1271732 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種碟片原版製作方法，特別是關於一 種用以製備碟片模版之碟片原版製作方法。 【先前技術】 酼著資訊與多媒體世代的來臨，電子產品對於儲存媒 鲁體的儲存密度及容量之需求也不斷地增加。傳統的儲存媒 體，大致上可分為兩大類，分別是磁記錄媒體與光記錄媒 體。目前市場上是以光記錄媒體佔優勢，其係包含唯讀型 光碟（CD-ROM)、可寫一次型光碟（CD-R)、可重覆讀寫 型光碟（CD-RW)、唯讀型數位影音光碟（DVD-ROM)、 可寫一次型數位影音光碟（DVD-R)、可重覆讀寫式數位 影音光碟（DVD-RW，DVD+RW)、以及動態隨機記憶數位 影音光碟（DVD-RAM)等等。 φ 光記錄媒體之生產過程中’一般都是利用具有溝槽或 凹洞之碟片模版（Disc Stamper)，配合射出成形的方法， 以製成與碟片模版具有相對應圖案之基板後，再利用此具 有預溝槽的基板（Pre-grooved Substrate)來進行後續製程 以生產大量的光記錄媒體。 為了要獲得碟片模版’則需先製作一碟片原版（Disc Master) 〇 如圖1所示，習知的碟片原版製作過程係包含下列步 驟： 5 1271732 (1) 塗佈一光阻層13於基板11上：為了加強光阻層13與 基板η之結合力，可先塗佈—接著劑（Primer) 12於 基板11上再塗佈光阻層13,而接著劑12可為一界面活 ' 性劑（Surfactant)或疋一黏著促進劑（Adhesion Promoter); (2) 雷射刻版（Laser Beam Recording，LBR)光阻層 13並 進行顯影步驟：將數位資料經訊號源介面系統（MIS) 轉換成高頻訊號送至刻版機，並驅動雷射光刻版在基板 釀 11的光阻層13上。然後藉由顯影把刻版的訊號顯像出 來。 (3) 濺鍍一金屬層於光阻層：在顯影完成之光阻層13上鍍 上一層薄金屬層14，其中，濺鍍常用的材料為鎳/釩合 金。 至此，即完成碟片原版之製程。然後，即可利用上述 之金屬層Μ作為後續電鑄（Electr〇f〇rming)步驟之導電 φ層。電鑄步驟進行時，係將金屬層加厚再將金屬層與碟片 原版分離’則此金屬層即形成一父模版（FatherStamper)。 獲彳于父模版之後，只要再重覆電鑄及分離步驟，即可 狻得複數個母模版（M〇therStamper)，而每一個母模版可 繼績進行電鎢步驟，以獲得複數個子模版（s〇nStamper)。 要大1生產光記錄媒體時，可利用父模版或子模版，來射 出成形具有預溝槽之碟片基板。如此一來，便可以省去再 次進订雷射刻版、顯影、濺鍍及電鑄等碟片模版製作步 驟，故能縮短製程時間並且降低成本。 1271732 然而，習知技術的碟片原版係利用光阻層來形成溝槽 之形狀，由於結構強度不夠，因此並無法進行多次父模版 • 之電鑄分離製程。 另外，為了符合可錄式數位影音光碟（DVD-R)之規 格，以增進碟片與光碟機之相容性，碟片原版之可覆寫資 料區（Rewritable Area)及預錄資料區（Embossed Area) 之溝槽需具有不同深度，其中，預錄資料區之溝槽深度係 需大於可覆寫資料區之溝槽深度。為了於碟片原版上製作 • 出不同深度之溝槽，請參考圖2，另一習知技術係利用光 阻層13’作為遮罩層，以製作不同深度之溝槽。在經過雷 射刻版時，預錄資料區A上之光阻層係完全被蝕刻以形成 溝槽，以利後續基板11蝕刻之進行；但在另一方面，光 阻層13’溝槽深度較淺之可覆寫資料區B，由於光阻層13’ 受雷射光照射之能量擴散不易控制，故使得可覆寫資料區 B之光阻層13’溝槽形狀成為V字形，進而無法精確控制 φ 後續蝕刻製程中可覆寫資料區B之溝槽尺寸，影響產品之 良率。 有鑑於上述課題，本案發明人亟思一種可以解決碟片 原版無法重覆使用、以及可覆寫資料區之光阻層形成V字 形，而使得溝槽尺寸不易精確控制之問題的「碟片原版製 作方法」。 【發明内容】 有鑑於上述課題，本發明之目的為提供一種可以重覆 7 1271732 且能精確控㈣槽尺寸之碟片原版製 法，包述目的，依本發明之碟片原版製作方 基板：丄塗二：具有一預錄資料區及-可覆寫資料區之1271732 IX. Description of the Invention: [Technical Field] The present invention relates to a method for producing a master of a disc, and more particularly to a method for fabricating a disc for preparing a disc stencil. [Prior Art] With the advent of information and multimedia generations, the demand for storage density and capacity of storage media has continued to increase. Traditional storage media can be roughly divided into two categories, namely magnetic recording media and optical recording media. Currently, the market is dominated by optical recording media, which include CD-ROM, CD-R, CD-RW, and CD-RW. Digital audio and video disc (DVD-ROM), write-once digital audio and video disc (DVD-R), repeatable digital audio and video disc (DVD-RW, DVD+RW), and dynamic random memory digital video disc ( DVD-RAM) and so on. In the production process of φ optical recording medium, it is generally used to use a disc stamper having a groove or a recess, and a method of injection molding to form a substrate having a pattern corresponding to the disc stencil, and then This pre-grooved substrate is used for subsequent processes to produce a large number of optical recording media. In order to obtain a disc template, a disc master is required. As shown in Fig. 1, the conventional disc mastering process includes the following steps: 5 1271732 (1) Coating a photoresist layer 13 on the substrate 11: in order to strengthen the bonding force between the photoresist layer 13 and the substrate η, the photoresist layer 13 may be coated on the substrate 11 by applying a primer 12, and the adhesive 12 may be an interface. Surfactant or Adhesion Promoter; (2) Laser Beam Recording (LBR) photoresist layer 13 and development step: digital data through the signal source interface system ( The MIS) is converted into a high frequency signal and sent to the engraving machine, and the laser lithography plate is driven on the photoresist layer 13 of the substrate 11 . The signal of the stencil is then visualized by development. (3) Sputtering a metal layer on the photoresist layer: a thin metal layer 14 is plated on the developed photoresist layer 13, wherein a material commonly used for sputtering is a nickel/vanadium alloy. At this point, the process of the original disc is completed. Then, the above-mentioned metal layer 即可 can be used as the conductive φ layer of the subsequent electroforming step. When the electroforming step is carried out, the metal layer is thickened and the metal layer is separated from the original plate. Then the metal layer forms a father template (FatherStamper). After being acquired by the parent template, as long as the electroforming and separation steps are repeated, a plurality of master templates (M〇therStamper) can be obtained, and each master template can be subjected to an electro-tungsten step to obtain a plurality of sub-templates ( s〇nStamper). When a large recording medium is produced, a parent template or a sub-template can be used to project a disk substrate having a pre-groove. In this way, the disc stencil making step of laser engraving, development, sputtering and electroforming can be omitted, so that the process time can be shortened and the cost can be reduced. 1271732 However, the conventional disc of the prior art uses the photoresist layer to form the shape of the groove, and since the structural strength is insufficient, it is impossible to perform the electroforming separation process of the parent template. In addition, in order to comply with the specifications of recordable digital audio and video discs (DVD-R), to enhance the compatibility of discs and CD players, the original discable data area (Rewritable Area) and pre-recorded data area (Embossed) The trenches of Area must have different depths, wherein the depth of the trenches of the pre-recorded data area is greater than the trench depth of the overwriteable data area. In order to make trenches of different depths on the disc master, please refer to FIG. 2. Another conventional technique utilizes the photoresist layer 13' as a mask layer to make trenches of different depths. Upon laser engraving, the photoresist layer on the pre-recorded data area A is completely etched to form trenches for subsequent etching of the substrate 11; but on the other hand, the photoresist layer 13' trench depth The shallower overwriteable data area B, because the energy diffusion of the photoresist layer 13' by the laser light is difficult to control, so that the groove shape of the photoresist layer 13' which can overwrite the data area B is V-shaped, and thus cannot be accurately Control φ The groove size of the data area B can be overwritten in the subsequent etching process, which affects the yield of the product. In view of the above problems, the inventor of the present invention has a "disc original" which can solve the problem that the original disc cannot be reused, and the photoresist layer which can overwrite the data area forms a V shape, so that the groove size is not easily controlled accurately. Production Method". SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a disc mastering method capable of repeating 7 1271732 and capable of accurately controlling the size of a (four) groove, and the purpose of the invention is to prepare a substrate for a disc original according to the present invention: Tu 2: has a pre-recorded data area and - can be overwritten data area
Mm㈣—先阻層，#射刻版並顯影光阻層，第一反 應性離子㈣基板 資 w禮矛 阻展〜 / 貝第二反應性離子勉刻光 曰，弟二反應性離伟刻基板之預錄資料區及可覆寫資Mm (four) - first resistive layer, #射刻版 and developed photoresist layer, the first reactive ion (four) substrate 资 礼 spear resistance ~ / Bei second reactive ion 勉 engraved light, the second reactive etched substrate Pre-recorded data area and rewriteable capital
料區，以及移除光阻層。The material area, as well as the removal of the photoresist layer.
使用且之碟片原版 作方法。 承上所述，因依本發明之碟片原版製作方法，係具有 複數次的反應性離子_步驟。與習知技術相比，本發明 之碟片原版製作方法係直接㈣基板以形成溝槽，因此可 重覆進行電鑄製程，以生產父模板。另外，本發明之碟片 原版製作方法湘複數:欠反應性離子_並搭二不同反 應氣體，將習知技術中因為光阻層經雷射刻版後，形成V 字形溝槽造成溝槽尺寸無法精確之缺點，經過複數次反應 性離子触刻後付以改善光阻層之溝槽形狀成為u字幵/ 並能進一少精確定義碟片原版之溝槽尺寸，也確保了碟^片 原版之良率。如此一來，則可有利於後續碟片模版及光資 訊儲存媒艨之製程進行。再者，利用複數次反應性離子蝕 刻，更能使完成後之碟片原版符合DVD-R規格，也就是 預錄資料匾之溝槽深度係大於可覆寫資料區之溝槽深度。 【實施方式】 以下將參照相關圖式，說明依本發明之碟片原版製作 1271732 方法之較佳實施例。 目=圖3所示，心原版製作方法係包含下列步驟. ::有一預錄資料區及-可覆寫資料區之基板之上塗你於 ”阻層（S2G)、雷射刻版並顯影光阻層（㈣） :::子:刻基板之預錄資料區(S4〇)、第二反應性離= f阻曰（S50)、第三反應性離子姓刻基板之 區及可覆寫資料區（_)、以及移除光阻層⑽）f = ，例中’碟片原版係用於光記錄媒體之—碟片模版以 Stamper)的製作。 、明同時參照圖4及圖6,本實施例中，碟片原版製作 方^更可包3塗佈—接著劑於基板（㈣）。於步驟训中， 接著劑（Prnner) 22係被塗佈於基板21上。本實施例中， 基板21之材質係為一玻璃 '一石英、或選用一陶瓷材料。 其中，陶究材料可為一氧化物、一氮化物、或一碳化物。 另外’接著劑22可為一界面活性劑（Surfactant)或是一 Φ黏&促進劑（Adhesion Promoter )。本實施例中，係以六甲 基一矽氮境（Hexamethyldisilazane，HMDS)作為接著劑為 例’用以加強光阻層23與基板21之間的結合力。 請同時參照圖4及圖5，於步驟S20中，係塗佈一光 阻層22於一具有一預錄資料區a及一可覆寫資料區b之 基板21之上，例如可利用旋轉塗佈（Spin-Coating)之方 式，將光阻層22形成於基板21上。其中，若基板21上 已塗佈有接著劑22，則光阻層23則形成於接著劑22上。 本貫施例中，基板21與光阻層23之間，係以沒有塗佈接 1271732 著劑22為例。 基板21之預錄資料區a及可覆寫資料區b係用以形 成不同殊度之溝槽’其中，預錄資料區A之溝槽深度係大 &可覆寫*料區B之溝槽深度，以使日後形成之光記錄媒 體能符合可錄式數位影音光碟DVD-R之規格要求。通常， 預錄貝料區A中係包含功率校正區（Power Calibration ’ CA )及錄寫管理區（Rec〇仙叫Management Area， _ RMA )。其中，功率校正區係於寫入時用以校正雷射功率， 錄寫管理區則具有碟片的識別碣、序號、碟片目前狀態、 寫入方式、資料位址與結構等等資料。另外，可覆寫資料 區B則具有導入區（Lea(MnArea)、導出區 Area)、以及可記錄區等等。 於步驟S30中，係雷射刻版（LaserBeamRec〇rding， LBR)光阻層23然後進行顯影，此係將數位資料轉換成高 頻訊號送至刻版機台，並驅動雷射光刻版在光阻層23上。 •然後藉由顯影液把刻版的訊號顯像出來，利用顯像後光阻 層23產生的間隔來定義基板21之溝槽尺寸。由圖5可知， 經過雷射刻錄及顯影後，已露出基板21之預錄資料區A ; 而可覆寫資料區B上之光阻層23則呈V字形，此v字形 光阻層23係不利曰後溝槽尺寸之定義。 於步驟S40中，係進行第一反應性離子触刻（First Reactive Ion Etching，First RIE)，以蝕刻基板 21 之預錄資 料區A。本實施例中，第一反應性離子蝕刻之反應氣體係 具有一含氟氣體，例如為三氟曱烷、氟化碳、c5Fi()、c3f8、 1271732 或CZF6。另外，含氟氣體係可搭配氬氣（Ar)或氧氧（ο〕） 來作為反應氣體，明加編彳能量。彻含氟氣體來作為 第一反應性離子蝕刻之反應氣體以蝕刻基板21時，雖然 含氟氣體也對光阻層23有反應，但於製程中可控制光阻 層23被蝕刻之厚度，而只會於基板21形成溝槽。 於步驟S50中，係進行第二反應性離子蝕刻（Sec〇nd Reactive Ion Etching，Second RIE)，則虫刻光阻層 23。本 '知例中，第一反應性離子钱刻之反應氣體係一含氧氣 體’例如為氧氣、或-氧化碳。進行第二反應性離子姓刻 時1其反應氣體只對光阻層23有反應，因此，隨著光阻 層23的變薄，可覆寫資料區B上光阻層23之溝槽形狀， 可由v字形逐漸變成u字形，最後則可露出基板21之可 覆寫資料區B，而形成容易定義基板21溝槽尺寸之光阻層 23 〇 於步驟S60中，係進行第三反應性離子蝕刻（Third • Reactive Ion Etching，Thini RIE)，以蝕刻基板 21 之預錄資 料區A及可覆寫資料區b。本實施例中，第三反應性離子 姓刻之反應氣體係具有一含氟氣體，例如為三氟曱烧、氟 化石反、C5F10、C#8、或czF6。另外，含氟氣體係可搭配氬 氣（Ar )或氧氧（〇2 )來作為反應氣體，以增加触刻能量。 由於利用含氟氣體來作為第三反應性離子蝕刻之反應氣 體時，對光阻層23雖有反應但可控制殘留光阻層23之厚 度，故能以殘留的光阻層23作為遮罩而於基板21上之可 覆寫資料區B形成溝槽並同時加深預錄資料區A之溝槽。 11 1271732 如^來’預錄資· A之溝槽因經過二次飿刻，故 槽殊度會大於可覆寫資料區B之溝槽深度。 、 於步驟S70中，係移除基板2 阻 施例中，可利用-反應性離子,、f ^ H阻層2 3。本貫 來自光_或基板;濕式清洗’以清除 不、生㈣處 餘物。其+，反應性離 'Γ认、日人--广體係可為氩氣、氧氣、氮氣、氫氣、 ㈣ &乳肢例如氬氣/氧氣、氮氣/氫氣等等。而渴 式清洗之反應雜料俩、鹽酸、氨 酸、 或含羥基（_〇H)之溶液。 邊从、 綜上所述’本發明之碟片原版製作 童 ::==驟，知技術相比，= ::===:成溝槽，因此可重覆 製作方法利用複數次反應性離子輪版 體’將習知技術巾因為光阻制雷㈣版後，形成 ===精確之缺點’經過複數次反應性離 進-步精確定㈣片原版之溝槽尺寸，也確保了砰片^ 來有利於後續碟片模版及光資訊儲 存媒胆之W知。再者，彻複數纽應性離子 更能使完成後之碟片原版符bVD_R規格，也· 資料區之溝槽深度係大於可覆寫資料區之溝槽深度。… 以上所述僅為舉例性，而非為限制性者。任ς未離 本發明之精神與範-’而對其進行之等效修改或變更，均 12 1271732' 應包含於後附之申請專利範圍中。 “ 【圖式簡單說明】 ， 圖1係為習知碟片原版製作方法之一示意圖； ^ 圖2係為另一習知碟片原版製作方法之一示意圖； 圖3係為本發明之碟片原版製作方法之一流程圖； 圖4係為本發明碟片原版製作方，法之一示意圖； 圖5係為本發明之碟片原版製作方法之另一流程圖； •以及 圖6係為本發明之碟片原版製作方法中，基板與光阻 層之間係具有一接著劑之一示意圖。 元件符號說明： 11 基板 12 接著劑 φ 13 光阻層 13’ 光阻層 14 金屬層 21 基板 22 接著劑 23 光阻層 S10 塗佈一接著劑於基板 S20 於一具有一預錄資料區及一可覆寫資料區之基板之 上塗佈一光阻層 13 1271732 S30 雷射刻版並顯影光阻層 S40 第一反應性離子蝕刻基板之預錄資料區 ^ S50 第二反應性離子蝕刻光阻層 … S60 第三反應性離子蝕刻基板之預錄資料區及可覆寫資 - 料區 S70 移除光阻層 A 預錄貧料區 B 可覆寫資料區 ❿Use the original disc as the method. As described above, the disc mastering method according to the present invention has a plurality of reactive ion-steps. Compared with the prior art, the disc mastering method of the present invention directly (iv) the substrate to form a groove, so that the electroforming process can be repeated to produce a parent template. In addition, the original preparation method of the disc of the present invention has a complex number of gases: an under-reactive ion _ and two different reaction gases. In the prior art, the groove size is formed by forming a V-shaped groove after the photoresist layer is laser-engraved. Unpredictable shortcomings, after a number of reactive ion etches, the groove shape of the photoresist layer is improved to become u-shaped 并 / and the groove size of the original disc can be precisely defined, and the original disc is also ensured. Yield. In this way, it can facilitate the subsequent process of disc stencil and optical storage media. Furthermore, by using multiple reactive ion etching, the finished disc original can conform to the DVD-R specification, that is, the groove depth of the pre-recorded data is larger than the groove depth of the overwriteable data area. [Embodiment] A preferred embodiment of the method of making a disc master 1271732 according to the present invention will be described below with reference to the related drawings.目 = As shown in Figure 3, the original method of making the original method includes the following steps: :: There is a pre-recorded data area and the substrate on the overwriteable data area is coated with "S2G", laser engraved version and developed light. Resistive layer ((4)) :::子: pre-recorded data area (S4〇), second reactive ion = f resistance (S50), area of the third reactive ion substrate and rewritable data Area (_), and removing the photoresist layer (10)) f = , in which the 'disc original is used for the optical recording medium - the disc template is made of Stamper. · Ming, see also FIG. 4 and FIG. In the embodiment, the disc mastering method can further apply the coating method to the substrate ((4)). In the step training, the following agent (Prnner) 22 is applied on the substrate 21. In this embodiment, The material of the substrate 21 is a glass 'a quartz, or a ceramic material. The ceramic material may be an oxide, a nitride, or a carbide. The 'adhesive 22 may be a surfactant ( Surfactant) or a Φ-Adhesion Promoter. In this example, Hexamethyldisilaza is used. Ne, HMDS) is used as an adhesive to enhance the bonding force between the photoresist layer 23 and the substrate 21. Referring to FIG. 4 and FIG. 5 simultaneously, in step S20, a photoresist layer 22 is applied. On the substrate 21 having a pre-recorded data area a and a rewritable data area b, the photoresist layer 22 can be formed on the substrate 21 by spin-coating, for example, if the substrate 21 is coated with an adhesive 22, and the photoresist layer 23 is formed on the adhesive 22. In the present embodiment, between the substrate 21 and the photoresist layer 23, the coating 22 is not coated. The pre-recorded data area a of the substrate 21 and the rewritable data area b are used to form trenches of different degrees. Among them, the groove depth of the pre-recorded data area A is large & rewritable * material area B The depth of the groove is such that the optical recording medium formed in the future can meet the specifications of the recordable digital video disc DVD-R. Generally, the pre-recorded bedding area A contains the power calibration area (Power Calibration ' CA ) and records Write management area (Rec), Management Area, _ RMA. The power correction area is used to correct the laser work when writing. The recording management area has the identification of the disc, the serial number, the current state of the disc, the writing mode, the data address and structure, etc. In addition, the overwriteable data area B has a lead-in area (Lea (MnArea)). , the lead-out area Area, and the recordable area, etc. In step S30, the LaserBeamRec〇rding (LBR) photoresist layer 23 is then developed, which converts the digital data into a high-frequency signal to the The plate is machined and the laser lithography plate is driven on the photoresist layer 23. • The signal of the stencil is then visualized by the developer, and the groove size of the substrate 21 is defined by the interval created by the photoresist layer 23 after development. As can be seen from FIG. 5, after laser writing and development, the pre-recorded data area A of the substrate 21 is exposed; and the photoresist layer 23 on the overwriteable data area B is V-shaped, and the v-shaped photoresist layer 23 is The definition of the groove size is not favorable. In step S40, a first reactive ion etch (First Reactive Ion Etching, First RIE) is performed to etch the pre-recorded material area A of the substrate 21. In this embodiment, the first reactive ion etching reaction gas system has a fluorine-containing gas such as trifluorodecane, carbon fluoride, c5Fi(), c3f8, 1271732 or CZF6. In addition, the fluorine-containing gas system can be combined with argon (Ar) or oxygen (o) as a reaction gas to clarify the energy. When the fluorine-containing gas is used as the reactive gas for the first reactive ion etching to etch the substrate 21, although the fluorine-containing gas also reacts to the photoresist layer 23, the thickness of the photoresist layer 23 to be etched can be controlled during the process. Only grooves are formed on the substrate 21. In step S50, a second reactive ion etching (Sec〇nd Reactive Ion Etching, Second RIE) is performed to insulate the photoresist layer 23. In the 'example, the first reactive ion-etched reaction gas system-oxygen-containing body' is, for example, oxygen or carbon monoxide. When the second reactive ion is performed, the reaction gas only reacts to the photoresist layer 23, and therefore, as the photoresist layer 23 is thinned, the groove shape of the photoresist layer 23 on the data region B can be overwritten. The V-shape can be gradually changed into a U-shape, and finally, the rewritable data area B of the substrate 21 can be exposed, and the photoresist layer 23 which easily defines the groove size of the substrate 21 is formed. In step S60, the third reactive ion etching is performed. (Third • Reactive Ion Etching, Thini RIE) to etch the pre-recorded data area A of the substrate 21 and the rewritable data area b. In this embodiment, the reaction gas system of the third reactive ion name has a fluorine-containing gas such as trifluorosulfonium, fluorinated fossil, C5F10, C#8, or czF6. In addition, the fluorine-containing gas system can be combined with argon (Ar) or oxygen (〇2) as a reaction gas to increase the engraving energy. When the fluorine-containing gas is used as the reaction gas for the third reactive ion etching, the thickness of the residual photoresist layer 23 can be controlled despite the reaction of the photoresist layer 23, so that the residual photoresist layer 23 can be used as a mask. The rewritable data area B on the substrate 21 forms a trench and simultaneously deepens the trench of the pre-recorded data area A. 11 1271732 If the groove is pre-recorded, the groove of A will be larger than the groove depth of the data area B that can be overwritten due to the second engraving. In step S70, in the example of removing the substrate 2, a -reactive ion, f ^ H resist layer 23 can be utilized. The continuum comes from the light _ or the substrate; the wet cleaning is used to remove the residue from the raw (four). Its +, reactive from 'Γ 、, Japanese - wide system can be argon, oxygen, nitrogen, hydrogen, (d) & breasts such as argon / oxygen, nitrogen / hydrogen and so on. The reaction mixture of thirsty cleaning, hydrochloric acid, amino acid, or a solution containing hydroxyl (_〇H). In the above, the above-mentioned disc original production child::==, knowing the technology, =:===: into a groove, so the repeated production method utilizes a plurality of reactive ions The wheel body 'will be known as the technical towel because of the light resistance lightning (four) version, the formation of === precise shortcomings 'after a number of reactive departures - step fine to determine (four) the original groove size of the film, also ensure the bracts ^ to facilitate the subsequent disc template and optical information storage media. Furthermore, the complex complex ions can make the original disc of the finished disc bVD_R specification, and the groove depth of the data area is larger than the groove depth of the overwriteable data area. The above description is for illustrative purposes only and not as a limitation. Any changes or modifications to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram showing a method for fabricating a conventional disc original; FIG. 2 is a schematic diagram showing another conventional method for fabricating a disc; FIG. 3 is a disc of the present invention. FIG. 4 is a schematic diagram of a method for producing a master of a disc according to the present invention; FIG. 5 is another flow chart of a method for fabricating a disc original of the present invention; In the disc mastering method of the invention, a schematic diagram of a bonding agent is provided between the substrate and the photoresist layer. Component symbol description: 11 substrate 12 subsequent agent φ 13 photoresist layer 13' photoresist layer 14 metal layer 21 substrate 22 The photoresist layer S10 is coated with an adhesive on the substrate S20 to coat a photoresist layer 13 1271732 S30 on a substrate having a pre-recorded data area and a rewritable data area, and the light is developed and developed. Resistive layer S40 Pre-recorded data area of the first reactive ion-etched substrate ^ S50 Second reactive ion-etching photoresist layer... S60 Third reactive ion-etched substrate pre-recorded data area and rewritable material - material area S70 shift In addition to the photoresist layer A pre-recorded poor material B rewritable data area ❿
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