TWI274616B - Method and system for removing thin metal film - Google Patents
Method and system for removing thin metal film Download PDFInfo
- Publication number
- TWI274616B TWI274616B TW092127919A TW92127919A TWI274616B TW I274616 B TWI274616 B TW I274616B TW 092127919 A TW092127919 A TW 092127919A TW 92127919 A TW92127919 A TW 92127919A TW I274616 B TWI274616 B TW I274616B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode
- metal
- electrolyte
- thin film
- metal plate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F5/00—Electrolytic stripping of metallic layers or coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002298947 | 2002-10-11 | ||
JP2002336838A JP4157753B2 (ja) | 2002-10-11 | 2002-11-20 | 金属薄膜の除去方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200405838A TW200405838A (en) | 2004-04-16 |
TWI274616B true TWI274616B (en) | 2007-03-01 |
Family
ID=32095441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092127919A TWI274616B (en) | 2002-10-11 | 2003-10-08 | Method and system for removing thin metal film |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4157753B2 (ja) |
KR (1) | KR101015427B1 (ja) |
TW (1) | TWI274616B (ja) |
WO (1) | WO2004033384A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0621184D0 (en) | 2006-10-25 | 2006-12-06 | Rolls Royce Plc | Method for treating a component of a gas turbine engine |
GB0701397D0 (en) | 2007-01-25 | 2007-03-07 | Rolls Royce Plc | Apparatus and method for calibrating a laser deposition system |
GB2449862B (en) | 2007-06-05 | 2009-09-16 | Rolls Royce Plc | Method for producing abrasive tips for gas turbine blades |
KR101769612B1 (ko) | 2010-12-10 | 2017-08-21 | 삼성디스플레이 주식회사 | 기판 평탄화 방법 |
TWI587962B (zh) * | 2015-06-03 | 2017-06-21 | 遠東科技大學 | 振動型光碟鍍膜去除裝置 |
TWI587963B (zh) * | 2015-06-03 | 2017-06-21 | 遠東科技大學 | 具斜角之直立式光碟鍍膜去除裝置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5150247A (ja) * | 1974-10-28 | 1976-05-01 | Inoue Japax Res | Denkaikensakukakohoho |
JPS59193859U (ja) * | 1983-06-06 | 1984-12-22 | 株式会社 山田メツキ工業所 | エツチング装置 |
JPS62290900A (ja) * | 1986-06-11 | 1987-12-17 | Oki Electric Ind Co Ltd | 透明導電膜のエツチング方法およびその装置 |
JP3353075B2 (ja) * | 1994-01-18 | 2002-12-03 | 西山ステンレスケミカル株式会社 | ガラス板の再生方法及びその装置 |
US6153535A (en) * | 1996-10-23 | 2000-11-28 | Asahi Glass Company Ltd. | Method for removing a thin film for a window glass |
US6334942B1 (en) * | 1999-02-09 | 2002-01-01 | Tessera, Inc. | Selective removal of dielectric materials and plating process using same |
US6723224B2 (en) * | 2001-08-01 | 2004-04-20 | Applied Materials Inc. | Electro-chemical polishing apparatus |
-
2002
- 2002-11-20 JP JP2002336838A patent/JP4157753B2/ja not_active Expired - Fee Related
-
2003
- 2003-10-02 KR KR1020057005724A patent/KR101015427B1/ko not_active IP Right Cessation
- 2003-10-02 WO PCT/JP2003/012630 patent/WO2004033384A1/ja active Application Filing
- 2003-10-08 TW TW092127919A patent/TWI274616B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2004182998A (ja) | 2004-07-02 |
KR101015427B1 (ko) | 2011-02-22 |
TW200405838A (en) | 2004-04-16 |
KR20050057615A (ko) | 2005-06-16 |
JP4157753B2 (ja) | 2008-10-01 |
WO2004033384A1 (ja) | 2004-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |