1262496 九、發明說明： 【發明所屬之技術領域】 種用 本發明係關於一種 以製備光儲存媒體 磲片模版製作方法，特別是關於— 之碟片板版製作方法。1262496 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a method for fabricating a stencil for an optical storage medium, and more particularly to a method for producing a stencil.
【先前技術】 蚁著貧讯與多媒體世代的來臨，電子產品 ^儲存密度及容量之f求也鹤地增加。傳統的= 大致上可分為兩大m，分別_錄媒體_= 目上是以光記錄雜佔優勢，錢包含 切（CD-ROM)、可寫—次型光碟（cd_r)、可 31光碟（CD-RW)、唯讀形u古％立央微, 貝寫 T巧型數位影音先碟（DVD-ROM)、 ^:次型數位影音光碟（DVD_R)、可重覆讀寫式數位 =光碟（DVD-RW，DVD+RW)、以及動態隨機記憶數位 衫曰光碟（DVD-RAM)等等。 、光記錄媒體之生產過程中，一般都是利用具有溝槽或 凹/同之碟片模版（Disc Stamper)，配合射出成形機台，來 大里生產與碟片模版具有相對應圖案之光記錄媒體基板。 如圖1所示，習知的碟片模版製作過程係包含下列步 d)濕洗一玻璃基板：通常係利用去離子水（DlWater)以 刷洗（Scrubbing)玻璃基板； (2)塗佈一光阻層於玻璃基板上：為了加強光阻層與玻璃基 板之結合力，因此可先塗佈一接著劑（primer)於玻璃 1262496 基板上再塗佈光阻層，而接著劑可為一界面活性劑 (Surfactant)或是一黏著促進劑（Adhesion Promoter ); (3) 雷射刻版（Laser Beam Recording，LBR)光阻層並進行 顯影：將數位資料經訊號源介面系統（MIS)轉換成高 頻訊號送至刻版機，並驅動雷射光刻版在玻璃基版的光 阻上。將後藉由顯影把刻版的訊號顯像出來，以形成有 訊號的凹洞（Pits); (4) 濺鍍一金屬層於光阻層，以形成一碟片原版（Disc • Master):在顯影完成之光阻層上鍍上一層薄金屬層， 其中，濺鍍常用的材料為鎳/釩合金； (5) 利用碟片原版進行電禱製程（Eiectroforining Process ): • 使得金屬層加厚，通常為鎳金屬；以及 (6) 分離碟片原版及加厚之金屬層：此加厚金屬層即為一父 模版（Father Stamper)。 獲得父模版之後，即可重覆電鑄及分離步驟，以獲得 複數個母模版（Mother Stamper)，而每一個母模版可繼續 鲁 進行電鑄步驟，以獲得複數個子模版（Son Stamper)。在 此’父模版及子模版均可稱為碟片模版。欲大量生產光記 錄媒體時，即利用碟片模版，來作為射出成形之模版，以 形成具有預溝槽之基板（Pre_gr〇〇ved Substrate) 〇如此一 來，便可以省去再次進行雷射刻版、顯影、藏鍍及電鑄等 碟片模版製作步驟，故能縮短製程時間並且降低成本。但 是，碟片模版的品質是否良好、表面是否均句無污染物 質，均是會影響光記錄媒體品質的因素。 6 1262496 然而，碟片模版於進行電鑄並 形以製造碟片基板後，表面難免會沾^ ’ f =於射出成 例如是電缚後分離所殘餘之金屬出 物質’ 八7 θ ^ ^ 町出碟片基板之殘留古 刀子之微粒。若是不設法清除這 阿 質，則曰後以碟片模版來進行射出製程，以生產光Γ己= 體之基板時’則會造成基板之表面不均句，進4:媒 錄媒體之品質。因此’如何在電鱗步驟後，去 = 表面的殘留物及微粒’-直是業界關心的問題。版 有鑑於上述課題，本案發明人亟思—種可以去 模版上的殘留物及污染微粒之「碟片模版製作方法」。/、片 【發明内容】 有鑑於上述課題，本發明之目的為提供一種去除 模版上的殘留物及污染微粒之碟片模版製作方法。” ” 緣是，為達上述目的，依本發明之碟片模版製作方 法，其係包含清洗一基板、塗佈一光阻層於基板之上、雷 射刻版並顯影光阻層、濺鍍一金屬層於基板及光阻層、^ 鑄以加厚金屬層，以形成一父模版、分離光阻層及父模 版、以及乾式清洗父模版。 承上所述，因依本發明之碟片模版製作方法，係於電 鑄分離後，對碟片模版進行乾式清洗，以去除碟片模版表 面的殘留物及微粒。與習知技術相比，利用電漿乾式清洗 碟片模版，不論是利用物理性的離子轟擊、或是利用化學 性的反應性離子蝕刻的方式來進行，均可使得原來附著在 1262496 碟片模版上之污染物被清除。 不會使得碟片模版之表面帶^外’利用㈣乾式清洗並 吸附污染物質。再者，利用^ ’故可減少碟片模版再次 洗，不需要利用大量的水資源:進仃碟片模版之乾式清 的水資源。而且經過乾（=來進行清洗，故能節省寶貴 留物及污染物，故日後進行射後=碟片模版，表面已無殘 碟片基板時，不但可提昇出製程以生產光記錄媒體之 昇光記錄媒體之品質。’、片基板表面之均勻度，更可提[Prior Art] With the advent of AIDS and the advent of multimedia generations, electronic products, storage density and capacity, have also increased. The traditional = can be roughly divided into two major m, respectively _ recording media _ = the objective is to dominate the optical recording, the money contains cut (CD-ROM), writable - sub-disc (cd_r), can be 31 disc (CD-RW), only read-reading u ancient% Liyang micro, Bei write T-type digital audio and video first disc (DVD-ROM), ^: sub-digital audio and video disc (DVD_R), repeatable read and write digits = Optical discs (DVD-RW, DVD+RW), as well as dynamic random memory digital compact discs (DVD-RAM) and more. In the production process of optical recording media, generally, a disc stamper or a concave disc stamper is used, and an injection molding machine is used to produce an optical recording medium having a corresponding pattern with a disc stencil. Substrate. As shown in FIG. 1, the conventional disc stencil making process comprises the following steps: d) wet-washing a glass substrate: usually using deionized water (DlWater) to scrub (Scrubbing) the glass substrate; (2) coating a light The resist layer is on the glass substrate: in order to strengthen the bonding force between the photoresist layer and the glass substrate, a primer may be applied on the glass 1262496 substrate and then the photoresist layer may be coated, and the adhesive may be an interface activity. Surfactant or Adhesion Promoter; (3) Laser Beam Recording (LBR) photoresist layer and development: convert digital data to high signal source interface system (MIS) The frequency signal is sent to the engraving machine and drives the laser lithography plate on the photoresist of the glass substrate. The signal of the stencil is then developed by development to form a signaled pit (Pits); (4) a metal layer is sputtered on the photoresist layer to form a disc original (Disc • Master): A thin metal layer is plated on the developed photoresist layer, wherein the commonly used material for sputtering is a nickel/vanadium alloy; (5) an Eiectroforining process is performed using a disc original: • thickening the metal layer , usually nickel metal; and (6) separate disc original and thickened metal layer: this thick metal layer is a father stamper (Father Stamper). Once the parent template is obtained, the electroforming and separation steps can be repeated to obtain a plurality of Mother Stampers, and each master can continue to perform the electroforming step to obtain a plurality of Son Stampers. Here, the parent template and the child template can be referred to as a disc template. In order to mass-produce an optical recording medium, a disc stencil is used as a template for injection molding to form a pre-grooved substrate (Pre_gr〇〇ved Substrate), so that the laser engraving can be omitted. Disc stencil making steps such as plate, development, plate plating and electroforming can shorten the process time and reduce costs. However, whether the quality of the disc template is good and whether the surface is uniform or not is a factor that affects the quality of the optical recording medium. 6 1262496 However, after the disc stencil is electroformed and shaped to make a disc substrate, the surface is inevitably smeared by the 'f = after being ejected into, for example, an electric metal to separate the residual metal material '8 7 θ ^ ^ The particles of the ancient knife remaining on the disc substrate. If you do not try to remove the quality, then use the disc template to carry out the injection process to produce the substrate of the light-emitting body, which will cause the surface of the substrate to be uneven, and enter the quality of the media. Therefore, 'how to go after the scale step, go to the surface residue and particles' is a concern of the industry. In view of the above problems, the inventor of the present invention has a "disc pattern making method" which can remove residues and contaminated particles on the stencil. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a method for producing a disc stencil for removing residue and contaminating particles on a stencil. In order to achieve the above object, a disc stencil making method according to the present invention comprises cleaning a substrate, coating a photoresist layer on the substrate, laser engraving and developing the photoresist layer, and sputtering. A metal layer is cast on the substrate and the photoresist layer to form a thick metal layer to form a parent stencil, a separate photoresist layer and a parent stencil, and a dry cleaning father stencil. As described above, according to the disc stencil making method of the present invention, after the electroforming is separated, the disc stencil is dry-cleaned to remove residues and particles on the surface of the disc stencil. Compared with conventional techniques, the use of plasma dry cleaning disc stencils, whether by physical ion bombardment or by chemical reactive ion etching, can be made to adhere to the 1262496 disc stencil. The pollutants on it are removed. It does not cause the surface of the disc stencil to be cleaned and adsorbed by the (4) dry matter. Furthermore, the use of ^' can reduce the disc stencil to be washed again, without the need to use a large amount of water: the dry water of the disc template. Moreover, after drying (= to clean, it can save precious materials and pollutants, so after the shooting = disc template, the surface has no residual disc substrate, not only can the process be upgraded to produce optical recording media The quality of the optical recording medium. ', the uniformity of the surface of the substrate, can be mentioned
【實施方式】 忒明依本發明之碟片模版製作 以下將參照相關圖式 方法之較佳實施例。 如圖2所示’碟片模 洗-基板(請)、塗佈—光;= 糸包含下列步驟:清 ? 元阻層於基板之上（S30)、雷射 L : (S50)、濺鍍一金屬層於基板及光阻層[Embodiment] Manufacture of a disc stencil according to the present invention will be described below with reference to a preferred embodiment of the related drawings. As shown in Figure 2, 'disc-washing-substrate (please), coating-light; = 糸 includes the following steps: clearing the elemental layer on the substrate (S30), laser L: (S50), sputtering a metal layer on the substrate and the photoresist layer
(S60)、輯以加厚金屬層，以形成—父模版⑽〉、分 離光阻層及賴版（)、錢乾式清洗父模版（s9〇)。 本實施例中，碟片模版主要係用以製作光記錄媒體之基 板，碟片模版主要係包含父模版（FatherStamper)及子模 版（Son Stamper)。當然，產自父模版F，且可用以電鑄 生產子模版S之母模版（Mother Stamper)也為一種碟片 模版，但通常母模版Μ並不直接用以製作光記錄媒體之基 板0 請參照圖2及圖3,於步驟sl〇令，係清洗一基板21。 1262496 本實施例中，基板21之材質係為一玻璃、一 J yb央、或選 用一陶瓷材料，其中陶瓷材料可為一氧化物、—氮化物' 或一碳化物。通常，清洗基板21的方式係利用去離子水 (Deion Water )進行刷洗。 7 如圖3及圖4所示，本實施例中，碟片模版製 更包含：塗佈一接著劑於基板上（S2〇)。於步驟$加中' 接著劑（Primer) 22係被塗佈於基板21上。其中，’(S60), a thick metal layer is added to form a parent template (10), a separate photoresist layer and a stencil (), and a dry cleaning master template (s9 〇). In this embodiment, the disc stencil is mainly used to make a substrate for an optical recording medium, and the disc stencil mainly includes a father stencil (FatherStamper) and a sub stencil (Son Stamper). Of course, the mother stamper which is produced from the parent template F and can be used to electroform the sub-plate S is also a disc template, but usually the mother mold plate is not directly used for the substrate of the optical recording medium. 2 and 3, a substrate 21 is cleaned in step s1. 1262496 In this embodiment, the material of the substrate 21 is a glass, a Jyb, or a ceramic material, wherein the ceramic material may be an oxide, a nitride, or a carbide. Usually, the method of cleaning the substrate 21 is performed by deionized water (Deion Water). As shown in FIG. 3 and FIG. 4, in the embodiment, the disc stenciling process further comprises: coating an adhesive on the substrate (S2〇). In the step $plus, the 'Primer' 22 is applied to the substrate 21. among them,'
劑22可為一界面活性劑（Surfactan〇或是—黏合促進: (Adhesion Promoter)。以六曱基二石夕氮燒 片1 (HexamethyldiSilazane，HMDS)作為接著劑 22 為例，由 於接著劑22之一端係具有親水基可和基板21相接，而另 一端係具有疏水基可和光阻層23相接，因此可加強光阻 層23與基板21之間的結合力。 再請參照圖2及圖3，於步驟S30中，係塗佈一光阻 層23於基板21之上，例如可利用旋轉塗佈（Spin_c〇ating) 之方式，將光阻層23形成於基板21之上。本實施例中， 基板21上係已塗佈有接著劑22，故光阻層23係形成於接 著劑21上。 如圖3及圖4所示，本實施例中，碟片模版製作方法 更包含·烘烤光阻層（S4〇)。於步驟S4〇中，係將光阻層 23進行烘烤，使得光阻層23硬化以進行後續步驟。 再請茶照圖2及圖3，於步驟S50中，進行光阻層23 之雷射刻版（Laser Beam Recording，LBR)並對光阻層23 進行顯影。將數位資料轉換成高頻訊號送至刻版機台，並 1262496 驅動雷射光刻版在光阻層23上。然後藉由顯影把刻版的 訊號顯像出來，以形成有訊號的凹洞（Pits ) 231。 於步驟S60中，係藏鑛一金屬層24於光阻層23及基 板21。其中，濺鑛常用的材料為鎳/鈒合金（Ni/V &11叮）。 如此一來，即完成一碟片原版（Disk Master )之製程，而 其表面之金屬層24則可作為日後利用電鑄製程來製備碟 片模版時之導電層。 於步驟S70中，係利用碟片原版來進行電鑄製程以加 厚金屬層24，以形成一父模版F。 於步驟S80中，係分離光阻層23及父模版F，以得到 父模版F進行後續製程。 於步驟S90中，係對於父模版F之表面，也就是對於 碟片模版之金屬表面，進行乾式清洗。 本實施例中，乾式清洗係可為一電漿乾式清洗（Plasma Dry Cleaning )，例如是利用物理性的離子轟擊（Physical Ion Bombardment )、或是利用化學性的反應性離子蝕刻 (Reactive Ion Etching，RIE)的方式來進行。其中，離子 轟擊之餘刻反應氣體係可為氬（Ar)、氮氣（N2)或氦（He); 而反應性離子蝕刻之蝕刻反應氣體係可為氧氣（〇2)、臭 氧（〇3)、一氧化二氮（N20)、氧化氮(NO)、一氧化碳、 或二氧化碳氣體等等。 本實施例中，電漿乾式清洗可在任何種類的電漿反應 器（Plasma Reactor)中進行，例如在反應性離子反應器、 灰化器（Asher)、電漿增強化學氣相沈積反應器 1262496 (Plasma-Enhanced CVD Reactor)、高密度電漿化學氣相沈The agent 22 may be a surfactant (Surfactan® or Adhesion Promoter). The HexamethyldiSilazane (HMDS) is used as the adhesive 22 as an example, due to the adhesive 22 One end has a hydrophilic group to be in contact with the substrate 21, and the other end has a hydrophobic group to be in contact with the photoresist layer 23, thereby enhancing the bonding force between the photoresist layer 23 and the substrate 21. Referring again to FIG. 2 and 3. In step S30, a photoresist layer 23 is coated on the substrate 21, and the photoresist layer 23 is formed on the substrate 21 by spin coating, for example. The substrate 21 is coated with the adhesive 22, so that the photoresist layer 23 is formed on the adhesive 21. As shown in FIG. 3 and FIG. 4, in the embodiment, the method for fabricating the stencil further includes baking. Baking the photoresist layer (S4〇). In step S4, the photoresist layer 23 is baked, so that the photoresist layer 23 is hardened to perform the subsequent steps. Then, please refer to FIG. 2 and FIG. 3 in step S50. The laser beam recording (Laser Beam Recording, LBR) of the photoresist layer 23 is performed and the photoresist layer 23 is developed. The digital data is converted into a high frequency signal and sent to the engraving machine, and the 1262496 drives the laser lithography plate on the photoresist layer 23. Then, the signal of the stencil is developed by development to form a pit with a signal (Pits 231. In step S60, a metal layer 24 is deposited on the photoresist layer 23 and the substrate 21. The material commonly used for sputtering is nickel/rhenium alloy (Ni/V & 11 叮). That is, the process of a disk master is completed, and the metal layer 24 on the surface can be used as a conductive layer in the future to prepare a disk template by using an electroforming process. In step S70, the original plate is used. The electroforming process is to thicken the metal layer 24 to form a parent template F. In step S80, the photoresist layer 23 and the parent template F are separated to obtain a parent template F for subsequent processing. In step S90, the system is for the parent. The surface of the stencil F, that is, the metal surface of the disc stencil, is dry cleaned. In this embodiment, the dry cleaning system may be a plasma dry cleaning, for example, using physical ion bombardment (Physical). Ion Bombardment ), It is carried out by means of chemical reactive ion etching (RIE), wherein the reaction gas system of the ion bombardment may be argon (Ar), nitrogen (N2) or helium (He); The etching reaction gas system of the ion etching may be oxygen (〇2), ozone (〇3), nitrous oxide (N20), nitrogen oxide (NO), carbon monoxide, or carbon dioxide gas. In this embodiment, the plasma dry cleaning can be carried out in any kind of plasma reactor, such as in a reactive ion reactor, an asher, a plasma enhanced chemical vapor deposition reactor 1262496. (Plasma-Enhanced CVD Reactor), high density plasma chemical vapor deposition
積反應器（High-Density Plasma CVD Reactor )、以及 RF/DC 濺鍍反應器（RF/DC Sputter Reactor)等等。 舉例來說，電漿乾式清洗係於JVC製造之反應性離子 反應器中進行，於氬氣之流量介於10〜1000 seem，氣壓介 於2〜20 pa，射率功率（RF Power )介於10〜1000W之條 件下，處理時間為5〜300秒。本實施例中，乾式清洗主要 是利用電漿產生帶電離子或自由基(Free Radical)來與污染 • 物反應，再以氣流將反應生成物帶出反應器。如此一來， 即清除了父模版F表面上之殘留物及污染微粒，故以父模 版F日後進行光記錄媒體之基板的製造時，基板之表面均 勻度得以提昇，並獲到高良率的基板。 如圖4及圖5所示，本實施例中，碟片模版製作方法， 更包含對於父模版進行電鑄並分離，以獲得一母模版 (S100)。於步驟Sl〇〇中，係利用父模版F為導電體，再 次進行電鑄，分離後即可獲得一母模版M (MQther • StamPer)。當然，也可以重覆進行步驟Sl〇〇，以獲得複數 母模版M。 本實施例中，碟片模版製作方法更包含電漿乾式清洗 母模版（S110)。於步驟S110中，係對母模版M進行二漿 乾式清洗。其中，電漿乾式清洗之條件，係與步驟S90中水 對父模版F進行電漿乾式清洗之限制條件相同，於此 贅述。 ：冉 本實施财，碟片模版製作方法更包含對於母模版進 11 1262496 係利鑄並刀離，以獲得一子模版（S120)°於步驟S120中， 得—子，拉版M為導電體，再次進行電鑄，分離後即可獲 和盔之拉版S。當然’也可以重覆進行步驟S120，以獲得 〜數子模版s。 子模^知例中’碟片模版製作方法更包含電聚乾式清洗 乾式、、主、（S13〇)。於步驟S130中，係對子模版s進行電漿 對父、中，電漿乾式清洗之條件，係與步驟S90中， 贅述魏F進订電裝乾式清洗之限制條件相同，於此不再 電鑄製浐：t ’對於父模版F及子模板5而言，無論是 的高分子，於之金屬顆粒、或是射出碟片基板時沾附 質，使η可在㈣乾式清洗後’去除表面之污染物 程，以及子模板8均可直接進行射出成形製 生產先冗錄媒體之碟片基板。 離接、T、上所述’本發明之碟片模版製作方法，係於電鎮八 離後，對碟片模版進行乾式清洗，以去除碟片 殘留物及微粒。與習知技術相比，利用電裝 模版，不論是利用物理性的離子秦擊、 ^碟片 反應性離子㈣的方式來進行，均可使得原來 模版上之污染物被清除。另外，利用電装乾式清洗並= 使得碟片模版之表面帶電荷’故可減少碟片模版再:欠：： 污染物質。再者，利用電漿進行磲片模版之式生夂及附 需要利用大量的水資源來進行清洗，故能節二=二 源。而且經過乾式清洗後的碟片模版，f &貝 污染物，故日後進行射出製程以生產光^ 已無殘留物及 。、彔媒體之碟片基 12 1262496 板時，不但可提昇碟片基板表面之均勻度，更可提昇光記 錄媒體之品質。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡早說明】 圖1係為習知碟片模版製作過程之一流程圖； 圖2係為本發明碟片模版製作方法之一流程圖； 圖3係本發明之碟片模版製作方法之一示意圖； 圖4係為本發明碟片模版製作方法之另一流程圖；以 及 圖5係本發明碟片模版製作方法中之另一示意圖。 元件符號說明： 21 基板 22 接著劑 23 光阻層 231 凹洞 24 金屬層 F 父模版 Μ 母模版 S 子模版 S10 清洗一基板 13 1262496 S20 塗佈一接著劑於基板上 S30 塗佈一光阻層於基板之上 S40 烘烤光阻層 S50 雷射刻版並顯影光阻層 S60 滅鍛一金屬層於基板及光阻層 S70 電禱以加厚金屬層，以形成一父模版 S80 分離光阻層及父模版 S90 乾式清洗父板版 ^ S100 對於父模版進行電鑄並分離，以獲得一母模版 S110電漿乾式清洗母模版 S120對於該母模版進行電鑄並分離，以獲得一子模版 S130電漿乾式清洗子模版High-Density Plasma CVD Reactor, RF/DC Sputter Reactor, etc. For example, the plasma dry cleaning is carried out in a reactive ion reactor manufactured by JVC. The flow rate of argon gas is between 10 and 1000 seem, the gas pressure is between 2 and 20 pa, and the radio frequency power (RF Power) is between Under the condition of 10~1000W, the processing time is 5~300 seconds. In this embodiment, the dry cleaning mainly uses a plasma to generate charged ions or radicals (Free Radical) to react with the pollutants, and then the reaction product is taken out of the reactor by a gas stream. In this way, the residue and the contaminated particles on the surface of the parent stencil F are removed, so that the surface uniformity of the substrate is improved and the substrate of the high yield is obtained when the substrate of the optical recording medium is manufactured by the parent stencil F in the future. . As shown in FIG. 4 and FIG. 5, in the embodiment, the disc stencil making method further comprises electroforming and separating the parent stencil to obtain a master stencil (S100). In the step S1, the parent template F is used as the electrical conductor, and electroforming is performed again, and a master template M (MQther • StamPer) is obtained after separation. Of course, step S1〇〇 can also be repeated to obtain a plurality of master templates M. In this embodiment, the disc stencil making method further comprises a plasma dry cleaning master stencil (S110). In step S110, the mother stencil M is subjected to two-stage dry cleaning. The conditions for the dry cleaning of the plasma are the same as those for the dry cleaning of the parent template F by the water in the step S90, and are described herein. : 冉本implementation, the disc stencil making method further includes inserting and cutting away the female die plate 11 1262496 to obtain a sub-template (S120). In step S120, the image is obtained as a conductor. , electroforming again, after separation, you can get the helmet version S. Of course, step S120 can also be repeated to obtain a sub-template s. In the sub-mode, the disc stencil making method further includes electro-dry cleaning, dry type, main, (S13 〇). In step S130, the condition of the plasma to the parent, the middle, and the plasma dry cleaning is performed on the sub-template s, which is the same as the restriction condition in the step S90, and the Wei F binding electrical dry cleaning is the same. Casting crucible: t 'For the parent template F and the sub-template 5, whether it is a polymer, the metal particles, or the substrate when the disc substrate is ejected, so that η can be removed after the (four) dry cleaning The contaminant process and the sub-template 8 can be directly subjected to injection molding to produce a disc substrate having a redundant medium. The method for fabricating the disc stencil of the present invention is the dry rinsing of the disc stencil to remove disc residue and particles. Compared with the prior art, the use of an electrical stencil, whether by physical ion bombardment or disc reactive ion (4), can cause the contaminants on the original stencil to be removed. In addition, the use of electric dry cleaning and = making the surface of the disc stencil charged 'thus can reduce the disc stencil: owe:: pollutants. In addition, the use of plasma for the stencil stencil and the use of a large amount of water for cleaning, so can be two = two sources. Moreover, after the dry cleaning of the disc stencil, f & shell contaminants, the injection process is carried out in the future to produce light ^ no residue and . When the media disc base 12 1262496 is used, it not only improves the uniformity of the surface of the disc substrate, but also improves the quality of the optical recording medium. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart of a conventional disc stencil making process; FIG. 2 is a flow chart of a disc stencil making method of the present invention; FIG. 3 is a disc stencil making method of the present invention. FIG. 4 is another flow chart of the method for fabricating the disc stencil of the present invention; and FIG. 5 is another schematic diagram of the disc stencil making method of the present invention. Description of the components: 21 Substrate 22 Subsequent agent 23 Photoresist layer 231 Cavity 24 Metal layer F Parent template 母 Master stencil S stencil S10 Clean a substrate 13 1262496 S20 Apply an adhesive on the substrate S30 Apply a photoresist layer On the substrate S40, the photoresist layer S50 is baked and the photoresist layer S60 is developed. The metal layer is printed on the substrate and the photoresist layer S70 to thicken the metal layer to form a parent template S80. Layer and parent template S90 dry cleaning parent board version ^ S100 For the parent template is electroformed and separated to obtain a master model S110 plasma dry cleaning master model S120 for the master template is electroformed and separated to obtain a sub-template S130 Plasma dry cleaning sub-model