also composed of the plate-like inclusions 20, it is possible to ensure stability when the silicon packaging bag 1 is placed in handling or the like. For this reason, the side parts 2, 3 and the side parts 2, 3 and the top part 5 of the silicon packaging bag 1 are prevented by preventing the silicon packaging bag 1 from collapsing and being less likely to be shaken in the packaging body during transportation. Since the contact with the packaging box for storing the packaging bag and the partition plate inside the packaging bag can also be reduced, generation of fine powder from the side surface portions 2 and 3 of the packaging bag 1 for silicon can be suppressed. Furthermore, since it becomes difficult for the shaking in the packing box to occur, generation of silicon fine powder at the contact portion between the massive polycrystalline silicon Ws in the silicon packaging bag 1 is also suppressed.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to the drawings.
FIG. 4 is a perspective view showing a silicon packaging bag 1A according to the second embodiment, and FIG. 5 is a perspective view showing an inclusion 20A constituting the silicon packaging bag 1A shown in FIG.
In the silicon packaging bag 1A according to the present embodiment, the inclusion 20A is composed of six substantially circular plate-like members 201.
In the following description, the same or substantially the same configuration as that of the first embodiment will be denoted by the same reference numeral, and description thereof will be omitted or simplified.
The silicon packaging bag 1A includes a packaging bag body 10 and inclusions 20A. The inclusion 20A includes six substantially circular plate-like members 201. Each of the plate-like members 201 is composed of, for example, a polycrystalline silicon plate having a thickness of about 5 mm to 10 mm cut out from a polycrystalline silicon rod.
Here, the impurity concentration of the inclusion 20A used in the present embodiment is preferably the same as or lower than that of the bulk polycrystalline silicon W housed in the packaging bag body 10. This is to prevent contamination of the surface of the bulk polycrystalline silicon W when it is accommodated in the packaging bag body 10 and in contact with the inclusions 20A after the storage. For this reason, before the inclusion 20A is disposed in the packaging bag body 10, surface impurities can be obtained by performing surface etching with an acidic etching solution (for example, hydrofluoric acid and nitric acid) or surface rinsing with pure water. It is desirable to remove.
Thereby, the quality of the impurity concentration (for example, carbon impurity concentration) on the surface of the bulk polycrystalline silicon W and the impurity concentration on the surface of the plate-like member 201 can be maintained at the same level.

As shown in FIGS. 4 and 5, such a plate-like member 201 is disposed at a position facing the bottom surface portion 4, the side surface portions 2, 2, 3, 3 and the top surface portion 5 of the packaging bag body 10. The That is, each of the plate-like members 201 corresponds to the bottom plate, the side plate, and the top plate of the present invention.
Each plate-like member 201 is opposed to each of the bottom surface portion 4 and the side surface portions 2, 2, 3, and 3 in the packaging bag body 10 when the bulk polycrystalline silicon W is accommodated in the silicon packaging bag 1A. After placing the five plate-like members 201 corresponding to the bottom plate and the side plate of the present invention at the position to be filled, the bulk polycrystalline silicon W is filled, and the plate-like member 201 corresponding to the top plate of the inclusion 20A is placed on each side plate. It arrange | positions at the upper part side of the corresponding plate-shaped member 201. FIG.

In the present embodiment, the inclusion 20A (each plate-like member 201) is made of a polycrystalline silicon plate cut out from the polycrystalline silicon rod, so that the processing can be facilitated. Further, since the inclusions 20A (each plate-like member 201) are made of polycrystalline silicon, and the inclusions 20A themselves are the same as the bulk polycrystalline silicon W accommodated in the packaging bag body 10, the quality of the inclusions 20A Easy to maintain. Further, by chamfering the edge portion of the inclusion 20A that comes into contact with the inner surface of the packaging bag body 10, the wear of the packaging bag body 10 at the time of contact with the packaging bag body 10 can be reduced. The generation of fine powder can be further suppressed.
In this embodiment, when the quality of the inclusion 20A itself is not comparable to the bulk polycrystalline silicon W, the inclusion 20A is a part of the silicon semiconductor raw material or the solar cell raw material, like the bulk polycrystalline silicon W. It may be used as

In addition, this invention is not limited to said each embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, a groove process may be formed on the surface (upper surface) of the bottom plate 21 on the side where the massive polycrystalline silicon W is accommodated. When the bulk polycrystalline silicon W accommodated in the packaging bag body 10 is moved or transported after packaging, silicon powder or fragments are generated in the packaging bag body 10 due to contact or collision between the silicon. Since these also cause impurities when the bulk polycrystalline silicon W is used, it is desirable to avoid adhesion to the bulk polycrystalline silicon W as much as possible. In this case, since the groove is formed on the upper surface of the bottom plate 21, it is possible to reduce the adhesion to the surface of the bulk polycrystalline silicon W by moving the generated silicon pieces and silicon powder into the groove. The groove processing on the bottom plate 21 may be performed by forming a plurality of V-shaped grooves, rectangular grooves, and U-shaped grooves on the inner surface of the bottom plate 21 so that the strength of the bottom plate 21 does not decrease.

In the second embodiment, the impurity concentration (for example, carbon impurity concentration) on the surface of the bulk polycrystalline silicon W and the impurity concentration on the surface of the plate-like member 201 (inclusion 20A) have the same quality. However, the present invention is not limited to this, and the impurity concentration on the surface of the plate-like member 201 may be lower than the impurity concentration on the surface of the bulk polycrystalline silicon W. In this case, since the bulk polycrystalline silicon W is filled in the packaging bag body 10 via inclusions having a carbon impurity concentration equal to or lower than the carbon impurity concentration of the bulk polycrystalline silicon W, Carbon impurity contamination does not occur when polycrystalline silicon comes into contact with inclusions.
In the second embodiment, the surface rinsing process such as etching or pure water is performed before the plate-like member 201 (inclusion 20A) is accommodated in the packaging bag body 10, but not limited thereto. If the surface quality of the inclusion 20A is equal to or higher than that of the bulk polycrystalline silicon W, the inclusion 20A may be accommodated in the packaging bag body 10 without performing these etching and surface rinsing processes. The same applies to the first embodiment.

In the first embodiment, the inclusion 20 is made of a silicon plate. However, the present invention is not limited to this. For example, the inclusion 20 is made of a quartz plate and the surface thereof is coated with silicon. It may be used as
In each said embodiment, although the inclusions 20 and 20A were made into the plate-shaped object, it is not restricted to this, For example, you may comprise an inclusion with things other than plate-shaped objects like a silica cloth. That is, the shape is not limited as long as it can be packaged and sealed without contact between the bulk polycrystalline silicon W to be accommodated and the inner surface of the packaging bag body 10. In addition, as a silica cloth, the heat-resistant, thermal shock property, a softness | flexibility, and heat insulation are high, and the silica fiber spinning product which is chemically stable can be illustrated.

  In the above-described embodiment, the inclusions 20 and 20A are disposed to face the bottom surface portion 4, the top surface portion 5 and the side surface portions 2 and 3 of the packaging bag body 10, respectively. The bottom surface portion 4 and the top surface portion 5 may be disposed to face each other, or the bottom surface portion 4 and the side surface portions 2 and 3 may be disposed to face each other. In other words, the inclusions 20 and 20 </ b> A only need to be disposed to face at least the bottom surface portion 4.

  In each of the embodiments described above, the packaging bag body 10 is filled with approximately 5 kg of massive polycrystalline silicon W. However, the present invention is not limited to this, and the filling amount of the massive polycrystalline silicon W into the packaging bag body 10 is as follows. It can be changed appropriately.

  The polycrystal silicon having a long side size of about 5 to 15 mm is filled in a polyethylene silicon packaging bag having a bottom size of about 140 mm square, a height of about 400 mm, and a thickness of about 0.3 mm. The following experiment was performed on the packaging bag. The bulk polycrystalline silicon contained in the silicon packaging bag is etched with a chemical solution composed of nitric acid and hydrofluoric acid, rinsed with pure water, dried, heated at about 700 ° C. for 60 minutes, What removed the organic substance on the surface was used.

For Examples 1 and 2, a cylindrical plate having a thickness of 5 mm cut from a polycrystalline silicon rod, a diameter of 130 mm in plan view, and chamfered corners is treated with a chemical solution composed of a mixture of hydrofluoric acid and nitric acid. After etching, the chemical solution is removed with pure water, and inclusions made of dried silicon plates are placed in a silicon packaging bag, and then filled with about 5 kg of bulk polycrystalline silicon to form a silicon package. did. Specifically, in Example 1, the inclusion (bottom plate) is disposed only on the bottom surface of the silicon packaging bag and filled with massive polycrystalline silicon, and then there is no crease in the opening at the upper end of the packaging bag body. After overlapping the inner side surfaces of the pair of side surface portions to form a surplus length portion, the upper end portion of the surplus length portion is heat-sealed along the horizontal direction to seal the packaging bag body, A band-shaped folded part was formed by folding the surplus part a plurality of times to form a silicon package. Further, in Example 2, the inclusions (bottom plate, side plate) are disposed so as to face the bottom and side surfaces of the silicon packaging bag, and then filled with approximately 5 kg of massive polycrystalline silicon and face each side surface. The inclusions (top plate) were arranged on the upper side of the inclusions (side plates) arranged to form a silicon package. The heat sealing method is the same as in the first embodiment.
On the other hand, in Comparative Example 1, without placing inclusions in the silicon packaging bag, approximately 5 kg of bulk polycrystalline silicon was filled in the same manner as in each Example, and heat sealed in the same manner as in Example 1. A silicon package was formed. In addition, each packaging body of Examples 1 and 2 and Comparative Example 1 was produced by two bags each, and one silicon packaging body was set as sample 1 and the other silicon packaging body was set as sample 2.

As experimental contents, the silicon packaging bodies (Samples 1 and 2) of Examples 1 and 2 and Comparative Example 1 produced as described above are accommodated in a cardboard packaging box, and each packaging box is placed on a truck bed. After running for 2 hours at an average speed of 50 km, the silicon packaging bag of the silicon package is opened and all the bulk polycrystalline silicon is taken out of the silicon tray, and each of the two silicon bags is made of silicon. IR (Infrared spectroscopic analysis) measurement is performed on CO and CO ₂ generated by combustion for 3 minutes at a heating temperature of about 700 ° C. for any three pieces of bulk polycrystalline silicon extracted from The carbon concentration contained in these three bulk polycrystalline silicon was analyzed, and the average value is shown in Table 1. .

  As shown in Table 1, it was confirmed that when inclusions were arranged, the surface carbon concentration of massive silicon tends to be higher than when no inclusions were arranged. Moreover, about the arrangement | positioning location of an inclusion, although only a bottom plate has an effect, it was confirmed by installing a bottom plate, a side plate, and a top plate that a big effect is exhibited by reduction of surface carbon concentration. In addition, the state of the bag was confirmed during sampling of the bulk silicon for analysis of the surface carbon concentration. The higher the surface carbon concentration, the more likely the press marks and scraped traces are thought to be due to rubbing between the bag and the bulk silicon during filling and transportation. There were many.

DESCRIPTION OF SYMBOLS 1 Silicon packaging bag 2, 3 Side surface part 4 Bottom surface part 5 Top surface part 6 Bottom seal part 8 Excess length part 9 Folding part 10 Packaging bag main body 20 20A Inclusion 21 Bottom plate 22 23 24 25 Side plate 26 Top plate 100 Silicon packaging body 201 Plate member W Lumped polycrystalline silicon

Claims (6)

A packaging bag body for containing bulk polycrystalline silicon having a bottom surface and a side surface rising from the periphery of the bottom surface;
Contained in the packaging bag body, and has inclusions disposed between the bulk polycrystalline silicon and the packaging bag body,
The said inclusion is arrange | positioned facing the said bottom face part at least when the said polycrystal silicon is made into the silicon package body accommodated in the said packaging bag main body, The packaging bag for silicon | silicone characterized by the above-mentioned.   The inclusion is disposed to face each of the bottom surface portion, the side surface portion, and the top surface portion of the silicon package body when the bulk polycrystalline silicon is a silicon package body accommodated in the packaging bag body. The silicon packaging bag according to claim 1, wherein the packaging bag is made of silicon.   The said inclusion is formed in plate shape, The packaging bag for silicon | silicone of Claim 1 or 2 characterized by the above-mentioned.   4. A silicon package comprising a silicon-containing packaging bag according to claim 1, wherein bulk polycrystalline silicon is accommodated and sealed. 5.   In the packaging bag body having a bottom surface portion and a side surface portion rising from the periphery of the bottom surface portion, together with the massive polycrystalline silicon, contain inclusions disposed between the massive polycrystalline silicon and the packaging bag body. Sealing, and the inclusion is disposed in the packaging bag body so as to face at least the bottom surface portion.   The said inclusion is arrange | positioned in the said packaging bag main body so as to oppose each of the bottom face part, the said side part, and the top | upper surface part formed after accommodation of the said bulk polycrystalline silicon. The silicon packaging method according to claim 1.

Images