JP2019016679A - Wafer case for single crystal substrate intermediate product and method for storing single crystal substrate intermediate product - Google Patents

Abstract

To transfer a wafer-like intermediate product of single crystal substrate without drying a surface and without damage.SOLUTION: A wafer case C for a single crystal substrate intermediate product includes: a body 1 having a box shape opening above and having a holding part 4 for holding a wafer-like single crystal substrate intermediate product; and a lid 2 for closing the opening. The lid 2 has a convex portion 11 at a lower portion thereof, and an air plug 12 is provided at a part of the convex portion 11.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a wafer case for an intermediate product of a single crystal substrate and a method for storing an intermediate product of a single crystal substrate.

In recent years, various surface wave devices used for mobile phones and the like have been manufactured using oxide single crystals such as lithium tantalate LiTaO ₃ (hereinafter LT) and lithium niobate LiNbO ₃ (hereinafter LN). In particular, when manufacturing LT and LN crystal substrates, in order to reduce the manufacturing cost, the crystal diameter is being increased. For example, the size of the LT substrate is mainly 4 inches or 6 inches. However, as with the semiconductor Si substrate, there is a trend of increasing the diameter, and 8 inches have been studied.

  By the way, since the LT substrate is fragile, care must be taken in handling the LT substrate, and a wafer case and a carrier are used for transporting the LT substrate in the same manner as the semiconductor Si substrate. For example, Patent Document 1 discloses a wafer case that is easy to handle and has little risk of damage to the wafer during transportation. The wafer case has a box-shaped main body for storing the wafer and a lid, and the main body side wall is vertically spaced at the upper half, the lower half is curved inward, and the inner surface is spaced apart from the wafer. A support plate having a rib and elastically supporting the wafer is provided on the bottom of the main body and the lid. In this wafer case, by fixing a part of the outer periphery of the wafer with a separation rib or a support plate, vibration during transportation and impact during dropping can be absorbed, preventing damage to expensive wafers and safety. Can be transported to.

Japanese Patent Publication No. 4-60347

  However, the conventional wafer case described in Patent Document 1 described above has no problem when used for transporting a semiconductor wafer or a finished product of a single crystal substrate. There is a problem. The single crystal substrate is manufactured by the following method. First, a single crystal is obtained using a growing method such as the Czochralski method (CZ method). Thereafter, the grown single crystal is cut with a multi-wire saw or the like to form a single crystal wafer-like intermediate product. Surface processing is performed on both surfaces and end surfaces of the wafer-like intermediate product to produce a product. This surface processing is performed by a processing method such as lapping or polishing on the wafer surface. In addition, between such surface processing steps, an etching step is performed to remove processing damage that has entered the wafer surface by processing such as a cleaning step and a lapping step in order to remove the polishing liquid used in each step. , May add. The transportation between these surface processing steps is generally transportation in the same building or the same factory, and is often put into the next process in a short time. This is done using a similar transport case. Also, when storing wafer-like intermediate products for a long time, if the wafer surface is dried, residues such as polishing liquid adhere to the wafer surface and are removed even after processing in the cleaning process or etching process. Since this may not be possible, it has been necessary to immerse and transport the product in a container such as a pure water tank.

  In particular, recently, as described above, there has been a trend to increase the diameter of a single crystal substrate. For example, studies have been made on a single crystal substrate having a diameter of 8 inches. When manufacturing such a large-diameter single crystal substrate, a processing machine used for manufacturing is limited, and thus a wafer-like intermediate product may be transported to the next process of another factory. In the transportation of such a wafer-like intermediate product, as described above, the wafer-like intermediate product needs to be transported safely without drying the surface and without damage. However, it was difficult to transport the surface without drying it.

  Accordingly, the present invention has been made in view of the above situation, and an object of the present invention is to transport a wafer-like intermediate product of a single crystal substrate without damaging the surface without drying.

  In order to solve the above-mentioned problems, the present inventor conducted extensive research and found that a wafer case intermediate product of a single crystal substrate can be transported without damage without drying the surface by making the wafer case into a predetermined structure. I found. The present invention has been completed based on such technical findings.

  Further, according to the first aspect of the present invention, the upper portion is a box-shaped opening, and a main body having a holding portion for holding the wafer-like single crystal substrate intermediate product, and a lid for sealing the opening. Provided is a wafer case for a single crystal substrate intermediate product, wherein the lid portion has a convex portion at a lower portion thereof, and an air stopper is provided at a part of the convex portion.

  In addition, according to the second aspect of the present invention, the upper portion is a box-like opening and has a holding portion for holding the wafer-like single crystal substrate intermediate product, and an inner lid portion for closing the opening of the main portion. And an outer box part that accommodates the main body part and the inner lid part in an engaged state, and an outer lid part that seals the opening of the outer box part. A wafer case for a single crystal substrate intermediate product, in which an air plug is provided in a part of the part, is provided.

  According to the third aspect of the present invention, in the first aspect, the convex part of the lid part is inclined upward from the peripheral part toward the central part, and the air plug is provided in the central part. A wafer case for a crystal substrate intermediate product is provided.

  According to a fourth aspect of the present invention, there is provided a wafer case for a single crystal substrate intermediate product, wherein in any one of the first to third aspects, a plurality of air stoppers are provided.

  According to a fifth aspect of the present invention, there is provided the wafer case for single crystal substrate intermediate product according to any one of the first to fourth aspects, wherein the holding part is detachable from the main body part. The

  According to a sixth aspect of the present invention, there is provided a method for storing a wafer-like single crystal substrate intermediate product, wherein the intermediate product is held inside a container that can be closed with a lid, and the intermediate product is held. There is provided a method for storing an intermediate product of a single crystal substrate, which includes filling the inside of the container with a liquid, removing air, and closing the container with a lid.

  The intermediate product wafer case and storage method of the present invention can transport a wafer-like intermediate product of a single crystal substrate without damaging the surface and without damaging it.

It is a perspective view of the wafer case for intermediate goods concerning a 1st embodiment. It is sectional drawing of the AA line shown in FIG. It is a figure which shows operation | movement of the wafer case for intermediate goods. It is a figure which shows operation | movement of the wafer case for intermediate goods. It is a schematic diagram of the wafer case of a prior art. It is a schematic diagram of the wafer case for intermediate goods concerning a 2nd embodiment.

  The present invention will be described below with reference to the drawings. However, the present invention is not limited to this. Further, in the drawings, in order to describe the embodiment, the scale is appropriately changed and expressed by partially enlarging or emphasizing. In each of the following drawings, directions in the drawing will be described using an XYZ coordinate system. In this XYZ coordinate system, the vertical direction is the Z direction, and the horizontal direction is the X direction and the Y direction. For each of the X direction, the Y direction, and the Z direction, the side of the arrow is appropriately referred to as a + side (eg, + X side), and the opposite side is referred to as a − side (eg, −X side).

[First Embodiment]
A single crystal substrate intermediate product wafer case (hereinafter, simply referred to as a “wafer case”) according to the first embodiment will be described.

  First, a conventional semiconductor wafer case will be described. FIG. 5 is a schematic view of a conventional wafer case. The wafer case Cx in FIG. 5 is a general wafer case used for storing the wafer W or the like. The wafer case Cx has a box-shaped main body 1 for storing the wafer W and a lid 2C. The main body 1 has a box shape with an upper opening. The main body 1 includes a box 1a whose outer shape is a rectangular parallelepiped. The box 1a has an opening 3 that opens upward at the top thereof. The opening 3 is used when the wafer W or the holding unit 4 is taken in and out of the main body 1. The lid 2C closes the opening 3 from above.

  The main body 1 includes a holding unit 4 that holds a plurality of wafers W. The holding | maintenance part 4 is arrange | positioned inside the box 1a. The holding part 4 has a substantially U-shape when viewed from the + X direction. The side wall (wall part) 4a of the holding part 4 has a symmetrical shape with respect to the center AX1 of the holding part 4 in the Y direction. The side wall 4a on the + Y side and the −Y side of the holding unit 4 has an upper half upright, a lower half on the inner side (center AX1 side), and an arc shape (R shape) similar to the outer periphery of the wafer W. It is a curved shape. The upper half of the side wall 4a is disposed on the + Y side and the −Y side of the wafer W to restrict the movement of the wafer W in the Y direction, and the lower half contacts the lower side of the wafer W to support the wafer W from below. To do.

  A plurality of separation ribs 6 for separating the wafer W are provided on the inner surface (AX1 side) of the holding unit 4 at regular intervals in the X direction (direction in which the wafers W are arranged) (see FIG. 1). Each spacing rib 6 has a plate shape protruding from the + Y side and the −Y side of the inner surface of the holding portion 4. Each separation rib 6 has a shape in which the upper half is upright and the lower half is curved in an arc (R shape) similar to the outer periphery of the wafer W on the inner side (center AX1 side). The wafer W is disposed between the separation rib 6 and the separation rib 6. The wafer W disposed between the separation ribs 6 is restricted from moving in the X direction and is separated from the wafer W disposed between the adjacent separation ribs 6. As a result, the holding unit 4 can place a plurality of wafers W one by one between the separation rib 6 and the separation rib 6 and hold the wafers W side by side in the X direction with the wafers W separated.

  Support members 7 and 8 that elastically support the wafer W are provided on the bottom of the main body 1 and the lower part of the lid 2C, respectively. Each of the support members 7 and 8 is a plate-like member that extends in the X direction and is formed of an elastic member such as rubber at a portion that contacts the wafer W. Each of the support members 7 and 8 is formed as a pair symmetrically with respect to the center AX1 (see FIG. 2) in the Y direction of the wafer case Cx. The support members 7 and 8 are formed so as to be able to contact above or below the wafer W, respectively. The support member 7 is elastically supported by contacting the lower side of the wafer W disposed (held) on the holding unit 4. The support member 8 is elastically supported by contacting the upper side of the wafer W when the main body 1 is closed by the lid 2C. In this wafer case Cx, a plurality of wafers W are separated from each other by the separation rib 6 and the support members 7 and 8 while being separated from each other by the separation rib 6. By fixing a part of the outer peripheral portion (circumferential side surface, side surface) of the wafer, it is possible to hold the wafer W by absorbing vibration during transportation and impact during dropping. Thereby, damage of the expensive wafer W can be prevented and the wafer W can be transported safely.

  Moreover, the above-mentioned holding | maintenance part 4 is integrated in the main-body part 1 (box 1a) as another component which can be attached or detached (separated and mounted | worn) with respect to the box 1a of the main-body part 1. FIG. Thus, the holding unit 4 can be separated from the box 1a of the main body 1 while holding the plurality of wafers W by the holding unit 4, and the wafer W can be held only by the holding unit 4 without the box 1a. With the W exposed, it can be installed at a predetermined position in the next process or the like. In addition, the holding | maintenance part 4 does not need to be removable from the box 1a, for example, may be provided in the inside of the box 1a so that separation is impossible.

  In the wafer case C of the first embodiment described below, the mechanism that absorbs the vibration during transportation of the wafer case Cx and the shock when dropped is utilized as it is.

  Hereinafter, the wafer case C according to the first embodiment will be described in detail. 1 and 2 are views showing a wafer case according to the first embodiment, FIG. 1 is a perspective view, and FIG. 2 is a cross-sectional view taken along the line AA shown in FIG. Wafer case C according to the present embodiment is a case for storing a wafer-like single crystal substrate intermediate product Wi (hereinafter simply referred to as “intermediate product”).

  The intermediate product Wi will be described. The intermediate product Wi is obtained by subjecting both surfaces and end surfaces to surface processing from a state in which a single crystal manufactured using a growing method such as the CZ method is cut into individual thicknesses by a cutting device such as a multi-wire saw and processed into a wafer shape. It is a single crystal substrate in a state until it is commercialized with a mirror surface. The surface processing is performed by subjecting the surface of the intermediate product Wi to processing such as lapping and polishing. Between such processes, there is an etching process that is performed to remove the processing damage that has entered the surface of the wafer W in the cleaning process and the lapping process to remove the polishing liquid used in each process. included. The wafer case C of this embodiment is used, for example, when the intermediate product Wi is transported or stored between the processes as described above. As described above, if the surface of the intermediate product Wi is dried when the intermediate product Wi is transported or the like, a residue of polishing liquid or the like adheres to the surface of the intermediate product Wi, and thus the cleaning process or the etching process. In some cases, it cannot be removed even if the above process is performed. For this reason, the intermediate product Wi needs to be transported in a state immersed in a container such as a water tank filled with pure water to prevent the surface from being dried. However, as described above, the conventional wafer case does not cope with this. Therefore, in the wafer case C of the present embodiment, the structure described below can be used to easily transport the intermediate product Wi while being immersed in a liquid L such as pure water, and ensure that the intermediate product Wi is dried. (See FIG. 4B).

  As shown in FIGS. 1 and 2, the wafer case C includes a box-shaped main body 1 that holds the intermediate product Wi and a lid 2 that seals the main body 1. Hereinafter, it demonstrates individually.

  The main body 1 is a box-shaped container that holds the intermediate product Wi. The main body unit 1 is the same as the main body unit 1 of the conventional wafer case Cx shown in FIG. 5 described above, and absorbs vibrations during transportation and impacts when the intermediate product Wi is dropped to prevent damage to the intermediate product Wi. It has a mechanism. Moreover, the holding | maintenance part 4 is integrated in the main-body part 1 (box 1a) as another component which can be attached or detached (separated and mounted | worn) from the box 1a of the main-body part 1 as mentioned above. In addition, if the shape of the main-body part 1 is a box shape which upper direction opens, it is not limited to said example, It is arbitrary. Moreover, the above-mentioned holding | maintenance part 4 is an example, Comprising: Another aspect may be sufficient. For example, the separation rib 6, the support members 7, 8 and the like use other well-known mechanisms that can fix a part of the outer peripheral portion of each intermediate product Wi in a state where the plurality of intermediate products Wi are separated. May be.

  The lid 2 is a lid that seals the main body 1. The lid 2 is different from the conventional wafer case Cx shown in FIG. The lid 2 seals the opening 3 of the box 1a of the main body 1 from above. In the present embodiment, the box 1a and the lid 2 are sandwiched between the upper end of the box 1a and the peripheral edge of the lower surface of the lid 2 via a sealing member 10 (seal member) such as silicone rubber. ) Engaged. The sealing member 10 has a rectangular annular (“B” -shaped) sheet shape. With the above configuration, the upper end portion of the box 1 a, the sealing member 10, and the peripheral edge portion of the lower surface of the lid portion 2 are in close contact with each other to seal the main body portion 1. The sealing of the main body 1 by the lid 2 is sufficient as long as the liquid L does not leak because the main body 1 is filled with the liquid L such as pure water as will be described later. Note that the method (mechanism) for sealing the main body 1 and the lid 2 is not limited to the above example, and other methods (mechanisms) may be used. Further, the main body 1 and the lid 2 may be provided with a mechanism (for example, a lock mechanism) such as a claw that holds the box 1a and the lid 2 sealed.

  As shown in FIG. 1, a pair of support members 8 are provided at the lower part of the lid 2. In the lid portion 2 of the present embodiment, the pair of support members 8 are provided so as to extend in the X direction along the inner wall side of the box body 1a. Further, the support member 8 may be provided to extend in the X direction in the vicinity of the middle between the center AX1 in the Y direction and the inner wall as in the conventional wafer case Cx shown in FIG. Also in the wafer case C of the present embodiment, a plurality of intermediate products Wi are sandwiched between the support member 7 and the support member 8 while being separated from each other by the separation rib 6 and the support members 7 and 8. By fixing a part of the outer peripheral portion of the intermediate product Wi, it is possible to hold the intermediate product Wi by absorbing vibration during transportation and impact during dropping. Thereby, damage of the expensive wafer W can be prevented and the intermediate product Wi can be transported safely.

  Moreover, the cover part 2 has the convex part 11 in the lower part. The lower part of the lid part 2 is the main body part 1 side. The convex part 11 protrudes downward. The convex portion 11 is inclined upward (in the + Z direction) from the peripheral portion (peripheral portion, ± X side and ± Y side ends) Pp of the lower surface of the lid portion 2 toward the central portion Pc (FIGS. 1 and 2). reference). At this time, the convex part 11 is formed so as to engage with the inner wall above the box 1a of the main body 1, and the support member 8 is arranged extending in the X direction along the inner wall side of the box 1a. In this case, the inclination of the convex part 11 should just be the grade which can move the air A (refer FIG. 3 (B)) upward along the surface of the convex part 11. FIG. The convex portion 11 guides the air A to the central portion Pc when the main body portion 1 is sealed and the liquid L is filled therein (see FIG. 3B). When the main body 1 is sealed and the liquid L is filled therein, the air A is collected from the peripheral portion Pp to the central portion Pc along the convex portion 11 of the lid portion 2 (see FIG. 3B). . In addition, this center part Pc does not need to be the completely center of the cover part 2, and should just be a center vicinity. Further, when the support member 8 is arranged extending in the X direction in the vicinity of the middle between the center AX1 in the Y direction and the inner wall as in the conventional wafer case Cx shown in FIG. An air plug 12 to be described later may be disposed at a predetermined location near 8 and the convex portion 11 may be formed so as to be inclined toward the air plug 12.

  An air plug 12 is provided on a part of the convex portion 11 (see FIGS. 1 and 2). In the present embodiment, two air plugs 12 are provided at the central portion Pc of the convex portion 11 (see FIG. 1). Each air plug 12 is a through-hole penetrating the lid portion 2 in the vertical direction, and communicates from the inside of the main body portion 1 to the outside when the lid portion 2 is closed. The air stopper 12 is provided with a lid 12 a that closes the air stopper 12 at the outer end of the main body 1. The lid 12a is detachable from the air plug 12. The air plug 12 is used to discharge air A from the inside of the main body 1 to the outside when the main body 1 is sealed and filled with the liquid L (see FIGS. 3 and 4). In addition, it is preferable to install at least two air plugs 12 as in this embodiment. By installing at least two air plugs 12, the air A can be discharged well.

  Next, a method for housing an intermediate product of a single crystal substrate using the wafer case C of this embodiment will be described. The storage method of the present embodiment is a method of storing a wafer-like single crystal substrate intermediate product Wi, wherein the intermediate product Wi is held inside a container that can be closed with a lid, and the intermediate product Wi is held. Filling the interior of the container with liquid L and removing air A and closing the container with a lid.

  3 and 4 are diagrams showing the operation when the wafer case C is used. As shown in FIG. 3A, the wafer case C is used when the intermediate product Wi held by the holding unit 4 in a state where the box 1a of the main body 1 (container) is filled with a liquid L such as pure water. Then, as shown in FIGS. 3B to 4B, the lid 2 (lid) is closed and the main body 1 is sealed. As a result, in the liquid L such as pure water, the plurality of intermediate products Wi are sandwiched between the support member 7 and the support member 8 in a state in which a part of the outer peripheral portion of each intermediate product Wi is fixed. Can be held.

  In the case of the above (FIG. 4 (B)), the inventor of the present application, when air A remains in the main body 1 that is closed and closed (see FIG. 3 (B)), the main body during transportation. It has also been found that the phenomenon that the intermediate product Wi (wafer W) breaks when the liquid L in 1 is shaken. For this reason, it is necessary to prevent air A from remaining in the main body 1. In the above case, the amount of air A remaining in the main body 1 is preferably 1% or less of the internal volume of the main body 1. Thereby, the shaking of the liquid L can be suppressed and cracking of the intermediate product Wi can be prevented. In this embodiment, since the convex part 11 and the air plug 12 described above are installed, the air A in the main body part 1 can be easily discharged and can be prevented from remaining in the main body part 1.

  In the wafer case C of the present embodiment, when the liquid L is filled in the main body 1 and the lid 2 is closed, the air plug 12 is opened as shown in FIGS. 3 (B) and 4 (A). By pushing down the lid 2, the air A is discharged to the outside while the liquid L inside the main body 1 is overflowed from the air plug 12, and the air A disappears in the container as shown in FIG. When the air plug 12 is closed with the lid 12a, the air A can be prevented from remaining in the main body 1. As described above, in the wafer case C of the present embodiment, since the lid portion 2 has the convex portion 11 and the air plug 12 described above, when the main body portion 1 is sealed and the liquid L is filled inside, the air A is centered. It can be guided to the part Pc, moved to the air plug 12, and easily discharged from the air plug 12. In this embodiment, since two air plugs 12 are provided, the air A can be easily discharged.

  In the state shown in FIG. 4B described above, the wafer case C of the present embodiment is a state in which the plurality of intermediate products Wi are separated from each other in the liquid L from which the air A has been removed. Hold the part securely. In this state, the plurality of intermediate products Wi are transported or stored between the processes described above. Wafer case C absorbs vibration during transportation and impact during dropping and holds a plurality of intermediate products Wi, thus preventing damage to expensive intermediate products Wi and transporting a plurality of intermediate products Wi safely. can do.

  As described above, the method for storing the wafer case C and the single crystal substrate intermediate product according to the present embodiment can transport the intermediate product Wi without damaging the surface and without damaging the surface. Further, as described above, the wafer case C can be manufactured easily because the structure of the conventional wafer case can be used. Moreover, since the wafer case C has the convex part 11 and the air plug 12 as mentioned above, when the main body part 1 is sealed and the liquid L is filled inside, the air A is easily discharged from the air plug 12. be able to. Thereby, the crack of the intermediate product Wi which arises when the liquid L in the main-body part 1 shakes can be suppressed easily.

[Second Embodiment]
In the present embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  Next, an intermediate product wafer case according to the second embodiment will be described with reference to FIG. FIG. 6 is a schematic view of a wafer case according to the second embodiment.

  As shown in FIG. 6, the wafer case CA of the present embodiment accommodates the main body 1, the inner lid 14 that closes the opening of the main body, and the main body 1 and the inner lid 14 in an engaged state. It has an outer box part 15 and an outer lid part 16 that seals the opening of the outer box part 15.

  Hereinafter, it demonstrates individually. The main body 1 is the same as in the first embodiment, and is a box-like container that holds the intermediate product Wi. The intermediate product Wi absorbs vibrations during transportation and shocks when dropped, thereby damaging the wafer W. It has a mechanism to prevent it.

  The inner lid portion 14 is a lid that closes the opening 3 of the main body portion 1. Unlike the lid portion 2 of the first embodiment, the inner lid portion 14 does not require the main body portion 1 to be sealed. Therefore, the main body 1 and the inner lid 14 may be the above-described conventional wafer case Cx. The inner lid portion 14 of this embodiment is such that the same air stopper 12 as that of the lid portion 2 of the first embodiment is provided on the lid portion 2C of the above-described conventional wafer case Cx. Close part 3 without sealing. Moreover, since the inner cover part 14 of this embodiment is equipped with the air plug 12, when filling the inside of the above-mentioned main-body part 1 with the liquid L, air A (refer FIG. 3 (B)) can be discharged | emitted easily. it can. A plurality of air plugs 12 may be provided to facilitate the discharge of the internal air A when the inner lid portion 14 is closed.

  The outer box portion 15 is a box-shaped container that accommodates the main body portion 1 and the inner lid portion 14 in an engaged state. The outer box 15 is a rectangular parallelepiped box-shaped container having an opening 18 at the top. The outer box portion 15 is formed in such a size that the liquid L such as pure water is accommodated therein and the engaged main body portion 1 and inner lid portion 14 can be completely submerged. The outer box part 15 fixes the main body part 1 and the inner lid part 14 via a spacer 19 and accommodates them inside. The spacer 19 is not particularly limited, and the position, size, number, and forming material can be arbitrarily set. However, if the spacer 19 is water-resistant and elastic, the above-described fixing becomes easy. The spacer 19 is, for example, low foam polyethylene. By using the spacer 19, the main body 1 can be easily fixed to the outer box 15 and the amount of the liquid L filled in the outer box 15 can be reduced. Can also be planned.

  The outer lid part 16 is a lid that seals the opening 18 of the outer box part 15 from above. The outer casing portion 15 and the outer lid portion 16 need only be sealed so long as the liquid L such as pure water in the outer casing portion 15 does not leak to the outside. The sealing method (mechanism) is not particularly limited and is arbitrary. For example, in the present embodiment, the outer box portion 15 and the outer lid portion 16 are sealed by sandwiching the sealing member 10 such as silicone rubber as described above between the engagement portions of the outer box portion 15 and the outer lid portion 16. To do.

  Next, a method for storing the intermediate product Wi using the wafer case CA of the present embodiment will be described. The storage method of the present embodiment is a method of storing a wafer-like single crystal substrate intermediate product Wi, wherein the intermediate product Wi is held inside a container that can be closed with a lid, and the intermediate product Wi is held. Filling the interior of the container with liquid L and removing air A and closing the container with a lid.

  First, the outer box portion 15 is prepared, and a liquid L such as predetermined pure water is filled therein. Next, the main body 1 (container) is submerged in the outer box 15. At this time, the main body 1 is fixed in the outer box 15 via the spacer 19.

  Next, the intermediate product Wi is individually held by the holding part 4 of the main body part 1 submerged. Thereafter, the inner lid part 14 is submerged in the liquid L in the outer box part 15, and the opening 3 of the main body part 1 is closed by the inner lid part 14 (lid). At this time, the air plug 12 is opened and the air A is discharged so that the air A does not remain in the lower portion of the inner lid 14 and in the main body 1, and then the lid 12 a of the air plug 12 is closed. Since the wafer case CA of the present embodiment submerses the main body 1 in the liquid L in the outer box portion 15, the air A remaining in the main body 1 can be easily suppressed. Thereby, the crack of the intermediate product Wi which arises when the liquid L in the main-body part 1 shakes can be suppressed easily.

  Next, the sealing member 10 is sandwiched between the engagement portions of the outer box portion 15 and the outer lid portion 16, the opening portion 18 is closed by the outer lid portion 16, and the outer box portion 15 is sealed. At this time, the spacer 19 is sandwiched and fixed between the outer lid portion 16 and the inner lid portion 14. In addition, the liquid L in the outer box part 15 should just be the water storage amount of the grade which can fully submerge the main-body part 1 and the inner cover part 14, and as shown in FIG. There may be A. This is because the liquid L in the outer box portion 15 flows due to vibration or the like during transportation, but the liquid L in the main body portion 1 is isolated by the main body portion 1 and the inner lid portion 14, and the flow becomes extremely small. Damage such as cracking of the intermediate product Wi is prevented.

  As described above, the method for storing the wafer case CA and the single crystal substrate intermediate product according to the second embodiment can transport the intermediate product Wi without damaging the surface and without damaging the surface. Further, in the wafer case CA according to the second embodiment, it is possible to use a conventional wafer case for the main body portion 1 and the inner lid portion 14 as compared with the wafer case C of the first embodiment, and the outer box portion. As for 15 and the outer lid portion 16, a commercially available sealing container can be used. In this case, the manufacturing cost can be reduced.

  The technical scope of the present invention is not limited to the aspects described in the above-described embodiments. One or more of the requirements described in the above embodiments and the like may be omitted. In addition, the requirements described in the above-described embodiments and the like can be combined as appropriate. In addition, as long as it is permitted by law, the disclosure of all documents cited in the above-described embodiments and the like is incorporated as a part of the description of the text.

C: Wafer case (first embodiment)
CA ... wafer case (second embodiment)
Cx: Wafer case (conventional)
Wi ... Single crystal substrate intermediate product (intermediate product)
W ... wafer 1 ... main body 1a ... box 2, 2C ... lid 4 ... hold 6 ... separating ribs 7, 8 ... support member 10 ... sealing member 11 ... convex 12 ... air plug 14 ... inner lid 15 ... Outer box part 16 ... outer lid part 18 ... opening 19 ... spacer L ... liquid A ... air Pc ... central part Pp ... peripheral part

Claims (6)

A main body having a holding portion for holding a wafer-like single crystal substrate intermediate product, which is in a box shape with an upper opening,
A lid that seals the opening;
The lid portion has a convex portion at a lower portion thereof, and an air stopper is provided on a part of the convex portion.
Wafer case for single crystal substrate intermediate product. A main body having a holding portion for holding a wafer-like single crystal substrate intermediate product, which is in a box shape with an upper opening,
An inner lid for closing the opening of the main body,
An upper box that is open and has an outer box that accommodates the main body and the inner lid in an engaged state;
An outer lid for sealing the opening of the outer box,
A wafer case for a single crystal substrate intermediate product, wherein an air stopper is provided in a part of the inner lid. The convex part is inclined upward from the peripheral part of the lid part toward the central part,
The wafer case for a single crystal substrate intermediate product according to claim 1, wherein the air plug is provided in the central portion.   The wafer case for a single crystal substrate intermediate product according to any one of claims 1 to 3, wherein a plurality of the air plugs are provided.   The single crystal substrate intermediate product wafer case according to any one of claims 1 to 4, wherein the holding portion is detachable from the main body portion. A method of storing a wafer-like single crystal substrate intermediate product,
Holding the intermediate product inside a container that can be closed with a lid, filling the inside of the container in which the intermediate product is held with liquid and removing air, and closing the container with a lid. A method for storing the intermediate product of the substrate.

Images