TWI278047B - Offset measuring mechanism and offset measuring method in a bonding apparatus - Google Patents

Offset measuring mechanism and offset measuring method in a bonding apparatus Download PDF

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Publication number
TWI278047B
TWI278047B TW092121465A TW92121465A TWI278047B TW I278047 B TWI278047 B TW I278047B TW 092121465 A TW092121465 A TW 092121465A TW 92121465 A TW92121465 A TW 92121465A TW I278047 B TWI278047 B TW I278047B
Authority
TW
Taiwan
Prior art keywords
camera
measuring
offset
measurement
tool
Prior art date
Application number
TW092121465A
Other languages
English (en)
Chinese (zh)
Other versions
TW200408022A (en
Inventor
Manabu Haraguchi
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200408022A publication Critical patent/TW200408022A/zh
Application granted granted Critical
Publication of TWI278047B publication Critical patent/TWI278047B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW092121465A 2002-09-30 2003-08-06 Offset measuring mechanism and offset measuring method in a bonding apparatus TWI278047B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002286214A JP4105926B2 (ja) 2002-09-30 2002-09-30 ボンディング装置におけるオフセット測定機構及びボンディング装置におけるオフセット測定方法

Publications (2)

Publication Number Publication Date
TW200408022A TW200408022A (en) 2004-05-16
TWI278047B true TWI278047B (en) 2007-04-01

Family

ID=32025363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092121465A TWI278047B (en) 2002-09-30 2003-08-06 Offset measuring mechanism and offset measuring method in a bonding apparatus

Country Status (4)

Country Link
US (2) US6915827B2 (https=)
JP (1) JP4105926B2 (https=)
KR (1) KR100532672B1 (https=)
TW (1) TWI278047B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10338809B4 (de) * 2003-08-21 2008-05-21 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Justage von Bondkopfelementen
US20070260420A1 (en) * 2006-05-03 2007-11-08 Data I/O Corporation Automated calibration system
US7810698B2 (en) * 2008-11-20 2010-10-12 Asm Assembly Automation Ltd. Vision system for positioning a bonding tool
KR101132842B1 (ko) 2009-10-22 2012-04-02 세크론 주식회사 다이본딩장치의 오프셋입력방법
JP5725796B2 (ja) * 2010-10-27 2015-05-27 株式会社牧野フライス製作所 工具の測定方法及び測定装置、並びに工作機械
TWI545663B (zh) 2014-05-07 2016-08-11 新川股份有限公司 接合裝置以及接合方法
WO2016158588A1 (ja) * 2015-03-31 2016-10-06 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
US9847313B2 (en) * 2015-04-24 2017-12-19 Kulicke And Soffa Industries, Inc. Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding
US11540399B1 (en) * 2020-04-09 2022-12-27 Hrl Laboratories, Llc System and method for bonding a cable to a substrate using a die bonder
TWI826789B (zh) * 2020-06-05 2023-12-21 日商新川股份有限公司 打線接合裝置
JP6946584B1 (ja) * 2021-02-15 2021-10-06 Dmg森精機株式会社 画像処理装置および工作機械
CN113567433A (zh) * 2021-06-09 2021-10-29 中车青岛四方机车车辆股份有限公司 粘接接头的检测方法及装置
US12374650B2 (en) * 2021-07-06 2025-07-29 Shinkawa Ltd. Manufacturing apparatus and manufacturing method of semiconductor device
CN118936309B (zh) * 2024-08-26 2025-12-05 西北工业大学深圳研究院 适用于卷绕系统的高反光卷材偏移量测量方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2982000B1 (ja) * 1998-07-03 1999-11-22 株式会社新川 ボンディング方法及びその装置
JP3416091B2 (ja) 2000-01-21 2003-06-16 株式会社新川 ボンディング装置およびボンディング方法
JP3967518B2 (ja) * 2000-03-06 2007-08-29 株式会社新川 オフセット測定方法、ツール位置検出方法およびボンディング装置
US6678058B2 (en) * 2000-10-25 2004-01-13 Electro Scientific Industries, Inc. Integrated alignment and calibration of optical system

Also Published As

Publication number Publication date
TW200408022A (en) 2004-05-16
JP4105926B2 (ja) 2008-06-25
US20040060663A1 (en) 2004-04-01
USRE41506E1 (en) 2010-08-17
JP2004127995A (ja) 2004-04-22
KR100532672B1 (ko) 2005-12-01
KR20040028495A (ko) 2004-04-03
US6915827B2 (en) 2005-07-12

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MM4A Annulment or lapse of patent due to non-payment of fees