TWI277756B - Electronic component test equipment - Google Patents

Abstract

Electronic component test equipment comprising a body side board (600) electrically connected with a test head body (500) and having a male side connector (620), and a socket board (700) fixed with an IC socket (700) to be in electrical contact with an IC device (IC) and having a female side connector (740) which is removably connected with the first connector (620). The body side board (600) has a connector board (610) for supporting the male side connector (620) to be opposite to the socket board (700), and an opening (613) larger than the male side connector (620) and at least having a first portion capable of passing the connector (620) is formed in a connector base (610).

Description

[Technical Field] The present invention relates to an electronic component measuring and testing apparatus for testing various electronic components (hereinafter also referred to as Ic components) such as a semiconductor integrated circuit component.

[Prior Art] In the processor constituting the electronic component testing device, the plurality of 1C components housed in the tray are moved into the processor, and the IC components are electrically contacted with the test head, and then the electronic component testing device body is made. (hereinafter also referred to as tester) for testing. Then, after the test is completed, each 1C component is removed from the test head, and is sorted into a good or defective product by being changed to a tray corresponding to the test result. However, in the electronic component testing apparatus as described above, although a single processor can be used to test the plural H: component, in order to cope with the type of the component to be tested, it is necessary to replace the upper part of the test head with the type corresponding to the type. . Fig. 30 is a schematic cross-sectional view showing the upper structure of a conventional test head, and Fig. 32 and Fig. 32 are sectional views each showing a first step and a second step of mounting a connector on a main body side plate of a conventional test head. In the upper structure of the test head 5, as shown in FIG. 3, it is known that: the socket board 700, the IC component (indicated by the symbol Ic in the figure) is electrically connected to the 1C socket 710; and the body The side plate 600 is electrically connected to the test head body (not shown); and is configured by a male connector mounted on the connector guide 66 of the body side 2030-7709-PF 5 1277756 plate 600 (4) Inserting the female side connector 74A disposed under the socket board 700, and electrically connecting the body side panel 600 and the socket board 700. In the case of a mountain, the outer casing of the male side connector 62 is formed into a hole (not shown), and the end of the coaxial cable 624 is inserted by means of welding or crimping. The connected coaxial configuration terminal 621 is held by the latch j. Similarly, the terminal insertion hole formed in the outer casing of the female connector 74 is also inserted into the fitting terminal of the coaxial structure and latch-held, and each terminal 621 of the male connector 620 is inserted into the female connector 74. The body has a mating terminal, and the body side panel 600 and the socket board 7 are electrically connected. This socket board 700 is dedicated to this type in order to correspond to the type of IC component. Therefore, when the type of the IC component is replaced, the test head 5 only replaces the socket board 700 with the type of the IC component, and the type of the IC component can be easily replaced. Alternatively, the main body side panel 6 constructed on the upper portion of the test head 5 is attached to the male side connector 62A by the method shown below. That is, first, as shown in Fig. 31, in a state where the outer casing 623 of the male side connector 62 is rotated by about 9 degrees, the connector 650 and the lower side of the connector guide 66 are inserted into the connector. The opening formed by the guide 660 is passed through. Next, as shown in Fig. 32, after the connector 620 is further increased in the distance L upward, as shown in Fig. 3, the connector guide 660 is fixed to the connector guide 660 at both ends thereof by bolts 625. This grouping operation is extremely poor in the grouping state by causing the narrow side opening to pass through the narrow opening in a state in which the male connector 260 of the plurality of coaxial cables 624 is rotated by about 90 degrees. In addition, after the passage, it is necessary to perform the work of correcting the cable line 624 to the original straight line state of 2030-7709-PF 6 1277756. Along with the fact that it takes dozens of hours to work on all the connectors on the board. Further, when the male connector 620 is inserted into the female connector 740, an excessive force acts on the terminal 621 from the cable 624, and the center shaft of the terminal 621 of the male connector 620 and the female connector 74 are fitted. When the central axis of the terminal is greatly inclined or laterally offset, there is a case where the fitting is poor or the terminal itself is subjected to the ridge. Therefore, it is necessary to press the cable 624 into a straight line state before the male connector 62 is passed through the narrow opening. In addition, in the group work, there is a case where the disadvantages as shown below occur. In the state shown in FIG. 31, since the cable 624 drawn from the male connector 62A is bent by 90 degrees or more, stress acts on the cable 624, and thus the terminal 621 is pulled to the side of the casing 623, It is pulled into the outer casing 623 and the like, which causes a manufacturing failure. First, in the state shown in Fig. 32, the excess distance occurs for the longest [, because the length of the electric slow line 624 is different, it is likely to affect the test performance. In addition, in other forms of use, in the case where the electronic component to be tested is a test wafer, a probe is applied instead of the IC socket 71, and a probe card having a probe in the center is used instead of the socket board 7〇〇 The main body side panel 600 is connected to the probe card via the connectors 620, 740. However, the arrangement of the connectors 62A and 740 may be arranged in a radial shape for use in the center arrangement of the plurality of probe groups. SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component 2030-7709-PF 7 1277756 test device having excellent composition and quality. (1) In order to achieve the object, according to the present invention, there is provided an electronic component measuring device comprising: a body side plate electrically connected to the test head body and having a first connector; and a connecting plate, mounting and being Testing the electrical component to be electrically connected to the contact terminal, and having a second connector detachable from the first connector; wherein the body side plate has a support for the connector to face the connector plate a support device; the support device 1 is larger than the first connector, and the first connector can pass through at least the opening portion of the first portion (refer to the first item of the patent application scope). The body side plate at the upper part of the test head includes a supporting device for forming an opening portion through which the first connector can pass. Therefore, when the body side plates are assembled, the first connection is not required to be rotated, or is upwardly redundant The man-made work such as the cable is pulled out, so the assembly of the electronic component test device is improved. In addition, the cable can be assembled because it is not necessary to bend the cable close to 9 degrees. In order to easily maintain the linear state of the electric ram and the wire, and because the terminals are at appropriate positions, it is possible to prevent the occurrence of defects such as tilting or positional deviation of the conventional terminal, and it is not necessary to make the cable close to 9 degrees. Since the ground is bent and the connector can pass, the transmission impedance of the cable does not change, and the terminal or the casing does not cause a defect, and good test performance can be exhibited. Therefore, an electronic component test device excellent in quality can be provided. For example, in the case where the terminal is damaged due to damage or reduction to the outer casing side during use, the assembly property is improved, and it is easy to remove only the connector in which the problem occurs, and the maintainability is also excellent. Discarding electronic components 2030-7709-PF 8 1277756 pieces of test equipment W η main + γ n different, m, ', easy to remove the connector, because of the excellent workability of decomposition, the second is the structure of the environmental surface. 1^月, although not particularly limited, the opening portion further includes: a second part of the lower side of the first connector supported by the moxibustion and the device. . By passing the electric gauge wire drawn from the support device =: connector through the second portion of the opening

- The connection n is supported by the support device. The money line does not bend. The excess stress does not act on the cable. In the invention, although not particularly limited, the support device has a plurality of pillars composed of a pair of pillars supporting one end of the first connector in order to support the first connector, and Each of the pillar groups is disposed to protrude toward the connecting plate side, and has a base portion that forms the opening portion; and the first portion that forms the opening portion between the pillar groups of the S soil bottom is preferable (refer to the patent scope) Further, the second portion of the wind edge opening 形成 is formed between the pair of pillars of the base portion (refer to item 4 of the patent application scope). The invention is not particularly limited, but the main body side plate has a pressing device, and the cable that passes through the second portion of the opening portion is drawn downward from the first connector; the pressing device can be mounted from above Preferably, the support device is provided (refer to item 5 of the patent application scope). By mounting the pressing device from above, the electronic component testing device is improved in composition, and the maintainability and the composition are also improved. The invention is not particularly limited, but has: an abutting member that abuts against the cable; and a base member that holds the abutting member; the abutting structure 2030-7709-PF 9 1277756 can be from the base member It is better to disassemble (refer to item 6 of the patent application scope). The detachable member of the pressing device can be detached from the base member, and the electronic component testing device is improved in composition, and the maintainability and the assemblability are also improved. Although the invention is not particularly limited, it is fixed. The device prevents the abutting member attached to the base member from being detached from the base member; the fixing device can be attached to the pressing device from above (refer to item 7 of the scope of the patent application). By including such a fixing means, the detachable abutment member can be prevented from coming off the base member. Although the invention is not particularly limited, the main body side panel has a spacer which can be attached to the support device from above (see the eighth item of the patent application). By installing the spacer from above, the assembly of the electronic component test apparatus is improved, and the maintainability and the composition are also improved. In the invention, although not particularly limited, the body side panel includes guiding means for guiding the connecting panel to the main body side panel when the connecting panel is mounted to the main body side panel; the guiding device can be mounted to the spacer from above Preferably (refer to item 9 of the patent application scope). By mounting the guiding device from above, the electronic component testing device is more organized, and the maintainability and organization are also improved. In order to achieve the object, according to the present invention, there is provided an electronic component testing apparatus comprising: a body side plate electrically connected to a test head body, and having a first connector; and a connection board, mounting and tested electronic components a contact terminal electrically connected, and having a second connector detachable from the first connector; wherein the body side plate comprises: a support 2030-7709-PF 10 1277756, having a plurality at both ends thereof Supporting the pillar group of the first connector, and forming an opening portion, wherein the opening portion includes a first portion, the first connector can be inserted through, and the second portion is oriented after the first electrical input is inserted Transversely moving, and the cable is passed in a state supported by the strut group; the pressing device supports the first connection by using the supporting device; after that, the opening is plugged, and the electric mirror line is locked; the spacer, Storing the support device 'to support the support device> a portion of the first connector is exposed through the opening; and the guiding device has a second connector for facing the opposite Positioning a first guide pin connector (see Patent Application range of 13).

The invention is not particularly limited, but the spacer and the guiding device are integrally formed integrally (refer to the first aspect of the patent application). In the invention, although not particularly limited, the first connector or the first connector is configured to be minutely set within a predetermined range when the first connector and the second connector are mounted. The movement is better (refer to item 11 of the patent application scope). Although the S-contact month is not particularly limited, the body side panel has: a housing that covers the entirety of the main body side panel when the upper portion of the first connector is exposed; and a connecting portion that electrically inserts the first- The connector and the test head body are detachable and detachable from the circuit board; the connecting portion is preferably exposed from the housing (", ', the patent scope 帛 J 7 item). In the present invention, the connection portion of the removable circuit board is electrically placed between the first connector and the test head body on the body side panel and the connection portion is exposed from the housing. Because it is easy to replace on the user side, it is adjusted to match the type of IC component under test.

2030-7709-PF 11 1277756 A circuit board that flows from the test head to the electrical signal of the first connector. In the invention, although not particularly limited, the body side panel is

a cover member of the circuit board of the connecting portion; the cover member; preferably: the body is detachably attached (refer to claim 18 of the patent application). Thus, the circuit board and the connecting portion are easily detachable, and the circuit board can be protected on one side: the invention is not limited to the invention but the cover member has the circuit board that remains mounted to the bottom plate; The portion is arranged to be slightly movable within a predetermined range of the cover member (refer to claim 19 of the patent application scope, by providing such a holding portion, it is possible to prevent the unhelpful effect: the electrical purity acting on the connection portion is connected, The board can be prevented from being damaged. 1 ... In the invention, although not particularly limited, the connecting board is mounted and tested = the socket board of the IC# seat electrically connected to the component, or the mounted and tested wafer The probe card of the probe for electrical contact is preferred (refer to claim 16 of the patent application). (2) In order to achieve the object, according to the present invention, an electronic element=test device is provided, including: a connection plate, installation The electronic component to be tested is electrically contacted by a contact terminal, and electrically connected to the test head body, characterized in that it further comprises a supporting device for supporting the connecting plate; The connecting plate is large, and the connecting plate can pass at least the opening portion of the 卩a σ 卩 (refer to the second item of the patent application scope). _ In the invention, the electronic component directly connected between the connecting plate and the test head The device includes a support member that forms an opening 4 through which the connecting plate can include at least a first portion. Thus, when the electronic component testing device is assembled,

2030-7709-PF 12 1277756 The assembly of the electronic component tester is improved because it is not necessary to rotate the connecting plate or to pull out the power line and other laborious work. Moreover, since it is not necessary to bend the cable line by approximately 90 degrees, it can be easily assembled, so that the straight line state of the cable can be easily maintained, and since each terminal is located at an appropriate position, it is possible to prevent the inclination of the terminal or the positional deviation such as the conventional terminal. happened. Further, since the connecting plate can be passed without bending the cable close to 9 degrees, the transmission impedance of the cable does not fluctuate, and the terminal or the casing is not defective, and good test performance can be exhibited. • Therefore, an electronic component test device with excellent quality can be provided. In addition, due to improved organization, maintainability and organization have also improved. In the invention, although not particularly limited, the opening portion further includes a second portion located on the lower side of the connecting plate supported by the supporting device (refer to claim 21 of the patent application). By causing the connecting plate supported by the supporting device to lead the fourth portion of the (4) electric wire to the fourth port, and the state in which the connecting plate is supported by the supporting device is not curved, the excess stress does not act on the cable. .

Although the invention is not particularly limited, the support device has a plurality of pillars which are formed by a pair of pillars supporting both ends of the (four) connecting plate in order to support the number of the connecting plates, and the pillar groups are arranged to The connection = 'and has a base portion forming the opening portion; and the first portion forming the opening portion between the base portion and the skin portion is preferably (refer to ^ patent - item 22) The second portion of the opening portion of the pair of struts of the base portion is preferably (refer to the patent application No. 2030-7709-PF 13 1277756 " in the heart _ _ not particularly limited, but the body side panel has The spacer mounted on the support device from above is preferably (refer to claim 24). By installing the spacer from above, the assembly of the electronic component test device is improved, and the maintainability and the composition are improved. In the case of a violation of the invention, ^ is not particularly limited, and γ den is a socket board in which the connection board is mounted and electrically connected by a J 4 IC component, or an electrical contact between the mounted and tested wafers. (4) The probe card is better (see [Embodiment] The embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a perspective view showing an entire electronic component testing device according to an embodiment of the present invention. 1 is a cross-sectional view of a π line, and Fig. 3 is a flow chart showing a tray for processing a 1C element. First, an electronic component testing apparatus according to the present embodiment will be schematically described with reference to Figs. 1 and 2 . Fig. 3 is a view for explaining a method of processing a 1C element of the electronic component test apparatus of the present embodiment, and a part of a member which is actually arranged in the vertical direction on a plane. The electronic component of the embodiment The test device is as shown in the figure, consisting of: a processor 1 for processing 1C component components; a test head 5 electrically connected to the iC component; and a tester 9, transmitting test signals to the test head 5, and executing The test of the IC component; the composition of the processor 1 consists of: the chamber 1〇〇; the 1C storage unit 2〇〇, stores the electronic components tested in the future, and classifies and stores the tested IC components; 2030-770 9-PF 14 1277756 The component parts are moved to the IC storage section; the carrier part is sent from the 1C storage unit to the chamber 1〇〇; and the unloading unit 4〇〇 is placed in the room. 100 tested test ic The processor 1 is a device that tests the temperature of the high or low temperature stress on the IC component (checks) whether the 1C component is properly operated, and the device is classified according to the test result. This application temperature should be 4 (four) (four) test system # 1 (: components from the load complex into a test pair

The tray of the 1C component (hereinafter also referred to as a custom pallet) is replaced by the test tray TST conveyed in the physical state 1. The test tray TST is loaded with the 1C component by the loading unit 3, and is loaded into the chamber portion 1GG to be loaded on the test tray TST, as shown in Fig. 3. The test is completed in the chamber by pressing each of the κ elements against the test head 5 and electrically contacting them (strictly placing the output of the element into the terminal to the contact of the socket 71 to make electrical contact). . After the test, the IC component was moved to the unloading section 4, and the # a, Qiu Junjun was replaced in the unloading section 4 to the custom pallet in response to the test results. The chamber portion 10": the thermostatic chamber 10 applies a target high temperature or low temperature stress to the ic element loaded in the test tray TST; the test chamber 1〇2 causes the vertical head 5 to contact with the thermostatic bath m to apply thermal stress The 1C element in the state and the heat removal groove 103 are configured to remove the applied thermal stress from the Ic element tested in the test chamber 1〇2. The constant temperature bath 101 is disposed to protrude upward from the test chamber 1〇2. Further, as shown in FIG. 3, the test tray TST is in the period of the inside of the constant temperature tank 1〇1, when the vertical conveyance device is installed until the test chamber 102 becomes empty, and the second test 2030-7709-PF 15 1277756 The vertical handling device is waiting under the support. Mainly during this waiting, a high temperature or low temperature stress is applied to the 1C element. In the test chamber 102, the test head 5 is disposed at the center thereof, and the test tray TST is moved onto the test head 5, and the contact of the socket of the test head 5 is electrically connected to the input and output of the IC component. Terminal, and test the 仄 component. Further, regarding the test head 5, it will be described in detail later. The heat removal tank 103 is also arranged to protrude upward from the test chamber 1 〇 2 as with the constant temperature bath 1 〇 1 '. The vertical conveyance device is provided as shown in the schematic view of Fig. 3. On the other hand, in the heat removal tank 103, when the high temperature is applied by the constant temperature bath 101, the ic element is cooled by the air supply to return to the room temperature, and in the case where the target temperature is lowered by the constant temperature bath 1〇1, warm air or After the heater or the like heats the 丨c element and returns to the temperature at which dew condensation does not occur, the heat-removed Ic element is transferred to the unloading unit 400. An inlet-side opening for carrying the test tray TST from the device substrate 1A is formed in the upper portion of the constant temperature bath 101. Further, an outlet-side opening for transporting the test tray TST to the device substrate 1〇5 is formed in the upper portion of the heat removal tank i〇3. Further, on the device substrate i5, a test tray transporting device i for allowing the test tray TST to enter and exit through the openings is provided. The test tray transport device 108 is constituted by, for example, a rotating roller or the like. The test tray transporting device 108 transports the test tray TST carried out from the heat removing tank 103 to the constant temperature bath 1〇1 via the unloading unit 400 and the load carrying unit 3〇〇. The 1C storage unit 200 is provided with a pre-test 1C storage 201 for storing the IC components before the test, and 2030-7709-PF 16 1277756 for storing the κ components classified according to the test results. The 1C storage 202 is tested; and the tray transfer arm 205. The entire range of the arrangement direction of the IC storage 201 and the tested 1C storage 202 before the test can be moved. The pre-test 1C reservoir 201 and the tested 1C reservoir 202 are constructed to include a frame-shaped tray support frame 2〇3 and an elevator 2〇4 so as to be lifted up and down from the lower portion of the tray support frame 203. In the tray support frame 203, the custom tray outside the drawing is stacked and supported, and the stacked custom tray can be moved up and down by the elevator 204. However, in the test 刖I c storage 2 01, the tamping tray for storing the I-c elements of the future type is stacked and kept. On the other hand, after the test, the 丨c reservoir 202 is stacked and the custom tray for properly classifying the tested Ic components is maintained. The above-mentioned custom tray is moved to the loading by a lifting table (not shown).卩300, facing through the window portion 3(10) opened on the device substrate 丨〇5

Above. Then, the IC component loaded in the order tray is replaced with the test tray TST stopped at the loading unit 300. In the Ic moving device for replacing the 1C component from the customized tray to the test tray, as shown in FIG. 1, the χ_γ handling device 3〇4 is used, including: two tracks 3 erected on the upper portion of the substrate 105. 1; a movable arm 3〇2, which is disposed between the test tray m and the custom tray by using the two rails 3〇lT (the direction is γ direction); and the movable head 3〇3, which is supported by the movable arm And can move in the x direction along the movable arm 3〇2.

In the movable head 3 () 3 of the X-Y conveying device 304, the adsorption head is mounted downwardly. The IC is adsorbed by the customizing tray of the adsorption head, and the 1C is attached.

2030-7709-PF 1277756 The components are replaced to the test tray tst. Such a squeezing head can be loaded to the test tray TST at the same time for the movable head 3〇3, for example, by mounting about 8#'. Further, in the present embodiment, the position corrector 305 is provided between the order tray and the test tray. The position corrector 3〇5 is not particularly illustrated, and has a relatively deep recessed portion, and is formed in a shape in which the inclined surface surrounds the periphery of the recessed portion. Therefore, by directly placing the ic element that has been replaced from the customized tray to the test tray tst before the test tray TST, the position corrector 305 is once dropped, and the mutual position of the eight Ic elements can be correctly determined. The IC component is accurately mounted to the test tray tst. After all the IC components loaded in the custom tray are replaced with the test tray TST, the lifting table lowers the empty custom tray and delivers the empty tray to the tray transfer arm 205. The unloading unit 400 is also provided with an X-γ conveying device 4〇4 having a structure similar to that of the X-γ conveying device 304 provided in the loading unit 3, and is constituted by the trajectory 4〇1, the movable arm 402, and the movable head 403. By using the χ-γ carrier device 4〇4, the IC element of the test unit is replaced from the test tray TST moved to the unloading unit 4 to the a-made tray. The customized tray is transported to the unloading unit 400' by the elevating table. When the customized tray is replaced by the window portion 4〇6 opened on the device substrate 1〇5, the 1C component is replaced by the top 0. The table lowers the full custom tray and hands the full custom tray to the tray transfer arm 205. By the way, in the present embodiment, only the self-parts 406 of 2030-7709-PF 18 1277756 are formed on the device substrate 1 〇 5, but the a-pieces classified as having a less frequent occurrence are temporarily stored in the device. The temporary storage unit provided on the substrate 1G5 can be classified into a maximum of eight types. Next, the test head q will be explained.筮 / mb Fig. 4 is a perspective view showing the upper structure of the test head of Fig. 2''. Fig. 6 is a cross-sectional view taken along line 5 of the figure, Fig. 7 The figure is a cross-sectional view taken along line VH-νπ of Fig. 5.

The test head 5 includes: a test head body 500 electrically connected via an electric wire 10 (refer to FIG. 2) and a test 11 9; a body side plate 600; and the test head body 500 are electrically connected; and a socket board 7A, the 1C socket 710 is mounted thereon, and the socket board 7 is detachably connected via the connectors 62A, 74A and the body side panel 600. On the upper surface of the socket board 700, as shown in Fig. 6, the Ic socket 71 is provided, and each of the input and output terminals of the IC component (indicated by symbol 丨c in Fig. 6) having the test object is electrically contacted. The contact pin; and the socket guide 720 are located around the 1C socket 710 and guide a push rod (not shown) that pushes the ic element. Each of the 1C sockets 710 corresponds to the type of the tested 1C component, and a predetermined amount of the 1C socket 710 is placed on the upper surface of the socket board 700. On the other hand, not only the test head body 500, but also the body side plate 600 is not substantially limited by the type of the IC component, but may be commonly used for the plural. Therefore, when the type of the IC component to be tested is replaced, by replacing only the socket board 700 in the test head 5, it is easy to cope with the plural 1C element by using one test head 5. Below the socket board 700, as shown in Fig. 6, a guide hole 730, 2030-7709-PF 19 1277756 can be inserted into the guide guide 6 62 formed by the connector guide 660 of the body side panel 600; The connector 740 is connectable to the male side connector 620 provided on the body side panel 6A. When the socket board 700 and the body side panel 600 are electrically connected by the connectors 620 and 740 when the type of the tested IC component is replaced, the guide pin 662 is guided by the guide hole 730, and can be navigated within a predetermined range. The movable male side connector 620 is positioned while being slightly moved while being guided to the female side connector 740. As a result, since the fitting shafts of the pins of the plurality of terminals 621 and the corresponding female connector 740 match, the terminals of the male connector 62〇_ and the terminals of the female connector 740 are appropriately fitted. Therefore, there is a thermal expansion accompanying the variation or temperature change, and a plurality (e.g., 48) of the male connector 620 can also be stably connected together with the female connector 74. As shown in FIGS. 5 to 7 , the body side panel 600 includes: a male side connector 620 ′ and a female side connector disposed under the socket board 700 detachable; a connector base 610, and a socket board 7 The male connector 620 is supported by the opposite side; the pressing member 63 is pressed to press the cable 624 drawn from the male connector 620; the cover member 640 prevents the cover member 640 of the pressing member 630 from being pressed. The member 63 is detached from the abutting member 632; the spacer 650; the connector guide 66 〇, when the socket plate 7 is mounted on the body side plate 600, the socket plate 7 〇〇 is guided to the body side plate 6 〇〇; The housing 670 covers the entire body side panel 600 with the upper portion of each of the male connector 62s exposed. Further, the casing is not shown in Figs. 5 to 8 and the spacer 65 and the connector guide 66 are not shown in Fig. 5. Further, the detailed internal structure of the male connector 62A is omitted in FIG. 2030-7709-PF 20 1277756 In the present embodiment, the connector base 610 corresponds to the supporting device of the present invention. The pressing member 630 corresponds to the pressing device of the present invention, and the cover member 640 corresponds to the fixing device of the present invention. The connector guide 66 is equivalent to the guiding device of the present invention. Further, in the present embodiment, as shown in Fig. 6, the main body side plate 600 is also detachably attached to the test head main body 5 by a connector. Fig. 9 is a perspective view showing the entirety of a connector base used in the main body side plate of Fig. 4, and Fig. 10 is an enlarged plan view showing a portion X of Fig. 9, and Fig. 11 is a XI-XI along the first drawing. A cross-sectional view of the line, a cross-sectional view taken along line X Π Χ Χ 第 of Fig. 10, and a third view showing a male side connector used in the side plate of the main body of Fig. 4, the 14th The figure shows a cross-sectional view of a first step of inserting the connector into the opening of the connector base, and Fig. 5 is a cross-sectional view showing a second step of moving the connector inserted into the opening of the connector base toward the lateral direction. As shown in FIGS. 9 to 12, the connector base 610 has a plurality of pillars 611 composed of a pair of pillars 6Ua and 6Ub supporting both ends of one male connector 620, and can be opposed to the socket board 7 The posture supports a plurality of male side connectors 620. On the upper surfaces of the respective pillars 6Ua and 611b, bolt fixing holes 611c for fixing the fixing portions 6 2 6 at both ends of the male side connector 620 are fixed by bolts 6 25 . Further, the connector base 610 has a base portion 612, and the strut group 611 is disposed to protrude toward the socket board 700 side. In the present embodiment, in order to arrange 48 connectors, as shown in Fig. 9, 48 sets of strut groups 611 are arranged on the base portion 612 in an arrangement of four rows and twelve rows. Forming the first portion 613a and the second portion 2030-7709-PF 21 1277756 at the base portion 612'

The intermediate shape L2 (described later with reference to the length of the thirteenth portion is turned to a portion 613a. The map of the first portion 613a is formed to be longer than the length map of the male side connector 620) (L! > L2), and the first portion 613a is formed. The width W 〆 is referred to as a width W2 (refer to FIG. 13 described later) which is longer than the width of the male connector 62 (refer to FIG. 13). Thus, the male side connection 2 620 can be fixed to the connector base 61 without being rotationally fixed. A second portion 613b of the opening portion 613 is formed between one of the base portions 612 and the pair of pillars 611a, 611b, and is located on the lower side of the male side connector 620 supported by the pair of pillars 611a, 6Ub. Further, in the present embodiment, in order to insert the first portion 613a of one opening portion 61 3 by the two sets of the column groups 611 located on both sides when the male connector 6 2 is inserted, the first portion is formed only on one side of the column group 611. 613a, while the first portion 613a is not formed on the other side, and the other pillar groups 611 are adjacent. Between the adjacent pillar groups 611, one of the pillars 611a is integrally formed with each other, and the other pillars 611b are also integrally formed. The male connector 6 2 0 includes a housing 632 as shown in FIG. 13 , and the fixing portions 626 at both ends form a bolt through hole required for the pillars 611 a and 611 b of the connector base 610 to be attached by bolts 625 . 623a; a plurality of terminals 621 projecting upward from the upper surface of the outer casing; the guide pins 622 projecting upward from the upper surface of the outer casing; and a plurality of electric wires 624 extending downward from the lower surface of the outer casing. The male connector 205 of this configuration is mounted to the above-described connector base 610 as shown below. That is, first, as shown in Fig. 14, the male side connection 2030-7709-PF 22 1277756 620 is inserted from the lower side into the first portion 613a of the opening portion 613 formed by the connector base 61 0 . At this time, since the first portion 613a is formed with a larger opening than the male connector 620, the cable 624 can remain in a straight line state. Therefore, it is not necessary to rotate the male-side connector 620 or excessively pull out the cable 624 and the like, and the male-side connector 620 can be easily connected to the opening portion 613 of the base 610. Therefore, the group standing of the body side plate β〇〇 is greatly improved. In addition, the length of the cable 624 becomes a shorter result, _ can reduce the wiring space of the excess power cable, and can transmit and receive higher speed electrical signals between the test head body 500 and the 1C component. Moreover, since the male connector 620 can be passed through the opening 613 of the connector base 610 without rotating the male connector 602, the stress of the electrical winding is not imparted, or the cable 624 is It is difficult to make a difference in length. Further, for example, in the case where the terminal 621 is damaged or lowered to the side of the outer casing 623 during use, it is necessary to replace it, and since the grouping property is improved, it is easy to remove only the problematic male side connector 62, in the maintenance property. Or decomposition when discarded _ workability is also excellent. Pulling the lower surface of the outer casing 623 of the male side connector 620 to the south of the post glib of the connector base 610, as shown in Fig. 15, the male side connector 620 is moved laterally, and the slave base substrate 61 is 〇 The cable 624 drawn from the male connector 620 in the supported state is located in the second portion 613b of the opening 613. Then, the bolts 625 (refer to FIG. 6) are inserted into the bolt through holes 623a of the male connector 620 and the bolt fixing holes 611c formed by the pillars 611a and 611b of the connector base 61, and 2030-7709- PF 23 1277756 The thread check 625 securely secures the male connector 620 to the connector base 610. Therefore, the bolt through hole of the male connector 62 is formed to be larger than the diameter of the bolt 625, and the male side connection 620 attached to the connector base 61 is oriented toward the direction of the arrow A in FIG. The plane direction of the body side plate 600 moves minutely. Therefore, when the socket board 7 is attached to the main body side panel 600, since the plurality of male side connectors 620 are inserted while emulating the female side connector 74, the workability is excellent. Further, it is also possible to make the male connector 62 〇 not only move toward the plane of the main body side plate 6 but also slightly along the side of the socket plate 7 〇 。. Thus, by causing the cable 624 drawn from the male connector 620 to be located at the second portion 613b of the opening 613, the cable 624 can be prevented from being bent in a state where the male connector 62 is supported by the connector base 610. And to prevent excess stress from acting on the cable 624. Fig. 16 is a perspective view showing a connector base and a pressing member for mounting a connector in the embodiment, Fig. 17 is an exploded perspective view showing the pressing member of the embodiment, and Fig. 18 is a view showing a connection at the mounting connector. A cross-sectional view of a third step of attaching the base member of the pressing member to the base member, and Fig. 19 is a cross-sectional view showing a fourth step of inserting the abutting member into the base member of the pressing member to which the connector base is attached. The pressing member 630 is a member that plugs the first portion 613a of the opening as shown in Figs. 16 and 17, including the abutting member 632, and the male connector in a state where the crucible is supported by the connector base 61 0 6 2 〇 the electric cable 624 is abutted, and the base member 631 〇 2030-7709-PF 24 1277756 supporting the abutting member 632 is abutting member 6 3 2 as shown in FIG. The cylindrical portion 633 where the connector 6 2 is connected by the cable 624 and the shaft 634 constitute the shaft of the cylindrical portion 633. The cylindrical portion 633 is made of, for example, a soft material such as a sponge, and is deformable when it comes into contact with the cable wire 624. As shown in Fig. 17, the base member 6 31 is a prism-shaped member in which a plurality of concave portions 631a are formed on the side surface, and the distance between the concave portions 631a is substantially the same as the second portion 61 of the opening portion 613 formed in the connector base 610. 3b are equally spaced from each other. Further, a groove portion 631b is formed in each of the opposing wall faces of the recessed portions 63A. The length of each of the recessed portions 631a in the longitudinal direction is longer than the axial length of the abutting member 632, and the cylindrical portion 633 of the abutting member 632 is inserted into each of the recessed portions 631a. At this time, the shaft 634 drawn from both ends of the cylindrical portion 633 enters the groove portion 631b of the concave portion 631a, and is held freely rotated by the bottom surface thereof. The connector base 610 of the female male side connector 620 is attached to the pressing member 63 of this configuration as shown below. That is, first, as shown in Fig. 18, the base member 631 of the pressing member 630 is inserted into the first portion 613a of the opening portion 613 formed by the connector base 610, and the base member 631 is fixed to the base member 631 by bolting or the like. Connector base 610. At this time, the respective recessed portions 63 la formed in the base member 631 are inserted into the base member 63 so as to face each other with the second portion 61 3b of the opening portion 613 formed by the connector base 61 。. Then, as shown in Fig. 19, the recessed portions 631a formed by the inserted base member 631 are inserted into the abutting member 632 from the upper side as pushed, and as a result, the cylindrical portion 633 of the abutting member 632 and the male side are Connector 620 2030-7709-PF 25 1277756 The drawn electrical I line 624 abuts and pushes. Therefore, as a result of linearly guiding the electric wire 624 to the terminal 62i, it is possible to prevent an excessively large amount from acting on the terminal 621, and it is possible to prevent the terminal 621 or the casing from being defective. In the present embodiment, the pressing member 63 can be attached from above, and the abutting member (10) of the pressing member 63 can be detached from the base member 63i, whereby the composition of the main body side plate can be further improved and the composition can be improved. Maintainability or decomposition workability. The 帛2G diagram shows a perspective view of the connector base and the cover member to which the pressing member is attached in the present embodiment, and Fig. 21 shows a perspective view of the member and the cover member in the fourth embodiment, and Fig. 22 shows the fixing by the cover member. A cross-sectional view of the fifth step of the (4) piece attached to the H substrate. The cover member 640 is a member of a shaft which is fixed to the shaft of the abutting member 632 to be mounted, as shown in Figs. 20 and 21, and is a flat member having a plurality of recesses 641 formed on the side. Each of the recesses 641 is substantially the same size as the recess 6' formed by the base member 631 of the dust member 630. Further, the distance between the concave portions 641 is substantially equal to the distance between the concave portions 631 a formed by the base member 631. In the connector base 61 on which the male connector 620 and the pressing member 630 are attached, the cover member 64 of this configuration is mounted as shown below. That is, it is attached to the upper surface of the pressing member 630 inserted in the connector base (4) by the % bolt fixing or the like from the upper side as shown in Fig. 22. At this time, the cover member 64 is attached to the pressing member 630, and the respective concave portions 641 formed in the cover member 64Q and the respective concave portions 63ia formed in the base member 631 are made uniform. 2030-7709-PF 26 1277756 Thus, the upper portion of each notch P 631b formed by the base member of the pressing member 63 is sealed, and the detachable abutting member 632 is prevented from coming off the base member 631 of the pressing member 630. . Fig. 23 is a perspective view showing the connector base and the connector guide for mounting the pressing member and the cover member in the present embodiment, and Fig. 24 is a view showing the spacer and the connector guide which are attached to the base of the connection II in the present embodiment. Fig. 25 is a perspective view showing a sixth step of mounting the spacer to the connector base, and a seventh step of mounting the connector guide to the spacer. In the present embodiment, as shown in Figs. 23 and 25, the spacer 650 has a shape covering the upper surface of the connector base 61A of the male connector 62, and is formed to be insertable into the male connector 62. Opening portion 651. The opening Deng 6 51 is arranged in accordance with the arrangement of the male side connectors 6 2 支持 supported by the connector base 6 ’ in accordance with the arrangement of four rows and twelve rows. As shown in Figs. 24 and 25, the connector guide 660 is formed into a flat plate-shaped member that can be inserted into the opening portion 661 of the male connector 62. Each of the opening portions 661 also has 48 rows arranged in four rows and 12 rows in order to correspond to the arrangement of the male-side connectors 620 supported by the connector base 61. Further, on the upper side of the connector guide 660, as shown in Fig. 24, a guide pin 662 which protrudes upward is formed. As shown in the above, when the socket board 7 is mounted on the body side panel 600, the socket pin 662 can be inserted by embedding the guide hole 73 provided under the socket board 700. 〇 Guide the body side plate 6 0 〇 and position. In the connector base 610 on which the male side connector 620, the pressing member 630, and the cover member 640 2030-7709-PF 27 1277756 are mounted, the spacer 65 这种 and the connector guide 660 of this configuration are mounted as shown below. That is, first, as shown in Figs. 23 and 25, the male connector 62 attached to the connector base 610 is inserted into the opening 651 formed between the brackets 650, and is opened from above. The spacer is attached to the male connector 620 and fixed by bolting or the like. Next, as shown in Figs. 24 and 25, the male connector 62 is inserted into each of the opening portions 661 formed by the connector guide 66, and the connector guide 660 is attached to the connector from above. The spacers mounted on the base 61 are fixed by bolts or the like. As described above, by mounting the spacer 65 and the connector guide 660 from above, the assembly of the main body side panel 6 is improved, and the maintainability and the disassembly workability are also improved. Further, in the present embodiment, as shown in Fig. 6, a part of the plurality of cable wires 624 which are taken out from the male connector 620 and electrically connected to the test head body 5 are via Pc. The n-plate connecting portion 691 and the test head body 500 are connected. In the pc〇n board connecting portion 691, a pcon board (Pc〇n board) 81 is detachably mounted by a relay connector or the like.

The Peon board 810 is mainly connected between the power supply terminal of the IC component and the circuit ground and the required capacitor corresponding to the type of the ic component (for example, a circuit board of an electrolytic capacitor such as 1 〇 "F~2000 //F", selected and κ The type of the component or the test condition corresponds to the Pc〇n board 81〇 and is connected to the Pc〇n board connection part 691. Similarly, although not specifically illustrated, the male connector 62〇 is taken out and the test head body 500 is A part of 2030-7709-PF 28 1277756 among the plurality of electrically connected cables 624 is connected to the test head body 500 via the application board connection portion 692. The application board connection portion 692 can be connected by a relay connector or the like. The universal board 820 is disassembled and assembled. The universal board 820 is a universal board that can be installed on the user side to select the desired board and the type of the IC component or the test condition corresponding to the universal board 8 2 and the application board connection part. The board connecting portions 691 and 692 are provided to be exposed to the side surface portion of the main body side plate 600 as shown in Figs. 4 and 24. Further, in the present embodiment, the pc〇n board 81 and The universal board 820 is equivalent to the circuit board of the present invention. In the embodiment, the Pc〇n board connecting portion 691 and the application board connecting portion 691 correspond to the connecting portion of the present invention. Fig. 26 is a cross-sectional view showing the eighth step of covering the main body side panel with the housing, Fig. 27 An exploded perspective view of the cover member of the present embodiment is shown. The housing 670 can cover the connector base 610, the male connector 620, the pressing member 630, the cover member 640, the spacer 650, and the connector guide 660. The main body side member 600 is a member of the entire body side panel 600. The first opening portion 671 is formed on the upper surface of the housing 67, and the male opening connector 620 is exposed to the outside. The second opening portion 672 which is exposed to the outside by the board connecting portions 691 and 692 of the Peon board 810 or the universal board 820 is detached. Thus, the board connecting portions 69J and 692 are exposed from the housing 670, and are on the user side. Easy to replace the desired pc〇n board 810 or universal board

820 〇 2030-7709-PF 29 1277756 Further, in the casing 670 of the present embodiment, as shown in FIGS. 4 and 27, the cover member 6 of the Peon plate 810 that covers the board connecting portions 691 and 692 is attached. 0 is set to be detachable using a spring lock or the like. As shown in Fig. 27, the cover member 680 has a cover body 681, plates 810 and 820 which are connected to the plate connecting portions 691 and 692, and holding portions 682 for holding the plates 810 and 820. A notch 682g is formed in each of the holding portions 682, and the plates 810 and 820 can be inserted into the notches 682g. Further, each of the holding portions 682 is attached to the lid body 681 so as to be slightly movable toward the arrow direction of Fig. 27. Therefore, it is possible to prevent undesired stress from being applied to the Peon plate 810 or the universal board 820 to which the board connecting portions 691 and 692 are connected, and to prevent the board connecting portions 691, 692 and the boards 810, 820 from being damaged. The test head described above, although the body side plate 600 is interposed between the socket board 700 and the test head body 5 而, can easily cope with the replacement of the type of the tested 1C component, but can also make the socket board The type in which the test head body 500 is directly connected includes a connector base 610. Fig. 28 is an exploded perspective view showing the upper structure of the test head according to the second embodiment of the present invention, and Fig. 29 is a plan view showing a state in which the socket board is inserted into the connector base in the second embodiment of the present invention. In the test head according to the second embodiment of the present invention, as shown in Fig. 28, the cable 624 and the socket board 700 are directly connected by soldering or the like, and the socket board 700 is directly connected to the test head body via the cable 624. In this type of test head, as shown in Fig. 29, a connector base 610 is also included, forming an opening 613 that is larger than the socket plate 700 and has a first portion 613a through which the socket plate 700 can pass. Therefore, when the test head 5 is assembled 2030-7709-PF 30 1277756, the test head 5 is not required because the socket board 700 is not required to be rotated or the power line 624 is excessively pulled upward. The group's standing is improved. Further, since the socket board 700 can be assembled without being rotated, unnecessary stress is not applied to the cable 624, and manufacturing defects are less likely to occur. Further, since the socket board 700 can be assembled without being rotated, the length of the cable 624 is hard to vary, and good test performance can be exhibited. In addition, since the grouping property is improved, the maintainability or the decomposing workability are also improved. The opening portion 613 formed in the connector base 61 is further provided with a second portion 613b located on the lower side of the socket board 700 in a state supported by the pillars 6Ua, 6ub of the connector base 61. In the second portion 6Ub, by passing the cable 624 drawn downward from the socket board 700, and the socket board 700 is supported by the connector base, the cable is not bent, and the unfavorable stress does not function. On cable 624. Further, in the present embodiment, after the male connector 62 is attached to the connector base 610, the spacer 65 can be attached from above. Therefore, the testability of the test head 5 is improved, and the maintainability or the decomposing workability is also improved. The embodiments described above are intended to facilitate the understanding of the present invention and are not intended to limit the invention. Therefore, the respective elements disclosed in the above embodiments are intended to include all design changes or equivalents of the technical scope of the invention. For example, in the above embodiment, the spacer 650 and the connector guide 660 are separated from each other, but the spacer 65 〇 and the connector guide 660 may be integrally formed. 2030-7709-PF 31 1277756 Further, in the above embodiment, the male connector 620 is provided on the main body side plate 600, and the female connector 740 is provided on the socket board 700. Become the opposite. Further, in the above embodiment, the male connector 620 can be moved "but the female connector 740 can be moved or the connectors 620, 740 can be moved. In addition, in other embodiments, the connector side plate connected by the probe card and the probe card used in the test, the connector base 610 and the male connector may be used as described above. 620, the pressing member 630, the cover member 640, Pa, the spacer 65 〇 and the connector guide 66 〇 are formed. At this time, in the arrangement of the male connector 620, in addition to the lattice arrangement shown in Fig. 16, a radial arrangement not shown in the drawings may be employed. Simple description of L schema] Dream Department! The figure is an overall perspective view of the electronic component testing device according to the first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along the line π π of the drawing of the drawing. Pieces! A flow chart showing the tray of the processing method of the 1C element of the electronic component testing apparatus of Fig. 1. Figure 4 is a perspective view of the upper structure of the test head of the fifth heart diagram. Brother b picture you 笙da ^ 放大 Figure 4 is an enlarged plan view of the V part. Figure 6 is a cross-sectional view taken along line νι-νι of Mo 5 ® . Brother (the figure is a cross-sectional view of the w-pass line along the 图 耆 5 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。.

2030-7709-PF 32 1277756 The second pj 111 1 糸 shows a perspective view of the entirety of the connector base used in the body side panel of Fig. 4. Fig. 10 is an enlarged plan view showing a portion X of Fig. 9. Figure 11 is a cross-sectional view taken along the line X I - X I of the first figure. Figure 12 is a cross-sectional view taken along line X π - X π of the first figure. Fig. 13 is a perspective view showing the male side connector used in the body side panel of Fig. 4.

Fig. 14 is a cross-sectional view showing the first step of inserting the connector into the opening of the connector base. Fig. 15 is a cross-sectional view showing a second step of moving the connector inserted into the opening of the connector base toward the lateral direction. Fig. 16 is a perspective view showing the connector base and the pressing member which are not attached to the first embodiment of the present invention. Fig. 17 is an exploded perspective view showing the pressing member according to the first embodiment of the present invention. Fig. 18 is a cross-sectional view showing the third step of mounting the base member of the pressing member on the connector base on which the connector is mounted. The ninth embodiment is a cross-sectional view showing a fourth step of inserting the abutting member into the base member of the pressing member to which the connector base is attached. Fig. 20 is a perspective view showing the connector base and the cover member to which the pressing member is attached, which is not the i-th embodiment of the present invention. Fig. 21 is a perspective view showing a pressing member and a lid member according to the first embodiment of the present invention. Figure 22 is not attached to the connector base by the cover member.

2030-7709-PF 33 1277756 A cross-sectional view of the fifth step of the pressing member. Fig. 23 is a perspective view showing a connector base and a connector guide for attaching a pressing member and a cover member in a third embodiment of the present invention. Fig. 24 is a perspective view showing a spacer and a connector guide of Annon's base of the connector in the third embodiment of the present invention. Figure 25 is a cross-sectional view showing the sixth step of mounting the spacer to the connector base and the seventh step of mounting the connector guide to the spacer.

Figure 26 is a cross-sectional view showing the eighth step of covering the body side panel with the casing. Fig. 27 is an exploded perspective view showing the cover member according to the first embodiment of the present invention. Fig. 28 is an exploded perspective view showing the structure of the upper portion of the test head according to the second embodiment of the present invention. Figure 29 is a plan view showing a state in which a socket board is inserted into a connector base in a second embodiment of the present invention. Fig. 30 is a schematic cross-sectional view showing the upper structure of a conventional test head. Fig. 0 is a cross-sectional view showing a first step of mounting a connector on a main body side plate of a conventional test head. Figure 32 is a cross-sectional view showing the second step of the connector mounting of the body side panel of the conventional test head.

[Main component symbol description] 2030-7709-PF 34 1277756

i processor, 100 compartment, 101 thermostat, 108 test pallet handling 200 1C storage, 201 pre-test 1C storage, 202 test 1C storage, 203 pallet support frame, 204 elevator, 205 pallet transfer arm, 300 loading unit, 401 supply tray storage 402 movable arm, 403 movable head, 404 tray conveying device, 405 temporary storage unit, 406 window portion, 500 test head body, 600 body side plate, 102 test chamber, 103 heat removal groove, 105 device substrate, set, 301 rail, 302 movable arm, 303 movable head, 304 XY transport device, 305 position corrector, 306 window portion, 400 unloading portion, 610 connector base, 613 opening, 620 male side connection , 700 socket board, 740 female connector, TST test tray.

2030-7709-PF 35

Claims (1)

1277756 X. Patent application scope: 1. An electronic component testing device comprising: a body side plate electrically connected to the test head body and having a first connector; and a connection plate for electrically connecting the mounted and tested electronic components Contact terminal, and having a second connector detachable from the first connector; characterized in that: _ the body side panel has a supporting device for supporting the first connector to face the connecting plate®; The support device is formed larger than the first connector, and the first connector can pass through at least the opening of the first portion. 2. The electronic component testing device of claim 1, wherein the opening further comprises a second portion on a lower side of the first connector supported by the support device. 3. The electronic component testing device of claim 3, wherein the supporting device has a plurality of pillars composed of a pair of pillars supporting one end of the first connector in order to support the plurality of first connectors. Further, the pillar groups are arranged to protrude toward the connecting plate side, and have a base portion forming the opening portion; the first portion of the opening portion is formed between the pillar groups of the base σ卩. 4. The electronic component testing device of claim 3, wherein the opening further comprises a second portion on a lower side of the first splicer supported by the support device; 2030-7709-PF 36 1277756 The second portion of the opening is formed between the pair of struts of the base portion. The electronic component testing device of claim 2, wherein: the body side panel has a pressing device, and the cable passing through the second portion of the opening portion is drawn downward from the first connector The pressing device can be mounted to the support device from above. 6. The electronic component testing device of claim 5, comprising: • an abutting member abutting the cable; and a base member holding the abutting member; the abutting member is separable from the base member Disassembly. 7. The electronic component testing device of claim 6, wherein the fixing device prevents the abutting member of the pressing device from being detached from the base member from the base member; the fixing device can be mounted from above The pressing device. 8. The electronic component testing device of claim 1, wherein the body side panel further has a spacer mountable from above to the support device. 9. The electronic component testing device of claim 8, wherein: the body side panel includes guiding means for guiding the connecting panel to the body side panel when the connecting panel is mounted to the body side panel; the guiding device is Installed on the spacer above. An electronic component testing device according to claim 9, wherein the spacer is integrally formed with the guiding device. 2030-7709-PF 37 1277756 The second electronic patent testing device of the second franchise patent, the center connector, the second connector or the second connector, when the first connector and the second connector are installed :—The person's set to move in the small ground. The connector may be in a predetermined range. 2. The electronic component testing device of claim 1, wherein the connecting plate is mounted and tested with an Ic component as an electrical socket socket board, or mounted and tested crystal Probe card with a probe of the electric type (4). 13·—Electronic component testing device, comprising: · body side plate, electrically connected with test head body, and having first connector; and ^ connecting plate, mounting and (4) test electronic component w electrically connected contact terminal And having a second connector detachable from the first connector; wherein: the body side panel comprises: a supporting device having a plurality of pillar groups supporting the first connector at both ends thereof, and forming an opening portion And the opening portion includes a first portion through which the first connector of the outgoing cable can be inserted; and a second portion that is moved laterally after being inserted into the first connector, and the cable is in the lateral direction The state of the group support passes; the pressing device, after supporting the first connector by the supporting device, plugs the opening and presses the cable; the spacer holds the supporting device to support the supporting device a portion of the first connector is exposed through the opening; and 2030-7709-PF 38 1277756 guiding device 'having the first connector to face the second connector Guide pin for connector positioning. 14. The electronic component testing device of claim 13, wherein the spacer is integrally formed with the guiding device. 15. The electronic component testing device of claim 13, wherein at least one of the first connection benefit or the second connector is configured to be installed when the first connector and the second connector are mounted The range can be moved minutely. 16. The electronic component testing device of claim 13, wherein the connecting plate is mounted and electrically connected to the socket plate of the socket, or the mounted and tested wafers are electrically contacted. Explore the probe card. The electronic component testing device of the invention, wherein the main body side panel further has: a housing body covering the entire upper portion of the first connector; And a connecting portion electrically inserting the first connecting piece with the test head body to be detachable from the circuit board; the connecting portion is exposed from the housing. 18. The mine of claim 17 of the patent scope; a ^^^ ^ electric kilometer test device, in which the body side panel has a cover attached to the eight cover member; The cover member of the circuit board can be detached from the housing. The component testing device, wherein the electronic component 2030-7709-PF 39 1277756 has a holding portion that holds the circuit board mounted on the bottom plate; the 〆 holding portion is disposed to the cover member The established range can be moved minutely. And an electronic component testing device comprising a connecting plate, a contact terminal for mounting the electronic component to be electrically contacted, and electrically connected to the test head body, wherein: further comprising: supporting the connecting plate a supporting device; _ formed in the supporting device, larger than the connecting plate, and the connecting plate can pass through at least the opening portion of the first portion. The electronic component testing device of claim 2, wherein the opening further comprises a second portion on a lower side of the connecting plate supported by the supporting device. 22. The electronic component testing device of claim 2, wherein the supporting device has a plurality of pillars consisting of a pair of pillars supporting one end of the connecting plate in order to support the plurality of connecting plates. Further, each of the pillar groups is disposed to protrude toward the connecting plate side, and has a base portion that forms the opening portion; and the first portion of the opening portion is formed between the pillar groups of the base portion. The electronic component testing device of claim 22, wherein the second portion of the opening portion is formed between the pair of struts of the base portion. 24) The electronic component testing device of claim 20, wherein the body side panel has a space 25 that can be mounted from the upper side of the support device as in the second aspect of the patent application. In the electronic component testing device, the connecting plate is an adapter plate of the socket in which the IG element is electrically contacted with the tested IG component or an electric probe card of the tested wafer. Probe 2030-7709-PF 41