TWI272650B - Reduced-pressure dryer - Google Patents

Reduced-pressure dryer Download PDF

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Publication number
TWI272650B
TWI272650B TW094141626A TW94141626A TWI272650B TW I272650 B TWI272650 B TW I272650B TW 094141626 A TW094141626 A TW 094141626A TW 94141626 A TW94141626 A TW 94141626A TW I272650 B TWI272650 B TW I272650B
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Taiwan
Prior art keywords
opening
chamber
closing valve
substrate
exhaust
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TW094141626A
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Chinese (zh)
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TW200632990A (en
Inventor
Takashi Kakimura
Yoshitaka Kitamura
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Dainippon Screen Mfg
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

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  • Physics & Mathematics (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Drying Of Solid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The reduced-pressure dryer comprises a chamber 10 covering the circumference of a substrate W, an exhaust pump 50, a first opening/closing valve 41, a second opening/closing valve 42, and a third opening/closing valve 43. After photoresist formed on the major surface of the substrate W is vacuum dried by opening the first opening/closing valve 41 and evacuating the chamber 10, the first opening/closing valve 41 is closed and evacuation of the chamber 10 is stopped. Subsequently, inert gas is supplied to the exhaust pump 50 by opening the second opening/closing valve 42, and inert gas is supplied into the chamber 10 by opening the third opening/closing valve 43.

Description

1272650 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種減壓乾燥裝置 【先前技術】1272650 IX. Description of the invention: [Technical field of invention] The present invention relates to a vacuum drying apparatus [Prior Art]

。例如’專利文獻丨中揭示有對光阻料之薄膜進行減堡乾 燦的減壓乾燥裝置,該光阻劑塗布於半導體晶圓或液晶顯 不面板用玻璃基板或者半導體製造裝置用光罩基板等基 板。於該專利文獻!中所揭示之減壓乾燥裝置中,使用乾二 幫浦等排氣泵對搬入有基板之腔室内實施減壓,藉此;: 進作為光阻液中心成分之溶劑的蒸發,以使光阻劑迅速乾 燥。使用如此之減壓乾燥裝置而使光阻劑乾燥之情形時, 可防止風或熱等外在因素影響,而使光阻劑均勻乾燥。 又,使用有如此之減壓乾燥裝置之情形時,有時會產生 開始減壓乾燥處理直後稱為突沸之現象。該現象係藉由塗 布於基板表面之光阻劑中之溶劑成分急速蒸發而突然沸騰 所產生之現象。產生有如此之突沸之情形時,將產生稱為 脫泡的於光阻表面形成有小泡之現象,則該基板不能使 用。因此,於減壓乾燥處理之初期階段,於腔室内進行低 速排氣,防止脫泡產生後,對腔室内實施強力排氣,以對 整個基板進行迅速且均勻之乾燥處理。 [專利文獻1]日本專利特開平7-283 108號公報 [發明所欲解決之問題] 構成薄膜之光阻劑中,例如,彩色濾光片(color Filter) 用光阻劑或者有機膜用光阻劑(Qrganic Resist)等之含有丙 106673.doc 1272650 稀酸系樹脂之光阻, + 具有猎由經時變化而易固化之性質。 因此,使用有如此 ^庇貝 衫色濾光片用光阻劑或者含有丙烯酸 糸树脂之光阻劑作炎、μ — — 、、光阻劑之情形時,將會產生光阻劑固 者於排氣泵内之問題。 即,騎減壓乾燥處理之情形時,於排氣製程初期,存 在於瓜至内之惰性氣體等大量通過排氣果。另一方面,於 排氣製程中途’光阻劑中之溶劑成分開始氣化。此時,由 於腔室内基本不存在惰性氣體等’故而氣體中所包含之高 濃度溶劑成分將會自泵中通過。 此時’至於排氣使用乾式幫浦。該乾式幫浦係 螺敬式录’其構成為,藉由使轉子於套管内旋轉,而使氣 體壓縮並且移動,以,μ»— Μ γ 移動u此進仃排氣。如此般,於排氣泵中侵 入有高濃度溶劑成分之情形時,壓縮氣體時光阻劑之溶劑 成分將會固著於泵之轉子部分。繼而,轉子上所固著之溶 劑成分堆積起來後,將對排氣泵之排氣動作引起障礙。 再者,如此之乾式幫浦中,因介隔微小空隙而使轉子盘 套管維持於非接觸狀態,故而於泵内流動有少量之淨化氣 體。因此,藉由使該淨化氣體之流量增大,可防止溶劑成 分固著’然而採用如此之構成後,將會產生排氣果之排氣 性能降低,腔室之真空到達度降低之問題。 本發明係為解決上述問題研製而成者,其目的在於提供 -種可防止光阻劑等之薄膜成分固著於排氣泵中的減壓乾 燥裝置。 【發明内容】 106673.doc 1272650 請求項丨所揭示之本發明’其係對基板之主面上所形成之 相實施減壓乾燥之減愿乾燥裳置,其特徵在於包H 室,其覆蓋基板周圍;排氣泵,其對上述腔室内之環境氣 體進行排氣;以及第斶閉闕,其配設於上述排氣泵盘上述 腔室之間’·且藉由打開上述第蹋閉閥使上述腔室内排氣, 錢基板之主面上所形成之薄膜減壓乾燥,繼而關閉上述 弟1開閉閥使上述腔室停止排氣後’將情性氣體供應至連結 上述第1開閉閥與上述排氣泵之管路中。 言章求項2所揭示之本發明,其係對基板之主面上所形成之 薄膜實施減麼乾燥之減壓乾燥裝置,其特徵在於包含於 室,其覆蓋基板周圍;排氣泵,其對上述腔室内之環境氣 體進行排氣;第則闕’其配設於上述排氣泵與上述腔室 ^間’弟2開閉閥,其連接至連結上述第旧閉閥與上述排 :泵之官路’用以將惰性氣體導入該管路中,'第3開閉閥, 八用以將惰性氣體供應至上述腔室内;以及控制機構,並 於猎由打開上述第1開閉閥使上述腔室内排氣,而使基板之 主面上所形成之薄膜減壓乾燥,繼而關閉上述第鴻閉閥使 上述腔室停止排氣後’打開上述第2開閉閥向連結上述第i 開閉閥與上述排褒$ 总 、、外 7 &路中供應惰性氣體,同時打開上 述第3開閉閥將惰性氣體供應至上述腔室内。 請求項3所揭示之本發明,其係如請求項2之本發明,直 二上述控制部,同時使上述第2開閉閥與上述第頂閉間打 開0 μ求項4所揭不之本發明,其係對基板之主面上所形成之 106673.doc 1272650 薄膜實施減壓乾燥之減壓乾燥裝置,其特徵在於包含:# 室,其覆蓋基板周圍;排氣泵,其對上述腔室内之 氣進行排氣;^開閉閥’其配設於上述排氣泵與上述織 之間;惰性氣體供應機構,其將惰性氣體供應至上述排氣 泵;以及控制機構,其藉由上述排氣泵之排氣使腔室内達 到預先設定之真空度後,關閉上述第!開閉闕,同時以使, 2上述惰性氣體供應機構而供應給排氣泵之惰性氣體的I 里增大之方式進行控制。 請求項5所揭示之本發明,其係如請求们至4中任何一項 之本發明’其中,上述薄膜係彩色遽光片用光阻劑或者含 有丙稀酸系樹脂之光阻劑。 月长員6所揭不之本發明’其係如請求項工至*中任何一項 之本發明,其中,上述排氣泵係乾式幫浦。 [發明之效果] 、、、根據請求項1、請求項2以及請求項4所揭示之本發明,於 管路^ ^後將惰性氣體供應至連結第1開閉間與排氣系之 吕 ,因此藉由介由該管路將惰性氣體供應至排氣泵, 可防止光阻劑等薄膜成分固著於排氣泵中。 根據請求項3所姐- π „ +貝3所揭不之本發明,同時將第2開光閥以及第3 開閉閥打開,闵 口此可使用以對裝置進行控制之構成簡單化。 根據請求項4所^ 、4所揭不之本發明,可防止易固化之彩色滤光 η用无阻劑或去 έ有丙稀酸系樹脂之光阻劑的成分附著於 非氧I添^中。 根據請求項S _ 、)所揭示之本發明,可於壓縮氣體時防止朝易 106673.doc 1272650 產生固化之乾式幫浦中之固著 【實施方式】 乂下 基於圖式,對本發明之實施形態加以說明。圖1 係本發明之減壓乾燥裝置之概要圖。 该減壓乾燥褒置具備腔室10,其包含蓋部11、填料12、 及基部13 ;支持銷15,其豎著設置於該腔室10之基部13上;. For example, in the 'Patent Document 揭示, there is disclosed a vacuum drying apparatus for drying a film of a photoresist, which is applied to a semiconductor wafer or a glass substrate for a liquid crystal display panel or a photomask substrate for a semiconductor manufacturing apparatus. Such as the substrate. In this patent document! In the vacuum drying apparatus disclosed in the present invention, an exhaust pump such as a dry two pump is used to depressurize a chamber into which a substrate is carried, thereby: evaporating a solvent as a center component of the photoresist to make the photoresist The agent dries quickly. When such a reduced-pressure drying device is used to dry the photoresist, external factors such as wind or heat can be prevented from being affected, and the photoresist can be uniformly dried. Further, when such a reduced-pressure drying apparatus is used, there is a case where the start of the reduced-pressure drying treatment is called a sudden boiling phenomenon. This phenomenon is caused by a sudden boiling of a solvent component in a photoresist coated on the surface of the substrate. When such a sudden boiling occurs, a phenomenon in which vesicles are formed on the surface of the photoresist called defoaming occurs, and the substrate cannot be used. Therefore, in the initial stage of the vacuum drying treatment, low-speed exhaust is performed in the chamber to prevent the occurrence of defoaming, and then strong exhaust gas is applied to the chamber to rapidly and uniformly dry the entire substrate. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei 7-283108 (Problems to be Solved by the Invention) Among the photoresists constituting the film, for example, a color filter for a color filter or a light for an organic film Resist (Qrganic Resist) and other photoresists containing C 106673.doc 1272650 dilute acid resin, + has the property of hunting and curing due to changes over time. Therefore, when a photoresist having such a blister filter or a photoresist containing acryl resin is used as the inflammatory, μ-, or photoresist, a photoresist is generated. Problems in the exhaust pump. In other words, in the case of riding under reduced pressure drying, in the initial stage of the exhaust gas process, a large amount of inert gas, such as melon, is passed through the exhaust fruit. On the other hand, the solvent component in the photoresist is vaporized in the middle of the exhaust process. At this time, since there is substantially no inert gas or the like in the chamber, the high-concentration solvent component contained in the gas will pass through the pump. At this time, as for the exhaust, a dry pump is used. The dry pumping system is constructed such that the gas is compressed and moved by rotating the rotor in the sleeve, so that μ»- Μ γ moves u into the exhaust. In this case, when a high concentration of solvent component is invaded in the exhaust pump, the solvent component of the photoresist will be fixed to the rotor portion of the pump when the gas is compressed. Then, after the solvent components fixed on the rotor are piled up, the exhaust operation of the exhaust pump is hindered. Further, in such a dry pump, since the rotor disk sleeve is maintained in a non-contact state due to the small gap, a small amount of purified gas flows in the pump. Therefore, by increasing the flow rate of the purge gas, it is possible to prevent the solvent component from being fixed. However, with such a configuration, there is a problem that the exhaust gas performance of the exhaust gas is lowered and the vacuum degree of the chamber is lowered. The present invention has been made to solve the above problems, and an object thereof is to provide a decompression drying apparatus capable of preventing a film component such as a photoresist from being fixed to an exhaust pump. [Claim of the Invention] 106673.doc 1272650 The invention disclosed in claim 1 is a deliberate drying device for performing a vacuum drying of a phase formed on a main surface of a substrate, characterized by comprising a H chamber covering the substrate An exhaust pump that exhausts ambient gas in the chamber; and a second shut-off that is disposed between the chambers of the exhaust pump disk and is opened by opening the third shut-off valve Discharging the inside of the chamber, drying the film formed on the main surface of the money substrate, and then closing the opening and closing valve of the first one to stop the exhaust of the chamber, and then supplying the inert gas to the first opening and closing valve and the above In the pipeline of the exhaust pump. The invention disclosed in claim 2 is a vacuum drying apparatus for performing drying on a film formed on a main surface of a substrate, characterized in that it is contained in a chamber covering a periphery of the substrate; and an exhaust pump; Exhausting the ambient gas in the chamber; the first 阙' is disposed between the exhaust pump and the chamber, and is connected to the first closed valve and the row: pump The official road 'is used to introduce an inert gas into the pipeline, the third opening and closing valve, eight for supplying an inert gas into the chamber; and a control mechanism for opening the first opening and closing valve to open the chamber Exhausting, and drying the film formed on the main surface of the substrate under reduced pressure, and then closing the first closing valve to stop the exhaust of the chamber, and then opening the second opening and closing valve to connect the first opening and closing valve and the row The inert gas is supplied to the 总$ total, outer 7 & road, and the third opening and closing valve is opened to supply the inert gas into the chamber. The present invention disclosed in claim 3 is the invention of claim 2, wherein the second control unit and the first closing unit open the 0 μ item 4 And a vacuum drying device for performing vacuum drying on a 106673.doc 1272650 film formed on a main surface of the substrate, comprising: a # chamber covering the periphery of the substrate; and an exhaust pump facing the chamber The gas is exhausted; the opening and closing valve is disposed between the exhaust pump and the woven fabric; the inert gas supply mechanism supplies the inert gas to the exhaust pump; and the control mechanism is provided by the exhaust pump After the exhaust gas reaches a predetermined degree of vacuum in the chamber, the above-mentioned first opening and closing is closed, and at the same time, the I of the inert gas supplied to the exhaust pump by the inert gas supply means is increased. The invention of claim 5, wherein the film is a photoresist for a color light-emitting sheet or a photoresist containing an acrylic resin. The present invention is the invention of any one of the items of the present invention, wherein the exhaust pump is a dry pump. [Effects of the Invention] According to the invention disclosed in the claims 1, the request 2, and the claim 4, the inert gas is supplied to the first opening and closing chamber and the exhaust system after the piping By supplying the inert gas to the exhaust pump through the piping, it is possible to prevent the film component such as the photoresist from being fixed to the exhaust pump. According to the invention of claim 3, the second opening valve and the third opening and closing valve are opened at the same time, and the opening can be used to simplify the configuration of the device. The invention disclosed in the fourth and fourth embodiments can prevent the component of the color filter η which is easy to be cured from being adhered to the non-oxygen I by the non-resistance agent or the component of the photoresist having the acrylic resin. The invention disclosed in the item S _ , ) can prevent the fixing in the dry pump which is cured by the light 106673.doc 1272650 when compressing the gas. [Embodiment] The embodiment of the present invention will be described based on the drawings. Figure 1 is a schematic view of a vacuum drying apparatus of the present invention. The vacuum drying apparatus is provided with a chamber 10 including a lid portion 11, a packing 12, and a base portion 13; a support pin 15 vertically disposed in the chamber On the base 13 of the chamber 10;

以及支持板22 ’其上豎著設置有複數個升降銷21。基板WAnd the support plate 22' is provided with a plurality of lift pins 21 vertically. Substrate W

於其主面上’塗布有作為薄膜之彩色濾光片用光阻劑或者 s有有機膜用光阻劑等之丙烯酸系樹脂的光阻劑,該基板 W於腔室1〇内’以使其主面朝上之水平姿勢由支持銷15或 者升降銷21支持。 支持板22,介隔支持棒24與升降機構25連結。升降銷21 與支持板22—併藉由升降機構25之作用,可於基板w之交 接位置’與®1所示之乾燥位置之間進行升降,該基板^之 交接位置係與未圖示之搬送臂之間對基板w進行交 置。 ^腔室1G之基部13,形成有排氣口 3!。該排氣口31,介 隔=路53、第!開閉閥41以及管_,與排氣㈣連接。該 排氣栗50包含藉由使轉子旋轉而使氣體壓縮並移動進而排 :了旋式乾式幫浦。於該排氣系5。上,配設有供應淨化 :氣脰用之管路54。介由該管路54,_直吹人有少量淨 氣於该排氣栗5 0内。 : 又’該排氣系5 0, 排氣栗5 0排出之氣體 介隔管路55與氣液 ,於氣液分離部5 6 分離部56連接。由 中被除去液體成分 106673.doc χ27265〇 後’排氣至大氣中’或者排氣區域。 連結第1開閉閥41與排氣果54之 接續有第2開閉閥42。唁 上,介隔管路52 用”… 名弟2開閉閥42係,經由管 用以將氮氣供應至排氣粟5〇 由吕路5】、52 供應源。 、’接有未圖示之氮氣 再者,存有彩色濾光片用光阻劑或者 之光阻劑固著於管路51内之情开 稀酉曼糸樹脂 除去固著於該管路51内之光^ ’、、、於吹人淨化氮氣以 叫目連接之㈣,儘以M;;,較好52與管路 u里處於弟1開閉閥41之近旁。 於腔至10之基部13,形成有氮 入π π考人-# 虱汛導入口 32。於該氮氣導 处’ ’丨隔管路57連接有第3門ρ卩門 们,係介隔管路57用以將氮^廡開閉閥❿該第3開閉閥 用以將虱軋供應至腔室内者,並連接有 未圖不之氮氣供給源。 圖2係表示該發明之減壓乾燥震置之主要電性構成的方 塊圖。 該減壓乾燥裝置含有控制部6〇 ’該控制部6〇包含議 61 ’其儲存有用於控制裝置所必需之動作程式;ram 62, 其於進行控制時暫時儲存資料等;以及cpu 63,其執行邏 輯運算。該控制部60,介由介面64連接有第丨開閉閥41、第 2開閉閥42以及第3開閉閥43。又,該控制部6(),亦連接有 上述升降機構25,或包含用以使腔室1〇之蓋部丨丨開閉之驅 動機構的其他驅動機構6 5。 其次,就藉由該減壓乾燥裝置對基板主面上所形成之薄 膜進行乾燥的乾煉動作加以說明。圖3以及圖4係表示藉由 106673.doc •10- 1272650 本發明之減壓乾燥裝置之乾燥動作之流程圖。 對基板w之主面上所形成之薄膜進行乾燥之情形時,最 初,關閉第1、第2、第3開閉閥41、42、43。於此狀態下, 藉由未圖示之升降機構而使腔室10之蓋部U上升,以此打 開腔室10(步驟S11)。其次,支持有基板冒之未圖示之搬送 臂進入腔室10内(步驟S 12)。 其-人,藉由升降機構25之驅動,升降銷21與支持板22 — φ 併上升至基板冒之交接位置為止(步驟S13)。藉此,由搬送 • #所支持之基板W,繼而由升降銷2 1支持。繼而,搬送臂 自腔室10内退出(步驟S 14)。 其次,藉由升降機構25之驅動,升降銷21與支持板22一 併下降至乾燥位置(步驟S15)。籍此,其下面由升降銷21所 支持之基板W移載至支持銷15上。繼而,藉由未圖示之升 P牛機構使腔室10之蓋部li下降,以此關閉腔室1〇(步驟S16)。 於該狀態下,打開第}開閉閥41,並藉由排氣泵5〇之作用 • 進行少量排氣(步驟S17)。如此般藉由少量排氣量而實施減 壓乾燥之情形時,藉由自基板W之主面之中央朝向端緣的 緩慢空氣流,可於防止有因突沸而引起之脫泡狀態下,實 行適當之減壓乾燥。 若於該狀態下經過固定時間(步驟S18),則切換排氣泵5〇 之驅動以使來自排氣口 3 1之排氣量增大(步驟s〗9)。此 •T於基板W之主面上,將自其中央朝向端緣產生相對較 大之空氣流。如此般藉由較大排氣量而實施減壓乾燥之情 形時,於整個基板^主面上,將迅速實施乾燥。然而, 106673.doc 1272650 於上述之因少量排氣而實施之乾燥工程中,薄膜受到一定 程度乾燥,因此不會產生因突沸而引起脫泡。 於该狀態、τ,若藉由未圖示之感應器、,摘測到腔室1〇内 之真空度達到預先設定值(步驟S2〇),則打開第3開閉閥U “將氮氣供應至腔室i 〇内’以使用氮氣淨化腔室Μ内(步驟 )又於此同打,實行關閉第1開閉閥41且打開第2開 閉閥42之閥門切換動作(步驟S22)。 於該狀態下,自開閉閥42經由管路52以及管路51,使多 2氣流入排氣泵50。#,氮氣之流量自零開始增加至特 定量。藉此,可使彩色濾光片用光阻劑或者含有丙烯酸系 樹脂之光阻劑之溶劑成分,與氮氣—起向氣液分離部56流 =。因此,可防止彩色濾光片用光阻劑或者含有丙烯酸系 樹脂之光阻劑的成分固著於排氣泵5〇中。又,此時,與除 去固著於排氣泵50中之光阻同時,亦可實行固著於管路51 中之光阻的除去。 再者士此般使多ΐ氮氣流入排氣泵5 0,亦可使腔室1 〇 内之士空度達到預先設定之值’且,由於第鳩閉閥41為關 閉狀態,故而對腔室10内之真空度並無影響,可良好實行 基板之乾燥處理。 再者,於該實施形態中,同時實行第i、第2、第3開閉閥 41、42、43之開閉動作。藉此,可使用以實行開閉動作之 定時器等簡略化,纟此可使用以控制裝置之構成簡單化。 若藉由來自第3開閉閥43之氮氣的淨化,使腔室ι〇内成為 大氣壓(步驟S23),則關閉第2開閉閥42而停止向排氣泵“ 106673.doc -12- 1272650 供應氮氣’同時關閉第3開閉閥43而停止向腔室1〇之氮氣淨 化(步驟S24)。再者,於此情形時,亦同時實行第]、第3開 閉閥42、43之開閉動作。藉此,可使用以執行開閉動作之 定時器等簡略化,由此可使用以控制裝置之構成簡單化。 其次,藉由未圖示之升降機構使腔室1〇之蓋部η上升, 以打開腔室1〇(步驟S25)。繼而,藉由升降機似之驅動,’ 使升降銷21與支持板22-併上升至基板^交接位 (步驟S26)。 於此狀態下’未圖示之搬送臂進入腔室_ (步驟S27卜 繼而,藉由升降機構25之驅動,升降鎖21與支持心 下降(步驟S28)。藉此,由升降鎖21所支持之基板%,繼而 由搬达臂支持。繼而,支持有基板之搬送臂自腔室 出(步驟S29)。 其次’就該減壓乾燥裝置之乾燥動作之其他實施形能加 =明、。圖5以及圖6係表示本發明之減壓乾㈣置的減塵 乾餘之流程圖。 於上述實施形態中,若蕪A氺6。0日。m 右精由來自苐3開閉閥43之氮氣的淨 機成為大氣厂堅(步驟叫則關_^^^ 7㈣孔果54供應氮氣,同時關閉第3開閉閥43而停 =向W之氮氣淨化(步驟S24),藉此 :作之定時器等簡略化,由此使用以靖置之構= :::於此,於該實施形態中,設為自打開第㈣閉闕42 “向排U5G供應並經過㈣設定之時 106673.doc -13- 1272650 述實施形態相同。 即’於該實施形態个若打開第3開閉閥43而將氮氣供應 至腔室ίο内,並以氮氣淨化腔室1〇内後(步驟s2i),腔室1〇a photoresist coated on the main surface thereof with a photoresist for a color filter as a thin film or an acrylic resin having a photoresist for an organic film, and the substrate W is in the chamber 1 以The horizontal posture whose main face is upward is supported by the support pin 15 or the lift pin 21. The support plate 22 is connected to the lifting mechanism 25 via the support rod 24. The lift pin 21 and the support plate 22, by the action of the lifting mechanism 25, can be raised and lowered between the transfer position of the substrate w and the dry position indicated by ®1, and the transfer position of the substrate is not shown. The substrate w is placed between the transfer arms. ^ The base 13 of the chamber 1G is formed with an exhaust port 3!. The exhaust port 31, the interval = the road 53, the first! The on-off valve 41 and the tube_ are connected to the exhaust gas (four). The exhaust pump 50 includes a rotary dry pump that compresses and moves the gas by rotating the rotor. In the exhaust system 5. On the upper side, there is a pipeline 54 for supplying and purifying: gas. Through the line 54, the direct blower has a small amount of clean air in the exhaust pump 50. Further, the exhaust system 50, the gas passage line 55 discharged from the exhaust pump 50, and the gas-liquid are connected to the separation portion 56 of the gas-liquid separation unit 56. The liquid component 106673.doc χ27265〇 is removed from the middle and then exhausted to the atmosphere or the exhaust zone. The second opening and closing valve 42 is connected to the first opening and closing valve 41 and the exhausting fruit 54. In the upper part, the partition line 52 uses "...the younger brother 2 opens and closes the valve 42 system, and supplies the nitrogen gas to the exhaust gas mill 5 by the Lu Lu 5], 52 supply source via the tube. Further, the color filter is filled with a photoresist or a photoresist, and the photoresist is fixed in the tube 51 to remove the light fixed in the tube 51. Blowing people to purify nitrogen to connect with the eyes (4), to M;;, preferably 52 and the pipeline u are in the vicinity of the opening and closing valve 41 of the brother 1. From the cavity to the base 13 of the 10, nitrogen is formed into the π π tester. -# 虱汛Importing port 32. The third door ρ 卩 连接 is connected to the nitrogen gas line ' ' 丨 compartment line 57, and is connected to the line 57 for opening and closing the valve to the third opening and closing valve It is used to supply the rolling to the chamber, and is connected to a nitrogen supply source which is not shown. Fig. 2 is a block diagram showing the main electrical configuration of the reduced-pressure dry vibration of the invention. The unit 6〇's the control unit 6〇 contains the action program 61' which stores the necessary action programs for controlling the device; the ram 62, which temporarily stores the funds during the control And the CPU 63 performs a logical operation. The control unit 60 is connected to the third opening and closing valve 41, the second opening and closing valve 42, and the third opening and closing valve 43 via the interface 64. Further, the control unit 6() The above-mentioned lifting mechanism 25 or another driving mechanism 65 including a driving mechanism for opening and closing the lid portion of the chamber 1 is connected. Next, the vacuum drying device is formed on the main surface of the substrate. The dry operation of drying the film will be described. Fig. 3 and Fig. 4 are flow charts showing the drying operation of the vacuum drying apparatus of the present invention by 106673.doc • 10-1272650. When the film is dried, the first, second, and third opening and closing valves 41, 42, and 43 are first closed. In this state, the lid portion U of the chamber 10 is raised by a lifting mechanism (not shown). Thereby, the chamber 10 is opened (step S11). Secondly, the transfer arm (not shown) supporting the substrate enters the chamber 10 (step S12). The person-applied by the lift mechanism 25, the lift pin 21 And the support board 22 - φ and rise to the position where the substrate is placed (step S13). The substrate W supported by the transport ## is then supported by the lift pin 21. Then, the transfer arm is withdrawn from the chamber 10 (step S14). Next, the lift pin 21 and the support are driven by the lift mechanism 25. The plate 22 is lowered to the dry position together (step S15). Thereby, the substrate W supported by the lift pins 21 is transferred to the support pin 15. The chamber is then opened by a rising P cow mechanism (not shown). The lid portion li of the lower portion 10 is lowered to close the chamber 1 (step S16). In this state, the opening and closing valve 41 is opened, and by the action of the exhaust pump 5, a small amount of exhaust gas is performed (step S17). . When the vacuum drying is performed by a small amount of exhaust gas as described above, the slow air flow from the center of the main surface of the substrate W toward the end edge can be prevented from being defoamed due to the sudden boiling. Dry under appropriate pressure. When a fixed time has elapsed in this state (step S18), the driving of the exhaust pump 5 is switched to increase the amount of exhaust from the exhaust port 3 1 (step s9). This T on the main surface of the substrate W will generate a relatively large air flow from its center toward the end edge. When the vacuum drying is performed by a large amount of exhaust gas as described above, drying is rapidly performed on the entire surface of the substrate. However, in the above-mentioned drying process by a small amount of exhaust gas, the film is dried to some extent, so that defoaming due to sudden boiling does not occur. In this state, τ, when the vacuum in the chamber 1〇 is measured by a sensor (not shown) to reach a predetermined value (step S2〇), the third opening and closing valve U is opened. In the chamber i, the inside of the chamber is purged with a nitrogen gas (step), and the valve switching operation of closing the first opening and closing valve 41 and opening the second opening and closing valve 42 is performed (step S22). The self-opening and closing valve 42 allows the air flow into the exhaust pump 50 via the line 52 and the line 51. #, the flow rate of nitrogen gas increases from zero to a specific amount. Thereby, the color filter can be used as a photoresist. Or the solvent component of the photoresist containing the acrylic resin flows with the nitrogen gas to the gas-liquid separation unit 56. Therefore, the composition of the photoresist for the color filter or the photoresist containing the acrylic resin can be prevented. The exhaust pump 5 is placed in the exhaust pump 5. At this time, the removal of the photoresist fixed in the exhaust pipe 50 can be removed simultaneously with the removal of the photoresist fixed in the exhaust pump 50. By flowing a plurality of nitrogen gas into the exhaust pump 50, the airspace in the chamber 1 can also reach a preset value'. Since the third closing valve 41 is in the closed state, the degree of vacuum in the chamber 10 is not affected, and the drying process of the substrate can be favorably performed. Further, in the embodiment, the i, second, and third are simultaneously performed. The opening and closing operations of the opening and closing valves 41, 42, and 43. The timer for performing the opening and closing operation can be simplified, and the configuration of the control device can be simplified. The nitrogen gas from the third opening and closing valve 43 can be used. When the inside of the chamber ι is at atmospheric pressure (step S23), the second opening and closing valve 42 is closed, and the supply of nitrogen gas to the exhaust pump "106673.doc -12-1272650" is stopped, and the third opening and closing valve 43 is closed and the flow is stopped. The chamber is purged with nitrogen gas (step S24). Further, in this case, the opening and closing operations of the first and third opening and closing valves 42 and 43 are simultaneously performed. Thereby, a timer or the like for performing the opening and closing operation can be simplified, whereby the configuration of the control device can be simplified. Next, the lid portion η of the chamber 1 is raised by a lifting mechanism (not shown) to open the chamber 1 (step S25). Then, by the elevator, the lift pin 21 and the support plate 22 are raised to the substrate (the step S26). In this state, the transfer arm (not shown) enters the chamber _ (step S27), and the lift lock 21 and the support core are lowered by the driving of the lift mechanism 25 (step S28). Thereby, the lift lock 21 supports The substrate % is then supported by the transfer arm. Then, the transfer arm supporting the substrate is discharged from the chamber (step S29). Next, the other embodiment of the drying operation of the vacuum drying device can be added. 5 and Fig. 6 are flow charts showing the dust-reducing dryness of the decompressed dry (four) set of the present invention. In the above embodiment, if 芜A氺6. 0. m is right-handed by the nitrogen gas from the 苐3 opening and closing valve 43 The net machine becomes the atmosphere factory (step is called _^^^ 7 (four) hole fruit 54 is supplied with nitrogen gas, and the third opening and closing valve 43 is closed and stopped = nitrogen gas purification to W (step S24), thereby: making a timer The simplification is used, and the use of the structure is as follows: ::: In this embodiment, it is set to open the fourth (closed) 42 "to supply to the row U5G and to pass the (four) setting 106673.doc -13 - 1272650 The embodiment is the same. That is, in the embodiment, when the third opening and closing valve 43 is opened, nitrogen gas is supplied to the chamber. The o, and to the (Step S2I) 1〇 a nitrogen purge chamber, the chamber 1〇

内成為大氣壓(步驟S23a),則關閉第3開閉閥43而停止向腔 室1〇供應氮氣(步驟82外另_方面,與此並行打開開閉闕 42而開始向排氣泵观應氮氣後(㈣s22),錢過預先設 定之固定時間後(步驟S23b),_第2開_閥42而停止向排 氣泵54供應氮氣(步驟S24b)e根據該實施形態,為防止彩 色濾光片用光阻劑或者含有丙烯酸系樹脂之光阻劑的成分 著“非氣泵50 ’可將向排氣泵5〇之氮氣供應時間設為最 適合之時間。 於上述實施形態中,均構成為:連接於排氣泵50 之官路51 ’藉由連接與氮氣之供給源相連接之管路52,而 將多量氮氣供應至排氣㈣。_,於將淨化氣體供應至 排亂泵50之管路54上設置流量調整閥,當腔室_之直空 預先設定之值,並關閉第丨開閉閥⑽,介由管路Μ =量氮氣流入排氣果5。’因此亦可採用防止彩色渡光片 4Γ劑或者含有丙烯酸系樹脂之光阻劑之成分固著於排 乳泵50中的構成。 【圖式簡單說明】 圖1係本發明之減壓乾燥裝置之概要圖。 塊;。I不本叙明之減壓乾燥装置的主要電性構成之方 圖3係表示乾燥動作之流程圖。 106673.doc -14· 1272650 圖4係表示乾燥動作之流程圖。 圖5係表示乾燥動作之流程圖。 圖6係表示乾燥動作之流程圖。 【主要元件符號說明】When the inside becomes atmospheric pressure (step S23a), the third opening and closing valve 43 is closed to stop the supply of nitrogen gas to the chamber 1 (in the case of the other side of the step 82, the opening and closing of the opening and closing unit 42 is started in parallel, and the nitrogen gas is started to be viewed from the exhaust pump ( (4) s22), after the money has passed the predetermined fixed time (step S23b), the second opening_valve 42 stops supplying nitrogen gas to the exhaust pump 54 (step S24b) e. According to the embodiment, the color filter is prevented from being used. The component of the resist or the photoresist containing the acrylic resin is such that the "non-air pump 50" can set the nitrogen supply time to the exhaust pump 5 to be the most suitable time. In the above embodiment, each of the components is configured to be connected to The official road 51' of the exhaust pump 50 supplies a large amount of nitrogen gas to the exhaust gas (4) by connecting a line 52 connected to a supply source of nitrogen gas. _, a line 54 for supplying the purge gas to the scramble pump 50 The flow regulating valve is arranged, when the chamber _ is directly set to a predetermined value, and the third opening and closing valve (10) is closed, and the nitrogen gas flows into the exhausting fruit 5 through the pipe Μ = a quantity of nitrogen. 4 tanning agent or a component containing a photoresist of an acrylic resin BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a vacuum drying apparatus according to the present invention. Block I. The main electrical configuration of the vacuum drying apparatus described in I is not shown in FIG. Fig. 4 is a flow chart showing the drying operation, Fig. 5 is a flow chart showing the drying operation, and Fig. 6 is a flow chart showing the drying operation.

10 腔室 11 蓋部 12 填料 13 基部 14 上面 15 支持銷 15 凹部 21 升降銷 22 支持板 25 升降機構 31 排氣口 32 氮氣導入孔 41 第1開閉閥 42 第2開閉閥 43 第3開閉閥 50 排氣泵 51 管路 52 管路 53 管路 56 氣液分離部 106673.doc • 15 - 1272650 57 管路 W 基板10 Chamber 11 Cover 12 Filler 13 Base 14 Upper surface 15 Support pin 15 Recess 21 Lifting pin 22 Support plate 25 Lifting mechanism 31 Exhaust port 32 Nitrogen introduction hole 41 First opening and closing valve 42 Second opening and closing valve 43 Third opening and closing valve 50 Exhaust pump 51 Line 52 Line 53 Line 56 Gas-liquid separation unit 106673.doc • 15 - 1272650 57 Line W substrate

106673.doc106673.doc

Claims (1)

1272650 十、申請專利範圍: 1· 一種減壓乾燥裝置’其係對形成於基板之主面之薄膜實 施減壓乾燥之減饜釤、原扭 减&釭展凌置,其特徵在於包含: 腔室’其覆蓋基板周圍; 排巩泵’其對上述腔室内之環境氣體進行排氣;以及 第1開閉閥,其配設於上述排氣泵與上述腔室之間; ,〆、中精由打開上述第旧閉閥使上述腔室内排氣,而對 形成於基板之主面之薄膜進行減壓乾燥,繼而關閉上述 第1開閉閥而使上述腔室停止排氣後,將情性氣體供應至 連結上述第1開閉閥與上述排氣泵之管路中。 2· 一種減壓乾縣置’其係對形成於基板主面之薄膜實施 減壓乾燥之減壓乾燥裝置,其特徵在於包含: 腔室,其覆蓋基板周圍; 排氣泵,其對上述腔室内之環境氣體進行排氣; 第1開閉閥,其配設於上述排氣泵與上述腔室之間; 第2開閉閥,其連接於連結上述第丨開閉閥與上述排氣 泵之官路上,用以將惰性氣體導入該管路中; 第3開閉閥,其用以將惰性氣體供應至上述腔室内;以及 控制機構,其藉由打開上述第丨開閉閥使上述腔室内排 氣,而對形成於基板之主面之薄膜實施減壓乾燥,繼而 關閉上述第1開閉閥而使上述腔室停止排氣後,打開上述 第2開閉閥而將惰性氣體供應至連結上述第丨開閉閥與上 述排氣栗之管路中,同時打開上述第3開閉閥而將惰性氣 I06673.doc 1272650 體供應至上述腔室内。 3·如請求項2之減壓乾燥裝置,其中上述控制部同時使上述 第2開閉閥與上述第3開閉閥打開。 4· 一種減壓乾燥裝置,其係對形成於基板主面之薄膜實施 減壓乾燥之減壓乾燥裝置,其特徵在於包含·· 腔室,其覆蓋基板周圍; 排氣泵,其對上述腔室内的環境氣體進行排氣; 第1開閉閥,其配设於上述排氣果與上述腔室之間; b性乳體供應機構,其將惰性氣體供應至上述排氣泵 中;以及 7 其藉由上述排氣泵之排氣使腔室内達到1272650 X. Patent application scope: 1. A vacuum drying device which performs decompression drying and reduction of the film formed on the main surface of the substrate, and is characterized in that it comprises: a chamber 'which covers the periphery of the substrate; a scoop pump' that exhausts the ambient gas in the chamber; and a first on-off valve that is disposed between the exhaust pump and the chamber; When the chamber is exhausted by opening the first closed valve, the film formed on the main surface of the substrate is dried under reduced pressure, and then the first opening and closing valve is closed to stop the exhaust of the chamber, and then the inert gas is removed. It is supplied to a line connecting the first opening and closing valve and the exhaust pump. 2. A vacuum drying device for decompressing and drying the film formed on the main surface of the substrate, characterized in that it comprises: a chamber covering the periphery of the substrate; an exhaust pump facing the cavity The indoor ambient gas is exhausted; the first on-off valve is disposed between the exhaust pump and the chamber; and the second on-off valve is connected to the official road connecting the third opening and closing valve and the exhaust pump For introducing an inert gas into the pipeline; a third opening and closing valve for supplying an inert gas into the chamber; and a control mechanism for exhausting the chamber by opening the first opening and closing valve The film formed on the main surface of the substrate is dried under reduced pressure, and then the first opening and closing valve is closed to stop the exhaust of the chamber, and then the second opening and closing valve is opened to supply the inert gas to the first opening and closing valve. In the above-described exhaust pump circuit, the third opening and closing valve is simultaneously opened, and the inert gas I06673.doc 1272650 is supplied into the chamber. 3. The vacuum drying apparatus according to claim 2, wherein the control unit simultaneously opens the second opening and closing valve and the third opening and closing valve. 4. A vacuum drying apparatus for vacuum drying a film formed on a main surface of a substrate, comprising: a chamber covering a periphery of the substrate; an exhaust pump facing the chamber The ambient gas in the room is exhausted; the first on-off valve is disposed between the exhaust gas and the chamber; the b-type emulsion supply mechanism supplies the inert gas to the exhaust pump; and 7 The chamber is reached by the exhaust of the above exhaust pump 如請求項1至4中任何_ 控制機構,其藉 先設定之真空度後 項之減壓乾燥裝置,For any of the control units in items 1 to 4, the vacuum drying device of the vacuum level is set. 燥裝置,其中上述薄 系樹脂之光阻Drying device, wherein the photoresist of the above thin resin is 項之減壓乾燥裝置,其中上述排 106673.docThe vacuum drying device of the item, wherein the above row 106673.doc
TW094141626A 2005-03-14 2005-11-25 Reduced-pressure dryer TWI272650B (en)

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