1259462 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種碟片原版製作方法，特別是關於一 種用以製備碟片模版之碟片原版製作方法。 【先前技術】 ^隨著貧訊與多媒體世代的來臨，電子產品對於儲存媒 =的儲存密度及容量之需求也不斷地增加。傳統的儲存媒 體，大致上可分為兩大類，分別是磁記錄媒體與光記錄媒 體。目前市場上是以光記錄媒體佔優勢，其係包含唯讀型 光碟（CD-ROM)、可寫一次型光碟（CD_R)、可重覆讀寫 型光碟（CD-RW)、唯讀型數位影音光碟（dvd_r〇m/、 可寫一次型數位影音光碟（DVD_R)、可重覆讀寫式數位 影音光碟（DVD-RW，DVD+RW)、以及動態隨機記憶數位 影音光碟（DVD-RAM)等等。 光記錄媒體之生產過程中，一般都是利用具有溝槽或 凹洞之碟片模版（DiscStamper)，配合射出成形的方法， 以製成與碟片模版具有相對應圖案之基板後，再進行後續 製程以生產大量的光記錄媒體。 為了要獲得碟片模版，則需先製成一碟片原版（Disc Master)。 如圖1所不，習知的碟片原版製作過程係包含下列步 驟： (1)濕洗一玻璃基板：通常係利用去離子水（DI Water)以 1259462 刷洗（Scrubbing)玻璃基板； (2) 塗佈一光阻層於玻璃基板上：為了加強光阻層與玻璃基 板之結合力’因此可先塗佈一接著劑（Primer)於玻璃 基板上再塗佈光阻層，而接著劑可為一界面活性劑 (Surfactant )或是一黏著促進劑（Adhesion Promoter ); (3) 雷射刻版（Laser Beam Recording，LBR)光阻層並進行 顯影步驟：將數位資料經訊號源介面系統（MIS)轉換 成高頻訊號送至刻版機，並驅動雷射光刻版在玻璃基版 的光阻上。然後藉由顯影把刻版的訊號顯像出來，以形 成有訊號的凹洞（Pits)。 (4) 濺鍍一金屬層於光阻層··在顯影完成之光阻層上鍍上一 層薄金屬層，其中，濺鍍常用的材料為鎳/釩合金。 至此，即完成碟片原版（Disc Master)之製程。然後， 即可利用碟片原版進行電鑄（Electroforming )步驟，將金 屬層加厚後，再將金屬層與碟片原版分離，則此金屬層即 為一父模版（Father Stamper)。 獲得父模版之後，即可重覆電鑄及分離步驟，以獲得 複數個母模版（Mother Stamper)，而每一個母模版可繼續 進步驟’以獲得複數個子模版（S〇n Stamper)。要 大1生產光記錄媒體時，即利用父模版或子模版，來射出 成形具有預溝槽之基板（Pre-gr〇〇ved Substrate)。如此一 來，便可以省去再次進行雷射刻版、顯影、濺鍍及電鑄等 碟片模版製作步驟，故能縮短製程時間並且降低成本。 然而’在碟片原版的製程中，若只用去離子水刷洗玻 1259462 璃基板’則無法去除例如油脂、有機物質以及研磨漿 (Slurry)之殘餘物等物質。通常具有此污染物之區域， 其基板可能較呈疏水性表面，也不利於光阻層與基板之結 合。另外，用去離子水刷洗後，會使得玻璃基板之表面帶 有負電荷’再加上凡得瓦爾力等物理吸附（Physical Sorption)作用、以及其他化學吸附（chemical Sorption) 的作用，故當玻璃基板暴露於空氣中時，則會再次吸附空 氣中的微粒（Particles)，造成二次的污染。玻璃基板被污 染後’則會影響接著劑之附著，進而降低玻璃基板與光阻 之間的結合力，並造成碟片原版製程的良率的下降。因 此，如何在光阻塗佈前，去除玻璃基板上的殘留物及微 粒，並使玻璃基板不再被微粒污染，一直是業界關心的問 題。 有鑑於上述課題，本案發明人亟思一種可以去除玻璃 基板上的殘留物及微粒，並使玻璃基板不再被污染之「碟 片原版製作方法」。 【發明内容】 有鑑於上述課題，本發明之目的為提供一種在光阻塗 佈前，進行乾式清洗基板之碟片原版製作方法。 緣是，料上述目的，依本發明之碟片原版製作方 法’其係包含於-基板上進行乾式清洗、塗佈—光阻層於 基板之上、雷射刻版並顯影光阻層、以及形成—金屬層於 光阻層。 1259462 承上所述，因依本發明之碟片原版製作方法，係於光 阻塗佈刖進彳T乾式清洗基板。與習知技術相比，利用電聚 進行基板之乾式清洗，不需要利用大量的水資源來進行清 洗，即可使得原來附著在基板上之污染物被清除，以利光 阻層之塗佈，故能節省寶貴的水資源。而且，利用乾式清 洗並不會使得基板之表面帶電荷，故可減少基板再次吸附 污染物質。除了污染物質被去除可提昇基板與光阻層之間 的接合能力之外，利用電漿乾式清洗也可使基板的表面稍 微變得粗糙，故也能提昇基板與光阻層之間的接著 (adhesion)能力。 【實施方式】 以下將芩照相關圖式，說明依本發明之碟片原版製作 方法之較佳實施例。 如圖2所示，碟片原版製作方法係包含下列步驟：於 一基板上進行乾式清洗（S10)、塗佈一光阻層於基板之上 (S30)、雷射刻版並顯影光阻層（S5〇)、以及形成一金屬 層於光阻層（S70)。本實施例中，碟片原版係用於光記錄 媒體之一碟片模版（Disc Stamper )的製作。 請參照圖2及圖3，於步驟S10中，係將一基板21進 行乾式清洗。本實施例中，基板21之材質係為一玻璃、 一石英、或選用一陶瓷材料，其中陶瓷材料可為一氧化 物、一氮化物、或一碳化物。而乾式清洗可為一電漿乾式 蝕刻（：Plasma Dry Etching )，例如是利用物理性的離子轟 1259462 擊（Physical Ion Bombardment)、或是利用化學性的活性 離子姓刻（Reactive Ion Etching，RIE)的方式來進行。其 中，離子轟擊之蝕刻反應氣體係可為氬（Ar)、氮氣（N2) 或氦（He);而活性離子蝕刻之蝕刻反應氣體係可為氧氣 (〇2)、臭氧（〇3)、一氧化二氮（N20)、氧化氮(NO)、一 氧化碳（CO)、或二氧化碳（C02)氣體等等。 本實施例中，電漿乾式蝕刻可在任何種類的電漿反應 器（Plasma Reactor)中進行，例如在活性離子反應器、灰 化器（Asher)、電漿增強化學氣相沈積反應器 (plasma-enhanced CVD Reactor )、高密度電漿化學氣相沈 積反應器（High-Density Plasma CVD Reactor )、以及 RF/DC 濺鍍反應器（RF/DC Sputter Reactor)等等。本實施例中， 電漿乾式蝕刻係於JVC製造之活性離子反應器中進行，於 氬氣之流量介於10〜500 seem，氣壓介於2〜20 pa，射率功 率（RF Power)介於10-1000W之條件下，處理時間為2〜120 秒。 本貫施例中，乾式清洗主要是利用電漿產生帶電離子 或自由基(Free Radical)來與污染物反應，再以氣流將反應 生成物帶出反應器。而去除污染物後之基板，其表面則形 成親水性的經基(Hydroxyl Group)，有利於後續接著劑22 或光阻層23之附著。 通常具有污染物之區域，基板21表面係較呈疏水性， 故不利於光阻層23與基板21之結合。利用電漿乾式清洗 基板21，不論是利用物理性的離子轟擊、或是利用化學性 1259462 的活性離子蝕刻的方式來進行，均可使得原來附著在基板 21上之污染物被清除。再者，利用電漿乾式清洗並不會使 得基板21之表面帶電荷，故可減少基板21再次吸附污染 物質。除了污染物質被去除可提昇基板21與光阻層23之 間的接合能力之外，利用電漿乾式清洗也可使基板21的 表面稍微變得粗链（Rough )，故也能提昇基板21與光阻 層23之間的接合能力。 請參照圖3及圖4，本實施例中，碟片原版製作方法 更可包含：塗佈一接著劑於基板上（S20)。於步驟S20中， 接著劑（Primer) 22係被塗佈於基板21上。其中，接著 劑22可為一界面活性劑（Surfactant)或是一黏合促進劑 (Adhesion Promoter)。如圖5所示，以六甲基二石夕氮烧 (Hexamethyldisilazane’HMDS)作為接著劑 22 為例，由 於接著劑22之一端係具有親水基221可和清洗後的基板 21相接，而另一端係具有疏水基222可和光阻層23相接， 因此可加強光阻層23與基板21之間的結合力。 再請參照圖2及圖3 ’於步驟S30中，係塗佈一光阻 層23於基板21之上，例如可利用旋轉塗佈（Spin_c〇ating) 之方式，將光阻層23形成於基板21之上。若基板21上 已塗佈有接著劑22 ’則光阻層23係形成於接^劑22上。 如圖3及圖4所示’本實施例中，碟片原版製作方法 更包含：烘烤光阻層（S40)。於步驟S4〇中，係將光阻層 23進行烘烤，使得光阻層23硬化以進行後續步驟。 再請參照圖2及圖3 ’於步驟S50中，進行光阻層23 1259462 之雷射刻版（Laser Beam Recording，LBR)然後顯$。_ . 將 數位資料轉換成高頻訊號送至刻版機台，並驅動雷射 版在光阻層23上。然後藉由顯影把刻版的訊號顯像出來 以形成有訊號的凹洞（Pits) 231。 於步驟S70中，係形成一金屬層24於光阻層23 〇 本實施例中，金屬層24可利用濺鍍或蒸鍍的方式來形成 其中，濺鍍常用的材料為鎳/釩合金（Ni/V alloy)，而^ 帛用的材料為銀。如此一來，即完成碟片原版之製程， 表面之金屬層24則可作為日後利用電鑄製程來製備模 時之導電層。 、版 綜上所述，本發明之碟片原版製作方法，係於光阻、、 佈鈾進行乾式清洗基板。與習知技術相比，利用電漿進^ 基板之乾式清洗，不需要利用大量的水資源來進行清仃 即可使得原來附著在基板上之污染物被清除，以利光 之塗佈，故能節省寶貴的水資源。而且，利用乾式層 不會使得基板之表面帶電荷，故可減少基板再次吸^^ 物質°除了污染物質被去除可提昇基板與光阻層之間^ I此力之外，則電漿乾式清洗也可使基板的表面稍微f 件粗糙’故也能提昇基板與光阻層之間的接著能力。Λ文 以上所述僅為舉例性，而非為限制性者。任 本發明之精神與輯，而對其進行之等效修改或，2 應包含於後附之申請專利範圍中。 ，句 【圖式簡單說明】 11 1259462 圖1係為習知碟片原版製作過程之一流程圖； 圖2係為本發明碟片原版製作方法之一流程圖； 圖3係本發明之碟片原版製作方法之一示意圖； 圖4係為本發明碟片原版製作方法之另一流程圖；以 及 圖5係本發明碟片原版製作方法中接著劑係介於基板 與光阻層之間之一示意圖。 元件符號說明： 21 基板 22 接著劑 23 光阻層 231 凹洞 24 金屬層 S10 於一基板上進行乾式清洗 S20 塗佈一接著劑於基板上 S30 塗佈一光阻層於基板之上 S40 烘烤光阻層 S50 雷射刻版並顯影光阻層 S70 形成一金屬層於光阻層 121259462 IX. Description of the Invention: [Technical Field] The present invention relates to a method for producing a master of a disc, and more particularly to a method for fabricating a disc for preparing a disc stencil. [Prior Art] With the advent of poor news and multimedia generations, the demand for storage density and capacity of electronic products is increasing. Traditional storage media can be roughly divided into two categories, namely magnetic recording media and optical recording media. Currently, the market is dominated by optical recording media, which include CD-ROM, CD-R, CD-RW, and read-only digital. Audio and video discs (dvd_r〇m/, write-once digital audio and video discs (DVD_R), repeatable digital audio and video discs (DVD-RW, DVD+RW), and dynamic random memory digital audio and video discs (DVD-RAM) Etc. In the production process of optical recording media, generally, a disc stencil having a groove or a recess is used, and a method of injection molding is used to form a substrate having a pattern corresponding to the disc stencil. Then, a subsequent process is performed to produce a large number of optical recording media. In order to obtain a disc stencil, a disc master is first prepared. As shown in Fig. 1, the conventional disc mastering process includes the following Steps: (1) Wet-washing a glass substrate: usually by using DI Water to scrub the glass substrate with 12,294,462; (2) coating a photoresist layer on the glass substrate: in order to strengthen the photoresist layer and The bonding force of the glass substrate is therefore First, a photoresist (Primer) is applied to the glass substrate to coat the photoresist layer, and the adhesive agent may be a surfactant (Surfactant) or an adhesion promoter (Adhesion Promoter); (3) Laser engraving (Laser Beam Recording, LBR) photoresist layer and development step: convert digital data into signal source system (MIS) into high frequency signal and send it to engraving machine, and drive laser lithography plate in glass substrate Then, the signal of the stencil is developed by development to form a signaled pit. (4) Sputtering a metal layer on the photoresist layer and plating on the developed photoresist layer. A thin metal layer, in which the material commonly used for sputtering is nickel/vanadium alloy. At this point, the process of disc master is completed. Then, the electroforming step can be performed by using the disc original. After the layer is thickened, the metal layer is separated from the original plate, and the metal layer is a father stamper. After obtaining the parent template, the electroforming and separation steps can be repeated to obtain a plurality of master templates. (Mother Stamper), and each one The stencil can continue to step 'to obtain a plurality of sub-templates (S〇n Stamper). When the optical recording medium is produced, the parent stencil or the sub-template is used to project the substrate with the pre-groove (Pre-gr〇〇) Ved Substrate). This eliminates the need to perform laser stenciling, development, sputtering, electroforming, and other disc stencil making steps, thereby reducing process time and cost. However, in the process of the original disc, if the glass 1259462 glass substrate is only scrubbed with deionized water, substances such as grease, organic matter, and slurries cannot be removed. In areas where this contaminant is usually present, the substrate may be more hydrophobic and unfavorable for bonding the photoresist layer to the substrate. In addition, brushing with deionized water will cause the surface of the glass substrate to have a negative charge' plus the physical Sorption effect such as van der Waals force and other chemical sorption effects, so when the glass When the substrate is exposed to the air, particles in the air are again adsorbed, causing secondary pollution. When the glass substrate is contaminated, it affects the adhesion of the adhesive, which in turn reduces the bonding force between the glass substrate and the photoresist, and causes a decrease in the yield of the original plate process. Therefore, how to remove residues and fine particles on the glass substrate before the photoresist coating and to prevent the glass substrate from being contaminated by particles has been a concern of the industry. In view of the above problems, the inventors of the present invention have a "disc original method for producing a disc original" which can remove residues and fine particles on a glass substrate and prevent the glass substrate from being contaminated. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a method for producing a master of a disk which is subjected to dry cleaning of a substrate before photoresist coating. The purpose of the present invention is to provide a method for fabricating a master according to the present invention, which comprises performing a dry cleaning on a substrate, coating a photoresist layer on the substrate, laser etching and developing the photoresist layer, and Forming a metal layer on the photoresist layer. 1259462 According to the above description, the disc mastering method according to the present invention is applied to a photoresist coating T dry cleaning substrate. Compared with the prior art, the dry cleaning of the substrate by electropolymerization does not require the use of a large amount of water for cleaning, so that the contaminants originally attached to the substrate are removed to facilitate the coating of the photoresist layer. Can save valuable water resources. Moreover, the use of dry cleaning does not cause the surface of the substrate to be charged, so that the substrate can be reduced to adsorb contaminants again. In addition to the removal of contaminants to enhance the bonding ability between the substrate and the photoresist layer, the dry cleaning of the plasma can also make the surface of the substrate slightly rough, so that the adhesion between the substrate and the photoresist layer can be improved ( Adhesion) ability. [Embodiment] Hereinafter, a preferred embodiment of a method for producing a master according to the present invention will be described with reference to the related drawings. As shown in FIG. 2, the disc mastering method comprises the following steps: performing dry cleaning on a substrate (S10), coating a photoresist layer on the substrate (S30), laser engraving and developing the photoresist layer. (S5〇), and forming a metal layer on the photoresist layer (S70). In the present embodiment, the disc original is used for the production of a disc stamper of an optical recording medium. Referring to Fig. 2 and Fig. 3, in step S10, a substrate 21 is subjected to dry cleaning. In this embodiment, the material of the substrate 21 is a glass, a quartz, or a ceramic material, wherein the ceramic material may be an oxide, a nitride, or a carbide. The dry cleaning can be a plasma dry etching (Plasma Dry Etching), for example, using physical Ion bombardment or using reactive Ion Etching (RIE). The way to proceed. Wherein, the ion bombardment etching reaction gas system may be argon (Ar), nitrogen (N2) or helium (He); and the reactive ion etching etching reaction gas system may be oxygen (〇2), ozone (〇3), one Nitrous oxide (N20), nitrogen oxide (NO), carbon monoxide (CO), or carbon dioxide (C02) gas, and the like. In this embodiment, the plasma dry etching can be carried out in any kind of plasma reactor, such as a reactive ion reactor, an asher, a plasma enhanced chemical vapor deposition reactor (plasma). -enhanced CVD Reactor), High-Density Plasma CVD Reactor, RF/DC Sputter Reactor, etc. In this embodiment, the plasma dry etching is performed in an active ion reactor manufactured by JVC. The flow rate of argon gas is between 10 and 500 seem, the gas pressure is between 2 and 20 pa, and the power of RF power is between Under the condition of 10-1000W, the processing time is 2~120 seconds. In the present embodiment, the dry cleaning mainly uses a plasma to generate charged ions or free radicals to react with the contaminants, and then the reactants are carried out of the reactor by a gas stream. On the substrate after the contaminant is removed, the surface forms a hydrophilic hydroxyl group, which facilitates the adhesion of the subsequent adhesive 22 or the photoresist layer 23. Generally, the surface of the substrate 21 is hydrophobic, which is disadvantageous for the combination of the photoresist layer 23 and the substrate 21. Dry cleaning of the substrate 21 by plasma, whether by physical ion bombardment or by reactive ion etching using chemical 1259462, allows the contaminants originally attached to the substrate 21 to be removed. Further, the dry cleaning by the plasma does not cause the surface of the substrate 21 to be charged, so that the substrate 21 can be prevented from adsorbing the contaminant again. In addition to the removal of contaminants, the bonding ability between the substrate 21 and the photoresist layer 23 can be improved. The dry cleaning of the plasma can also make the surface of the substrate 21 slightly rough (Rough), so that the substrate 21 can be lifted. The bonding ability between the photoresist layers 23. Referring to FIG. 3 and FIG. 4, in the embodiment, the disc mastering method may further include: coating an adhesive on the substrate (S20). In step S20, a primer (Primer) 22 is applied onto the substrate 21. The adhesive 22 can be a surfactant or an adhesion enhancer. As shown in FIG. 5, Hexamethyldisilazane 'HMDS is used as the adhesive 22 as an example. Since one end of the adhesive 22 has a hydrophilic group 221, it can be attached to the cleaned substrate 21, and The one end having the hydrophobic group 222 can be in contact with the photoresist layer 23, so that the bonding force between the photoresist layer 23 and the substrate 21 can be enhanced. Referring to FIG. 2 and FIG. 3 ' in step S30 , a photoresist layer 23 is coated on the substrate 21 , and the photoresist layer 23 can be formed on the substrate by spin coating, for example, by spin coating. Above 21 . When the substrate 21 is coated with the adhesive 22', the photoresist layer 23 is formed on the bonding agent 22. As shown in FIG. 3 and FIG. 4, in the embodiment, the method for manufacturing the original disc includes: baking the photoresist layer (S40). In step S4, the photoresist layer 23 is baked, so that the photoresist layer 23 is hardened to perform the subsequent steps. Referring to FIG. 2 and FIG. 3 again, in step S50, Laser Beam Recording (LBR) of the photoresist layer 23 1259462 is performed and then $ is displayed. _. Convert the digital data into a high frequency signal and send it to the engraving machine, and drive the laser plate on the photoresist layer 23. The signal of the stencil is then developed by development to form a signaled pit 231. In step S70, a metal layer 24 is formed on the photoresist layer 23. In the embodiment, the metal layer 24 can be formed by sputtering or evaporation. The commonly used material for sputtering is nickel/vanadium alloy (Ni). /V alloy), and the material used for ^ is silver. In this way, the process of the original disc is completed, and the metal layer 24 on the surface can be used as a conductive layer for preparing the mold by an electroforming process in the future. In summary, the original method for manufacturing a disc according to the present invention is a dry cleaning substrate for photoresist and uranium. Compared with the conventional technology, the dry cleaning using the plasma into the substrate does not require the use of a large amount of water for cleaning, so that the contaminants originally attached to the substrate are removed, so as to facilitate the coating of light, Save valuable water resources. Moreover, the use of the dry layer does not cause the surface of the substrate to be charged, so that the substrate can be re-absorbed. In addition to the removal of the contaminant, the substrate can be lifted between the substrate and the photoresist layer, and the plasma is cleaned. It is also possible to make the surface of the substrate slightly rough, so that the adhesion between the substrate and the photoresist layer can also be improved. The above description is for illustrative purposes only and not as a limitation. The spirit and the spirit of the present invention, and equivalent modifications thereto, or 2, should be included in the scope of the appended claims. 11 1259462 FIG. 1 is a flow chart of a conventional disc production process; FIG. 2 is a flow chart of a method for manufacturing a disc original of the present invention; FIG. 3 is a disc of the present invention; FIG. 4 is another flow chart of the method for fabricating the original disc of the present invention; and FIG. 5 is a diagram of the adhesive between the substrate and the photoresist layer in the method for fabricating the original disc of the present invention. schematic diagram. Description of the component symbols: 21 substrate 22 subsequent agent 23 photoresist layer 231 cavity 24 metal layer S10 dry cleaning on a substrate S20 coating an adhesive on the substrate S30 coating a photoresist layer on the substrate S40 baking The photoresist layer S50 is laser etched and developed by the photoresist layer S70 to form a metal layer on the photoresist layer 12