TWI270429B - Method of joining members, method of joining metallic members, radiation member, process for manufacturing the same, jig for the manufacturing and heat sink - Google Patents

Method of joining members, method of joining metallic members, radiation member, process for manufacturing the same, jig for the manufacturing and heat sink Download PDF

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Publication number
TWI270429B
TWI270429B TW95100741A TW95100741A TWI270429B TW I270429 B TWI270429 B TW I270429B TW 95100741 A TW95100741 A TW 95100741A TW 95100741 A TW95100741 A TW 95100741A TW I270429 B TWI270429 B TW I270429B
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Taiwan
Prior art keywords
substrate
copper
metal
jig
bonding
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TW95100741A
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Chinese (zh)
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TW200631713A (en
Inventor
Hisashi Hori
Motoshi Hotta
Yoshimasa Kasezawa
Hisao Saito
Tsuyoshi Minamida
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Nippon Light Metal Co
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Priority claimed from JP2002249983A external-priority patent/JP2004088014A/en
Priority claimed from JP2003150205A external-priority patent/JP4222108B2/en
Priority claimed from JP2003162488A external-priority patent/JP4211499B2/en
Priority claimed from JP2003203752A external-priority patent/JP4337441B2/en
Application filed by Nippon Light Metal Co filed Critical Nippon Light Metal Co
Publication of TW200631713A publication Critical patent/TW200631713A/en
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Publication of TWI270429B publication Critical patent/TWI270429B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/103Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding using a roller

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

A method of joining two metallic members of different melting points piled on each other, which enables obtaining stable joined part quality and enables junction of large metallic members of complex configuration. Two or more metallic members (aluminum member (101) and copper member (102)) are joined to each other through a process comprising arranging two or more metallic members (aluminum member (101) and copper member (102)) so that these are piled on each other in the order of highness of melting point and moving the circumferential face of tool main body (103a) of disk-shaped junction tool (103) capable of rotating in the circumferential direction, while in the piling portion pressing the same in the surface (102a) of metallic member (copper member (102)) having the highest melting point among those of the metallic members, along the surface (102a) of metallic member (copper member (102)).

Description

1270429 九、發明說明: 【發明所屬之技術領域】 本發明的第一群組’係關於一種將具有相異溶點的金 屬元件相互重合並接合的方法,又關於具有優良的接合強 度的散熱元件、以及具有優良的接合效率的散熱元件的製 造方法。 本發明的第二群組,係關於一種將相互之間具有一定 間隔的複數個板材相互重合並接合於一基板的一表面的方 ,法’又關於使用上述的接合方法製造使用於1(:用散熱元 件、皮蒂爾致冷器(pel tier device)用散熱元件、馬達用 散熱元件、電子控制零件用散熱元件等的散熱元件及其製 造方法’還有使用於上述製造方法的散熱元件製造用治具。 本發明的第三群組,係關於冷卻半導體元件等的各種 電子零件的散熱器(heat sink)。 本發明的第四群組,係關於金屬元件相互重合並接合 •的方法,又關於將複數個金屬製板材接合於一基板的一: 面的方法,更關於應用上述接合方法的IC用散熱元件、皮 蒂爾致冷器(peltier device)用散熱元件、馬達用散熱元 件、電子控制零件用散熱元件等的散熱元件製造方法。 本發明的第五群組,係關於金屬元件相互重合並接合 的方法,更關於應用上述接合方法的IC用散熱元件、皮蒂 爾致冷器(peltier device)用散熱元件、馬達用散熱元 件、電子控制零件用散熱元件等的散熱元件及其製造方法。 本發明的第六群組,係關於1(:用散熱器、皮蒂爾致冷 2036-5808B-PF 5 1270429 器、電子控制 更關於使用上 器(peltier device)用散熱器、馬達用散熱 零件用散熱器等的散熱元件及其製造方法, 述散熱元件的散熱器。 【先前技術】 法, 將具有相異熔點的二個金屬元件相互重合並接合的方 通常係使用銲接或爆炸壓接。1270429 IX. Description of the Invention: [Technical Field of the Invention] The first group of the present invention relates to a method of recombining and joining metal members having dissimilar melting points, and a heat dissipating member having excellent joint strength. And a method of manufacturing a heat dissipating component having excellent bonding efficiency. A second group of the present invention relates to a method of re-bonding and bonding a plurality of sheets having a certain interval to each other to a surface of a substrate, and the method is also used for manufacturing using the above-described bonding method. A heat dissipating element, a heat dissipating element for a pel tier device, a heat dissipating element for a motor, a heat dissipating element for a heat radiating element for electronic control parts, and a method for manufacturing the same, and a heat dissipating element used in the above manufacturing method A third group of the present invention relates to a heat sink for cooling various electronic components such as semiconductor elements. The fourth group of the present invention relates to a method for re-engaging and joining metal components. Further, a method of bonding a plurality of metal plate members to one surface of a substrate, and further relates to a heat dissipating component for an IC to which the bonding method is applied, a heat dissipating component for a peltier device, a heat dissipating component for a motor, and A method of manufacturing a heat dissipating component such as a heat dissipating component for electronically controlling a component. The fifth group of the present invention relates to a method in which metal components are rejoined and joined to each other. Further, the present invention relates to a heat dissipating component for an IC for applying the above-described bonding method, a heat dissipating component for a peltier device, a heat dissipating component for a motor, a heat dissipating component for an electronic control component, and the like. The sixth group is about 1 (: using a radiator, Pittier cooling 2036-5808B-PF 5 1270429, electronic control, using a heat sink for the peltier device, heat dissipation for the motor A heat dissipating component such as a device and a method of manufacturing the same, and a heat sink for a heat dissipating component. [Prior Art] A method in which two metal members having different melting points are joined and joined to each other is usually welded or detonated.

久後,經由上述熔融的銲接材冷卻伴隨著凝固的過程中 就完成了接合。 所謂的銲接,係使熔融的辉接材流入接合部,而利用 與母材的「潤濕」肖「流動」的接合方法,藉由可溶融或 反應擴散的液相銲接材之毛細現象’將界面間隙埋覆,不 又,所謂的爆炸麼接,係使用在發生火藥爆炸的及短 時間内的高能量而將金屬接合的方法,其中係將各金屬元 件之間設置適當的間隔,在—邊的金屬元件上承載火藥, 而在火藥的-端用雷管引爆’而使兩金屬元件以高速度撞 擊,藉由在撞擊點發生顯著的流動現象(金屬喷流;metai jet),排除金屬表面之污染層,並同時在高壓下密接。 然而,使用銲接時,有著接合部的品質不安定,以即 可用於接合的金屬種類受到限制等缺點。 另外,使用爆炸壓接時,有著成本高、無法接合大型 金屬元件與具複雜形狀的金屬元件等缺點。 有鑑於此’本發明的第一群組係提供一種接合方法, 將熔點互異的二金屬元件相互重合併接合時,可以得到安After a long period of time, the joining is completed during the cooling along with the molten solder material. In the welding, the molten glow joining material flows into the joint portion, and the capillary phenomenon of the liquid phase welding material which can be melted or reacted and diffused by the "wetting" and "flowing" bonding method with the base material will be Interfacial gap embedding, no longer, the so-called explosion connection, is the use of high-energy in the occurrence of gunpowder explosion and a short time to join the metal, in which the appropriate spacing between the metal components, in - The metal element on the side carries the gunpowder, and the detonator is detonated at the end of the gunpowder, and the two metal elements are struck at a high speed, and the metal surface is excluded by a significant flow phenomenon (metal jet; metai jet) at the impact point. The contaminated layer is simultaneously bonded under high pressure. However, when welding is used, the quality of the joint portion is unstable, so that the type of metal that can be used for joining is limited. In addition, when explosive pressure bonding is used, there are disadvantages such as high cost and inability to join large metal components and metal components having complicated shapes. In view of the fact that the first group of the present invention provides a bonding method, when two metal elements having mutually different melting points are joined and joined to each other, an

2036-5808B-PF 1270429 、定的接合部品質,亦可以達成在大型且形狀複雜的金屬之 '間的接合。又,本發明亦提供以上述方法所製造的散熱元 件及其製造方法。 又,將相互之間具有一定間隔的複數個鰭片立設於一 基板的一表面上之散熱元件的製造方法,已揭示有例如將 王體的散熱7G件以鋁擠型(extrude)的步驟一體成形(請參 考曰本特許特開2001-3841 6號公報)。又,將複數個棒狀 丨部與立設於上述棒狀部的鰭片以並列的方式排列,再將各 棒狀部以銲接的方式製造鋁製的散熱元件;其中上述棒狀 部與鰭片係以擠型製成,具有斷面為L字型或凹字型的銘 製政熱元件之構成元件(請參考日本特許特開6-177289號 A報)。更者,亦有為了提高散熱性能而使用具高熱傳導性 的銅,而將複數個銘製·鰭片以鲜接的方式接合於一銅製的 基板的' 表面上。 然而’將全體的散韵^件以銘擠型#步驟—體成形 牯1 之南度/間隔比(tong ratio)存在有製程上的限 制。而鰭片之高度/間隔比愈高,散熱元件的散熱性能命 高’且銘擠型的步驟所能得到的鰭片之高度/間隔比無法超 過20的情況下,亦造成所製造的散熱元件的散熱性能受到 又,使用銲接時,在真空爐等加熱裝置中加敎、怪、、田 一段時間是必要的步驟’而有高製造成本的問題。恤 而上述習知技術的問 製造方法上,將相互之發绿散熱元件的 遢/、有一疋間隔的複數個板材立設2036-5808B-PF 1270429 The quality of the joint can also be achieved between the large and complex metal. Further, the present invention also provides a heat dissipating member manufactured by the above method and a method of manufacturing the same. Further, a method of manufacturing a heat dissipating member in which a plurality of fins having a certain interval therebetween are erected on a surface of a substrate has been disclosed, for example, in a step of extruding a heat dissipating 7G member of a king body. One-piece molding (please refer to the shogunate special opening 2001-3841 6). Further, a plurality of rod-shaped ridge portions and fins erected on the rod-shaped portion are arranged side by side, and each of the rod-shaped portions is welded to manufacture a heat dissipating member made of aluminum; wherein the rod-shaped portion and the fin are formed The film is made of extruded type, and has a constituent element of an inlaid political element with an L-shaped or concave type (please refer to Japanese Patent Laid-Open No. 6-177289A). Further, in order to improve the heat dissipation performance, copper having high thermal conductivity is used, and a plurality of inlaid fins are joined to the surface of a copper substrate in a fresh manner. However, there is a process limitation in the stencil type 牯1 south/interval ratio. The higher the height/space ratio of the fins, the higher the heat dissipation performance of the heat dissipating components, and the height/space ratio of the fins that can be obtained by the step of the extrusion type cannot exceed 20, and the heat dissipating components are also produced. The heat dissipation performance is again affected. When welding is used, it is a necessary step to add 敎, blame, and field in a heating device such as a vacuum furnace, and there is a problem of high manufacturing cost. In the manufacturing method of the above-mentioned conventional technology, a plurality of green sheets of mutually different green heat dissipating elements are erected.

2036-5808B-PF 1270429 、於一基板的一表面上時,亦廣泛地面臨著相同的問題。 有鐘於此’本發明的第二群組係首先提供一元件接合 方法’可以將又薄又高的複數個板材以短間距簡單地立設 並接合於一基板的一表面。更者,本發明係提供可以低成 本製造具南局度/間隔比的散熱元件之散熱元件製造方 法;本發明係又提供使用上述方法所製造的具有高散熱性 能的散熱元件,以及在上述方法中所使用的散熱元件製造 治具。 _ 又,搭載於個人電腦等各種機器與電動、電子機器等 電子$又備之半導體元件等電子元件,需要避免在實用時發 熱到某種程度,在上述電子元件的冷卻上,伴隨著近年來 電子元件的高功率化與高集積化,成為極為重要的技術課 題。現在,上述的冷卻手段,例如有將電子元件的發熱部 位與一散熱元件做導熱性的接觸,而將上述電子元件的發 熱部位所產生的熱輸送到散熱元件的鰭片上,並使用風扇 • 做強制性地冷卻而將熱排到外界的散熱器(heat sink)。又 如薄型的筆記型電腦,要製作將熱排到發熱部位之附近的 構造有空間上的困難時,係開始使用排熱管(heat pipe) 來連接發熱部位與散熱元件,而將散熱元件與風扇遠離位 於箱型容器本體侧的發熱部位,而配置於空間較有餘裕的 面板側之散熱器。 使用於上述散熱器的散熱元件,係將複數個銅製或鋁 製的鰭片直接立設並接合於銅製的基极,_而言貪 擠型將基板與立設於其上的複數個鰭片一體成形後,重合 2036-5808B-PF 8 1270429 並接合於銅製的基板上。其中,前者之銅製的基板與複數 個銅製ills製的韓片之接合係使用銲接,而後者銅基板與 紹基板之接合係使用銲接或爆炸壓接。 而銲接,係使熔融的銲接材流入接合部,而利用與母 材的「满濕」#「流動」的接合方法,藉由可熔融或:應 擴散的液相銲接材之毛細現象,將界面間隙埋覆,不久後, 經由上述熔融的銲接材冷卻伴隨著凝固的過程中,就完成 了接合。2036-5808B-PF 1270429, when faced on a surface of a substrate, is also widely faced with the same problem. There is a clock in which the second group of the present invention first provides a component bonding method which allows a plurality of thin and high sheets to be simply erected and joined to a surface of a substrate at short intervals. Furthermore, the present invention provides a heat dissipation element manufacturing method capable of manufacturing a heat dissipation element having a south degree/space ratio at a low cost; the present invention further provides a heat dissipation element having high heat dissipation performance manufactured by the above method, and the above method The heat sink used in the manufacture of fixtures. _ In addition, it is installed in various devices such as personal computers, electronic components such as electric and electronic devices, and other electronic components such as semiconductor components, and it is necessary to avoid heat generation to a certain extent in practical use. The high power and high integration of electronic components has become an extremely important technical issue. Now, the cooling means described above, for example, is to make the heat-generating portion of the electronic component in thermal contact with a heat-dissipating component, and to transfer the heat generated by the heat-generating portion of the electronic component to the fin of the heat-dissipating component, and use a fan to do Forced cooling to drain heat to the outside heat sink. In the case of a thin notebook computer, when it is difficult to make a structure in which heat is discharged to the vicinity of the heat generating portion, a heat pipe is used to connect the heat generating portion and the heat dissipating member, and the heat dissipating member and the fan are used. The heat sink is located away from the heat generating portion on the side of the box-shaped container, and is disposed on the heat sink portion of the panel side. The heat dissipating component used in the above heat sink is characterized in that a plurality of fins made of copper or aluminum are directly erected and joined to a base of copper, and the crucible type has a plurality of fins erected thereon. After integrally forming, 2036-5808B-PF 8 1270429 was superposed and bonded to a substrate made of copper. Among them, the bonding between the copper substrate of the former and the plurality of Korean copper ills is performed by soldering, and the bonding of the latter copper substrate to the substrate is by soldering or explosion bonding. In the case of welding, the molten solder material is poured into the joint portion, and the interface is formed by the "full wet" #"flow" bonding method of the base material, and the interface is melted or the liquid material of the liquid material to be diffused is used. The gap is buried, and soon after, the bonding is completed in the process of solidification through the molten solder material.

又,爆炸壓接,係使用在發生火藥爆炸的及短時間户 的高能量而將金屬接合的方法,其中係將各金屬元件之間 :置適當的間隔’在—邊的金屬元件上承载火藥,而在火 藥的端用雷B引爆,而使兩金屬元件以高速度撞擊,藉 由在撞擊點發生顯著的流動現象(金屬噴流、他"⑷, 排除金屬表面之污染層’並同時在高壓下密接。 然而’使用銲接時,在真空爐等加熱裝置中加孰、恆 溫-段時Μ必要的步驟,而有高製造成本的問題,且亦 有接合部品質不安定的問題。 人,优用碌坪壓接時,有菩 — 啕者成本间、無法接合大型^ 屬元件與具複雜形狀的金屬元件等缺點。 有鐘於此,本發明的筮- 月的第二群組的目的係提供-高性截 的散熱器,具有在低成本下,1 卜其鋼基板與銅鰭片、鋁鳍片 或銘基板能確實地接合的散熱元件。 0015至0018與圖2、3、5的習知 白知的放熱兀件的製造方法,In addition, explosive pressure bonding is a method of joining metals in the event of a gunpowder explosion and a high-time energy of a short-time household, in which a metal powder is placed between the metal components at appropriate intervals. At the end of the gunpowder, the thunder B is detonated, and the two metal components are struck at a high speed, by causing a significant flow phenomenon at the impact point (metal jet, he"(4), eliminating the contaminated layer of the metal surface' and at the same time In the case of welding, the necessary steps are added to the heating device such as a vacuum furnace, and the temperature is constant, and there is a problem of high manufacturing cost, and there is also a problem that the quality of the joint is unstable. When using the Puping crimping, there are disadvantages such as the cost of the bodhisattva, the inability to join the large-sized components and the metal components with complicated shapes. In this case, the purpose of the second group of the present invention is Provides a high-profile heat sink with a heat-dissipating component that can be reliably joined to a copper fin, aluminum fin, or a substrate at a low cost. 0015 to 0018 and Figures 2, 3, and 5 Zhibaizhi Method of manufacturing hot stamping parts,

2036-5808Β-PF 9 1270429 如第66A圖所示,由銅合金組成的基板462的表面462a 上,配置有:將鋁合金組成的薄板予以彎折,而形成具有 基端部464a、散熱面464b、前端部464c之連續凹凸斷面 形狀的鰭片464,其中各基端部464a係與表面462a形成 面接觸;再如第66B、66C圖所示,將一沿圓周轉動的圓板 狀接合治具463的治具本體463a的圓周面壓入鰭片464的 基端部464a的表面,並沿著基端部464a的表面移動,而 使鑛片464接合於基板462。上述的接合方法稱為摩擦震 動接合(friction acoustic bonding)。 如下所示的摩擦震動接合所使用的接合治具皆可以使 用:具有平坦的治具本體463a的圓周面之接合治具463(請 參考第6 7A圖);在治具本體463a的圓周面上,形成有平 行於治具本體463a圓周面厚度方向的複數個細條463b的 接合治具463B(請參考第67B圖);在治具本體463a的圓 周面上,具有突出於治具本體463a的徑向,成島狀排列的 複數個四角錘形狀的突起463c的接合治具463C(請參考第 6 7C圖);以及在治具本體463a的圓周面上,具有突出於 治具本體463a的徑向,成島狀排列的複數個圓弧形狀的突 起463d的接合治具463D(請參考第67D圖)。其中,與第 67A圖之接合治具463相比,第67B〜67D圖之接合治具 463b、463c、463d,因為與鰭片464的基端部464a有較大 的接觸面積,在摩擦震動接合鰭片464與基板462時有較 好的效率。 然而,上述習知的散入元件的製造方法,存在著以下 2036-5808B-PF 10 1270429 ,的問題。 , (1)因為接合治具463是壓入鋁合金所構成的鰭片464 之側而為摩擦震動接合,而鋁合金的熔點係低於構成基 板462之銅合金,因此在基板462與鰭片464的交界面達 J接〇所必要的溫度(548。〇的共晶溫度)之前,鰭片464的 基端部464a就因高溫化而降低其抗形變強度。因此,來自 接曰/Π具463的壓應力便無法充分地傳達至基板與鰭 片464的基端部464a的交界面,而發生接合不良或無法接 籲-的門4更者’鰭片464的基端部464a的厚度車交薄(例 如〇.5mm以下時)時,會有鰭片464的基端部464&熔斷的 缺點。 (2) 口為接合治具463是壓入錯片464之侧,鰭片464 的組成中之基端部464a就無法省略,散熱元件的形狀與構 造就因而受限。 (3) 因為接合治具463是壓入鰭片464之側,位於散熱 # 面464b正下方之基端部464a與基板462殘留有未接合的 部分,而導致散熱元件的散熱性能與接合強度不足。 (4) 必須注意高速轉動的接合治具463,在各個小鰭片 464的散熱面464b之間壓入的深度,否則會使接合治具463 再為接觸各個散熱面464b的情形下移動,而使接合作業變 侍繁雜且困難。上述的情況,特別在為了提升散熱元件的 散熱性能而將鰭片之高度/間隔比提高時(將散熱面464b 之間的間隔縮小、且/或提开散熱w 4僧_ 著。 ' 2036-5808B-PF 11 1270429 上述的問題,不僅僅是發生在散熱元件的製造方法 上,一般將複數個金屬製板材立設於一金屬製基板的一表 面上時,亦廣泛地面臨著相同的問題。更者,一般金屬元 件之間相互重合並接合時,亦面臨著上述(1)〜(3)項的問 題。 有鑑於此,本發明之第四群組首先提供一接合方法, 可以簡易並確實地將各金屬元件相互重合並接合。本發明 係又提供-接合方法,可以簡易並確實地將複數個金屬製 板材接合至-金屬製基板;且更應用上述方法,提供簡易 的散熱元件的製造方法,將複數個鰭片強固地立設、接合 至一基板。 又,將銅合金所構成的基板與鋁合金所構成的薄板重 合,並將一旋轉的圓板狀接合治具壓在熔點低於銅合金之 鋁合金薄板上之習知的金屬元件接合方法已經為世人所瞭 解(請參考例如日本特許㈣2G03_14簡號公報之段落 0015至GG18及其第69圖_3)。上述的接合方法中,係將 上述旋轉的圓板狀接合治具與上述銘合金薄板接觸而產生 摩擦熱,並利用上述摩擦熱使上述薄板與基板的交界面成 為可塑化(流動化)的固相。因此,將上述可塑化(流動化) 的銘。金與銅合金冷卻後,上述薄板與上述基板就已接合 在起了。藉由上述的接合方法,可以較少的步驟並在短 時間内接合各金屬元件。2036-5808Β-PF 9 1270429 As shown in Fig. 66A, a surface 462a of a substrate 462 composed of a copper alloy is provided with a thin plate made of an aluminum alloy bent to form a base end portion 464a and a heat dissipating surface 464b. a fin 464 having a continuous concave-convex cross-sectional shape of the front end portion 464c, wherein each base end portion 464a is in surface contact with the surface 462a; and as shown in Figs. 66B and 66C, a circular plate-shaped joint treatment is performed. The circumferential surface of the jig body 463a having the 463 is pressed into the surface of the base end portion 464a of the fin 464 and moved along the surface of the base end portion 464a to bond the ore piece 464 to the substrate 462. The above bonding method is called friction acoustic bonding. The joining jig used for the frictional vibration joining as shown below can be used: a joining jig 463 having a flat circumferential surface of the jig body 463a (refer to Fig. 6A); on the circumferential surface of the jig body 463a a joining jig 463B having a plurality of thin strips 463b parallel to the thickness direction of the circumferential surface of the jig body 463a (refer to FIG. 67B); and a diameter protruding from the jig body 463a on the circumferential surface of the jig body 463a a joining jig 463C of a plurality of quadrangular hammer-shaped projections 463c arranged in an island shape (refer to FIG. 6C); and a radial direction protruding from the jig body 463a on the circumferential surface of the jig body 463a, The bonding jig 463D of a plurality of arc-shaped protrusions 463d arranged in an island shape (refer to Fig. 67D). Among them, the joint jigs 463b, 463c, and 463d of Figs. 67B to 67D have a larger contact area with the base end portion 464a of the fin 464 than the joint jig 463 of Fig. 67A, and are subjected to frictional vibration bonding. The fins 464 and the substrate 462 have better efficiency. However, the above-described conventional method for manufacturing a diffusing element has the following problems of 2036-5808B-PF 10 1270429. (1) Since the bonding jig 463 is pressed into the side of the fin 464 formed of the aluminum alloy to be frictional vibration bonding, and the melting point of the aluminum alloy is lower than that of the copper alloy constituting the substrate 462, the substrate 462 and the fin are Before the interface of 464 reaches the temperature necessary for the junction (the eutectic temperature of 548. 〇), the base end portion 464a of the fin 464 is lowered in its deformation resistance due to the high temperature. Therefore, the compressive stress from the joint/cooker 463 cannot be sufficiently transmitted to the interface between the substrate and the base end portion 464a of the fin 464, and the door 4 which is poorly joined or unreachable is more the 'fin sheet 464. When the thickness of the base end portion 464a is thin (for example, when the thickness is 5 mm or less), there is a disadvantage that the base end portion 464 & (2) The mouth is a joining jig 463 which is pressed into the side of the stagger 464. The base end portion 464a of the composition of the fin 464 cannot be omitted, and the shape and configuration of the heat dissipating member are limited. (3) Since the bonding jig 463 is pressed into the side of the fin 464, the base end portion 464a directly under the heat dissipating surface 464b and the substrate 462 remain unjoined portions, resulting in insufficient heat dissipation performance and bonding strength of the heat dissipating member. . (4) It is necessary to pay attention to the depth of the joining jig 463 which is rotated at a high speed, between the heat radiating faces 464b of the respective small fins 464, otherwise the joining jig 463 is moved in contact with the respective heat radiating faces 464b, and It is complicated and difficult to make the joining work. In the above case, in particular, in order to improve the heat dissipation performance of the heat dissipating member, the height/space ratio of the fins is increased (the interval between the heat dissipating surfaces 464b is reduced, and/or the heat dissipating is performed.) 2036- 5808B-PF 11 1270429 The above problem is not only caused by the manufacturing method of the heat dissipating component, but also when the plurality of metal plates are erected on one surface of a metal substrate, the same problem is widely faced. Moreover, when the metal elements are generally rejoined and joined to each other, the problems of the above items (1) to (3) are also faced. In view of this, the fourth group of the present invention first provides a bonding method which can be easily and surely The metal elements are rejoined and joined to each other. The present invention further provides a bonding method for easily and surely joining a plurality of metal sheets to a metal substrate; and further applying the above method to provide a simple heat dissipating element manufacturing In the method, a plurality of fins are firmly erected and joined to a substrate. Further, a substrate made of a copper alloy is superposed on a thin plate made of an aluminum alloy, and a rotating circle is formed. Conventional metal component bonding methods for pressing a bonding tool on an aluminum alloy sheet having a melting point lower than that of a copper alloy have been known to the world (please refer to paragraphs 0015 to GG18 and Fig. 69 of the Japan Patent (4) 2G03_14 short bulletin _ 3) In the above bonding method, the rotating disk-shaped bonding jig is brought into contact with the above-mentioned alloy thin plate to generate frictional heat, and the interface between the thin plate and the substrate is plasticized by the frictional heat (fluidization) Therefore, the above-mentioned plasticized (fluidized) ingot. After the gold and the copper alloy are cooled, the thin plate and the substrate are joined together. By the above bonding method, fewer steps can be The metal components are joined in a short time.

β然而,上述的金屬元件接合方法中,由於接合治具是 壓入鋁合金薄板之-側,基板與薄板的重合部(交界面)的 2036-5808Β-PF 12 1270429 、又達到鋁σ金與銅合金之接合必要的共晶溫度它) 、夺銘a金亦即薄板的抗形變強度就會變得較小。因 此,上述的金屬元件接合方法中,來自接合治具的壓應力 便無法充分地傳達到基板與薄板的重合部,而基板與薄板 之間的接合就無法形成高強度接合。 有鑑於此,本發明係提供一種金屬元件的接合方法, 可以杈少的步騾並在短時間内接合各金屬元件,並可使上β However, in the above-described metal element bonding method, since the bonding jig is pressed into the side of the aluminum alloy sheet, the overlapping portion (interface) of the substrate and the sheet is 2036-5808Β-PF 12 1270429, and the aluminum σ gold and The necessary eutectic temperature for the bonding of the copper alloy, and the deformation resistance of the thin plate, that is, the thin plate, becomes smaller. Therefore, in the above-described metal element bonding method, the compressive stress from the bonding jig cannot be sufficiently transmitted to the overlapping portion of the substrate and the thin plate, and the bonding between the substrate and the thin plate cannot form a high-strength bonding. In view of the above, the present invention provides a bonding method of a metal component, which can reduce the number of steps and join the metal components in a short time, and can be used

述金屬7C件具有高接合強度;以及提供應用上述方法之散 熱元件的製造方法’並提供使用上述方法所製造之散敎元 件。 又,日本特許特開平9-203595號公報(段落〇〇1〇至 〇〇16與第卜4圖)令,揭示使用填隙接合(⑽iUng joint)、接著劑、或銲接接合的散熱元件。上述的散熱元 件的焦點是在重量較大而熱傳導率極高的銅的特性、以及 熱傳導率猶小於銅,而重量比銅還輕的链的特性,將基板 與鰭片由各種適合的異種金屬構成,可以雙方面滿足提升 散熱性能與輕量化的要求。 然而,要更提升上述散熱元件的性能時,必須考量將 =板的厚度加大、或是縮小鰭片的間隔(增加鰭片的數 1),如此一來將增加散熱元件全體的重量,就與輕量化的 要求背道而馳。換言之,在不降低散熱性能的倩況下,要 將散熱元件做更輕量化的處理有其極限。 有鑑於此,本發明的第六群組係違成不降低散熱性能 的前提下,又能達到輕量化之課題。在達成上述之前提下, 2036-5808B-PF 13 1270429 .本發明係提供—也一 μ 件的今献时 的製造方法、與使用上述散熱元 仵的散熱器。 【發明内容】 本發明的第一群組係提一-含 圾供徑金屬疋件接合方法,包 姚别· 依…熔點的尚低順序相互重合 , 將一沿圓周轉動的圓板狀接合治呈# in η s f 於上述金屬元件的重合部,使上 二周 周件中熔點最高的金屬元件的表面,並使上述圓 ::上述熔點最高的金屬元件的表面移動,而使上述 金屬7L件相互接合。 -本發明係又提供一種金屬元件接合方法,包含:提供 一個熔點相異的金屬元件相The metal 7C member has high joint strength; and a manufacturing method for providing a heat radiating member to which the above method is applied' and provides a bulk material manufactured by the above method. Japanese Laid-Open Patent Publication No. Hei 9-203595 (paragraphs 〇〇1 to 〇〇16 and 4) discloses a heat dissipating element using a gap joint ((10) iUng joint), an adhesive, or a solder joint. The above-mentioned heat dissipating component focuses on the characteristics of copper which is heavy in weight and extremely high in thermal conductivity, and the thermal conductivity is smaller than that of copper, and the weight is lighter than that of copper. The substrate and the fin are made of various suitable dissimilar metals. The composition can meet the requirements of improving heat dissipation performance and light weight in two aspects. However, in order to improve the performance of the above-mentioned heat dissipating components, it is necessary to increase the thickness of the plate or reduce the spacing of the fins (increasing the number of fins 1), thus increasing the weight of the entire heat dissipating component. It runs counter to the requirements of lightweighting. In other words, there is a limit to the process of making the heat dissipating component lighter in the case of not reducing the heat dissipation performance. In view of this, the sixth group of the present invention achieves the problem of weight reduction without prejudice to heat dissipation performance. Before the above is reached, 2036-5808B-PF 13 1270429. The present invention provides a manufacturing method of a one-piece and a heat sink using the above-described heat dissipating unit. SUMMARY OF THE INVENTION The first group of the present invention is a method for joining metal-containing metal parts, which comprises a circular plate-shaped joint treatment in which the melting point of the package is superimposed in a low order. #在 η sf in the overlapping portion of the above-mentioned metal member, so that the surface of the metal element having the highest melting point in the last two circumferential members is moved, Engage each other. - The present invention further provides a metal component bonding method comprising: providing a metal component phase having a different melting point

Mia 排列,以及將一沿圓周 ㈣的圓板狀接合治具的圓周面置於上述金屬元件的重合 j ’使上述接合治具的圓周面M人上述金屬元件中溶點較 咼的金屬元件的表面,並使上 ·'' k A 儿使上迷®周面沿著上述熔點較高 、屬元件的表面移動,而使上述金屬元件相互接合。 上述的金屬元件接合方法,係藉由接合治具的堡應 力,使金屬元件重合部的縫隙消失,並藉由轉動的接合: 具與金屬元件之接觸而產生的震動,使存在於金屬元件二 Π面之氧化物皮膜分裂、破壞’再加上所產生的摩擦熱使 重合部高溫化並發生塑性變形’而增加各金屬元件間的接 觸面積與擴散速率,而使重合部接合..。上述,的方法稱 擦震動接合。 ' 14Mia is arranged, and a circumferential surface of the disc-shaped joint jig along the circumference (four) is placed on the overlap of the metal elements, so that the circumferential surface of the joint jig is a metal element in which the melting point of the metal element is relatively thin. The surface and the upper surface of the upper surface of the element are moved along the surface of the element having a higher melting point, and the metal elements are joined to each other. In the above metal element bonding method, the gap of the metal element overlapping portion is eliminated by the bonding stress of the bonding tool, and the vibration is generated by the contact of the metal element, and the metal element is present. The oxide film splitting and destroying on the kneading surface, together with the frictional heat generated, causes the superposed portion to become high-temperature and plastically deformed, and increases the contact area and diffusion rate between the metal elements, thereby joining the overlapping portions. The above method is called rubbing engagement. ' 14

2036-5808B-PF 1270429 特別是,將複數個金屬元件依照其炫點的高低順序相 互重合配置’而將接合治具麼入熔點最高的金屬之側而接 合時’在各金>1元件的重合部的溫度提相接合所必要的 派度時’鄰近接合治具之—側的金屬元件仍然能保持高抗 形變強度’而使接合治具的M應力能夠有效率地傳達到重2036-5808B-PF 1270429 In particular, when a plurality of metal elements are arranged one above another in accordance with the order of their heights, and the joining jig is joined to the side of the metal having the highest melting point, the bonding is performed in each gold > When the temperature of the coincident portion is added to the necessary degree of joining, the metal component on the side adjacent to the joint fixture can still maintain high deformation strength, and the M stress of the joint fixture can be efficiently conveyed to the weight.

合面,而能夠在金屬元件間形成無縫隙且具高接合 接合。 X _ 本發明係又提供一種金屬元件接合方法,包含··提供 -銅元件與一鋁元件相互重合排列;以及將一沿圓周轉動 的圓板狀接合治具的圓周面置於上述銅元件與上述鋁元件 的重合部,使上述接合治具的圓周面壓入上述銅元件的表 面,並使上述圓周面沿著上述銅金屬元件的表面移動,而 使上述銅元件與上述鋁元件相互接合。 要在銅元件與鋁元件之間形成一 CuA12層,而在摩擦 震動接合後,實現上述的接合時,兩元件的重合面必須達 _ 到共晶溫度(548°C)以上。但是,如果上述接合治具是壓入 熔點低於銅元件之鋁元件一侧而為摩擦震動接合時,因為 兩元件的重合面達到共晶溫度以上時,鋁元件的抗形變強 度就會變小,來自接合治具的壓應力便無法充分地傳達到 重合面上,而容易發生接合不良的問題。而如果上述接合 治具是壓入熔點高於鋁元件之銅元件一侧而為摩擦震動接 合時’因為兩元件的重合面達到共晶溫度以上時,鋼元件 的抗形變強度較大,壓應力就能充分地傳達至重合面,而 能夠確實地接合。 2036-5808B-PF 15 1270429 的 上述的金屬元件接合方法中,接合時接合治具轉動 因周速率ROn/min.)較好係由下式⑴求出: 250 ^ 2000 ......... … 接合時接合治具轉動的圓周速率小於250ro/min.時, 接口具與銅7G件之摩擦接觸所產生的熱量便會過小,銅 ^件與紹元件的重合面的溢度較低,而發生接合不良的問 題另方面,接合時接合治具轉動的圓周速率大於 2J)00m/min·時’接合治具與銅元件之摩擦接觸所產生的熱 里便曰大於所必要的熱量,& 了會增加驅動接合治具時的 能量損失之外,亦會使與接合治具接觸的銅元件之溫度會 局部性地過大而使該部分發生塑性變形,因而使來自來自 接合治具的屋應力便無法充分地傳達到重合面…在兩 元件之間有產生縫隙的可能。因&,接合時接合治具轉動 的圓周速率在25Gm/min.〜2_m/min·時,接合治具與銅元 件之摩擦接觸所產生的熱量便是適#的值,而能夠行良好 的接合。 又,上述的金屬元件接合方法中,接合時接合治具在 銅元件的表面壓入量α(π〇^較好為由下式(B)求出: 0. 03xt^ α ^ 3xt...............(b) 其中t為該重合部中的該銅元件的厚度(^)。 接合時接合治具在銅元件的表面壓入量小於〇. 〇 3七 時,銅元件與鋁元件的重合面會殘留縫隙而造成接合不 良;另一方面,壓入量大於〇· 3t_;”雖,銅元件與 的重合面不會殘留縫隙,但是在銅元件的表面會因壓入量 2036-5808B-PF 16 J27〇429 過大而殘留顯菩的m 時接人…而發生元件的損失。因此,接-時接合治具在銅元件的表面接口 治具的壓應力便是適〜* 纟U3卜0.3t時,接合 重人面不4㈣ 田的值,而能夠在銅元件與紹 痕。 _的清況下,亦能縮小銅元件表面的凹 Μ ^ ^ r,筏合時接合治具沿 =件的表面移動的行進速料(—η.)係由下式⑹求 〇· 1 ^ R/(5. Oxl〇7xt2)...............(c) 其中R為接合時該接合治具的圓周速率(m/_) ’· 士為該重合部中的該銅元件的厚度(m)。 因為隨著接合時接合治具圓周速率的增大,接合治且 與銅元件之摩擦接觸所產生的熱量亦會增大,接合治具的 行進速度V亦增大時,便能使重合部的溫度保持在一定的 數值以上。但是’因為當銅元件的厚度增加時,要將重合 面達到-定溫度以上就較為費時,若是接合治具的行進速 度V過大時’在接合面達到一定溫度以上之前,接合治具 便已通過,而發生接合不良的問題。因此,欲執行良好的 摩擦震動接合,接合治具的行進速度v、圓周速率R、與銅 π件的厚度t相互之間的調節是必要的;而發明人們的實 驗結果’係確認了滿足Vs R/(5· 〇xl 〇7xt2)時,可以有良好 的接合。 又’接合治具的行進逮度V過小時,就會言接 不佳的觀點之緣故’發明人們經由實驗係確認了滿足〇 · 1 2036-5808B-PF 17 1270429 ^ V時’可以有良好的接合效率。 本發明係又提供一種散熱元件,包含··一銘質散熱器 (heat sink),具有一基板、與立設於上述基板之一表面上 的散熱鰭片;以及一銅質導熱板,在上述基板的另一表面 上,與上述基板相互重合而接合於上述基板,其中上述鋼 質導熱板與上述基板的接合方法係使用上述的金屬元件接 合方法。 上述的散熱元件中,因為將一沿圓周轉動的圓板狀接 合治具的圓周面壓入上述銅質導熱板之側,並施行摩擦震 動接合’成為上述基板與上述導熱板之重合面無縫隙、且 具較南接合強度的散熱元件。 又,上述的散熱元件中,散熱器材料較好為使用鋁擠 型而成形。 上述的散熱元件中,因為散熱器材料較好為使用鋁擠 型而成形,散熱器材料具有高加工精度。 _ 本發明係又提供一種散熱元件的製造方法,包含··提 供鋁質散熱器材料,具有一基板、與立設於上述基板之 一表面上的散熱鰭片,並配置一銅質導熱板,重合於上述 基板的另一表面上;以及使用上述之金屬元件接合方法, 接合上述基板與上述銅質導熱板。 上述的散熱元件的製造方法中,因為將一沿圓周轉動 的圓板狀接合治具的圓周面壓入上述熔點高於鋁元件的銅 質導熱板之侧,並施行摩擦震動接合p與接合治具接觸的 銅元件不易溶融且在高溫時能保持高的抗形變強度。因 2036-5808B-PF 18 1270429 此,接合條件(接合治具的轉動樹、行進速率等)的容許範 圍大,具有良好的接合效率。又,容許在重合面局部的高 溫化,散熱元件不會如爆炸壓接時一般受到過度的負荷, 因此可防止散熱鰭片的變形,並提供具有良好散熱效率的 散熱元件。 又’本發明的第二群組係提供一種元件接合方法,適 用於將相互之間具有一定間隔的複數個板材立設並接合於 -基板之-表面,包含:一元件配置步驟,在排列成相互 之間具有-定間隔的複數個板材之間,各置入一間隔物 (spacer),並將上述板材立設於一基板之一表面;一摩擦 振動接合步驟,將一沿圓周轉動的圓板狀接合治具的圓周 面壓入上述基板之另-表面,並沿著上述基板之另一表面 移動’而使上述板材接合於上述基板;以及—間隔物脫離 步驟,將上述間隔物移除。 上述的元件接合方法令,首先在元件配置步驟時,The face is joined to form a seamless joint with a high joint between the metal members. X _ The invention further provides a metal component joining method, comprising: providing - a copper component and an aluminum component are arranged in a mutually coincident arrangement; and placing a circumferential surface of a circumferentially rotating disk-shaped joint fixture on the copper component and The overlapping portion of the aluminum member is pressed against the surface of the copper member by the circumferential surface of the bonding jig, and the circumferential surface is moved along the surface of the copper metal member to bond the copper member and the aluminum member to each other. To form a CuA12 layer between the copper component and the aluminum component, and after the frictional vibration bonding, the bonding surface of the two components must reach _ to the eutectic temperature (548 °C) or more. However, if the bonding jig is pressed into the side of the aluminum element having a melting point lower than that of the copper component and is frictional vibration bonding, since the overlapping faces of the two components reach a eutectic temperature or higher, the deformation resistance of the aluminum component becomes small. The compressive stress from the joining jig cannot be sufficiently transmitted to the overlapping surface, and the problem of poor joining is likely to occur. However, if the bonding fixture is pressed into the side of the copper component having a higher melting point than the aluminum component and is subjected to frictional vibration bonding, since the overlapping surface of the two components reaches a eutectic temperature or higher, the deformation resistance of the steel component is large, and the compressive stress is large. It can be fully conveyed to the coincident surface and can be reliably joined. In the above-described metal element bonding method of 2036-5808B-PF 15 1270429, the rotation speed of the joining jig at the time of joining is preferably determined by the following formula (1): 250 ^ 2000 . .. ... When the circumferential speed of the joint fixture rotation is less than 250ro/min., the heat generated by the frictional contact between the interface and the copper 7G piece is too small, and the overlap of the copper and the component is low. On the other hand, the problem of joint failure occurs. When the circumferential speed of the joint jig is greater than 2J) 00 m/min· when joining, the thermal contact generated by the frictional contact between the joint fixture and the copper component is greater than the necessary heat. & In addition to increasing the energy loss when driving the jig, the temperature of the copper element in contact with the jig is locally too large to plastically deform the part, thus resulting from the jig from the jig. The house stress cannot be fully conveyed to the coincident surface... there is a possibility of a gap between the two elements. The heat generated by the frictional contact between the bonding jig and the copper member is a value of #, and can be performed well when the circumferential speed of the joining jig is 25 Gm/min. to 2 mm/min. Engage. Further, in the above-described metal element bonding method, the amount of pressing of the bonding jig on the surface of the copper element during bonding is preferably determined by the following formula (B): 0. 03xt^ α ^ 3xt... (b) where t is the thickness (^) of the copper element in the overlapping portion. The bonding jig is pressed on the surface of the copper member less than 〇. 〇3 At 7 o'clock, the overlapping surface of the copper component and the aluminum component may leave a gap and cause poor bonding; on the other hand, the amount of pressing is greater than 〇·3t_;" although the overlapping surface of the copper component does not leave a gap, but in the copper component The surface will be damaged due to the excessive amount of 2036-5808B-PF 16 J27〇429 and the residual m is retained. Therefore, the contact of the jig on the surface of the copper component is pressed. The stress is suitable for ~* 纟U3 Bu 0.3t, the value of the jointed human face is not 4 (four) field, but can also reduce the concave surface of the copper component under the condition of the copper component and the trace. ^ ^ r When the splicing jig is moved along the surface of the member, the traveling material (—η.) is obtained by the following formula (6) 〇 1 ^ R/(5. Oxl 〇 7xt2)... ...(c) where R is connected The circumferential rate (m/_) of the joining fixture is the thickness (m) of the copper member in the overlapping portion. Because the circumferential rate of the joining fixture increases as the joint is joined, the bonding is combined with copper. The heat generated by the frictional contact of the component also increases, and when the traveling speed V of the bonding jig increases, the temperature of the overlapping portion can be maintained above a certain value. However, because when the thickness of the copper component increases, It is more time-consuming to bring the overlapping surface to a constant temperature or higher. If the traveling speed V of the joining jig is too large, the joining jig has passed before the joining surface reaches a certain temperature or higher, and the joint failure occurs. Performing a good frictional vibration engagement, the adjustment of the traveling speed v of the joining jig, the circumferential rate R, and the thickness t of the copper π piece is necessary; and the inventors' experimental results 'confirmed that Vs R/( 5· 〇xl 〇7xt2), it is possible to have a good joint. Also, the 'catch of the jig of the jig is too small, and it will be a bad idea.' The inventors confirmed the satisfaction of the experiment. 2036 -5808B-PF 17 1270429 ^V" can have good bonding efficiency. The present invention further provides a heat dissipating component comprising: a heat sink having a substrate and standing on the substrate a heat dissipating fin on a surface; and a copper heat conducting plate on the other surface of the substrate, which is overlapped with the substrate and bonded to the substrate, wherein the method of bonding the steel heat conducting plate to the substrate is as described above In the above-described heat dissipating member, the circumferential surface of a disk-shaped joining jig that rotates circumferentially is pressed into the side of the copper heat-conducting plate, and frictional vibration bonding is performed to become the substrate and the above-mentioned heat conduction. The heat dissipating component of the board has no gap and has a south joint strength. Further, in the above heat dissipating member, the heat sink material is preferably formed by extrusion using aluminum. Among the above heat dissipating members, since the heat sink material is preferably formed by using an aluminum extrusion type, the heat sink material has high processing precision. The invention further provides a method for manufacturing a heat dissipating component, comprising: providing an aluminum heat sink material, having a substrate, a heat dissipating fin standing on a surface of the substrate, and a copper heat conducting plate; Cooperating with the other surface of the substrate; and bonding the substrate and the copper heat conductive plate using the metal element bonding method described above. In the above method for manufacturing a heat dissipating member, the circumferential surface of a disk-shaped joining jig that rotates circumferentially is pressed into the side of the copper heat-conducting plate whose melting point is higher than that of the aluminum element, and frictional vibration bonding p and bonding are performed. The copper component with contact is not easily melted and maintains high deformation strength at high temperatures. Since 2036-5808B-PF 18 1270429, the joining condition (rotation tree of the jig, the traveling speed, etc.) is large, and the joining efficiency is good. Further, it is allowed to locally increase the temperature of the overlapping surface, and the heat dissipating member is not excessively loaded as in the case of explosive pressure bonding, so that deformation of the heat radiating fin can be prevented, and a heat dissipating member having good heat dissipating efficiency can be provided. Further, the second group of the present invention provides a component bonding method for erecting and bonding a plurality of sheets having a certain interval therebetween to a surface of a substrate, comprising: a component arrangement step, arranged in Between each of the plurality of sheets having a predetermined interval therebetween, a spacer is disposed, and the sheet is erected on a surface of one of the substrates; and a frictional vibration bonding step is performed to rotate a circle along the circumference The circumferential surface of the plate-shaped bonding fixture is pressed into the other surface of the substrate and moved along the other surface of the substrate to bond the plate to the substrate; and the spacer is removed to remove the spacer . The above-described component bonding method, first in the component configuration step,

板材、基板、與間隔物設定至一既定位置。上述元件的 ,並沒有特別的限制,各板材、各間隔物、以及板材與 隔物之間’可以是同種材料組成亦可以是數種不同材料 成。間隔物的形狀並沒有特別的限制,較好是各間隔物 間有相互連結。 此時,在各板材相互之間分別w ^ U刀〜置入一間隔物,可以i 確地保持板材相互之間隔,並简罝认〜*The plate, the substrate, and the spacer are set to a predetermined position. The above elements are not particularly limited, and each of the sheets, the spacers, and the sheets and the spacers may be of the same material or may be of a plurality of different materials. The shape of the spacer is not particularly limited, and it is preferred that the spacers are connected to each other. At this time, between the plates, w ^ U knife ~ placed a spacer, can accurately maintain the spacing of the plates, and simply recognize ~ *

Χ間早地決定其位置;再加J 可猎由間隔,物將板材補強,柘姑的p由 ^ 扳材的厚度可以變得非常薄。 又’僅需要變更間隔物的厚廑, 予度就可以任意變更板材的® 19In the daytime, the position is determined early; plus J can be hunted by the interval, the material is reinforced, and the thickness of the plate can be made very thin. In addition, it is only necessary to change the thickness of the spacer, and the plate can be arbitrarily changed.

2〇36-58〇8B-PF 1270429 置間隔;更者’亦可以一併變更板材的高度,而使得特別 將薄板厚、高板高的複數個板材以短間隔立設並接合於基 板的一表面變得可行。而在此步驟中,各板材立設並配置 於基板的一表面的狀態下,雖然各間隔物可以不與板材的 該表面直接接觸;而如果考慮到下一個步驟中來自接合治 具的壓應力使板材受到彎曲應力的作用,為了提高間隔物 對板材的補強效果’較好為使各間隔物直接接觸基板的該 表面。 又’在接下來的摩擦震動接合步驟中,將接合治具壓 至基板的另一表面使各板材與基板因摩擦震動接合而接 合。如此一來,就沒有必要如使用銲接時一般,在真空燐 中加熱並維持一段既定時間,可以削減接合成本。而為了 要提高基板與板材之接合強度,較好為接合治具在基板的 另一表面上的移動能夠遍及各板材基端面的全面,而使各 板材能完全與基板接合;而在接合成本的削減較為重要 時,亦可以移動接合治具,而僅遍及各板材基端面的一部 份。又,將基板與各板材摩擦震動接合時,雖然亦可以使 各間隔物與基板接合;而如果考慮到移除間隔物的下一個 步驟’較好為使接合治具依照不I基板與各間隔物接合的 軌跡移動。 又i上述的元件接合方法中,間隔物的構成材料較妤 為熔點高於板材與基板的材料。 上述的元件接合方法中,,為骨隔♦的修點高於板材 及基板的熔點’將接合治具的轉動數與行進速度設定在既 2036-5808B-PF 20 1270429 定的範圍時,就不會使間隔物接合於基板與板材上,美板 與板材的接合也變得較簡單。 又此時,在完成摩擦震動接合的階段,因為間隔物並 不接合於基板與板材上,在最後的間隔物脫離步驟時,就 可以不費事地移除間隔物。例如將板材及間隔物朝下而將 基板朝上而向上移動時,僅留下間隔物而僅有板材與基板 一體地向上移動,而可以簡單地移除間隔物,而成為複數 個板材立設並接合於基板一表面的狀態。 又,上述的元件接合方法中,基板的構成材料較好為 馆*點南於板材的材料。 上述的元件接合方法中,因為在將板材與基板交界面 的溫度上升至接合所必要的溫度時,基板能夠保持高抗形 變強度,接合治具的壓應力能夠有效率地傳達至交界面, 並可以形成板材與基板之間無縫隙的高強度接合。2〇36-58〇8B-PF 1270429 is spaced apart; moreover, it is also possible to change the height of the sheet together, so that a plurality of sheets of thin sheet thickness and high sheet height are erected at short intervals and joined to the substrate. The surface becomes feasible. In this step, each of the sheets is erected and disposed on a surface of the substrate, although each spacer may not be in direct contact with the surface of the sheet; and if the compressive stress from the joint jig in the next step is considered The sheet is subjected to bending stress, and in order to improve the reinforcing effect of the spacer on the sheet, it is preferred that each spacer directly contacts the surface of the substrate. Further, in the subsequent frictional vibration bonding step, the bonding jig is pressed to the other surface of the substrate so that the respective plates and the substrate are joined by frictional vibration. In this way, it is not necessary to heat and maintain in a vacuum crucible for a predetermined period of time, which can reduce the joint cost. In order to improve the bonding strength between the substrate and the board, it is preferred that the movement of the bonding jig on the other surface of the substrate can be integrated throughout the base end faces of the respective plates, so that the plates can be completely joined to the substrate; When the reduction is more important, it is also possible to move the jig and only cover a part of the base end face of each plate. Further, when the substrate and the respective plates are friction-vibrated, the spacers may be bonded to the substrate; and if the next step of removing the spacers is considered, it is preferable that the bonding jigs are not in accordance with the substrate and the spacers. The trajectory of the object is moved. Further, in the above element bonding method, the constituent material of the spacer is a material having a higher melting point than the plate material and the substrate. In the above-described component bonding method, when the repair point of the bone spacer ♦ is higher than the melting point of the sheet material and the substrate, the number of rotations of the joint jig and the traveling speed are set within a range of 2036-5808B-PF 20 1270429, The spacer is bonded to the substrate and the plate, and the bonding of the plate to the plate is also relatively simple. At this time, at the stage of completion of the frictional vibration bonding, since the spacer is not bonded to the substrate and the sheet, the spacer can be removed without trouble in the final spacer detachment step. For example, when the plate and the spacer are facing downward and the substrate is moved upward and upward, only the spacer is left and only the plate and the substrate are moved upward integrally, and the spacer can be simply removed, and the plurality of plates can be erected. And bonded to a state of a surface of the substrate. Further, in the above-described element bonding method, the constituent material of the substrate is preferably a material which is located on the plate material. In the above-described component bonding method, since the substrate can maintain high deformation resistance strength when the temperature at the interface between the plate material and the substrate is raised to the temperature necessary for bonding, the compressive stress of the bonding jig can be efficiently transmitted to the interface, and Forming a high-strength joint without gaps between the sheet and the substrate.

本發明係又提供一種散熱元件的製造方法,適用於將 相互之間具有—定間隔的複數個金屬t鰭片謂並接合於 -金屬製基板之-表面,包含:—元件配置步驟,在排列 成相互之間具有-^間隔的複數個鰭片之間,纟置入一間 隔物(spacer),並使上述韓片立設於一基板之一表面;一 摩擦振動接合步驟’將一沿圓周轉動的圓板狀接合治具的 圓周面壓人上述基板之另—表面,並沿著上述基板之另一 表面移動’而使上述鰭片接合於上述基板;以及—間隔物 脫離步驟,將上述間隔物移除 上述的散熱元件的製造方法中,首先在元件配置步驟 2036-5808B-PF 21 1270429 中將板材、基板、與間隔物設定至一既定位置。上述元件 的材質並沒有特別的限制。此時,在各板材相互之間分別 置入一間隔物,可以正確地保持板材相互之間隔,並簡單 地決定其位置;再加上可藉由間隔物將板材補強,板材的 厚度可以變知非常薄。又,僅需要變更間隔物的厚度,就 可以任思變更板材的配置間隔;更者,亦可以一併變更板 材的高度,而使得特別在簡單地製造具有高高度/間隔比的 散熱元件變得可行。而在此步驟中,各板材立設並配置於 基板的表面的狀態下,雖然各間隔物可以不與板材的該 表面直接接觸;而如果考慮到下一個步驟中來自接合治具 的壓應力使板材受到彎曲應力的作用,為了提高間隔物對 板材的補強效果,較好為使各間隔物直接接觸基板的該表 面。 又,在接下來的摩擦震動接合步驟中,將接合治具壓 至基板的另一表面使各板材與基板因摩擦震動接合而接 合。如此一來,就沒有必要如使用銲接時一般,在真空爐 中加熱並維持一段既定時間,可以削減接合成本。而為了 要提高基板與板材之接合強度,較好為接合治具在基板的 另一表面上的移動能夠遍及各板材基端面的全面,而使各 板材能完全與基板接合;而在接合成本的削減較為重要 時,亦可以糝動揍合治具,而僅遍及各板材基端面的一部 份。又,將基板與各板材摩擦震動接合時,雖然亦可以使 各間隔物與基板接合;而如果考慮到移除間隔物的下一個 步驟,較好為使接合治具依照不使基板與各間隔物接合的 2036-5808B-PF 22 1270429 軌跡移動。 本發明係又提供一種散熱元件的製造方法,適用於將 相互之間具有一定間隔的複數個金屬製縛片立設並接合於 、金屬製基板之一表面,包含:_鰭片配置步驟,在排列 成相互之間具有一定間隔的複數個韓片之間,各置入一間 隔物(spacer),其中上述間隔物的基端面分別沒入上述續 片的基端面之下’而使上述間隔物的基端面分別低於上述 籍片的基端面的高度差不大於上述間隔物的厚度;一基板 攀酉己置步驟,將上述韓片中,凸出於上述間隔物的基端面的 基端部彎折’而使上述鰭片立設於一基板之一表面;一摩 擦振動接合步驟,將-沿圓周轉動的圓板狀接合治具的圓 周面壓入上述基板之另一表面,並沿著上述基板之另一表 面移動’而使上述鰭片的基端部接合於上述基板;以及一 間隔物脫離步驟,將上述間隔物移除。 上述的散熱元件的製造方法與前一項之散熱元件的製 _ 造方法約略相同,其間的分別在於將鰭片(以及間隔物)的 配置步驟與基板的配置步驟分開。首先在鰭片配置步驟 中,使各間隔物的基端面分別沒入各鰭片的基端面(基板側 之^面)之下(鰭片的基端面較間隔物的基端面突出);接下 來的基板配置步驟中,將基板壓在鰭片上,而將鰭片的基 端部(敕間隔物突出的部分)彆折。而务词 起’鰭片的基端部突出的長度在間隔物的厚度以内,因此 將各鰭片的基端部彎折後,彼此,,不會相'互重疊、。· 片的厚度相當薄時,鰭片的基端部是在與基板重合的狀態 2036-5808B-PF 23 1270429 下與其接觸,因而擴大鰭片與基板的接觸面積而使兩者能 夠確實地接合。 間隔物的構成材 又’上述的散熱元件的製造方法中 料係為熔點高於鰭片及基板的材料。 因為間隔物的溶點高 上述的散熱元件的製造方法中, 於鰭片及基板的熔點,將接合治具的轉動數與行進速度設 定在既定的範㈣,就不會使間隔物接合於韓片與基板 上,基板與鰭片的接合也變得較簡單。 又此時,在完成摩擦震動接合的階段,因為間隔物並The invention further provides a method for manufacturing a heat dissipating component, which is suitable for bonding and bonding a plurality of metal t fins having a predetermined interval therebetween to a surface of a metal substrate, comprising: - component arrangement steps, arranged Between the plurality of fins having a spacing therebetween, a spacer is placed and the Korean piece is erected on a surface of a substrate; a frictional vibration bonding step 'will be along the circumference a circumferential surface of the rotating disc-shaped joining jig pressing the other surface of the substrate and moving along the other surface of the substrate to engage the fin to the substrate; and a spacer separating step In the method of manufacturing the spacer to remove the heat dissipating component described above, the board, the substrate, and the spacer are first set to a predetermined position in the component disposing step 2036-5808B-PF 21 1270429. The material of the above components is not particularly limited. At this time, a spacer is placed between each of the plates, so that the plates can be properly spaced from each other and the position thereof can be easily determined. In addition, the thickness of the plate can be changed by reinforcing the plate by the spacer. very thin. Further, it is only necessary to change the thickness of the spacer, and it is possible to change the arrangement interval of the sheet material. Further, the height of the sheet material can be changed together, so that the heat dissipating member having a high height/space ratio can be easily manufactured in particular. feasible. In this step, in the state in which the respective sheets are erected and disposed on the surface of the substrate, although the spacers may not directly contact the surface of the sheet; and if the compressive stress from the joining jig in the next step is taken into consideration The sheet material is subjected to bending stress, and in order to improve the reinforcing effect of the spacer on the sheet material, it is preferred that each spacer directly contacts the surface of the substrate. Further, in the subsequent frictional vibration bonding step, the bonding jig is pressed to the other surface of the substrate so that the respective plate members and the substrate are joined by frictional vibration. In this way, it is not necessary to heat and maintain in a vacuum furnace for a predetermined period of time, as in the case of welding, and the joint cost can be reduced. In order to improve the bonding strength between the substrate and the board, it is preferred that the movement of the bonding jig on the other surface of the substrate can be integrated throughout the base end faces of the respective plates, so that the plates can be completely joined to the substrate; When the reduction is more important, it can also be used to move the fixture, but only a part of the base end of each sheet. Further, when the substrate and the respective plates are friction-vibrated, the spacers may be bonded to the substrate; and in consideration of the next step of removing the spacers, it is preferable to make the bonding fixtures not to be spaced apart from each other. The object is engaged by 2036-5808B-PF 22 1270429. The invention further provides a method for manufacturing a heat dissipating component, which is suitable for erecting and bonding a plurality of metal tabs having a certain interval therebetween to one surface of a metal substrate, comprising: a fin arrangement step, Between the plurality of Korean sheets arranged at a certain interval from each other, a spacer is placed in each of them, wherein the base end faces of the spacers are respectively below the base end surface of the continuous sheet, and the spacers are a base end surface respectively lower than a height difference of the base end surface of the piece is not more than a thickness of the spacer; a substrate climbing step, the base end of the base end surface of the spacer protruding from the spacer Bending 'the fins are erected on a surface of one of the substrates; a frictional vibration bonding step of pressing the circumferential surface of the circumferentially rotating disc-shaped bonding jig into the other surface of the substrate and along The other surface of the substrate moves 'to make the base end portion of the fin bonded to the substrate; and a spacer removing step to remove the spacer. The above-described method of manufacturing the heat dissipating component is roughly the same as the method of fabricating the heat dissipating component of the former, and the difference between the steps of disposing the fins (and the spacers) and the step of disposing the substrate. First, in the fin arrangement step, the base end faces of the spacers are respectively submerged under the base end faces of the respective fins (the surface of the substrate side) (the base end faces of the fins protrude from the base end faces of the spacers); In the substrate arrangement step, the substrate is pressed against the fin, and the base end portion of the fin (the portion where the spacer spacer protrudes) is folded. However, since the length at which the base end portion of the fin protrudes is within the thickness of the spacer, the base end portions of the fins are bent and do not overlap each other. When the thickness of the sheet is relatively thin, the base end portion of the fin is in contact with the substrate 2036-5808B-PF 23 1270429, thereby expanding the contact area between the fin and the substrate so that the two can be surely joined. The constituent material of the spacer is also a material having a higher melting point than the fin and the substrate. Since the melting point of the spacer is high, in the method of manufacturing the heat dissipating element described above, the number of rotations of the bonding jig and the traveling speed are set to a predetermined value (4) at the melting points of the fin and the substrate, and the spacer is not bonded to the Han. On the sheet and the substrate, the bonding of the substrate and the fins also becomes simpler. At this time, at the stage of completing the frictional vibration joint, because of the spacer

不接合於鰭片與基板上,在最後的門 取使的間隔物脫離步驟時,就 可以不費事地移除間隔物。例如將 %对μ月及間隔物朝下而將 基板朝上而向上移動時,僅留τ間隔物而僅有鰭片與基板 :體地向上移動’而可以簡單地移除間隔物,〜完成散熱 元件的製作。 又,上述的散熱元件的製造方法中,基板的構成材料 φ 較好為熔點高於鰭片的材料。 ▲.上述的散熱元件的製造方法中,因為在將鰭片與基板 交界面的溫度上升至接合所必要的溫度時,基板能夠保持 高抗形變強度,接合治具的壓應力能夠有效率地傳達至交 界面,並可以形成縛片與基板之間無縫隙的高強度接合。 較好為鋁合金,而基板的構成材料較好為銅。 藉由上述的散熱元件的製造方法,利用銅的高熱傳導 性而可以製造出咼散熱性能的散熱元件。 2036-5808B-PF 24 1270429 本卷月係又提供一種散熱兀件的製造方法,適用於將 相互之間具有一定間隔的複數個金屬製續片構成材,立設 並接合於-金屬製基板之-表面,包含:―元件配置步驟, 提供排列成相互之間具有一定間隔的複數個鰭片構成材, 其中每個鰭片構成材包含左右排列的—對鰭片,該對鰭片 2其端部相互連接之部分成為基端部,而形成呈現斷面凹 字型的上述鰭片構成材,並在上述續片構成材之間、與該 纣曰片之間’各置入一間隔物(spacer) ’並使上述鰭片構 成材的基端部接觸一基板之一表面,而使上述韓片構成材 立认於上述基板之一表面;一摩擦振動接合步驟,將一沿 圓周轉動的圓板狀接合治具的圓周面壓入上述基板之另一 表面’並沿著上述基板之另一表面移動’而使上述縛片構 成材的基端部接合於該基板;以及一間隔物脫離步驟,將 上述間隔物移除。 上述的散熱元件的製造方法與前一項之散熱元件的製 造方法約略相同,而使用斷面凹字型的鰭片構成材取代鰭 片。當然,在各鰭片構成材相互之間、以及鰭片構成材之 左右鰭片之間,可置入同種類或不同種類的間隔物。如此 一來,在鰭片構成材之左右鰭片的厚度非常薄的情況下, 鰭片構成材的基端部係在與基板重合的情形下與其接觸, 而能夠將鰭片確實地揍合於基板。雨鰭片構成材可如以下 所述簡單地製作而成:使用一間隔物置於一薄金屬板的中 央。p ’並考折上述薄金屬板,,而將士述間隔物夾在中 形成斷面凹字型的鰭片構成材。 2036-5808B-PF 25 1270429 /又_L述的散熱兀件的製造方法中,間隔物的構成材 料係為熔點高於鰭片構成材及基板的材料。 上述的散熱元件的製造方法中,因為間隔物的溶點高 於鰭片構缝及基板的熔點,將接合料的轉動數與行進 速度設定在既定的範圍時,就不會使間隔物接合於錯片構 成材/、基板上,基板與鰭片構成材的接合也變得較簡單。 又此時’在完成摩擦震動接合的階段,因為間隔物並 :接合於鰭片構成材與基板上,在最後的間隔物脫離步驟 時,就可以不費事地移除間隔物。例如將鰭片構成材及間 隔物朝下而將基板朝上而向上移動時,僅留下間隔物而僅 有鰭片構成材與基板-體地向上移動,而可以簡單地移除 間隔物,而完成散熱元件的製作。 又,上述的散熱元件的製造方法中,基板的構成材料 較好為溶點高於鰭片構成材的材料。 上述的散熱元件的製造方法中,因為在將縛片構成材 與基板交界面的溫度上升至接合所必要的溫度時,基板能 夠保持高抗形變強度,接合治具的壓應力能夠有效率地傳 達至父界面’並可以形成鰭片構成材與基板之間無縫隙的 高強度接合。 又,上述的散熱元件的製造方法+,鰭Η冓成材的構 成材料較好為鈒合金,而基板的構成材料較好為銅。 藉由上述的散熱元件的製造方法,利用銅的高熱傳導 性而可以製造出高散熱性能的散,熱兔件、。 本發明係又提供一種由上述的散熱元件製造方法所製 2036-5808B-PF 26 1270429 造的散熱元件。 由;上述的放熱元件係以上述的散熱元件製造方法所 製造,具有高散熱性能並可以低成本地製造。Without being bonded to the fins and the substrate, the spacers can be removed without difficulty when the spacers are removed from the final door. For example, when % vs. μ month and the spacer are facing downward and the substrate is moved upwards and upwards, only the τ spacer is left and only the fin and the substrate are moved up to the body', and the spacer can be simply removed. The manufacture of heat dissipating components. Further, in the above method for manufacturing a heat dissipating member, the constituent material φ of the substrate is preferably a material having a higher melting point than the fin. ▲. In the above method for manufacturing a heat dissipating member, since the temperature at the interface between the fin and the substrate is raised to a temperature necessary for bonding, the substrate can maintain high deformation strength, and the compressive stress of the bonding jig can be efficiently transmitted. To the interface, and can form a high-strength joint without gaps between the tab and the substrate. The aluminum alloy is preferred, and the constituent material of the substrate is preferably copper. According to the above-described method for manufacturing a heat dissipating member, it is possible to manufacture a heat dissipating member having heat dissipation performance by utilizing the high thermal conductivity of copper. 2036-5808B-PF 24 1270429 This volume also provides a method for manufacturing a heat dissipating member, which is suitable for arranging and joining a plurality of metal slab members having a certain interval therebetween, and erecting and joining the metal substrate. a surface comprising: a component arrangement step of providing a plurality of fin constituent materials arranged at a certain interval from each other, wherein each fin constituent material comprises a pair of fins arranged side by side, and a pair of fins 2 at the ends thereof The portion connected to each other is a base end portion, and the fin constituent material having a concave shape in a cross section is formed, and a spacer is placed between the splicing constituent materials and the cymbal sheet ( Spacer) 'and the base end portion of the above-mentioned fin constituent material is in contact with one surface of a substrate, so that the above-mentioned Korean sheet constituent material is recognized on one surface of the substrate; a frictional vibration bonding step, a circle rotating in the circumference a circumferential surface of the plate-shaped bonding fixture is pressed into the other surface of the substrate and moved along the other surface of the substrate to bond the base end portion of the tab member to the substrate; and a spacer disengagement step ,will The above spacers are removed. The above-described method of manufacturing the heat dissipating member is roughly the same as the method of manufacturing the heat dissipating member of the former, and the fin structure is replaced with a fin-shaped fin. Of course, spacers of the same type or different types may be placed between the fin constituent members and the left and right fins of the fin constituent material. In this way, when the thickness of the right and left fins of the fin constituent material is very thin, the base end portion of the fin constituent material is in contact with the substrate, and the fin can be surely coupled to the fin. Substrate. The rain fin constituent material can be simply fabricated as follows: a spacer is placed in the center of a thin metal plate. In the case of p ', the thin metal plate is folded, and the spacer is sandwiched between the spacers to form a fin-shaped fin structure. 2036-5808B-PF 25 1270429 / Further, in the method of manufacturing a heat sink element, the constituent material of the spacer is a material having a higher melting point than the fin constituent material and the substrate. In the above method for manufacturing a heat dissipating member, since the melting point of the spacer is higher than the fin structure and the melting point of the substrate, and the number of rotations of the bonding material and the traveling speed are set within a predetermined range, the spacer is not bonded to the spacer. On the wrong component/material, the bonding between the substrate and the fin constituent material is also relatively simple. At this time, at the stage of completion of the frictional vibration bonding, since the spacers are bonded to the fin constituent material and the substrate, the spacer can be removed without trouble in the final spacer detachment step. For example, when the fin constituent material and the spacer are facing downward and the substrate is moved upward and upward, only the spacer is left and only the fin constituent material and the substrate-body are moved upward, and the spacer can be simply removed. The fabrication of the heat dissipating component is completed. Further, in the above method for manufacturing a heat dissipating member, the constituent material of the substrate is preferably a material having a higher melting point than the fin constituent material. In the method for manufacturing a heat dissipating element described above, when the temperature at the interface between the tab constituent material and the substrate is raised to the temperature necessary for bonding, the substrate can maintain high deformation strength, and the compressive stress of the bonding jig can be efficiently transmitted. To the parent interface 'and can form a high-strength joint without a gap between the fin constituent material and the substrate. Further, in the above-described method for producing a heat dissipating member, the fin material is preferably a niobium alloy, and the material of the substrate is preferably copper. According to the above-described method for manufacturing a heat dissipating member, it is possible to produce a heat-dissipating heat-resistant rabbit piece by utilizing the high thermal conductivity of copper. The present invention further provides a heat dissipating member made of 2036-5808B-PF 26 1270429 manufactured by the above heat dissipating member manufacturing method. The heat radiating element described above is manufactured by the above-described heat radiating element manufacturing method, and has high heat dissipation performance and can be manufactured at low cost.

本發明係又提供一種散熱元件之製造用治具,包含: 鰭片固疋部’在一鰭片或一鰭片構成材與一間隔物呈交 重S的狀心下’固疋上述稽片或籍片構成材與上述間隔 物;以及-基板固定部,使一基板之一表面與上述鰭片或 籍片構成材的基端部接觸,助定上述基板。 上述的散熱元件之製造用治具係特別適用於目前為止 敛述過的方法,可以在摩擦震動接合時,媒實地固定鰭片 或鰭片構成材、間隔物、以及基板。 又,本發明的第三群組係提供—種散熱器,包含一散 熱元件與一風扇,並具有下列特徵:上述散熱元件具有一 銅基板與複數個銅鰭片或鋁鰭片,i /、γ上述鋼基板係導熱 性連接於一發熱體,上述鋼鰭片 Μ 乃4銘鰭片係相互之間具有 一定間隔且立設於上述基板之-表面;以及將-沿圓周轉 動的囫板狀接合治具的圓周面壓入上述鋼基板之另一表 面,並沿著上述銅基板之另一表 盐人、土址入 表面移動,而藉由摩擦振動 接5法,接5上述銅基板與上述銅韓片或紹籍片。 上述的散熱器,係為具有散熱元一 ,,、風扇之兩性能的 政…、益。上述政熱元件係在基板一 l 、〇 表面上立設並接合有 複數個相互之間具有一定間隔的鰭复 ^ ^ 中基板係由熱傳 導率極尚的銅所樣成,散熱霄片 一 u 乃係由妍或由熱傳導率略小 於銅的鋁所構成。而上述的基板 曰片係由摩擦震動接合 2036-5808B-PF 27 1270429 :所接合。這裡所謂的摩擦震動接合法是金屬&件間之接 口法中的-種,係藉由接合治具的壓應力,使各金屬元件 間的接合部的缝隙消a,並藉由轉動的接I治具與金屬元 件之接觸而產生的震動,使存在於金屬元件重合面之氧化 物皮膜分裂、破壞,再加上所產生的摩擦熱使接合部高溫 化並發生塑性變形,而增加接合部的接觸面積與擴散速 率,而使各金屬元件接合在一起的方法。The present invention further provides a jig for manufacturing a heat dissipating component, comprising: a fin fixing portion 'under a fin or a fin forming material and a spacer having a weight S. And the substrate constituent material and the spacer; and the substrate fixing portion, the surface of one of the substrates is brought into contact with the base end portion of the fin or the sheet constituent material to assist the substrate. The above-described jig for manufacturing a heat dissipating member is particularly suitable for the method which has been described so far, and it is possible to securely fix the fin or fin constituent material, the spacer, and the substrate at the time of frictional vibration bonding. Moreover, the third group of the present invention provides a heat sink comprising a heat dissipating component and a fan, and has the following features: the heat dissipating component has a copper substrate and a plurality of copper fins or aluminum fins, i /, γ The steel substrate is thermally connected to a heat generating body, and the steel fins are at a certain interval from each other and are erected on the surface of the substrate; and a slab-like shape that rotates circumferentially The circumferential surface of the bonding fixture is pressed into the other surface of the steel substrate, and moves along the other surface of the copper substrate and the surface of the copper substrate, and is connected to the copper substrate by friction vibration 5 The above-mentioned copper Korean film or Shaoguan film. The above-mentioned heat sink has the functions of heat dissipation element one, and two functions of the fan. The above-mentioned political heating element is erected on the surface of the substrate, and is bonded to a plurality of fins having a certain interval therebetween. The substrate is formed by copper having excellent thermal conductivity, and the heat-dissipating film is formed. It consists of yttrium or aluminum with a thermal conductivity slightly smaller than copper. The above substrate lining is joined by frictional vibration bonding 2036-5808B-PF 27 1270429. Here, the friction-vibration bonding method is a type in the interface method between the metal and the member, and the gap of the joint portion between the metal members is eliminated by the compressive stress of the bonding jig, and is rotated by the connection. The vibration generated by the contact between the I fixture and the metal component causes the oxide film existing on the overlapping surface of the metal component to split and break, and the frictional heat generated causes the joint portion to be heated and plastically deformed, and the joint portion is increased. The contact area and diffusion rate, and the method of joining the metal elements together.

而上述散熱器的散熱元件,係藉由接合治具的壓應 力,使基板與鰭片的對接部(butt)的缝隙消失,並藉由轉 動的接合治具與基板之接觸而產生的震動,使存在於上述 對接部之氧化物皮膜分裂、破土裏,再加上所產±的摩擦熱 使對接部高溫化並發生塑性變形,而增加對接部的接觸面 積與擴散速率,而使基板與鰭片接合在一起。如此,將基 板與鰭片以摩擦震動接合而接合,與習知的銲接接合比 較,可以低成本地製造出具有較高的基板與鰭片的接合強 度的散熱元件。 特別是,鰭片為銅時,雖然可以直接與基板接合;而 有鋁或鋁合金等熔點低於銅的金屬介於基板與銅鰭片之間 時,可以在較低的接合溫度之下完成摩擦震動接合,對設 備、電力等而言較為經濟。X,當鰭片係由熔點低於銅的 紹所構成時,在銅基板的一表面立設並配置銘鳍片,並使 用接合治具壓入銅基板的另一表面為接合時,在將銅基板 與銘鰭片的對接部的溫度上升玉接、合所要脅溫度(共晶 溫度:548t)而在對接部形成CuA12層時,鋼基板 2036-5808B-PF 28 1270429 有高抗形變強度,因為接合治具的壓應力可以有效地傳達 至對接部’而能夠形成對接部無縫隙、兩者以更高強度接 合的散熱元件。 本發明係又提供一種散熱器,包含一散熱元件與一風 扇,並具有下列特徵··上述散熱元件具有一銅基板、一鋁 基板、與複數個鋁鰭片,其中上述銅基板係導熱性連接於 一發熱體’上述鋁基板係重疊配置於該銅基板之一表面, 上述銘縛片係相互之間具有一定間隔且立設於上述鋁基板 十’與上述銅基板之相對侧之面;上述鋁基板與上述鋁鰭 片係藉由擠型(extrusi〇n)而一體成形;以及將一沿圓周轉 動的圓板狀接合治具的圓周面壓入上述銅基板之另一表 面,並沿者上述銅基板之另一表面移動,而藉由摩擦振動 接合法’接合上述銅基板與上述鋁基板。 上述的散熱器亦與前一項之散熱器同樣是具有散熱元 件與風扇的高性能散熱器;惟相異點是在散熱元件並非將 ”、、θ片直接立设並接合於銅基板上,而是事先已以擠型一體 成形之無元件一鰭片立設於基板上的鋁元件,上述鋁元件 的基板是重合並接合於銅基板上。而上述散熱器的散熱元 件係藉由接合治具的壓應力使銅基板與鋁基板的重合部的 縫隙消失,並藉由轉動的接合治具與基板之接觸而產生的 震動’使存在於上述重合部之氧化物皮膜分裂、破壞,再 加上所產生的摩擦熱使重合部高溫化並發生塑性變形,而 增加重合部的接觸面積與嘗散,逮率背使銅基板 接合在一起。如此,將銅基板與鋁基板以摩擦震動接合而 2036-5808B-PF 29 1270429 接合,與習知的銲接與爆炸壓接來作接合時比較,可以低 成本地製造出具有較高的銅基板與鋁基板的接合強度的散 熱元件。 當然,在銅基板的一表面重合並配置鋁基板,並使用 接合治具壓入銅基板的另一表面為接合時,在將重合部的 溫度上升至接合所必要的溫度(共晶溫度·· 548°C )而在重合 部形成CuA1 2層時’銅基板依然保有高抗形變強度,因為 接合治具的壓應力可以有效地傳達至·重合部,而能夠形成 重合部無缝隙、兩者以更高強度接合的散熱元件。 又,上述的散熱器中,發熱體與銅基板較好為以排熱 管(heat pipe)連接。 上述的散熱器中,由於發熱體與鋼基板係以排熱管連 接,可將散熱元件與風扇配置在離發熱體較遠的位置,如 薄型的筆記型電腦’要製作將熱排到發熱部位之附近的構 造有空間上的困難時,可以使用上述的散熱器。 • 又,本發明的第四群組係提供一種金屬元件接合方 法,包含:提供複數個金屬元件,依照溶點的高低順序相 互重合排列,·以及在上述金屬元件中溶點最高的金屬元件 之表面側,對上述金屬元件之重合部加熱及加麼,而使上 述金屬元件相互接合。 上述的金屬元件接衫 互重合配置,而由重合部最外側的金屬元件之一侧加執及 加麼’使重合部的縫隙消失,並使存在於重合部之氧化物 皮膜分裂'破壞’再加上藉由加熱使重合部高溫化並發生 2036-5808B-PF 30 1270429 塑性變形,而增加重合部的接觸 金屬元件接合在一起。 面積與擴散速率 而使各 由於上述的複數個金屬元件係依照溶點的高低順序相 重合排列’並在熔點最高的金屬元件之側加熱及加壓, 將各金屬元件的重合部的溫度上升至接合所必要的” :,加熱及加麼側的金屬元件依然保有高抗形變強度,: 合治具的壓應力可以有效地傳達至交界面,而能夠形成金 鲁4元件間無縫隙與高強度的接合。例如將銅元件與紹元件 重合時,係在銅元件之側對重合部加壓及加熱。 而上述加壓及加熱的方法並沒有特別的限制,可以在 溶點最高的金屬元件的表面使用任何的治具與其接觸,而 可使用任何可藉由上述治具將摩擦熱與壓應力傳達至重合 部的接觸方式,亦可以使用如電磁誘導等非接觸方式。 本發明係又提供-種金屬元件接合方法,適用於將相 互之間具有一定間隔的複數個金屬製板材,立設並接合於 • 熔點高於該些板材之熔點的一金屬製基板之一表面,包 含·一 7L件配置步騾,在排列成相互之間具有一定間隔的 上述金屬製板材之間,各置入一間隔物(spacer),並將上 述板材立設於上述基板之一表面;一接合步驟,由上述基 板之另一表面,對上述基板及上述板材的交界面加熱及加 壓,而使上述板材接合於土述基板;以及一間隔物脫^ 驟’將上述間隔物移除。 上述的金屬元件接合方,法栌,t先在元令配,置:步驟 時,將板材、基板、與間隔物設定至一既定位置。上述板 2036-5808B-PF 31 1270429 材與基板係為金屬製,基板的炼點高於板材的熔點。間隔 的材質並有特別的限制。間隔物的形狀亦沒有特別的 限制,較好是各間隔物之間有相互連結。 此時,在各板材相互之間分別置入一間隔物,可以正 確㈣持板材相互之間隔,並簡單地決定其位置;再加上 可藉由間隔物將板材補強,板材的厚度可以變得非常薄。 又’僅需要變更間隔物的厚度,就可以任意變更板材的配 Φ 置間隔;更者,亦可以一併變更板材的高度,而使得特別 將薄板厚、南板高的複數個板材以短間隔立設並接合於基 板的-表面變得可行。而在此步射,各板材立設並配^ 於基板的一表面的狀態下,雖然各間隔物可以不與板材的 該表面直接接觸;而如果考慮到下一個步驟中來自接合治 具的壓應力使板材受到彎曲應力的作用,為了提高間隔物 對板材的補強效果,較好為使各間隔物直接接觸基板的該 表面。 • 又,在接下來的接合步驟中,由基板的另一表面對該 基板與各板材的交界面加熱及加壓,而使基板與各板材接 合。此處的接合原理與前一項的金屬元件接合方法相同。 而為了要k南基板與板材之接合強度,較好為各板材的基 端面能完全與基板接合;而在接合成本的削減較為重要 時,亦可以僅使各板材基端面的一部份與基板接合。又, 將基板與各板材接合時,雖然亦可以使各間隔物與基板接 泛’而如果考慮到移除間隔物的下< 一^個&步驟$,較好為 <不使 基板與各間隔物接合。 2036-5808B-PF 32 1270429 本發明更提供一種散熱元件的製造方法,適用於將相 互之間具有一定間隔的複數個金屬製鰭片構成材,立設並 接合於熔點高於該些鰭片構成材之熔點的一金屬製基板之 一表面,包含:一元件配置步驟,其中排列成相互之間具 有一定間隔的該些鰭片構成材中,每個鰭片構成材包含左 右排列的一對鰭片,該對鰭片以其端部相互連揍之部分成 為基端部,而形成呈現斷面凹字型的上述鰭片構成材,並 在上述鰭片構成材之間、與該對鰭片之間,各置入一間隔 物(spacer),並使上述鰭片構成材的基端部接觸上述基板 之一表面,而使上述鰭片構成材立設於上述基板之一表 面,一接合步驟,由該基板之另一表面,對上述基板及上 述鰭片構成材的交界面加熱及加壓,而使上述鰭片構成材 接合於上述基板;以及一間隔物脫離步驟,將上述間隔物 移除。 上述的散熱兀件的製造方法中,係應用上述的金屬元 鲁件接合方法,將斷面凹字型_片構成材作為板材。當然, 在各縛片構成材相互之間、以及籍片構成材之左右籍片之 間,可置入同種類或不同種類的間隔物。如此一來,在鰭 片構成材之左右鰭片的厚度非常薄的情況下,鳍片構成材 的基端。P係在與基板重合的情形下與其接觸,而能夠將縛 片確實地接合於基板。鰭片構成材與基板的接合原理已經 說明了。而鰭片構成材可如以下所述簡單地製作而成:使 用一間隔物置於一薄金屬板前中實寺,並管折士述薄金屬 板,而將上述間隔物夾在中間,形成斷面凹字型的韓片構The heat dissipating component of the heat sink is such that the gap between the substrate and the fin butt is eliminated by the compressive stress of the bonding jig, and the vibration generated by the contact of the rotating jig and the substrate is caused by the vibration. The oxide film existing in the butting portion is split and broken, and the friction heat generated by the ± is heated to cause the butt portion to be heated and plastically deformed, thereby increasing the contact area and the diffusion rate of the butting portion, and the substrate and the fin. The pieces are joined together. Thus, the substrate and the fin are joined by frictional vibration bonding, and a heat dissipating member having a high bonding strength between the substrate and the fin can be manufactured at a low cost in comparison with a conventional solder joint. In particular, when the fin is copper, although it can be directly bonded to the substrate; and a metal such as aluminum or aluminum alloy having a lower melting point than copper is interposed between the substrate and the copper fin, it can be completed at a lower bonding temperature. Friction and vibration bonding is economical for equipment and electricity. X, when the fins are composed of a melting point lower than that of copper, the erect fins are erected and disposed on one surface of the copper substrate, and the other surface of the copper substrate is bonded using the bonding jig for bonding. When the temperature of the abutting portion of the copper substrate and the slab is increased, the temperature of the joint (the eutectic temperature: 548t) is reached, and when the CuA12 layer is formed at the butt portion, the steel substrate 2036-5808B-PF 28 1270429 has high deformation strength. Since the compressive stress of the joining jig can be effectively transmitted to the abutting portion ', it is possible to form a heat dissipating member in which the abutting portion has no gap and the two are joined with higher strength. The invention further provides a heat sink comprising a heat dissipating component and a fan, and having the following features: The heat dissipating component has a copper substrate, an aluminum substrate, and a plurality of aluminum fins, wherein the copper substrate is thermally connected The aluminum substrate is superimposed on one surface of the copper substrate, and the indicia sheets are disposed at a predetermined interval between the aluminum substrate and the copper substrate; The aluminum substrate and the aluminum fin are integrally formed by extrusion; and a circumferential surface of a circumferentially rotating disc-shaped bonding fixture is pressed into the other surface of the copper substrate, and The other surface of the copper substrate is moved, and the copper substrate and the aluminum substrate are joined by frictional vibration bonding. The above heat sink is also a high-performance heat sink with a heat dissipating component and a fan as the heat sink of the previous item; the only difference is that the heat dissipating component is not erected and the θ piece is directly erected and bonded to the copper substrate. The aluminum element is formed on the substrate by a one-piece fin that has been integrally formed by extrusion, and the substrate of the aluminum element is bonded and bonded to the copper substrate. The heat dissipating component of the heat sink is bonded. The compressive stress causes the gap between the copper substrate and the aluminum substrate to disappear, and the vibration generated by the contact of the rotating bonding jig with the substrate causes the oxide film existing in the overlapping portion to be split and destroyed, and then added. The frictional heat generated on the upper surface causes the superposed portion to be heated and plastically deformed, and the contact area and the taste of the overlapping portion are increased, and the copper substrate is bonded together by the catching rate. Thus, the copper substrate and the aluminum substrate are joined by frictional vibration. 2036-5808B-PF 29 1270429 bonding, which can produce a high bonding strength between a copper substrate and an aluminum substrate at a low cost compared with conventional soldering and explosion bonding. Of course, when the aluminum substrate is placed on one surface of the copper substrate and the other surface of the copper substrate is bonded using the bonding jig, the temperature of the overlapping portion is raised to the temperature necessary for bonding (eutectic). Temperature · · 548 ° C) When the CuA1 2 layer is formed in the overlapping portion, the copper substrate retains high deformation strength, because the compressive stress of the bonding fixture can be effectively transmitted to the overlapping portion, and the overlapping portion can be formed without gaps. Further, in the heat sink described above, the heat generating body and the copper substrate are preferably connected by a heat pipe. In the heat sink described above, the heat generating body and the steel substrate are The heat-dissipating pipe connection can dispose the heat-dissipating component and the fan at a position far from the heat-generating body, and the thin-type notebook computer can use the above-mentioned structure when it is difficult to make a structure in which heat is discharged to the vicinity of the heat-generating part. Further, the fourth group of the present invention provides a metal component bonding method, comprising: providing a plurality of metal components, which coincide with each other according to the order of the melting points And the surface side of the metal element having the highest melting point in the metal element, and heating and adding the overlapping portion of the metal element to bond the metal elements to each other. The metal element shirts are arranged to overlap each other. By adding and holding one of the outermost metal members of the overlapping portion, the gap of the overlapping portion is eliminated, and the oxide film existing in the overlapping portion is broken and broken, and the overlapping portion is heated by heating. 2036-5808B-PF 30 1270429 plastic deformation occurs, and the contact metal elements of the overlapping portion are joined together. The area and the diffusion rate are such that each of the plurality of metal elements is arranged in the order of the melting point. The side of the metal element with the highest melting point is heated and pressurized, and the temperature of the overlapping portion of each metal element is raised to the extent necessary for bonding: : The metal element heated and added still retains high deformation strength, The compressive stress can be effectively transmitted to the interface, and a gapless and high-strength joint between the elements of the Jinlu 4 can be formed. For example, when the copper element and the element are overlapped, the overlapping portion is pressurized and heated on the side of the copper element. The above method of pressurizing and heating is not particularly limited, and any jig can be used in contact with the surface of the metal element having the highest melting point, and any frictional heat and compressive stress can be transmitted to the surface by using the above jig. The contact mode of the coincidence portion can also be used in a non-contact manner such as electromagnetic induction. The invention further provides a metal component bonding method, which is suitable for erecting and bonding a plurality of metal plate materials having a certain interval therebetween to one surface of a metal substrate having a melting point higher than a melting point of the plates. a 7L arrangement step, wherein spacers are disposed between the metal sheets arranged at a certain interval from each other, and the sheets are erected on one surface of the substrate; a bonding step of heating and pressurizing the interface between the substrate and the plate by the other surface of the substrate to bond the plate to the substrate; and a spacer removing the spacer . In the above-mentioned metal element joining method, the method is to first set the sheet, the substrate, and the spacer to a predetermined position. The above-mentioned plate 2036-5808B-PF 31 1270429 is made of metal and the substrate is made higher than the melting point of the plate. The spacing of the material is subject to special restrictions. The shape of the spacer is also not particularly limited, and it is preferred that the spacers are connected to each other. At this time, a spacer is placed between each of the plates, so that the plates can be correctly spaced (4) and the position of the plates can be easily determined; and the plate can be reinforced by the spacers, and the thickness of the plate can be changed. very thin. In addition, it is only necessary to change the thickness of the spacer, and the spacing between the plates can be arbitrarily changed. Alternatively, the height of the plate can be changed together, so that the plurality of plates having a thin plate thickness and a south plate height are particularly short-circuited. It is feasible to erect and bond to the surface of the substrate. In this step, in the state in which the sheets are erected and disposed on one surface of the substrate, although the spacers may not directly contact the surface of the sheet; and if the pressure from the joining jig in the next step is taken into consideration The stress causes the sheet to be subjected to bending stress. In order to improve the reinforcing effect of the spacer on the sheet, it is preferred that each spacer directly contacts the surface of the substrate. • In the subsequent bonding step, the interface between the substrate and each of the sheets is heated and pressurized by the other surface of the substrate, and the substrate is bonded to each of the sheets. The joining principle here is the same as the joining method of the metal element of the previous item. In order to achieve the bonding strength between the substrate and the sheet, it is preferred that the base end of each sheet can be completely bonded to the substrate; and when the reduction of the joint cost is important, only a part of the base end of each sheet and the substrate can be used. Engage. Further, when the substrate is bonded to each of the sheets, the spacers may be attached to the substrate, and if the lower portion of the spacer is removed, it is preferably < Engaged with each spacer. 2036-5808B-PF 32 1270429 The present invention further provides a method for manufacturing a heat dissipating component, which is suitable for forming a plurality of metal fin constituent materials having a certain interval from each other, and is erected and joined to a melting point higher than the fins. a surface of a metal substrate having a melting point of the material, comprising: a component disposing step in which the fin constituent materials are arranged at a certain interval from each other, each fin constituent material comprising a pair of fins arranged side by side a fin, the pair of fins having their ends connected to each other as a base end portion, and forming the fin constituent material having a concave shape in a cross section, and between the fin constituent materials and the pair of fins Between each spacer, a base end portion of the fin constituent material is brought into contact with a surface of the substrate, and the fin constituent material is erected on one surface of the substrate, and a bonding step Heating and pressurizing the interface between the substrate and the fin constituent material on the other surface of the substrate, and bonding the fin constituent material to the substrate; and a spacer removing step to divide the interval Removed. In the above method for manufacturing a heat dissipating member, the above-described metal element joining method is employed, and the cross-sectional concave type sheet member is used as a sheet material. Of course, spacers of the same type or different types may be placed between the respective constituent members of the binder and the left and right sheets of the constituent members of the sheet. As a result, in the case where the thickness of the left and right fins of the fin constituent material is very thin, the fin constitutes the base end of the material. P is in contact with the substrate in the case of being overlapped with the substrate, and the die can be surely bonded to the substrate. The principle of bonding the fin constituent material to the substrate has been explained. The fin constituent material can be simply fabricated as follows: a spacer is placed in front of a thin metal plate in the middle of the temple, and the thin metal plate is folded, and the spacer is sandwiched to form a section. Concave-shaped Korean structure

2036-5808B-PF 33 ^70429 成材。 而上述的金屬元件接人方汰 、 俾臉 口 中’上述的加熱及加壓, 板之::圓周轉動的圓板狀接合治具的圓周面壓至上述基 移動表面’並使上述圓周面沿著上述基板的另-表面 秒勒,且上述接合治具的圓周 轉動 ° 上,較好為形成有相對於 動方向輕微傾斜、且連續的凹槽。 俜將 料金屬70件接合方法中,上述的加熱及加壓, 係將一沿圓周轉動的圓板狀接合治且 板之另-表面,並使上述圓周面沿著上:|至上述基 移動,且上述接合治具的圓周面上,乾好^板的另一表面 轉動方向輕微傾斜、且連續的凹槽/乂好為形成有相對於 壓,::述=件的製造方法中,上述的加熱及加 ’並使上述圓周面沿著上述基板的另- 對於轉動二上述接合治具的圓周面上’較好為形成有相 對於轉動方向輕微傾斜、且連續的凹槽。 狀接2二屬元件接合方法,係將“圓周轉動的圓板 :二的圓周面麼入熔點最高的金屬元 1 吏上述0周面沿著該金屬元件的表面移動,而對重人邱加 …及加壓’因而可以期待確實的接合勝過簡易的裝置。 此處,因為接合治具的圓周面H 、 接合治具的圓周面與金屬元件的接觸面=槽— 產生摩擦熱m有效率鱗複 ^有效率地 更者,接合治具的圓周面上的凹;件相互接合。 胃係相對於轉動方 2036~~5808B—Pf 34 1270429 向輕微傾斜、且連續的凹槽,人、 邊’沿著接合治具的圓月产 °治具轉動軸的周 此,伴隨著接合治具的螺旋狀—成。因 塑化的金屬會沿著接合::的【;方:槽内部所蓄積的可 以將接合後金屬元件表面殘出因此了 戈一的凹入罝抑制到最小限度。 而前面所述及的内容在 合在上述金屬元件接合方法與上 述政熱元件的製造方法中也是一樣。 又,上述的金屬元件接合方法中,上述凹槽之間的平 面部的寬度為上述凹槽的寬度$ w2(随),並較好 為符合以下條件:仏⑷、且k化3、且〇._wl/w2 $5.00。 又’上述的金屬元件接合方法中,上述凹槽之間的平 面部的寬度為wl(mm)、上述凹槽的寬度為w2(mm),並較好 為符合以下條件心心5、且匕⑴、且G 67^i/w2 € 5· 〇〇 〇 _ ^又,上述的散熱元件的製造方法中,上述凹槽之間的 平面部的寬度為wl(mm)、上述凹槽的寬度為w2(min),並較 好為符合以下條件:lSwlg5、且且〇·67$ wl/w2^ 5. 00 〇 關於上述的金屬元件接合方法,接合治具之凹槽之間 的平面部的寬度 的寬度wl與凹槽的寬度w2的的比值係發明人們重複實驗 時:當wl/w2過小時,因為金屬元件脅表面狀況會韻似於 受到接合治具的切削’接合治具所產生摩擦熱的產生量就 352036-5808B-PF 33 ^70429 成材. And the above-mentioned metal element is connected to the human face, and the above-mentioned heating and pressurization is performed, and the circumferential surface of the circular-plate-shaped joint jig of the circumferential rotation is pressed to the base moving surface' and the circumferential surface is On the other surface of the substrate, and in the circumferential rotation of the bonding jig, it is preferable to form a groove which is slightly inclined and continuous with respect to the moving direction. In the method of joining 70 pieces of metal, the above-mentioned heating and pressurization is to form a circumferentially rotating disc-shaped joint and the other surface of the plate, and move the circumferential surface along the upper:| to the base And on the circumferential surface of the above-mentioned joint jig, the other surface of the dry plate is slightly inclined in the direction of rotation, and the continuous groove/乂 is formed to be formed with respect to the pressure, in the manufacturing method of the above-mentioned member, The heating and the addition of the circumferential surface along the circumferential surface of the substrate to the second substrate are preferably formed with a slightly inclined and continuous groove with respect to the direction of rotation. The joining method of the two elements is to "circumferentially rotate the circular plate: the circumferential surface of the two into the metal element 1 having the highest melting point, the above-mentioned 0-circumferential surface moves along the surface of the metal element, and the heavy man Qiujia ...and pressurization', it is expected that a reliable joint will outperform a simple device. Here, since the circumferential surface H of the jig, the contact surface of the jig and the contact surface of the metal member = groove - the frictional heat is generated efficiently. The scales are more efficient, and the concave surfaces on the circumferential surface of the jig are joined; the pieces are joined to each other. The stomach system is slightly inclined and continuous with respect to the rotating side 2036~~5808B-Pf 34 1270429, the person and the side 'The circumference of the rotating shaft along the joint fixture is accompanied by the spiral shape of the jig. The plasticized metal will follow the joint::; The surface of the metal element after the bonding can be eliminated, so that the recessed enthalpy of the genus is suppressed to a minimum. The foregoing is also the same in the method of bonding the metal element described above and the method of manufacturing the above-mentioned galvanic element. Moreover, the above metal component is connected In the method, the width of the plane portion between the grooves is the width of the groove of $w2 (following), and preferably meets the following conditions: 仏(4), k3, and 〇._wl/w2 $5.00. In the above-described metal element bonding method, the width of the plane portion between the grooves is wl (mm), and the width of the groove is w2 (mm), and it is preferable that the core 5 is satisfied and 匕(1), Further, in the above method for manufacturing a heat dissipating member, the width of the flat portion between the grooves is w1 (mm), and the width of the groove is w2 ( Min), and preferably meets the following conditions: lSwlg5, and 〇·67$ wl/w2^ 5. 00 〇 Regarding the above-described metal member joining method, the width of the width of the flat portion between the grooves of the joining jig The ratio of wl to the width w2 of the groove is the result of repeated experiments by the inventors: when wl/w2 is too small, the surface condition of the metal component will be similar to the friction heat generated by the cutting fixture of the joining fixture. The amount is 35

2036-5808B-PF 1270429 會較大,接合後殘留於金屬元侏 旰表面的凹陷量就會 大;另一方面,當Wl/w2過大時, 侍車又 U為會類似於使 面平坦的圓周面的接合治具來作 "、表 求作接合時的狀況,接合仏 所產生摩擦熱的產生量就會較小,接人▲广 〜具 表面的壓入篁就必須增加,機械負荷亦會增大;而 件 wl$5、且 l$w2S3、且 〇R7< 1 / 1 各 = Wl/w2g5.00 時,很 地不但可以抑制接合治具壓入金 乃顯 I屬兀件表面的壓入量, 合治具所產生摩擦熱的產生量就 獲 率的接合。 μ亦會車父大’而能夠行有效 又,上述的金屬元件接合方法中,較好為上述凹 對於上述接合治具的轉動方向傾斜的角度為〇 ".〇。:目 上述接合治具的整個圓周面中,至少形成有二條上述凹槽且 又,上述的金屬元件接合方法中,較好為上述日 對於上述接合治具的轉動方向傾斜的角度為 上述接合治具的整個圓周面中,至少形成有二條上述凹槽 又,上述的散熱元件的製造方法中,較好為上述凹曰 相對於上述接合治具的轉動方向傾斜的角度為。· 5 且上述接合治具的整個圓周面中,至少形成有二條上述凹 槽。 關於上述的金屬元件接合方法,接合治具圓周面上之 之凹槽的傾斜角度备 角度小於〇 · 5時,凹槽內Jqj拼苦^ ^ 價内邛所畜積的可塑化的金屬就無法 、沿著接合治具的寬彦方& $ /、叼克度方向依序送出,,接合治具通過後就會 在金屬元件表面殘留毛⑯町);另一方面’當凹槽的傾 2036-5808B-PF 36 1270429 斜角度大於2.0。時,切粉的排出量就會變大,不但會使殘 留於金屬元件表面的凹痕變大,”加大機械負荷:而在 凹槽的傾斜角度為0.5~2.0。時,报明顯地就不會有上述的 弊害。而考慮到接合治具的寬度’上述接合治具的整個圓 周面中’較好為至少形成有二條上述凹槽。 而前面所述及的内容,在上述金屬元件接合方法與上 述散熱元件的製造方法中也是一樣。 又,上述的金屬元件接合方法中,上述凹槽的深度較 妤為 0. 30〜1. 2mm。 又,上述的金屬元件接合方法中,上述凹槽的深度較 好為 0· 30〜1. 2mm。 又,上述的散熱元件的製造方法中,上述凹槽的深度 較好為0.30〜1.2mm。 關於上述的金屬元件接合方法,接合治具圓周面上之 凹槽的深度係發明人們重複實驗時:當凹槽的深度小於 0.30mm時,可塑化的金屬會蓄積於凹槽内部,使接:治具 所產生的摩擦熱的發生量減少’而無法行充分的接人另 -方面,當凹槽的深度大於"咖時,因為金屬㈣的表 面狀況會類似於受到接合治具的切削,接合治具所產生摩 擦熱的產生量就會較大,接合後殘留於金屬元件表面的凹 陷量就會變得較大;而凹槽的深度為〇. 34〜1. 2_磚M 顯地就不會有上述的弊害。 ^ ^ ^ ® ^ ^ ^ ^ ^ ^ ^ ^ # # ^ ^ ^ ^ 述散熱元件的製造方法中也是一樣。2036-5808B-PF 1270429 will be larger, and the amount of depression remaining on the surface of the metal element will be large after joining; on the other hand, when Wl/w2 is too large, the car will be similar to the circumference of the flat surface. The surface of the joint fixture is used for the condition of the joint, and the amount of friction heat generated by the joint 就会 is small, and it is necessary to increase the mechanical load of the surface. Will increase; and w1$5, and l$w2S3, and 〇R7< 1 / 1 each = Wl/w2g5.00, it can not only inhibit the pressing of the bonding fixture into the surface of the metal element. The amount of friction heat generated by the fixture is the joint of the yield. In the metal element joining method described above, it is preferable that the angle at which the concave portion is inclined with respect to the rotation direction of the joining jig is 〇 ". At least one of the grooves is formed in the entire circumferential surface of the joint jig, and in the above-described method of joining the metal members, it is preferable that the angle at which the rotation direction of the joint jig is inclined is the above-mentioned joint treatment. In the entire circumferential surface of the tool, at least two of the grooves are formed. In the method of manufacturing the heat dissipating member, it is preferable that the angle of the concave portion is inclined with respect to the rotation direction of the bonding jig. Further, at least two of the grooves are formed in the entire circumferential surface of the joint jig. With regard to the above-described metal element joining method, when the angle of inclination of the groove on the circumferential surface of the joint jig is less than 〇·5, the plasticized metal in the groove of the Jqj is hard to be smashed. , along the direction of the Kuanhiko & $ /, 叼 度 接合 接合 接合 接合 接合 接合 依 接合 接合 接合 接合 依 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 凹槽 凹槽 凹槽 凹槽 凹槽 凹槽 凹槽2036-5808B-PF 36 1270429 The oblique angle is greater than 2.0. When the amount of cut powder is increased, not only will the dents remaining on the surface of the metal component become larger," the mechanical load is increased: while the inclination angle of the groove is 0.5 to 2.0, it is noticeable In view of the width of the joining jig, 'the entire circumferential surface of the joining jig' is preferably formed with at least two grooves. The foregoing describes the joining of the above metal members. The method of the above-described metal element bonding method, wherein the recessed portion has a depth of less than 0.30~1. 2mm. Further, in the above method for manufacturing a heat dissipating member, the depth of the groove is preferably from 0.30 to 1.2 mm. The metal element joining method described above is a joint jig circumference. The depth of the groove on the surface is repeated by the inventors: when the depth of the groove is less than 0.30 mm, the plasticized metal will accumulate inside the groove, so that the amount of friction heat generated by the jig is reduced. and It is impossible to make a full access. In other respects, when the depth of the groove is larger than the "Coffee", since the surface condition of the metal (4) is similar to the cutting by the jig, the amount of friction heat generated by the jig is higher. Large, the amount of recess remaining on the surface of the metal component after bonding will become larger; and the depth of the groove is 〇. 34~1. 2_ Brick M will not have the above disadvantages. ^ ^ ^ ® ^ ^ ^ ^ ^ ^ ^ ^ # # ^ ^ ^ ^ The same is true for the manufacturing method of the heat dissipating component.

2036-5808B-PF 37 1270429 、又,本發明的第五群組,係提供一種金屬元件接合方 法,包含:―第—步驟,將-第—金屬元件與、熔點高於上 述第一金屬元件的熔點的一第二金屬元件重合;以及一第 一步驟’由上述第一金屬&件向上述第一金屬纟件加壓並 加熱,而使上述第-金屬元件與上述第二金屬元件相互接 合0 上述的金屬元件接合方法中,係將第一及第二金屬元 件相互重合配置…第二金屬元件之一側加熱及加壓, 使重合部的縫隙消《,並使存在於重合部之氧化物皮膜分 裂、破壞’再加上藉由加熱使重合部高溫化並發生塑性變 形,而增加重合部的接觸面積與擴散速率,而使各金屬元 件接合在一起。 而特別是,上述的金屬元件接合方法,係由溶點互異 的二金屬元件—第一金屬元件與熔點高於第一金屬元件的 溶點的第二金屬元件—重合排列,並在溶點較高的第二金 屬元件之側朝第-金屬元件的方向加壓並加熱而構成。在 這樣的金屬元件接合方法中,將第一金屬元件與第二金屬 元件的重合部的溫度上升至接合所必要的溫度時,熔點較 高的第二金屬元件依然保有高抗形變強度,來自第二金屬 元件的壓應力可以有效地傳達至交界面。因此,藉由上述 縫隙與高強度的接合,而能夠將第一及第二金屬元件做高 強度地接合。 而上述加麼及加熱的方法並沒有特別的限制,可以在 2036-5808B-PF 38 1270429 而可使用 合部的接 第二金屬元件的表面使用任何的治具與其接觸, 任何可藉將摩擦熱與壓應力傳達至重 觸方式’亦可以使用如電磁誘導等非接觸方式。2036-5808B-PF 37 1270429 Further, a fifth group of the present invention provides a metal component bonding method comprising: a first step, a -metal element, and a melting point higher than the first metal component a second metal component of the melting point is superposed; and a first step 'pressing and heating the first metal member to the first metal member to bond the first metal member and the second metal member In the metal element bonding method described above, the first and second metal elements are placed one on another, and one side of the second metal element is heated and pressurized to eliminate the gap of the overlapping portion and to cause oxidation in the overlapping portion. The film splitting and breaking is combined with the high temperature and plastic deformation of the overlapping portion by heating to increase the contact area and the diffusion rate of the overlapping portion, thereby joining the metal members together. In particular, the metal element bonding method described above is a method in which a two-metal element having a different melting point, a first metal element, and a second metal element having a melting point higher than a melting point of the first metal element are arranged in a coincident manner, and is in a melting point. The side of the higher second metal member is pressed and heated in the direction of the first metal member. In such a metal element bonding method, when the temperature of the overlapping portion of the first metal element and the second metal element is raised to a temperature necessary for bonding, the second metal element having a higher melting point retains high deformation strength, from The compressive stress of the two metal components can be effectively communicated to the interface. Therefore, the first and second metal members can be joined with high strength by the above-described slit and high-strength bonding. The above method of adding and heating is not particularly limited, and may be used at 2036-5808B-PF 38 1270429, and the surface of the second metal component which can be used in combination may be contacted with any jig, and any friction heat may be used. Non-contact methods such as electromagnetic induction can also be used to convey the stress to the heavy-touch mode.

又,上述的金屬元件接合方法中,上述的第二步驟, 較好為使用會轉動的圓板狀接合治具的板面壓在上述第二 金屬元件,並使該板面沿著上述第二金屬元件的表面移動。 上述的金屬元件接合方法,係將轉動的圓板狀接合治 的板面(與接合治具的轉動軸交叉的平面)壓在上述第二 金屬元件,並使該板面沿著上述第二金屬元件的表面移 對重s邛行加熱及加屢〜因此,藉由此金屬元件接合 方法,可以期待使用簡易的襞置作確實的接合。又在此金 屬元件接合方法中,因為接合治具的板面與第二金屬元件 的表面接觸,接合治具的徑愈大,加熱及加壓的範圍就可 以擴大。 本發明係又提供一種散熱元件的製造方法,包含:一 _ 第步驟,將一第一金屬元件與熔點高於上述第一金屬元 件的熔點的一第二金屬元件重合;一第二步驟,由上述第 二金屬元件向上述第一金屬元件加壓並加熱,而使上述第 金屬元件與上述第二金屬元件相互接合;以及一第三步 驟’對上述第一金屬元件施以鍛造加工,而在上述第二金 屬元件上立設複數俩散熱鰭片。 本發明係又提供一種散熱元件的製造方法,包含:一 第一步驟’將一第一金屬元件與熔點、裔於土述第—,金:屬元 件的溶點的一第二金屬元件重合;一第二步驟,由上述第 2036-5808B-PF 39 1270429 二金屬元件向上述第一金屬元件加壓並加熱,而使上述第 一金屬元件與上述第二金屬元件相互揍合;以及—第 驟,對上述第一金屬元件施以切削加工,形成複數個狹缝 (slit)於上述第一金屬元件,而在上述第二金屬元件上立 設複數個散熱鰭片。 前二項的散熱元件的製造方法中的第一步驟與第二步 驟,與前一項的金屬元件接合方法的第一步驟與第二步驟 相同。而上述的散熱元件的製造方法中,經由分別之第一 步驟與第二步驟接合的第一及第二金屬元件中,對該第= 金屬元件施以鍛造加工或切削加工,從而形成散熱鰭片。 因此,藉錢樣的散熱元件㈣造方法,與㈣的發 明-樣,不但可以藉由簡#的裝置確實地接合第—及第二 金屬元件,並可以使用鍛造加工與切削加工等簡單的加: 法形成散熱鰭片。 又’本發明之散熱元件,係舍会· ,^ 3 ·複數個散熱鰭片, 由斷面呈現[字形的板材所構成,其 及一基板,其材質為第二金屬,且 屬,以 於上述第-金屬的熔點;i中上…第二金屬的溶點高 合,係制上述的金屬元件接合方法^片與該基板之接 又,本發明之散熱元件,係 及一基板,其材質為第二金屬,且上述第,、屬,以 於上述第一金屬的熔點;其 、/一金屬的熔點高Further, in the above-described metal element bonding method, in the second step, it is preferable that a plate surface of the disk-shaped bonding jig that rotates is pressed against the second metal element, and the plate surface is along the second surface. The surface of the metal component moves. The metal element joining method described above is to press a rotating disk-shaped joining plate surface (a plane intersecting the rotating shaft of the joining jig) against the second metal member, and the plate surface is along the second metal. The surface of the element is heated and added to the weight s. Therefore, by the metal element bonding method, it is expected that the simple bonding can be performed using a simple device. Further, in the metal element bonding method, since the plate surface of the bonding jig is in contact with the surface of the second metal member, the larger the diameter of the bonding jig, the wider the range of heating and pressurization. The invention further provides a method for manufacturing a heat dissipating component, comprising: a step of: superposing a first metal component with a second metal component having a melting point higher than a melting point of the first metal component; The second metal member pressurizes and heats the first metal member to bond the third metal member and the second metal member to each other; and a third step 'forging the first metal member, and A plurality of heat dissipation fins are vertically disposed on the second metal component. The invention further provides a method for manufacturing a heat dissipating component, comprising: a first step of 'coinciding a first metal component with a second metal component of a melting point, a source of the earth, and a melting point of the gold component; a second step of pressurizing and heating the first metal component by the second metal component of the 2036-5808B-PF 39 1270429, and the first metal component and the second metal component are coupled to each other; and - the first step The first metal component is subjected to a cutting process to form a plurality of slits on the first metal component, and a plurality of heat dissipation fins are vertically disposed on the second metal component. The first step and the second step in the method of manufacturing the heat dissipating member of the first two items are the same as the first step and the second step of the metal element joining method of the preceding item. In the above method for manufacturing a heat dissipating component, the first metal component is subjected to forging or cutting processing through the first and second metal members joined by the first step and the second step, respectively, thereby forming a heat dissipating fin . Therefore, the borrowing method of the heat-dissipating component (fourth) and the invention of (4) can not only reliably join the first and second metal components by the device of the simple #, but also use a simple addition such as forging and cutting. : The method forms heat sink fins. Further, the heat dissipating component of the present invention is a plurality of heat dissipating fins, which are formed by a section of a glyph, and a substrate which is made of a second metal and belongs to The melting point of the first metal, the upper point of the second metal, the melting point of the second metal, the bonding method of the metal element described above, and the substrate, the heat dissipating component of the present invention, and a substrate, the material thereof Is a second metal, and the above, the genus, the melting point of the first metal; the melting point of the / metal

2036-5808B-PF 40 1270429 又,,發明之散熱元件,係包含:複 韓片,其材質為第一金屬 質為第二金屬,且該篦_as 具材 屬的熔點高於上述第-金屬的 溶點,其中上述散熱鰭片盥 一 一上述基板之接合,係使用上述 的金屬元件接合方法。 又’本發明之散数元杜 你 …件係包含··複數個散熱柱狀體, 其材質為第一金屬;以及一美 甘 基板,其材質為第二金屬,且 上述第二金屬的熔點高於上述第一金屬的溶點,·其中 散熱韓片與上述基板之接合,係使用上述的金屬元件接合 方法。 上述的散熱元件,择公則+ 干係刀別由散熱鰭片、波形鰭片、散 熱柱狀體作為第一金屬元件,且分別由基板作為第二金屬 凡件’以上述的金屬元件接合方法來作接合。而由基板侧 施以加熱及加壓’將基板與縛片等接合。因此,上述的散 熱70件’與與前述的發明-樣,可以藉由簡單的裝置確實 地接合.鰭片等與基板。又,此一 二政熱7〇件中,由基板侧施 以加熱及加壓將韓片等與基板接合之緣故,即使是具有複 雜的形狀及構造的散熱韓片等,均是可以用簡易的裝置來 製造的。因此’藉由這些散熱元件,散熱面積較大而具有 複雜的形狀及構造的散熱鰭片等,均可以配製在基板上。 本發明第六群組的散熱元件,係包含1 表面係連接於-發熱體,另一表面係立設並接合有複數個 鰭片 '以及一凸條,於上述基板另一表面丨,連結上述鰭 片0 412036-5808B-PF 40 1270429 Further, the heat dissipating component of the invention comprises: a Korean film whose material is a first metal and a second metal, and the melting point of the genus asas is higher than the first metal The melting point, wherein the heat dissipating fins are bonded to the substrate, the metal element bonding method described above is used. Further, the present invention includes a plurality of heat dissipating columns, the material of which is a first metal, and a megan substrate which is made of a second metal and has a high melting point of the second metal. In the melting point of the first metal, the metal element bonding method described above is used for bonding the heat-dissipating film to the substrate. In the above heat dissipating component, the heat sinking fin, the wave fin, and the heat dissipating column body are used as the first metal component, and the substrate is used as the second metal component respectively. Engage. On the other hand, the substrate is joined to the bonding piece or the like by heating and pressurizing. Therefore, the above-described heat dissipation 70 pieces can be surely joined to the substrate by a simple device as in the above-described invention. In addition, in the case of the heat transfer and pressurization, the Korean film or the like is bonded to the substrate by the substrate side, and even a heat-dissipating Korean film having a complicated shape and structure can be easily used. The device is manufactured. Therefore, the heat dissipating fins having a large heat dissipating area and having a complicated shape and structure can be prepared on the substrate by these heat dissipating members. The heat dissipating component of the sixth group of the present invention comprises: 1 surface is connected to the heat generating body, and the other surface is erected and joined with a plurality of fins and a ridge on the other surface of the substrate Fins 0 41

2036-5808B-PF 1270429 與發熱體連接的基板’為了要達成將發熱體的熱量傳 至各縛片的功能’一般來說,基板愈厚,則散熱元件的散 熱性能愈高。但是,基板愈厚,則散熱元件的重量愈大。 因此本發明中’基板的厚度並非全體性的增加,僅僅對於 ^發熱體的熱量傳至各基板的貢獻度大的部分,增加該部 分基板的厚度;對於貢獻度小的部分則減低其厚度;而使 基板全體的重量不變的情況下,將發熱體的熱量:效率地 傳至各鰭片。具體而言,藉由連結各鰭片的凸條形成於基 板上’可以在不增加重量的情況下提高散熱詩的散熱性 在此,凸條雖然可以以數個鰭片為單位而連結各衾 片,而將全部的鰭片特別地連續形成連結時,可以將發垂 體的熱量確實地傳達至末端的鰭片’可使散熱性能更向』 提昇,凸條的形成也比較容易,因而能夠抑制製造成本。 又,雖然凸條可以與各韓片呈斜交的方向形成,而將 凸=別地以與各鰭片呈直交的方向形成時,凸條的形成 較谷易’凸條與基板合各鰭片的接合部__構造較單 純,因而能夠抑制製造成本。又,凸條韓片與各鍵片呈直 交的方向日夺,可以縮小凸條的全長,,片: 大化,係更可以提昇散熱性能。 I、的斷面積最 :基=本體。如此—來’特別與風扇一 減小壓力損失。 τ 又,凸條的斷面形較好為沿著長度方向保持一定。可2036-5808B-PF 1270429 The substrate "connected to the heating element" is intended to achieve the function of transferring the heat of the heating element to the respective sheets. In general, the thicker the substrate, the higher the heat dissipation performance of the heat dissipating element. However, the thicker the substrate, the greater the weight of the heat dissipating component. Therefore, in the present invention, the thickness of the substrate is not an increase in the overall thickness, and the thickness of the portion of the substrate is increased only for the portion where the heat of the heating element is transmitted to each substrate, and the thickness of the portion is reduced for the portion having a small contribution; When the weight of the entire substrate is not changed, the heat of the heating element is efficiently transmitted to the fins. Specifically, the ridges connecting the fins are formed on the substrate. The heat dissipation of the heat dissipation poem can be improved without increasing the weight. Here, the ridges can be connected to each other in units of a plurality of fins. When all the fins are continuously connected in a continuous manner, the heat of the hairpin can be reliably transmitted to the fins at the end to improve the heat dissipation performance, and the formation of the ridges is relatively easy, thereby suppressing manufacturing cost. Moreover, although the ridges can be formed in a direction oblique to each of the Korean sheets, and the protrusions are formed in a direction orthogonal to the fins, the formation of the ridges is better than that of the ribs and the substrate. The joint portion of the sheet has a relatively simple structure, so that the manufacturing cost can be suppressed. In addition, the ridged Korean film and the key pieces are in a direction perpendicular to each other, and the total length of the ridges can be reduced, and the film can be improved in heat dissipation performance. I, the largest area of the area: base = body. This is the case - especially with the fan to reduce the pressure loss. τ Further, the cross-sectional shape of the ridge is preferably kept constant along the length direction. can

2036-5808B-PF 42 1270429 以容易地將凸條形成於 狀與構造也較單純凸條與各韓片的接合部的形 早純’因而能夠抑制製造成本。 在此情況下,Λ怂 ratin 7 凸條的斷面積之輪廓比(aspect rat10)(寬度/厚度之比值 埶元株的入a 子為5〜30,而凸條的厚度/散 熟兀件的全鬲之比值較好 例中瞼鉉π 、 ·〜0· 3。可以由後述的實施 、’凸條的厚度相對過大時,會加大壓力損失,反 ^散熱性能;凸條的厚度相對科時,就相近 的厚度全體性地增加時的情況。 又’凸條的斷面面積可以由基板與發熱體接觸的相對 ,置,向凸條的長度方向逐漸縮減。由於傳至基板的熱量 疋心者距離發熱體愈遠而愈小,依據此熱量分佈情形縮減 凸條的斷面積是適當的’可以形成散熱效率更高的散熱元 件0 又,基板較好為銅(包含銅合金),而鰭片較好為鋁(包 含銘合金)。因為銅的熱傳導率極A,可以極有效率地將發 熱體的熱量傳達至各_片’而㈣熱傳導率耗相對較 小’其具有輕量且加工容易的優點。 又,鰭片較好為兩兩一對,而各對中的二鰭片較好為 藉由平行於該基板的基端部而連結。上述兩兩一對的鰭片 和將其連結的基端部構成約略為凹字型的斷面時,可以減 少接合基板與鰭片時所費的工女 拿取也比較容易,而可以容易地製造具高高度/間隔比的散 熱元件。而將一鰭片的基端部呈約略^字發,而可以將續 片與基端部以蛇腹狀連續地連結而成為波形縫片。 2036-5808B-PF 43 1270429 更者,如此的散熱鰭片,雖然可以使用在自然空冷式 的散熱器,而使用在強制空冷式散熱器(附設風扇並藉由此 風扇帶走各鰭片的熱量)時,可以得到更高的散熱性能。 上述的散熱器中,雖然可以任意決定安裝風扇時風扇 相對於散熱元件的角度,而若將風扇配置為送風時,風的 來源係為相對於鰭片的側面時,可以得到特別高的散熱性 月b ’亦可以調整其高度、大小而不會受到設置空間的限制。 另外’上述散熱元件的製造方法可以任意決定,較好 為包含:提供一銅基板,上述銅基板一表面上形成有一凸 條’在形成有上述凸條的表面上,以橫跨上述凸條的方式, 立設、配置複數個鋁鰭片;以及由上述銅基板之另一表面, 對上述銅基板及上述鋁鰭片的交界面加熱及加壓,而使上 述鋁鰭片接合於上述銅基板。 藉由上述的製造方法,在加熱及加壓時,鰭片與凸條 不會造成麻煩,鰭片的間隔與高度/間隔比可以自由地設 疋。又,基板與鰭片係分別為銅與鋁所構成,在由溶點高 於鋁的銅基板之側施行加熱及加壓,而使所施加的壓應力 能夠有效率地傳達至基板與鰭片的交界面,可使兩者確實 地接合。 此處,可以任意地決定加熱及加壓的方法,亦可以使 甩例如電磁誘導等非接觸方式:在揍觸方式方备,―較好為 使用沿圓周方向轉動的圓板狀接合治具壓至鋼基板的另一 表面,並沿著銅基板的另一表面,動。 上述的方法稱為摩擦震動接合,可以使用簡單的裝置 2036-5808B-PF 44 1270429 將基板與鰭片確實地接合。 【實施方式】 、 Θ參考所附圖面,對本發明之實施型態作詳細 地說明。而說明 之中’同一要素係使用同一符號,便省略 重複的說明。 百先說明本發明第一群組之實施型態。 第ΙΑ 1B係顯示本發明金屬元件接合方法之一實施型 態各步驟的正面剖面圖,第1C圖係第1B圖之側視圖。本 :屬元件接5方法中,首先如第Μ圖所示,鋁元件I。與 銅兀件MS係、以面接觸的方式互相重合配置,ϋ使用未繚 示於圖面的治具固定。 ^接下來,如第1β圖所示,以轉動軸103b為中心、朝 圓周方向以圓周速率高速轉動的接合治具I” 之接合本體103a之圓周面,垂直壓入銅元件1〇2的表面 l〇2a ;如第ic圖所示,藉由將接合治具1〇3沿著銅元件 1〇2的表面l〇2a以行進速率v(m/min)移動,使鋁元件ι〇ι 與銅το件1〇2重合並接合。接合治具1〇3係在轉動轴1〇礼 的前端部將圓板狀的治具本體1〇3a固定,而治具本體 係由JIS : SKD61等工具鋼所構成。相對於壓入鋼元件ι〇2 的表面102a時的行進方^ ^ # Φ Μ 1G 3 a # ^^ ^ 的方向,沿著轉動軸103b的周邊轉動。 如第2A圖所示,治具本體1〇3a价冊^ a (m)壓入銅元件102的表面1〇2a的狀態高速轉動,並沿 2036-5808B-PF 45 口7〇429 著鋼元件1G2的表面ma移動。而藉著上述治具本體_ 在銅元件102的表面l〇2a之壓入,使鋁元件1〇1與銅元件 1〇2之重合面的缝隙消失;並藉著高速轉動的治具本體 1〇3a與銅元件102的接觸所產生的震動,將鋁元件ι〇ι與 銅元件102之重合面的氧化物皮膜分裂破壞;並如第“圖 戶斤系’與治具本體1 0 3 a接觸的銅元件 i〇2的既定區域與其2036-5808B-PF 42 1270429 It is possible to easily form the ridges and the shape of the joints of the simple ridges and the respective Korean sheets, so that the manufacturing cost can be suppressed. In this case, the contour ratio of the cross-sectional area of the Λ怂ratin 7 rib is (aspect rat10) (the ratio of the width/thickness is 5 to 30 in the a sub-segment of the sag, and the thickness of the ridge/disintegration In the case of a better ratio, the ratio of 鬲π, ·~0·3 can be increased by the implementation described later, when the thickness of the ridge is relatively large, the pressure loss is increased, and the heat dissipation performance is reversed; the thickness of the ridge is relative to the time In the case where the thickness is increased as a whole, the cross-sectional area of the ridge can be set to be in contact with the heat generating body, and the thickness of the rib can be gradually reduced in the longitudinal direction of the ridge. The farther and farther away from the heating element, the smaller the sectional area of the ridges is appropriate according to the heat distribution. 'The heat dissipation element with higher heat dissipation efficiency can be formed. The substrate is preferably copper (including copper alloy), and the fin The sheet is preferably aluminum (including the alloy). Because the thermal conductivity of copper is very high, the heat of the heating element can be efficiently transmitted to the respective sheets, and (4) the heat conduction rate is relatively small, which is lightweight and processed. Easy advantage. Also, fins are more Preferably, the two fins of each pair are connected by being parallel to the base end portion of the substrate. The two pairs of fins and the base end portion connecting the two are formed to be approximately concave. When the cross-section of the font is used, it is relatively easy to reduce the labor cost of joining the substrate and the fins, and the heat dissipating component having a high height/space ratio can be easily manufactured. The base end of a fin is used. The sequel and the base end portion can be continuously connected in a bellows shape to form a corrugated slit. 2036-5808B-PF 43 1270429 Moreover, such a fin can be used in a natural air-cooling type. The heat sink can be used for a forced air-cooled heat sink (with a fan and the heat of the fins taken away by the fan). In the above heat sink, the fan can be arbitrarily determined. The angle of the fan relative to the heat dissipating component, and if the fan is configured to supply air, the source of the wind is relative to the side of the fin, and a particularly high heat dissipation month b' can be obtained, and the height and size can be adjusted without Will be subject to Further, the method for manufacturing the heat dissipating member may be arbitrarily determined, and preferably includes: providing a copper substrate having a ridge formed on a surface of the copper substrate on the surface on which the ridge is formed to cross a plurality of aluminum fins erected and disposed in the manner of the ridges; and the other surface of the copper substrate is heated and pressurized to the interface between the copper substrate and the aluminum fins to bond the aluminum fins In the above copper substrate, the fins and the ridges are not troublesome during heating and pressurization, and the fin spacing and height/space ratio can be freely set. Further, the substrate and the fins The system is made of copper and aluminum, and is heated and pressurized on the side of the copper substrate having a melting point higher than aluminum, so that the applied compressive stress can be efficiently transmitted to the interface between the substrate and the fin. The two are indeed joined. Here, the method of heating and pressurizing may be arbitrarily determined, and a non-contact type such as electromagnetic induction may be used: in the case of a rubbing method, and it is preferable to use a disc-shaped jig in a circumferential direction. To the other surface of the steel substrate, and along the other surface of the copper substrate, move. The above method is called frictional vibration bonding, and the substrate can be surely joined to the fins using a simple device 2036-5808B-PF 44 1270429. [Embodiment] The embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements are denoted by the same reference numerals, and the repeated description will be omitted. The first embodiment of the present invention will be described. Fig. 1B is a front cross-sectional view showing each step of the embodiment of the metal element joining method of the present invention, and Fig. 1C is a side view of Fig. 1B. This is a method of connecting the components to the 5, first as shown in the figure, the aluminum component I. It is placed in contact with the matte MS in a face-to-face manner, and is fixed by a jig that is not shown on the drawing. Next, as shown in the 1st-figure diagram, the circumferential surface of the joint body 103a of the joining jig I" which is rotated at a high speed in the circumferential direction around the rotating shaft 103b is vertically pressed into the surface of the copper member 1? L〇2a; as shown in the figure ic, by moving the bonding fixture 1〇3 along the surface l〇2a of the copper component 1〇2 at a traveling rate v(m/min), the aluminum component ι〇ι and The copper τ 件 1 〇 重 重 。 。 。 。 。 。 。 。 。 。 。 。 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合The steel is formed to rotate along the periphery of the rotating shaft 103b with respect to the direction of the traveling side ^^# Φ 1G 3 a # ^^ ^ when the surface 102a of the steel element ι 2 is pressed. As shown in Fig. 2A , the fixture body 1〇3a price book ^ a (m) is pressed into the surface of the copper member 102 in the state of 1〇2a at a high speed, and moves along the surface ma of the 2036-5808B-PF 45 port 7〇429 steel member 1G2. By the pressing of the surface of the copper element 102, the gap between the aluminum element 1〇1 and the copper element 1〇2 disappears; and by the high-speed rotation The vibration generated by the contact between the body 1〇3a and the copper element 102 splits and breaks the oxide film of the overlapping surface of the aluminum element ι〇ι and the copper element 102; and as shown in the figure “图图系系” and the fixture body 1 The predetermined area of the copper element i〇2 that is in contact with 0 3 a

鄰近區域、還有與上述區域鄰接的鋁元件ι〇ι的既定區 威,因治具本體103a與銅元件i 〇2的摩擦接觸所產生的熱 量而高溫化’呈現可塑化(流動化)的固相狀態。上述的結 果,使得銅元件102與鋁元件1〇1在相互的交界面上流動 擴散’並由當初的表面開始塑性變形。 接合治具103之治具本體1〇3a的通過軌跡,如第% 圖所示’#由治具本冑1()3a之壓應力而在銅元件ι〇2的表 面l〇2a形成一對淺的段部1〇2卜又,鋁元件i〇i與銅元 件102的重合面中’已塑性變形的銘元件ι〇ι及銅元件 相互咬合,而固化成斷面凹凸型的接合面s,上述的接合 面S介於銅元件1()2舆銘元件m之間而將二者確實㈣ 合0 此處’考慮到接合治具103由鋁元件1〇1之侧壓入時, 鋁元件的熔點低於銅元件的熔點,鋁元件1〇1與銅元件1〇2 的重合翁連财接合所必要的务 件1〇1的抗形變強度就會變得較小,而使來自接合治具103 的壓力無法充分地傳達至鋁元件丨侧與銅元件丨〇 2的重合 面。另一方面,將接合治具1〇3廢入溶點高於銘元件 2036-5808B-PF 46 Ϊ270429 的鋼元件102之侧時,在鋁元件101與銅元件1〇2的重合 面達到接合所必要的共晶溫度以上時,銅元件1〇2可以保 :比較大的抗形變強度,可使來自接合治I 1〇3的壓力充 分地傳達至銘元件m與銅元件1G2的重合面,而使兩元 件間的縫隙消失,而能夠行高強度的接合。The adjacent area, and the predetermined area of the aluminum component ι〇ι adjacent to the above-mentioned area, are heated by the heat generated by the frictional contact between the jig body 103a and the copper element i 〇 2 to present plasticized (fluidized) Solid state. The above result causes the copper member 102 and the aluminum member 1〇1 to flow and diffuse at the mutual interface and plastically deform from the original surface. The passing trajectory of the jig body 1〇3a of the jig 103 is formed as a pair of '#' by the compressive stress of the jig 1() 3a as shown in the % figure, and a pair is formed on the surface l〇2a of the copper element ι 2 In the shallow section 1 〇 2, the aluminum component i〇i and the copper component 102 overlap the 'plastically deformed element ι〇ι and the copper element, and the surface is spliced to form a joint surface s The joint surface S described above is interposed between the copper element 1 () 2 and the element m, and the two are indeed (four) 0. Here, considering that the joint jig 103 is pressed by the side of the aluminum element 1〇1, the aluminum The melting point of the element is lower than the melting point of the copper element, and the deformation resistance of the workpiece 1〇1 necessary for the bonding of the aluminum element 1〇1 and the copper element 1〇2 becomes smaller, and the deformation resistance of the element 1 〇1 becomes smaller. The pressure of 103 is not sufficiently transmitted to the overlapping faces of the side faces of the aluminum member and the copper member 丨〇2. On the other hand, when the joining jig 1〇3 is scrapped into the side of the steel element 102 having a melting point higher than that of the inscription element 2036-5808B-PF 46 Ϊ 270429, the joining surface of the aluminum element 101 and the copper element 1〇2 is joined. When the necessary eutectic temperature is higher than or equal to the eutectic temperature, the copper element 1〇2 can maintain a relatively large deformation strength, and the pressure from the bonding process I 1〇3 can be sufficiently transmitted to the overlapping surface of the inscription element m and the copper element 1G2. The gap between the two elements disappears, and a high-strength joint can be performed.

人而此金屬元件接合方法並不限於將鋁元件與銅元件重 合並接合的情況’可以廣泛地適用於各金屬元件間的重合 並接合。而上述金屬元件的形狀,只要在相互重合之後能 夠使接合治具壓入就可以。更者’重合的金屬元件的數量 也不限於二個,三個以上亦可。 ^例如,如第3圖所示金屬元件接合方法的另一實施型 態,係將三個金屬元件(5〇〇〇系的鋁元件1〇ι、1〇〇〇系的 銘元件101,、銅元件102)相互重合配置,將接合治具1〇3 的化具本豸1 03a Μ人三個金屬元件中溶點最冑的銅元件 2之侧,而為摩擦震動接合。在此,考慮到接合時各金 屬兀件的要達到共晶溫度以上,且此時各金屬元件的抗形 I強度對來自接合、冶具的壓應力傳達至各金屬元件的接合 傳達效率的影響,較好為將三個金屬元件依熔點的高 低順序(此處的順序為銅元# 1〇2、1〇〇〇系、的鋁元件 1 01 5000系的鋁元件101)重合配置,並將接合治具1〇3 的治具本體103a ^件^^^ 件(此處為銅凡件1Q2)之側,而為摩擦震動接合。其他, 一個金屬元件為銅、鋁、鎂時,較妤為价辨元件、链元件、 鎮元件的项序重合’將接合治具壓入鋼元件之側而行摩擦The metal element joining method is not limited to the case where the aluminum member and the copper member are rejoined and joined, and can be widely applied to the overlap and joint between the metal members. Further, the shape of the above-mentioned metal member can be made to press the bonding jig after being superposed on each other. Further, the number of metal elements to be overlapped is not limited to two, and three or more may be used. ^ For example, another embodiment of the metal element bonding method as shown in FIG. 3 is a three-metal element (a 5-inch aluminum element 1 〇, a 1 〇〇〇-based ing element 101, The copper elements 102) are placed one on top of the other, and the bonding tool 1103a of the jig 1〇3 is joined to the side of the copper element 2 having the most melting point among the three metal elements, and is friction-vibrating. Here, in consideration of the influence of the metal element of the metal element at the time of bonding, the resistance I of the metal element is transmitted to the bonding efficiency of each metal element, and the compressive stress from the bonding and the metallurgy is transmitted to the metal element. It is preferable that the three metal elements are arranged in the order of the melting point (the order is copper element #1〇2, the type of the aluminum element 101 of the aluminum element 1015000 series), and the bonding is performed. The jig body 103a of the jig 1〇3 is on the side of the piece (here, the copper piece 1Q2), and is friction-vibration joint. Others, when a metal component is copper, aluminum or magnesium, it is more coincident with the order of the identifiable component, the chain component, and the sinter component. ‘The friction of the bonding fixture is pressed into the side of the steel component.

2036-5808B-PF 47 1270429 震動接合。2036-5808B-PF 47 1270429 Vibration engagement.

第4圖為一斜視圖,係顯示本發明之散熱元件之一實 施型態。圖中所示的散熱元件1〇4係由銘元件構成的散敎 、器材料m與銅元件構成的傳熱板1〇6所構成。散熱器材 料105係由基板105a、立設於基板1〇53之一表面(圖中的 :面)的複數個散_片1G5b所構成。而傳熱板⑽係重 一;土板10 5a之另一表面(圖中的上面),以上述的摩擦震 動接合法,將散熱器材料1〇5與傳熱板1〇6接合。而散熱 兀件104’係將接合治具壓入由熔點高於鋁元件的銅元件 所構成的傳㈣⑽之側而行摩擦震動接合而成,因此基 板105a與傳熱板1〇6的重合部無縫隙,成為高強度的接 合。更好為將基板1〇以與傳熱板1〇6的重合面作全面性的 摩擦震動接合’雖然僅有一部份作摩擦震動接合亦可,作 全面性的摩擦震動接合時可提高接合強度與散熱性能。 而本發明之散熱元件並不限定於此,只要包含具有基 板105a與立設於其一表面的散熱鰭片1〇5的鋁元件所構成 的散熱器材料105、與藉由上述金屬元件接合方法之摩柊 震動接合重合並接合於基板1〇5a之另一表面的銅元件戶; 構成的傳熱板1〇6,其他的方面可以自由變更。 例如,第5A〜5C圖所示的散熱元件1〇4,係為了盡量 提升散熱性能,而增加散熱餘十 圖中,散熱鰭片l〇5b係為向長度方向延伸的波狀;第5b 圖中,散熱鰭片105b傺立設脅向脅熱板 圖中,散熱續片1〇5b係向高度方向曲折(相對於傳熱’板ι〇6 2036-5808B-PF 48 1270429 的寬度方向左右對稱的斷面形狀或是左右未對稱的斷面形 狀皆可)。 第6A、6B圖為一系列之正面剖面圖,係顯示本發明之 散熱元件的製造方法之一實施型態之第4圖所示之散熱元 件104的製造方法之的各步驟,而第6c圖為第6B圖之剖 面圖。 首先,如第6A圖所示,使散熱鰭片i〇5b向下 TIT Μ 元件所構成的散熱器1〇5固定在接合工作桌1〇7上。接— 來,將銅元件構成的傳熱板1〇6以相互面接觸的方式重^ 配置於政熱器1〇5的基板i〇5a的上面,並以未緣示於圖f 的治具固定。 接下來,如第6B圖所示,以轉動軸1〇3b為中心,并 沿圓周方向高速轉動的接合治具1〇3的治具本體1〇3的穩 周面垂直壓入傳熱板1〇6的表面1〇6a;並如第6c圖所示 藉由將接合治具103沿著傳熱板106的表面106a移動,有 散熱器材料105的基板1〇5&與傳熱板1〇6重合並接合。农 對於壓入傳熱板1()6的表面1G6a時的行進方向,治具本儀 1〇=係以送至後方的方向,沿著轉動軸103b的周邊轉動t 接,治具103的移動區域雖然可及於傳熱板m之全面或 、二知之面皆可,而在傳熱板106的全面區域移動時,可 =製造出接合強度與散熱性能敕高^ # 1〇4 〇 ^, 藉由治具本體103的Μ應力在傳熱板1G6的表面ma殘留 的凹痕時’可將傳熱板1册的表督H 6 a切脅掉一既定 厚度’而得到具美麗外觀的散熱元件1〇4。 2036-5808B-PF 49 1270429 又,散熱鰭片l〇5b的寬度較小時,如第7A圖戶一 將在各散熱…05b之間所後入的斷面形狀的散::: 支持具108固定於接合治具桌107上,接下來如第^ -將各散熱韓片105故入散熱韓片支持具1〇8而行. 動接合時,可以確實地防止來自接合 不 散熱鰭片mb變形。 的呕應力使 更者,如第7C圖所示,亦可以使用在轉動轴1〇此的 周邊以一既定間隔固定有複數個治具本體103a的接合治 具103取代接合治纟1〇3。此時,可以同時對複數個區域 施以摩擦震動接合’可以縮斷接合時所需要的時間,因而 更加提昇效率。 以上係說明本發明之較佳實施例,但不應用以限定本 發明’任何熟習此技藝者,在不麟本發明之精神和範圍 内,當可作些許之更動與潤飾。 實驗一: 如第1A〜1C圖與第2A〜2C圖所示,將鋁元件與鋼元 件重合並於銅元件之側作摩擦震動接合時,施以以十的實 驗以驗錢合治具的接合本體的圓周速率R的適當範圍。 使用厚度0.001m的銅元件與厚度〇 〇〇lm的鋁元件 作為實驗材料。又,使用治具本體的直徑為 0. 08m ^ 〇. 005m ^ ^ 0 ^ ^ ^ ^ # 在銅元件表面的壓入量設定為0.0003m。 結果如表一所示。 之 此處所謂的材料剝離係指在重合面發生兩元件Fig. 4 is a perspective view showing an embodiment of the heat dissipating member of the present invention. The heat dissipating member 1 〇 4 shown in the drawing is composed of a heat sink plate 1 〇 6 composed of a bulk material, a material m and a copper element. The heat sink material 105 is composed of a plurality of sheets 1G5b which are erected on one surface (surface in the figure) of the substrate 105a. The heat transfer plate (10) is one heavy; the other surface (the upper surface in the figure) of the soil plate 105a is joined to the heat transfer plate 1A by the above-described frictional vibration bonding method. The heat dissipating member 104' is formed by frictionally joining the bonding jig into the side of the pass (4) (10) formed by the copper element having a higher melting point than the aluminum member, so that the overlapping portion of the substrate 105a and the heat transfer plate 1〇6 is formed. The seamless gap becomes a high-strength joint. It is better to make the frictional vibration joint of the substrate 1〇 with the overlapping surface of the heat transfer plate 1〇6. Although only a part of the frictional vibration joint can be used, the joint strength can be improved when the frictional vibration joint is comprehensive. With thermal performance. The heat dissipating element of the present invention is not limited thereto, and the heat sink material 105 including the aluminum element having the substrate 105a and the heat dissipating fins 1〇5 standing on one surface thereof, and the bonding method by the metal element described above The frictional engagement is combined with the copper component of the other surface of the substrate 1〇5a; the heat transfer plate 1〇6 is configured to be freely changeable. For example, the heat dissipating elements 1 〇 4 shown in FIGS. 5A to 5C are designed to increase the heat dissipation performance as much as possible, and the heat dissipating fins l 〇 5b are wavy extending in the longitudinal direction; FIG. 5b In the heat-dissipating fins 105b, the heat-dissipating fins 1〇5b are bent in the height direction (relative to the width direction of the heat transfer 'plate 〇6 2036-5808B-PF 48 1270429) The cross-sectional shape or the left and right unsymmetrical cross-sectional shape can be). 6A and 6B are a series of front cross-sectional views showing the steps of the method for manufacturing the heat dissipating member 104 shown in Fig. 4 of an embodiment of the method for manufacturing a heat dissipating member of the present invention, and Fig. 6c It is a sectional view of Fig. 6B. First, as shown in Fig. 6A, the heat sink fins 5, 5, which are formed by the heat sink fins i 〇 5b down the TIT 元件 element, are fixed to the joint work table 1〇7. Then, the heat transfer plates 1〇6 composed of the copper elements are placed on the upper surface of the substrate i〇5a of the heat exchanger 1〇5 in such a manner as to face each other, and the jigs shown in FIG. fixed. Next, as shown in FIG. 6B, the stable circumferential surface of the jig body 1〇3 of the joining jig 1〇3 which is centered on the rotating shaft 1〇3b and rotates at a high speed in the circumferential direction is vertically pressed into the heat transfer plate 1 The surface 1〇6a of the crucible 6; and as shown in Fig. 6c, by moving the bonding jig 103 along the surface 106a of the heat transfer plate 106, the substrate 1〇5& with the heat sink material 105 and the heat transfer plate 1〇 6 heavy combined joints. For the direction of travel when the surface of the heat transfer plate 1 () 6 is pressed into the surface 1G6a, the jig is sent to the rear direction, and t is connected along the periphery of the rotating shaft 103b, and the movement of the jig 103 is moved. Although the area can be applied to the full or the other side of the heat transfer plate m, when the entire area of the heat transfer plate 106 is moved, the joint strength and the heat dissipation performance can be made high. # 1〇4 〇^, When the dent of the jig body 103 is on the dent of the surface ma of the heat transfer plate 1G6, the heat transfer plate 1 can be shrunk to a predetermined thickness to obtain a beautiful appearance. Element 1〇4. 2036-5808B-PF 49 1270429 Moreover, when the width of the heat radiating fins l〇5b is small, as shown in Fig. 7A, the cross-sectional shape of the heat sinking fins 05b will be separated::: Supporting device 108 It is fixed to the jig table 107, and then the heat-dissipating film 105 is inserted into the heat-dissipating film support device 1〇8. When the joint is engaged, the deformation of the fins mb can be reliably prevented. . Further, as shown in Fig. 7C, it is also possible to use a joining jig 103 in which a plurality of jig bodies 103a are fixed at a predetermined interval around the periphery of the rotating shaft 1 instead of the joining process 1〇3. At this time, the frictional vibration engagement can be applied to a plurality of regions at the same time, and the time required for the engagement can be shortened, thereby further improving the efficiency. The above description of the preferred embodiments of the present invention is not intended to limit the scope of the present invention, and may be modified and modified in the spirit and scope of the present invention. Experiment 1: As shown in Figures 1A to 1C and Figures 2A to 2C, when the aluminum component and the steel component are combined on the side of the copper component for frictional vibration bonding, the experiment of ten is used to check the fixture. An appropriate range of the circumferential rate R of the engaging body. A copper member having a thickness of 0.001 m and an aluminum member having a thickness of 〇 lm were used as experimental materials. Moreover, the diameter of the body of the jig is 0. 08m ^ 〇. 005m ^ ^ 0 ^ ^ ^ ^ # The amount of pressing on the surface of the copper component is set to 0.0003m. The results are shown in Table 1. The term "material stripping" as used herein refers to the occurrence of two components on the coincident surface.

2036-5808B-PF 50 12704292036-5808B-PF 50 1270429

離,即表示不完全的接合與未接合。又,材料接合部破斷 係指接合部的重合面以外的元件發生破斷,表示其接合是 完全的。 表一 材料:1050-0、Cu 厚度:A卜0_ 001m、Cu-0· 001m 治具形狀:0 0. 08m、0. 005m厚 治具壓入量α=0· 0003m _ 試片 編號 轉動數 圓周速率 (R) 行進速率 (V) 圓周速率 /行進速 率(R/V) σΒ 接合 寬度 接合強度 參考 rpra in/min in/inin Ν ra(xl〇·3) N/m2(xl06) 1 -1 1000 251.32 1.0 251 1764 22.05 80.00 材料剝離 1-2 1000 251.32 3.0 84 1754 22.04 79. 58 材料剝離 1-3 2000 502. 64 2.0 251 2056 20.18 101.88 材料接合部破斷 1-4 2000 502. 64 3.0 168 2356 24.13 97. 64 材料接合部破斷 1-5 3000 753. 96 0.50 1508 2071 22.22 93.20 材料接合部破斷 1 -6 3000 753. 96 1.0 754 2076 20. 65 100.53 材料接合部破斷 1-7 3000 753. 96 2.0 377 2171 19.84 109.43 材料接合部破斷 1-8 3000 753. 96 3.0 251 2246 20.75 108.24 材料接合部破斷 1 -9 3000 753. 96 4.0 188 2310 21.00 110.00 材料接合部破斷 1-10 6000 1507.92 3.0 503 2302 22.17 103.83 材料接合部破斷 如表一所示,可以暸解接合時接合治具以 25 0〜20 0 Om/m in的圓周速率轉動時,接合治具與銅元件之 摩擦接觸所產生的熱量為恰好適當,而能夠行良好的接 合。又,可以瞭解接合時接合治具以500〜200 Om/min的圓 周速率轉動時,而能夠行較良好的接合。 實驗二: 將實驗一之銅元件的厚度t(m)與接合治具之治具本體 在銅元件的壓入量 a (m)作變化,而進行與實驗一相同的 實驗。 結果如表二所示。 2036-5808B-PF 51 1270429Off means that the joint is not completely joined or not. Further, the breaking of the material joint portion means that the element other than the overlapping surface of the joint portion is broken, indicating that the joining is complete. Table 1 material: 1050-0, Cu thickness: A Bu 0_ 001m, Cu-0· 001m Fixture shape: 0 0. 08m, 0. 005m thick fixture indentation α=0· 0003m _ test piece number rotation number circumference Rate (R) Travel Rate (V) Cycle Rate / Travel Rate (R/V) σΒ Joint Width Bond Strength Reference rpra in/min in/inin Ν ra(xl〇·3) N/m2(xl06) 1 -1 1000 251.32 1.0 251 1764 22.05 80.00 Material stripping 1-2 1000 251.32 3.0 84 1754 22.04 79. 58 Material stripping 1-3 2000 502. 64 2.0 251 2056 20.18 101.88 Material joint breaking 1-4 2000 502. 64 3.0 168 2356 24.13 97. 64 Material joint break 1-5 3000 753. 96 0.50 1508 2071 22.22 93.20 Material joint break 1 -6 3000 753. 96 1.0 754 2076 20. 65 100.53 Material joint break 1-7 3000 753. 96 2.0 377 2171 19.84 109.43 Material joint break 1-8 3000 753. 96 3.0 251 2246 20.75 108.24 Material joint break 1 -9 3000 753. 96 4.0 188 2310 21.00 110.00 Material joint break 1-10 6000 1507.92 3.0 503 2302 22.17 103.83 The joint of the material is broken as shown in Table 1. When the jig is rotated at a peripheral speed of 25 0 to 20 0 Om/m in , the heat generated by the frictional contact between the bonding jig and the copper member is just right, and a good bonding can be performed. Further, it can be understood that the joining jig at the time of joining is rotated at a circular peripheral speed of 500 to 200 Om/min, and a good joining can be performed. Experiment 2: The same experiment as in Experiment 1 was carried out by changing the thickness t(m) of the copper component of Experiment 1 and the fixture body of the bonding fixture in the amount of pressing of the copper component a (m). The results are shown in Table 2. 2036-5808B-PF 51 1270429

表二 材料·· 1050-0、Cu A1 厚度:0.001m 接合治具形狀:0〇.〇8m、0.005m厚 試片 編號 轉動數 圓周速率 (R) 行進速率 (V) Cu厚度 ⑴ 壓入量 ⑷ 接合強度 評價 參考 rpm ffl/min m/min m(xl0"3) m(xl(T3) N/m2(xl06) 比-1 700 175.924 1.00 1.0 0.30 0 X 比-2 700 175. 924 1.00 3.0 0. 30 0 X 比-3 850 213.622 1.00 1.0 0. 30 0 X 比-4 850 213.622 1.00 3.0 0.30 0 X 2-1 1000 251.320 0.25 5.0 0.50 65 Δ 材料剝離 2-2 1000 251.320 0. 50 5.0 0. 50 65 Δ 材料剝離 2-3 1000 251.320 1.00 1.0 0.30 80 △ 材料剝離 2-4 1000 251.320 1.00 3.0 0.30 65 △ 材料剝離 2-5 1000 251.320 3. 00 1.0 0. 30 80 △ 材料剝離 2-6 1000 251.320 3. 00 3.0 0.30 78 △ 材料剝離 2-7 2000 502. 640 2.00 1.0 0.30 102 〇 材料接合部破斷 2-8 2000 502. 640 3.00 1.0 0.30 98 , 〇 材料接合部破斷 2-9 3000 753. 960 5. 00 1.0 0.30 95 〇 材料接合部破斷 2-10 3000 753. 960 1.00 1.0 0.30 100 〇 材料接合部破斷 2-11 3000 753. 960 2.00 1.0 0.30 109 〇 材料接合部破斷 2-12 3000 753. 960 3. 00 1.0 0. 30 108 〇 材料接合部破斷 2-13 3000 753. 960 4. 00 1.0 0.30 110 〇 材料接合部破斷 2-14 3000 753. 960 3.00 1.0 0.10 90 〇 材料接合部破斷 2-15 3000 753.960 0.50 1.0 0.20 95 〇 材料接合部破斷 2-16 3000 753. 960 0. 50 3.0 0.20 91 〇 材料接合部破斷 2-17 6000 1507.920 3.00 1.0 0.30 104 〇 材料接合部破斷 如表二所示,接合時接合治具的圓周速率小於 25Om/min時,接合治具與銅元件之摩擦接觸所產生的熱量 就過小,而使銅元件與銘元件的重合面的溫度過低,而導 致接合不良(比-1〜比- 4)。另一方面,雖然表二未顯示,接 合時接合治具的圓周速率大於20 0 Om/min時,接合治具與 銅元件之摩擦接觸所產生的熱量就會大過所必要的,使與 接合治具接觸的銅元件的温度會局部過高,導致該部分發 生塑性變形,而使接合治具的壓應力無法充分地傳達至重 2036-5808B-PF 52 1270429 合面導致在兩元件間產生縫隙。又,此時接合治具的驅動 能量損失會變大,而使接合效率惡化。因此,可以瞭解接 合時接合治具以250〜2000m/m in的圓周速率轉動時,接合 治具與銅元件之摩擦接觸所產生的熱量為恰好適當,而能 夠行良好的接合。(2-1〜2-17) 實驗三: 進行與實驗二相同的實驗,驗證接合治具之治具本體 在銅元件的壓入量α(Π1)與銅元件的厚度ΐ(Π〇的關係。 結果如表三所示。 表三 材料:1050-0、Cu A1 厚度:0. 001m 接合治具形狀:0〇.〇8m、0.005m厚 試片 編號 轉動數 圓周速率 ⑻ 行進速率 (V) Cu厚度 (t) 壓入量 ⑷ 接合強度 評價 參考 rpm ra/min m/min ra(xl0'3) m(xl0~3) N/m2(xl06) 比-5 3000 753. 96 2.0 1.0 0.05 0 X 比-6 3000 753. 96 2.0 3.0 0.10 0 X 比-7 3000 753. 96 3.0 3.0 0.15 0 X 比-8 3000 753. 96 0.5 5.0 0.30 0 X 3-1 2000 502. 64 2.0 3.0 0.30 101 〇 材料接合部破斷 3-2 2000 502. 64 3.0 3.0 0.30 92 〇 材料接合部破斷 3-3 3000 753. 96 0.5 3.0 0.30 94 〇 材料接合部破斷 3-4 3000 753. 96 1.0 3.0 0.30 98 〇 材料接合部破斷 3-5 3000 753. 96 2.0 3.0 0.30 110 〇 材料接合部破斷 3-6 3000 753. 96 3.0 3.0 0.30 103 〇 材料接合部破斷 3-7 3000 753. 96 4.0 3.0 0.30 105 〇 材料接合部破斷 3-8 6000 1507.92 3.0 3.0 0.30 100 〇 材料接合部破斷 3-9 2000 502. 64 0.5 5.0 0. 50 89 〇 材料接合部破斷 3-10 2000 502. 64 0.5 5.0 0.50 188 〇 材料接合部破斷Table 2 Materials·· 1050-0, Cu A1 Thickness: 0.001m Joint fixture shape: 0〇.〇8m, 0.005m thick test piece No. Number of revolutions Peripheral rate (R) Travel rate (V) Cu thickness (1) Press-in amount (4) Joint strength evaluation reference rpm ffl/min m/min m(xl0"3) m(xl(T3) N/m2(xl06) ratio -1 700 175.924 1.00 1.0 0.30 0 X ratio -2 700 175. 924 1.00 3.0 0 30 0 X to -3 850 213.622 1.00 1.0 0. 30 0 X to -4 850 213.622 1.00 3.0 0.30 0 X 2-1 1000 251.320 0.25 5.0 0.50 65 Δ Material stripping 2-2 1000 251.320 0. 50 5.0 0. 50 65 Δ Material peeling 2-3 1000 251.320 1.00 1.0 0.30 80 △ Material peeling 2-4 1000 251.320 1.00 3.0 0.30 65 △ Material peeling 2-5 1000 251.320 3. 00 1.0 0. 30 80 △ Material peeling 2-6 1000 251.320 3 00 3.0 0.30 78 △ Material peeling 2-7 2000 502. 640 2.00 1.0 0.30 102 〇 Material joint break 2-8 2000 502. 640 3.00 1.0 0.30 98 , 〇 material joint break 2-9 3000 753. 960 5. 00 1.0 0.30 95 〇 Material joint break 2-10 3000 753. 960 1.00 1.0 0.30 100 〇 Material joint break 2-11 3000 753. 960 2.00 1.0 0.30 109 接合 material joint break 2-12 3000 753. 960 3. 00 1.0 0. 30 108 〇 material joint break 2-13 3000 753. 960 4. 00 1.0 0.30 110 〇 material joint broken Broken 2-14 3000 753. 960 3.00 1.0 0.10 90 〇 material joint break 2-15 3000 753.960 0.50 1.0 0.20 95 〇 material joint break 2-16 3000 753. 960 0. 50 3.0 0.20 91 〇 material joint Breaking 2-17 6000 1507.920 3.00 1.0 0.30 104 破 The joint of the material is broken as shown in Table 2. When the circumferential speed of the joining fixture is less than 25Om/min, the heat generated by the frictional contact between the bonding fixture and the copper component is broken. If it is too small, the temperature of the overlapping surface of the copper component and the inscription element is too low, resulting in poor bonding (-1 to ~4). On the other hand, although not shown in Table 2, when the circumferential speed of the joining jig at the time of joining is greater than 20 0 Om/min, the heat generated by the frictional contact between the joining jig and the copper member is greater than necessary, and the bonding is performed. The temperature of the copper component in contact with the fixture is locally too high, causing plastic deformation of the portion, and the compressive stress of the joint fixture is not sufficiently transmitted to the weight 2036-5808B-PF 52 1270429. The joint surface causes a gap between the two components. . Further, at this time, the driving energy loss of the joining jig is increased, and the joining efficiency is deteriorated. Therefore, it can be understood that when the joining jig is rotated at a peripheral speed of 250 to 2000 m/m in the joining, the heat generated by the frictional contact between the jig and the copper member is just appropriate, and good joining can be performed. (2-1~2-17) Experiment 3: The same experiment as in Experiment 2 was carried out to verify the relationship between the pressing amount α (Π1) of the copper member and the thickness ΐ (Π〇 of the copper member) of the fixture fixture. The results are shown in Table 3. Table 3 Materials: 1050-0, Cu A1 Thickness: 0. 001m Joint fixture shape: 0〇.〇8m, 0.005m thick test piece number rotation number circumferential rate (8) travel rate (V) Cu thickness (t) Indentation amount (4) Joint strength evaluation reference rpm ra/min m/min ra(xl0'3) m(xl0~3) N/m2(xl06) ratio -5 3000 753. 96 2.0 1.0 0.05 0 X -6 3000 753. 96 2.0 3.0 0.10 0 X -7 3000 753. 96 3.0 3.0 0.15 0 X -8 3000 753. 96 0.5 5.0 0.30 0 X 3-1 2000 502. 64 2.0 3.0 0.30 101 〇Material bonding Partial break 3-2 2000 502. 64 3.0 3.0 0.30 92 〇 material joint break 3-3 3000 753. 96 0.5 3.0 0.30 94 〇 material joint break 3-4 3000 753. 96 1.0 3.0 0.30 98 〇 material Broken joint 3-5 3000 753. 96 2.0 3.0 0.30 110 〇 Material joint break 3-6 3000 753. 96 3.0 3.0 0.30 103 〇 Material joint break 3-7 3000 753. 96 4.0 3.0 0.30 105 〇Material joint break 3-8 6000 1507.92 3.0 3.0 0.30 100 〇Material joint break 3-9 2000 502. 64 0.5 5.0 0. 50 89 〇Material joint break 3-10 2000 502. 64 0.5 5.0 0.50 188 〇 material joint broken

如表三所示,接合時接合治具之治具本體在銅元件的 壓入量α小於0. 11時,銅元件與银元、侏的v重合,面1木^ 留缝隙而導致接合不良(比-5〜比-8 )。另一方面,雖然表三 2036-5808B-PF 53 1270429 未顯示,接合時接合治具 Γ _ Λ 〇 ^ 本體在銅元件的壓入量α 大於0.3t時,雖然銅元件盥 里 ^^ ^件的重合面中不會殘留縫 “而過大的接合治具壓入量合. 的m广增L 里培在銅兀件的表面殘留顯著As shown in Table 3, when the pressing amount α of the copper element is less than 0.11, the copper element overlaps with the silver element and the v of the crucible, and the surface 1 is left with a gap to cause a poor joint ( Than -5~ than -8). On the other hand, although Table 3 2036-5808B-PF 53 1270429 is not shown, the bonding fixture Γ _ Λ 〇 ^ when the body is joined, when the pressing amount α of the copper component is greater than 0.3t, although the copper component is in the case of ^^^ There is no residual seam in the coincident surface. The excessively large bonding jig is pressed in. The m is increased by L. The lining has a significant residual on the surface of the copper piece.

的凹痕,導致元件的指矣。阳lL -^ . . 、 口此,接合時接合治具之治具 本體在銅元件的麼入量 人、/ π υ· 以上、〇· 3t以下時,接 3治具的壓應力為正好適各 .. 灯週田的值,可以瞭解就可以在銅元 件與鋁元件的重人都丁* , σ °卩不產生縫隙的情況下完成接合,亦可 以鈿小銅元件表面的凹痕。 但是,此實驗中,接合治具的治具本體的圓周面是平 :在接合本體的圓周面形成有凹槽時’就會因為增加 ::體的原周面與銅元件的接觸面積,而可能可以減少 合時治具本體在鋼元件表面的壓入量。藉由發明人的實 在接口本體的圓周面形成有凹槽時,接合時接合治具 ° ''本體在銅元件的壓入量α在〇. 031:以上、〇. 3t以 下時是適當的。 實驗四: 實驗四係進行與實驗二相同的實驗,驗證接合治具之 :具本體的仃進逮率v(m/min)的適當範圍。而將鋼元件的 厚度設定為G.GG5m、接合治具之治具本體的板厚設 0.01m ° 結果如表四所示。 表四 材料·· 1050-0、Cu 厚度:Al-0. 001m、Cu-0· 〇〇5mf=杓 接合治具形狀:0 〇. 〇gm、〇 〇 /S=R/(5.0xl07xt2) 咖各The dents that cause the fingers of the component.阳lL -^ . . , mouth, the joint of the fixture when joining the fixture is in the amount of the copper component, / π υ · above, 〇 · 3t or less, the compressive stress of the 3 fixture is just right Each of the values of the lamp Zhoutian can be understood to be able to complete the bonding without any gap between the copper component and the aluminum component, and to dent the surface of the copper component. However, in this experiment, the circumferential surface of the jig body of the jig is flat: when the groove is formed on the circumferential surface of the joint body, 'because of the increase: the contact area of the original circumferential surface of the body with the copper member, and It may be possible to reduce the amount of pressing of the fixture body on the surface of the steel component. When the groove is formed on the circumferential surface of the actual interface body of the inventor, the engagement jig at the time of joining is suitable when the pressing amount α of the copper member is 〇.031: or more, 〇.3t or less. Experiment 4: Experiment 4 performed the same experiment as Experiment 2, and verified the appropriate range of the entanglement rate of the body with the onset rate v (m/min). The thickness of the steel element was set to G.GG5m, and the thickness of the fixture body of the joint jig was set to 0.01 m. The results are shown in Table 4. Table 4 Materials·· 1050-0, Cu Thickness: Al-0. 001m, Cu-0· 〇〇5mf=杓Jig fixture shape: 0 〇. 〇gm, 〇〇/S=R/(5.0xl07xt2) each

2036-5808B-PF 54 1270429 試片 編號 轉動數 圓周速率 (R) 行進速率 (V) β 壓入量(α) 接合強度 評價 參考 rpm m/min m/min m/min mCxlO-3) N/m2(xl06) 比-9 700 175.924 0. 25 0.140 0. 50 0 X 比-10 850 213.622 0.25 0.170 0.50 0 X 比-11 3000 753.960 0. 75 0. 603 0. 50 0 X 比-12 3000 753.960 1.00 0.603 0.50 0 X 比-13 3000 753. 960 2. 00 0.603 0.10 0 X 比-14 6000 1507.920 2.00 1.206 0. 50 0 X 比-15 3000 753.960 3. 00 0.603 0.20 0 X 4-1 3000 753. 960 0. 25 0.603 0. 50 86 〇 材料接合部破斷 4-2 2000 502. 640 0.25 0.402 0.50 71 〇 材料接合部破斷 4-3 3000 753.960 0.50 0.603 0.50 83 〇 材料接合部破斷 4-4 6000 1507.920 1.00 1.206 0. 50 80 〇 材料接合部破斷 由表四可以瞭解,接合時接合治具之治具本體的行進 速率V,在接合時接合治具之圓周速率為R(m/min)、重合 部的銅元件的厚度為t(m)時,較好為VSR/(5.0xl07xt2) 之範圍。 其理由,舉例來說,接合時接合治具的圓周速率變大 時,因接合治具與銅元件的摩擦接觸所產生的熱量亦會變 大,而使接合治具以高速行進時,重合部仍能保持一定的 溫度;而銅元件的厚度變大時,重合部要達到一定的溫度 以上就比較費時,若此時接合治具的行進速率過大時,在 重合部的溫度達到一定溫度以上之前,接合治具就已通 過,就會導致接合不良的問題。而實行良好的摩擦震動接 合時,接合治具的行進速率V、圓周速率R、銅元件的厚度 t必須要相互調節。而發明人們的實驗結果,係確認了滿 足V$R/(5.0xl07xt2)時,能夠有良好的接合。 因此,可以瞭解接合時接合治具較好為以下式(C)求出 的行進速率V(m/min·),沿著該銅金屬元件的表面移動時, 552036-5808B-PF 54 1270429 Test piece No. Number of revolutions Peripheral rate (R) Travel rate (V) β Press-in amount (α) Joint strength evaluation reference rpm m/min m/min m/min mCxlO-3) N/m2 (xl06) -9 700 175.924 0. 25 0.140 0. 50 0 X than -10 850 213.622 0.25 0.170 0.50 0 X -11 3000 753.960 0. 75 0. 603 0. 50 0 X -12 3000 753.960 1.00 0.603 0.50 0 X than -13 3000 753. 960 2. 00 0.603 0.10 0 X Ratio -14 6000 1507.920 2.00 1.206 0. 50 0 X Ratio -15 3000 753.960 3. 00 0.603 0.20 0 X 4-1 3000 753. 960 0. 25 0.603 0. 50 86 〇 Material joint break 4-2 2000 502. 640 0.25 0.402 0.50 71 〇 Material joint break 4-3 3000 753.960 0.50 0.603 0.50 83 〇 Material joint break 4-4 6000 1507.920 1.00 1.206 0. 50 80 破 Material joint breakage As can be seen from Table 4, the travel rate V of the jig body of the jig when joining is engaged, and the circumferential speed of the joint jig at the time of joining is R (m/min), coincidence When the thickness of the copper element is t (m), it is preferably in the range of VSR / (5.0 x 107 x t2). For this reason, for example, when the circumferential rate of the joining jig at the time of joining becomes large, the heat generated by the frictional contact between the joining jig and the copper member is also increased, and the joining portion is moved at a high speed, and the overlapping portion is made. When the thickness of the copper component is increased, it takes time to reach the temperature of the overlapping portion. If the traveling speed of the bonding fixture is too large, the temperature of the overlapping portion reaches a certain temperature or higher. If the jig is passed, it will cause a problem of poor joint. When a good frictional vibration engagement is performed, the traveling speed V of the joining jig, the peripheral speed R, and the thickness t of the copper member must be adjusted to each other. As a result of the inventors' experiments, it was confirmed that a good bonding was obtained when V$R/(5.0xl07xt2) was satisfied. Therefore, it can be understood that the joining speed at the time of joining is preferably a traveling rate V (m/min·) obtained by the following formula (C), as it moves along the surface of the copper metal member, 55

2036-5808B-PF 1270429 能夠有良好的摩擦震動接合。 0. R/(5. 0xl07xt2)...............⑹ 其中R為接合時該接合治具的圓周速率(m/min.); t為該重合部中的該銅元件的厚度(m)。 實驗五: 利用第6A〜6C圖所示的方法,實際地製作如第4圖所 示形狀的散熱元件。其中,散熱器材料係為鋁推型材料, 基板的厚度為0.005m、寬度為〇·〇6πι、長度為〇·2ιη;散熱 _ 鰭片的寬度為〇. 、配置間隔為〇· 0〇2m、高度為 0.015m。傳熱板的厚度為〇·〇〇 5m,寬度及長度與散熱器材 料的基板相同。摩擦震動接合所使用的接合治具中,、二 /口 /、 本體的直徑為0.08m、厚度為(KOim,接合條件設定為户具 本體的轉動數為3000RPM、行進速率為(K25m/min、在傳熱 板的壓入量為〇.〇〇〇5m。又,摩擦震動接合後,傳熱板的 表面會以機械加工切削掉〇 · 〇 〇 1 m的深度。 φ 藉由以上的條件,可以有效率地製造具有優良熱傳導 性的散熱元件。 接下來說明本發明第二群組的實施型態。 首先,在切入主題之前,以金屬元件的摩擦震動接合 的基本架構為刖提作說明。 所謂的金屬元件的摩擦震動接合,是藉由揍合治具的 壓應力使金屬元件重合部的縫隙消失,並藉由轉動的接合 治具與金屬元件的接觸所農生的震動分裂破货存在於金屬 兀件重合面的氧化物皮膜,並藉由摩擦熱將重合部高溫化 2036-5808B-PF 56 1270429 而發生塑性變形,在增加各 屬7^件的接觸面積與增大擴 政速率的同時將重合部接合的方法。2036-5808B-PF 1270429 can have good friction and vibration joints. 0. R/(5. 0xl07xt2) (6) where R is the circumferential velocity (m/min.) of the joining jig when engaged; t is the overlapping portion The thickness (m) of the copper component. Experiment 5: The heat dissipating member having the shape shown in Fig. 4 was actually produced by the method shown in Figs. 6A to 6C. The heat sink material is an aluminum push type material, the thickness of the substrate is 0.005 m, the width is 〇·〇6πι, the length is 〇·2ιη; the heat dissipation _ the width of the fin is 〇., and the arrangement interval is 〇·0〇2m The height is 0.015m. The thickness of the heat transfer plate is 〇·〇〇 5m, and the width and length are the same as those of the heat sink material. In the joint jig used for frictional vibration joining, the diameter of the second/port/body is 0.08 m, and the thickness is (KOim, the joining condition is set such that the number of rotations of the main body is 3000 RPM, and the traveling speed is (K25 m/min, The amount of pressing in the heat transfer plate is 〇.〇〇〇5m. Further, after friction and vibration bonding, the surface of the heat transfer plate is machined to cut the depth of 〇·〇〇1 m. φ By the above conditions, It is possible to efficiently manufacture a heat dissipating member having excellent thermal conductivity. Next, an embodiment of the second group of the present invention will be described. First, the basic structure of the frictional vibration joining of the metal member will be described before cutting into the subject. The so-called frictional vibration joint of the metal component is caused by the compressive stress of the twisting fixture, the gap of the metal component overlapping portion is eliminated, and the vibration of the agricultural component is broken and broken by the contact of the rotating joint jig and the metal component. The oxide film on the surface of the metal element overlaps, and the superposed portion is heated by frictional heat to 2018-5808B-PF 56 1270429, which is plastically deformed, increasing the contact area and increasing the contact area of each member. A method of joining the coincident portions while expanding the rate of the economy.

而特別是,將複數個金屬元件,依照溶點的高低順序 目互重合配置’將接合治具壓至溶點最高的金屬元件之側 而為接合時,在各金屬元件的重合部上升至接合所必要的 溫度時鄰近接合治具之侧的金屬元件仍能保持高抗形變強 度’而使接合治具的壓應力能夠有效率地傳達至重合面, 因而能夠完成金屬元件間無縫隙之高強度的接合。 此處舉出銘元件與溶點較高的鋼元件作為金屬元件之 -例’而較具體地說明。第8A〜_係顯示摩擦震動接合 的順序’其中第8A、8B為正面剖面圖,帛%圖為第⑽圖 之側視圖。在摩擦震動接合中’首先如第8a圖所示,將銘 几件_201與銅元件2〇2以面接觸的方式相互重合配置,以 未繪示於圖面的治具固定。 接下來,如第8B、8C圖所示,將以轉動轴為中 心、以圓周方向以圓周速度R高速轉動的接合治具2〇3之 治具本體203的圓周面垂直壓至銅元件2〇2的表面2〇2心 並將接合治具2G3沿著銅元件2〇2的表面2G2a以行進速率 V移動’而使鋁元件201與銅元件202重合並接合。接合 治具203係在轉動軸2〇3b的前端部將圓板狀的治具本^ 2〇3a固定,而治具本體2〇3a係由JIS: SKD61等工具鋼所 構成。相對於壓入鋼元件202的表面202a時的行進方向, 八本體203a係以送至後方的方向.,沿著轉,動軸Ub 周邊轉動。 2036-5808B-PF 57 1270429 如第9A圖所示,治具本體203a的圓周面係以一定量 a (m)壓入銅元件202的表面202a的狀態下以圓周方向高 速轉動,並沿著銅元件202的表面202a移動。而藉著上述 治具本體203a在銅元件202的表面202a之壓入,使紹元 件201與銅元件202之重合面的縫隙消失;並藉著高速轉 動的治具本體203a與銅元件202的接觸所產生的震動,將 鋁元件201與銅元件202之重合面的氧化物皮膜分裂破 壞;並如第9B圖所示,與治具本體203a接觸的銅元件2〇2 的既定區域與其鄰近區域、還有與上述區域鄰接的鋁元件 201的既定區域,因治具本體2〇3a與銅元件2〇2的摩擦接 觸所產生的熱量而高溫化,呈現可塑化(流動化)的固相狀 悲。上述的結果,使得銅元件2 〇 2與鋁元件2 〇 1在相互的 交界面上流動擴散,並由當初的表面開始塑性變形。In particular, a plurality of metal elements are arranged in a mutually overlapping manner according to the order of melting points. When the joining jig is pressed to the side of the metal element having the highest melting point and joined, the overlapping portion of each metal element rises to the joint. At the necessary temperature, the metal member adjacent to the side of the jig can maintain high deformation strength, and the compressive stress of the bonding jig can be efficiently transmitted to the coincident surface, thereby completing the high strength without gap between the metal members. Engagement. Here, a steel element having a high melting point and a high melting point is exemplified as an example of a metal element. 8A to _ show the order of frictional vibration engagement', wherein 8A and 8B are front cross-sectional views, and 帛% is a side view of (10). In the frictional vibration engagement, first, as shown in Fig. 8a, the inscription _201 and the copper member 2〇2 are placed in surface contact with each other, and are fixed by a jig not shown in the drawing. Next, as shown in Figs. 8B and 8C, the circumferential surface of the jig body 203 of the joining jig 2〇3 which is rotated at a high speed in the circumferential direction at the peripheral speed R in the circumferential direction is vertically pressed to the copper member 2〇. The surface of 2 is 2〇2 and the joining fixture 2G3 is moved along the surface 2G2a of the copper member 2〇2 at a traveling rate V to re-engage the aluminum member 201 and the copper member 202. The jig 203 is fixed to the tip end portion of the rotating shaft 2〇3b by the disc-shaped jig 2, 3a, and the jig main body 2〇3a is made of tool steel such as JIS: SKD61. The body 203a is sent to the rear direction with respect to the traveling direction when the surface 202a of the steel element 202 is pressed, and rotates around the moving shaft Ub. 2036-5808B-PF 57 1270429 As shown in Fig. 9A, the circumferential surface of the jig body 203a is rotated at a high speed in the circumferential direction with a certain amount of a (m) pressed into the surface 202a of the copper member 202, and along the copper Surface 202a of element 202 moves. By the pressing of the jig body 203a on the surface 202a of the copper member 202, the gap of the overlapping surface of the member 201 and the copper member 202 disappears; and the contact between the jig body 203a and the copper member 202 by the high-speed rotation is achieved. The generated vibration splits and breaks the oxide film of the overlapping surface of the aluminum member 201 and the copper member 202; and as shown in FIG. 9B, the predetermined region of the copper member 2〇2 in contact with the fixture body 203a and its adjacent region, Further, a predetermined region of the aluminum member 201 adjacent to the above region is heated by the heat generated by the frictional contact between the jig body 2〇3a and the copper member 2〇2, and exhibits a plasticized (fluidized) solid phase sorrow. . As a result of the above, the copper member 2 〇 2 and the aluminum member 2 〇 1 flow and diffuse at the mutual interface, and plastic deformation starts from the original surface.

接合治具203之治具本體203a的通過軌跡,如第9C 圖所不,藉由治具本體203a之壓應力而在銅元件2〇2的表 面202a形成一對淺的段部2〇2b。又,鋁元件2〇1與銅元 件202的重合面中,已塑性變形的鋁元件2〇1及銅元件2〇2 相互咬合,而固化成斷面凹凸型的接合面s,上述的接合 面S介於銅元件202與鋁元件2〇1之間而將二者確實地接 合0 此處,考慮到接合治具2〇3由鉛元件201之侧壓入時, 鋁元件201的熔點低於銅元件2〇2的熔點,鋁元件2〇1與 銅兀件202的重合面達到接合所资要货共晶溫言㈣代) 以上時,鋁元件201的抗形變強度就會變得較小,而使來 2036-5808B-PF 58 1270429 自接合治纟203 #壓力無法充分地傳達至銘元件2〇ι與銅 元件202的重合面,而容易發生接合不良。另一方面,將 接合治具203壓入熔點高於鋁元件2〇1的銅元件2〇2之侧 時’在銘元# 201 #鋼元件202 ^合面達到接合所必要 的共晶溫度以上時,銅元件202可以保持比較大的抗形變 強度,可使來自接合治具203的壓力充分地傳達至鋁元件 201與銅元件202的重合面,而使兩元件間的縫隙消失, 而能夠行高強度的接合。 以上述的方法將鋁元件201與銅元件2〇2重合而摩擦 震動接合時,較好為由下式(A)求出接合時接合治具2〇3(治 具本體203a)轉動的圓周速率R(m/min·): 250 ^R^ 2000...............(a) 接合時接合治具203的圓周速率小於25〇m/min時,接 合治具203與銅元件202之摩擦接觸所產生的熱量就過 小,而使銅元件202與鋁元件201的重合面的溫度過低, •而導致接合不良。另一方面,接合時接合治具203的圓周 速率大於2000m/min時,接合治具2〇3與銅元件2〇2之摩 擦接觸所產生的熱量就會大過所必要的,不僅僅是使接合 治具203的驅動能量損失會變大,並使與接合治具2〇3接 觸的銅兀件202的溫度會局部過高,導致該部分發生塑性 變形,而使接合治具2 0 3的壓應力無法充分地傳達至重合 面導致在兩元件間產生縫隙。因此,可以瞭解接合時接合 治具203以250〜2000m/min的圓厨遽率律動時,,接合治具 203與銅元件202之摩擦接觸所產生的熱量為恰好適當, 2036-5808B-PF 59 1270429 而能夠行良好的接合。 又,將銘元件201與銅元件202重合而摩擦震動接合 :接合時’接合治具2G3(治具本體2Q3a)在銅元件 、面壓入量《 (in)較好為由下式(B)求出: 〇· a $ 〇· ..................(Β) 其中t為重合部中的銅元件的厚度(m)。 接合時接合治具203在銅元件202表面的壓入量以小 於U3t時,銅元件2〇2與紹元妹2()1的重合面中會殘留 縫隙而導致接合不良。另一方面,壓入量“大於〇·3ΐ時, 雖然銅元件202與鋁元件201的重合面中不會殘留縫隙, 而過大的接合治具203的壓入量會在銅元件2〇2的表面殘 留顯著的凹痕’導致元件的損失。因此,接合時接合治具 203在銅元件202表面的壓入量α在〇 〇3七以上、0 ^ 2 下時’接合治* 203的壓應力為正好適當的值,可以瞭解 就可以在銅元件202與銘元件2〇1的重合部不產生縫隙的 情況下完成接合,亦可以縮小銅元件2G2表面的凹痕。 更者’將紹元件2〇1與銅元件2〇2重合而摩擦震動接 合時,接合時,接合治具2〇3(治具本體2〇3〇沿著銅元件 202的表面移動的行進速率v(m/min)較好為由下式(⑺求 出: 〇· l^FSR/(5· 〇xl〇7xti)……………(c) 其中R為接合時接合治具的圓周速率),· t為重合部_的銅元件的厚度〇心 其中,接合時接合治具203的圓周速率變大時,因接 2036-5808B-PF 60 1270429 合治具203與銅元件202的摩擦接觸所產生的熱量亦會變 大,而使接合治具203的行進速率v較高時,重合部仍能 保持-定的溫度;而銅元件2〇2的厚度變大時,重合部要 達到-定的溫度以上就比較費時,若此時接合治具2。3的 :進速率過大時’在重合部的溫度達到一定溫度以上之 前,接合治具203就已通過,就會導致接合不良的問題。 而實行良好的摩擦震動接合時,接合治具2〇3的行進速率 卜圓周速率R、銅元件的厚度,必須要相互調節。而實驗 結果係確認了滿足⑸/(5· 〇χ1 〇7χΐ2)時,能夠有良好的接 。另方面’由當接合治4 2〇3的行進速率v過小時, 會有降低接合效率的觀點,實驗結果係確認了滿^ 時,可以得到較好的接合效率。 而此金屬元件的摩擦震動接合並不限於將銘元件與銅 兀件重合並接合的情況’可以廣泛地適用於各金屬元件間 的重合並接合。而上述金屬元件的形狀,只要在相互重合 之後能夠使接合治具壓入就可以。更者,重合的金屬元件 的數量也不限於二個,三個以上亦可。 例如,在第1〇圖中,係將三個金屬元件(5〇〇〇系的銘 凡件加、簡系的銘元件2G1,、銅元件_相互重合 配置’將接合治具203的治具本體2〇34入三個金屬元件 中熔點最高的銅元件202之側,而為摩擦震動接合… 考慮到接合時各金屬元件的要達到一既定溫度以上,且此 至各金屬元件的接合面之傳達效率的影響,較好為將三個 2036-5808B-PF 61 1270429 的順序為銅元件202、The passage path of the jig body 203a of the jig 203, as shown in Fig. 9C, forms a pair of shallow segments 2〇2b on the surface 202a of the copper member 2〇2 by the compressive stress of the jig body 203a. Further, in the overlapping surface of the aluminum element 2〇1 and the copper element 202, the plastic element 3〇1 and the copper element 2〇2 which have been plastically deformed are engaged with each other, and are solidified into a joint surface s having a cross-sectional uneven shape, and the above-mentioned joint surface S is interposed between the copper member 202 and the aluminum member 2〇1 to positively bond the two. Here, considering that the bonding jig 2〇3 is pressed by the side of the lead member 201, the melting point of the aluminum member 201 is lower than The melting point of the copper element 2〇2, the overlapping surface of the aluminum element 2〇1 and the copper element 202 is as good as the joint eutectic temperature (4) generation, and the deformation resistance of the aluminum element 201 becomes smaller. Then, 2036-5808B-PF 58 1270429 self-bonding 纟 203 # pressure cannot be sufficiently transmitted to the overlapping surface of the member 2 ι and the copper member 202, and joint failure is likely to occur. On the other hand, when the bonding jig 203 is pressed into the side of the copper element 2〇2 whose melting point is higher than that of the aluminum element 2〇1, the surface of the steel element 202 is at the eutectic temperature necessary for bonding. When the copper element 202 can maintain a relatively large deformation strength, the pressure from the bonding fixture 203 can be sufficiently transmitted to the overlapping surface of the aluminum element 201 and the copper element 202, so that the gap between the two elements disappears, and the line can be eliminated. High strength joints. When the aluminum element 201 and the copper element 2〇2 are overlapped by the above-described method and frictionally vibrated, it is preferable to determine the circumferential speed at which the joining jig 2〇3 (the jig body 203a) is rotated by the following formula (A). R(m/min·): 250 ^R^ 2000............(a) When the circumferential speed of the joint jig 203 at the time of joining is less than 25 〇m/min, the joint treatment The heat generated by the frictional contact between the member 203 and the copper member 202 is too small, and the temperature at the overlapping surface of the copper member 202 and the aluminum member 201 is too low, resulting in poor bonding. On the other hand, when the circumferential speed of the joining jig 203 at the time of joining is more than 2000 m/min, the heat generated by the frictional contact between the joining jig 2〇3 and the copper member 2〇2 is greater than necessary, not only The driving energy loss of the joining jig 203 is increased, and the temperature of the copper piece 202 in contact with the joining jig 2〇3 is locally too high, causing the part to be plastically deformed, and the joining jig 2 0 3 The inability to adequately transfer the compressive stress to the coincident surface results in a gap between the two elements. Therefore, it can be understood that when the joining jig 203 is rotated at a round kitchen rate of 250 to 2000 m/min, the heat generated by the frictional contact between the jig 203 and the copper member 202 is just right, 2036-5808B-PF 59 1270429 and can do a good joint. Further, the inscription element 201 and the copper element 202 are superposed on each other to be friction-vibration-bonded: when bonding, the bonding jig 2G3 (the jig body 2Q3a) is pressed in the copper element and the surface (in) is preferably from the following formula (B) Find: 〇· a $ 〇· ..................(Β) where t is the thickness (m) of the copper component in the overlap. When the joining amount of the joining jig 203 on the surface of the copper member 202 is less than U3t, a gap remains in the overlapping surface of the copper member 2〇2 and the Shaoyuan 2()1, resulting in poor bonding. On the other hand, when the amount of press-fitting is "greater than 〇·3 ,, although no gap remains in the overlapping surface of the copper member 202 and the aluminum member 201, the amount of pressing of the excessive bonding jig 203 may be in the copper member 2〇2. A significant indentation on the surface causes a loss of the component. Therefore, when the bonding amount θ of the bonding jig 203 on the surface of the copper member 202 is 〇〇37 or more and 0^2, the compressive stress of the bonding process is 203. For just the appropriate value, it can be understood that the bonding can be completed without the gap between the copper component 202 and the overlapping portion of the component 2〇1, and the dent of the surface of the copper component 2G2 can be reduced. When the crucible 1 is overlapped with the copper member 2〇2 and frictionally vibrated, when the joint is engaged, the joining jig 2〇3 (the traveling speed v(m/min) of the jig body 2〇3〇 along the surface of the copper member 202 is higher. It is preferable to obtain the following formula ((7): 〇·l^FSR/(5· 〇xl〇7xti)..................(c) where R is the circumferential velocity of the jig when joining, and t is the coincident portion The thickness of the copper element of _ is in the center of the core, and when the circumferential rate of the joining jig 203 is increased at the time of joining, the connection is 2036-5808B-PF 60 1270. 429 The heat generated by the frictional contact between the fixture 203 and the copper member 202 is also increased, and when the traveling speed v of the bonding fixture 203 is high, the overlapping portion can maintain a constant temperature; and the copper member 2〇 When the thickness of 2 becomes large, it takes time and time for the overlapping portion to reach a predetermined temperature or higher. If the joining fixture is at this time, when the feed rate is too large, 'the joining fixture is before the temperature of the overlapping portion reaches a certain temperature or higher. When 203 has passed, it will cause a problem of poor joint. When a good frictional vibration joint is applied, the traveling rate of the joining jig 2〇3, the circumferential rate R, and the thickness of the copper member must be adjusted to each other. When it is confirmed that (5)/(5· 〇χ1 〇7χΐ2) is satisfied, it is possible to have a good connection. On the other hand, when the traveling rate v of the bonding treatment 4 2〇3 is too small, the bonding efficiency is lowered, and the experimental results are When the full ^ is confirmed, better bonding efficiency can be obtained. The frictional vibration bonding of the metal component is not limited to the case where the inscribed component and the copper component are combined and joined together' can be widely applied to the recombination between the metal components. Joint Further, the shape of the metal element may be such that the bonding jig can be pressed after being overlapped with each other. Further, the number of overlapping metal elements is not limited to two, and three or more may be used. For example, in the first In the figure, three metal components (5 铭 铭 铭 、 、 、 、 2 2 2 2 、 、 、 、 、 2 2 2 2 2 2 2 2 2 2 2 2 2 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合Among the metal elements, the side of the copper element 202 having the highest melting point is the frictional vibration joint. Considering the influence of the metal element to a predetermined temperature or more at the time of bonding, and the communication efficiency of the joint surface of each metal element is compared, Fortunately, the order of the three 2036-5808B-PF 61 1270429 is the copper component 202,

震動接合。 金屬元件依熔點的高低順序(此處 1 000系的紹元件201’ 、50 00系的 並將接合治具203壓至三徊a屈二 以上,係已說明金屬元件的摩擦震動接合的基本架 構,接T來說明應用上述摩擦震動接合之散熱元件的製造 第11A〜11B圖及第12A〜12B圖係用以說明本發明散熱 兀件的製造方法之第一實施型態的圖式。第nA〜nB圖係 顯示元件配置步驟的正面剖面圖、第12A圖係顯示摩擦震 動接合步驟的正面剖面圖、第丨2β圖係顯示間隔物脫離步 驟之正面剖面圖。又,第13圖為一分解斜視圖,係顯示本 φ 發明之散熱元件製造用治具之一實施型態。 在本實施型態中,首先如第11A圖所示,將鋁製的板 狀元件之ϋ片204與鐵製的板狀元件之間隔物205交互並 列’並立設配置於散熱元件製造用治具21 〇之元件設定部 212。 散熱元件製造用治具210,如第13圖所示,係由上面 是開放的箱型治具本體211、置放於元件設定部212且可 以滑動的壓板213、緊閉環检♦基板面定貨 閉螺栓216所構成。其中元件設定部212係形成於治具本 2036-5808B-PF 62 1270429 體211内部之凹部,·緊閉螺栓214得]乂與壓板213直交的 方向貫穿治具本體211的壁體,且其前端部係固著於壓板 213的背面,頭部則位於治具本體211的壁體的外側;基 板固疋板215係以與壓板213平行的方向,架設於、並橫 跨治具本體211的壁體的上部;緊閉螺栓216係用以將基 板固疋板215的兩端固定於治具本體211的壁體的上部。 而在此處,各鰭片204與各間隔物205以交互立設的 方式並排於元件設定部212,將緊閉螺栓214鎖緊而藉由 _壓板213的固定,使上述各鰭片m與各間隔物2()5彼此 之間在相互緊密接觸之下固定。此時,因為鰭片2〇4與間 隔物205是全體等高的,各鰭片2〇4的上面(基端面)與各 間隔物205的上面(基端面)係形成一水平面。 接下來,如第11Β圖所示,在配置於元件設定部212 的各鰭片204及各間隔物205的上面,搭載銅製的板狀元 件之基板206及其上方的基板固定板215,並將各鰭片204 • 及各間隔物205的上部(基端部)嵌入形成於基板固定板 215的下面之凹槽215a,而固定各鰭片2〇4及各間隔物 205 ’使其無法朝其長度方向(與紙面垂直的方向)移動。更 者,在此狀態下,由基板固定板215兩端的螺絲孔215b, 朝向治具本體211的壁體上面的螺絲孔2 π a,將緊閉螺栓 216旋緊,而將基板2〇6固定於鰭片204及陴 上部。又,雖然圖式中未繪示,將基板2〇6固定而使其無 法朝其寬度方向(紙面的左右方向)移育是必必要的。此處, 藉由鰭片204及間隔物2〇5的基端面與基板206的下面(一 2036-5808B-PF 63 1270429 表面)直接接觸,而完成將鰭片204與間隔物2〇5立設配置 於基板206的步驟。 而如第1 ΙΑ、11B圖所示的元件配置步驟,並非必要的Vibration joint. The basic structure of the frictional vibration joint of the metal component has been described in the order of the melting point of the metal component in the order of the melting point of the metal component (here, the 1 000-series element 201', the 50 00 system and the bonding jig 203 are pressed to three or more y. FIG. 11A to FIG. 11B and FIGS. 12A to 12B are diagrams for explaining the first embodiment of the method for manufacturing the heat dissipation member of the present invention. The n-picture diagram shows a front cross-sectional view of the component arrangement step, the 12th aspect shows a front cross-sectional view of the friction-vibration bonding step, and the second 2β-pattern shows a front cross-sectional view of the spacer disengagement step. Further, FIG. 13 is an exploded view. In the oblique view, one embodiment of the jig for manufacturing a heat dissipating member of the present invention is shown. In the present embodiment, first, as shown in FIG. 11A, the baffle 204 of the plate member made of aluminum is made of iron. The spacers 205 of the plate-like elements are alternately arranged in parallel with each other and disposed in the element setting unit 212 of the jig 21 for heat dissipation element manufacturing. The jig 210 for heat dissipating element manufacturing is opened as shown in FIG. Box fixture The body 211 is formed by a platen 213 that can be slidably placed in the element setting unit 212, and a closed-loop detection substrate surface order closing bolt 216. The element setting unit 212 is formed in the jig 2036-5808B-PF 62 1270429 body. The concave portion inside the 211, the tightening bolt 214 is inserted into the wall of the jig body 211 in a direction orthogonal to the pressing plate 213, and the front end portion thereof is fixed to the back surface of the pressing plate 213, and the head portion is located at the jig body 211. The outer side of the wall body; the substrate fixing plate 215 is mounted on the upper part of the wall body of the jig body 211 in a direction parallel to the pressure plate 213; the closing bolt 216 is used to fix the two sides of the substrate fixing plate 215 The end is fixed to the upper portion of the wall of the jig body 211. Here, each of the fins 204 and the spacers 205 are arranged side by side in the component setting portion 212 to lock the tight bolt 214. The fixing plate 213 is fixed such that the fins m and the spacers 2 are fixed in close contact with each other. At this time, since the fins 2〇4 and the spacers 205 are all equal, The upper surface (base end surface) of each fin 2〇4 and the upper surface of each spacer 205 (base end) Then, as shown in FIG. 11 , the substrate 206 of the copper plate-shaped element and the substrate above it are mounted on the upper surface of each of the fins 204 and the spacers 205 disposed on the element setting portion 212. The fixing plate 215 is fixed, and the upper portion (base end portion) of each of the fins 204 and each of the spacers 205 is fitted into the recess 215a formed on the lower surface of the substrate fixing plate 215, and the fins 2〇4 and the spacers 205 are fixed. 'It cannot be moved in the longitudinal direction (the direction perpendicular to the paper surface). Further, in this state, the screw holes 215b at both ends of the substrate fixing plate 215 are directed toward the screw holes 2 π on the wall of the jig body 211. a. The tightening bolt 216 is tightened to fix the substrate 2〇6 to the fin 204 and the upper portion of the crucible. Further, although not shown in the drawings, it is necessary to fix the substrate 2〇6 so as not to be migrating in the width direction (left-right direction of the paper surface). Here, the fin 204 and the spacer 2〇5 are completed by directly contacting the base end surface of the fin 204 and the spacer 2〇5 with the lower surface of the substrate 206 (a surface of 2036-5808B-PF 63 1270429). The step of being disposed on the substrate 206. The component configuration steps as shown in Figures 1 and 11B are not necessary.

限制’,、要在最後將各鰭片204與各間隔物205如第11B 圖所示配置於既定的位置,並不限制其順序。因此,亦可 以疋例如將相互之間具有間隔的各鰭片2〇4(或各間隔物 205)配置好,在將基板2〇6固定於其基端面之後,最後在 鰭片2〇4(或間隔物205)之間分別插入間隔物205(或鰭片 馨 204)。 接下來,如第12A圖所示,將以轉動軸2〇3b為中心以 圓周方向高速轉動的接合治具203之治具本體2〇3a的圓周 面垂直壓至基板206之另一表面206a,並使接合治具203 沿著基板206之另一表面206a移動,使鰭片204接合於基 板 206 〇 此時,因為構成基板206的銅的熔點高於構成鰭片204 φ 的鋁,鰭片204與基板206之交界面的溫度上升到接合時 所必要的溫度(共晶溫度:548°C )時,基板206仍能保持高 的抗形變強度,使接合治具203的壓應力能夠有效率地傳 達至乂界面’並且肖b彳亍鰭片2 0 4與基板2 0 6之間無縫隙的 高強度接合。 又,由於構成間隔物205的鐵的溶點高於橼成鰭片2〇4 的鋁及構成基板206的鋼,接合治具203的圓周速率與行 進速率設定在既定的範圍時,間隔物1OF不會與韓片204 及基板206接合,而能夠容易地僅接合基板2〇6與鰭片204。 2036-5808B-PF 64 1270429 最後,將散熱元件製造用治具21 0的緊閉螺栓21 6放 鬆,而將基板固定板21 5從治具本體211取下,並將緊閉 螺栓214放鬆,解除壓板213對鰭片204及間隔物205的 固定,如第12B圖所示,將基板206向上移動。如此一來, 僅有接合於基板206的各鰭片204 —起向上移動,而將各 間隔物2 0 5留在散熱元件製造用治具21 〇之元件設定部 212。如此可以以間隔物脫離步驟簡單地移除各間隔物 205,而可以製造出如第η圖所示之散熱元件250,其中 散熱元件250係由相互間隔的複數個鋁製鰭片2〇4立設接 合於銅製基板206之一表面。 藉由上述的散熱元件的製造方法,由於各鰭片204之 間分別置入各間隔物205,可以正確地保持鰭片204相互 之間隔’並可以決定相互以既定間隔隔開狀態的各鰭片204 之並列位置。又,間隔物205係補強了鰭片2〇4,摩擦震 動接合步驟時就不會有彎曲應力作用在鰭片2〇4,鰭片2〇4 的厚度亦可以變得非常薄。又,只要變更間隔物2〇5的厚 度’就能夠任意地變更鰭片204之配置間隔,更加上一併 變更鰭片204的高度的情況下,特別是將薄板厚、高板高 的各縫片204以短間隔立設接合於基板206之一表面,就 可以製造具有高高度/間隔比(例如高度/間隔比超過2 0 )的 散熱元件250。當然,間隔物205並不限定為金屬製,考 量到強度、加工性等因素時,亦可以使用陶瓷或是其他任 意材質;又亦可以適宜地決定贺筲物 件配置步驟中將各鰭片204立設配置於基板206的一表面 2036-5808B-PF 65 1270429 時’各間隔物205的基端面雖然亦可以不與基板2〇6的該 表面接觸’而考慮到摩擦震動接合步驟時來自接合治具2〇3 的屋應力作用為對縛片204的弯曲應力時,為了提高間隔 物205對韓片204的補強效果,較好為如上述實施型態一 般,準備同高的各間隔物205與各韓片2〇4,而使各間隔 物205的基端面與基板2〇6的該表面接觸。In the end, the fins 204 and the spacers 205 are arranged at a predetermined position as shown in Fig. 11B, and the order is not limited. Therefore, for example, the fins 2〇4 (or the spacers 205) having a space therebetween may be disposed, after the substrate 2〇6 is fixed to the base end surface thereof, and finally at the fins 2〇4 ( Spacers 205 (or fins 204) are inserted between spacers 205), respectively. Next, as shown in FIG. 12A, the circumferential surface of the jig body 2〇3a of the joining jig 203 which is rotated at a high speed in the circumferential direction around the rotating shaft 2〇3b is vertically pressed to the other surface 206a of the substrate 206, The bonding fixture 203 is moved along the other surface 206a of the substrate 206 to bond the fin 204 to the substrate 206. At this time, since the melting point of the copper constituting the substrate 206 is higher than the aluminum constituting the fin 204 φ, the fin 204 When the temperature at the interface with the substrate 206 rises to the temperature necessary for bonding (eutectic temperature: 548 ° C), the substrate 206 can maintain high deformation strength, so that the compressive stress of the bonding jig 203 can be efficiently A high-strength joint that communicates to the 乂 interface' and has no gaps between the fins 1024 and the substrate 205. Further, since the melting point of the iron constituting the spacer 205 is higher than the aluminum of the fins 2〇4 and the steel constituting the substrate 206, the circumferential rate and the traveling rate of the bonding jig 203 are set within a predetermined range, and the spacer 1OF The substrate 204 and the fins 204 can be easily bonded only without being bonded to the Korean wafer 204 and the substrate 206. 2036-5808B-PF 64 1270429 Finally, the closing bolt 21 6 of the jig for manufacturing the heat dissipating member is loosened, and the substrate fixing plate 215 is removed from the jig main body 211, and the closing bolt 214 is loosened and released. The fixing of the fins 213 to the fins 204 and the spacers 205, as shown in Fig. 12B, moves the substrate 206 upward. As a result, only the fins 204 bonded to the substrate 206 are moved upward, and the spacers 205 are left in the component setting portion 212 of the jig 21 for heat dissipation element manufacturing. Thus, the spacers 205 can be simply removed in the spacer detachment step, and the heat dissipating component 250 as shown in FIG. 11 can be fabricated, wherein the heat dissipating component 250 is formed by a plurality of aluminum fins 2 〇4 spaced apart from each other. It is bonded to one surface of the copper substrate 206. According to the above-described method for manufacturing a heat dissipating member, since the spacers 205 are respectively disposed between the fins 204, the fins 204 can be accurately spaced from each other and the fins can be determined to be spaced apart from each other at a predetermined interval. The parallel position of 204. Further, the spacers 205 reinforce the fins 2〇4, and no bending stress acts on the fins 2〇4 during the frictional vibration bonding step, and the thickness of the fins 2〇4 can be made very thin. Further, if the thickness of the spacers 2〇5 is changed, the arrangement interval of the fins 204 can be arbitrarily changed, and when the height of the fins 204 is changed more than once, the slits having a thin plate thickness and a high plate height are particularly used. The sheet 204 is erected to the surface of one of the substrates 206 at short intervals, so that the heat dissipating member 250 having a high height/space ratio (for example, a height/space ratio exceeding 20) can be manufactured. Of course, the spacer 205 is not limited to a metal. When considering factors such as strength and workability, ceramics or any other material may be used. Alternatively, the fins may be disposed in the step of configuring the object. When the surface of the substrate 206 is disposed on a surface 2036-5808B-PF 65 1270429, the base end surface of each spacer 205 may not be in contact with the surface of the substrate 2〇6, and the friction and vibration bonding step is taken from the bonding fixture. When the house stress of 2〇3 is the bending stress of the bonding piece 204, in order to improve the reinforcing effect of the spacer 205 on the Korean piece 204, it is preferable to prepare the spacers 205 of the same height as in the above-described embodiment. The Korean film 2〇4 is placed such that the base end faces of the spacers 205 are in contact with the surface of the substrate 2〇6.

又’藉由以上之散熱元件的製造方法,因為不需要如 辉接時-般在真空爐中加熱並維持一既定時間,而能夠將 各韓片204與基板接合,可以削減製造成本。而,在提升 基板206與各鰭月m之接合強度的同時,亦提升散熱元 件250的散熱性能的情況,就如第m圖所示,較好為使 接合治具203在基板206的裏面(基板2〇6的另一表面)的 移動能夠遍及各鰭片2〇4的基端面的全面,使得各縛片 能夠完全地接合於基板2〇6。(第15A〜说圖中以斜線標示 的區域係表示接合治具2〇3的移動軌跡)另一方面,在重視 接合成本的肖彳減時’例如如帛15B圖所示,亦可以移動接 合治具203,而未遍及各鰭片2〇4的基端面的全面,僅遍 及各鰭片204基端面的一部份。又,將基板2〇6與各韓片 2〇4摩擦震動接合時,同時也將基板2Q6與各間隔物2〇5 接合時,在間隔物脫離步驟中,雖然可以使用任何的方法 將各間隔物205從基板2Ό6與各鰭片204移除;在接合治 具203的治具本體203a的寬度小於鰭片204的厚度時,如 第15C圖所示,較好為以基板,2嘗輿嘗間賓物2〇5.本‘會接 合的執跡(在圖式中為各鰭片2〇4正上方的區域),來移動 2036-5808B-PF 66 1270429 接合治具203 ;又,僅僅使各鰭片2〇4與基板2〇6接觸, 而使各間隔物205不與基板206接觸的配置亦可;或是, 如上述的實施型態一般’使用熔點高於鰭片2〇4及基板2〇6 之熔點的間隔物205時,就與接合治具2〇3的移動軌跡無 關,各間隔物205不會接合於基板2〇6與鰭月2〇4時,即 使摩擦震動接合後,各間隔物2〇5亦不會接合於基板2〇6 與鰭片204,而使間隔物脫離步驟的程序可以省略,而能 夠削減製造成本。X ’因接合治具2〇3的壓應力而在基板 206之另一表面206a殘留較大凹痕時,可將基板2〇6的表 面206a切削掉一既定厚度,而能夠得到具美麗外觀的散熱 元件250。 μ 又,為了簡化摩擦震動接合步驟,如第16圖所示,亦 可以使用在轉動軸203b的周邊以一既定間隔固定有複數 個治具本體203a的接合治具203,取代接合治具2〇3。此 時,可以同時對複數個區域施以摩擦震動接合,可以縮斷 接合時所需要的時間,因而更加提昇效率。 而以上述方法所製造的散熱元件25〇的各鰭片2〇4的 前端面更與另一基板206,接合時,如第17圖所示,亦可 以製造出將相互間隔的各鰭片2〇4分別摩擦震動接合於基 板206、206的散熱元件250’ 。 第17圖所示之散熱元件250,的製造順序的第一樣態 如第18A圖所示,將相互間隔的各鰭片2〇4之間分別置入 各間隔物205,再於各縛片綱 分別配置基板206、206,,分別將接合治具203、203壓 2036-5808B-PF 67 1270429 至基板206的背面(圖式中的上面) J上面)U及基板206,的背面 (圖式中的下面),同時作麾棟雪 亏下厚“震動接合。而在最後,將各 間隔物205由侧面(垂直紙面的方向)取出。 散熱元件250,的製造順序的第二樣態如第應圖所 示,將相互間隔的各縛片204之間分別置入各間隔請, 再於…204的兩端(圖式中的上下端)分別配置基板 206、206’ ’在一側將接合治具2〇3向下壓至基板的Further, by the above method for manufacturing a heat dissipating member, since it is not necessary to heat and maintain the vacuum in a vacuum furnace for a predetermined period of time, the Korean wafer 204 can be bonded to the substrate, whereby the manufacturing cost can be reduced. However, while the bonding strength between the substrate 206 and each of the fins m is increased, and the heat dissipation performance of the heat dissipating member 250 is also improved, as shown in the mth diagram, it is preferable that the bonding jig 203 is on the inside of the substrate 206 ( The movement of the other surface of the substrate 2〇6 can extend over the entire surface end faces of the fins 2〇4 so that the respective tabs can be completely joined to the substrate 2〇6. (15A to the area indicated by oblique lines in the figure indicates the movement trajectory of the joining jig 2〇3) On the other hand, when the weighting of the joining cost is emphasized, for example, as shown in FIG. 15B, the joint can also be moved. The jig 203 does not extend over the entire surface of the base end faces of the fins 2〇4, only over a portion of the base end faces of the fins 204. Further, when the substrate 2〇6 is frictionally and frictionally bonded to each of the Korean sheets 2〇4, and when the substrate 2Q6 is joined to the spacers 2〇5, the spacers can be separated by any method. The object 205 is removed from the substrate 2Ό6 and each of the fins 204. When the width of the jig body 203a of the bonding jig 203 is smaller than the thickness of the fin 204, as shown in FIG. 15C, it is preferable to use the substrate. Intervening object 2〇5. This 'construction of the joint (in the figure is the area directly above each fin 2〇4), to move 2036-5808B-PF 66 1270429 joint fixture 203; The fins 2〇4 are in contact with the substrate 2〇6, and the arrangement in which the spacers 205 are not in contact with the substrate 206 may be used; or, as in the above-described embodiment, the melting point is higher than the fins 2〇4 and When the spacer 205 of the melting point of the substrate 2〇6 is independent of the movement trajectory of the bonding jig 2〇3, each spacer 205 is not bonded to the substrate 2〇6 and the fin month 2〇4, even after frictional vibration bonding. The spacers 2〇5 are also not bonded to the substrate 2〇6 and the fins 204, and the procedure for removing the spacers from the step can be omitted, and Reduce manufacturing costs. When X' remains a large indentation on the other surface 206a of the substrate 206 due to the compressive stress of the bonding jig 2〇3, the surface 206a of the substrate 2〇6 can be cut to a predetermined thickness, and a beautiful appearance can be obtained. Heat sink element 250. Further, in order to simplify the frictional vibration joining step, as shown in Fig. 16, a joining jig 203 in which a plurality of jig bodies 203a are fixed at a predetermined interval around the rotating shaft 203b may be used instead of the jig 2〇. 3. At this time, the frictional vibration joint can be applied to a plurality of regions at the same time, and the time required for the joint can be shortened, thereby improving the efficiency. When the front end faces of the fins 2〇4 of the heat dissipating component 25A manufactured by the above method are further joined to the other substrate 206, as shown in FIG. 17, the fins 2 which are spaced apart from each other can also be manufactured. The crucible 4 is frictionally coupled to the heat dissipating elements 250' of the substrates 206, 206, respectively. The first stage of the manufacturing sequence of the heat dissipating member 250 shown in FIG. 17 is as shown in FIG. 18A, and the spacers 205 are interposed between the fins 2 and 4, and the spacers are respectively placed in the respective spacers 205. The substrates 206 and 206 are respectively arranged, and the bonding jigs 203 and 203 are pressed 2036-5808B-PF 67 1270429 to the back surface of the substrate 206 (top surface in the drawing) J) and the back surface of the substrate 206 (pattern). In the middle of the middle), at the same time, the thick snow "shock joint" is used as the bottom of the snow. At the end, each spacer 205 is taken out from the side (the direction of the vertical paper). The second form of the manufacturing sequence of the heat dissipating member 250 is as follows. As shown in the figure, the spacers 204 are spaced apart from each other, and the substrates 206, 206' are disposed on both ends of the ... 204 (upper and lower ends in the drawing). The fixture 2〇3 is pressed down to the substrate

背面(圖式中的上面)而作摩擦震動接合。之後保持各元件 的配置關係’將鰭片2〇4、間隔物m、基板m、與基板 2〇6’上下反轉,如第18C圖所示,在另_㈣接合治具 2〇3向下壓至基板2()6,的背面(圖式中的上面)而作摩擦 震動接合。而在最後’將各間隔物2〇5由侧面(垂直紙面的 方向)取出。 散熱7G件250’的製造順序的第三樣態如第19A圖所 示,將相互間隔的各鰭片2〇4之間分別置入各間隔物2〇5, 在僅僅於各鰭片204的一端(圖式中的上端)配置基板 2〇6,在一側將接合治具2〇3向下壓至基板2〇6的背面(圖 式中的上面)而作摩擦震動接合。之後保持各元件的配置關 係,將鰭片204、間隔物205、與基板206上下反轉,如第 19B圖所示,於各鰭片2〇4的另一端(圖式中的上端)配置 基板20 6 ,更如第19C圖所示,在另一侧將接合治具2〇3 向下壓至基板206,的背面(圖式中的上面)而作摩擦震動 接合。而在最後,將各間隔物^ 5實側'm,直 取出。 2036-5808B-PF 68 1270429 散熱π件250’的製造順序的第四樣態如第igD圖所 示,將相互間隔的各鰭片2〇4之間分別置入各間隔物2〇5, 在僅僅於各韓片204的一端(圖式中的上端)配置基板 206 ’在一侧將接合治具2〇3向下塵至基板2〇6㈣面(圖 式中的上面)而作摩擦震動接合。接下來’如帛挪圖所 不,將基板206與鰭片204向上移動,將基板2〇5取出, 而先完成散熱元件250。之後,將散熱元件25〇上下反轉, 如第19F圖所示’在各鰭片2〇4之間分別置入各間隔物 2〇5,於各鰭# 2G4的另—端(圖式中的上端)配置基板 2〇6’。更如第19G圖所示,在另一側將接合治|2〇3向下 壓至基板206’的背面(圖式中的上面)而作摩擦震動接 合。而在最後,將各間隔物2〇5由側面(垂直紙面的方向) 取出。 &接下來說明本發明散熱元件的製造方法之第二實施型 恶。本實施型態與上述第一實施型態約略相同,而不同點 在於不使用散熱元件21G,而使用間隔物治具22()以代之。 間隔物治具220’如第20A圖所示,係為將各間隔物 205的前端部(圖式中的下端部)相互連結的斷面為梳子形 狀的治具。而在元件配置步驟中’將間隔物治請的各 間隔物205向上放置並固定後,如第_圖所示,分別將 ^ 2〇4 # A # m # 205 ^ ^ f 2〇C ® ^ ^ , 將各鰭片204的上面(基端面)與基板2〇6的下面(一表面) 206 ® ^ °^ , 將基板206固定於間隔物治具22〇的上面之後,再由侧面 2036-5808B-PF 69 1270429 (與紙面垂直方向)將各間隔物205插入。 如第20D圖所示,在接下來的摩擦震動接合步驟中, 將接合治具203壓至基板206的上面(另—表面),將基板 206摩擦震動接合於各鰭片204。 如第20E圖所示,在最後的間隔物脫離步驟中,將基 板206及接合於其上的各鰭片204向上移動,而移除間隔 物治具220。 如本實施型態使用間隔物治具220時,就不需要使用 散熱元件製造用治具210,其優點在於可以省略配置間隔 物205的程序。 接下來說明本發明散熱元件的製造方法之第三實施型 態。本實施型態與上述第一實施型態約略相同,而不同點 在於70件配置步驟中的鰭片配置步驟以及其後的基板配置 步驟。 而最初的鰭片配置步驟中,如第21A圖所示,各鰭片 204與各間隔物205交互並列,並立設配置於散熱元件製 造用治具210之元件設定部212,此時各間隔物2〇5的基 端面分別沒入各鰭片2〇4的基端面之下,而使各間隔物2〇5 的基端面分別低於各鰭片204的基端面的高度差不大於各 間隔物205的厚度。換言之’各鰭片2〇4的高度係分別高 於各間隔物205的高度,且其範圍係在間隔物20 5的厚度 祀圍内,各鰭片204的基端面分別較各間隔物2〇5的基端 面犬出,且其範圍係在間隔翁2肺獨厚度範 接下來的基板配置步驟中,如第21B圖所示,在立設 2036-5808B-PF 70 1270429 配置於元件設定部212的各鰭片咖上,承載基板2〇6。 然後如第21C、2U)圖所示,藉由朝向鰭片2()4之向下的壓 應力之作用將各鰭# 204的基端部2〇4a(較各間隔物2〇5 突出的部分)·彎折並固定在呈斷面L字型的狀態。此時,由 於鰭片204的基端部购的高度在間隔物2〇5的厚度範圍 内,被弯折的鰭# 204的基端部204a不會相互重疊,而形 成平行於並靠著基板206的一表面(圖式中的下表面)的表 面0 接下來,如第22A圖所示,將以轉動軸2〇补為中心以 圓周方向高速轉動的接合治具2()3的治具本體m的圓周 面:直壓入基板206的另一表面2〇6a,並使接合治具2〇3 化著基板206的表面206a移動,而將各籍片m的基端部 204a接合於基板206。 夺因為被譬折成直角的鰭片2〇4的基端部形 成沿著基2G6之-表面的面,與第一實施型態比較,係 增加基板206與鰭m㈣面積,可使兩者確實地接 合。而藉由本發明’即使鰭# 2〇4的厚度非常薄,可以製 以出基板206與各鰭片m已確實地立設接合的散執元 250 〇 最後’如第22B圖所示,將基板2〇6向上移動,僅有 6 # ^ ^ 206 ^ , 2〇4 ^ ^ ^ ^ # % ^ ^The back side (the upper part in the drawing) is used for frictional vibration engagement. After that, the arrangement relationship of the respective elements is kept 'the fins 2〇4, the spacers m, the substrate m, and the substrate 2〇6' are reversed up and down, as shown in FIG. 18C, and the other _(four) bonding jigs 2〇3 direction The back surface (the upper surface in the drawing) of the substrate 2 () 6 is pressed down to perform frictional vibration bonding. At the end, each spacer 2〇5 is taken out from the side (the direction of the vertical paper). The third state of the manufacturing sequence of the heat dissipating 7G member 250' is as shown in FIG. 19A, and the fins 2〇4 spaced apart from each other are placed in the spacers 2〇5, respectively, in only the fins 204. The substrate 2〇6 is disposed at one end (upper end in the drawing), and the bonding jig 2〇3 is pressed down to the back surface (upper surface in the drawing) of the substrate 2〇6 on one side to perform frictional vibration bonding. Thereafter, the arrangement relationship of the respective elements is maintained, and the fins 204, the spacers 205, and the substrate 206 are vertically inverted. As shown in FIG. 19B, the substrate is disposed at the other end of each of the fins 2〇4 (the upper end in the drawing). 20 6 , as shown in Fig. 19C, on the other side, the bonding jig 2〇3 is pressed down to the back surface of the substrate 206 (the upper surface in the drawing) for frictional vibration bonding. At the end, the spacers 5 are solid side 'm, straight out. 2036-5808B-PF 68 1270429 The fourth state of the manufacturing sequence of the heat-dissipating π-piece 250' is as shown in the igD diagram, and the spacers 2〇4 spaced apart from each other are placed in the spacers 2〇5, respectively. Only at one end of each of the Korean sheets 204 (the upper end in the drawing), the substrate 206' is disposed on one side of the bonding jig 2〇3 to the surface of the substrate 2〇6 (four) (the upper surface in the drawing) for frictional vibration bonding. . Next, if the image is not moved, the substrate 206 and the fins 204 are moved upward, and the substrate 2〇5 is taken out, and the heat dissipating element 250 is completed first. Thereafter, the heat dissipating member 25 is reversed up and down, as shown in FIG. 19F, and each spacer 2〇5 is placed between each fin 2〇4, at the other end of each fin #2G4 (in the drawing) The upper end) is configured with the substrate 2〇6'. Further, as shown in Fig. 19G, the bonding treatment|2〇3 is pressed down on the other side to the back surface of the substrate 206' (the upper side in the drawing) for frictional vibration bonding. At the end, each spacer 2〇5 is taken out from the side (direction of the vertical paper). & Next, a second embodiment of the method for manufacturing a heat dissipating member of the present invention will be described. This embodiment is approximately the same as the first embodiment described above, except that the heat dissipating member 21G is not used, and the spacer jig 22() is used instead. As shown in Fig. 20A, the spacer jig 220' is a jig having a comb shape in which the tip end portions (lower end portions in the drawings) of the spacers 205 are connected to each other. In the component arrangement step, after the spacers 205 of the spacers are placed up and fixed, as shown in the figure _, respectively, ^ 2〇4 # A # m # 205 ^ ^ f 2〇C ® ^ ^, the upper surface (base end surface) of each fin 204 and the lower surface (one surface) of the substrate 2〇6 (one surface) 206 ® ^ ° ^, after the substrate 206 is fixed on the upper surface of the spacer jig 22, and then by the side 2036- 5808B-PF 69 1270429 (in the direction perpendicular to the paper), each spacer 205 is inserted. As shown in Fig. 20D, in the subsequent frictional vibration bonding step, the bonding jig 203 is pressed onto the upper surface (other surface) of the substrate 206, and the substrate 206 is frictionally and vibrationally bonded to the respective fins 204. As shown in Fig. 20E, in the final spacer detachment step, the substrate 206 and the fins 204 bonded thereto are moved upward to remove the spacer jig 220. When the spacer jig 220 is used in the present embodiment, it is not necessary to use the jig 210 for heat dissipating component manufacturing, which is advantageous in that the procedure of disposing the spacer 205 can be omitted. Next, a third embodiment of the method of manufacturing the heat dissipating member of the present invention will be described. This embodiment is approximately the same as the above-described first embodiment, and differs in the fin configuration step in the 70-part configuration step and the subsequent substrate configuration step. In the first fin arrangement step, as shown in FIG. 21A, each of the fins 204 is alternately arranged with each of the spacers 205, and the element setting portion 212 disposed in the jig 210 for heat dissipation element mounting is erected. The base end faces of the 2〇5 are respectively below the base end faces of the fins 2〇4, and the base end faces of the spacers 2〇5 are respectively lower than the base end faces of the fins 204, and the height difference is not more than each spacer. The thickness of 205. In other words, the height of each fin 2〇4 is higher than the height of each spacer 205, and the range is within the thickness of the spacer 20 5 , and the base end faces of the fins 204 are respectively larger than the spacers 2 . The base end face of 5 is out of the range, and the range is in the substrate arrangement step of the spacer width 2, and as shown in FIG. 21B, the standing unit 2036-5808B-PF 70 1270429 is disposed in the component setting portion 212. Each of the fins is on the substrate 2'6. Then, as shown in Figs. 21C and 2U), the base end portion 2〇4a of each fin #204 is protruded by the downward compressive stress toward the fin 2() 4 (more than the spacer 2〇5) Part) · Bending and fixing in a state of an L-shaped cross section. At this time, since the height of the base end portion of the fin 204 is within the thickness range of the spacer 2〇5, the base end portions 204a of the bent fins #204 do not overlap each other, but are formed parallel to and against the substrate. Surface 0 of one surface (lower surface in the drawing) of the following: Next, as shown in Fig. 22A, the jig of the jig 2 () 3 which is rotated at a high speed in the circumferential direction centering on the rotation axis 2 〇 The circumferential surface of the body m is directly pressed into the other surface 2〇6a of the substrate 206, and the bonding fixture 2〇3 is moved to the surface 206a of the substrate 206, and the base end portion 204a of each of the sheets m is bonded to the substrate. 206. The base end portion of the fin 2〇4 which is folded at right angles forms a surface along the surface of the base 2G6, and compared with the first embodiment, the area of the substrate 206 and the fin m(4) is increased, so that both can be Ground joint. According to the present invention, even if the thickness of the fins #2〇4 is very thin, it is possible to produce a loose element 250 in which the substrate 206 and the respective fins m are surely erected. Finally, as shown in FIG. 22B, the substrate is as shown in FIG. 22B. 2〇6 moves up, only 6 # ^ ^ 206 ^ , 2〇4 ^ ^ ^ ^ # % ^ ^

隔物^留在散熱元件製造m2i0的元件設定部212, 、製ia出八有弯折的基曹部2㈣,立說斯 一表面的散熱元件250。 2036-5808B-PF 1270429 接下來說明纟發明t熱元件的製造方法之第四實施型 態。本實施型態與上述第一實施型態約略相同,而不同點 在於使用斷面凹字型的鰭片構成材23〇取代鰭片2〇4。 而最初的70件配置步驟中,首先如第23八圖所示,將 -銘合金製的薄板材231的中央部與一間隔物2〇5直交配 置,使二者成為倒τ字型,如第23B圖所示,在斷面凹字 型鰭片構成材製造治具240的中央部的溝槽内,將板材231 彎折,並將其中央部壓入的同時插入間隔物2〇5,而如第 23C圖所示,於中央部的溝槽内形成將間隔物2〇5爽在中 間的斷面凹子型的鰭片構成材230。鰭片構成材23〇係以 左右一對的鰭片與連結上述左右一對的鰭片2〇4的基端部 204a而形成其斷面凹字型。 而準備複數個如上所述之在左右一對的鰭片2〇4之間 置入間隔物205的鰭片構成材230,將上述各鰭片構成材 230與各間隔物205’交互並列,而如第23D圖所示,立設 φ 配置於散熱元件製造用治具210的元件設定部212。此時 的鰭片構成材230係為在左右一對的鰭片2〇4之間置入有 間隔物205的狀態、且為基端部204a向上的狀態。又,置 入於各鰭片構成材230相互之間的各間隔物2〇5,的高度 係高於置入於左右一對的鰭片204之間的間隔物,且較好 為二者的高度 材230的基端部204a與間隔物205,的基端部形成水平的 上表面。 之後,如第23E圖所示,於立設配置於元件設定部212 2036-5808B-PF 72 1270429 的各鰭片構成材230與各間隔物20 5’的上面搭載基板206 並將其固定。此處將縛片構成材230的基端部204a及間隔 物205’形成與基板206的一表面(圖式中的下表面)接觸 的狀態時,即完成了元件配置步驟。 而第23A〜23B圖所示的元件配置步驟並非一必要之限 制,只要各基板構成材230、各間隔物205、各間隔物205, 在最後配置於如第23E圖所示之既定位置時,並不限定其 順序。因此,例如將已預先形成斷面凹字型的鱗片構成材 230相互間隔排列;分別將各間隔物2〇5插入各鰭片構成 材230之左右一對的鰭片204之間,同時並分別將各間隔 物2 0 5插入各鰭片構成材2 3 0相互之間;最後配置基板 206之步驟亦可。或是將已預先形成斷面凹字型的鰭片構 成材230相互間隔排列;接下來配置基板2〇6 ;而最後分 別將各間隔物2 0 5插入各鯖片構成材2 3 0之左右一對的鰭 片204之間,同時並分別將各間隔物2〇5,插入各鰭片構 成材230相互之間之步驟亦可。 接下來的摩擦震動接合步驟中,如第24A圖所示,將 以轉動軸203b為中心以圓周方向高速轉動的接合治具2〇3 的治具本體203a的圓周面垂直壓至基板2〇6之另一表面之 表面2〇6a,並使接合治具203沿著基板206之表面2〇6a 移動’而使各鰭片構成材2洲的基端部2〇4a接合於基板 206 〇 此時,因為鰭片構成,材1着的fc基端部2〇4a形成沿著基 板206之-表面的面’與第一實施型態比較,係增加基板 2036-5808B-PF 73 1270429 206與鰭片204之接觸面積,可使兩者確實地接合。而藉 由本實施型態,即使鰭片204的厚度非常薄,可以製造出 基板206與各鰭片204已確實地立設接合的散熱元件25〇。 最後’如第24B圖所示,將基板2〇6向上移動時,僅 一起向上移動, 有已接合於基板206的各鰭片構成材230The spacers are left in the element setting portion 212 of the heat dissipating element manufacturing m2i0, and the sub-cavity portion 2 (four) which is bent, and the heat dissipating element 250 on the surface. 2036-5808B-PF 1270429 Next, a fourth embodiment of the manufacturing method of the invention t heat element will be described. This embodiment is roughly the same as the above-described first embodiment, except that the fin-shaped fin member 23 is replaced with the fin-shaped fin 23〇. In the first 70 steps, first, as shown in Fig. 23, the central portion of the thin plate 231 made of -Ming alloy is placed orthogonally to a spacer 2〇5, so that the two become inverted τ-shaped, such as As shown in Fig. 23B, in the groove at the center of the cross-sectional concave fin constituent material manufacturing jig 240, the plate member 231 is bent, and the center portion is press-fitted into the spacer 2〇5, On the other hand, as shown in Fig. 23C, a fin-shaped fin structure 230 in which the spacer 2〇5 is cooled in the middle is formed in the groove in the center portion. The fin constituent material 23 is formed by a pair of right and left fins and a base end portion 204a that connects the pair of left and right fins 2〇4 to form a cross-sectional concave shape. Further, a plurality of fin constituent members 230 in which the spacers 205 are placed between the pair of left and right fins 2〇4 as described above are prepared, and the fin constituent members 230 are alternately arranged with the spacers 205'. As shown in FIG. 23D, the element setting unit 212 disposed in the jig 210 for heat radiation element manufacturing is erected. The fin constituent material 230 at this time is in a state in which the spacer 205 is placed between the pair of right and left fins 2〇4, and the base end portion 204a is in the upward state. Further, the spacers 2〇5 placed between the respective fin constituent members 230 are higher in height than the spacers placed between the pair of right and left fins 204, and are preferably both. The base end portion 204a of the height member 230 and the base end portion of the spacer 205 form a horizontal upper surface. Then, as shown in Fig. 23E, the substrate 206 is mounted on the upper surface of each of the fin constituent members 230 and the spacers 20 5' disposed on the element setting portions 212 2036-5808B-PF 72 1270429, and is fixed. Here, when the base end portion 204a of the bonding sheet member 230 and the spacer 205' are brought into contact with one surface (the lower surface in the drawing) of the substrate 206, the component disposing step is completed. The component arrangement steps shown in FIGS. 23A to 23B are not necessarily limited as long as the substrate constituent members 230, the spacers 205, and the spacers 205 are finally disposed at a predetermined position as shown in FIG. 23E. The order is not limited. Therefore, for example, the scale constituent members 230 having the cross-sectional concave shape formed in advance are arranged at intervals; and the spacers 2〇5 are respectively inserted between the pair of right and left fins 204 of the respective fin constituent members 230, and respectively Each of the spacers 205 is inserted between the respective fin constituent members 230, and the step of arranging the substrate 206 is also possible. Or, the fin constituents 230 having the pre-formed concave shape are arranged at intervals; and then the substrate 2〇6 is disposed; and finally, the spacers 2 0 5 are respectively inserted into the respective constituents of the cymbal sheet 2300. The steps of inserting the spacers 2 to 5 between the pair of fins 204 and inserting the respective fins 230 into each other may be performed. In the subsequent frictional vibration joining step, as shown in Fig. 24A, the circumferential surface of the jig body 203a of the joining jig 2〇3 which is rotated at a high speed in the circumferential direction around the rotating shaft 203b is vertically pressed to the substrate 2〇6. The surface 2〇6a of the other surface is joined, and the bonding fixture 203 is moved along the surface 2〇6a of the substrate 206 to bond the base end portion 2〇4a of each fin constituent material 2 to the substrate 206. Because of the fin configuration, the fc base end portion 2〇4a of the material 1 forms a surface along the surface of the substrate 206. Compared with the first embodiment, the substrate 2036-5808B-PF 73 1270429 206 and the fin are added. The contact area of 204 allows the two to be reliably joined. According to this embodiment, even if the thickness of the fin 204 is extremely thin, the heat dissipating member 25A in which the substrate 206 and the fins 204 are surely erected can be manufactured. Finally, as shown in Fig. 24B, when the substrate 2〇6 is moved upward, only the upward movement is performed together, and each of the fin constituent members 230 joined to the substrate 206 is provided.

而將各間隔物205、205’留在散熱元件製造用治具21〇的 π件設定部212,可以製造出具有鰭片構成材23〇的基端 部204立設接合於基板206之一表面的散熱元件25〇。 以上係以說明散熱元件的製造方法、以該方法所製造 的散熱το件、以及該方法所使用的散熱元件製造用治具的 實施型態’但非用以限定本發明,任何熟習此技藝者,在 不脫離本發明之精神和範圍内,當可作些許之更動與潤飾。 例如關於散熱元件,亦可以如第25Α圖所示,具有在 長度方向的中央部高度縮減的複數個鰭片2〇4,、和無上 述情況的複數個鰭片204 一起相互間隔排列並立設接合於 基板206的散熱元件251 ;亦可以如帛挪圖所示,具有 複數個在其高度沿著長度方向成凹凸形狀的梳子狀H片 2〇4’,相互間隔排列並立設接合於基板m的散熱元件 252。而特別是與第14圖所示的散熱元件㈣比較,散熱 凡件252韓片的表面積特別大’而提升其散熱性能。 =第26Α圖中’具有複數個不同直徑的薄的圓筒形狀的鰭 間隔排列成同心圓狀並立設<接舍於言板,'2〇6八 的一表面的散熱元件253;亦可以是如第_圖所示,具By leaving the spacers 205 and 205' in the π-piece setting portion 212 of the heat-radiating element manufacturing jig 21, it is possible to manufacture the base end portion 204 having the fin constituent material 23〇 to be erected and bonded to one surface of the substrate 206. The heat dissipating component 25〇. The above description is directed to a method of manufacturing a heat dissipating member, a heat dissipating member manufactured by the method, and an embodiment of a jig for manufacturing a heat dissipating member used in the method, but is not intended to limit the present invention, and any skilled in the art. It is possible to make some changes and refinements without departing from the spirit and scope of the invention. For example, as for the heat dissipating member, a plurality of fins 2〇4 having a height reduction in the central portion in the longitudinal direction may be arranged as shown in Fig. 25, and a plurality of fins 204 having no such case may be spaced apart from each other and erected. The heat dissipating element 251 of the substrate 206 may have a plurality of comb-shaped H-pieces 2〇4' having a concavo-convex shape along the length thereof as shown in the figure, which are arranged at intervals and are erected and bonded to the substrate m. Heat sink element 252. In particular, compared with the heat dissipating component (4) shown in Fig. 14, the surface area of the heat dissipating member 252 is particularly large, and the heat dissipating performance is improved. = in Fig. 26, 'a thin cylindrical fin having a plurality of different diameters is arranged in a concentric circle and erected < a heat dissipating element 253 attached to a surface of the '2〇6-8; Is as shown in the figure _

2036-5808B-PF 74 1270429 有複數個平面波形的鰭片204B相互間隔並列、且立設接合 於基板206之一表面的散熱元件254。 更者,散熱元件的基板亦不限定為平板狀,亦可以是 如第26C圖所示,於縱斷面呈圓弧狀的半圓筒基板別⑽的 外周面立設接合有複數個相互間隔的鰭片2〇4的散熱元件 255 〇 當然,上述的散熱元件251〜255均是以目前已述及的 散熱元件的製造方法所製造。 以上所說明的散熱元件製造方法,雖然係應用金屬元 件的摩擦震動接合,亦可以是接合對象物並不限定於金屬 疋件的70件接合方法。例如散熱元件中的鰭片2〇4與基板 2 06中其中之一或二者為非金屬例如陶瓷等所製的元件 時,本發明就成為將相互間隔的複數個板材立設接合於一 基板的一表面的元件接合方法。 實施例 觀察實際應用第21Α〜21C圖與第22Α〜22Β圖所示之散 熱元件的製造方法後的鰭片204與基板206的接合部的組 織。 此處所使用的鰭片204係為板厚imm( = 10xl(r3mm)、 高度 26mm( = 2· 6xl〇-2mm)、長度 60mm( = 6· 〇><1〇-2111111)之 A1〇5〇 鉛合金;間隔物2仍係為板犀 SSmnKd.SxlO-2·)、長度 57mm( = 5 7xl〇-2mm)之軟鋼;以及 基板 206 係為板厚 2_f =2·餘If3耐产 57mm( = 5.7xl〇-2mm)、長度 60mm( = 6 〇xl(r2mm)2無氧銅。此 2036-5808B-PF 75 1270429 時鰭片204的高度/間隔比為26。又,摩擦震動接合時係 設定為··接合治具203的治具本體203a的直徑為 80mm( = 8.0xl0 mm)、寬度為 5mm( = 5 〇xl〇-3mm)、轉動數為 300 0RPM、行進速率 V 為 4〇〇〇mm/min( = 4· Om/min)、在基板 206 的表面 206a 的壓入量 α 為 〇3mm( = 3· 〇xl〇-4mm)。 摩擦震動接合後將間隔物2〇5移除,觀察鰭片2〇4與 基板206的接合部的組織。如第27A圖所示,可以見到基 φ 板206有若干的變形、鰭片204有浙與彎等變形。鰭片2〇4 與基板206之間係藉由CuA12所構成的反應層2〇7所接 合。將第27A圖放大而如第27B圖所示,反應層2〇7的大 部分係受到摩擦震動接合時接合治具的壓應力的作用被掃 出而置於外側鰭片204的基端部區域的反應層2〇7的厚度 為30/zm( = 3.〇xl(T5m)以下,並未見到龜裂與縫隙等。而反 應層207係會妨礙從基板2〇6到鰭片2〇4的熱傳導,具有 極薄的反應層207時,係成為具高散熱性能的散熱元件。 • 接下來,說明本發明之第三群組的實施形態。 摩擦震動接合 首先,在切入主題之前,以金屬元件的摩擦震動接合 的基本架構為前提作說明。 所謂的金屬元件的摩擦震動接合,是藉由接合治具的 壓應办使金屬元件重合部的缝隙洧免 治具與金屬元件的接觸所產生的震動分裂破壞存在於金屬 元件重合面的氧化物皮膜Γ並藉,摩職將重τ部紋^ 而毛生塑ϋ變形,在增加各金屬元件的接觸面積與增大擴 2036-5808B-PF 76 1270429 散速率的同時將重合部接合的方法 而特別是,將複數個金屬元件,依照熔 相互重合配置’將接合治具溶點·至最高的金屬元件之侧 :為接合時,在各金屬元件的重合部上升至接合所必要的 -度時鄰近接合治具之側的金屬元件仍能保持高抗形變強 度’而使接合治具的壓應力能夠有效率地傳達至重合面, 因而能夠完成金屬元件間無縫隙之高強度的接合。 匕處牛出鋁元件與熔點較高的銅元件作為金屬元件之 一例’而較具體地說明。第28A〜28C圖係顯示摩擦震動接 〇的順序其中第28Α、8β為正面剖面圖,第28C圖為第 娜圖之側視圖。在摩擦震動接合中,首先如f 28Α圖所 不’將銘元件3G1與鋼元件3〇2以面接觸的方式相互重合 配置,以未繪示於圖面的治具固定。 接下來,如第28B、28C圖所示,將以轉動轴3〇3b為 中心、以圓周方向以圓周速度R高速轉動的接合治具· 之治具本體303的圓周面垂直壓至銅元件3〇2的表面 〇2a並將接口冶具3〇3沿著銅元件的表面%以行 進速率v移動,而使銘元件3〇1與銅元件3〇2重合並接合。 接。/α /、303係在轉動軸3〇3b的前端部將圓板狀的治具本 體303a固疋,而治具本體3〇3a係由川:別則等工具鋼 所構成相對於壓入銅元件3 0 2的表育 向,治具本體303a係以送至後方的方向,沿著轉動軸3〇3b 的周邊轉動。 如第29A圖所示,治具本體3〇3a的圓周面係以一定量2036-5808B-PF 74 1270429 A plurality of planar waveform fins 204B are spaced apart from each other and erected to a heat dissipating element 254 bonded to one surface of the substrate 206. Further, the substrate of the heat dissipating element is not limited to a flat plate shape, and as shown in FIG. 26C, the outer peripheral surface of the semi-cylindrical substrate (10) having an arc shape in a vertical cross section may be vertically connected to each other at a plurality of intervals. The heat dissipating elements 255 of the fins 2〇4 are of course manufactured by the above-described heat dissipating element manufacturing method. In the method of manufacturing a heat dissipating member described above, the friction welding of the metal member is applied, and the joining target is not limited to the 70 joining method of the metal fitting. For example, when one or both of the fins 2〇4 and the substrate 206 in the heat dissipating component are made of a non-metal such as ceramic, the present invention is to vertically bond a plurality of sheets spaced apart from each other to a substrate. A component bonding method of a surface. [Embodiment] The structure of the joint portion of the fin 204 and the substrate 206 after the manufacturing method of the heat radiating element shown in Figs. 21 to 21C and Figs. 22 to 22 is actually observed. The fins 204 used herein are A1〇 having a plate thickness imm (= 10xl (r3mm), a height of 26mm (= 2·6xl〇-2mm), a length of 60mm (=6· 〇><1〇-2111111). 5〇 lead alloy; spacer 2 is still soft steel of plate rhinoceros SSmnKd.SxlO-2·), length 57mm (= 5 7xl〇-2mm); and substrate 206 is plate thickness 2_f =2·余 If3 is resistant to 57mm ( = 5.7xl 〇 - 2mm), length 60mm ( = 6 〇 xl (r2mm) 2 oxygen-free copper. This 2036-5808B-PF 75 1270429 when the fin 204 height / spacing ratio is 26. Also, friction and vibration when engaged The jig body 203a of the jig 203 is set to have a diameter of 80 mm (= 8.0 x 10 mm), a width of 5 mm (= 5 〇 xl 〇 - 3 mm), a number of revolutions of 300 0 RPM, and a travel rate V of 4 〇. 〇〇mm/min (= 4· Om/min), the amount of pressing α on the surface 206a of the substrate 206 is 〇3 mm (= 3· 〇 xl 〇 -4 mm). After the frictional vibration is joined, the spacers 2 〇 5 are moved. Except for observing the structure of the joint portion of the fin 2〇4 and the substrate 206. As shown in Fig. 27A, it can be seen that the base φ plate 206 has a certain deformation, and the fin 204 has a deformation such as a bend and a bend. 4 and the substrate 206 is a reaction formed by CuA12 2〇7 is joined. The 27A is enlarged and as shown in Fig. 27B, most of the reaction layer 2〇7 is swept out by the action of the compressive stress of the bonding fixture when it is subjected to frictional vibration bonding, and is placed on the outer fin. The thickness of the reaction layer 2〇7 in the base end region of 204 is 30/zm (= 3.〇xl (T5m) or less, and cracks, cracks, and the like are not observed. The reaction layer 207 is hindered from the substrate 2〇. 6 to the heat conduction of the fins 2〇4, and having a very thin reaction layer 207, is a heat dissipating element having high heat dissipation performance. • Next, an embodiment of the third group of the present invention will be described. Before cutting into the theme, the basic structure of the frictional vibration joint of the metal component is premised on the premise. The so-called frictional vibration joint of the metal component is a gap relief tool for the metal component overlap by the pressure of the joint fixture. The vibration generated by the contact with the metal component splits and destroys the oxide film which exists on the coincident surface of the metal component, and borrows the weight of the τ section and deforms the plastic enamel, increasing the contact area of each metal component and increasing Large expansion 2036-5808B-PF 76 1270429 The method of joining the overlapping portions while dispersing the velocity, in particular, arranging the plurality of metal components in accordance with the fusion mutual arrangement to melt the bonding fixture to the side of the highest metal component: for bonding, in the metal component When the coincident portion rises to the degree necessary for the joint, the metal member adjacent to the side of the joint jig can maintain high deformation strength, and the compressive stress of the joint jig can be efficiently transmitted to the coincident surface, thereby completing the metal member. High-strength joint without gaps. The aluminum element and the copper element having a higher melting point are more specifically described as an example of the metal element. The 28A to 28C drawings show the order of the frictional vibration joints, in which the 28th, 8th, and 8β are front cross-sectional views, and the 28Cth is a side view of the first. In the frictional vibration engagement, first, the member 3G1 and the steel member 3〇2 are placed in surface contact with each other as shown in Fig. 28, and are fixed by a jig not shown in the drawing. Next, as shown in Figs. 28B and 28C, the circumferential surface of the jig body 303 of the jig that rotates at a high speed in the circumferential direction at the peripheral speed R around the rotation axis 3〇3b is vertically pressed to the copper member 3. The surface 〇 2a of the crucible 2 moves the interface tool 3〇3 along the surface % of the copper member at a traveling rate v, and the inscribed element 3〇1 is re-engaged with the copper member 3〇2. Pick up. /α /, 303 is a fixed shape of the disc-shaped jig body 303a at the front end portion of the rotating shaft 3〇3b, and the jig body 3〇3a is formed by a tool steel such as a steel tool. In the direction of the element 3 0 2 , the jig body 303a is rotated in the direction of the rear direction along the rotation axis 3〇3b. As shown in Fig. 29A, the circumferential surface of the fixture body 3〇3a is a certain amount

2036-5808B-PF 77 1270429 a(m)壓入銅元件302的表面302a的狀態下以圓周方向高 速轉動,並沿著銅元件302的表面302a移動。而藉著上述 治具本體303a在銅元件302的表面302a之壓入,使銘元 件301與銅元件302之重合面的縫隙消失;並藉著高速轉 動的治具本體303a與銅元件302的接觸所產生的震動,將 鋁元件301與銅元件302之重合面的氧化物皮膜分裂破 壞;並如第29B圖所示,與治具本體3〇3a接觸的鋼元件 302的既定區域與其鄰近區域、還有與上述區域鄰接的鋁 _ 元件301的既定區域,因治具本體303a與銅元件302的摩 擦接觸所產生的熱量而高溫化,呈現可塑化(流動·化)的固 相狀態。上述的結果,使得銅元件3〇2與鋁元件3〇1在相 互的交界面上流動擴散,並由當初的表面開始塑性變形。 接合治具303之治具本體303a的通過軌跡,如第29(: 圖所示,藉由治具本體303a之壓應力而在銅元件3〇2的表 面302a形成一對淺的段部3〇2b。又,鋁元件301與銅元 • 件302的重合面中,已塑性變形的鋁元件301及銅元件3〇2 相互咬合,而固化成斷面凹凸型的接合面s,上述的接合 面S介於銅元件302與鋁元件301之間而將二者確實地接 合。2036-5808B-PF 77 1270429 a(m) is pressed at a high speed in the circumferential direction while being pressed into the surface 302a of the copper member 302, and moves along the surface 302a of the copper member 302. By the pressing of the jig body 303a on the surface 302a of the copper member 302, the gap of the overlapping surface of the inscription element 301 and the copper member 302 disappears; and the contact of the jig body 303a with the copper member 302 by the high-speed rotation is achieved. The generated vibration splits and breaks the oxide film of the overlapping surface of the aluminum member 301 and the copper member 302; and as shown in Fig. 29B, the predetermined region of the steel member 302 in contact with the jig body 3〇3a and its adjacent region, Further, a predetermined region of the aluminum-element 301 adjacent to the above region is heated by the heat generated by the frictional contact between the jig main body 303a and the copper member 302, and exhibits a plasticized (fluidized) solid phase state. As a result of the above, the copper member 3〇2 and the aluminum member 3〇1 flow and diffuse at the mutual interface, and plastic deformation starts from the original surface. The passage path of the jig body 303a of the jig 303 is formed as a pair of shallow segments 3 on the surface 302a of the copper member 3〇2 by the compressive stress of the jig body 303a as shown in FIG. Further, in the overlapping surface of the aluminum member 301 and the copper member 302, the plastically deformed aluminum member 301 and the copper member 3〇2 are engaged with each other, and are solidified into a joint surface s having a concave-convex shape, and the above-mentioned joint surface S is interposed between the copper element 302 and the aluminum element 301 to positively bond the two.

此處,考慮到接合治具303由鋁元件3〇1之側壓入時, 鋁元件301的溶點低I 銅元件302的重合面達到接合所必要的共晶溫度(548。〇 以上時’紹元件3〇1的抗形變強度就^變'得較“小^ 自接合治具303的壓力無法充分地傳達至鋁元件3〇1與銅 2036-5808B-PF 78 1270429 兀件302的重合面’而容易發生接合不良。另一方面,將 接a 具3 G 3 [人溶點馬於艇元件3 Q}的銅元件聊之侧 時,在紹元件3〇1與銅亓杜 、%疋仵3 0 2的重合面達到接合所必要 的共晶溫度以上時,铜开彼Q n。 幻疋件302可以保持比較大的抗形變 強度,可使來自接合治\ > 口 /、3 0 3的壓力充分地傳達至鋁元件 301與銅元件302的重人而,品庇二一从0日 J里口面’而使兩兀件間的縫隙消失, 而能夠行高強度的接合。Here, in consideration of the fact that the bonding jig 303 is pressed by the side of the aluminum element 3〇1, the melting point of the aluminum element 301 is low, and the overlapping surface of the copper element 302 reaches the eutectic temperature necessary for bonding (548. The deformation resistance of the component 3〇1 is changed to be smaller than the pressure of the self-joining fixture 303, which cannot be sufficiently transmitted to the overlapping surface of the aluminum component 3〇1 and the copper 2036-5808B-PF 78 1270429 element 302. 'And it is prone to poor joint. On the other hand, when it is connected to the side of the copper component with 3 G 3 [human melting point on the boat component 3 Q}, the component 3〇1 and the copper 亓 Du, %疋When the coincident surface of 仵3 0 2 reaches the eutectic temperature necessary for bonding, the copper turns on Q n. The illusion element 302 can maintain a relatively large deformation strength, which can be obtained from the joint treatment \ > mouth /, 3 0 The pressure of 3 is sufficiently transmitted to the heavy members of the aluminum member 301 and the copper member 302, and the gap between the two members is eliminated from the 0-side and the gap between the two members, and the high-strength joint can be performed.

以上述的方法將紹元件3〇1與銅元件302重合而摩擦 震動接合時,較好為由下式⑴求出接合時接合治具3〇3(治 具本體303a)轉動的圓周速率R(m/min. ) ·· 250 $ RS 2000 .................. 接合時接合治具3〇3的圓周速率小於250m/min時,接 合治具303與銅元件3〇2之摩擦接觸所產生的熱量就過 小’而使銅元件302與鋁元件301的重合面的溫度過低, 而導致接合不良。另一方面,接合時接合治具3〇3的圓周 速率大於2000m/min時,接合治具3〇3與銅元件3〇2之摩 擦接觸所產生的熱量就會大過所必要的,不僅僅是使接合 治具303的驅動能量損失會變大,並使與接合治具3〇3接 觸的銅元件302的溫度會局部過高,導致該部分發生塑性 變形,而使接合治具303的壓應力無法充分地傳達至重合 面導致在兩元件間有可能會倉生缝隙〇因此r可以瞭解接 合時接合治具303以25〇〜2〇〇〇m/min的圓周速率轉動時, 接合治具303與銅元件302之摩擦接謂背產 好適當,而能夠行良好的接合。 2036-5808B-PF 79 1270429 又’將銘元件301與銅元件302重合而摩擦震動接合 時,接合時,接合治具303(治具本體3〇3a)在銅元件2〇2 的表面壓入量a(m)較好為由下式(β)求出·· 0· 03xtS α $ 〇· 3xt...............(b) 其中ΐ為重合部中的銅元件的厚度(m)。 接合時接合治具303在銅元件2〇2表面的壓入量α小 於0.03t時,銅元件302與鋁元件2〇1的重合面中會殘留 縫隙而導致接合不良。另-方面,壓入量α大於〇·3", 雖然銅元件302與銘元件301的重合面中不會殘留縫隙, 而過大的接合治具303的壓入量會在銅元件3〇2的表面殘 留顯著的凹痕,導致元件的損失。因此,接合時接合治具 如3在銅元件302表面的壓入量α在〇 〇3t以上、〇 3t 2 下時,接合治具303的壓應力為正好適當的值,可以瞭解 就可以在銅元件302與魅元件3〇1的重合部不產生缝隙的 情況下完成接合,亦可以縮小銅元件3Q2表面的凹痕。 籲 更者’將銘元件301與銅元件3〇2重合而摩擦震動接 合時,接合時’接合治具3〇3(治具本體3。3心沿著銅元件 3G2的表面移動的行進速率v(m/min.)較好為由下式(c)求 出: 0. 1^ R/(5. 〇xl〇7xt2)...............(c) 其中R為接含時接合洽具的圓周速率(m/m t t為重合部中的銅元件的厚度(m)。 其中,接合時接合治具㈣3%圓。厨逮率變大時,因接 合治具303與銅元件302的摩擦接觸所產生的熱量亦會變 2036-5808B-PF 80 1270429 大’而使接合治具303的行進速率v較高_,重合部仍能 保持一定的溫度;而銅元件3〇2的厚度變大時,重合部要 達到-定的溫度以上就比較費時,若此時接合治具3〇3的 行進速率過大時,在重合部的溫度達到一定溫度以上之 前,接合治具303就已通過’就會導致接合不良的問題。When the element 3〇1 and the copper element 302 are overlapped by the above-described method and the frictional vibration is joined, it is preferable to determine the circumferential rate R of the rotation of the joint jig 3〇3 (the jig body 303a) at the time of joining by the following formula (1). m/min. ) ·· 250 $ RS 2000 .................. When the circumferential speed of the joining jig 3〇3 at the time of joining is less than 250 m/min, the jig 303 is joined. The heat generated by the frictional contact with the copper member 3〇2 is too small', and the temperature of the overlapping surface of the copper member 302 and the aluminum member 301 is too low, resulting in poor bonding. On the other hand, when the circumferential speed of the joining jig 3〇3 at the time of joining is more than 2000 m/min, the heat generated by the frictional contact between the joining jig 3〇3 and the copper member 3〇2 is greater than necessary, not only The driving energy loss of the bonding jig 303 is increased, and the temperature of the copper member 302 in contact with the bonding jig 3〇3 is locally too high, causing plastic deformation of the portion, and the pressure of the bonding jig 303 is caused. The stress cannot be sufficiently transmitted to the coincident surface, which may cause a gap between the two components. Therefore, r can be understood that when the joint jig 303 is rotated at a peripheral speed of 25 〇 2 〇〇〇 m/min at the time of joining, the jig is attached. The friction between the 303 and the copper member 302 is well-suited for proper production, and good bonding is possible. 2036-5808B-PF 79 1270429 Further, when the element 301 and the copper element 302 are overlapped and frictionally vibrated, the bonding jig 303 (the jig body 3〇3a) is pressed on the surface of the copper element 2〇2 at the time of bonding. a(m) is preferably obtained from the following formula (β)········································ The thickness of the copper component (m). When the pressing amount α of the bonding jig 303 on the surface of the copper element 2〇2 is less than 0.03t, a gap remains in the overlapping surface of the copper element 302 and the aluminum element 2〇1, resulting in poor bonding. On the other hand, the amount of press-in α is larger than 〇·3", although no gap remains in the overlapping faces of the copper member 302 and the member 301, and the amount of pressing of the oversized jig 303 is in the copper member 3〇2 Significant dents remain on the surface, resulting in loss of components. Therefore, when the pressing amount α of the joining jig 3 on the surface of the copper member 302 is 〇〇3t or more and 〇3t 2 at the time of joining, the compressive stress of the joining jig 303 is just an appropriate value, and it can be understood that it can be in copper. The bonding of the element 302 and the overlapping portion of the charm element 3〇1 is completed without causing a gap, and the indentation on the surface of the copper element 3Q2 can also be reduced. When the member 301 is overlapped with the copper member 3〇2 and frictionally vibrated, the joining fixture 3〇3 (the traveling speed of the jig body 3. 3 along the surface of the copper member 3G2 is v. (m/min.) is preferably obtained by the following formula (c): 0. 1^ R/(5. 〇xl〇7xt2)...............(c) Where R is the circumferential velocity of the joint at the time of joining (m/mtt is the thickness (m) of the copper component in the overlap. Among them, the joint fixture (4) is 3% round when joining. When the kitchen catch rate becomes large, the joint cure The heat generated by the frictional contact between the 303 and the copper component 302 also becomes 2036-5808B-PF 80 1270429 large', and the traveling speed v of the bonding fixture 303 is higher _, the overlapping portion can still maintain a certain temperature; When the thickness of the element 3〇2 is increased, it takes time and time for the overlapping portion to reach a predetermined temperature or higher. If the traveling rate of the bonding jig 3〇3 is excessively large at this time, the bonding is performed before the temperature of the overlapping portion reaches a certain temperature or higher. If the jig 303 has passed, it will cause a problem of poor joint.

而實行良好的摩擦震動接合時,接合治具3〇3的行進速率 V、圓周速率R、銅元件的厚度^須要相互調節。而實驗 =果係確認了滿足VS(5.0xl(rxt2)時,能夠有良好的接 «。另一方面,由當接合治具303的行進速率v過小時, =有降低接合效率的觀點,實驗結果係確認了滿足〇·⑷ 時,可以得到較好的接合效率。 _而此金屬元件的摩擦震動接合並不限於將銘元件與鋼 凡件重合並接合的情況,可以廣泛地適用於各金屬元件間 的重合並接合。而上述金屬元件的形狀,只要在相互重合 之後能夠使接合治具壓入就可以。更者,重合的金屬元件 的數量也不限於二個,三個以上亦可。 例如,在第30_中,係將三個金屬元件(_系的紹 凡件30卜3000系的銘元件3〇1,、鋼元件_相互重合 配置’將接合治具3G3的治具本體3咖壓入三個金屬元件 中熔點最高的鋼元件302之侧,而為摩擦震動接合。在此, 考慮到接合時各金屬元件的要達到二既定1 時各金屬元件的抗形變強度對來自接合治具的壓應力傳達 金屬疋件依熔點的高低順序(此處的順序為銅元件3〇2、 2036-5808B-PF 81 1270429 1000系的鋁元件301, 、5000季的鈕分灶Qni、 、 υ乐的鋁兀件301)重合配置, 並將接合治具3G3壓至三個金屬元件中熔點最高的金屬元 件(此處為銅元件302)之側,而為摩擦震動接合。其他, 三個金屬元件為銅、鋁、鎂時,輕 ^孕乂妤為以銅兀件、鋁元件、 鎮元件的順序重合,將接合治且壓 入銅兀件之侧而行摩擦 震動接合。 ' 散熱元件 Φ 卩上’係已說明金屬元件的摩擦震動接合的基本架 構,接下來說明應用上述摩擦震動接合之散熱元件。 第1圖為斜視圖,係顯示本發明之散熱元件之一實 施型態。圖中所示的散熱元件350係在銅製的基板3〇5的 -表面上,立設並接合複數個相互間隔之鋁製的鰭片綱。 1隔物/σ具306 ’如第32Α圖所示,係為將各間隔物 3〇6a的下端部相互連結的斷面為梳子形狀的治具。各間隔 物的高度係與散熱元件35〇的各散熱籍片3〇4相等。 • 首先如第32B圖所示,分別將各鰭片304插入各間隔 物3 0 6 a之間。此時,各鍵η q π u ^谷,片304的上面與各間隔物306a 的上面形成一水平面。 接下來,如第32C圖所示,將各鰭片3〇4的上面與基 板305的一表面(圖式中的下面)接觸,將基板3〇5固定。 亦可將第娜、32e®-#^* 305 ®^ 物治具3D6的上面之後’再由側面(與紙面垂直方向)將各 籍片304插入。 : 接下來如第32D圖所示,將接合治具3〇3壓至基板3〇5When a good frictional vibration engagement is performed, the traveling speed V of the joining jig 3, the peripheral speed R, and the thickness of the copper member need to be adjusted with each other. On the other hand, it was confirmed that when VS (5.0xl (rxt2) is satisfied, there is a good connection. On the other hand, from the viewpoint that the traveling speed v of the joining jig 303 is too small, = the joining efficiency is lowered, the experiment As a result, it was confirmed that when the 〇·(4) is satisfied, a good joining efficiency can be obtained. _ The frictional vibration joining of the metal member is not limited to the case where the inscribed element and the steel member are combined and joined, and can be widely applied to each metal. The shape of the metal element can be joined by pressing the bonding jig after overlapping each other. Further, the number of overlapping metal elements is not limited to two or three or more. For example, in the 30th, three metal elements (the sigma-like member 30, the 3,000-series syllabic element 3〇1, and the steel element _ are placed one on another) are attached to the jig body 3 of the jig 3G3. The coffee is pressed into the side of the steel element 302 having the highest melting point among the three metal components, and is frictional vibration joint. Here, in consideration of the resistance of each metal component to the two predetermined ones at the time of joining, the deformation strength of the metal component is from the joint. Jig The compressive stress conveys the order of the melting point of the metal element (the order here is the copper element 3〇2, 2036-5808B-PF 81 1270429 1000 series aluminum element 301, the 5000 season button nibble Qni, υ乐The aluminum 301 301) is arranged in a superposed manner, and the bonding fixture 3G3 is pressed to the side of the metal element having the highest melting point among the three metal elements (here, the copper element 302), and is frictionally vibrated. The other three metal components are In the case of copper, aluminum, and magnesium, the light and the 乂妤 are overlapped in the order of the copper enamel, the aluminum element, and the sinter element, and the joint is pressed and pressed into the side of the gong to perform the frictional vibration joint. 'The heat dissipating element Φ The basic structure of the frictional vibration joint of the metal component has been described, and the heat radiating element to which the above frictional vibration joint is applied will be described next. Fig. 1 is a perspective view showing an embodiment of the heat radiating element of the present invention. The heat dissipating member 350 is formed on the surface of the copper substrate 3〇5, and is erected and joined to a plurality of mutually spaced aluminum fins. The spacer/sigma 306' is as shown in the figure 32. Connecting the lower ends of the spacers 3〇6a to each other The jig having a comb shape is the same. The height of each spacer is equal to the heat radiating fins 3〇4 of the heat dissipating member 35A. • First, as shown in Fig. 32B, the fins 304 are inserted into the spacers 3, respectively. Between 0 6 a. At this time, each key η q π u ^ valley, the upper surface of the sheet 304 forms a horizontal plane with the upper surface of each spacer 306a. Next, as shown in Fig. 32C, the fins 3〇4 The upper surface is in contact with a surface of the substrate 305 (the lower surface in the drawing) to fix the substrate 3〇5. The Dina, 32e®-#^* 305®^ can also be used to fix the upper surface of the 3D6. The respective sheets 304 are inserted (in the direction perpendicular to the paper surface). : Next, as shown in Fig. 32D, the bonding jig 3〇3 is pressed to the substrate 3〇5

2036-5808B-PF 82 1270429 的另一表面(圖式中的上面),將各鰭片304摩擦震動接合 於基板3 0 5 °此時,因為構成基板3 〇 5的銅的熔點高於構 成-曰片304的|呂’鰭片304與基板305之交界面的溫度上 升到兩者接合時所必要的溫度(共晶溫度·· 548〇c )時,基板 3〇5仍能保持高的抗形變強度,使接合治具3〇3的壓應力 月b夠有效率地傳達至交界面,並且能行鰭片3〇4與基板 之間無縫隙的高強度接合。 又’由於構成間隔物306a的鐵的熔點高於構成鰭片 304的鋁及構成基板3〇5的銅,接合治具3〇3的圓周速率 與仃進速率設定在既定的範圍時,間隔物3〇6a不會與鰭片 及基板305接合,而能夠容易地僅接合基板gw鱼鈐 片304 〇 …曰 最後如第32E圖所示,將基板3〇5及接合於其上的各 鰭片304向上移動,而移除間隔物治具3〇6,而完成散埶 元件350的製造。 ”、 猎由上述的步驟,由於間隔物治具3〇6 3_入各…。4,可以正確地保持各二: 相互之間隔’並可以決定相互以既^間隔隔開狀態的各舞 片304之並列位置。又,對於摩擦震動接合步驟時作用在 鰭片304的弯曲應力,藉由間隔物306a係補強了鰭片3〇4, ® ^ ^ 3^4 ^ M ° ^ -隔物治具306的各間隔物3〇6a的厚度與配置間隔,就能夠 任意地調節鰭片304之配置._鮮度,更_ = 韓片304的高度的情況下,特別是將薄板厚、高板高的各 2036-5808B-PF 83 1270429 鰭片304以短間隔立設接合於基板3〇5之一表面,就可以 製造具有高高度/間隔比(例如高度/間隔比超過2〇)的散熱 元件350。當然,間隔物治具3〇6(間隔物3〇6a)並不限定 為金屬製,考量到強度、加工性等因素時,亦可以使用陶 瓷或是其他任意材質。而雖然可以使間隔物治具3〇6的各 間隔物306a的高度較鰭片3〇4的高度小,而使摩擦震動接 合時各間隔物306a就不會接觸基板305的一表面;考慮到 摩擦震動接合時,因接合治具303的壓應力使鰭片304受 * 到彎曲應力的作用時,為了提高間隔物306a對鰭片3〇4的 補強效果,較好為如上述實施型態一般,準備同高的各間 隔物306a與各鰭片304。 又,藉由以上的製造方法,因為不需要如銲接時一般 在真空爐中加熱並維持一既定時間,而能夠將各鰭片3〇4 與基板305接合,可以削減製造成本。 而’在&升基板305與各鳍片304之接合強度的同時, _ 亦提升散熱元件350的散熱性能的情況,就如第33A圖所 示,較好為使接合治具303在基板305的裏面(基板3〇5的 另表面)的移動能夠遍及各鰭片304的基端部(圖式中的 上面)的全面’使得各錯月3 0 4能夠完全地接合於基板 30 5 ° (第3 3 A〜3 3 C圖中以斜線標示的區域係表示接合治且 303的移動軌跡)另< 如如第33B圖所示,亦可以移動接合治具303,而未遍及 各鰭片304的基端面的全面,僅實及各赏 一部份。又,將基板305與各鰭片304摩擦震動接合時, 2036-5808B-PF 84 1270429 同時也將基板305與各間隔物3〇6a接合時,在間隔物脫離 步驟中,雖然可以使用任何的方法將各間隔物3〇6a從基板 305與各鰭片304移除,·在接合治具3〇3的治具本體3〇3a 的寬度小於鰭片304的厚度時,如第33C圖所示,較好為 以基板305與各間隔物3063不會接合的軌跡(在圖式中為 各鰭片304正上方的區域),來移動接合治具3〇3 ;又,僅 僅使各鰭片304與基板305接觸,而使各間隔物3〇6a不與 φ 基板305接觸的配置亦可;或是,如上述的實施型態一般, 使用熔點高於鰭片304及基板3〇5之熔點的間隔物3〇h 時,就與接合治具303的移動軌跡無關,各間隔物3〇6&不 會接合於基板305與鰭片304時,即使摩擦震動接合後, 各間隔物306a亦不會接合於基板3〇5與鰭片3〇4,而使間 隔物脫離步驟的程序可以省略,而能夠削減製造《本。又, 因接合治具303的壓應力而在基板3〇5之另一表面殘留較 大凹痕時,可將基板305的表面切削掉一既定厚度,而能 • 夠得到具美麗外觀的散熱元件350。 又,為了簡化摩擦震動接合步驟,亦可以使用在轉動 轴303b的周邊以一既定間隔固定有複數個治具本體別% 的接合治具(圖式省略)。此時,可以同時對複數個區域施 以摩擦震動接合,可以縮斷接合時所需要的時間,因而更 加提昇效率。 - …….......’.… ........ — . .......-.…. 第34圖為一斜視圖,係顯示本發明之散熱元件之另一 實施型態。圖十所示的實熱元伴3时^ 摩擦震動接合於銅製的基板的_表面上。銘散熱部謝 2036-5808B-PF 85 1270429 係將重合配置於基板305的一表面上的鋁製基板3〇7a、以 及相互間隔並立設於基板305的相對側之面上的各鰭片 3〇7b,以擠型一體成形而成。 散熱元件360的製造方法與散熱元件350的製造方法 、’、勺略相同。將第3 5 A圖所示斷面形狀的間隔物治具3 〇 6固 疋於接合工作桌上;如第35B圖所示,於間隔物治具 之各間隔物306a之間分別嵌入個鰭片307b而置放鋁散熱 φ 部307。又在鋁散熱部307之基板307a之各鰭片3〇71b之 相對側之面(圖式中的上面)上,重合並固定基板的一 表面(圖式中的下面)。而如第35C圖所示,由基板305的 另表面(圖式中的上面)以接合治具303行摩擦震動接 口最後,如第35E圖所示,移除間隔物治具3〇6後,完 成了散熱元件360的製造。而其他部分皆與散熱元件35〇 的製造方法相同。 散熱器 # 接下來說明本發明散熱器之實施型態。 第36A〜36B圖係顯示本發明散熱器之第一實施型態, 其中第36A圖為分解斜視圖,第_圖為組裝後的斜視圖。 又第37A圖為第36A〜36B圖之散熱器之俯視圖;第、 37C圖刀別為第364〜36^圖之散熱器之1方向側視圖與丫 方向側視圖............................... 政熱器31 〇A係為具有散熱元件350與風扇320之高性 月匕的政熱器。散熱元件3 5,翁與,^The other surface of the 2036-5808B-PF 82 1270429 (the upper surface in the drawing) frictionally vibrates the fins 304 to the substrate 3 0 5 ° at this time, because the melting point of the copper constituting the substrate 3 〇 5 is higher than the composition - When the temperature at the interface between the 吕' fin 304 and the substrate 305 of the cymbal 304 rises to a temperature (eutectic temperature··548 〇c) necessary for the bonding of the both, the substrate 3〇5 can maintain high resistance. The deformation strength enables the compressive stress month b of the bonding jig 3〇3 to be efficiently transmitted to the interface, and the high-strength joint between the fins 3〇4 and the substrate without gaps can be performed. Further, since the melting point of the iron constituting the spacer 306a is higher than the aluminum constituting the fin 304 and the copper constituting the substrate 3〇5, the circumferential rate and the entanglement rate of the bonding jig 3〇3 are set within a predetermined range, and the spacer 3〇6a does not bond with the fin and the substrate 305, but can easily bond only the substrate gw fish fillet 304 曰... Finally, as shown in Fig. 32E, the substrate 3〇5 and the fins bonded thereto The 304 moves upward, and the spacer jigs 3〇6 are removed, and the manufacture of the heat sink element 350 is completed. ", Hunting by the above steps, because the spacer fixture 3〇6 3_ into each .... 4, can correctly maintain each two: mutual spacing 'and can determine each other separated by the interval The parallel position of 304. Further, for the bending stress acting on the fin 304 in the frictional vibration bonding step, the fins 3063 are reinforced by the spacers 306a, ® ^ ^ 3^4 ^ M ° ^ - spacers With the thickness and arrangement interval of the spacers 3〇6a of the 306, the arrangement of the fins 304 can be arbitrarily adjusted. _ Freshness, more _ = height of the Korean wafer 304, in particular, thin plate thickness and high plate height Each of the 2036-5808B-PF 83 1270429 fins 304 is erected to the surface of one of the substrates 3〇5 at short intervals, so that the heat dissipating member 350 having a high height/space ratio (for example, a height/interval ratio exceeding 2 〇) can be manufactured. Of course, the spacer jig 3〇6 (spacer 3〇6a) is not limited to metal, and ceramics or any other material may be used in consideration of factors such as strength and workability, and spacers may be used. The height of each spacer 306a of the jig 3〇6 is smaller than the height of the fins 3〇4, and the friction is caused. When the movable bonding is performed, each of the spacers 306a does not contact a surface of the substrate 305; in consideration of the frictional vibration bonding, when the fin 304 is subjected to the bending stress by the compressive stress of the bonding jig 303, the spacer 306a is raised. For the reinforcing effect of the fins 3〇4, it is preferable to prepare the spacers 306a and the fins 304 of the same height as in the above-described embodiment. Further, by the above manufacturing method, since it is not necessary to be soldered as usual By heating and maintaining in a vacuum furnace for a predetermined period of time, the fins 3〇4 can be bonded to the substrate 305, which can reduce the manufacturing cost. While the bonding strength between the substrate 305 and the fins 304 is _ The heat dissipation performance of the heat dissipating member 350 is also improved. As shown in FIG. 33A, it is preferable that the movement of the bonding jig 303 on the inside of the substrate 305 (the other surface of the substrate 3〇5) can be spread over the fins 304. The overall end of the base end (the upper part in the drawing) enables each wrong month 300 to be completely bonded to the substrate 30 5 ° (the area indicated by the slanted line in the 3 3 A to 3 3 C diagram represents the bonding process and 303 movement track) another < as shown in Figure 33B As shown, the jig 303 can also be moved without extending the entire end surface of each of the fins 304, and only a portion of each of the fins 304 is stretched. When the substrate 305 is frictionally joined to each of the fins 304, 2036- 5808B-PF 84 1270429 When the substrate 305 is also joined to each of the spacers 3〇6a, in the spacer detaching step, although the spacers 3〇6a can be removed from the substrate 305 and the respective fins 304 by any method. When the width of the jig body 3〇3a of the jig 3〇3 is smaller than the thickness of the fin 304, as shown in FIG. 33C, it is preferable that the substrate 305 and the spacers 3063 do not engage with each other ( In the figure, the area directly above each fin 304) is moved to the bonding fixture 3〇3; again, only the fins 304 are brought into contact with the substrate 305, so that the spacers 3〇6a are not associated with the φ substrate 305. The configuration of the contact may be; or, as in the above-described embodiment, when the spacer 3〇h having a melting point higher than the melting point of the fin 304 and the substrate 3〇5 is used, it is independent of the movement trajectory of the bonding jig 303. When the spacers 3〇6& are not bonded to the substrate 305 and the fins 304, even after frictional vibration bonding, The spacers 306a are not bonded to the substrate 3〇5 and the fins 3〇4, and the procedure for separating the spacers can be omitted, and the manufacturing process can be reduced. Further, when a large indentation remains on the other surface of the substrate 3〇5 due to the compressive stress of the bonding jig 303, the surface of the substrate 305 can be cut to a predetermined thickness, and a heat-receiving member having a beautiful appearance can be obtained. 350. Further, in order to simplify the frictional vibration joining step, it is also possible to use a joining jig (not shown) in which a plurality of jig bodies are fixed at a predetermined interval around the rotating shaft 303b. At this time, frictional vibration engagement can be applied to a plurality of regions at the same time, and the time required for the engagement can be reduced, thereby improving the efficiency. - .............'........................................ Figure 34 is a perspective view showing the heat dissipating component of the present invention. Another embodiment. The real heat element shown in Fig. 10 is bonded to the surface of the copper substrate by frictional vibration. The heat sink portion 2036-5808B-PF 85 1270429 is an aluminum substrate 3〇7a which is placed on one surface of the substrate 305, and fins 3 which are spaced apart from each other and are erected on the opposite side of the substrate 305. 7b, formed by extrusion molding. The method of manufacturing the heat dissipating member 360 is the same as the method of manufacturing the heat dissipating member 350, and the spoon is slightly the same. The spacer jigs of the cross-sectional shape shown in Fig. 35A are fixed to the joint work table; as shown in Fig. 35B, the fins are respectively embedded between the spacers 306a of the spacer jig. The sheet 307b is placed with the aluminum heat dissipation φ portion 307. Further, on the opposite side (the upper surface in the drawing) of the fins 3' to 71b of the substrate 307a of the aluminum heat dissipating portion 307, a surface (the lower surface in the drawing) of the fixed substrate is overlapped. As shown in Fig. 35C, the other surface of the substrate 305 (the upper surface in the drawing) is rubbed and vibrated by the bonding jig 303. Finally, as shown in Fig. 35E, after the spacer jig 3 is removed, The manufacture of the heat dissipating component 360 is completed. The other parts are the same as the heat sink element 35〇. Radiator # Next, an embodiment of the heat sink of the present invention will be described. 36A to 36B are views showing a first embodiment of the heat sink of the present invention, wherein Fig. 36A is an exploded perspective view, and Fig. 3 is an oblique view after assembly. 37A is a top view of the heat sink of the 36A to 36B; the first and third sides of the heat sink of the 364th to 36th are the side view and the side view of the heat sink. ....................... The heat exchanger 31 〇A is a political heater with a high temperature of the heat dissipating component 350 and the fan 320. Heat dissipating component 3 5, Weng and ^

官(heat pipe)作導熱性的連接。 2036-5808B-PF 86 1270429 散熱元件350,如以上所說明,係為將複數個鋁製的 鰭片304相互間隔並立設在銅製的基板3〇5的一表面上的 狀態下,摩擦震動接合而成。此處,在基板3〇5的兩侧面 形成有突起305a。又,在基板3〇5的下面,形成有與導熱 管330的端部嵌合的嵌合溝3〇5b。 風扇320係將散熱元件35〇強制冷卻,經由風扇裝設 兀件321裝設於散熱元件35〇,而將散熱元件35〇的熱量 政出至上方。風扇320係連接有未綠示於圖中的馬達。 ® 風扇裝设元件321係由上板部321a與側板部321b、 321b所構成,並形成有可包含散熱元件35〇之個鰭片3〇4 之斷面門形。上板部321a的中央部係穿設有因應風扇32〇 的位置及大小所設計的空氣孔321c,並在上板部321a的 四個角落形成有小型螺絲孔321d。側板部321b的係在基 板305的突起305a的對應位置穿設有裝設孔321 e。 將犬起305a插入裝設孔321e後,藉由將突起305a彎 • 曲加工之固定,將風扇裝設元件321裝設於散熱元件35〇。 又,由風扇320的上方將小型螺絲321f鎖入小型螺絲孔 321d’而使風扇320裝設於風扇裝設元件321。 導熱管330係將發熱體之CPU 340所產生的熱量輸送 至散熱元件3 5 Ο,其一端於散熱元件350,另一端於〇?11 3 4 0,將二會 接。導熱f 的狀態嵌合於散熱元件350之基板3〇5的嵌合溝3〇5b,並 以金屬裝設元件3 31及小型螺絲固定v又 上的叉熱元件341之上面,與散熱元件350之基板305的 2036-5808B-PF 87 1270429 下面相同,亦形成有嵌合溝341a,而使導熱管330的另一 端係以壓合的狀態嵌合於嵌合溝3 41 a,並以金屬裝設元件 342及小型螺絲固定於受熱元件341。受熱元件341係為熱 傳導率高的金屬材料(例如銅)。 CPU 340 的下方係配置有電路基板的插槽 (socket)343。插槽343的側面形成有突起343a。插槽343 之上係與CPU 340重合,更與CPU 340上的受熱元件341 重合。在兩端部穿設有裝設孔 344a的門形裝設夾 • (cl ip) 344坡覆於插槽343、CPU 340、與受熱元件341的 上方,而將突起343a插入裝設孔344a,藉由將突起343a 彎曲加工之固定,而將插槽343、CPU 340、與受熱元件341 一體固定於彼此受壓接觸的狀態。 以上的散熱器31 0A係具有散熱元件350與風扇320, 將發熱體之CPU 340所產生的熱量依序經由受熱元件341 與導熱管330輸送至散熱元件350,並由風扇320強制性 0 地排出至外界,而具有高散熱性能。又,由於CPU 340與 散熱元件350係為導熱管330所連接,散熱元件350與風 扇320可以配置在遠離CPU 340的位置,使得例如薄型的 筆記型電腦等要在CPU340的附近裝設散熱構造有空間上 的困難之情況,有了可供對應的方案。 又,因為散熱器310A的散熱元件350係為將複數個鰭 片304相互間隔並立設在基板305的一表面上的狀態下, 摩擦震動接合而成,與習知以銲接揍合的、情況相:比‘,基板 與鰭片可以得到較高強度的接合、與較低的製造成本。特 2036-5808B-PF 88 1270429 別是因為鰭片304是由熔點低於銅的鋁所構成,摩擦震動 接合時鋼製的基板305可將接合治具303的壓應力有效率 地傳達至接合部,而使接合部中無缝隙,使兩者形成更高 強度的接合。 第38圖為一組裝後的斜視圖,係顯示本發明散熱器之 第二實施型態。此處的散熱元件3丨〇B除了散熱元件的構成 之外’均與第一實施型態之散熱器31 0A相同。散熱器31 0B 的散熱元件360,如以上所說明,係將鋁散熱部307摩擦 震動接合於銅製的基板305的一表面。鋁散熱部307係將 重合配置於基板305的一表面上的鋁製基板3〇7a、以及相 互間隔並立設於基板305的相對側之面上的各鰭片3〇7b, 以播型一體成形而成。 因為散熱器310B的散熱元件360係將鋼製的基板305 與鋁製的基板307a摩擦震動接合而成,與習知以銲接與爆 炸壓接接合的情況相比,基板3〇5與3〇7a可以得到較高強 ❿度的接合、與較低的製造成本。又,摩擦震動接合部位係 為基板205與基板307a之重合部,因為有大的接合面積, 比第一實施型態之散熱器310A的散熱元件35〇容易製造。 第39A〜39B圖係顯示本發明散熱器之第三實施型熊, 其中第39A圖為分解斜視圖,第39β圖為組裝後的斜視圖。 又’第碰圖為第3M^« v 40C圖分別為第39A〜39B圖之散熱器之χ方向側視圖與γ 方向側視圖。 此處的散熱元件310C除了縛片的構造等等之外,均與 2036-5808B-PF 89 1270429 第一實施型態之散熱器31 0A相同。 散熱元件31 0C的風扇322係以配置於散熱元件35〇的 一側的狀態下直接裝設於散熱元件350。風扇322係面朝 散熱元件350的各鰭片304的側端面配置於各鰭片別4的 一侧’而將散熱元件250的熱量排出至上方。風扇322係 含有可以包含各鰭片304的斷面門形的風扇箱型物322&。 在風扇箱型物322a的下部與基板305的突起3〇5a的對靡 位置係穿設有裝設孔322b。將突起305a插入裝設孔322b > 之後,藉由將突起305a彎曲加工之固定,而將風扇322裝 設於散熱元件350。 以上的散熱器31 0C係具有散熱元件35〇與風扇32〇, 將發熱體之CPU 340所產生的熱量依序經由受熱元件 與導熱管330輸送至散熱元件350,並由風扇322強制性 地排出至外界,而具有高散熱性能。又,由於cpu 與 散熱元件350係為導熱管330所連接,散熱元件35〇與風 •扇322可以配置在遠離CPU 34〇的位置,並且因為風扇^22 係配置於散熱元件350之一側,而使散熱元件3l〇c的全體 高度可小於第一實施型態的散熱器31〇A,而更適合於例如 薄型的筆記型電腦等要在CPU34〇的附近裝設散熱構造有 空間上的困難之情況。 而在其他的肴成及作费方 熱器310A相同。 第41圖為一組裝後的斜視圖r曹 第四實施型態。此處的散熱元件310D除了散熱元件的構成 2036-5808B-PF 90 1270429 之外,均與第三實施型態之散熱器31 0C相同。散熱器31 OD 的散熱元件360,如以上所說明,係將鋁散熱部307摩擦 震動接合於銅製的基板305的一表面。鋁散熱部307係將 重合配置於基板305的一表面上的鋁製基板30 7a、以及相 互間隔並立設於基板3 0 5的相對侧之面上的各鰭片3〇 7b, 以擠型一體成形而成。 第42A〜42B圖係顯示本發明散熱器之第五實施型態, 其中第42A圖為分解斜視圖,第42B圖為組裝後的斜視圖。 又,第43A圖為第42A〜42B圖之散熱器之俯視圖;第43B、 43C圖分別為第42A〜42B圖之散熱器之χ方向側視圖與γ 方向側視圖。 此處的散熱器31 0Ε大略與第一實施型態之散熱器 310Α相同,係具有散熱元件35〇,與風扇32〇之高性能的 散熱器。散熱元件350,係在不經由導熱管33〇的狀態下, 直接與CPU 340作導熱性的連接。 政…、π件350,大略與第一實施型態之散熱器31〇八 散熱元件350的構成相同,而以橫切各鰭片咖的方式 形成有可供裝設夾344插入的夾溝304a。而散熱元件咖 係在銅製的基板3G5的—表面,立設有二列的銘製稽片① 而分隔出夹溝304a,再以摩擦震動接合而成。 ,合;:^ ^ -- 成熱益31 0E的風扇,裝設驚件 ’丨u d 町w板部32ϊ: 下部中央部係形成有可供裝設夾344嵌合的夾溝叫The heat pipe is used as a thermally conductive connection. 2036-5808B-PF 86 1270429 The heat dissipating member 350, as described above, is a friction stir welding joint in a state in which a plurality of fins 304 made of aluminum are spaced apart from each other and erected on a surface of a substrate 3〇5 made of copper. to make. Here, protrusions 305a are formed on both side faces of the substrate 3〇5. Further, on the lower surface of the substrate 3?5, a fitting groove 3?5b fitted to the end portion of the heat transfer pipe 330 is formed. The fan 320 forcibly cools the heat dissipating member 35, and is attached to the heat dissipating member 35A via the fan mounting member 321, and the heat of the heat dissipating member 35 is released upward. The fan 320 is connected to a motor that is not green as shown in the drawing. The fan mounting member 321 is composed of an upper plate portion 321a and side plate portions 321b and 321b, and is formed with a sectional gate shape that can include the fins 3〇4 of the heat dissipating member 35〇. The central portion of the upper plate portion 321a is provided with an air hole 321c designed to correspond to the position and size of the fan 32'', and a small screw hole 321d is formed at four corners of the upper plate portion 321a. The side plate portion 321b is provided with a mounting hole 321 e at a corresponding position of the protrusion 305a of the substrate 305. After the dog 305a is inserted into the mounting hole 321e, the fan mounting member 321 is attached to the heat dissipating member 35A by bending the projection 305a. Further, the small screw 321f is locked into the small screw hole 321d' by the upper side of the fan 320, and the fan 320 is attached to the fan mounting member 321. The heat pipe 330 conveys the heat generated by the CPU 340 of the heating element to the heat dissipating component 35, one end of which is disposed on the heat dissipating component 350, and the other end of which is connected to the elbow 11 3 4 0. The state of the heat conduction f is fitted to the fitting groove 3〇5b of the substrate 3〇5 of the heat dissipation element 350, and the upper surface of the fork heat element 341 on the metal mounting element 31 and the small screw is fixed to the heat dissipation element 350. 2036-5808B-PF 87 1270429 of the substrate 305. The fitting groove 341a is also formed in the same manner, and the other end of the heat transfer pipe 330 is fitted to the fitting groove 3 41 a in a pressed state, and is mounted in metal. The element 342 and the small screw are fixed to the heat receiving element 341. The heat receiving element 341 is a metal material (e.g., copper) having a high thermal conductivity. Below the CPU 340, a socket 343 of a circuit board is disposed. A projection 343a is formed on a side surface of the slot 343. The upper side of the slot 343 coincides with the CPU 340, and more coincides with the heat receiving element 341 on the CPU 340. A gate-shaped mounting clip (cl ip) 344 having a mounting hole 344a at both ends thereof is overlaid on the slot 343, the CPU 340, and the heat receiving element 341, and the protrusion 343a is inserted into the mounting hole 344a. The socket 343, the CPU 340, and the heat receiving element 341 are integrally fixed to each other in a state of being pressed into contact with each other by bending the projection 343a. The heat sink 31 0A has a heat dissipating component 350 and a fan 320, and the heat generated by the CPU 340 of the heating element is sequentially sent to the heat dissipating component 350 via the heat receiving element 341 and the heat pipe 330, and is forcibly discharged by the fan 320. To the outside world, and has high heat dissipation performance. Moreover, since the CPU 340 and the heat dissipating component 350 are connected by the heat pipe 330, the heat dissipating component 350 and the fan 320 can be disposed at a position away from the CPU 340, so that, for example, a thin notebook computer or the like is to be provided with a heat dissipating structure in the vicinity of the CPU 340. In the case of difficulties in space, there is a solution that can be used. Moreover, since the heat dissipating member 350 of the heat sink 310A is in a state in which a plurality of fins 304 are spaced apart from each other and erected on one surface of the substrate 305, friction and vibration are joined, which is conventionally combined with soldering. : Compared with ', the substrate and the fin can achieve higher strength bonding and lower manufacturing cost. Special 2036-5808B-PF 88 1270429 In other words, since the fin 304 is made of aluminum having a lower melting point than copper, the steel substrate 305 can efficiently transmit the compressive stress of the bonding jig 303 to the joint portion during frictional vibration bonding. There is no gap in the joint, so that the two form a stronger joint. Figure 38 is a perspective view showing an assembled second embodiment of the heat sink of the present invention. Here, the heat dissipating member 3B is the same as the heat sink 31 0A of the first embodiment except for the configuration of the heat dissipating member. The heat dissipating member 360 of the heat sink 31 0B, as explained above, frictionally bonds the aluminum heat dissipating portion 307 to one surface of the copper substrate 305. The aluminum heat dissipating portion 307 is formed by superposing the aluminum substrate 3〇7a disposed on one surface of the substrate 305 and the fins 3〇7b which are spaced apart from each other and disposed on the opposite side of the substrate 305. Made. Since the heat dissipating member 360 of the heat sink 310B is formed by frictionally and vibrating the steel substrate 305 and the aluminum substrate 307a, the substrate 3〇5 and 3〇7a are compared with the conventional case of soldering and explosive crimp bonding. A higher strength of the joint can be obtained, and a lower manufacturing cost. Further, the frictional vibration bonding portion is a portion where the substrate 205 and the substrate 307a overlap each other, and because of the large bonding area, it is easier to manufacture than the heat dissipating member 35 of the heat sink 310A of the first embodiment. 39A to 39B are views showing a third embodiment of the heat sink of the present invention, wherein Fig. 39A is an exploded perspective view, and Fig. 39β is an assembled oblique view. Further, the first touch diagram is the third M^« v 40C diagram showing the side view of the heat sink in the 39A to 39B and the side view in the γ direction. Here, the heat dissipating member 310C is the same as the heat sink 31 0A of the first embodiment of 2036-5808B-PF 89 1270429 except for the configuration of the tab. The fan 322 of the heat dissipating element 31 0C is directly mounted on the heat dissipating element 350 in a state of being disposed on one side of the heat dissipating element 35 。. The fan 322 is disposed on the side of each of the fins 4 toward the side end surface of each of the fins 304 of the heat dissipating member 350, and discharges the heat of the heat dissipating member 250 upward. The fan 322 is a fan case type 322& which has a sectional gate shape which can include each fin 304. A mounting hole 322b is formed in a lower portion of the fan case 322a and a position opposite to the projection 3?5a of the substrate 305. After the projection 305a is inserted into the mounting hole 322b >, the fan 322 is attached to the heat dissipating member 350 by bending the projection 305a. The heat sink 31 0C has a heat dissipating component 35 〇 and a fan 32 〇 , and the heat generated by the CPU 340 of the heating element is sequentially sent to the heat dissipating component 350 via the heat receiving component and the heat pipe 330 , and is forcibly discharged by the fan 322 . To the outside world, and has high heat dissipation performance. Moreover, since the cpu and the heat dissipating component 350 are connected to the heat pipe 330, the heat dissipating component 35 and the fan 322 may be disposed away from the CPU 34A, and since the fan 22 is disposed on one side of the heat dissipating component 350, The overall height of the heat dissipating component 31c can be smaller than that of the first embodiment of the heat sink 31A, and is more suitable for, for example, a thin notebook computer, etc., having difficulty in installing a heat dissipating structure in the vicinity of the CPU 34A. The situation. It is the same as the other recipes and the cost of the radiator 310A. Figure 41 is a perspective view of an assembled oblique view of the fourth embodiment. Here, the heat dissipating member 310D is the same as the heat sink 31 0C of the third embodiment except for the configuration of the heat dissipating member 2036-5808B-PF 90 1270429. The heat dissipating member 360 of the heat sink 31 OD, as explained above, frictionally bonds the aluminum heat dissipating portion 307 to a surface of the copper substrate 305. The aluminum heat dissipating portion 307 is formed by superposing an aluminum substrate 30 7a disposed on one surface of the substrate 305 and fins 3〇7b spaced apart from each other and standing on the opposite side of the substrate 350, so as to be integrated Formed. 42A to 42B are views showing a fifth embodiment of the heat sink of the present invention, wherein Fig. 42A is an exploded perspective view, and Fig. 42B is a perspective view after assembly. Further, Fig. 43A is a plan view of the heat sink of Figs. 42A to 42B; Figs. 43B and 43C are respectively a side view of the heat sink and a side view of the γ direction of the heat sink of Figs. 42A to 42B. Here, the heat sink 31 is substantially the same as the heat sink 310 of the first embodiment, and is a heat sink having a heat dissipating member 35A and a high performance of the fan 32. The heat dissipating member 350 is directly connected to the CPU 340 in a thermally conductive state without passing through the heat transfer pipe 33. The 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 . On the other hand, the heat dissipating component is placed on the surface of the copper substrate 3G5, and two rows of the inlaid chip 1 are placed to separate the groove 304a, and then joined by friction and vibration. ,合;:^ ^ -- Fan of the heat of 31 0E, installed with a shocked piece ’丨u d machi w board section 32ϊ: The lower central part is formed with a clamping groove for fitting clip 344

2036-5808B-PF 91 1270429 關於散熱器31 0E的組裝順序,首先以Cpu 34〇、散熱 疋件350,的基板305的順序重合於插槽343上;將裝設 夾344插入散熱元件350’的夾溝3〇4a ;更將插槽343的 大起343a插入裝設夹344的裝設孔344a,而藉由將突起 343a彎曲加工之固定,而將插槽343、cp[J 34〇、散熱元件 350’以相互受壓接觸的狀態下一體固定,使發熱體之 340與散熱元件350,形成導熱性的連接。 鲁接下來,一面將裝設夾344插入夾溝32ig,一面將風 扇裝設元件321,被覆於散熱元件35〇,之上,將突起3〇5& 插入裝設孔321e後,而藉由將突起3〇5a彎曲加工之固定, 將風扇裝設元件321,裝設於散熱元件35〇,。最後,由風 扇320的上方將小型螺絲321f鎖入小型螺絲孔321d,而 將風扇320裝設於風扇裝設元件321,,而完成了散熱器 321E的組裝。 以上的散熱器321E,係具有散熱元件35〇,與風扇 _ 320 ’在不經由導熱管330的狀態下,直接將CPU 340所產 生的熱直接傳達至散熱元件3 5 〇,,而由風扇強制性地排 出至外界,具有特別高的散熱性能。 而其他的構成及作用,係與第一實施型態之散熱器 31 0 A相同。 第4 4圖為一缸裝後的斜視圖,係顯示本發明散熱器之 第六實施型態。此處的散熱元件310F除了散熱元件的構成 之外’均與第五實施型態之散熱言舒❿ 的散熱元件360,係與第二實施型態之散熱器31〇b相同, 2036-5808B-PF 92 1270429 係將鋁散熱部30 7摩擦震動接合於銅製的基板3〇5的一表 面。鋁散熱部307係將重合配置於基板3〇5的一表面上的 鋁製基板30 7a、以及相互間隔並立設於基板3〇5的相對側 之面上的各鰭片307b,以擠型一體成形而成。又,各鰭片 3〇7b,係形成有與第五實施型態相同而圖式未繪示的夾溝。 第45A〜45B圖係顯示本發明散熱器之第七實施型態, 其中第45A圖為分解斜視圖,第45B圖為組裝後的斜視圖。 又,第46A圖為第45A〜45B圖之散熱器之俯視圖;第46β、 46C圖分別為第45Α〜45β圖之散熱器之χ方向侧視圖與γ 方向側視圖。 此處的散熱器310G大略與第五實施型態之散熱器 310Ε相同,係具有散熱元件35〇,與風扇32〇之高性能的 政熱器。散熱元件35 0,係在不經由導熱管33〇的狀態下, 直接與CPU 340作導熱性的連接。 散熱器310G中,風扇320係裝設於散熱元件35〇,的 一侧,將散熱元件350’的熱排出於一侧。因此,散熱器 31〇G的風扇裝設元件321,’的空氣孔321c、小型螺絲孔 3 21 d係形成於一侧。 以上的散熱器321G,係具有散熱元件35〇,與風扇 320,在不經由導熱管 330 的狀態下,直接將cpϋ34o 所產 生的熱直揍傳達至散I元 出至外界,具有特別高的散熱性能。並且因為風扇320係 配置於散熱元件35α,之*側〜,可,縮事散熱元件31儒 的全體高度,而特別適合於例如薄型的筆記型電腦等要在 932036-5808B-PF 91 1270429 The assembly sequence of the heat sink 31 0E is first superposed on the slot 343 in the order of the substrate 34 of the CPU 34 and the heat sink 350; the mounting clip 344 is inserted into the heat dissipating component 350'. The groove 3〇4a is further inserted into the mounting hole 344a of the mounting clip 344, and the socket 343, cp[J 34〇, heat dissipation is performed by bending the protrusion 343a. The element 350' is integrally fixed in a state of being in pressure contact with each other, and the heat generating body 340 and the heat radiating element 350 are thermally connected. Next, the mounting clip 344 is inserted into the grooving 32ig, and the fan is mounted on the component 321 to be covered on the heat dissipating component 35, and the protrusion 3〇5& is inserted into the mounting hole 321e, and The projections 3〇5a are fixed by bending, and the fan mounting member 321 is mounted on the heat dissipating member 35A. Finally, the small screw 321f is locked into the small screw hole 321d from the upper side of the fan 320, and the fan 320 is attached to the fan mounting member 321, so that the assembly of the heat sink 321E is completed. The heat sink 321E has a heat dissipating component 35 〇, and the heat generated by the CPU 340 is directly transmitted to the heat dissipating component 35 5 without the fan _ 320 ′ passing through the heat pipe 330 , and is forced by the fan. Sexual discharge to the outside, with a particularly high heat dissipation performance. The other configurations and functions are the same as those of the heat sink 31 0 A of the first embodiment. Fig. 4 is a perspective view of the cylinder after mounting, showing a sixth embodiment of the heat sink of the present invention. The heat dissipating component 310F herein is the same as the heat dissipating component 360 of the fifth embodiment except for the configuration of the heat dissipating component, and is the same as the heat sink 31〇b of the second embodiment, 2036-5808B- PF 92 1270429 frictionally and vibrates the aluminum heat dissipating portion 30 7 to one surface of the copper substrate 3〇5. The aluminum heat dissipating portion 307 is formed by superposing an aluminum substrate 30 7a disposed on one surface of the substrate 3〇5 and fins 307b spaced apart from each other and standing on the opposite side of the substrate 3〇5. Formed. Further, each of the fins 3?7b is formed with a groove similar to that of the fifth embodiment and not shown in the drawings. 45A to 45B are views showing a seventh embodiment of the heat sink of the present invention, wherein Fig. 45A is an exploded perspective view, and Fig. 45B is a perspective view after assembly. Further, Fig. 46A is a plan view of the heat sink of the 45A to 45B; the 46th and 46C are respectively a side view of the heat sink of the 45th to 45th planes and a side view of the γ direction. Here, the heat sink 310G is roughly the same as the heat sink 310 of the fifth embodiment, and is a high-performance heat exchanger having a heat dissipating member 35A and a fan 32. The heat dissipating member 35 0 is directly connected to the CPU 340 in a thermally conductive state without passing through the heat transfer tube 33 . In the heat sink 310G, the fan 320 is mounted on one side of the heat dissipating member 35, and the heat of the heat dissipating member 350' is discharged to one side. Therefore, the air hole 321c and the small screw hole 321d of the fan mounting member 321, ’ of the heat sink 31〇G are formed on one side. The heat sink 321G has a heat dissipating element 35 〇, and the fan 320 directly transmits the heat generated by the cp ϋ 34o to the outside without going through the heat transfer pipe 330, and has a particularly high heat dissipation. performance. Moreover, since the fan 320 is disposed on the heat dissipating component 35α, the * side of the heat dissipating component 31 can be reduced to the overall height of the heat dissipating component 31, and is particularly suitable for, for example, a thin notebook computer.

2036-5808B-PF 1270429 CPU340的附近裝設散熱構造有空間上的困難之情況。 而其他的構成及作用,係與第五實施型態之散熱器 31 0 E相同。 第4 7圖為一組裝後的斜視圖,係顯示本發明散熱器之 第八實施型態。此處的散熱元件3丨〇H除了散熱元件的構成 之外,均與第七實施型態之散熱器310G相同。散熱元件 310H的散熱元件360,係與與第六實施型態之散熱器31叮 的散熱元件360’相同。 ♦ ❻具體的尺寸之-例,如下所示。· (υ銅基板的厚度X寬度x深度·· 2mmx72mmx55mm 銘-曰片的居度 <深度x兩度·· 〇. 3mmx54mmxi 〇mm 鰭片間隔·· 1. 5mm〜1. 6mm 鰭片數量:422036-5808B-PF 1270429 There is a spatial difficulty in installing the heat dissipation structure in the vicinity of the CPU 340. The other configurations and functions are the same as those of the heat sink 31 0 E of the fifth embodiment. Fig. 47 is an oblique perspective view showing the eighth embodiment of the heat sink of the present invention. Here, the heat dissipating member 3丨〇H is the same as the heat sink 310G of the seventh embodiment except for the configuration of the heat dissipating member. The heat dissipating member 360 of the heat dissipating member 310H is the same as the heat dissipating member 360' of the heat sink 31 of the sixth embodiment. ♦ ❻ Specific dimensions - examples, as shown below. · (Thickness of υ copper substrate X width x depth · 2mmx72mmx55mm 铭 - 的 的 & 深度 深度 深度 深度 3 3. 3mmx54mmxi 〇mm fin spacing · · 1. 5mm~1. 6mm Number of fins: 42

最大散熱能力:42〜43W (2)銅基板的厚度x寬度χ深度:2mmx72mmx55mm • 鋁鰭片的厚度x深度x高度:〇.3mmx58mmxl2.5mm 鰭片間隔·· 1. 5mm〜1. 6mmMaximum heat dissipation: 42~43W (2) Thickness of copper substrate x Width χ Depth: 2mmx72mmx55mm • Thickness of aluminum fins x Depth x Height: 〇.3mmx58mmxl2.5mm Fin spacing·· 1. 5mm~1. 6mm

鰭片數量:42 最大散熱能力:58〜59W 接下來說明本發明第四群組的實施型態。 金屬—元件接合方法-1-.........-................-----—————— — 本發明金屬元件接合方法的第一實施型態,係為將各 金屬元件重合而摩擦震動接合,的,方赞〜所謂的金屬元件的 摩擦震動接合,是藉由接合治具的壓應力使金屬元件重合Number of fins: 42 Maximum heat dissipation capacity: 58 to 59 W Next, an embodiment of the fourth group of the present invention will be described. Metal-component joining method -1-.........-..............----------the metal component of the present invention The first embodiment of the bonding method is to frictionally and vibrate the metal elements by overlapping them. The frictional vibration bonding of the so-called metal components is the coincidence of the metal components by the compressive stress of the bonding fixture.

2036-5808B-PF 1270429 ;:ΓΓ隙消失’並藉由轉動的接合治具與金屬元件的接觸 :斤:震動分裂破壞存在於金屬元件重合面的氧化物皮 、並藉由摩擦熱將重合部高溫化而發生塑性變形,在增 加各金屬元件的接觸面積與增大擴散速率的: 接合的方法。 5 而特別是,將複數個金屬元件,依照溶點的高低順序 相互重合配置’將接合治具壓至熔點最高的金屬元件之側 而為接合時’在各金屬元件的重合部上升至接合所必要的 溫度時鄰近接合治具之侧的金屬元件仍能保持高抗形變強 度而使接合治具的壓應力能夠有效率地傳達至重人面 因而能夠完成金屬元件間無縫隙之高強度的接合。 此處舉出銘7C件與熔點較高的銅元件作為金屬元件之 -例,而較具體地說明。第48Α〜侃圖係顯示摩擦震動接 β的順序’其中第48A、彻為正面剖面圖,第侃圖為第 48B圖之側視圖。在本實施型態中,首先如第圖所干, 將紹元件401與銅元件4〇2以面拉 ,、別兀仵4U2以面接觸的方式相互重合配 置’以未繪示於圖面的治具固定。 接下來’如第48B、48C圖所*,將以轉動轴㈣為 中心、以圓周方向以圓周速度R高速轉動的接合治具4〇3 之治具本體403的圓周面垂直壓至銅元件權的表面 # 4〇3 ^ 4〇^—的表面帥如以行 進速率V移動,而使紹元件4G1與銅元件4G2重合並接合。 接合治具403係在轉動輯轉卵时實端部將厨板狀的洽具本 體403a固定’而治具本體4〇3a係由JIs:skd6i等工具鋼 2036-5808B-PF 95 1270429 的表面402a時的行進方 的方向,沿著轉動軸4〇3b 所構成。相對於壓入銅元件4 0 2 向’治具本體403a係以送至後方 的周邊轉動。 如第49A圖所示,治具本體4〇3a的圓周面係以—定量 α(π〇壓入銅元件402的表面4〇2a的狀態下以圓周方向= 速轉動,並沿著銅元件402的表面402a移動。而藉著上2 治具本體403a在銅元件402的表面402a之壓入,使鋁元 ^ 401與銅元件4〇2之重合面(交界面)的縫隙消失;並藉 著高速轉動的治具本體403&與銅元件4〇2的接觸所產生^ 震動,將鋁元件401與銅元件402之重合面的氧化物皮膜 刀裂破壞,並如第49B圖所示,與治具本體4〇3a接觸的鋼 元件402的既定區域與其鄰近區域、還有與上述區域鄰接 的鋁元件401的既定區域,因治具本體4〇3&與銅元件4〇2 的摩擦接觸所產生的熱量而高溫化,呈現可塑化(流動化) 的固相狀態。上述的結果,使得銅元件4〇2與鋁元件4〇1 在相互的交界面上流動擴散,並由當初的表面開始塑性變 形。 接合治具403之治具本體403a的通過執跡,如第49c 圖所示,藉由治具本體403a之壓應力而在銅元件4〇2的表 面402a形成一對淺的段部402b。又,鋁元件401與銅元 # 4 0 2 ^ i # ^ ® ) t ^ « 形的 I 元件 4針及 鋼元件402相互咬合,而固化成斷面凹凸型的接合面s, 上述的接合面S介於銅%件4會Γ與"銘%件前I之哪背將二 者確實地接合。 2036-5808B-PF 96 1270429 此處考慮到接合治具403由紹元件4〇^之側廢入時, 銘元件401的溶點低於銅元件4〇2的炫點,紹元件綱與 銅元件402的重合面(交界面)達到接合所必要的溫度(共 日日/皿度548 C )以_L _,紹几件4〇1的抗形變強度就會變得 較小,而使來自接合治且1 Λ Q ^ /、403的壓力無法充分地傳達至鋁 元件4(Π與銅元件術的重合面(交界面),而容易發生接 合不良。另一方面,將接合治具403塵入熔點高於銘元件 401的銅元件402之侧眸,a加-μ , J f在鋁兀件401與銅元件402的 重合面(交界面)達到接合所必要的溫度(共晶溫度)以上 時’銅元件402可以保持比較大的抗形變強度,可使來自 接一具403的壓力充分地傳達至銘元件術與銅元件術 :重合面(交界面)’而使兩元件間的縫隙消失,而能夠行 局強度的接合。 如第50A圖所示,接合治具4〇3之治具本體條的圓 周面上’係形成有約略沿著轉動方向的凹槽她。因此, 增大了接合治具4。3的圓周面與銅元件4〇2的接觸面積, 可以有效率地產生摩擦熱,並可以有效率㈣合鋼 與鋁元件401。 ^ 又凹槽403c,係相對於轉動方向輕微傾斜、且連續的 凹槽’即是在接合治具權的轉動軸嶋的周邊 具本體―敝圓周^ 隨者治具本體4〇3a的轉動與移動,凹槽術内部所蓄 出,因此可以將接合後銅元彳術表面殘留的凹入量(段=2036-5808B-PF 1270429 ;: the gap disappears 'and the contact with the metal element by the rotating joint fixture: the pound: the vibration split breaks the oxide skin present on the coincident surface of the metal component, and the overlap is caused by the friction heat A method of bonding by increasing the contact area of each metal element and increasing the diffusion rate by high temperature. 5 In particular, a plurality of metal elements are placed in a stacking order in accordance with the order of the melting points. When the joining jig is pressed to the side of the metal element having the highest melting point and joined, the joining portion of each metal element rises to the joint. At the necessary temperature, the metal component adjacent to the side of the jig can maintain high deformation strength, so that the compressive stress of the bonding jig can be efficiently transmitted to the heavy human face, thereby enabling high-strength bonding without gaps between the metal components. . Here, an example of a metal element having a higher melting point and a copper element having a higher melting point is exemplified. The 48th 侃 侃 系 显示 显示 显示 显示 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦 摩擦In the present embodiment, first, as shown in the figure, the element 401 and the copper element 4〇2 are pulled in a face-to-face manner, and the other parts of the 4U2 are placed in surface contact with each other in a plane contact manner, which is not shown in the drawing. The fixture is fixed. Next, as shown in Figs. 48B and 48C, the circumferential surface of the jig body 403 of the joining jig 4〇3 which is rotated at a peripheral speed R in the circumferential direction centering on the rotating shaft (four) is vertically pressed to the copper component right. The surface of the surface #4〇3^4〇^- is as handsome as the traveling rate V, and the element 4G1 is re-engaged with the copper element 4G2. The joint jig 403 fixes the kitchen plate-shaped arranging body 403a at the solid end portion when rotating the egg, and the jig body 4〇3a is the surface 402a of the tool steel 2036-5808B-PF 95 1270429 such as JIs:skd6i. The direction of the traveling direction is formed along the rotating shaft 4〇3b. The tool body 403a is rotated toward the periphery of the rear side with respect to the press-fitting copper member 4 0 2 . As shown in Fig. 49A, the circumferential surface of the jig body 4〇3a is rotated in the circumferential direction = speed along the surface of the surface 4〇2a of the copper member 402 by the amount α (π〇), and along the copper member 402 The surface 402a moves, and by the pressing of the upper 2 fixture body 403a on the surface 402a of the copper member 402, the gap between the aluminum element 401 and the copper element 4〇2 overlaps (intersection) disappears; The high-speed rotating jig body 403 & contact with the copper element 4 〇 2 generates vibration, and the oxide film of the overlapping surface of the aluminum element 401 and the copper element 402 is cracked, and as shown in Fig. 49B, The predetermined region of the steel member 402 having the body 4〇3a contact with the adjacent region and the predetermined region of the aluminum member 401 adjacent to the region is generated by the frictional contact between the fixture body 4〇3& and the copper member 4〇2. The heat is high and the solid phase state is plasticized (fluidized). As a result, the copper element 4〇2 and the aluminum element 4〇1 flow and diffuse at the mutual interface, and the plasticity starts from the original surface. Deformation. The passing of the jig body 403a of the jig 403 As shown in Fig. 49c, a pair of shallow segments 402b are formed on the surface 402a of the copper member 4A by the compressive stress of the jig body 403a. Further, the aluminum member 401 and the copper member #4 0 2 ^ i # ^ ® ) t ^ « The shape of the I component 4 pin and the steel component 402 are engaged with each other and solidified into a joint surface s of a profiled concave-convex type, and the above-mentioned joint surface S is interposed between the copper component 4 and the " Which of the first I's back will actually engage the two. 2036-5808B-PF 96 1270429 When considering that the bonding jig 403 is scrapped from the side of the component 4〇, the melting point of the inscription element 401 is lower than that of the copper component 4〇2, and the component element and the copper component are The coincident surface (interface) of 402 reaches the temperature necessary for the joint (a total of DAY/day 548 C) with _L _, and the deformation resistance of several pieces of 4 〇 1 becomes smaller, and the joint deformation becomes smaller. The pressure of 1 Λ Q ^ /, 403 is not sufficiently transmitted to the aluminum component 4 (the interface of the Π and the copper component (interface), and the joint failure is likely to occur. On the other hand, the bonding fixture 403 is dusted. The melting point is higher than the side 眸 of the copper element 402 of the title element 401, a plus -μ, J f when the overlapping surface (intersection) of the aluminum element 401 and the copper element 402 reaches the temperature (eutectic temperature) necessary for bonding 'The copper element 402 can maintain a relatively large deformation strength, so that the pressure from the next 403 can be fully conveyed to the elemental component and the copper component: the coincident surface (intersection)', and the gap between the two components disappears. And the joint of the strength of the row can be achieved. As shown in Fig. 50A, the circumferential surface of the body strip of the jig of the joint fixture 4〇3 The groove is formed approximately in the direction of rotation. Therefore, the contact area of the circumferential surface of the bonding jig 4. 3 with the copper member 4〇2 is increased, friction heat can be efficiently generated, and efficiency can be efficiently obtained. Steel and aluminum element 401. ^ The groove 403c is slightly inclined with respect to the direction of rotation, and the continuous groove 'is the body around the axis of rotation of the joint fixture - the circumference of the fixture ^ the fixture body 4转动3a rotation and movement, the inside of the groove is stored, so the amount of recession remaining on the surface of the copper element after the joint can be segmented (segment =

2036-5808B-PF 97 1270429 4 0 2 b的南度)抑制到最小限度。 在此處,接合治具403的治具本體403a的圓周面之凹 槽403c之間的平面部403d的寬度wl(mm)及凹槽4〇3〇的 寬度w2Um),係設定為符合以下條件:、且 w2S3、且 0.67$wl/w2S5.00。將平面部 403d 及凹槽 4〇3c 如此設定時,不但可以抑制接合治具4〇3的治具本體4〇3& 壓入銅元件402表面的壓入量,接合治具4〇3的治具本體 403a所產生摩擦熱的產生量就亦會較大,而能夠行有效率 的接合。 又,接合治具403之治具本體403a的圓周面的凹槽 403c,係形成為傾斜於治具本體4〇3a的轉動方向,傾斜角 Θ係設定為〇·5〜2·0。。而第50A圖中,Μ係顯示與轉動方 向平行的線。而治具本體403a的整個圓周面的寬度方向 中,至少形成有二條凹槽403c。將凹槽403c的傾斜角0 及數量如此設定時,伴隨著接合治具403的治具本體4〇3a φ 的轉動與移動,凹槽403c内部所蓄積的可塑化的金屬會相 當連續地沿著治具本體403a的寬度方向依序送出,治具本 體403a通過後就幾乎不會有毛邊(burr )與凹痕殘留在銅 元件402的表面,亦減低了機械負荷。 更者,接合治具403之治具本體403a的圓周面的凹槽 4 〇 3 c ^ ^ & d ^ ^ 2 mm 〇 Μ η ^ ^ ^ d如此設定時,可塑化的銅元件402就不會蓄積於凹槽4〇3C 的内部’接合後殘留於銅元件402表面的▼ 較小,就可以施行有效率的接合。 2036-5808B-PF 98 1270429 以上述的方法將紹元件4(n與銅元件4G2重合而摩擦 震動接合時’較好為由下式⑴求出接合時接合治具403(治 具本體403a)轉動的圓周速率R(m/min.): 250 $ 2000...............(A) 接合時接合治具403的圓周速率小於25〇m/n]in時,接 合治具403與銅元件4〇2之摩擦接觸所產生的熱量就過 小,而使銅元件402與紹元件401的重合面(交界面)的溫 度過低,而導致接合不良。另一方面,接合時接合治具4〇3 的圓周速率大於SGGGn^in時,接合治具偏與銅元件4〇2 之摩擦接觸所產生的熱量就會大過所必要的,不僅僅是使 接合治具403的驅動能量損失會變大,並使與接合治具權 接觸的銅元件402的溫度會局部過高,導致該部分發生塑 性變形’而使接合治具403的壓應力無法充分地傳達至重 合面(交界面)導致在兩元件間有可能會產生縫隙。因此, 可以瞭解接合時接合治具403以25〇〜2〇〇〇m/min的圓周速 率轉,時’接合治具403與銅元件402之摩擦接觸所產生 的熱量為恰好適當,而能夠行良好的接合。 又’將銘元件4〇1與銅元件402重合而摩擦震動接合 時’接合時,接合治具403(治具本體4恤)在銅元件4〇2 的表面壓入量α (m)較好為由下式(B)求出: 〇. 0 3 X t ^ a ^ 〇. 3 χ1τ·^ ·νν ·νν^ ^ f ___________ \ y —. 一 —.一….. 其中t為重合部中的銅元件的厚度(m)。 接合時接合治具403在銅元伴402,表面的壓入量々小 於〇.〇3t時,銅元件402與鋁元件401的重合面(交界面) 2036-5808B-PF 99 1270429 中㈢殘留縫隙而導致接合不良。另一方面,壓入量α大於 〇· 3ΐ時’雖然銅元件402與鋁元件401的重合面(交界面) 中不會殘留縫隙,而過大的接合治具403的壓入量會在銅 元件402的表面殘留顯著的凹痕,導致元件的損失。因此, 一夺接口具403在銅元件402表面的壓入量〇:在 〇.〇3t以上、0·3ΐ以下時,接合治具4〇3的壓應力為正好 適田的值’可以瞭解就可以在銅元件402與鋁元件401的 φ 重合部(父界面)不產生缝隙的情況下完成接合,亦可以縮 小鋼元件402表面的凹痕。 更者’將鋁tl件401與銅元件402重合而摩擦震動接 合時,接合時,接合治具4〇3(治具本體4〇3a)沿著銅元件 402的表面移動的行進速率v(m/min)較好為由下式(◦)求 出: °* 1 - V- K/(5. 0xl07xt2)...............(〇 其中R為接合時接合治具的圓周速率(m/min.); t為重合部中的銅元件的厚度(m)。 其中,接合時接合治具4〇3的圓周速率變大時,因接 合治具403與銅元件術的摩擦接觸所產生的熱量亦會變 大,而使接合治具403的行進速率v較高時,重合部仍能 保持- ^的溫度;而鋼元件4()2的厚度變大時,4合面(交 .若言時接合治罝. 403 :行進速率過大時,在重合部的溫度達到—定溫度: 之刖接s ’口具4⑽就已逋過’就會導致资脊不 題。而實行良好的摩擦震動接合時,接合治具4()3的行進 2036-5808B-PF 100 1270429 速率V、圓周速率R、銅元侔的斤危^ — 仵的;度t必須要相互調節。而 實驗結果係確認了滿足R/h n 7 一 κ/U· 0x10 xt )時,能夠有良好 的接合。另—方面’由當接合治4偏的行進速率V過小 時’會有降低接合效率的觀點’實驗結果係確認了滿足01 $ V時,可以得到較好的接合效率。 而&具本體430a係被固定於轉動軸4〇3b的前端部 時,是為懸臂式(cantilever type)的接合治具4〇3,治具 本體430a的寬度係設定為5〜25_;而治具本體4施的寬 度大於25_時,較好為使治具本體43〇&被固定於轉動軸 403b的中間部,是為兩邊固定式的接合治具4〇3。當增加 治具本體43(^的寬度時,作用於接合治具4〇3的壓力會使 轉動軸403b受到損壞,而造成難以將治具本體43〇a的圓 周面垂直壓入銅元件402的表面402a的問題。 而此金屬元件的摩擦震動接合並不限於將鋁元件與銅 元件重合並接合的情況,可以廣泛地適用於各金屬元件間 的重合並接合。而上述金屬元件的形狀,只要在相互重合 之後能夠使接合治具壓入就可以。更者,重合的金屬元件 的數量也不限於二個,三個以上亦可。 例如,在第51圖中,係將三個金屬元件(5〇〇〇系的鋁 元件401、1 000系的鋁元件401,、銅元件402)相互重合 配置,將接合治具403的治具本體403a壓入三個金屬元件 中熔點最高的銅元件4 0 2之側,而為摩擦震動接合。在此, 考慮到接合時各金屬元件的要達到二既定,溫,度以㊇於 時各金屬元件的抗形變強度對來自接合治具的壓應力傳達 2036-5808B-PF 101 1270429 至各金屬70件的重人而贸 、 . 〇面(父界面)之傳達效率的影響,較好 為將二個金屬元件依炼點的高低順序(此處 請、酬系的銘元請,、5嶋的紹元 合配置,並將接合治具壓至三個金屬元件高 的金屬兀件(此處為鋼元件㈣之側,而為摩擦震動接合。 其他’三個金屬元件為銅、在呂、鎂時,較好為以鋼元件、 銘元件、鎮元件的順序重合,將接合治具塵入銅元件之侧2036-5808B-PF 97 1270429 4 0 2 b South (s) is suppressed to a minimum. Here, the width w1 (mm) of the flat portion 403d between the groove 403c of the circumferential surface of the jig body 403a of the jig 403, and the width w2Um of the groove 4〇3〇 are set to satisfy the following conditions. :, and w2S3, and 0.67$wl/w2S5.00. When the flat portion 403d and the recess 4〇3c are set as described above, it is possible to suppress not only the jig body 4〇3& which presses the jig 4〇3, but also the amount of press-fitting of the surface of the copper member 402, and the treatment of the jig 4〇3 The amount of frictional heat generated by the body 403a is also large, and efficient bonding can be performed. Further, the groove 403c of the circumferential surface of the jig body 403a of the jig 403 is formed to be inclined in the rotational direction of the jig body 4〇3a, and the inclination angle Θ is set to 〇·5 to 2·0. . In Fig. 50A, the lanthanide line shows a line parallel to the direction of rotation. At least two grooves 403c are formed in the width direction of the entire circumferential surface of the jig body 403a. When the inclination angle 0 and the number of the grooves 403c are set as described above, the plasticized metal accumulated inside the groove 403c is considerably continuous along the rotation and movement of the jig body 4〇3a φ of the joining jig 403. The width direction of the jig body 403a is sequentially sent out, and after the jig body 403a passes, almost no burr and dents remain on the surface of the copper member 402, and the mechanical load is also reduced. Further, when the groove 4 〇3 c ^ ^ & d ^ ^ 2 mm 〇Μ η ^ ^ ^ d of the circumferential surface of the jig body 403a of the jig 403 is joined, the plasticized copper member 402 is not The inner portion of the groove 4〇3C that is accumulated in the groove 4〇3C is smaller than the ▼ remaining on the surface of the copper member 402, so that efficient bonding can be performed. 2036-5808B-PF 98 1270429 In the above-described method, when the element 4 (n is overlapped with the copper element 4G2 and joined by frictional vibration), it is preferable to determine the rotation of the joint jig 403 (the jig body 403a) at the time of joining by the following formula (1). Circumferential rate R (m/min.): 250 $ 2000...(A) When the circumferential speed of the joining jig 403 is less than 25 〇m/n]in at the time of joining The heat generated by the frictional contact between the bonding fixture 403 and the copper component 4〇2 is too small, and the temperature of the overlapping surface (interface) of the copper component 402 and the component 401 is too low, resulting in poor bonding. When the circumferential speed of the joining fixture 4〇3 is greater than SGGGn^in, the heat generated by the frictional contact between the bonding fixture and the copper member 4〇2 is greater than necessary, not only for the bonding fixture. The driving energy loss of 403 becomes large, and the temperature of the copper element 402 in contact with the bonding jig is locally too high, causing plastic deformation of the portion, and the compressive stress of the bonding jig 403 is not sufficiently transmitted to coincidence. The surface (interface) causes a gap between the two components. Therefore, it can be understood that the joint jig 4 is engaged. 03 is rotated at a peripheral speed of 25 〇 to 2 〇〇〇 m/min, and the heat generated by the frictional contact between the bonding fixture 403 and the copper member 402 is just right, and the bonding can be performed well. 4〇1 coincides with the copper element 402 and the frictional vibration is engaged. When joining, the pressing force α (m) of the bonding fixture 403 (the fixture body 4 shirt) on the copper element 4〇2 is preferably of the following formula ( B) Find: 〇. 0 3 X t ^ a ^ 〇. 3 χ1τ·^ ·νν ·νν^ ^ f ___________ \ y —. One—.1..... where t is the thickness of the copper component in the overlap (m) When joining the jig 403 in the copper element 402, when the surface pressing amount 々 is less than 〇.〇3t, the overlapping surface (interface) of the copper element 402 and the aluminum element 401 2036-5808B-PF 99 1270429 The middle (3) residual gap causes poor joint. On the other hand, when the press-in amount α is larger than 〇·3ΐ, although the gap is not left in the overlapping surface (interface) between the copper element 402 and the aluminum element 401, the excessive joint jig is excessive. The amount of indentation of 403 will leave significant dents on the surface of the copper component 402, resulting in loss of components. Therefore, the interface 403 is in the copper component. The amount of pressing of the surface of the 402 is 〇: when 〇.〇3t or more and 0. 3ΐ or less, the compressive stress of the bonding fixture 4〇3 is just the value of the field. It can be understood that the copper element 402 and the aluminum element 401 can be When the φ coincidence portion (parent interface) is joined without a gap, the dent of the surface of the steel member 402 can be reduced. Further, when the aluminum tl member 401 and the copper member 402 are overlapped and frictionally vibrated, when joined, the joint is engaged. The traveling speed v (m/min) of the jig 4〇3 (the jig body 4〇3a) moving along the surface of the copper member 402 is preferably determined by the following formula (◦): °* 1 - V- K/ (5. 0xl07xt2)...............(where R is the circumferential velocity of the jig when joining (m/min.); t is the thickness of the copper component in the overlap (m). In the case where the circumferential rate of the joining jig 4〇3 at the time of joining becomes large, the heat generated by the frictional contact between the joining jig 403 and the copper member is also increased, and the traveling speed v of the joining jig 403 is high. At the same time, the coincidence portion can still maintain the temperature of - ^; and when the thickness of the steel member 4 () 2 becomes large, the 4 joint surface (cross. If the joint treatment is 罝. 403: when the traveling rate is too large, the temperature at the overlapping portion Reaching - the fixed temperature: 刖 s 'mouth 4 (10) has been smashed 'will lead to the ridge of the ridge. And when a good friction and vibration joint, the joint fixture 4 () 3 travel 2036-5808B-PF 100 1270429 Rate V, circumferential rate R, copper 侔 危 ^ ; ; ;; degree t must be adjusted to each other. And the experimental results confirm that R / hn 7 - κ / U · 0x10 xt) can be good Engagement. On the other hand, when the traveling rate V of the bonding process is too small, the bonding efficiency is lowered. The experimental results show that when the value of 01 $ V is satisfied, a good bonding efficiency can be obtained. When the main body 430a is fixed to the front end portion of the rotating shaft 4〇3b, it is a cantilever type joint jig 4〇3, and the width of the jig body 430a is set to 5 to 25 mm; When the width of the jig body 4 is greater than 25 mm, it is preferable that the jig body 43 is fixed to the intermediate portion of the rotating shaft 403b, and is a joint jig 4〇3 which is fixed on both sides. When the width of the jig body 43 is increased, the pressure acting on the jig 4〇3 causes damage to the rotating shaft 403b, which makes it difficult to press the circumferential surface of the jig body 43〇a vertically into the copper member 402. The problem of the surface 402a. The frictional vibration bonding of the metal member is not limited to the case where the aluminum member and the copper member are overlapped and joined, and can be widely applied to the re-engagement bonding between the metal members. After the mutual overlap, the joining jig can be pressed in. Further, the number of the overlapping metal members is not limited to two, and three or more. For example, in Fig. 51, three metal members are used ( The aluminum element 401 of the lanthanum system, the aluminum element 401 of the 1 000 series, and the copper element 402) are placed one on another, and the jig body 403a of the bonding jig 403 is pressed into the copper element 4 having the highest melting point among the three metal elements. On the side of 0 2, it is a frictional vibration joint. Here, in consideration of the fact that each metal component of the joint is to be set to a predetermined temperature, the deformation resistance of each metal component is transmitted to the compressive stress from the joint fixture. 2 036-5808B-PF 101 1270429 To the weight of 70 people of each metal, the influence of the communication efficiency of the face (parent interface) is better than the order of the two metal components according to the point of refining (here, The inscription of the reward system, please arrange the 5 yuan of the Shaoyuan, and press the jig to the metal part of the three metal parts (here the side of the steel element (4), and the frictional vibration joint. When the three metal components are copper, in the case of Lu and magnesium, it is preferable to overlap the steel component, the inscription component, and the town component, and the bonding fixture is dusted into the side of the copper component.

而行摩擦震動接合。 金屬元件接合方法一 2 本發明金屬元件接合方法的第二實施型態’係將複數 個金屬製板材立設接合於一金屬製的基板而為摩擦震動接 合而製造一散熱元件。 第52Α〜52Β圖及第53Α〜53Β圖為一系列之正面剖面 圖,係顯示本發明之金屬元件接合方法之第二實施型態之 製造方法,其中第52Α〜52Β圖係顯示元件配置步驟,其中 _第53Α圖係顯示摩擦震動接合步驟,第53Β圖係顯示間隔 物脫離步驟。又,第54圖為一分解斜視圖,係顯示本發明 之散熱元件製造用治具之一實施型態。 在本貫施型態中,首先如第5 2 Α圖所示,將鋁製的板 狀兀件之鰭片404與鐵製的板狀元件之間隔物405交互並 列’並立設配置於散熱元件製造用治具41 〇之元件設定部 412 〇 散熱元件製造用治具4TT,如第1爹圖⑸所示,係由上面 是開放的箱型治具本體411、置放於元件設定部412且可 2036-5808B-PF 102 1270429 以滑動的壓板413、緊閉螺栓414、基板固定板4i5、斑緊 閉螺栓416所構成。其中元件設定部412係形成於治具本 體411内部之凹部;緊閉螺检414係以與壓板413直交的 向貝穿〜、本體411的壁體,且其前端部係固著於壓板 413的月面,碩部則位於治具本體41丨的壁體的外側;基 板固定板415係以與壓板413平行的方向,架設於、並橫 跨治具本體411的壁體的上部;緊閉螺检416係用以將基 •板固定板415的兩端固定於治具本體411的壁體的上部。 而在此處,各鰭片4 0 4與各間隔物4 0 5以交互立設的 方式並排於元件設定部412,將緊閉螺栓414 #緊而藉由 壓板413的固定’使上述各鰭片4〇4與各間隔物4〇5彼此 之間在相互緊密接觸之下固定。此時,因為鰭片4〇4與間 隔物405是全體等高的,各鰭片4〇4的上面(基端面)與各 間隔物405的上面(基端面)係形成一水平面。 接下來’如第52B圖所示,在配置於元件設定部412 •的各鰭片404及各間隔物405的上面,搭載銅製的板狀元 件之基板406及其上方的基板固定板415,並將各鰭片4〇4 及各間隔物405的上部(基端部)嵌入形成於基板固定板 415的下面之凹槽415a,而固定各鰭片404及各間隔物 405,使其無法朝其長度方向(與紙面垂直的方向)移動。更 者,在此狀態下,由基板固定板415兩端的螺絲孔415b, 朝向治具本體411的壁體上面的螺絲孔41 la,將緊閉螺栓 416旋緊,而將基板406固定於鰭货着4及間隔物“ 上部。又,雖然圖式中未繪示,將基板406固定而使其無 2036-5808B-PF 103 1270429 去朝其寬度方向(紙面的左右方向)移動是必要的。此處, 猎由鰭片404及間隔物405的基端面與基板406的下面(一 表面)直接接觸,而完成將鰭片404與間隔物405立設配置 於基板406的步驟。 而如第52A、52B圖所示的元件配置步驟,並非必要的 限制,只要在最後將各鰭片4〇4與各間隔物4〇5如第 圖所示配置於既定的位置,並不限制其順序。因此,亦可 •以是例如將相互之間具有間隔的各鰭片404(或各間隔物 4〇5)配置好,在將基板4〇6固定於其基端面之後,最後在 1片404(或間隔物405)之間分別插入間隔物4〇5(或鰭片 404)。 接下來,如第53A圖所示,將以轉動軸4〇朴為中心以 圓周方向高速轉動的接合治具4〇3之治具本體4〇3a的圓周 面垂直壓至基板406之另-表面206a,並使接合治具4〇3 沿著基板406之另一表面406a移動,使鰭片4〇4接合於基 板406。治具本體403a的圓周面,係形成有與第一實施型 態相同的凹槽403c。 此%,因為構成基板406的銅的熔點高於構成鰭片4〇4 的銘,鰭片404與基板406之交界面的溫度上升到接合時 所必要的溫度(共晶溫度:5肌)時,基板4〇6仍能保持高 的抗形變強度’使接合治具權的壓應力能夠有效率地傳 達至交界面’並且能行韓片4G4與基板傷之間無縫隙的 高強度接合。 _ 又’由於構成間隔物405的鐵的熔點高於構成鰭片4〇4 2036-5808B-PF 104 1270429 的鋁及構成基板406的銅,接合治具403的圓周速率與行 進速率設定在既定的範圍時,間隔物4〇5不會與鰭片4〇4 及基板406接合,而能夠容易地僅接合基板4〇6與鰭片4〇4。 最後’將散熱元件製造用治具410的緊閉螺栓216放 鬆,而將基板固定板41 5從治具本體411取下,並將緊閉 螺栓414放鬆,解除壓板413對鰭片404及間隔物405的 固疋’如第53B圖所示,將基板406向上移動。如此一來, _ 僅有接合於基板406的各鰭片404 —起向上移動,而將各 間隔物405留在散熱元件製造用治具41〇之元件設定部 412。如此可以以間隔物脫離步驟簡單地移除各間隔物 405,而可以製造出如第55圖所示之散熱元件45〇,其中 散熱元件4 5 0係由相互間隔的複數個鋁製鰭片4 4立設接 合於銅製基板406之一表面。 藉由上述的方法,由於各鰭片404之間分別置入各間 隔物405,可以正確地保持鰭片4〇4相互之間隔,並可以 ®決定相互以既定間隔隔開狀態的各鰭片4〇4之並列位置。 又,間隔物405係補強了鰭片4〇4,摩擦震動接合步驟時 就不會有彎曲應力作用在鰭片4〇4,鰭片4〇4的厚度亦可 以變付非常薄。又,只要變更間隔物4〇5的厚度,就能夠 任意地變更鰭片404之配置間隔,更加上一併變更鰭片4〇4 的高度的情況下,特別是將薄板厚、高板高的各鰭月4〇4 以短間隔立設接合於基板406之一表面,就可以製造具有 高高度/間隔比(例如高度/間隔资超,過,阶 450。當然,間隔物405並不限定為金屬製,考量到強度、 2036-5808B-PF 105 1270429 加工性等因素時,亦可以使用陶兗或是其他任意材質;又 亦可以適宜地決定間隔物4〇5的形狀。而在元件配置步驟 等各-、、曰片404立设配置於基板4〇6的一表面時,各間隔 物4〇5的基端面雖然亦可以不與基板406的該表面接觸’ 而考慮到摩擦震動接合步驟時來自接合治具4〇3的壓應力 作用為對‘II片4G4的_曲應力時,為了提高間隔物4〇5對 鰭片404的補強被要,& ^ , 車父好為如本實施型態一般,準備同 门的各間物405與各鰭片4〇4,而使各間隔物4〇5的基 端面與基板406的該表面接觸。 而在提升基板406與各鰭片4〇4之接合強度的同時, 亦提升散熱元件450的散熱性能的情況,就如第56A圖所 :’車乂好為使接合治具4〇3(治具本體4〇3a)在基板4〇6的 裏面(基板406的另一表面)的移動能夠遍及各鰭片綱的 基端面的全面,佬彳旱久鍺y λ 從侍各鰭片404能夠完全地接合於基板 4〇6。(第56Α〜56C圖中以斜線標示的區域係表示接合治具 403的移動軌跡)另—方面,在重視接合成本的削減時,例 如如第56Β圖所示’亦可以移動接合治具4〇3,而未遍及 各鰭片4G4的基端面的全面,僅遍及各縛片綱基端面的 。又,將基板406與各韓片404摩擦震動接合時, 同時也將基板406與各間隔物4Q5接合時,在間隔物脫離 步驟中’雖然可以使用任何的方法將各間隔物權從基板 406與各鰭片404移除;在接合治具4〇3的治具本體4〇3a 的寬度小於錯片404的厚度時,如繁,5翁野赏示…較好為 以基板406與各間隔物405不會接合的軌跡(在圖式中為各 2036-5808B-PF 106 1270429 鰭片404正上方的區域),來移動接合治具4〇3,·又,僅僅 使各鰭片404與基板406接觸,而使各間隔物4〇5不與基 板406接觸的配置亦可;或是,如上述的實施型態一般, 使用熔點高於鰭片404及基板4〇6之熔點的間隔物4〇5 時,就與接合治具403的移動執跡無關,各間隔物4〇5不 會接合於基板406與鰭片404時,即使在接合後,各間隔 物405亦不會接合於基板406與鰭片404,而使間隔物脫 •離步驟的程序可以省略,而能夠削減製造成本。又,因接 合治具403的壓應力而在基板4〇6之另一表面4〇6&殘留較 大凹痕時,可將基板406的表面406a切削掉一既定厚度, 而能夠得到具美麗外觀的散熱元件45〇。 又,為了簡化摩擦震動接合步驟,如第57圖所示,亦 可以使用在轉動軸403b的周邊以一既定間隔固定有複數 :治具本體403a的接合治具403,取代接合治具4〇3。此 時,可以同時對複數個區域施以摩擦震動接合,可以縮斷 接合時所需要的時間,因而更加提昇效率。 而以上述方法所製造的散熱元件450的各鰭片404的 前端面更與另一基板406’接合時’如第58圖所示,亦可 、製l出將相互間隔的各鰭片4 〇 4分別摩擦震動接合於基 板406、406’的散熱元件450,。 第58圖所示之散熱元件45〇,的製造順序的第一樣態 如第59A圖所示,將相互間隔的各鰭片4〇4之間分別置入 各間隔物4 0 5 ’苒於各鰭片4 的兩端f圖式γ 分別配置基板4G6、4G6,,分別將接合治具偏、4〇3壓 2036-5808B-PF 107 1270429 至基板406的背面(圖式中的上面)以及基板4〇6,的背面 (圖式中的下面),同時作摩擦震動接合。而在最後,將各 間隔物4 0 5由側面(垂直紙面的方向)取出。 散熱元件450’的製造順序的第二樣態如第59B圖所 不’將相互間隔的各鰭片404之間分別置入各間隔物405, 再於各鰭片404的兩端(圖式中的上下端)分別配置基板 406、406 ’在一側將接合治具403向下壓至基板406的 • 背面(圖式中的上面)而作摩擦震動接合。之後保持各元件 的配置關係,將鰭片404、間隔物405、基板4〇6、與基板 406’上下反轉,如第59C圖所示,在另一側將接合治具 403向下壓至基板406,的背面(圖式中的上面)而作摩擦 晨動接a而在最後,將各間隔物4 0 5由側面(垂直紙面的 方向)取出。 散熱τΜ牛450,㈤製造順序㈣三樣態6〇A圖所 示,將相互間隔的各,鰭片404之間分別置入各間隔物4〇5, 在僅僅於各鰭片404的一端(圖式中的上端)配置基板 406 ’在-侧將接合治具4{)3向下壓至基板綱的背面(圖 式中的上面)而作摩擦震動接合。之後保持各元件的配置關 係,將鰭片404、間隔物405、與基板4〇6上下反轉,如第 隱圖所示,於各鰭片404的另—端(圖式t的上端)配置 基板406 ,更如第60C圖所示,在另一側將接合治具4〇3 向下壓至基板4G6,w背面(圖式中的上面)而作摩擦震動 接合。而在最後,將各間隔翁4阶由側赞f垂金 取出。The line is frictionally joined. Metal Element Bonding Method 1 In the second embodiment of the metal element joining method of the present invention, a plurality of metal plates are vertically joined to a metal substrate to form a heat dissipating member for frictional vibration bonding. The 52nd to 52th drawings and the 53rd to 53th drawings are a series of front cross-sectional views showing the manufacturing method of the second embodiment of the metal component bonding method of the present invention, wherein the 52nd to 52th drawings show the component arrangement steps, The _53Α diagram shows the frictional vibration bonding step, and the 53rd diagram shows the spacer detachment step. Further, Fig. 54 is an exploded perspective view showing an embodiment of the jig for manufacturing a heat dissipating member of the present invention. In the present embodiment, first, as shown in FIG. 5, the fins 404 of the aluminum plate-shaped element are alternately arranged with the spacers 405 of the plate-like elements made of iron and are vertically disposed on the heat dissipating component. The fixture setting unit 412 for manufacturing the jig 41 is disposed on the component setting unit 412 by the box-shaped fixture main body 411 which is open from the top, as shown in Fig. 1 (5). The 2036-5808B-PF 102 1270429 is composed of a sliding platen 413, a closing bolt 414, a substrate fixing plate 4i5, and a spot tightening bolt 416. The component setting portion 412 is formed in a recessed portion inside the jig body 411; the closing screw 414 is a wall body that is perpendicular to the pressing plate 413, and the front end portion is fastened to the pressing plate 413. The lunar surface is located on the outer side of the wall of the fixture body 41丨; the substrate fixing plate 415 is mounted on the upper portion of the wall body of the jig body 411 in a direction parallel to the pressing plate 413; The inspection 416 is for fixing both ends of the base plate fixing plate 415 to the upper portion of the wall of the jig body 411. Here, each of the fins 404 and the spacers 405 are arranged side by side in the element setting portion 412, and the closing bolts 414 # are tightly held by the fixing of the pressure plate 413 to make the respective fins The sheet 4〇4 and the spacers 4〇5 are fixed to each other in close contact with each other. At this time, since the fins 4〇4 and the spacers 405 are all equal in height, the upper surface (base end surface) of each fin 4〇4 and the upper surface (base end surface) of each spacer 405 form a horizontal plane. Then, as shown in FIG. 52B, the substrate 406 of the plate-shaped element made of copper and the substrate fixing plate 415 above it are mounted on the upper surface of each of the fins 404 and the spacers 405 of the element setting unit 412. The fins 4〇4 and the upper portion (base end portion) of each of the spacers 405 are fitted into the recesses 415a formed on the lower surface of the substrate fixing plate 415, and the fins 404 and the spacers 405 are fixed so as not to be opposed thereto. The length direction (the direction perpendicular to the paper surface) moves. Furthermore, in this state, the screw holes 415b at both ends of the substrate fixing plate 415 are screwed toward the screw holes 41 la on the wall of the fixture body 411, and the fastening bolts 416 are tightened to fix the substrate 406 to the fins. 4 and spacer "upper. Again, although not shown in the drawings, it is necessary to fix the substrate 406 so that it does not move 2036-5808B-PF 103 1270429 in its width direction (left and right direction of the paper). The base end surface of the fin 404 and the spacer 405 is in direct contact with the lower surface (one surface) of the substrate 406, and the step of arranging the fin 404 and the spacer 405 on the substrate 406 is completed. The component arrangement step shown in FIG. 52B is not necessarily limited, and as long as the fins 4〇4 and the spacers 4〇5 are disposed at a predetermined position as shown in the figure, the order is not limited. Alternatively, for example, the fins 404 (or the spacers 4〇5) having a space therebetween may be disposed, after the substrate 4〇6 is fixed to the base end surface thereof, and finally at a 404 (or interval) A spacer 4〇5 (or fin 404) is inserted between the objects 405). As shown in Fig. 53A, the circumferential surface of the jig body 4〇3a of the joining jig 4〇3 which is rotated at a high speed in the circumferential direction about the rotation axis 4 is vertically pressed to the other surface 206a of the substrate 406, and The bonding fixture 4〇3 is moved along the other surface 406a of the substrate 406 to bond the fins 4〇4 to the substrate 406. The circumferential surface of the jig body 403a is formed with the same groove as the first embodiment. 403c. This %, because the melting point of copper constituting the substrate 406 is higher than that of the fins 4〇4, the temperature at the interface between the fin 404 and the substrate 406 rises to the temperature necessary for bonding (eutectic temperature: 5 muscles). At the time of the substrate 4〇6, the high deformation strength can be maintained, so that the compressive stress of the bonding jig can be efficiently transmitted to the interface and the high-strength bonding without gap between the Korean film 4G4 and the substrate can be performed. _ 'Because the melting point of the iron constituting the spacer 405 is higher than the aluminum constituting the fins 4〇4 2036-5808B-PF 104 1270429 and the copper constituting the substrate 406, the circumferential rate and the traveling rate of the bonding jig 403 are set at an established value. In the range, the spacer 4〇5 does not overlap with the fin 4〇4 and the substrate 406 In combination, the substrate 4〇6 and the fins 4〇4 can be easily joined. Finally, the closing bolts 216 of the jig 410 for heat dissipation element manufacturing are loosened, and the substrate fixing plate 41 5 is removed from the jig body 411. And the locking bolt 414 is loosened, and the fixing of the fin 413 and the spacer 405 is released. As shown in FIG. 53B, the substrate 406 is moved upward. Thus, only _ is bonded to the substrate 406. The fins 404 are moved upward, and the spacers 405 are left in the element setting portion 412 of the jig 41 for heat dissipation element manufacturing. Thus, the spacers 405 can be simply removed in the spacer removing step, and the heat dissipating member 45A as shown in FIG. 55 can be manufactured, wherein the heat dissipating member 450 is composed of a plurality of aluminum fins 4 spaced apart from each other. 4 is erected to one surface of the copper substrate 406. According to the above method, since the spacers 405 are respectively disposed between the fins 404, the fins 4〇4 can be properly spaced from each other, and the fins 4 which are mutually spaced apart at a predetermined interval can be determined. The collocation position of 〇4. Further, the spacers 405 reinforce the fins 4〇4, and the frictional stress bonding step does not cause bending stress to act on the fins 4〇4, and the thickness of the fins 4〇4 can be made very thin. Moreover, if the thickness of the spacers 4〇5 is changed, the arrangement interval of the fins 404 can be arbitrarily changed, and when the height of the fins 4〇4 is changed more than once, the thickness of the thin plate and the height of the plate are particularly high. Each fin month 4〇4 is erected to a surface of one of the substrates 406 at a short interval, and can be manufactured with a high height/space ratio (for example, height/interval, over, step 450. Of course, the spacer 405 is not limited to Metal, considering the strength, 2036-5808B-PF 105 1270429 processability and other factors, you can also use ceramic pot or any other material; can also be suitable to determine the shape of the spacer 4〇5. When the respective slabs 404 are disposed on one surface of the substrate 4〇6, the base end faces of the spacers 4〇5 may not be in contact with the surface of the substrate 406, and the frictional vibration bonding step is considered. When the compressive stress from the joining fixture 4〇3 acts as the _-curvature stress of the 'II piece 4G4, in order to improve the reinforcement of the fin 404 by the spacer 4〇5, & ^, the car is better as this embodiment Generally, the 405 and the fins of the same door are prepared. 4〇4, the base end faces of the spacers 4〇5 are brought into contact with the surface of the substrate 406. While the bonding strength between the substrate 406 and the fins 4〇4 is improved, the heat dissipation performance of the heat dissipating component 450 is also improved. In the case, as shown in Fig. 56A: 'The rut is so that the movement of the bonding fixture 4〇3 (the fixture body 4〇3a) on the inside of the substrate 4〇6 (the other surface of the substrate 406) can be spread over the fins. The hologram of the base end face of the slab can be completely joined to the substrate 4 〇 6 from the slab fins 404. (The areas indicated by oblique lines in the 56th to 56Cth drawings indicate the bonding jig 403 In the other way, when the reduction of the joint cost is emphasized, for example, as shown in Fig. 56, the joint jig 4〇3 can be moved, and the base end faces of the fins 4G4 are not spread over the entire range. Further, when the substrate 406 is frictionally and frictionally bonded to each of the Korean sheets 404, and when the substrate 406 is joined to the spacers 4Q5, the spacers are detached from the step, although the spacers may be used in any manner. The property right is removed from the substrate 406 and the fins 404; the treatment of the bonding fixture 4〇3 When the width of the main body 4〇3a is smaller than the thickness of the wrong piece 404, as shown in Fig. 5, it is preferable that the trajectory of the substrate 406 and the spacers 405 are not joined (in the figure, each 2036-5808B- PF 106 1270429 is a region directly above the fin 404) to move the bonding jig 4〇3, and only the fins 404 are in contact with the substrate 406, and the spacers 4〇5 are not in contact with the substrate 406. Alternatively, as in the above-described embodiment, when the spacer 4〇5 having a melting point higher than the melting point of the fin 404 and the substrate 4〇6 is used, it is independent of the movement of the bonding jig 403, and the intervals are When the object 4〇5 is not bonded to the substrate 406 and the fin 404, even after the bonding, the spacers 405 are not bonded to the substrate 406 and the fins 404, and the procedure for removing the spacers may be omitted. And it can reduce manufacturing costs. Further, when the other surface 4〇6& of the substrate 4〇6 remains large indentation due to the compressive stress of the bonding jig 403, the surface 406a of the substrate 406 can be cut to a predetermined thickness, and a beautiful appearance can be obtained. The heat dissipating component 45〇. Further, in order to simplify the frictional vibration joining step, as shown in Fig. 57, a joining jig 403 in which a plurality of jig bodies 403a are fixed at a predetermined interval around the rotating shaft 403b may be used instead of the jig 4? . At this time, the frictional vibration joint can be applied to a plurality of regions at the same time, and the time required for the joint can be shortened, thereby improving the efficiency. When the front end surface of each of the fins 404 of the heat dissipating component 450 manufactured by the above method is further joined to the other substrate 406', as shown in Fig. 58, the fins 4 which are spaced apart from each other can also be formed. 4 frictional vibrations are respectively bonded to the heat dissipating elements 450 of the substrates 406, 406'. The heat dissipating element 45A shown in Fig. 58 has the same manufacturing sequence as shown in Fig. 59A, and the spacers 4〇4 which are spaced apart from each other are placed between the spacers 4 0 5 ' The both ends f of each of the fins 4 are arranged with the substrates 4G6 and 4G6, respectively, and the bonding jig is biased, 4〇3 pressure 2036-5808B-PF 107 1270429 to the back surface of the substrate 406 (the upper side in the drawing), and The back surface of the substrate 4〇6 (the lower side in the drawing) is simultaneously subjected to frictional vibration bonding. At the end, each of the spacers 405 is taken out from the side (the direction of the vertical paper). The second aspect of the manufacturing sequence of the heat dissipating component 450' is as shown in FIG. 59B. The fins 404 spaced apart from each other are placed in the spacers 405, respectively, and then at the ends of the fins 404 (in the drawing) The upper and lower ends of the substrate 406, 406' are respectively disposed on one side of the bonding jig 403 to the back surface of the substrate 406 (the upper surface in the drawing) for frictional vibration bonding. After that, the arrangement relationship of the respective elements is maintained, and the fins 404, the spacers 405, the substrate 4〇6, and the substrate 406' are reversed upside down. As shown in FIG. 59C, the bonding jig 403 is pressed down on the other side to On the back surface of the substrate 406 (the upper surface in the drawing), the frictional morning connection a is made, and finally, the spacers 405 are taken out from the side surface (the direction perpendicular to the paper surface). Heat dissipation τ yak 450, (5) Manufacturing sequence (4) Three states 6 〇 A diagram, each of the mutually spaced fins 404 is placed between each spacer 4 〇 5, at only one end of each fin 404 ( The upper end of the drawing) is disposed on the substrate 406' on the side to press the bonding jig 4{) 3 down to the back surface of the substrate (the upper surface in the drawing) for frictional vibration bonding. After that, the arrangement relationship of the components is maintained, and the fins 404, the spacers 405, and the substrate 4〇6 are vertically inverted. As shown in the hidden diagram, the other ends of the fins 404 (the upper end of the figure t) are disposed. The substrate 406, as shown in Fig. 60C, is pressed on the other side to the back surface of the substrate 4G6, w (the upper surface in the drawing) for frictional vibration bonding. In the end, the 4th order of each spacer is taken out by the side.

2036-5808B-PF 108 1270429 政熱元件4 5 0 的;Ρ邊·川旨皮^ αα » 一 " 、序的弟四樣態如第60D圖所 示,將相互間隔的各鯖片 乃4U4之間分別置入各間隔物4〇5, 在僅僅於各鰭片404的一端(円山 ^ 和(圖式中的上端)配置基板 侧,在一側將接合治具·向下麗至基板彻的背面(圖 式中的上面)而作摩擦震動接合。接下來,如帛60Ε圖所 示’將基板406與鰭片404向卜梦心 门上私動,將基板405取出,2036-5808B-PF 108 1270429 Political element 4 5 0; Ρ · · 川 皮 皮 α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α α Each of the spacers 4〇5 is placed in between, and the substrate side is disposed only at one end of each of the fins 404 (the upper end of the drawing), and the bonding jig is turned down to the substrate on one side. The back side (the upper part in the drawing) is used for frictional vibration bonding. Next, as shown in Fig. 60, the substrate 406 and the fin 404 are privately moved to the Bumeng door, and the substrate 405 is taken out.

而先完成散熱元件450。之後,脾與為 L &傻將散熱兀件450上下反轉, 如弟60F圖所示,在久鍵η 在各籍片404之間分別置入各間隔物 405,於各鰭片404的另一踹Γ闰斗、山 力 ^(圖式中的上端)配置基板 406’ 。更如第6〇g圖所干,力H y α斤不在另一側將接合治具403向下 壓至基板406’的背面 (Θ式中的上面)而作摩擦震動接 合。而在最後,將各間隔物4〇5 j阳切刊ΰ由側面(垂直紙面的方向) 取出。 金屬元件接合方法-3 本發明金屬元件接合方沐夕榮_ a 一— 丧口万去之弟二實施型態,與上述第 二實施型態約略相同,而不回科— J而不冋點在於不使用散熱元件410, 而使用間隔物治具420以代之。 間隔物治具420’如第61A圖所示,係為將各間隔物 405的前端部(圖式中的下端部)相互連結的斷面為梳子形 狀的治具。而在元件配置步驟中,將間隔物治纟42〇的各 間隔物405向上放置並固定後’如第61β圖所示,分別將 各鰭>} 404插入各間隔物4〇5之間,更如第圖所示, 將各鰭片404的上面(基端面)貧塞板㈣分的下面(一表面) 接觸,將基板406固定。亦可將第61B、61C圖的順序逆轉, 109The heat dissipating component 450 is completed first. After that, the spleen and the L & silly heat sink element 450 are reversed up and down, as shown in the figure 60F, the spacer 405 is placed between the respective sheets 404 at the long key η, and the spacers 405 are respectively placed on the fins 404. The other bucket, the mountain force ^ (the upper end in the drawing) is arranged with the substrate 406'. Further, as shown in Fig. 6g, the force H y α jin does not press the bonding jig 403 down to the back side of the substrate 406' (the upper side in the cymbal type) on the other side for frictional vibration bonding. At the end, each spacer 4〇5j is cut out from the side (the direction of the vertical paper). Metal Element Bonding Method-3 The metal component of the present invention is joined to the side of the MU _ _ a _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Instead of using the heat dissipating element 410, a spacer jig 420 is used instead. As shown in Fig. 61A, the spacer jig 420' is a jig having a comb shape in which the tip end portions (lower end portions in the drawings) of the spacers 405 are connected to each other. In the component arrangement step, after the spacers 405 of the spacers are placed upside down and fixed, as shown in FIG. 61β, the respective fins >} 404 are inserted between the spacers 4〇5, respectively. Further, as shown in the figure, the upper surface (one surface) of the upper (base end) side of each fin 404 is contacted to fix the substrate 406. The order of Figures 61B and 61C can also be reversed, 109

2036-5808B-PF 1270429 將基板406固定於間隔物治具42〇的上面之後,再由側面 (與紙面垂直方向)將各間隔物4〇5插入。 如第61D圖所示,在接下來的摩擦震動接合步驟中, 將接合治具403壓至基板406的上面(另一表面),將基板 406摩擦震動接合於各鰭片4〇4。 如第61 £圖所示,在最後的間隔物脫離步驟中,將基 板406及接合於其上的各鰭片4〇4向上移動’而移除間隔 物治具420。 如本實施型態使用間隔物治具420時,就不需要使用 散熱元件製造用治I 410,其優點在於可以省略配置間隔 物4 0 5的程序。 金屬元件接合方法一4 本發明金屬元件接合方法之第四實施型態,與上述第 二實施型態約略相同,而不同點在於元件配置步驟中的鰭 片配置步驟以及其後的基板配置步驟。 而最初的鰭片配置步驟中,如第62A圖所示,各鰭片 404與各間隔& 4G5交互並列,並立設配置於散熱元^製 造用治具410之元件設定部412,此時各間隔⑯邮的基 端面分別沒入各·鳍片404的基端面之下,而使各間隔物405 的基端面分別低於各鰭#偏的基端面的高度差不大於各 間隔物405的厚度。換言之’各籍片4〇4的高度係分別高 =各間隔物405的高度,且其範圍係在間隔物4〇5的厚度 範:内;各轉片404的基端面分別货崎 面突出,且其範圍係在間隔物405的厚度範圍内。 2036-5808B-PF 110 1270429 接下來的基板配置步驟中,如第62B圖所示,在立設 配置於70件設定部412的各鰭片404上,承載基板4〇6。 然後如第62C、62D圖所示,藉由朝向鰭片404之向下的壓 應力之作用將各鰭片404的基端部404a(較各間隔物405 突出的部分)彎折並固定在呈斷面L字型的狀態。此時,由 於續片404的基端部404a的高度在間隔物405的厚度範圍 内’被彎折的鰭片404的基端部404a不會相互重疊,而形 •成平行於並靠著基板406的一表面(圖式中的下表面)的表 面0 接下來,如第63A圖所示,將以轉動軸403b為中心以 圓周方向高速轉動的接合治具4〇3的治具本體4〇3的圓周 面垂直壓至基板406的另一表面406a,並使接合治具403 沿著基板406的表面406a移動,而將各鰭片404的基端部 4〇4a接合於基板4Q6。 此^ ’因為被彎折成直角的鰭片404的基端部404a形 _成/口著基板406之-表面的面,與第二實施型態比較,係 增加基板406與鰭片404之接觸面積,可使兩者確實地接 合。而藉由本發明,即使鰭片4〇4的厚度非常薄,可以製 造出基板406與各鰭片404已確實地立設接合的散熱元件 450 〇 最後,如第63β圖所示,將基板4〇6向上移動,僅有 已接合於基板406的各鰭片404 —起向上移動,而將各間 隔物405留在散熱元件製造背洽'具辦 可以製造出具有彎折的基端部4〇4立設接合於基板4〇6之 2036-5808Β-PF 111 1270429 一表面的散熱元件450。 散熱元件的製造方法 的製造方法之實施型態。 方法之第二實施型態約略 予型的鰭片構成材430取 接下來說明本發明散熱元件 本實施型態與上述金屬元件接合 相同,而不同點在於使用斷面凹 代鰭片404。2036-5808B-PF 1270429 After the substrate 406 is fixed to the upper surface of the spacer jig 42, the spacers 4〇5 are inserted from the side surface (the direction perpendicular to the paper surface). As shown in Fig. 61D, in the subsequent frictional vibration bonding step, the bonding jig 403 is pressed onto the upper surface (the other surface) of the substrate 406, and the substrate 406 is frictionally and vibrationally bonded to the respective fins 4〇4. As shown in Fig. 61, in the final spacer detachment step, the spacer 420 is removed by moving the substrate 406 and the fins 4〇4 bonded thereto upward. When the spacer jig 420 is used in the present embodiment, it is not necessary to use the heat dissipating member manufacturing process I 410, which is advantageous in that the procedure of disposing the spacer 405 can be omitted. Metal Element Bonding Method - 4 The fourth embodiment of the metal element bonding method of the present invention is approximately the same as the above-described second embodiment, except for the fin arrangement step in the element arrangement step and the subsequent substrate arrangement step. In the first fin arrangement step, as shown in FIG. 62A, each of the fins 404 is alternately arranged with each of the spacers & 4G5, and the component setting portion 412 disposed in the heat dissipating component manufacturing fixture 410 is erected. The base end faces of the gaps 16 are respectively below the base end faces of the fins 404, and the height difference between the base end faces of the spacers 405 and the base end faces of the fins 151 is not greater than the thickness of each spacer 405. . In other words, the heights of the respective pieces 4〇4 are respectively higher than the height of each spacer 405, and the range thereof is within the thickness range of the spacers 4〇5; the base end faces of the respective rotating pieces 404 are respectively protruded from the surface of the goods. And its range is within the thickness range of the spacer 405. 2036-5808B-PF 110 1270429 In the subsequent substrate arrangement step, as shown in Fig. 62B, the substrate 4 is placed on each of the fins 404 of the 70-piece setting portion 412. Then, as shown in FIGS. 62C and 62D, the base end portion 404a of each fin 404 (the portion protruding from each spacer 405) is bent and fixed by the action of the downward compressive stress toward the fin 404. The state of the L-shaped section. At this time, since the height of the base end portion 404a of the continuation 404 is within the thickness range of the spacer 405, the base end portions 404a of the bent fins 404 do not overlap each other, and are formed parallel to and against the substrate. Surface 0 of one surface (lower surface in the drawing) of 406 Next, as shown in Fig. 63A, the jig body 4 of the joining jig 4〇3 which is rotated at a high speed in the circumferential direction around the rotating shaft 403b The circumferential surface of 3 is pressed vertically to the other surface 406a of the substrate 406, and the bonding jig 403 is moved along the surface 406a of the substrate 406, and the base end portion 4A4a of each fin 404 is bonded to the substrate 4Q6. This is because the base end portion 404a of the fin 404 which is bent at right angles is formed into a surface of the surface of the substrate 406, and the contact between the substrate 406 and the fin 404 is increased as compared with the second embodiment. The area allows the two to be reliably joined. According to the present invention, even if the thickness of the fins 4〇4 is very thin, the heat dissipating member 450 in which the substrate 406 and the fins 404 are surely erected can be manufactured. Finally, as shown in Fig. 63β, the substrate 4 is folded. 6 moving upwards, only the fins 404 that have been bonded to the substrate 406 are moved upwards, and the spacers 405 are left in the manufacturing of the heat dissipating component to make the base end portion 4〇4 with bending. A heat dissipating member 450 bonded to a surface of the substrate 4〇6, 2036-5808Β-PF 111 1270429 is erected. An embodiment of a method of manufacturing a method of manufacturing a heat dissipating component. The second embodiment of the method is similar to the pre-formed fin constituent material 430. Next, the heat dissipating member of the present invention will be described. This embodiment is identical to the above-described metal member bonding, except that the cross-sectional recessed fin 404 is used.

而最初的元件配置步驟中,首先如第64a圖所示,將 紹合金製的薄板材㈣中央部與一間隔物4〇5直交配 置’使二者成為倒T字型’如第64B圖所示,在斷面凹字 型鰭片構成材製造治具440 #中央部的溝槽内,將板材431 彎折,並將其中央部壓入的同時插入間M 4()5,而如第 64C圖所示,於中央部的溝槽内形成將間隔物4〇5夾在中 間的斷面凹字型的韓片構成# 43G。韓片構成材係以 左右一對的鰭片404與連結上述左右—對的籍片4〇4的基 端部404a而形成其斷面凹字型。In the first component arrangement step, first, as shown in Fig. 64a, the central portion of the thin plate (4) made of the alloy is arranged orthogonally to a spacer 4〇5 to make the two become inverted T-shaped as shown in Fig. 64B. In the groove of the central portion of the cross-sectional concave fin constituent material manufacturing fixture 440 #, the plate member 431 is bent, and the center portion is pressed while being inserted into the space M 4 () 5, as in the first As shown in Fig. 64C, a cross-sectional concave type Korean composition #43G in which the spacer 4〇5 is sandwiched is formed in the groove in the center portion. The Korean component is formed by a pair of right and left fins 404 and a base end portion 404a that connects the left and right pairs of the pieces 4 to 4 to form a cross-sectional concave shape.

而準備複數個如上所述之在左右一對的鰭片4〇4之間 置入間隔&amp; 405㈣片構成材術,將上述各鰭片構成材 430與各間隔物405’交互並列,而如第64d圖所示,立設 配置於散熱元件製造用治具410的元件設定部412。此時 的鰭片構成材430係為在左右一對的鰭片4〇4之間置入有 間隔物405的狀態、且為基端部404a向上的狀態。又,置 入於各鰭片構成材430相互之間的各間隔物4〇5,的高度 係高於置入於左古一對的鳍片 較好為二者的高度差僅僅是基端部4〇4a的厚度,而使鰭片 2036-5808B-PF 112 1270429 構成材430的基端部404a與間隔物405’的基端部形成水 平的上表面。 之後,如第64E圖所示,於立設配置於元件設定部412 的各鰭片構成材430與各間隔物405,的上面搭載基板4〇6 並將其固定。此處將鰭片構成材43〇的基端部4〇“及間隔 物405形成與基板406的一表面(圖式中的下表面)接觸 的狀態時,即完成了元件配置步驟。 φ 而第64A〜64B圖所示的元件配置步驟並非一必要之限 制,只要各基板構成材430、各間隔物405、各間隔物·4〇5, 在最後配置於如第64Ε圖所示之既定位置時,並不限定其 順序。因此,例如將已預先形成斷面凹字型的鰭片構成材 430相互間隔排列;分別將各間隔物4〇5插入各鰭片構成 材430之左右一對的鰭片4〇4之間,同時並分別將各間隔 物405’插入各鰭片構成材43〇相互之間;最後配置基板 406之步驟亦可。或是將已預先形成斷面凹字型的鰭片構 •成材430相互間隔排列;接下來配置基板綱;而最後分 別將各間隔物405插入各鰭片構成材43〇之左右一對的鰭 片404之間,同時並分別將各間隔物4〇5’插入各鰭片構 成材4 3 0相互之間之步驟亦可。 接下來的接合步驟中,如第65Α圖所示,將以轉動軸 403b為中心以圓周方向高速轉動的接合治具4〇3的治具本 體403a的圓周面垂直壓至基板4〇6之另一表面之表面 406a’並使接合治具403沿著基板嗜之表面4〇6义 而使各鰭片構成材430的基端部4〇4a接合於基板4〇6。 2036-5808B-PF 113 1270429 此時,因為鰭片構成材430的基端部4〇4a形成沿著基 板406之一表面的面,與第一實施型態比較,係增加基板 406與鰭片404之接觸面積,可使兩者確實地接合。而藉 由本實施型態,即使鰭片404的厚度非常薄,可以製造出 基板406與各鰭片404已確實地立設接合的散熱元件45〇。 最後,如第65B圖所示,將基板406向上移動時,僅 有已接合於基板406的各鰭片構成材430 —起向上移動, φ而將各間隔物405、405,留在散熱元件製造用治具41〇的 元件設定部412,可以製造出具有鰭片構成材43〇的基端 部404立設接合於基板406之一表面的散熱元件45〇。 其他 而以上的實施型態中,係以使用接合治具4〇3之所謂 的摩擦震動接合為例來做說明,但是本發明並不受限於 此。例如,加熱及加壓的方法,並不限定於將轉動的接合 治具403壓入熔點較高的金屬元件之側,而將所產生的摩 籲擦熱與壓應力傳達至金屬元件間的2界面等接冑方式;亦 可以使用如電磁誘導,由熔點較高的金屬元件之側,對金 屬元件間的交界面加熱及加壓等非接觸方式。 以下係顯示實施例。 如第48A〜48C圖與第49A〜49C圖所示,實際地實行摩 擦震動接合,將銅製的板材(銅板)與鋁合金(A1 〇5〇)製的板 材(鋁板)重合,將高速轉動的接合治具的圓周面壓至銅板 的表面並移動。銅板的厚度為' 4mm ,、.寬奮為,随、長度為 100mm,鋁板的厚度為〇·5ιμι、寬度為7〇_、長度為1〇〇匪。 2036-5808B-PF 114 1270429 接合治具的直徑為120咖、寬度為24_'接合治具的轉動 數為2〇〇〇RPM(圓周速率約為15〇7m/min)、行進速率為 〇·75m/min 〇 實施例1 設定不同的接合治具的圓周面的平面部的寬度 wl(mm)、凹槽寬度w2(mm)、平面部的寬度/凹槽寬度之比 後’接合品質 ' 外觀、機械負荷的實驗結果如表五 戶斤示。 表五 平面部寬度 wl(mm) 凹槽寬度 w2(mm) wl/w2 實施例1 -1 1 1 1 實施例—1-2 2 1 2 實施例1-3 3 1 3 實施例1 -4 5 1 5 實施例1 -5 Γ 2 Γ 3 0. 67 實施例1 -6 3 3 1 實施例1-7 4 3 1.33 比較例1-1 7 1 7 _比較例1 -2 1 3 0.33 0.5 &lt;外觀〉◎:良好/△:切粉多/χ:毛邊多 〈接合品質&gt;◎:負荷小/〇··馬達的指定條件以下 △•馬達的指定條件以上 X ··因連續使用導致馬達停止 凹槽深度 (mm) 接合品質 外觀 機械負荷 ◎ △ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ △ ◎ -* ----- ◎ ◎ ◎ ◎ 〇 ◎ ◎ 〇 ◎ X X L3ZI X ◎ 由表五可知,δ W1 /W2過小時(比較例丨_2),因為銅 板的表面狀況會類似於受到接合治具的切削,接合治具所 產生摩擦熱的產生量就會較大、機械負荷變小,接合後殘 留於銅板的表面的凹陷量就會變得較大而外觀不佳,接合 。口負亦差,另一方面,當wl/w2過大時(比較例卜U,因 為έ類似於使用具表面平坦的.圓周面的接合治具^ 時的狀況,接合治具所產生摩擦熱的產生量就會較小,2 2036-5808Β-PF 115 1270429 合治具壓入銅板表面的壓入量就 佳’機械負荷亦會過大。 必須增加 而使外觀不And a plurality of spacers and 405 (four) sheets are placed between the pair of left and right fins 4〇4 as described above, and the fin members 430 are alternately arranged with the spacers 405', and As shown in Fig. 64d, the component setting unit 412 disposed on the jig 410 for heat radiation element manufacturing is erected. The fin constituent material 430 at this time is in a state in which the spacer 405 is placed between the pair of left and right fins 4〇4, and the base end portion 404a is in an upward state. Further, the spacers 4〇5 placed between the fin constituent members 430 are higher in height than the fins placed in the left ancient pair, and the height difference between the two is only the base end portion. The thickness of 4〇4a is such that the base end portion 404a of the constituent member 430 of the fin 2036-5808B-PF 112 1270429 forms a horizontal upper surface with the base end portion of the spacer 405'. Then, as shown in FIG. 64E, the substrate 4〇6 is mounted on the upper surface of each of the fin constituent members 430 and the spacers 405 which are disposed on the element setting unit 412, and is fixed. Here, when the base end portion 4 of the fin constituent member 43A and the spacer 405 are brought into contact with one surface of the substrate 406 (the lower surface in the drawing), the component arrangement step is completed. The component arrangement steps shown in Figs. 64A to 64B are not necessarily limited, as long as each of the substrate constituent members 430, the spacers 405, and the spacers 4〇5 are finally disposed at a predetermined position as shown in Fig. 64. Therefore, for example, the fin constituent members 430 having the cross-sectional concave shape formed in advance are arranged at intervals; and the spacers 4〇5 are respectively inserted into the pair of fins of the respective fin constituent members 430. Between the sheets 4〇4, each spacer 405' is inserted into each of the fin constituent members 43〇 at the same time; the step of arranging the substrate 406 may be performed at the same time, or the fin having the concave shape of the cross-section may be formed in advance. The sheet structure and the material 430 are arranged at intervals; next, the substrate is arranged; and finally, the spacers 405 are respectively inserted between the pair of fins 404 of the respective fin constituent members 43, and the spacers 4 are respectively disposed. 〇5' inserted into each fin structure 4 3 0 mutual In the subsequent joining step, as shown in Fig. 65, the circumferential surface of the jig body 403a of the joining jig 4〇3 which is rotated at a high speed in the circumferential direction around the rotating shaft 403b is vertically pressed to the substrate. The surface 406a' of the other surface of the crucible 6 is joined to the substrate 4〇6 by the bonding fixture 403 along the surface of the substrate, so that the base end portion 4〇4a of each fin constituent member 430 is bonded to the substrate 4〇6. -5808B-PF 113 1270429 At this time, since the base end portion 4〇4a of the fin constituent member 430 forms a face along one surface of the substrate 406, the substrate 406 and the fin 404 are added as compared with the first embodiment. With the contact area, the two can be surely joined. With this embodiment, even if the thickness of the fin 404 is very thin, the heat dissipating member 45A in which the substrate 406 and the fins 404 have been reliably erected can be manufactured. As shown in FIG. 65B, when the substrate 406 is moved upward, only the fin constituent members 430 bonded to the substrate 406 are moved upward, and φ is left for the heat dissipating members. The component setting unit 412 of the jig 41 can be manufactured to have a fin structure The base end portion 404 of the material 43 is erected to the heat dissipating member 45A bonded to one surface of the substrate 406. In the above embodiment, the so-called frictional vibration joint using the bonding jig 4〇3 is taken as an example. Although the invention is not limited thereto, for example, the method of heating and pressurizing is not limited to pressing the rotating joining jig 403 onto the side of the metal element having a higher melting point, and the resulting friction is generated. It is said that the rubbing heat and the compressive stress are transmitted to the interface of the metal element and the like, and the non-contact such as electromagnetic induction, the side of the metal element having a higher melting point, and the heating and pressurization of the interface between the metal elements can also be used. the way. The examples are shown below. As shown in Figs. 48A to 48C and Figs. 49A to 49C, the frictional vibration bonding is actually carried out, and the copper plate (copper plate) and the aluminum alloy (A1 〇5〇) plate (aluminum plate) are superposed and rotated at a high speed. The circumferential surface of the joining jig is pressed against the surface of the copper plate and moved. The thickness of the copper plate is '4mm, .. wide and the length is 100mm, the thickness of the aluminum plate is 〇·5ιμι, the width is 7〇_, and the length is 1〇〇匪. 2036-5808B-PF 114 1270429 The jig has a diameter of 120 coffee and a width of 24_'. The number of rotations of the jig is 2〇〇〇RPM (circum rate is about 15〇7m/min), and the travel rate is 〇·75m. /min 〇Example 1 Set the width w1 (mm) of the flat portion of the circumferential surface of the joint jig, the groove width w2 (mm), the width of the flat portion / the groove width ratio, and the 'joint quality' appearance, The experimental results of the mechanical load are shown in Table 5. Table 5 Plane width wl (mm) Groove width w2 (mm) wl / w2 Embodiment 1 - 1 1 1 1 Example - 1-2 2 1 2 Example 1-3 3 1 3 Example 1 - 4 5 1 5 Example 1 -5 Γ 2 Γ 3 0. 67 Example 1 -6 3 3 1 Example 1-7 4 3 1.33 Comparative Example 1-1 7 1 7 _Comparative Example 1 -2 1 3 0.33 0.5 &lt; Appearance: ◎: Good / △: Multi-cutting powder / χ: More burrs <joint quality> ◎: Small load / 〇 · · Motor specified conditions below △ • Motor specified conditions or more X · · Motor stop due to continuous use Groove depth (mm) Bonding quality Appearance mechanical load ◎ △ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ - * ----- ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ XX L3ZI X ◎ From Table 5, δ W1 /W2 is too small (Comparative Example 丨_2), because the surface condition of the copper plate is similar to that of the joint fixture, the friction heat generated by the joint fixture is large, the mechanical load is small, and after the joint The amount of depression remaining on the surface of the copper plate becomes large and the appearance is poor, and the joint is made. The mouth is also poor. On the other hand, when wl/w2 is too large (comparative example U, because έ is similar to the case of using a joint jig with a flat surface. The amount of production will be small, 2 2036-5808 Β-PF 115 1270429 The pressing force of the press-fitted copper plate surface is good, the mechanical load will be too large. It must be increased to make the appearance not

凹槽相對於轉動方向 外觀、機械負荷的 2 - 2的條件中,將接The groove is opposite to the direction of rotation, and the condition of the mechanical load is 2 - 2

凹槽深度 (mm) 凹槽數量 ——~~.___ 接合品質 丁_ 外觀 機械負荷 8 LIP~ —--- ◎ —3 1 ~@~ ◎ 2 ◎ ◎ △ ◎ 1 X X cum ^xj isHGroove depth (mm) Number of grooves ——~~.___ Joint quality D_ _ Appearance Mechanical load 8 LIP~ —--- ◎ —3 1 ~@~ ◎ 2 ◎ ◎ △ ◎ 1 X X cum ^xj isH

b、且 1 Q 時(實施例卜卜卜7),很明:、且uw&quot;心5.0。 入銅板表面的麼入量,接人::不但.可以抑制接合治具塵 亦會較大、機械負荷就會較小 里就 實施例2 而此夠订有效率的接合。 設定不同的接合治具的圓周面的 的傾斜角度、凹槽數量後,接合品質 實驗結果如表六所示。而僅在比較例 合治具的寬度設定為l〇mm。 表六 凹槽傾斜角 —θ(。) 實施例互^ 實施例 實施例2-3 j Γ 2 比較例2-1 3 、认ϋ 只,μ .艮野/入•不良 〈吵,〉◎ ··良好/△ ··切粉多/χ ··毛邊多 〈接a品質&gt;® ·:負荷小/〇·_馬達的指定條件以下 △.馬達的指定條件以上 X ··因連續使用導致馬達停止 由表六可知,當凹槽的傾斜角度小於0 5。時(比較例 2 — 2),機械負荷小,凹槽内部所蓄積的可塑化的金屬就無 法沿著接合治具的寬度方向依序送出,接合治具通過後就 會在銅板表面殘留毛邊(bUrr),而使外觀不良,·另一方面, 當凹槽的傾斜角度大於^ 0。時(比較例 排出1就會變大而使外觀不良,亦使殘留於金屬元件表面 2036-5808B-PF 116 1270429 的凹痕變大,並加大機械負荷。 I G· 5〜2· 〇°時(實施例 述的弊害,可以得到良好 而在凹槽的傾斜角度 2 -1〜2 - 3 ),很明顯地就不會有上 的接合。 而考慮到接合治具的寬度技入 見度接合治具的整個圓周面 中,係至少形成有二條的凹槽。在卜 丨日 隹比孕父例2-2中,凹槽的 數量為0,係顯示沒有向接合治具的隸 π锝勁方向傾斜的凹槽。 實施例3 設定不同的接合治具的圓周面的凹槽的深度後,接合 品質、外觀、機械負荷的實驗結果如表七所示。 表七 眚祐你I VI ~凹槽深度 (mm) Π ^ _ 平面部寬度 wl(mm) w2(mm) 0(° ) (mm) [¥¥ 品質 外觀 「機械 貝 ϋ JL 實施例3-2 U. 0 0.4 Ml·«月 ◎ Δ Μ ΛΌ\ ◎ 實施例3-3 0.8 〇 0.1 〜0.2 ◎ ◎ ◎ 實施例3_4 1.2 2 1 0.5 ◎ ◎ 〇 比較例3-1 0.2 ◎ Δ 比較例3_2 2 ◎ X X 比較例3-3 0. 3-0. 5 〈接合品質&gt;◎ &amp;良好/χ 「不良 -------- ----~-—,_« X X ◎ 〈外觀〉◎:良好/△ ··切粉多/χ ··毛邊多 〈接合品質&gt;◎:負荷小/〇:馬達的指定條件以下 △:馬達的指定條件以上 X:因連續使用導致馬達停止 由表七可知,當凹槽的深度小於〇3〇mm時(比較例 3-1 ),可塑化的金屬會蓄積於凹槽内部,使接合治具所產 生的摩擦熱的發生量減少,而無法行充分的接合;另一方 面,當凹槽的深度大於1.2mm時(比較例3 —2),因為銅板 表面狀況會類似於受到接合洽具 摩擦熱的產生量就會較大且機械負荷就較小,接合治具的 2036-5808B-PF 117 1270429 壓入量就變得較大,苴結果枱 、、果係為外觀不良。更者,完全沒 有凹槽時(比較例3-3),因糸拉人/ 口為接合治具所產生摩擦熱的產 生量較小,而必須加大接合 σ,、在銅板表面的塵入量,而 使外觀不佳,機械負荷亦過大。 而凹槽的深度為〇, 30〜〗/ 1 · 2mm a守,很明顯地就不會有上 述的弊害,可以得到良好的接合。 接下來,說明本發明箆石敌^ — 十知π乐五群組的實施型態。 金屬元件接合方法b, and 1 Q (Embodiment Bub 7), very clear:, and uw &quot; heart 5.0. The amount of the intrusion into the surface of the copper plate is: not only. It can suppress the dust of the joint fixture and the mechanical load will be smaller. In the second embodiment, the joint is efficient. After setting the inclination angles and the number of grooves of the circumferential surfaces of the different jigs, the joint quality test results are shown in Table 6. Only the width of the comparative fixture is set to l〇mm. Table 6 Groove Tilt Angle - θ (.) Example Inter-Examples Example 2-3 j Γ 2 Comparative Example 2-1 3, ϋ ϋ only, μ. 艮野/入•不〈 <Noisy, 〉◎・Good/△ ··Cleaning powder/χ················································································ The stop is shown in Table 6, when the inclination angle of the groove is less than 0 5 . At the time (Comparative Example 2-2), the mechanical load is small, and the plasticized metal accumulated inside the groove cannot be sequentially sent out along the width direction of the joining jig, and the burr remains on the surface of the copper plate after the jig is passed ( bUrr), which makes the appearance poor, on the other hand, when the inclination angle of the groove is larger than ^0. At the time of the comparative example, the discharge 1 becomes large and the appearance is poor, and the dents remaining on the surface of the metal member 2036-5808B-PF 116 1270429 are increased, and the mechanical load is increased. IG· 5~2· 〇° (The disadvantages of the embodiment can be obtained well at an inclination angle of 2 -1 to 2 - 3 in the groove), and it is obvious that there is no upper joint. Considering the width of the joint jig, the joint engagement is considered. In the entire circumferential surface of the jig, at least two grooves are formed. In the case of the dice, the number of the grooves is 0, which indicates that there is no π 锝 向 接合The groove is inclined in the direction. Embodiment 3 After setting the depth of the groove of the circumferential surface of the different jig, the experimental results of the joint quality, appearance, and mechanical load are shown in Table 7. Table 7 眚 You I VI ~ concave Groove depth (mm) Π ^ _ Plane width wl (mm) w2 (mm) 0 (°) (mm) [¥¥ Quality appearance "Mechanical shellfish JL Example 3-2 U. 0 0.4 Ml·«月◎ Δ Μ ΛΌ ◎ Example 3-3 0.8 〇 0.1 ~ 0.2 ◎ ◎ ◎ Example 3_4 1.2 2 1 0.5 ◎ ◎ 〇 Comparative Example 3-1 0.2 ◎ Δ Comparative Example 3_2 2 ◎ XX Comparative Example 3-3 0. 3-0. 5 <joint quality> ◎ &amp; good / χ "bad -------- ----~--, _ « XX ◎ 〈 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观 外观The use of the motor to stop is shown in Table 7. When the depth of the groove is less than 〇3〇mm (Comparative Example 3-1), the plasticized metal accumulates inside the groove, causing the friction heat generated by the joint fixture to occur. The amount is reduced, and the joint is not sufficient; on the other hand, when the depth of the groove is larger than 1.2 mm (Comparative Example 2-3), the surface condition of the copper plate will be similar to the amount of friction heat generated by the joint. Large and mechanical load is small, the 2036-5808B-PF 117 1270429 of the jig has become larger, and the result is poor, and the result is poor. 3-3), because the amount of frictional heat generated by the puller/mouth is small, the joint σ must be increased, The amount of dust on the surface of the copper plate makes the appearance poor, and the mechanical load is too large. The depth of the groove is 〇, 30~〗 1 / 2 mm a, obviously there will be no such defects, you can get Good bonding. Next, an implementation form of the meteorite enemy group of the present invention will be described. Metal component bonding method

首先說明本發明金屬元件接合方法的第一實施型態。 此處係以作為第一金屬元件的銘元件與作為第二金屬元件 的銅元件之接合為例來作說明。 〃此處舉出作為第一金屬元件的一例的紹元件、與作為 第二金屬元件的一例的銅元件,首先說明本發明金屬元件 接:方法的第一實施型態。第68A,C圖係顯示第一實施 i…、之金屬元件接合方法之摩擦接合的順序,其中第6 8 a、 68B圖為正面剖面圖,第68c圖為第68β圖之側視圖。第 69A〜69C圖為一系列之剖面圖,係顯示第68a~68c圖之鋁 7L件與銅元件之重合部之塑性變形的過程。第圖係顯示 第68B與68C圖之接合治具之部分放大圖。 在此金屬元件接合方法中,首先如第68A圖所示,將 I呂元件501與銅元件502以面接觸的方式相互重合配置, 以未繪示於圖面的治具固定。 接下來,如第68B 18C厨所示,將以轉動轴 中心、以圓周方向以圓周速度R高速轉動的接合治具5〇3 2036-5808B-PF 118 1270429 /、本體5〇3a的圓周面垂直壓至銅元件5〇2的表 5〇2心並將接合治具503沿著銅元件502的表面5G2aj^ 移動’而使銘元件501與銅元件5Q2重合並接合: 接“具503係在轉動軸5〇3b的前端部將圓板狀的治具本 體5〇3a固疋’而治具本體5G3a係&amp; : SKD61等工具鋼 所構成。相對於壓入銅元件5G2的表φ 5仏時的行進方 向’治具本體503a係以送至後方的方向,沿著轉動輛5First, a first embodiment of the metal element bonding method of the present invention will be described. Here, the joining of the inscription element as the first metal element and the copper element as the second metal element will be described as an example. Here, as an example of the first metal element and a copper element as an example of the second metal element, the first embodiment of the metal element connection method of the present invention will be described first. 68A, C is a view showing the order of frictional engagement of the metal element joining method of the first embodiment, wherein the sixth through the 68th is a front cross-sectional view and the 68th is a side view of the 68th. The 69A to 69C drawings are a series of sectional views showing the process of plastic deformation of the overlapping portion of the aluminum 7L member and the copper member in Figs. 68a to 68c. The figure is a partial enlarged view showing the jig of the 68B and 68C drawings. In the metal element bonding method, first, as shown in Fig. 68A, the Ilu element 501 and the copper element 502 are placed in surface contact with each other, and are fixed by a jig not shown in the drawing. Next, as shown in the kitchen of the 68B 18C, the joint jig 5〇3 2036-5808B-PF 118 1270429 /, which is rotated at a high speed in the circumferential direction at the circumferential speed R, is perpendicular to the circumferential surface of the body 5〇3a. Pressing the surface of the copper element 5〇2 to the core of the copper element 5〇2 and moving the bonding fixture 503 along the surface 5G2aj of the copper element 502 to re-engage the bonding element 501 and the copper element 5Q2: The front end portion of the shaft 5〇3b is formed by fixing the disc-shaped jig body 5〇3a and the jig body 5G3a system &amp; : SKD 61 and the like, and the table φ 5 压 with respect to the press-in copper member 5G2 The direction of travel 'the fixture body 503a is sent to the rear direction along the rotating vehicle 5

的周邊轉動。 如第69A圖所示,治具本體5〇3a的圓周面係以一定量 α(Π1)壓入銅元件502的表面502a的狀態下以圓周方向高 速轉動,並沿著銅元件502的表面5〇2a移動。而藉著上述 治具本體503a在銅元件502的表面502a之壓入,使鋁元 件501與銅元件5〇2之重合部的縫隙消失;並藉著高速轉 動的治具本體5〇3a與銅元件502的接觸所產生的震動,將 鋁π件501與銅元件5〇2之重合面的氧化物皮膜分裂破 壞;並如第69B圖所示,與治具本體503a接觸的銅元件 502的既定區域與其鄰近區域、還有與上述區域鄰接的鋁 元件501的既定區域,因治具本體5〇3a與銅元件502的摩 擦接觸所產生的熱量而高溫化,呈現可塑化(流動化)的固 相狀態。上述的結果,使得銅元件502與鋁元件501在相 互的交界面上流動擴散,並由當初的表面開始塑性變形。 而在接合治具503之治具本體503a通過之後即冷卻,如第 69C圖所示’铭元件5 () 1與瓣元件5松相’互接合〃而4 接合體:[〇 2036-5808B-PF 119 1270429 上述接合體J的銅元件502的表面502a上,如第69c 图所示具本體503a使表面502a負荷壓應力的同時並The circumference of the rotation. As shown in Fig. 69A, the circumferential surface of the jig body 5〇3a is rotated at a high speed in the circumferential direction with a certain amount α(Π1) pressed into the surface 502a of the copper member 502, and along the surface 5 of the copper member 502. 〇 2a moves. By the pressing of the jig body 503a on the surface 502a of the copper member 502, the gap between the overlapping portion of the aluminum member 501 and the copper member 5〇2 disappears; and the jig body 5〇3a and copper are rotated by high speed. The vibration generated by the contact of the element 502 splits and breaks the oxide film of the overlapping surface of the aluminum π piece 501 and the copper element 5〇2; and as shown in Fig. 69B, the predetermined condition of the copper element 502 in contact with the jig body 503a The region and its adjacent region, and the predetermined region of the aluminum member 501 adjacent to the region, are heated by the heat generated by the frictional contact between the jig body 5〇3a and the copper member 502, and exhibit a plasticized (fluidized) solid. Phase state. As a result of the above, the copper member 502 and the aluminum member 501 flow and diffuse at the mutual interface, and plastic deformation starts from the original surface. After the jig body 503a of the jig 503 is passed, it is cooled. As shown in Fig. 69C, the 'Ming element 5 () 1 and the valve element 5 are loosely engaged with each other and the 4 joint body: [〇2036-5808B- PF 119 1270429 on the surface 502a of the copper member 502 of the joint body J, as shown in Fig. 69c, the body 503a is used to load the surface 502a under compressive stress and

又,在此接合體j中,鋁元件5〇1與銅元件5〇2的重合面 中,已塑性變形的鋁元件5〇1及銅元件5〇2成波浪形起伏 而相互咬合,而固化成斷面凹凸型的接合面S。上述的接 合體J中,藉由此接合面s而將銅元件502與鋁元件5〇1 • 確實地接合。而藉由接合治具503的壓應力而在銅元件5〇2 的表面502a所形成的段部5〇2b,較好為在鋁元件5〇ι及 銅元件502接合之後,將銅元件5〇2的表面5〇2&amp;切削掉一 定厚度,而將其平滑化。 此處,考慮到接合治具5〇3由鋁元件5〇1之側壓入時, 鋁元件501的熔點低於銅元件5〇2的熔點,鋁元件5〇1與 銅元件5 0 2的重合面達到接合所必要的 C )以上時,鋁元件5〇1的抗形變強度京 來自接合治具5 0 3的壓力益法右公认推 溫度(共晶溫度5 4 8Further, in the joint body j, among the overlapping faces of the aluminum member 5〇1 and the copper member 5〇2, the plastically deformed aluminum member 5〇1 and the copper member 5〇2 are undulated and occluded to each other, and solidified. A joint surface S having a concave-convex shape. In the above-described joint J, the copper member 502 and the aluminum member 5〇1 are surely joined by the joint surface s. The segment 5 〇 2b formed on the surface 502 a of the copper member 5 〇 2 by the compressive stress of the bonding tool 503 is preferably the copper member 5 after the bonding between the aluminum member 5 〇 and the copper member 502. The surface 5〇2&amp; of 2 cuts off a certain thickness and smoothes it. Here, considering that the bonding jig 5〇3 is pressed in from the side of the aluminum member 5〇1, the melting point of the aluminum member 501 is lower than the melting point of the copper member 5〇2, and the aluminum member 5〇1 and the copper member 5 0 2 When the coincident surface is more than C) necessary for bonding, the deformation strength of the aluminum component 5〇1 is derived from the pressure of the bonding fixture 503. The right-handed push temperature (eutectic temperature 5 4 8)

2036-5808B-PF 120 1270429 強度的接合。 本實施型態的金屬元件接合方法中所使用的接合治具 5 03 ’如第70圖所不,治具本體5〇3a的圓周面上,係形成 有約略沿著轉動方向的凹槽503c。藉由使用此接合治具之 金屬元件接合方法’係增大了接合治4 5〇3的圓周面與銅 元件502的表面5023的接觸面積’可以有效率地產生摩擦 熱,並可以有效率地接合銅元件5〇2與鋁元件。2036-5808B-PF 120 1270429 Bonding of strength. The joint jig 5 03 ' used in the metal element joining method of the present embodiment is not shown in Fig. 70. The circumferential surface of the jig body 5〇3a is formed with a groove 503c approximately in the rotational direction. By using the metal member bonding method of the bonding jig, the contact area of the circumferential surface of the bonding process and the surface 5023 of the copper member 502 is increased, the frictional heat can be efficiently generated, and the heat can be efficiently and efficiently The copper element 5〇2 is bonded to the aluminum element.

又接合治具503中,凹槽503c係相對於轉動方向輕微 傾斜、且連續的凹槽,即是在接合治具5()3的轉動轴5_ 的周邊’沿著接合治具5G3的圓周面描緣出螺旋狀軌跡而 形成。藉由使用此接合治具之金屬元件接合方法,伴隨著 接合治具503的轉動與移動,凹槽5〇3。内部所蓄積的可塑 化的金屬會沿著接合治具5〇3的寬度方向依序送出,因此 可以將接合後銅元件5〇2的表面5G2a殘留的凹入量(段部 402b的高度)抑制到最小限度。 在此處,接合治具503的治具本體5〇3a的圓周面之凹 槽503c中,凹槽503c之間的平面部_的寬度 及凹槽503c的寬度W2(_)’係較好設定為符合以下條件: 1SW1S5、且 1$W2$3、且 〇.67swl/w2g5 〇〇。將平面 部503d及凹槽503c如此設定時,不但可以抑制接合治具 5〇3的治具本體503a壓入銅元件5〇2的表面5〇2a的壓入 1,接合治具503的治具本體503a所產生摩擦熱的產生量 就亦會較大,而能夠”行有政率的捿合;。 的圓周面的凹槽 又接合治具503,其治具本體503a 2036-5808B-PF 121 1270429 ⑽c’係形成為傾斜料具本體5G3a的轉動方向,傾斜角 Θ係#乂好K為0 5〜2 ()。。又接合^具⑽中,户且本體 咖a的整個圓周面的寬度方向中,較好為至少形成口有二條 凹槽咖。將凹槽503c的傾斜角θ及數量如此設定時, 伴隨著接合治具503的治具本體5〇3a的轉動與移動,凹槽 敝内部所蓄積的可塑化的金屬會相當連續地沿著治呈本 體5心的寬度方向依序送出’治具本體5〇3a通過後就幾 手不會有毛邊(b町)與凹痕殘留在銅元件5〇2的表面,亦 減低了機械負荷。 更者,接合治具503之治具本體503a的圓周面的凹槽 5〇3c的深度d係設定為〇. 3〇]· 2_。將凹槽5〇3c的深度 d如此設定時,可塑化的銅元件5Q2就不會蓄積心槽⑽ 的内部,接合後殘留於銅元件5。2的表面5〇2a的凹陷量就 會變得較小,就可以施行有效率的接合。 以上述的方法將紹元件5〇1舆銅元件5〇2重合而摩捧 震動接合時,較好為由下式⑴求出接合時接合治具503(治 具本體503a)轉動的圓周速率) ·· 250 $ RS ...................(A) 接口時接合/口具5 03的圓周速率小於25〇m/min時,接 合治具5 0 3與銅元件5 D ^ , 之摩擦接觸所產生的熱量就過 小’而使銅元件502與銘元件5〇1的重合部的溫度過低, 而V致接口不良。另-方面’接合時接合治具5〇3的圓周 速率大於2_m/min時’接合治f卿 擦接觸所產生的熱量就會大過所必要的,不僅僅是使接合 2036-5808B-PF 122 1270429 治具5 0 3的驅動能I0丄 功此里抽失會變大,並使與接合治具5〇3接 觸的銅元件502的溫度會局部過高,導致該部分發生塑性 k形’而使接合治具5〇3的壓應力無法充分地傳達至重合 部導致在兩元件間有可能會產生縫隙。因此,可以瞭解接 合時接合治具503以25〇~2〇〇〇m/min的圓周速率轉動時, 接合治具503與鋼元件5Q2之摩擦接觸所產生的熱量為恰 好適當’而能夠行良好的接合。 φ 又’將銘元件501與銅元件502重合而摩擦震動接合 時,接合時,接合治具503(治具本體5〇3a)在銅元件5〇2 的表面502a的壓入量α (m)較好為由下式(B)求出: 〇. 〇3xt^ a ^ 〇. 3xt...............(B) 其中t為重合部中的銅元件的厚度(m)。 接合時接合治具503在銅元件502的表面502a的壓入 里α小於0· 〇3t時,銅元件502與鋁元件501的重合部中 會殘留縫隙而導致接合不良。另一方面,壓入量α大於 I 〇· 3t時,雖然銅元件5〇2與鋁元件5〇1的重合部中不會殘 留縫隙’而過大的接合治具503的壓入量會在銅元件502 的表面殘留顯著的凹痕,導致元件的損失。因此,接合時 接合治具503在銅元件502的表面502a的壓入量α在 〇.〇3t以上、0 3t以下時,接合治具5〇3的壓應力為正好 適當的值,可以瞭解就可以在銅元件5〇2與鋁元件501的 重合部不產生縫隙的情況下完成接合,亦可以縮小銅元件 502的表面5〇2a的凹痕。 更者,將鋁元件501與銅元件502重合而摩擦震動接 2036-5808B-PF 123 1270429 一守接δ時,接合治具5 0 3 (治具本體5 0 3 a )沿著銅元件 502的表面移動的行進速率較好為由下式(◦求 出: CC) 〇. 1 ^ R/(5. Oxl 〇7xt2) 其中R為接合時接合治具的圓周速率(m/min.); t為重合部中的銅元件的厚度。In the joint jig 503, the groove 503c is a slightly inclined and continuous groove with respect to the rotational direction, that is, at the periphery of the rotational axis 5_ of the jig 5 () 3 along the circumferential surface of the jig 5G3. The contour is formed by a spiral trajectory. By the use of the metal member joining method of the joining jig, the groove 5〇3 is accompanied by the rotation and movement of the joining jig 503. The plasticized metal accumulated in the inside is sequentially sent in the width direction of the bonding jig 5〇3, so that the amount of recessed (the height of the segment portion 402b) remaining on the surface 5G2a of the joined copper member 5〇2 can be suppressed. To a minimum. Here, in the groove 503c of the circumferential surface of the jig body 5〇3a of the jig 503, the width of the plane portion _ between the grooves 503c and the width W2(_)' of the groove 503c are preferably set. To meet the following conditions: 1SW1S5, and 1$W2$3, and 〇.67swl/w2g5 〇〇. When the flat portion 503d and the recess 503c are set in this manner, it is possible to suppress the pressing of the jig main body 503a of the joining jig 5〇3 into the surface 5〇2a of the copper member 5〇2, and the jig of the jig 503. The amount of frictional heat generated by the body 503a is also large, and the groove of the circumferential surface can be joined to the jig 503, and the jig body 503a 2036-5808B-PF 121 1270429 (10) c' is formed in the direction of rotation of the inclined material body 5G3a, and the inclination angle Θ#乂好 K is 0 5~2 (). The width of the entire circumferential surface of the household coffee bean a is also joined in the tool (10). In the direction, it is preferable that at least two grooves are formed in the mouth. When the inclination angle θ and the number of the grooves 503c are set as described above, the rotation and movement of the jig body 5〇3a of the joint jig 503 are accompanied by the groove 敝The plasticized metal accumulated in the interior is sent in a continuous manner along the width direction of the center of the body 5 of the treatment body. 'The fixture body 5〇3a passes, and then there are no burrs (b town) and dents remain in the hands. The surface of the copper member 5〇2 also reduces the mechanical load. Moreover, the fixture body 5 of the bonding fixture 503 The depth d of the groove 5〇3c of the circumferential surface of 03a is set to 〇. 3〇]· 2_. When the depth d of the groove 5〇3c is set as such, the plasticized copper component 5Q2 does not accumulate the core groove (10) The inside of the copper element 5. After the bonding, the amount of depression of the surface 5〇2a of the copper member 5 becomes smaller, and efficient bonding can be performed. In the above method, the element 5〇1舆 copper element 5〇 When the two are joined together and the vibration is engaged, it is preferable to determine the circumferential speed at which the joining jig 503 (the jig body 503a) is rotated by the following formula (1). ·· 250 $ RS .......... .........(A) When the circumferential speed of the joint/portion 5 03 at the interface is less than 25〇m/min, the frictional contact between the joint fixture 503 and the copper element 5 D ^ The heat is too small, and the temperature of the overlapping portion of the copper member 502 and the inscription element 5〇1 is too low, and the V-to-interface is poor. In the other aspect, 'the circumferential speed of the joining jig 5〇3 when joining is greater than 2 mm/min' The heat generated by the joint treatment will be greater than necessary, not only to make the drive energy of the joint 2036-5808B-PF 122 1270429 fixture 503, and the loss will become larger. Make The temperature of the copper member 502 which is in contact with the jig 5〇3 is locally too high, causing the portion to be plastically k-shaped, and the compressive stress of the bonding jig 5〇3 is not sufficiently transmitted to the overlapping portion, resulting in a gap between the two members. There may be a gap. Therefore, it can be understood that when the joining jig 503 is rotated at a peripheral speed of 25 〇 to 2 〇〇〇 m/min, the heat generated by the frictional contact between the joining jig 503 and the steel member 5Q2 is just right. 'And can do a good joint. φ and 'when the element 501 and the copper element 502 are overlapped with each other and frictionally vibrated, the pressing amount α (m) of the bonding jig 503 (the jig main body 5〇3a) on the surface 502a of the copper element 5〇2 is engaged at the time of joining. Preferably, it is obtained by the following formula (B): 〇. 〇3xt^ a ^ 〇. 3xt...............(B) where t is the copper component in the overlap Thickness (m). When the joining jig 503 is less than 0· 〇 3t in the press-fitting of the surface 502a of the copper member 502, a gap remains in the overlapping portion of the copper member 502 and the aluminum member 501, resulting in poor bonding. On the other hand, when the press-in amount α is larger than I 〇·3t, the gap between the copper element 5〇2 and the aluminum element 5〇1 does not remain in the overlapping portion, and the excessively large bonding jig 503 is pressed in the copper. Significant dents remain on the surface of element 502, resulting in loss of components. Therefore, when the pressing amount α of the joining jig 503 at the surface 502a of the copper member 502 is 〇.〇3t or more and 0 3t or less, the compressive stress of the joining jig 5〇3 is just an appropriate value, and it can be understood The bonding can be completed without a gap between the overlapping portions of the copper member 5〇2 and the aluminum member 501, and the indentation of the surface 5〇2a of the copper member 502 can be reduced. Moreover, the aluminum component 501 and the copper component 502 are overlapped and the frictional vibration is connected to 2036-5808B-PF 123 1270429. When the δ is adhered, the bonding fixture 5 0 3 (the fixture body 5 0 3 a ) is along the copper component 502. The traveling speed of the surface movement is preferably as follows (◦: CC) 〇. 1 ^ R/(5. Oxl 〇7xt2) where R is the circumferential velocity (m/min.) of the jig when joining; t It is the thickness of the copper component in the overlap.

/、中接合時接合治具503的圓周速率變大時,因接 合治具503與銅元件502的摩擦接觸所產生的熱量亦會變 大’而使接合治具5G3的行進速率¥較高日夺,重合部仍能 保持一定的溫度;而銅元件5〇2的厚度變大時,重合部要 達到一定的溫度以上就比較費時,若此時接合治具的 2進速率過大時,在重合部的溫度達到一定溫度以上之 别’接合治具503就已通過’就會導致接合不良的問題。 而實行良好㈣擦震動接合時,接合治具5()3的行進速率 圓周速率R、銅兀件的厚度t必須要相互調節。而實驗 ^果係確認了滿^ U R/(5.⑽…,)時,能夠有良好的接 另方面,由虽接合治具503的行進速率v過小時, 會有降低接合效率的觀點,實驗結果係確認了滿^ ⑷ 時’可以得到較好的接合效率。 ▲接下來說明本發明金屬元件接合方法的第二實施型 態。第71A〜71C圖係顯示第二實施型態之金屬元件接合方 法所使用的接合治具,其中帛71A圖為斜視圖,第71B、 爪為第二實施型態之金屬元件接合來法嘴使用的^ 子的底面視圖。第72Α~7_為一系列之斜視圖,係顯示 2036-5808B-PF 124 1270429 第二實施型態之金屬元件接合方法所使用的接合治具之其 他例子。f 73A〜73B圖為-系列之剖面圖,係顯示第二實 施型態之金屬元件接合方法之摩擦接合的步驟。 此金屬7G件接合方法’首先與第一實施型態之金屬元 件接口方法相同,將!呂70件501與板狀的銅元件5〇2以面 接觸的方式相互重合配置(請參考第m圖)。而在此金屬 元:接合方法中,係使用以下的接合治具來取代第一實施/ When the circumferential rate of the joining jig 503 is increased, the heat generated by the frictional contact between the jig 503 and the copper member 502 is also increased, and the traveling speed of the jig 5G3 is increased. If the thickness of the copper component 5〇2 becomes larger, it is more time-consuming to reach a certain temperature above the overlapped portion. If the 2-inlet rate of the bonding fixture is too large, it is coincident. If the temperature of the part reaches a certain temperature or higher, the 'joining jig 503 has passed' will cause a problem of poor bonding. When a good (four) rubbing engagement is performed, the traveling rate of the joining jig 5 () 3, the circumferential rate R, and the thickness t of the copper piece must be adjusted to each other. On the other hand, when the experiment is completed, it is possible to have a good connection. When the traveling rate v of the bonding jig 503 is too small, the bonding efficiency is lowered. As a result, it was confirmed that a good bonding efficiency was obtained when the full ^ (4) was obtained. ▲ Next, a second embodiment of the metal element bonding method of the present invention will be described. 71A to 71C are diagrams showing a joint jig used in the metal element joining method of the second embodiment, wherein the 帛71A is a perspective view, and the 71B, the claw is a second embodiment of the metal element joined to the nozzle. The bottom view of the ^. The 72nd to 7th is a series of oblique views showing other examples of the bonding jig used in the metal element bonding method of the second embodiment. 2036-5808B-PF 124 1270429. f 73A to 73B are sectional views of the series, showing the step of frictional engagement of the metal element joining method of the second embodiment. This metal 7G piece joining method is first the same as the metal element interface method of the first embodiment, and will be! The 70 pieces of 501 and the plate-shaped copper elements 5〇2 are placed in surface contact with each other (refer to the mth figure). In this metal element: bonding method, the following bonding fixture is used instead of the first implementation.

型態之金屬元件接合方法中所使用的接合治具5〇3(請參考 第 68B 、 68C 圖)。 如第71A圖所示,本金屬元件接合方法中所使用的接 合治具504係具有圓板狀的治具本體5〇4a、與轉動軸 5〇4b,轉動軸504b係固定於治具本體5〇4&amp;的上表面⑽。 而在治具本體504a的下表面DS係形成有複數個突起b。 匕犬之b係可以由固著於該下表面的類鑽碳 (diamond-1 ike carb〇n ; dlc)等研磨粒子所構成。 又,此接合治具504的治具本體504a,亦可以具有取 代上述突起b的細溝。此細溝G,可以是如第7ΐβ圖所示 之由下表面DS上的轉動中心人又以放射狀延伸者;亦可以 是如第71C圖所示之在下表面DS上以格子狀延伸者。The bonding jig 5〇3 used in the bonding method of the metal element of the type (refer to Figs. 68B and 68C). As shown in Fig. 71A, the joint jig 504 used in the present metal element joining method has a disc-shaped jig body 5〇4a and a rotating shaft 5〇4b, and the rotating shaft 504b is fixed to the jig body 5上4&amp; upper surface (10). On the lower surface DS of the jig body 504a, a plurality of protrusions b are formed. The b-type of the Mastiff can be composed of abrasive particles such as diamond-1 ike carb〇n; dlc fixed to the lower surface. Further, the jig body 504a of the joint jig 504 may have a narrow groove in which the protrusion b is replaced. The fine groove G may be radially extended by a center of rotation on the lower surface DS as shown in Fig. 7A; or may be extended in a lattice shape on the lower surface DS as shown in Fig. 71C.

又,此細溝G亦可以是彎曲的,例如可以是如第72A 圖所示之在下表面形成為渦卷形(scroll)者、亦可以是如 第72B圖所示之以同心圓狀配置之複數個直徑相異的環狀 細溝G 〇 又’雖然未繪示於圖面,此接合治具5〇4的治具本體 2036-5808B-PF 125 1270429 亦可以在下表面Ds具有取代上述突起匕的彎曲凸條 (μ⑴此凸條可以是在下表面DS(請參考第71A圖)形成 為渦卷:(SCro⑴者、亦可以是形成為同心圓狀者。 此第二實施型態之金屬元件接合方法中,如第73A與 73B圖所示’將以轉動軸5〇4b為中心而高速轉動的接合治 _ 504之々具本體5〇4a的下表面的壓至銅元件的表 2a並將接合治具503沿著銅元件的表面502a •以前述的行進速率V移動,而使鋁元件501與銅元件502 重合並接合。 ^此時的治具本體504a,如第73A圖所示,此下表面Ds 係僅以一定量α (m)壓入銅元件5〇2的表面5〇2&amp;的狀態下 鬲速轉動,並沿著銅元件5〇2的表面5〇2a移動。而藉著上 述治具本體504a在銅元件502的表面502a之壓入,使鋁 疋件501與銅元件5〇2之重合部的缝隙消失;並藉著高速 轉動的治具本體50物與銅元件5〇2的接觸所產生的震動, _將銘元件501與銅元件502之重合部的氧化物皮膜分裂破 壞;並如第73B圖所示,與治具本體5〇4a接觸的銅元件 502的既定區域與其鄰近區域、還有與上述區域鄰接的鋁 元件501的既定區域,因治具本體504a與銅元件502的摩 擦接觸所產生的熱量而高溫化,呈現可塑化(流動化)的固 相狀態。上述的結果,使得銅元件5〇2與鋁元件5〇1在相 互的父界面上塑性流動,並由當初的表面開始塑性變形。 接合治具504的治具本體504a的通過執跡係與第一實 施型態之金屬元件接合方法相同,藉由治具本體5〇4&amp;的壓 2036-5808B-PF 126 1270429 ::在銅元件5°2的表…上,形成一對淺的段部 咖b(請參考帛69C圖)。又,在銘元件训與銅元件肥 的重合面巾’與第-實施型態之金屬元件接合方法相同, 已塑性變形的鋁元件501及銅元件5〇2相互咬合而固化成 斷面凹凸型的接合® S’而藉由介於銅元件哪與銘元件 501之間的此接合面S,而使銅元件5〇2與鋁元件5〇1確實 地接合(請參考第69C圖)。 、Further, the narrow groove G may be curved. For example, it may be formed as a scroll on the lower surface as shown in FIG. 72A, or may be arranged in a concentric shape as shown in FIG. 72B. A plurality of annular narrow grooves G 〇 and 'which are not shown in the drawing, the jig body 2036-5808B-PF 125 1270429 of the joint jig 5〇4 may also have the above-mentioned protrusions on the lower surface Ds. Curved rib (μ) (1) This rib may be formed as a wrap on the lower surface DS (refer to Fig. 71A): (SCro (1), or may be formed into a concentric shape. This second embodiment of the metal element joint In the method, as shown in FIGS. 73A and 73B, the lower surface of the cooker body 5〇4a of the joint _504 which is rotated at a high speed centering on the rotating shaft 5〇4b is pressed to the surface 2a of the copper member and joined. The jig 503 is moved along the surface 502a of the copper member • at the aforementioned travel rate V, and the aluminum member 501 is re-engaged with the copper member 502. ^ The fixture body 504a at this time, as shown in Fig. 73A, The surface Ds is pressed into the surface 5〇2&amp; of the copper member 5〇2 only by a certain amount α (m). The lower jaw rotates and moves along the surface 5〇2a of the copper member 5〇2, and the aluminum member 501 and the copper member 5〇2 are pressed by the surface 502a of the copper member 502 by the above-mentioned jig body 504a. The gap of the overlapping portion disappears; and the vibration generated by the contact between the fixture body 50 and the copper member 5〇2 rotating at a high speed _ splits the oxide film of the overlapping portion of the member 501 and the copper member 502; And as shown in Fig. 73B, the predetermined region of the copper member 502 in contact with the jig body 5〇4a and its adjacent region, and the predetermined region of the aluminum member 501 adjacent to the region, due to the jig body 504a and the copper member 502 The friction generated by the frictional contact is heated to a high temperature, exhibiting a plasticized (fluidized) solid phase state. As a result, the copper member 5〇2 and the aluminum member 5〇1 are plastically flowed on each other at the parent interface, and The original surface begins to be plastically deformed. The passing of the jig body 504a of the joining jig 504 is the same as that of the metal element of the first embodiment, and the pressure of the jig body 4〇4&amp; 2036-5808B-PF 126 1270429 :: Table of 5° 2 in copper components... On the top, a pair of shallow segments are formed (see 帛69C). In addition, the coincident face towel of the element component training and the copper component fertilizer is the same as the metal component joining method of the first embodiment, and is plastically deformed. The aluminum member 501 and the copper member 5〇2 are bonded to each other to be solidified into a joint of the cross-sectional concave-convex type, and the copper member 5〇2 is caused by the joint surface S between the copper member and the member 501. The aluminum component 5〇1 is surely joined (refer to Figure 69C).

散熱元件及其製造方法 接下來說明由上述金屬元件製造方法所得之鋁元件 5〇1(第-金屬元件)及銅元件5〇2(第二金屬元件)所構成的 接合體J(請參考第69C圖)所製造的散熱元件。第圖 為一散熱元件的斜視圖;第74B〜74c圖以及第75a〜7冗圖 係,、、、員示弟7 4 A圖所示之散熱元件的製造步驟。 ° 此散熱元件係使用於例如IC用散熱元件、皮蒂爾致冷 器(Peltier device)用散熱元件、馬達用散熱元件、電: 控制零件用散熱元件等等,如第7“圖所示,散熱元件_ 除了有基板207與複數個散熱鰭片5〇8a之外,亦具有散熱 元件508;其中散熱元件508係由將散熱鰭片5〇8&amp;相^間、 隔排列並立設於基板507上,並於基板5〇7的一表面上接 合而成。此散熱元件506的基板507,係由相當於上述接 合體J(請參考第69C圖)之銅元件5〇2之部分、與相當於 下述順序中的前述接合體J之鋁元件5〇1之部分所形成者。 接下來說明此散熱元伴506的製造,私 法中,藉由將上述接合體J的鋁元件5〇1鍛造加工,而在 2036-5808B-PF 127 1270429 銅元件502上立設複數個散熱鰭片508a。 此鍛造加工中所使用的鍛造模具,例如如第74B圖所 示’舉出由下部鍛造模具509與上部鍛造模具51〇所構成 者。其中下部鍛造模具509係具有一内部空間5〇9b,内部 空間509b的開口形狀係與接合體j的平面形狀相同,並將 此形狀延伸至平坦的底部509a;而上部鍛造模具51〇係具 有與下部鍛造模具509的内部空間509b約略相同的形狀, • 而在與下部鍛造模具509的底部509a合模之側,形成有依 據散熱鰭片508a的外型所作成的形狀之凹部51 。 在此散熱元件的製造方法中,首先如第74B圖所示, 在下部鍛造模具509的底部509a中配置接合體j。此時的 接合體j係將鋁元件5〇1配置為面對上部鍛造模具的 方向。接下來,由下部鍛造模具5〇9的開口 5〇9c,將上部 鍛造模具510向内部空間5〇9b壓下,如第7优圖所示,使 得鋁元件5 01發生塑性變形而進入形成於上部鍛造模具的 凹部510a内。然後將上部锻造模具51〇向上移動,使上部 鍛造模具510的凹部51〇a由接合體;離開,而製造出如第 74A圖所示的散熱元件5〇6。 又,此散熱元件506的製造方法並不限定於如上所述 之鍛造加工,亦可以使用接下來所述的切削加工。其製造 方法係將上述的接合體】切削加卫而形成複數個狹缝 (SHt),而在鋼元件502上立設複數個散熱鰭片508a。 於此切肖〗加工中所使用,的切5削器身 不係舉出由支持軸51 lb與以等間隔配置於其上的複數個Heat Dissipating Element and Method of Manufacturing the Same Next, a joint body J composed of an aluminum element 5〇1 (first metal element) and a copper element 5〇2 (second metal element) obtained by the above metal element manufacturing method will be described (please refer to 69C) The heat dissipating component manufactured. The figure is a perspective view of a heat dissipating component; the 74B to 74c and the 75th to 7th redundancy diagrams, and the manufacturing steps of the heat dissipating component shown in the drawing of the drawing. ° The heat dissipating component is used, for example, in a heat dissipating component for an IC, a heat dissipating component for a Peltier device, a heat dissipating component for a motor, a heat dissipating component for controlling a component, and the like, as shown in Fig. 7 The heat dissipating component _ has a heat dissipating component 508 in addition to the substrate 207 and the plurality of heat dissipating fins 5 8 8a; wherein the heat dissipating component 508 is arranged and erected on the substrate 507 by the heat dissipating fins 5 〇 8 &amp; The substrate 507 of the heat dissipating component 506 is made of a portion corresponding to the copper component 5〇2 of the bonding body J (please refer to FIG. 69C), and is formed by bonding on one surface of the substrate 5〇7. The portion of the aluminum member 5〇1 of the aforementioned joint body J is formed in the following order. Next, the manufacture of the heat dissipating element 506 will be described. In the private method, the aluminum member 5〇1 of the joint body J is forged. Processing, and a plurality of heat dissipating fins 508a are erected on the copper member 502 of 2036-5808B-PF 127 1270429. The forging die used in the forging process, for example, as shown in Fig. 74B, is exemplified by the lower forging die 509 and The upper forging die 51〇 is composed of The forging die 509 has an inner space 5〇9b, the opening shape of the inner space 509b is the same as the planar shape of the joined body j, and extends the shape to the flat bottom portion 509a; and the upper forging die 51 has the same forging with the lower portion The inner space 509b of the mold 509 is approximately the same shape, and a concave portion 51 having a shape formed according to the outer shape of the heat dissipation fin 508a is formed on the side of the lower portion 509a of the lower forging die 509. In the manufacturing method, first, as shown in Fig. 74B, the joined body j is disposed in the bottom portion 509a of the lower forging die 509. At this time, the joined body j is disposed such that the aluminum member 5〇1 faces the upper forging die. Then, the upper forging die 510 is pressed down to the inner space 5〇9b by the opening 5〇9c of the lower forging die 5〇9, as shown in the seventh figure, the aluminum element 510 is plastically deformed and enters the upper portion. Forging the concave portion 510a of the mold. Then, the upper forging die 51〇 is moved upward, so that the concave portion 51〇a of the upper forging die 510 is separated from the joined body; and the heat dissipation as shown in Fig. 74A is produced. Further, the manufacturing method of the heat dissipating member 506 is not limited to the above-described forging processing, and the cutting processing described below may be used. The manufacturing method is to cut the above-described joined body. A plurality of slits (SHt) are formed, and a plurality of fins 508a are erected on the steel member 502. The cutter body used in the processing is not exemplified by the support shaft 51 lb and a plurality of them arranged at equal intervals

2036-5808B-PF 128 1270429 刀具(CUtter)511a所構成者。其 ^ 、 各刀具511 a係為圓杯 狀之形狀,且其圓周面係分別 _板 刀π仏成有硬數個圖式中未繪示 的鋸齒;而支持軸511b係用以支捭久 曰 又荷各刀具511 a,且 &gt; 置 軸向轉動者。2036-5808B-PF 128 1270429 The tool (CUtter) 511a. Each of the cutters 511a has a round cup shape, and its circumferential surface is respectively _ 刀 仏 仏 into a hard number of saw teeth not shown in the figure; and the support shaft 511b is used for supporting曰 曰 各 each tool 511 a, and > set the axial rotation.

此散熱元件5。6的製造方法中,首先如第75a圖所示, 在圖式中未緣示的支持台上水平地承载著銘元# 5〇1朝上 的接合體J,而在接合體j的上方配置支持轴5ub呈水平 狀態的切削器具511。接下來,將切削器具5ιι向接人體】 的方向壓下,而如第75B圖所*,使各刀具5山在接合體 的鋁元件501形成複數個間隔配置的複數個狹缝5〇2c。藉 由上述複數個狹缝502c將銘元件5〇1分割而形成以既定^ 隔並列的散熱縛片5G5a,而製造出如第74A圖所示的散熱 元件506。 ' 而如上所述的散熱元件506的製造方法中,將鋁元件 501作鍛造處理、或是作切削處理’而在鋼元件5〇2上立 設複數個散熱鰭片508a的上述步驟中,係相當於申請專利 範圍中的「第三步驟」。 雖然以上係說明將接合體的鋁元件5〇1鍛造加工或是 切削加工而形成具有散熱鰭片5〇8a的散熱元件5〇6及其製 造方法,但是本發明之散熱元件並不限定於此,而亦可以 是如接下來所說明,將作為第一金屬元件的散熱鰭片、與 作為第二金屬元件的基板,以摩擦接合方法(前述第一級第 二實施型態之金屬元件接合方法)相互,接合的其他的散熱 元件。 2036-5808B-PF 129 1270429 其他的散熱元件及其製造方法 以下係說明其他的散熱元件及其製造方法,此處係以 上述第-實施型態之金屬元件接合方法所接合的散熱元件 及其製造方法為例來作說明。第76圖為_剖面圖,係顯示 其他的散熱元件。第77圖為一斜視圖,係顯示第76圖之 :熱元件構成中之散熱縛片。第78圖為—斜視圖,係顯示 第76圖之散熱元件製造時所使用的支持治具。第〜In the manufacturing method of the heat dissipating member 5.6, first, as shown in Fig. 75a, the bonding body J with the upward direction of the Ming #5〇1 is horizontally carried on the support table not shown in the drawing, and is joined. A cutting tool 511 having a support shaft 5ub in a horizontal state is disposed above the body j. Next, the cutting tool 5 is pressed in the direction of the human body, and as shown in Fig. 75B, each of the cutters 5 is formed in a plurality of slits 5〇2c which are disposed at a plurality of intervals in the aluminum member 501 of the joined body. The heat dissipating member 5G5a is formed by dividing the inscription element 5〇1 by the plurality of slits 502c, thereby producing the heat dissipating member 506 as shown in Fig. 74A. In the above-described method of manufacturing the heat dissipating member 506, the aluminum element 501 is subjected to the forging process or the cutting process, and the above-described steps of arranging the plurality of heat dissipating fins 508a on the steel element 5〇2 are It is equivalent to the "third step" in the scope of patent application. Although the above description explains that the heat dissipating member 5 〇 6 having the fins 5 〇 8 a and the manufacturing method thereof are formed by forging or cutting the aluminum member 5 〇 1 of the bonded body, the heat dissipating member of the present invention is not limited thereto. Alternatively, as will be described later, the heat dissipating fin as the first metal element and the substrate as the second metal element may be frictionally bonded (the first-stage second embodiment of the metal element bonding method) ) Other heat dissipating components that are joined to each other. 2036-5808B-PF 129 1270429 Other heat dissipating elements and manufacturing method thereof Hereinafter, other heat dissipating elements and manufacturing methods thereof will be described. Here, the heat dissipating elements joined by the metal element joining method of the first embodiment described above and the manufacturing thereof are manufactured. The method is illustrated as an example. Figure 76 is a cross-sectional view showing other heat dissipating components. Figure 77 is a perspective view showing the heat sink tab in the heat element configuration shown in Figure 76. Fig. 78 is a perspective view showing the support jig used in the manufacture of the heat dissipating member of Fig. 76. No. ~

圖為系歹】之剖面圖,係顯示第7 6圖所示之散熱元件的製 造步驟。f 8GA〜8GD圖為u之剖面圖與—斜視圖,係 顯不第76圖所示之散熱元件的變形例。 如第76圖所示,在此處說明的散熱元件512,係具有 銘板構成的散熱韓片512a(第—金屬元件)與銅構成的基板 512b(第二金屬元件在此散熱元件512中,在基板⑽ 的一表面上立設配置有複數個高度為h5、相互之間具有一 既定間隔排列的複數個散熱,鰭片512a。而配置在最外端的 散熱鰭片512a,纟基板512b上係具有—既定長度㈨的偏 移量。 而各散熱鰭片512a的高度旧較好為在8〜22關的範圍 内適宜地設定。又,偏移量的長度〇s則大體為—的程度。 各散熱鰭片512a,可一併參考第77圖會更加清楚, 係為將IS材作擠型而成型,而構成為斷面L字型的板材。 此政…、〜片512a亦可以為將平板材作L字型的彎曲所形 成而政,、一曰片512a的厚度(板,厚)較脊令,伽^ 度。又,與基板512b接觸的散熱籍片51別部分的寬度w5(請 2036-5808B-PF 130 1270429 參考第76圖)愈寬則愈能提升與基板5叫的接合力,而相 反地則減少立設於基板512a的各散熱韓片51孔的數量, 而減少散熱兀件512的散熱面積。因此,為了確保基板5i2b 上的散熱鰭片512a的接合力、與散熱面積雙方面都能夠滿 足上述寬度w5較好係設定在〗·2〜2〇mm的範圍内。 接下來說明散熱元件512的製造方法。首先,支持複 數個散熱鰭片512a以將其分別以一既定的間隔並列而。支The figure is a sectional view of the system, showing the manufacturing steps of the heat dissipating component shown in Fig. 76. f 8GA to 8GD is a cross-sectional view and a perspective view of u, and shows a modification of the heat dissipating member shown in Fig. 76. As shown in FIG. 76, the heat dissipating member 512 described herein is a heat dissipating Korean chip 512a (first metal member) composed of a nameplate and a substrate 512b made of copper (the second metal component is in the heat dissipating member 512, A plurality of heat dissipation fins 512a are disposed on a surface of the substrate (10) and have a plurality of heat dissipation fins 512a arranged at a predetermined interval. The heat dissipation fins 512a disposed on the outermost ends of the substrate have a heat dissipation fin 512a. - The offset of the predetermined length (nine). The height of each of the heat radiating fins 512a is preferably set appropriately within the range of 8 to 22, and the length of the offset 〇s is generally -. The fins 512a can be more clearly seen with reference to Fig. 77. The IS material is extruded and formed into a L-shaped plate. The 512a can also be a flat plate. The material is formed by the bending of the L-shape, and the thickness (plate, thickness) of the one piece 512a is higher than that of the ridges, and the width w5 of the heat-dissipating piece 51 contacting the substrate 512b (please 2036-5808B-PF 130 1270429 refer to Figure 76) The wider the width, the more it can be lifted with the substrate 5 The bonding force, on the other hand, reduces the number of holes of the heat dissipation fins 51 that are erected on the substrate 512a, and reduces the heat dissipation area of the heat dissipation element 512. Therefore, in order to secure the bonding force of the heat dissipation fins 512a on the substrate 5i2b, The heat dissipation area can satisfy both of the above widths w5 and is preferably set within a range of 2 to 2 mm. Next, a method of manufacturing the heat dissipation element 512 will be described. First, a plurality of heat dissipation fins 512a are supported to respectively a given interval juxtaposed.

持各散熱鰭片512a的方法並沒有特別的限制,可以列舉出 將複數個散熱元件維持在既定間隔的支持器具的使用方 f上述的支持器具,係列舉出例如為如第78圖所示,由 複數個接X各散熱鰭片512a插入的狹縫(sl i 以一 既定間隔並列於一方向所形成的塊狀物體(bl ock)所構成 的支持器具51 3。 分別在上述支持器具513的狹縫513a置入各散熱鰭片 512a後,將此支持器具5〗3以既定的散熱元件製造用治具 固定。 如第79A圖所不’散熱元件製造用治具514,係具有 由上面是開放的箱型治具本體51“、與緊閉螺栓514b。其 中緊閉螺栓514b係用以固定收納於箱型治具本體5 j “的 支持器4 513, ϋ將其以螺絲結合於構成箱塑治具本體 514a的壁上。此散熱元件製造用治具中,係將散熱韓 片512a之被彎曲的緣部512c的一側朝向治具本體514^所 開放的上面,而將支持器:具.'5找收喻於洽具本體Η 並將緊閉螺栓514b鎖入,而將治具本體5〗4a内的複數個 2036-5808B-PF 131 1270429 散熱鰭片512a固定。 接下來,如第79B圖所示,將基板512b重合於朝向治 具本體514a所開放的上面的散熱鰭片512a的緣部512c。 此日守基板51 2b係以圖式中未繪示的固定治具固定於散熱 鳍片512a的緣部512c。 如上所述將基板512b重合餘個散熱鰭片512a後,將 各散熱鰭片512a與基板512b以上述第一實施型態之金屬 φ 兀件接合方法接合。而如第79C圖所示,將以轉動軸5〇3b 為中心以圓周方向高速轉動的治具本體5〇3a的圓周面垂 直壓至基板512b之表面,並使治具本體5〇3a沿著基板51礼 之表面移動,使各鰭片512a與基板512b接合。 此時,因為構成基板51 2b的銅的熔點高於構成散熱鰭 片512a的鋁,各散熱鰭片512a與基板512b之重合面的溫 度上升到兩者接合時所必要的溫度(共晶溫度:548^ )時, 基板512b仍能保持高的抗形變強度。此結果,在此散熱元 ί 件5 12的製造方法中,接合治具5〇3的壓應力能夠有效率 地傳達至各散熱鰭片512a與基板512b之重合部,而使各 散熱鰭片512a與基板512b之間無缝隙形成,亦使各散熱 鰭片512a與基板512b行高強度的接合。而此處,係使用 第一實施型態之金屬元件接合方法,而當然亦可以使用上 述的第二實施型態之金屬元件接合方法。 如上所述將各散熱鰭片512a與基板512b接合後,將 支持器具513由散熱元件製造'用治,你 否的各政熱_片51 2 a與基板512 b由支持治具513中拔 2036-5808B-PF 132 1270429 出’而完成了散熱元件512的製造步驟。The method of holding each of the heat radiation fins 512a is not particularly limited, and the above-described support device is used as a support device for maintaining a plurality of heat dissipation elements at a predetermined interval, and the series is, for example, as shown in FIG. 78. a support member 51 3 formed by a plurality of slits (s1 i) which are inserted into the heat dissipation fins 512a at a predetermined interval and arranged in a direction, respectively, in the support device 513 After the slit 513a is placed in each of the heat radiating fins 512a, the support device 5 is fixed to a predetermined jig for heat dissipating element manufacturing. As shown in Fig. 79A, the jig 514 for heat dissipating element manufacturing has The open box jig body 51" and the closing bolt 514b. The closing bolt 514b is for fixing the holder 4 513 housed in the box jig body 5 j", and is screwed to the forming box The jig of the heat-fixing element manufacturing fixture is such that one side of the curved edge portion 512c of the heat-dissipating Korean piece 512a faces the upper side of the jig body 514, and the holder is: With '5 looking for a metaphor in the body The locking bolts 514b are locked, and the plurality of 2036-5808B-PF 131 1270429 heat radiating fins 512a in the fixture body 5 4a are fixed. Next, as shown in FIG. 79B, the substrate 512b is superposed on the orientation. The edge portion 512c of the upper heat dissipation fin 512a opened by the fixture body 514a. The substrate substrate 51 2b is fixed to the edge portion 512c of the heat dissipation fin 512a by a fixing jig not shown in the drawing. After the substrate 512b is overlapped with the remaining heat dissipation fins 512a, the heat dissipation fins 512a and 512b are joined by the metal φ piece bonding method of the first embodiment described above, and as shown in FIG. 79C, the rotation axis 5 is used. The circumferential surface of the jig body 5〇3a, which is rotated at a high speed in the circumferential direction, is vertically pressed to the surface of the substrate 512b, and the jig body 5〇3a is moved along the surface of the substrate 51 so that the fins 512a and At this time, since the melting point of the copper constituting the substrate 51 2b is higher than the aluminum constituting the heat dissipation fin 512a, the temperature of the overlapping surface of each of the heat dissipation fins 512a and 512b rises to the temperature necessary for the joining of the two ( When the eutectic temperature is 548^), the substrate 512b can still be protected. As a result, in the manufacturing method of the heat dissipating member 512, the compressive stress of the bonding jig 5〇3 can be efficiently transmitted to the overlapping portion of each of the heat radiating fins 512a and 512b, and The gap between each of the heat dissipation fins 512a and the substrate 512b is formed without gaps, and the heat dissipation fins 512a and 512b are joined to each other with high strength. Here, the metal element bonding method of the first embodiment is used, of course. The metal element bonding method of the second embodiment described above can also be used. After the heat dissipating fins 512a and the substrate 512b are joined as described above, the supporting device 513 is manufactured by the heat dissipating component. If you do not have any heat, the film 51 2 a and the substrate 512 b are pulled out of the supporting jig 513 by 2036. -5808B-PF 132 1270429 The manufacturing steps of the heat dissipating component 512 are completed.

針對以上作詳述,上述本實施型態的金屬元件接合方 法令 由炫點較高的板狀銅元件,以接合治具5 〇 3、5 0 4、 5〇5(請參考第68B〜68C圖、第71A〜71C圖、與第72A〜72B 囷)加以加熱及加壓,而在銘元件5 01與銅元件§ 〇 2之重合 邙的度上升到接合時所必要的溫度(共晶溫度·· 5 4 8 °C ) 時,銅元件502仍能保持其高的抗形變強度,而使壓應力 φ 能夠有效率地傳達至重合部。因此,藉由此金屬元件接合 方法,可以簡單地裝置,而能夠成為鋁元件5〇1與銅元件 5 0 2之間無縫隙的高強度接合。 又,本實施型態之散熱元件的製造方法中,係形成由 鋁元件501與銅元件502(基板)以上述金屬元件接合方法 接合的接合體J(請參考第69C圖);接下來,係將相當於 該接合體之鋁元件501的部分加工而形成散熱鰭片5〇8a, 或是將鋁構成的散熱鰭片512a與銅構成的基板5i2b以上 • 述的金屬元件接合方法接合而製造散熱元件512。因此, 藉由此散熱元件512的製造方法,可以如上述金屬元件接 合方法一樣簡單地裝置,而能夠成為散熱鰭片512a與基板 512b之間無缝隙的高強度接合。 又,藉由此散熱元件的製造方法,因為不需要如銲接 時一般在真空爐中加熱並維持一既定時間,而能夠將鰭片 508a、512a與基板507、51 2b(請參考第74A圖與第76圖) 接合,可以削減製造成本。 又,將散熱鰭片512a與基板512b以上述的金屬元件 2036-5808B-PF 133 1270429 接合方法接合的散熱元件512的製造方法中,將散埶緒 仙與基板㈣相互重合之際,以支持治具513(請= 第78圖)支持複數個散熱鰭片512a。因此,藉由此散熱元 件512的製造方法,不但可以正確地保持各散熱鰭片“Μ 相互的間隔,亦可以決定相互之間以一既定間隔分開之狀 態的位置。 又,此散熱元件512的製造方法中,將散熱鰭片512a 與基板512b以上述金屬元件接合方法接合之際,散熱鰭片 512a係受到彎曲應力的作用,而散熱鰭片512&amp;係受^支 持Is具513的補強。因此,藉由此散熱元件512的製造方 法,散熱鰭片512a的厚度可予以相當地薄化。 又,此散熱το件512的製造方法中,將散熱鰭片512a 與基板512b以上述金屬元件接合方法接合之際,因為散熱 曰片512a係文到支持器具5 j 3的補強,散熱鰭片$ j 2a的 尚度h5可以作得較大。因此,藉由此散熱元件5i2的製造 方法’可以製造出具有高高度/間隔比(例如高度/間隔此超 過20)的散熱元件512。 本實施型態的散熱元件512,係由基板51孔之側施以 加熱及加壓而將散熱鰭片512a與基板512b接合而成者。 而並不是如習知的物件一般,由散熱鰭片512&amp;之側施以加 熱及加壓而為接合。因此,藉由此散熱元件512,即使是 八有複雜的形狀及構造的散熱韓片512a,亦可以簡易地將 其裝置而製造而成為散熱元件512脅構成。由此結果,此 散熱元件512中,可以在基板51^上配設具有較大散熱面In view of the above, the metal element bonding method of the present embodiment described above is used to bond the fixtures 5 〇 3, 5 0 4, 5 〇 5 by a plate-shaped copper element having a high sleek point (refer to pages 68B to 68C). Fig. 71A to 71C and 72A to 72B) are heated and pressurized, and the degree of coincidence of the ingrown element 5 01 and the copper element § 〇2 rises to the temperature necessary for bonding (eutectic temperature) At the time of 5 4 8 ° C, the copper member 502 can maintain its high deformation strength, and the compressive stress φ can be efficiently transmitted to the overlapping portion. Therefore, by the metal element bonding method, it is possible to easily form a high-strength joint without gaps between the aluminum element 5〇1 and the copper element 502. Further, in the method of manufacturing a heat dissipating element of the present embodiment, a bonded body J in which the aluminum element 501 and the copper element 502 (substrate) are joined by the above-described metal element bonding method is formed (refer to Fig. 69C); A portion corresponding to the aluminum element 501 of the bonded body is processed to form the heat dissipation fins 5 8 8a, or the heat dissipation fins 512 a made of aluminum and the substrate 5 i 2 b made of copper are bonded to each other to form a heat dissipation method. Element 512. Therefore, by the method of manufacturing the heat dissipating member 512, the device can be easily assembled as in the above-described metal element bonding method, and can be a high-strength joint without gaps between the heat dissipating fin 512a and the substrate 512b. Moreover, with the manufacturing method of the heat dissipating element, since it is not necessary to heat and maintain a vacuum in a vacuum furnace for a predetermined time, the fins 508a and 512a and the substrates 507 and 51 2b can be replaced (refer to FIG. 74A and FIG. Figure 76) Bonding can reduce manufacturing costs. Further, in the method of manufacturing the heat dissipating element 512 in which the heat dissipating fin 512a and the substrate 512b are joined by the above-described metal element 2036-5808B-PF 133 1270429, the dispersing method and the substrate (4) are overlapped each other to support the treatment. A plurality of heat sink fins 512a are supported by 513 (please = figure 78). Therefore, by the method of manufacturing the heat dissipating member 512, not only can the heat dissipating fins be accurately held, but also the positions of the heat dissipating fins can be determined to be separated from each other by a predetermined interval. In the manufacturing method, when the heat radiating fin 512a and the substrate 512b are joined by the above-described metal element bonding method, the heat radiating fins 512a are subjected to bending stress, and the heat radiating fins 512 &amp; are supported by the Iss 513. With the manufacturing method of the heat dissipating member 512, the thickness of the heat dissipating fin 512a can be considerably thinned. Further, in the manufacturing method of the heat dissipating member 512, the heat dissipating fin 512a and the substrate 512b are bonded by the metal element. At the time of joining, since the heat radiating fin 512a is reinforced by the supporting means 5 j 3 , the degree h5 of the heat radiating fins $ j 2a can be made larger. Therefore, the manufacturing method of the heat radiating element 5i2 can be manufactured. The heat dissipating component 512 having a high height/space ratio (for example, a height/interval of more than 20) is provided. The heat dissipating component 512 of this embodiment is heated and pressurized by the side of the hole of the substrate 51. The heat dissipating fins 512a and the substrate 512b are joined together. Instead of being heated as a general object, the side of the heat dissipating fins 512 &amp; is joined by heating and pressurization. Even in the case of a heat-dissipating Korean chip 512a having a complicated shape and structure, it can be easily fabricated and formed into a heat-dissipating element 512. As a result, the heat-dissipating element 512 can be disposed on the substrate 51. Has a large heat dissipation surface

2036-5808B-PF 134 1270429 積之具有複雜的形狀及構造的散熱鰭片5i2a。 二以上’係已說明本發明的實施型態,而本發明並不限 定於上述的實施型態,而能以各式各樣的型態實施。 例如,在本實施型態中,在鋼元件5〇2(第二金屬元件) 施以加熱及加壓之際,係採用以接合治具5〇3、5。4、_ 參考第68B〜68C圖、第71A〜7ir囬 弟71A71C圖、與第72A〜72B圖)壓至 銅元件502的接觸方式·而士 1。口 式,而本發明的金屬元件接合方法並 不限定於上述的接觸方— 式亦可以使用電磁誘導加埶等非 接觸方式來取代上述的接觸方式。 又’在本實施型態中择 ^ , τ係以鋁兀件作為第一金屬元件 之一例、以及以銅元件5〇2作兔笙 入择 太获明wh 作為第二金屬元件之-例;而 本發明的金屬元件接合方 散熱元件的製造方法'以及 月文熱7L件,並不限定於 使用熔^ ϋ M A '&quot; 用的材料,而可以廣泛地 便用爆點互異的金屬元件。 又,第-實施型態之金屬元件接合 在治具本體503a的圓月面且古^ 係以使用 πΐϋ周面具有凹槽5〇3c 的方法為例,·而本發明之 ° * 503 、屬兀件接合方法亦可以蚀田目 有在圓周面上有突起的治具本體之接吏用/、 周面為平滑構成的治具本體之接合治:二取,具有圓 合治具503a。 /、 取代上述的接 第貝靶型恕之金屬元件接合方法 在治具本體504a的下声而μ 係以使用 人、/ 下表面DS形成有突起b與細 认 a &gt;口具5 0 4的方法立γ r · ^、、'、暴G的接 可以使用具有下表面Ds A早、Ά 蜀兀件接合,法亦 為千〉月面構成之治具本體的接合2036-5808B-PF 134 1270429 A heat sink fin 5i2a having a complicated shape and configuration. The present invention has been described in terms of two or more embodiments, and the present invention is not limited to the above-described embodiments, and can be implemented in various forms. For example, in the present embodiment, when the steel element 5〇2 (the second metal element) is heated and pressurized, the joint jig 5〇3, 5. 4, _ reference 68B to 68C is used. Fig. 71A to 7ir, the 71A71C picture, and the 72A to 72B picture) are pressed to the copper element 502. In the mouth type, the metal element joining method of the present invention is not limited to the above-described contact method, and a non-contact method such as electromagnetic induction twisting may be used instead of the above contact method. Further, in the present embodiment, the τ is an example in which the aluminum element is used as the first metal element, and the copper element 5〇2 is used as the second metal element. However, the method for manufacturing the metal element joint-side heat dissipating member of the present invention and the monthly heat 7L member are not limited to the use of the material used for the melting of the MA '&quot;, and the metal elements having different explosion points can be widely used. . Further, the metal element of the first embodiment is joined to the meniscus of the jig body 503a, and the method of using the groove 5〇3c on the πΐϋ circumferential surface is taken as an example, and the °*503 of the present invention The 接合 接合 目 亦 亦 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 。 。 503 。 503 503 503 503 503 503 503 503 503 503 503 503 503 /, in place of the above-described connection method of the metal element, the metal element bonding method is formed in the lower surface of the jig main body 504a, and the user/the lower surface DS is formed with the protrusion b and the fineness a &gt; The method of γ r · ^, , ', and the contact of the G can be used with the lower surface Ds A early, the 蜀兀 接合 接合 , , , , , , , , , , , 本体

2036-5808B-PF 135 1270429 治具,來取代在此金屬元件接合方法中所使用的接合治具 504 ° 又’本實施型態之散熱元件,係以具有斷面形狀為l 字型的散熱鰭片者為例,而本發明並不限定於此,亦可以 疋例如第80A圖所示之具有斷面形狀為〔字型的散熱鰭片 512a 者。 又,本發明的散熱元件,如第80B與80C圖所示,散 熱元件512a亦可以是波浪狀板材所構成的波形 (corrugate)鰭片。又,該板材的波形並無特別的限制,可 以如第8B圖所示之三角形狀的波,亦可以是如第8〇(:圖所 示之矩形的波。又,散熱鰭片512a與基板512b的接合部 ^ 了以疋政熱鰭片512a與基板512b接觸的全體部位, 又波形鰭片的兩端部為例,亦可以是接觸部位的一部分。 又在第80B與80C圖所示的散熱鰭片512a中,係以由一個 板材所構成的散熱鰭片512a為例,而使用於本發明的散熱 几件之散熱鰭片並不受限於此,而在形成第8〇β與80C圖 所示的波形時,亦可以將複數個被彎曲的板材在基板上並 列配置’並將各板材分別與基板結合之圖式未繪示的散熱 鱗片亦可。而如第8〇Α圖所示的散熱鰭片512a中,寬度 W5較好為在丨.2〜2· 〇mni的範圍内適宜地設定,散熱鰭片 512a的面度h5較好為在8〜16 mm的範圍内適宜地設定。又, 如第80B所示的散熱鰭片512a中,鰭片寬度p較好係設定 為在1· 5〜2· 〇mm的範圍。又,如:第._e,所^ 中’籍片寬度p較好係設定為在j · 5〜j. 8mni的範圍。又, 2036-5808B-PF 136 1270429 散熱鰭片51 2a的高彦h ς &amp; &amp; $ &amp; η 李父好為在8〜1 6mm的範圍内適宜地 設定。 本爲細型恶之散熱元件中,係以具有鰭片508a、 512a(請參考第74A圖與第”圖)者為例,而本發明之散熱 ,件並不限定於此,亦可以是如帛81D圖所示之,在作為 第-金屬兀件的基512|}上接續有作為第一金屬元件之 複數個散熱柱狀|f5l2d。此散熱柱狀體的斷面形狀並沒有 限制,圓柱、角柱皆可。此散熱柱狀體512d的高度較好為 20〜40_的範圍,散熱柱狀體512d在基板51化上的配置 間隔P較好為h8〜2·0_的範圍。又,散熱柱狀體512d為 圓柱體時,其直徑較好大體為2_。 接下來,說明本發明第六群組的實施型態。 第81A〜81B圖係顯示本發明之散熱元件之第一實施型 悲,其中第81A圖為斜視圖,第81β圖為分解斜視圖。又,2036-5808B-PF 135 1270429 Fixture, in place of the joint fixture 504 ° used in the joining method of the metal component, and the heat dissipating component of the present embodiment is a fin having a sectional shape of a l-shape. The film is exemplified, and the present invention is not limited thereto, and for example, a heat sink fin 512a having a cross-sectional shape as shown in Fig. 80A may be used. Further, in the heat dissipating member of the present invention, as shown in Figs. 80B and 80C, the heat dissipating member 512a may be a corrugate fin formed of a corrugated sheet material. Further, the waveform of the plate material is not particularly limited, and may be a triangular wave as shown in Fig. 8B, or may be a rectangular wave as shown in Fig. 8 (also shown as a heat wave fin 512a and a substrate). The joint portion of the 512b is an entire portion in contact with the substrate 512b by the hot fin 512a, and both ends of the corrugated fin are used as an example, or may be a part of the contact portion. Further, as shown in Figs. 80B and 80C. In the heat dissipation fin 512a, the heat dissipation fins 512a composed of one plate material are taken as an example, and the heat dissipation fins used for heat dissipation of the present invention are not limited thereto, and the eighth 〇β and 80C are formed. In the waveform shown in the figure, a plurality of bent sheets may be arranged side by side on the substrate, and the heat-dissipating fins not shown in the drawings may be combined with the respective sheets, and as shown in Fig. 8 In the heat dissipation fin 512a, the width W5 is preferably set within a range of 丨.2 to 2· 〇mni, and the surface roughness h5 of the heat dissipation fin 512a is preferably in the range of 8 to 16 mm. Further, in the heat dissipation fin 512a shown in FIG. 80B, the fin width p is preferably set to be 1· 5~2· 的mm range. Also, such as: _e, ^^'s film width p is better set in the range of j · 5~j. 8mni. Again, 2036-5808B-PF 136 1270429 The heat sink fins 51 2a of Takahashi h ς &amp;&amp; $ &amp; η Lee father is suitably set in the range of 8~1 6mm. This is a thin type of heat dissipation element, with fins 508a 512a (please refer to FIG. 74A and FIG. 3) as an example, and the heat dissipation of the present invention is not limited thereto, and may be as shown in FIG. 81D, and is used as a base of the first metal element. The 512|} is connected with a plurality of heat-dissipating columns as the first metal element |f5l2d. The cross-sectional shape of the heat-dissipating column is not limited, and the column and the corner column are all. The height of the heat-dissipating column 512d is preferably In the range of 20 to 40 mm, the arrangement interval P of the heat dissipation columnar body 512d on the substrate 51 is preferably in the range of h8 to 2·0_. Further, when the heat dissipation columnar body 512d is a cylinder, the diameter thereof is preferably large. 2_. Next, an embodiment of the sixth group of the present invention will be described. Figs. 81A to 81B are diagrams showing the first embodiment of the heat dissipating component of the present invention, wherein 81A picture shows a perspective view of 81β picture shows an exploded perspective view. Also,

第82A圖為帛81A圖沿AA線之剖面圖、第82B圖為第81A 圖沿BB線之剖面圖、第82C圖為第81a圖之底部視圖。如 以上之圖式所示,散熱元件601A係由基板602與各鰭片 603所構成。 、…曰 基板602係為銅製,其寬度、長度、厚度分別為W6、 L、t。基板602的一表面602a係間隔著散熱片 (heatsp]:eader)6〇4,與作為發熱體的cpu 6〇5作導熱性接 觸。又,基板602的另一表面6〇2b上係形成有厚度“、 寬度Ws、長度Ls的凸條6〇2e。凸條附 度大致與散熱片604的寬度相同。又,凸條6〇託的長度 2036-5808B-PF 137 1270429Fig. 82A is a cross-sectional view taken along line AA of Fig. 81A, Fig. 82B is a cross-sectional view taken along line BB of Fig. 81A, and Fig. 82C is a bottom view of Fig. 81a. As shown in the above figures, the heat dissipating member 601A is composed of a substrate 602 and fins 603.基板 The substrate 602 is made of copper, and its width, length, and thickness are W6, L, and t, respectively. One surface 602a of the substrate 602 is thermally contacted with a heat sink (easp) 6〇4, and is thermally contacted with a cpu 6〇5 as a heat generating body. Further, the other surface 6〇2b of the substrate 602 is formed with a ridge 6〇2e having a thickness “, a width Ws, and a length Ls. The ridge attach is substantially the same as the width of the heat sink 604. Further, the ridge 6 〇 Length 2036-5808B-PF 137 1270429

Ls在此處係與基板602的長度L相等’ Ls〈L亦可。 各鑛片603係為铭製,以相互平行的方式立設接合於 基板6G2的表面6Q2bJl。而二個—對的縛片6Q3,於基端 部603a才目互連結而形成鰭片構成材6〇6。鰭片構成材_ Μ底部的寬度方向的略中央部係形成有與基板6〇2之凸條 6〇2c對應形狀的凹部6Q6a ’而將各鰭片立設接合於基板 602的表面6G2b時’凸條6心較好為完全與各鰭片6〇3 馨 連接。 散熱兀件601A中,CPU 605所產生的熱量,首先介由 熱分散器散熱片604傳至基板602,接下來以第似圖的 箭號所示的全部方向流動而傳至各散熱續片6〇3,最後係 以自然冷卻或藉由風扇等強制冷卻而發散至空氣中。因 此’一胃般來說’雖然基板602的厚度愈大,愈容易將cpu6〇5 的熱置傳至各鰭片603,而在此情況下,基板6〇2的重量 也會增加。因此,在此散熱元件6〇u中,基板6〇2的厚度 書並非王體性地增加,而—方面僅僅對於將⑽服的熱量 傳至各鰭片603的貢獻度大的部分,增加該部分的基板6〇2 的厚度,·而對於貢獻度小的部分,則減少其厚度;使基板 602的全體重量不變,而有效率地將cpu 6〇5的熱量傳至 各籍片603。而藉由在基板6〇2上形成凸條6〇2c,第82c 圖中沿著箭號X方向的熱流係遠大於沿著箭號y方向的熱 流,而將CPU 605所產生的熱量有效率地傳至各鰭月6〇3。 而基板602的全體重量不雙而能脅提嘴散舍性能,意咮著 能夠在不使散熱性能降低的情況下而達成輕量化。 2036-5808B-PF 138 1270429 述的觀點,以凸條6 〇 2 c的斷面形狀來說,其寬度 旱度tS之比(輪廓比;aspect ratio)較好為5〜3〇 ;或 是凸條602c的Μ许+ 又ts/其所在的散熱元件的全高h6之比 較好為 〇1〜丄u • · 而由其後所述的實施例中可以瞭解,凸 “ c的厚度相對過大時,會加大壓力損失,反而降低散 …丨此,凸條602c的厚度相對過小時,就相近於將基板的 厚度全體地增加時的情況,而形成6.的意義就變小了。 φ 接下來說明散熱元件601A的製造方法之一例。 首先準備由熔點高於銅及鋁的鐵等物質所構成的間 隔物/口 /、6 G 7。如帛8 3 A圖所示,此間隔物治具⑽7中, 係立設形成有複數個等高的間隔部6〇7a,以等間隔並列。 各間隔部⑽的間隙607b的寬度約略等於鰭片6G3的板 厚。各間隔部607a分別形成有與基板6〇2的凸條6〇2c的 形狀大體相同的凹部6〇7C。 方面,將中央部形成有長方形開口的平版狀的鋁板 癱彎曲呈斷面凹字型,而製作籍片構成材6〇6。 接下來,以圍繞間隔物治具607的間隔部6〇7a的方 式,由相對於間隔物治具607的側邊將鰭片構成材6〇6插 入。亦即,分別將鰭片603、603朝向間隔部6〇7a兩側的 間隙60 7b、607b,並使基端部6〇3a位於該間隔部6〇 7a的 上面的位置,由間隔物治具607的側邊將鰭片構成材6〇6 插入。同樣地,依次將各鰭片構成材6〇6插入間隔物治具 607 ’使其他的間隙607b分別為鰭片&amp;〇3所嵌入。如此— 來,藉由鰭片構成材606的凹部606a與間隔物治具607的 2036-5808B-PF 139 1270429 凹部607c,而形成可供基板602的凸條6〇2c嵌入的凹溝。 之後’由固定各鰭片構成材6 〇 β的間隔物治具6 〇 7的 上方被覆基板602。在此狀態下,基板6〇2的表面6〇2b(圖 式中的下表面)係與鰭片構成材β〇β的基端部接觸, 而未與間隔物治具607的間隔部607a接觸。同樣地,基板 ⑽2的凸條602c的下表面係與位於鰭片構成材6〇6的凹部 606a的各鰭片β〇3接觸,而未與間隔物治具6〇7的間隔部 _ 607a接觸。但是,基板602的凸條602c的寬度、鰭片構 成材606的凹部606a的寬度、與間隔物治具6〇7的凹部 6〇7c的寬度相互之間大體相等,因此基板6〇2的凸條Μ。 係具有正確地決定基板602與鰭片構成材6〇6的寬度方向 的相對位置、甚至鰭片構成材⑽6兩兩相互之間寬度方= 的位置之位置決定部的機能。 接下來,如第83B圖所示,以轉動軸6〇肋為十心、朝 圓周方向、以高速轉動的接合治具6〇8之接合本體之 圓周面,垂直壓至基板602的表面6〇2a,並藉由將接合治 具603沿著基板602的表面602a以一既定的行進速率移 動,使鰭片構成材606與基板602摩擦震動接合。接人、么 具608係在轉動軸608b的前端部將圓板狀的治具本體Mg 固定,而治具本體608a係由Jis : SKD61等工%说 /、蜩所構成。 相對於壓入基板602的表面6〇2a時的行進方 J '/台具本I# 608a係以送至後方的方向,沿著轉動軸⑼讣的周邊轉動。 如第84B圖所示,治具冰艘⑽齡'诗督爆 a (m)壓入基板602的表面602a的狀態高速轉動,並、儿: 者 2036-5808B-PF 140 1270429 基板602的表面602a移動。而藉著上述治具本體6〇8a在 基板6 0 2之壓入,使鰭片構成材β 〇 6的基端部6 〇 3 a與基板 602之交界面的缝隙消失;並藉著高速轉動的治具本體 6 08a與基板602的接觸所產生的震動,將鰭片構成材6〇6 的基端部603a與基板602之交界面的氧化物皮膜分裂破 壞,並與治具本體608a接觸的基板602的既定區域與其鄰 近區域、還有與上述區域鄰接的基端部6〇3a的既定區域, _ 因治具本體60 8a與基板602的摩擦接觸所產生的熱量而高 溫化,而使基板602 (銅)和與其連接的基端部6〇3a(鋁)的 一部分發生共晶熔融。上述的結果造成在基板6〇2與基端 部603a之間形成共晶層609。而後,接合治具6〇8之接合 本體608a通過後而冷卻,而使鰭片構成材6〇6的基端部 6 0 3a與基板602之間介由共晶層6〇9而接合。 基板602的表面602a中,治具本體6〇3a對該表面6〇2a 施以壓應力之負荷並通過所留下的執跡,較好為經由後製 _ 程的切削而形成平滑的表面。 如此一來,基板602與,鰭片構成材6〇6分別為銅與紹 所構成’因為接合治具608係麼至熔點高於紹的銅基板6〇2 之側,縛片構成材606的基端部603a與基板602的重合部 達到接合所必要的溫度(銅與鋁的共晶溫度·· 5“它)以上 時,基板602可以保持比較大的抗形變強度,可使來自接 合治具_的壓力充分地傳達至交界面,而將兩者確實地 接° &amp;具608壓至基板韻2之際,凸條6〇2c並 不會造成麻煩’而使韓片603的高度/間隔比、以及凸條Here, Ls is equal to the length L of the substrate 602' Ls < L. Each of the slabs 603 is made of a name, and is vertically erected to be bonded to the surface 6Q2bJ1 of the substrate 6G2. The two-paired tabs 6Q3 are interconnected at the base end portion 603a to form the fin constituents 6〇6. The fin constituent material _ a concave portion 6Q6a' having a shape corresponding to the ridges 6〇2c of the substrate 6〇2 is formed at a substantially central portion in the width direction of the bottom portion of the crucible, and when the fins are erected to the surface 6G2b of the substrate 602. Preferably, the rib 6 is completely connected to each of the fins 6〇3. In the heat sink element 601A, the heat generated by the CPU 605 is first transmitted to the substrate 602 via the heat spreader heat sink 604, and then flows to all the heat sinks 6 in all directions indicated by the arrows of the first figure. 〇3, and finally it is diverged into the air by natural cooling or forced cooling by a fan or the like. Therefore, the larger the thickness of the substrate 602, the easier it is to transfer the heat of the cpu6〇5 to the fins 603, and in this case, the weight of the substrate 6〇2 is also increased. Therefore, in the heat dissipating member 6〇u, the thickness book of the substrate 6〇2 is not increased in the body, and the aspect is increased only for the portion where the contribution of the (10) heat to the fins 603 is large. The thickness of the portion of the substrate 6〇2 is reduced, and the thickness of the portion of the substrate 602 is reduced, and the total weight of the substrate 602 is not changed, and the heat of the cpu 6〇5 is efficiently transmitted to the respective sheets 603. By forming the ridges 6〇2c on the substrate 6〇2, the heat flow in the arrow X direction in Fig. 82c is much larger than the heat flow in the direction of the arrow y, and the heat generated by the CPU 605 is efficient. The ground is passed to each fin month 6〇3. On the other hand, the entire weight of the substrate 602 is not double and the performance of the nozzle can be lifted, which means that the weight can be reduced without deteriorating the heat dissipation performance. 2036-5808B-PF 138 1270429 The point of view is that the ratio of the width to dryness tS (the aspect ratio) is preferably 5 to 3 〇 in the cross-sectional shape of the rib 6 〇 2 c; The height of the strip 602c + ts / the full height h6 of the heat dissipating component in which it is located is preferably 〇 1 丄 • u • · and it can be understood from the embodiment described later that when the thickness of the convex "c is relatively large, When the pressure loss is increased, the thickness of the rib 602c is relatively small, which is similar to the case where the thickness of the substrate is increased as a whole, and the meaning of forming 6. becomes smaller. An example of a method of manufacturing the heat dissipating element 601A will be described. First, a spacer/port/6 G 7 composed of a substance having a melting point higher than that of copper and aluminum is prepared. As shown in Fig. 8 3 A, the spacer jig is provided. In (10), the spacers 6〇7a are formed in a plurality of equal heights, and are arranged at equal intervals. The width of the gap 607b of each of the spacers (10) is approximately equal to the thickness of the fins 6G3. Each of the spacers 607a is formed with The ridges 6〇2c of the substrate 6〇2 are substantially the same in the shape of the recesses 6〇7C. A flat plate-shaped aluminum plate having a rectangular opening is formed into a concave shape in a cross-sectional shape, and a green sheet member 6 6 is formed. Next, in a manner of surrounding the spacer portion 6〇7a of the spacer jig 607, The side edges of the spacer jig 607 are inserted into the fin constituents 6〇6, that is, the fins 603 and 603 are respectively directed to the gaps 60 7b and 607b on both sides of the partition portion 6〇7a, and the base end portion 6〇 is 3a is located at the upper surface of the partition portion 6〇7a, and the fin constituent material 6〇6 is inserted by the side of the spacer jig 607. Similarly, the fin constituent members 6〇6 are sequentially inserted into the spacer jig. 607 'The other gaps 607b are respectively embedded in the fins &amp; 〇3. Thus, by the recess 606a of the fin constituent material 606 and the recess 3673 of the spacer jig 607, 2036-5808B-PF 139 1270429 A groove into which the ridges 6〇2c of the substrate 602 are fitted is formed. Then, the substrate 602 is covered by the spacer jigs 6 〇7 of the respective fins 6 〇β. In this state, the substrate 6〇 The surface 6〇2b of 2 (the lower surface in the drawing) is in contact with the base end portion of the fin constituent β〇β, but not The spacer 607a of the spacer jig 607 is in contact. Similarly, the lower surface of the rib 602c of the substrate (10) 2 is in contact with the fins β 〇 3 of the recess 606a of the fin constituent member 6 〇 6 without the spacer The spacer _ 607a of the jig 6 is in contact with each other. However, the width of the rib 602c of the substrate 602, the width of the concave portion 606a of the fin constituent material 606, and the width of the concave portion 6〇7c of the spacer jig 6〇7 are mutually The two are substantially equal, so the ridges of the substrate 6〇2 are Μ. The function of the position determining unit that accurately determines the relative position of the substrate 602 and the fin constituent material 6〇6 in the width direction, and even the position of the width of the fin constituent material (10)6 between the two sides is determined. Next, as shown in Fig. 83B, the circumferential surface of the joint body of the joint jig 6〇8 which is rotated in the circumferential direction and at a high speed by the yoke of the rotating shaft 6 is vertically pressed to the surface 6 of the substrate 602. 2a, and by frictionally engaging the fin constituents 606 with the substrate 602 by moving the bonding fixture 603 along a surface 602a of the substrate 602 at a predetermined rate of travel. The 608 is fixed to the front end portion of the rotating shaft 608b by a disc-shaped jig body Mg, and the jig main body 608a is composed of Jis: SKD61 and the like. The traveling side J'/the table piece I# 608a when the surface 6〇2a of the substrate 602 is press-fitted is rotated in the direction of the rearward direction, and is rotated along the periphery of the rotating shaft (9). As shown in Fig. 84B, the state of the surface of the surface 602a of the substrate 602 is rapidly rotated at a high speed, and the surface 602a of the substrate 602 is 2036-5808B-PF 140 1270429. mobile. By pressing the substrate body 6〇8a on the substrate 602, the gap between the base end portion 6〇3 a of the fin constituent material β 〇6 and the substrate 602 disappears; and by high speed rotation The vibration generated by the contact between the jig body 6 08a and the substrate 602 splits and breaks the oxide film at the interface between the base end portion 603a of the fin constituent material 6〇6 and the substrate 602, and is in contact with the jig body 608a. The predetermined area of the substrate 602 and its adjacent area, and the predetermined area of the base end portion 6〇3a adjacent to the above-mentioned area, are heated by the heat generated by the frictional contact between the jig body 60 8a and the substrate 602, and the substrate is made high. 602 (copper) and a portion of the base end portion 6〇3a (aluminum) connected thereto are eutectic melted. The above result results in the formation of a eutectic layer 609 between the substrate 6〇2 and the base end portion 603a. Then, the bonding body 608a of the bonding jig 6〇8 is cooled by the rear, and the base end portion 6 0 3a of the fin constituent member 6〇6 and the substrate 602 are joined by the eutectic layer 6〇9. In the surface 602a of the substrate 602, the jig body 6〇3a exerts a compressive stress on the surface 6〇2a and passes through the remaining traces, preferably through the cutting of the post-process to form a smooth surface. In this way, the substrate 602 and the fin constituents 6〇6 are respectively made of copper and the like. “Because the bonding fixture 608 is connected to the side of the copper substrate 6〇2 whose melting point is higher than that of the copper substrate 6〇2, the tab constituent material 606 When the overlapping portion of the base end portion 603a and the substrate 602 reaches a temperature necessary for bonding (the eutectic temperature of copper to aluminum is 5" or more), the substrate 602 can maintain a relatively large deformation strength, and can be obtained from the bonding fixture. The pressure of _ is fully conveyed to the interface, and when the two are positively connected to the substrate 2, the ridges 6〇2c do not cause trouble, and the height/space ratio of the Korean 603 is made. And ribs

2036-5808B-PF 141 1270429 602c的形狀等可以自由地設定。 最後,如第85圖所示,僅僅將基板602由間隔物治具 向上移動’就可以將已經在基板6 0 2上立設接合各鰭片構 成材606的散熱元件601A取出。 接下來說明散熱元件6 01A的製造方法的其他例子。 首先如第86A圖所示,將一鋁合金製的薄板材6〇3,The shape and the like of 2036-5808B-PF 141 1270429 602c can be freely set. Finally, as shown in Fig. 85, only the substrate 602 is moved upward by the spacer jig, and the heat dissipating member 601A which has been erected to the respective fin members 606 on the substrate 602 can be taken out. Next, another example of the method of manufacturing the heat dissipating element 610A will be described. First, as shown in Fig. 86A, a thin plate made of aluminum alloy is 6〇3,

的中央部與一間隔物61 0直交配置,使二者成為倒τ字型, 如第86B圖所示,在斷面凹字型鰭片構成材製造治具611 的中央部的溝槽内,將板材603,彎折,並將其中央部壓 入的同時插入間隔物610,而如第86C圖所示,於中央部 的溝槽内形成將間隔物610夾在中間的斷面凹字型的鮮片 構成材606。鰭片構成材606係以一對的鰭片6〇3與連結 上述鰭片603的基端部603a而形成其斷面凹字型。 而準備複數個如上所述之在一對的鰭片6〇3之間置入 間隔物610的鰭片構成材606,將上述各鰭片構成材 與各間隔物610’交互並列,並如第86D圖所示,立設配 置於散熱元件製造用治具61 2的元件設定部β丨2a。此時的 鰭片構成材606係為在一對的鰭片6〇3間 鬥^ 61 0的狀悲、且為基端部β 〇 3 a向上的狀態。又,置、 入於各 鰭片構成材606相互之間的各間隔物61〇,的高度係言於 置入於一對的鰭片603之間的間隔物61〇,且較好為:者 的高度差僅僅是基端部6〇3a的厚度’而使轉片構成材咖 的基端部603a與間隔.物6Η,.的基端.部形成水 '的上表 面。 2036-5808B-PF 142 1270429 之後’如第86E圖所示,於立設配置於元件設定部612a 的各籍片構成材606與各間隔物610,的上面搭載基板6〇2 、、、口疋工具613將其固定。此處將鰭片構成材的基 化4 603a及間隔物6丨〇’形成與基板602的表面6〇2b接 觸的狀態。 接下來如第87A圖所示’將以轉動軸608b為中心以圓 周方向同速轉動的接合治具608的治具本體608a的圓周面 _ 垂直壓至基板602之表面602a,並使接合治具6〇8沿著基 板602之表面602a移動,而使各鰭片構成材6〇6的基端部 603a摩擦震動接合於基板406。 最後,如第87B圖所示,將基板β〇2向上移動時,僅 有已接合於基板6〇2的各鰭片構成材6〇6 一起向上移動, 而將各間隔物610、61〇,留在散熱元件製造用治具612的 元件設定部612a,可以將散熱元件61〇Α取出,其中散熱 兀件610Α中,係將複數個鰭片6〇3介由鰭片構成材的 _ 基端部603而立設接合於基板6〇2的表面6〇2b。 接下來說明本發明散熱元件的其他實施型態。 如第88A圖所示,第二實施型態的散熱元件6〇ΐβ,其 基板602的凸條602c受到長度方向的分割,其他均和第一 實施型態相同。凸條602c如此受到長度方向的分割時,由 CPU 6G5傳達熱里的路徑在到達末端的鰭片之前就被 刀斷u其放熱性能比起凸條6〇2〇在長度方向連續的第 只訑5L心差其放熱性能v仍比無凸條# 元件高。The central portion is disposed orthogonally to a spacer 610, so that the two are inverted τ-shaped, as shown in Fig. 86B, in the groove at the central portion of the cross-sectional concave fin constituent material manufacturing jig 611, The plate member 603 is bent, and the spacer 610 is inserted while being pressed in the center portion thereof, and as shown in Fig. 86C, a cross-sectional concave type in which the spacer 610 is sandwiched is formed in the groove at the center portion. Fresh piece 606. The fin constituent material 606 has a pair of fins 6〇3 and a base end portion 603a that connects the fins 603 to form a cross-sectional concave shape. And a plurality of fin constituents 606 in which the spacers 610 are placed between the pair of fins 6〇3 as described above, and the fin constituents are alternately arranged with the spacers 610', and are As shown in Fig. 86D, the element setting unit β丨2a disposed on the jig 61 2 for heat dissipation element mounting is erected. At this time, the fin constituent material 606 is in a state in which the pair of fins 6〇3 are in a state of coma and the base end portion β 〇 3 a is upward. Further, the height of each of the spacers 61 置 between the fin members 606 is a spacer 61 置 placed between the pair of fins 603, and preferably: The height difference is only the thickness ' of the base end portion 6〇3a', and the base end portion 603a of the rotor constituting material and the base portion of the spacer. 2036-5808B-PF 142 1270429 After that, as shown in Fig. 86E, the substrate 6〇2 and the port are mounted on the upper surface of each of the individual component members 606 and the spacers 610 disposed in the component setting unit 612a. The tool 613 fixes it. Here, the base 4 603a of the fin constituent material and the spacer 6丨〇' are brought into contact with the surface 6〇2b of the substrate 602. Next, as shown in Fig. 87A, 'the circumferential surface _ of the jig body 608a of the jig 608 which is rotated at the same speed in the circumferential direction around the rotating shaft 608b is pressed perpendicularly to the surface 602a of the substrate 602, and the jig is attached. 6〇8 moves along the surface 602a of the substrate 602, and the base end portion 603a of each fin constituent member 6〇6 is frictionally and vibrated to the substrate 406. Finally, as shown in FIG. 87B, when the substrate β〇2 is moved upward, only the fin constituents 6〇6 that have been bonded to the substrate 6〇2 move upward together, and the spacers 610 and 61 are turned, The heat dissipating component 61 can be removed from the component setting portion 612a of the heat dissipating component manufacturing jig 612. The heat dissipating component 610 is configured to pass a plurality of fins 6〇3 through the fin base material. The portion 603 is erected to the surface 6〇2b of the substrate 6〇2. Next, other embodiments of the heat dissipating member of the present invention will be described. As shown in Fig. 88A, in the second embodiment of the heat dissipating member 6??, the rib 602c of the substrate 602 is divided in the longitudinal direction, and the others are the same as in the first embodiment. When the rib 602c is divided in the longitudinal direction as described above, the CPU 6G5 communicates that the path in the heat is cut off before reaching the fin at the end, and the heat release performance is longer than the ridge 6〇2〇 in the longitudinal direction. The 5L heart rate has a higher exothermic performance v than the no-bump # component.

2036-5808B-PF 143 1270429 如第88B圖所示,第三實施型態的散熱元件6〇ic,其 基板602的凸條6〇2c係形成為與各鰭片6〇3呈斜交的方 向,其他均和第一實施型態相同。凸條602c的方向如此與 各.韓片603呈斜交時,在維持基板6〇2原重量的情況下凸 條602c的斷面面積會變小,而使其散熱性能比凸條Μ。 與各韓片6G3成直交的第—實施型態差,但是其散熱性能 仍比無凸條602c的習知的散熱元件高。 第89A圖所示的第四實施型態的散熱元件6〇id、第8祁 圖所示的第五實施型態的散熱元件6〇1E、第89c圖所示的 =實施型態的散熱元件_中,其凸條_的斷面形 :別為梯形、二角形、與圓頂形(d_),三者的凸條 疋距離基板602的本體愈遠則其寬度愈小2036-5808B-PF 143 1270429 As shown in Fig. 88B, in the heat dissipating element 6〇ic of the third embodiment, the ridges 〇2c of the substrate 602 are formed in a direction oblique to the fins 6〇3. Others are the same as the first embodiment. When the direction of the rib 602c is oblique to each of the Korean 603 pieces, the cross-sectional area of the rib 602c is reduced while maintaining the original weight of the substrate 〇2, and the heat dissipation performance is higher than that of the ridges. The first implementation type which is orthogonal to each Korean 6G3 is inferior, but its heat dissipation performance is still higher than that of the conventional heat dissipation element without the rib 602c. The heat dissipating element 6 〇 id of the fourth embodiment shown in FIG. 89A, the heat dissipating element 6 〇 1E of the fifth embodiment shown in FIG. 8 , and the heat dissipating element of the embodiment type shown in FIG. 89 c In _, the sectional shape of the ridge _ is not trapezoidal, square, and dome-shaped (d_), and the smaller the ridge of the three is from the body of the substrate 602, the smaller the width is.

的斷面形狀為長方形的情況,特別是如^m/6〇2C 符別疋如前唬的方向由侧邊 扇作強制冷卻時,其壓力損失較小。 板j9°Affl所示的第七實施型態的散熱元件咖,其基 板602的凸條6〇2c的厚度 、土 俜m +度維持-定’而凸條602c的寬度 係形成為··由盥CPU 605技_ k 的長声方6 接觸的相對位置開始,向凸條602c 幻食度方向,距離愈遠則凸命 均和第一者&amp;別% 4 〇 2C的寬度逐漸縮減;其他 乐 錢施型態相同。 苐90B圖所示的第八警 板602的凸條6〇2的〜 ' 恶的散熱元件601H’其基 俜带成A 维持—定,而凸條602c的厚度 係形成為:由與CPU 605接 予又 ^fin9 ^ f ^ ^ ^ 602^ 均和第 ^ 、 2 C的厚度逐漸縮減;其他 J和弟~實施型態相同。 -^In the case where the cross-sectional shape is a rectangular shape, especially when the direction of the front side of the ^m/6〇2C is forcibly cooled by the side fan, the pressure loss is small. In the heat dissipating component of the seventh embodiment shown by the plate j9°Affl, the thickness of the ridges 〇2c of the substrate 602 and the soil m+ degree are maintained constant, and the width of the ribs 602c is formed by盥 CPU 605 technology _ k the relative position of the long-sounding party 6 contact begins, toward the convexity of the rib 602c, the farther the distance is, the convexity is equal to the first one &amp; the width of the other 4% 〇 2C is gradually reduced; Le Qian is the same type. The 散热 的 〇 〇 〇 〇 第八 第八 第八 第八 第八 第八 第八 第八 第八 第八 第八 第八 第八 第八 第八 第八 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 The thickness of ^^9^f^^^ 602^ and the thickness of ^^ and 2C are gradually reduced; the other J and the brothers are the same. -^

2036-5808B-PP 144 1270429 第90C圖所示的第为♦ 叔β 焉知型態的散熱元件6 011,直基 板602的凸條602c的宽 ,、暴 μ 見度及厚度係形成為··由與CPU 6〇5 接觸的相對位置開始,向 m π ,ΛΟ 條602c的長度方向,距離愈遠 幻凸條602c的寬度及厚声 ^ 又均逐漸縮減,且凸條602c全體 係形成為圓頂形狀;其他 ,、他杓和第一實施型態相同。 由於傳至基板6 〇 2的執吾e碎4 ^ i …、里疋^者距離CPU 605愈遠而 I小,依據此熱量分佈愔形卜、』、 曰 八‘減凸條6〇2c的斷面積在學理2036-5808B-PP 144 1270429 The heat dissipating element 6 011 of the first and second β 焉 焉 第 第 , , , , , , , , , , , 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 602 Starting from the relative position of contact with the CPU 6〇5, to m π , the length direction of the beam 602c, the farther the distance is, the width and thickness of the spur 602c are gradually reduced, and the rib 602c is formed into a circle. Top shape; other, he is the same as the first embodiment. Since the transfer to the substrate 6 〇 2 is broken 4 ^ i ..., the distance from the CPU 605 is smaller than I, and the heat distribution is based on the heat distribution, 』, 曰八' reduction convex strip 6〇2c Break area in theory

上疋適高的’因此卜i/ft ίΛ Ml jj,— 上述的放熱兀件601G〜6〇1U可以實行效 率更高的散熱。 又’弟9U圖所示的第十實施型態的散熱元件601J, 不使用鰭片構成材60 6,而將各鰭片6〇3直接立設接合於 基板602,其他均和第一實施型態相同。 更者’第91B圖所不的第十一實施型態的散熱元件 6〇1Κ’各鰭片603分別在其寬度方向分割為三而立設接合 於基板602,其他均和第一實施型態相同。當然將各錯片 • 構成材分別在其寬度方向分割而構成者亦可。 而本發明之散熱元件及其製造方法並不限定於以上所 述者,當然可以作適宜地變更而為實施。例如,凸條6〇2c 不僅僅致有一列,亦可以有複數列。又,凸條6〇2並不一 疋要與基板602的本體一體成形’亦可以另外形成之後再 固疋於基板602的本體。基板602與鰭片603的材質亦可 以分別變更為銅與鋁以外的材質。散熱片的有無及其尺 寸、形狀亦可以任意變更’亦可以使脅導,熱,管等介 發熱體的CPU 605與基板602之間而將二者接續。 2036-5808B-PF 145 1270429 更者,基板602與鰭片603的接人 擦震動接合中,接合治I 6。8的行 盘:所舉例的摩 合條件可以任意決定,接合方法圍”料方向等接 的接合治具壓入熔點較高的金屬側不:定於將轉動 的摩擦應應力傳達至金屬元件::交:由此產生 式,亦可以是使用電磁誘導由溶點較高的全=接觸方 金屬元件間的交界面加熱及加屋等的非接=件之側對The upper 疋 i 因此 因此 因此 i i i i i i i 因此 因此 — — 上述 上述 601 601 601 601 601 601 601 601 601 601 601 601 601 601 601 601 601 601 601 601 601 601 601 Further, in the heat dissipation element 601J of the tenth embodiment shown in FIG. 9U, the fins 6〇3 are directly erected and bonded to the substrate 602 without using the fin constituents 606, and the other is the first embodiment. The state is the same. Further, in the eleventh embodiment of the eleventh embodiment, the fins 603 are respectively divided into three in the width direction and are erected and bonded to the substrate 602, and the others are the same as the first embodiment. . Of course, it is also possible to divide each of the erroneous pieces and the constituent materials in the width direction thereof. Further, the heat dissipating member of the present invention and the method of manufacturing the same are not limited to those described above, and of course, it can be appropriately modified and implemented. For example, the ribs 6〇2c may have not only one column but also a plurality of columns. Further, the ridges 6〇2 are not integrally formed with the body of the substrate 602, and may be separately formed and then fixed to the body of the substrate 602. The material of the substrate 602 and the fins 603 may be changed to materials other than copper and aluminum. The presence or absence of the heat sink, its size, and shape may be arbitrarily changed. Alternatively, the CPU 605 and the substrate 602 of the heat generating body may be connected to each other. 2036-5808B-PF 145 1270429 Moreover, in the joining and squeezing engagement of the substrate 602 and the fin 603, the aligning condition of the splicing treatment I 6. 8 can be arbitrarily determined, and the joining method is surrounded by the material direction. The equal joint jig is pressed into the metal side with a higher melting point. No: the frictional stress to be transmitted is transmitted to the metal component:: cross: the resulting formula, or the electromagnetic induction by the higher melting point = side of the interface heating between the contact metal components and the non-contact parts of the house

如基請與鰭…為銅時,較好為=;的, 界面置入…更者,亦可以使用填隙接合=: joint)、接著劑、或銲接接合等 g 韓片603接合。 方法將基板602與 構二===的散熱Μ上裝設風扇’而 a列如,如第92Α圖所示的散熱器6m,風扇614 散熱凡件6G1A的上方將風送至各散熱鰭片603;亦可以θ ΓΙΓ圖所示的散熱器62°Β,風扇614係由散熱元: 601Α的側邊將風送至各散熱鰭片6〇3。 :=614的裝設方法與風的方向並無限定,散熱器 勺袭°又較好為依照裝設空間等因素作適宜的設定。 實施例1 以模擬的 的有無而變化 條的散熱元件 resistance) °For example, if the base and the fin are copper, it is preferably =; the interface is placed. Alternatively, the gap splicing =: joint), the adhesive, or the solder joint may be used. The method comprises: mounting the fan 602 on the heat dissipation raft of the substrate 602 and the frame ===, and arranging, for example, the heat sink 6m as shown in FIG. 92, and sending the wind to the heat dissipation fins above the fan 614 heat dissipation member 6G1A. 603; The heat sink 62 is also shown in the figure θ, and the fan 614 is sent to the heat sink fins 6〇3 by the side of the heat sink: 601Α. The installation method of :=614 is not limited to the direction of the wind, and the heat sink scooping angle is preferably set according to factors such as the installation space. Embodiment 1 Variation of the heat dissipation element of the strip with the presence or absence of the simulation resistance)

方式測試散熱元件的散熱性能,如何因凸條 。具體而言,準備無凸條的散熱元件與有凸 ’分別求出在自,餘杳V 而個別的基板之斷面積是相等的。有凸條的 2036-5808B-pp 146 1270429 散熱元件中,凸條係沿基板的長度方向呈連續的狀態,凸 條的斷面積沿著其長度方向維持一定。基板為銅製、鰭片 為鋁製。鰭片依照第91A圖所示的樣態逐一立設接合於基 板。各樣品(sample)的斷面形狀緣示於第93A、93B圖,顯 示模擬結果的長條圖顯示於第93C圖。又,實驗數據列於 表八0 表八因凸條的有無所導致熱抵抗的不同(自然對流) 基板 鰭片 全高 (mm) 最南 溫度 (°C) 熱抵抗 (°C/W) 本體 寬度 W(mm) 本體 長度 L(mm) 本體 厚度 t(mm) 凸條 寬度 Ws(mm) 凸條 長度 Ls(mm) 凸條 厚度 ts(ram) 斷面積 (mm2) 間隔 (mm) 數量 1-1 無凸條 50 50 2.00 — — — 100 1.3 30 11.5 449 5.90 1-2 有凸條 1.10 15 50 3 420 5.49 由第93C圖的長條圖可以瞭解,在自然對流下,有凸 條的樣品1-2,與無凸條的樣品1-1比較,雖然有相同的 基板斷面積,其熱抵抗大幅地降低。亦即,散熱元件的重 量不變而能夠提高散熱性能,換言之,可以瞭解在不使散 熱性能降低的情況下而達成輕量化。 實施例2 與實施例1相同,以模擬的方式測試有散熱元件的散 熱性能,如何因凸條的有無而變化。但是,實施例1是在 自然對流下所作的模擬;在實施例2中,係使用風扇由上 方(由鰭片至基板的方向)吹送3m/s的風,將鰭片強制冷 卻。散熱元件的散熱性能的指標,不僅僅是熱抵抗,亦求 出壓力損失。其他則與實施例1相同。顯示模擬結果的長 條圖繪示於第94A、94B圖中。又。,赛驗數,據列於表九。 表九因凸條的有無所導致散熱性能的不同(由上方強制冷卻) 2036-5808B-PF 147 1270429The way to test the heat dissipation performance of the heat sink is how the ribs are. Specifically, it is prepared that the heat dissipating elements having no ridges and the convex portions are respectively obtained, and the area of the individual substrates is equal to each other. 2036-5808B-pp 146 1270429 with ribs In the heat dissipating component, the ribs are continuous along the longitudinal direction of the substrate, and the broken area of the ribs is maintained constant along the length direction. The substrate is made of copper and the fins are made of aluminum. The fins are erected to the substrate one by one in accordance with the pattern shown in Fig. 91A. The cross-sectional shape of each sample is shown in Figs. 93A and 93B, and the bar graph showing the simulation results is shown in Fig. 93C. Also, the experimental data is listed in Table VIII. Table 8: Difference in thermal resistance due to presence or absence of ridges (natural convection) Substrate fin height (mm) Southern temperature (°C) Thermal resistance (°C/W) Body width W (mm) Body length L (mm) Body thickness t (mm) Bar width Ws (mm) Bar length Ls (mm) Bar thickness ts (ram) Area (mm2) Interval (mm) Quantity 1-1 No rib 50 50 2.00 — — — 100 1.3 30 11.5 449 5.90 1-2 with ribs 1.10 15 50 3 420 5.49 It can be seen from the bar graph of Fig. 93C that under natural convection, samples with ribs 1 - 2. Compared with the sample 1-1 without the ridges, the thermal resistance was greatly reduced although the same substrate sectional area was obtained. That is, the weight of the heat dissipating member is constant, and the heat dissipating performance can be improved. In other words, it can be understood that the weight reduction can be achieved without deteriorating the heat dissipation performance. [Embodiment 2] As in Embodiment 1, the heat dissipation performance of the heat dissipating member was tested in an analog manner, and it was changed depending on the presence or absence of the ridge. However, Embodiment 1 is a simulation performed under natural convection; in Embodiment 2, a fan is used to blow a wind of 3 m/s from the upper side (from the direction of the fin to the substrate) to strongly cool the fin. The index of heat dissipation performance of the heat dissipating component is not only thermal resistance but also pressure loss. Others are the same as in the first embodiment. A bar graph showing the simulation results is shown in Figures 94A and 94B. also. The number of matches is shown in Table 9. Table 9 shows the difference in heat dissipation performance due to the presence or absence of ridges (forced cooling from above) 2036-5808B-PF 147 1270429

Sfe -- 絲片 全高 (mm) 最南 溫度 (°C) 熱抵抗 (°C/W) 壓力 損失 (Pa) 本體 寬度 W(mm) 本體 長度 L(mm) 本體 厚度 t(mm) 凸條 寬度 ffs(mm) 凸條 長度 Ls(mm) 凸條 厚度 ts(mm) 斷面積 (mm2) 間隔 (mm) 數量 2-1無凸條 50 107 2. 00 — — — 100 1.3 78 11.5 52.0 10. 38 31 2-2有凸條 1.10 15 107~ 3 50.1 0.35 33 由第9 4 A圖的長條圖可以瞭解,在風扇由上方作強制 冷卻的情況下,有凸條的樣品2-2,與無凸條的樣品2-1 比較,雖然有相同的基板斷面積,其熱抵抗較低。又,由 第94B圖的長條圖可以瞭解,有凸條的樣品2-2的壓力損 失,與無凸條的樣品2-1的壓力損失約略相同。因此,藉 ® 由凸條的形成,散熱元件的重量不變而能夠提高散熱性 月b ’換S之’可以瞭解在不使散熱性能降低的情況下而達 成輕量化。 實施例3 與實施例2相同,以模擬的方式測試散熱元件的散熱 性能,如何因凸條的有無而變化。但是,在實施例2中, 係使用風扇由上方(由鰭片至基板的方向)吹送風,將鰭片 _ 強制冷卻;而在實施例3中,係使用風扇由侧方(由鰭片的 寬度方向)吹送3m/s的風,將鰭片強制冷卻。其他則與實 施例2相同。各樣品(sampie)的斷面形狀繪示於第95a〜95c 圖,顯示模擬結果的長條圖繪示於第95D、95E圖中。又, 貫驗數據列於表十。 ^士因凸條有無所導致散熱性能的不同(由側方強制冷卻) 基板 錯片 全高 (mm) 最高 溫度 (°C) 熱抵抗 (°C/W) 壓力 損失 (Pa) 本體 寬度 W(mm) 本體 長度 L(mm) 本體 厚度 t(mm) 凸條 寬度 Ws(mni&gt; 凸條 長度 Ls(mm) 凸條 厚度 斷面積 (mm2) 間隔 (mm) 數量 3~&quot;l|無凸條 50 107 2.00 — 一 100 1.3 78 11.5 54.8 0. 41 67 2036-5808B-PF 148 1270429 (梯形)Sfe -- Full height of the wire (mm) Southern temperature (°C) Thermal resistance (°C/W) Pressure loss (Pa) Body width W (mm) Body length L (mm) Body thickness t (mm) Bar width Ffs(mm) rib length Ls (mm) rib thickness ts (mm) sectional area (mm2) interval (mm) number 2-1 without ridges 50 107 2. 00 — — — 100 1.3 78 11.5 52.0 10. 38 31 2-2 with ribs 1.10 15 107~ 3 50.1 0.35 33 From the bar graph of Figure 9 4 A, it can be seen that in the case of forced cooling of the fan from above, samples 2-2 with ribs, and none The sample 2-1 of the ribs has a lower thermal resistance despite the same substrate cross-sectional area. Further, as can be seen from the bar graph of Fig. 94B, the pressure loss of the sample 2-2 having the ridges was approximately the same as the pressure loss of the sample 2-1 having no ridges. Therefore, by the formation of the ridges, the weight of the heat dissipating member can be made constant, and the heat dissipation can be improved, and it can be understood that the heat dissipation performance is reduced without reducing the heat dissipation performance. Embodiment 3 As in Embodiment 2, the heat dissipation performance of the heat dissipating member was tested in an analog manner, and how it was changed due to the presence or absence of the ridges. However, in Embodiment 2, the fan is blown by the wind from above (in the direction from the fin to the substrate) to forcibly cool the fins; and in Embodiment 3, the fan is used from the side (by the fins) In the width direction, 3 m/s of wind is blown to forcibly cool the fins. Others are the same as in the second embodiment. The cross-sectional shape of each sample (sampie) is shown in Figs. 95a to 95c, and the bar graph showing the simulation results is shown in Figs. 95D and 95E. Also, the inspection data is listed in Table 10. ^Because of the presence or absence of the ribs, the heat dissipation performance is different (forced cooling by the side). Substrate error height (mm) Maximum temperature (°C) Thermal resistance (°C/W) Pressure loss (Pa) Body width W (mm) Body length L (mm) Body thickness t (mm) Bar width Ws (mni> rib length Ls (mm) ridge thickness break area (mm2) Interval (mm) Quantity 3~&quot;l|No rib 50 107 2.00 — a 100 1.3 78 11.5 54.8 0. 41 67 2036-5808B-PF 148 1270429 (trapezoidal)

53. βΙ 〇. 40 91 1 1 53.1 〇. 39 84 卜 y、勞,在風屬由側方作強u 广:的情況下,有凸條的樣品3〜,與無凸條j! 凸:較,雖然有相同的基板斷面積,其熱抵抗較低。:: :的斷面形狀為梯形的樣…的熱抵抗,小於凸條的 _面形狀為長方形的樣品3 — 2。 3 2 由第^圖的長條圖可以瞭解,有凸條的樣品 的差力損失’較無凸條的樣品3-!的麗力損失大。 :凸條的斷面形狀為梯形的樣品3_3的屡力賴失 凸 條的斷面形狀為長方形的樣品3-2。 、 由以上的結果,可以瞭解在形成凸條的情形下,由側 冷卻時’㈣失變大而熱抵抗變小。因此,適 =:周=扇的性能等’使遷力損失對散熱元件的散熱性 小於熱抵抗的影響時’藉由凸條的形成,散熱元 1不變而能夠提高散熱性能;換言之,可以瞭解在 ;使;熱性能降低的情況下而達成輕量化…在此情況 並寬^瞭解到較好為使凸條的斷面形狀,離基板愈遠則 /、寬度愈小(請參考第89A〜89C圖)。 實施例4 二模擬的方式測試有凸條的情況下,散熱元件的散熱 '何因凸條的形狀與尺寸而變化。分別使用如第95、 95B圖所示形狀的散熱元件作·實雜‘其53. βΙ 〇. 40 91 1 1 53.1 〇. 39 84 Bu y, labor, in the case where the wind is made by the side of the strong u wide: the sample with the ribs 3~, and the no convex strip j! convex: Although it has the same substrate cross-sectional area, its thermal resistance is lower. :: : The cross-sectional shape of the trapezoid is... the thermal resistance is smaller than the sample 2-3 of the rectangular shape of the rib. 3 2 From the long bar graph of Fig. 2, it can be understood that the differential loss of the sample with the ridges is larger than that of the sample without the ridges 3-! : The cross-sectional shape of the sample 3_3 in which the cross-sectional shape of the ridge is trapezoidal is reduced. The cross-sectional shape of the ridge is a rectangular sample 3-2. From the above results, it can be understood that in the case where the ridges are formed, when the side is cooled, the '(4) is large and the heat resistance is small. Therefore, the appropriate =: week = the performance of the fan, etc., when the heat loss of the heat-dissipating component is less than the heat resistance of the heat-transfer element, the heat-dissipating element can be improved by the formation of the ridges; in other words, Understand the light weight in the case of lowering the thermal performance. In this case, it is better to know that the cross-sectional shape of the ridge is better, and the smaller the width from the substrate, the smaller the width (please refer to the 89A). ~89C picture). Embodiment 4 In the case of testing a rib with a two-simulation method, the heat dissipation of the heat dissipating member changes depending on the shape and size of the ridge. Using a heat dissipating member having the shape shown in Figs. 95 and 95B, respectively,

例3相同。I貝示模擬結果的折線㈣示於第9 6、9 ]7圖^ 2036-58 08B-PF 149 1270429 又,實驗數據列於表十一。 「参一因形狀、導致散熱性能的不同(由側方強制冷卻) 4-1 本體 寬度 W(mm) 本體 長度 L(mm) 本體 厚度 t(mm) 凸條 寬度 Ws(mm) Q ΠΠ 基板 凸條 長度j Ls(mm) 凸條 厚度 ts(mm) 凸條 輪廓比 斷面積 (mm2) 鰭 間隔 (mm) 片 數量 全1¾ (mm) 最高 溫度 (°〇 熱抵抗 (°C/W) 壓力 損失 (Pa) 1 1 4-2 y· uu 11.25 5.0 4. 0 1.8 2. 8 53.93 0.402 125 4-3 Rfi 107 1 1 π 15.00^ 3. 〇 5. 0 53. 46 p- π λ 0. 395 105 4-4 JU 1. 1 U 22. 50 107 2. 〇 11 3 100 1.3 78 11.5 53. 64 394 91 4-5 37.50^ 1.2 31. 3 53. 62 0.397 79 4-6 45.00 1.0 45.0 54.16 55. 02 0. 405 0.417 77 79 由苐Μ 97圖的折線圖可以瞭解,凸條的輪靡比設定 在5 3 0時或疋凸條厚度為1 · 1 5mm〜3 · 4 5mm時,熱抵抗小、 壓力損失亦未明顯變大。亦即,可以得知凸條的輪廓設定 為5〜30時、或是凸條厚度/散熱元件的全高之比設定為 0. 1〜0· 3時’可以得到較佳平衡的散熱性能。 在最後,說明以上所述摩擦震動接合方法的應用例。 而以下的應用中所謂的「銅」、「鋁」係分別才旨「銅或銅 合金」、「鋁或鋁合金」;「鋁箔」係指「由鋁或鋁合金 馨 構成的『箔』或薄板」。 第98圖所示的第一應用例,係將鋁箔7〇3夾在二銅板 701、702之間並全面地重合,將接合治具7〇4壓至銅板7〇ι 的外側面。亦即,將以轉動軸7〇41)為中心以圓周方向高速 轉動的治具本體704a的圓周面垂直壓至鋼板7〇1之表面, 並使治具本體704a沿著銅板701之表面以一既定的行進速 率移動如此來,藉由與治具本體704a的摩擦接觸熱將 銅板701高溫化,使與銅版,m接觸應 將其冷卻後得到共晶層介於銅板7〇1與銅板7〇2之間而將 2036-5808B-PF 150 1270429 二者接合。 第99圖所示的第二應用例,係將第二銅板702相對於 第一銅板701呈現約略τ字型而直交配置,將接合治具7〇4 壓至銅板701的外侧面。此時因為銅板7〇1與銅板7〇2之 間亦夾有铭箔703,可以將銅板70丨與銅板702接合。 第1 00圖所示的第三應用例,係將銅板7〇丨的一部分 與紹板705的一部分重合配置,藉由接合治具7〇4由熔點 • 較高的銅板7 〇 1之側作用至二者的重合部,而在重合部形 成共晶層,將銅板7 01與鋁板7 〇 5接合。 第101圖所示的第四應用例,係將鋁板7〇5直交配置 於銅板701 ’其他的情況皆與第三應用例相同。 第102A、102B圖所示的第五應用例,係將銅板7〇1與 紹板705形成為一片板材。在第i〇2a圖中,在銅板7〇1的 端部形成有嵌合凸部701a與嵌合凹部701b,在鋁板705 的端部形成有嵌合凸部705a與嵌合凹部705b。將嵌合凸 ® 部701a喪入喪合凹部705b、將嵌合凸部7〇5a嵌入嵌合凹 部701b。亦即,銅板701與鋁板7〇5係以槽口相接(ship]Lap joint)的形式相互嵌合,而構成一片板材。而後,藉由接 合治具704由熔點較高的銅板7〇1之嵌合凸部7〇la之側作 用至二者的嵌合部,而接合銅板701與鋁板705。另外, 在第102B圖中,在銅板7〇1的端面及鋁板7〇5的端面分別 成為相互逆向的斜面。亦即,在此處銅板7〇1的端面為向 下的斜面、而紹板7〇5的端面為向上的斜面。之後,將使 斜面接觸配置後,藉由接合治具704由熔點較高的銅板701 2036-5808B-PF 151 1270429 之侧作用至斜面部,而 片板材。 而接合銅板701與鋁板 7 〇 5,構成一 第103A、103B圖所示 示的第六應用例,係將銅板7 〇 1與Example 3 is the same. The fold line (I) of the simulation results of I be shown in Fig. 9 is shown in Fig. 9 6 and 9] Fig. 2 2036-58 08B-PF 149 1270429 Further, the experimental data is shown in Table 11. "The difference in shape depends on the heat dissipation performance (forced cooling by the side) 4-1 Body width W (mm) Body length L (mm) Body thickness t (mm) Bar width Ws (mm) Q 基板 Substrate convex Strip length j Ls (mm) rib thickness ts (mm) rib profile area (mm2) fin spacing (mm) number of sheets total 13⁄4 (mm) maximum temperature (° 〇 heat resistance (°C / W) pressure loss (Pa) 1 1 4-2 y· uu 11.25 5.0 4. 0 1.8 2. 8 53.93 0.402 125 4-3 Rfi 107 1 1 π 15.00^ 3. 〇 5. 0 53. 46 p- π λ 0. 395 105 4-4 JU 1. 1 U 22. 50 107 2. 〇11 3 100 1.3 78 11.5 53. 64 394 91 4-5 37.50^ 1.2 31. 3 53. 62 0.397 79 4-6 45.00 1.0 45.0 54.16 55. 02 0. 405 0.417 77 79 According to the line drawing of Fig. 97, it can be understood that when the rim ratio of the ridge is set at 5 3 0 or the thickness of the ridge is 1 · 1 5 mm~3 · 4 5 mm, the heat resistance is small, The pressure loss is also not significantly increased. That is, it can be known that the contour of the ridge is set to 5 to 30, or the ratio of the thickness of the rib/the total height of the heat dissipating component is set to 0. 1~0·3 when Better balanced heat dissipation Finally, an application example of the above-described frictional vibration bonding method will be described. In the following applications, the so-called "copper" and "aluminum" are respectively intended to be "copper or copper alloy", "aluminum or aluminum alloy"; “Foil” or “sheet” made of aluminum or aluminum alloy. The first application example shown in Fig. 98 is to sandwich the aluminum foil 7〇3 between the two copper plates 701 and 702 and completely overlap. The joining jig 7〇4 is pressed to the outer side surface of the copper plate 7〇. That is, the circumferential surface of the jig body 704a which is rotated at a high speed in the circumferential direction around the rotating shaft 7〇41) is vertically pressed to the steel plate 7〇1 The surface of the jig 704a is moved along the surface of the copper plate 701 at a predetermined traveling rate. The copper plate 701 is heated by the frictional contact heat with the jig body 704a, so that contact with the copper plate, m should be After cooling, a eutectic layer is obtained between the copper plate 7〇1 and the copper plate 7〇2 and the 2036-5808B-PF 150 1270429 is joined. In the second application example shown in Fig. 99, the second copper plate 702 is disposed approximately orthogonally with respect to the first copper plate 701, and the bonding jig 7〇4 is pressed to the outer side surface of the copper plate 701. At this time, since the foil 703 is interposed between the copper plate 7〇1 and the copper plate 7〇2, the copper plate 70丨 can be joined to the copper plate 702. In the third application example shown in Fig. 100, a part of the copper plate 7 is overlapped with a part of the plate 705, and the bonding tool 7〇4 is applied to the side of the copper plate 7 〇1 having a higher melting point. To the overlapping portion of the two, a eutectic layer is formed in the overlapping portion, and the copper plate 071 is joined to the aluminum plate 7 〇5. The fourth application example shown in Fig. 101 is the same as the third application example in the case where the aluminum plate 7〇5 is disposed orthogonally to the copper plate 701'. In the fifth application example shown in Figs. 102A and 102B, the copper plate 7〇1 and the plate 705 are formed as one sheet. In the second embodiment, a fitting convex portion 701a and a fitting concave portion 701b are formed at the end portion of the copper plate 7〇1, and a fitting convex portion 705a and a fitting concave portion 705b are formed at the end portion of the aluminum plate 705. The fitting convex portion 701a is dropped into the funnel recessed portion 705b, and the fitting convex portion 7〇5a is fitted into the fitting recessed portion 701b. That is, the copper plate 701 and the aluminum plate 7〇5 are fitted to each other in the form of a slot joint to form a single plate. Then, the copper plate 701 and the aluminum plate 705 are joined by the joint jig 704 from the side of the fitting convex portion 7〇1 of the copper plate 7〇1 having a relatively high melting point to the fitting portion of the joint. Further, in Fig. 102B, the end faces of the copper plate 7〇1 and the end faces of the aluminum plates 7〇5 are inclined surfaces which are opposite to each other. That is, the end face of the copper plate 7〇1 is a downward slope, and the end face of the plate 7〇5 is an upward slope. Thereafter, after the inclined surface is placed in contact, the bonding tool 704 is applied to the inclined surface portion by the side of the copper plate 701 2036-5808B-PF 151 1270429 having a relatively high melting point, and the sheet material is plated. The bonding copper plate 701 and the aluminum plate 7 〇 5 constitute a sixth application example shown in Figs. 103A and 103B, which is a copper plate 7 〇 1 and

板 7 0 2。 _ 第104圖所不的第七應用例,係將鋁板705與鋁板706 鄰接配置,二者鄰接部的上下夾於銅板7〇1與銅板7〇2之 間,而形成銅板701與鋁板705、7〇6的重合部以及銅板 7〇2與鋁板7〇5、706的重合部,藉由接合治具7〇4由熔點 較高的銅板701、70 2之側作用至重合部,而接合銅板7〇卜 702 與鋁板 705、706。 第105A、105B圖所示的第八應用例,亦將鋁板705與 鋁板706鄰接配置。在第105A圖中,鋁板7〇5的端部片面 • 側係形成有嵌合凹部7〇5b,鋁板706的端部片面側係形成 有嵌合凹部706b。而嵌合凹部705b、706b係形成一喪合 凹溝’將合於此喪合凹溝的銅板701鼓入此喪合凹溝,藉 由接合治具704於銅板701上的作用,而接合銅板701與 铭板705、706。第10 5B圖所示與第10 5A圖所示大體相同, 將銅板7 01、7 0 2分別嵌入铭板7 0 5、7 〇 6之端部兩面侧。 而將接合治具7 0 4於銅板7 01、7 〇 2上時,依序施行亦可、 同時施行亦可。 第1 0 6 A、1 0 6 B圖所示的第九應用例,係將銅板7 01與 2036-5808B-PF 152 1270429 銅板702以與第八應用例同樣的形狀接合。在第丄圖 中,銅板701的端部片面側係形成有嵌合凹部7〇 1匕,銅板 702的端部片面側係形成有嵌合凹部7〇2b。而嵌合凹部 701b、702b係形成一嵌合凹溝,因此將鋁箔7〇3順應性地 形成於此肷合凹溝上,將合於此嵌合凹溝的銅板7〇7嵌入 此嵌合凹溝,藉由接合治具7〇4於銅板7〇7上的作用,而 接合銅板707與銅板701、702。第1〇 6B圖所示與第10 6A φ 圖所示大體相同,將鋼板707、708分別嵌入銅板701、702 之端部兩面側。 第1 07圖所不的第十應用例,係將圓柱形或圓筒形的 鋁棒709、710的端部,分別合入並插入銅環7丨1的内部而 相互鄰接後,藉由接合治具704於銅環711的外周面上的 作用,而使銅環711與鋁棒709、710接合。 第1 08圖所示的第十一應用例,與第十應用例大體相 同,鋁棒709、710的端部,分別突出形成有圓柱形或圓筒 鲁形的嵌合凸部709a、710a,並分別合入並插入銅環711的 内部而相互鄰接。此狀態下,銅環71丨的外周面與鋁棒 709、71 0的外周面是一致的。其他則與第十應用例相同。 第109圖所示的第十二應用例,係將銅板7〇2與鋁網 體Π2重合,藉由接合治具704由熔點較高的銅板7〇1之 側作用至重合部,而將銅板7 〇 1與鋁網體71 2接合。 第11 0圖所示的第十三應用例,係將空心或實心的鋁 棒709以立設狀態配置於銅板70T,藉由接合治具7〇4'由 熔點較高的銅板701之側作用至兩者的接觸部,而將銅板 2036-5808B-PF 153 1270429 701與鋁棒709接合。 第111圖所示的第十四應用例,係將空心或實心的銅 棒713以立設狀態配置於銅板7〇1,而兩者之間更夾入配 置有铭搭703,藉由接合治具7〇4於銅板7〇丨之側的作用, 使與銅版701接觸的鋁箔7〇3共晶熔融,將其冷卻後得到 共晶層介於銅板7 01與銅棒713之間而將二者接合。Board 7 0 2 . The seventh application example of FIG. 104 is such that the aluminum plate 705 and the aluminum plate 706 are disposed adjacent to each other, and the upper and lower portions of the adjacent portions are sandwiched between the copper plate 7〇1 and the copper plate 7〇2 to form the copper plate 701 and the aluminum plate 705. The overlapping portion of 7〇6 and the overlapping portion of the copper plate 7〇2 and the aluminum plates 7〇5 and 706 are joined to the overlapping portion by the bonding jigs 7〇4 from the sides of the copper plates 701 and 702 having a higher melting point, and the copper plates are joined. 7 〇 702 with aluminum plates 705, 706. In the eighth application example shown in Figs. 105A and 105B, the aluminum plate 705 is also disposed adjacent to the aluminum plate 706. In Fig. 105A, the end piece surface of the aluminum plate 7〇5 is formed with a fitting recess 7b5b on the side, and the end face side of the aluminum plate 706 is formed with a fitting recess 706b. The fitting recesses 705b, 706b form a recessed groove d. The copper plate 701 corresponding to the recessed groove is slid into the recessed groove, and the copper plate is joined by the action of the jig 704 on the copper plate 701. 701 and nameplate 705, 706. The figure shown in Fig. 10B is substantially the same as that shown in Fig. 10 5A, and the copper plates 7 01 and 7 0 2 are respectively embedded on both sides of the end portions of the name plates 7 0 5 and 7 〇 6 . When the jig 704 is attached to the copper plates 7 01 and 7 〇 2, it may be carried out in sequence or simultaneously. In the ninth application example shown in Figs. 1 0 6 A and 1 0 6 B, the copper plate 7 01 and the 2036-5808B-PF 152 1270429 copper plate 702 are joined in the same shape as the eighth application example. In the second diagram, the end surface side of the copper plate 701 is formed with a fitting recess 7 〇 1 匕, and the end surface side of the copper plate 702 is formed with a fitting recess 7 〇 2b. The fitting recesses 701b, 702b form a fitting recess, so that the aluminum foil 7〇3 is conformally formed on the folding recess, and the copper plate 7〇7 of the fitting recess is embedded in the fitting recess. The groove bonds the copper plate 707 and the copper plates 701 and 702 by joining the jigs 7 to 4 on the copper plate 7〇7. Similarly to the 10th 6th φ diagram, the first steel plate 707 and the 708 are respectively fitted to the end faces of the copper plates 701 and 702, respectively. The tenth application example of the Fig. 07 is that the ends of the cylindrical or cylindrical aluminum rods 709 and 710 are respectively joined and inserted into the inside of the copper ring 7丨1 to be adjacent to each other by being joined. The jig 704 acts on the outer peripheral surface of the copper ring 711 to bond the copper ring 711 to the aluminum bars 709, 710. The eleventh application example shown in FIG. 18 is substantially the same as the tenth application example, and the end portions of the aluminum rods 709 and 710 are respectively formed with cylindrical or cylindrically shaped fitting convex portions 709a and 710a. And they are respectively joined and inserted into the inside of the copper ring 711 to be adjacent to each other. In this state, the outer circumferential surface of the copper ring 71A coincides with the outer circumferential surfaces of the aluminum rods 709 and 710. Others are the same as the tenth application example. In the twelfth application example shown in FIG. 109, the copper plate 7〇2 is overlapped with the aluminum mesh body 2, and the bonding tool 704 is applied to the overlapping portion from the side of the copper plate 7〇1 having a higher melting point, and the copper plate is bonded. 7 〇 1 is bonded to the aluminum mesh body 71 2 . In the thirteenth application example shown in Fig. 10, the hollow or solid aluminum rod 709 is disposed in the standing state on the copper plate 70T, and the joint jig 7〇4' acts on the side of the copper plate 701 having a higher melting point. To the contact portions of the two, the copper plates 2036-5808B-PF 153 1270429 701 are joined to the aluminum bars 709. In the fourteenth application example shown in FIG. 111, the hollow or solid copper rod 713 is placed on the copper plate 7〇1 in an upright state, and the two are sandwiched between the two. Having a function of 7〇4 on the side of the copper plate 7〇丨, the aluminum foil 7〇3 in contact with the copper plate 701 is eutectic and melted, and after cooling, a eutectic layer is obtained between the copper plate 7 01 and the copper rod 713. Engage.

第11 2圖所示的第十五應用例,係將圓筒形的銅棒7 J 4 與圓筒形的鋁棒715形成單一的棒體。銅棒714的端部, 係形成有環狀的嵌合凸部714a、及位於嵌合凸部714a内 周的嵌合凹部714b。又,鋁棒715的端部,係形成有環狀 的嵌合凸部715a、及位於嵌合凸部715a外周的嵌合凹部 715b。肷合凸部714a係嵌入嵌合凹部715b、嵌合凸部 係嵌入嵌合凹部714b。之後,藉由接合治具7〇4由熔點較 紹棒715高的銅棒714的嵌合凸部71“之側作用至嵌合 部’而將銅棒714與鋁棒715接合。 第113圖所示的第十六應用例,係將圓筒形的銅棒 與圓同形的銅棒7 ] β,1;义ife楚丄丁 ^ m 牛以與弟十五應用例相同的形狀接合。 而在嵌合部夾入鋁箔703而將銅棒714、716接合。 ’與第十五應用例大體 的端面係分別成為相互 相同 苐114圖所示的第十七應用例 ,銅棒714的端面及鋁棒715 逆向的斜面。亦即,在此處銅棒714的端面是由外侧朝中 空部深入之所謂料狀的斜面,而銘棒715的端面是由外 侧朝中空部伸出的斜面。而將各斜轉觸配置後〆秦 合治具7G4 ·點較高的銅棒714之側作用至斜面部,而 2036-5808B-PF 154 1270429 接合銅棒714與鋁棒715,構成單一的棒體。 第11 5圖所示的第十八應用例,係將圓筒形的銅棒7 i 4 〃圓筒形的銅棒7丨6,以與第十七應用例相同的形狀接合。 而在斜面間夾入鋁箔703而將銅棒714、716接合。 第116圖所示的第十九應用例,係關於半導體的散熱 板(packing plate)的製造方法。亦即在鋁製的散熱板7 的片側面形成有複數條凹溝717a,將銅製的蓋板718重合 _於散熱板7Π之各凹溝717a之側的表面上,藉由接合治具 704由熔點較高的銅製的蓋板718之側作用至散熱板γη 與銅製的蓋718之重合部,而接合散熱板717與蓋板 718,以蓋板718所密閉的各凹溝717&amp;就成為水冷孔。藉 由上述的方法,因為並未使用熔接等方法將接合材熔融, 由所產生的熱應蜒較少,而能夠以低成本製造高精度的製 品。In the fifteenth application example shown in Fig. 12, the cylindrical copper rod 7 J 4 and the cylindrical aluminum rod 715 are formed into a single rod. The end portion of the copper rod 714 is formed with an annular fitting convex portion 714a and a fitting concave portion 714b located at the inner circumference of the fitting convex portion 714a. Further, an end portion of the aluminum rod 715 is formed with an annular fitting convex portion 715a and a fitting concave portion 715b located on the outer circumference of the fitting convex portion 715a. The coupling convex portion 714a is fitted into the fitting concave portion 715b, and the fitting convex portion is fitted into the fitting concave portion 714b. Thereafter, the copper rod 714 is joined to the aluminum rod 715 by the joining fixture 7〇4 being applied to the fitting portion by the side of the fitting convex portion 71 of the copper rod 714 having a higher melting point than the rod 715. The sixteenth application example shown is that a cylindrical copper rod is joined to a round-shaped copper rod 7]β,1; Yifei Chuanding^m cattle in the same shape as the application of the fifteenth application. The aluminum foil 703 is interposed between the fitting portions to join the copper rods 714 and 716. 'The general end face of the fifteenth application example is the same as the seventeenth application example shown in Fig. 114, and the end face of the copper rod 714 and The aluminum rod 715 has a reverse slope. That is, the end surface of the copper rod 714 is a so-called material-like inclined surface which is deeped from the outer side toward the hollow portion, and the end surface of the inner rod 715 is a sloped surface which protrudes from the outer side toward the hollow portion. After each oblique touch configuration, the Qinhe fixture 7G4 is applied to the side of the copper rod 714 with a higher point, and the 2036-5808B-PF 154 1270429 is joined with the copper rod 714 and the aluminum rod 715 to form a single rod. The eighteenth application example shown in Fig. 15 is a cylindrical copper rod 7 i 4 〃 cylindrical copper rod 7 丨 6 to the seventeenth The same shape is used for bonding. The aluminum foil 703 is sandwiched between the inclined surfaces to bond the copper rods 714 and 716. The nineteenth application example shown in Fig. 116 relates to a method of manufacturing a semiconductor heat sink. That is, a plurality of recessed grooves 717a are formed on the side surface of the heat radiating plate 7 made of aluminum, and the cover plate 718 made of copper is superposed on the surface of the side of each of the recessed grooves 717a of the heat radiating plate 7 by the bonding jig 704. The side of the higher copper cover plate 718 acts on the overlapping portion of the heat dissipation plate γη and the copper cover 718, and the heat dissipation plate 717 and the cover plate 718 are joined, and the respective grooves 717 &amp; sealed by the cover plate 718 become water-cooled holes. According to the above method, since the bonding material is not melted by a method such as welding, the amount of heat generated is small, and a highly precise product can be manufactured at low cost.

第117圖所不的第二十應用例,係與第十九應用例大 體相同,不同處係將散熱板與蓋板的材f互換。亦即在銅 衣的政熱板719的片側面形成有複數條凹溝719a,將鋁製 的蓋板720重合於散熱板719之各凹溝7心之側的表面 上,藉由接合治具704由溶點較高的銅製的散熱板719之 側作用至散熱板719與蓋板720之重合部,而接合散熱板 719與蓋板72G,以蓋板720所密閉的各凹溝719a就成為 水冷孔。其他的部分均與第十九應用例相同。 第 118圖所示的第二十一應甩有,係與第十九The twentieth application example, which is not shown in Fig. 117, is substantially the same as the nineteenth application example, and the heat sink is interchanged with the material f of the cover plate in different places. That is, a plurality of concave grooves 719a are formed on the side surface of the sheet of the hot plate 719 of the copper garment, and the aluminum cover plate 720 is superposed on the surface of the side of each of the concave grooves 7 of the heat dissipation plate 719 by the joint jig. 704 is applied to the overlapping portion of the heat dissipation plate 719 and the cover plate 720 by the side of the heat dissipation plate 719 having a high melting point, and the heat dissipation plate 719 and the cover plate 72G are joined, and the respective grooves 719a sealed by the cover plate 720 are formed. Water-cooled holes. The other parts are the same as the nineteenth application example. The twenty-first one shown in Figure 118 should be the same as the nineteenth

應用例大體相同 不同之處在於散熱板與蓋板的材質都是 2036-5808B-PF 155 1270429 銅。亦即在銅製的散熱板719的片側面形成有複數條凹溝 719a,將銅製的蓋板718重合於散熱板719之各凹溝 之側的表面上。此時,散熱板71 9與蓋板71 8之間的重合 部中,係置入有鋁箔703夾於二者之間。而後,藉由接合 具704由盍板71 8或散熱板71 9之側作用至重合部,而 接合散熱板719與蓋板718,以蓋板718所密閉的各凹溝 71 9a就成為水冷孔。其他的部分均與第十九、二十應用例 相同。 Φ 第11 9圖所示的第二十二應用例,係將紹容器7 21的 底面與不銹鋼板722接合而成為電磁調理器。接合治具 係可以使用之岫所敘述過者,而此處係將以轉動軸Μ处為 中心以圓周方向高速轉動的治具本體723a的上表面(與轉 動轴723b直交的表面)垂直壓至不銹鋼板々22之表面,並 使治具本體723a沿著不銹鋼板722之表面以一既定的行進 、、率私動如此來,藉由與治具本體的摩擦接觸熱 _將不錄鋼板722高溫化,使與不錄鋼板722接觸的紹容器 721部分地共晶溶融,將其冷卻後得到共晶層介於不錄鋼 板722與鋁容器721之間而將二者接合。 帛120 ®所示的第二十三應用例,係將大體狂字型 斷面的銘型材724、725以左右一對的狀態下組合並接合而 製造筒狀的儲存桶單元(basket eeU )。儲存桶單元其内部 係貯藏使用完畢的核燃料棒’而集合各儲存桶單元而構成 儲存桶(basket),而儲存桶係為輸,送容言和抓妗怜 刀鋁里材724、725皆含有二十個重量百分比(2〇wt%)的 2036-5808B-PF 156 1270429 碳化棚(boron carbide)。鋁型材724的端部係形成有嵌合 凸部724a與敌合凹部724b,紹型材?^端部係形成= 嵌合凸部725a與喪合凹部725b。喪合凸部咖係嵌入後 合凹部㈣,喪合凸部7…係礙入喪合凹部724b。喪合 凸部724a係在敌合凸部725a的外側。又,銘型材似、 725的嵌合部中係夾入有鋁猪7〇3。而後,從嵌合凸部…&amp; 的外側提供接合治具704的作用,將銘型材接合。 此時,接合治具704向下的壓應力,將使嵌合部往下方彎 曲,為了防止接合時金屬由下方漏出而造成接合不良,在 此,於筒狀體内中空部配置台車式内部元件⑽及内播板 727。内檔板727係沿著接合部的下面所配置的長板。又, 台車式内部元件726係以上下方向伸縮自如的千斤頂 (⑽)726b由下將内播板727頂至接合部的下面,並以滾 子(r〇ller)726a使筒狀體内中空部與接合治具7〇4同步移 動。因此,受到接合治具704之來自上方㈣力的接合部 的下面,較為⑽板727所佔據而受到内襠板m的支 持、因此接合部幾乎不會彎曲,亦不會有金屬漏出。 第121圖所示的第二十四應用命J,係與第二十 例大體相同,相異處在於敌合部 似 你甘入。的形狀。亦即鋁型材724 的端面係向下的斜面,紹型# 725的端面係向上的斜面。 而將紹7G3夾在中間而使紹型材724的斜面無型材725 的斜面接觸,由外側使接合治具7〇4作用於斜面,而接合 飽型材724與銘型材725。其他的部,全部黎 用例相同。 2036-5808B-PF 157 1270429 第122圖所示的第二十五應用例,係將 斷面的鋁型材728、729組合 為1子| 一 工接5而製造筒狀的 兀。大體為L字型斷面的嵌合部可位於 接合治具7。4的正下方係配置 ‘因為 一 罝土 ’就不需要楚-本 二應用例之台車式内部元件。 一 應用例相^ 其他㈣分全部㈣二十三 。弟123圖所示的第二十六應用例,係與第二十五岸用 例大體相同,相異處在於嵌合 應用 ΛΛ ^ ^ ^ 的形狀。亦即鋁型材728 =面係向下的斜面’㈣729的端面係向 而將紹請夹在中間而使紹型材728的斜面與紹型材-的斜面接觸,由外側使接合治具7〇4作用於斜面, 銘型材728與1呂型材729。其他的部分全部與第二十^ 用例相同。 Τ 恶 第124Α 124β圖所不的第二十七應用例,係將四個鋁 ^730、731、732、733組合並接合而製造筒狀的(basket ce⑴。大體為L字型斷面的嵌合部可位於任一角落部。如 第麗圖所示’㈣材73G的端部的外側係形成有嵌人凸 部⑽,㈣材733的端部的上面係形成有支持自7⑽。 又’嵌合部中係夾入有紹箱703。之後,藉由從銘型材73〇 的後合凸部730a的外側’提供接合治具?〇4的治具本體 7〇4a的作用,對㈣7〇3加熱及加壓,而將紹型材㈣、 733接合。因為來自接合治$ m之向下的壓應力,係傳 730 ^ 733; , 具734所吸收’·嵌合部就不會散開,亦不會向下彎曲。四 2036-5808B-PF 158 1270429 個部位的嵌合部灼 9疋相對於筒狀體的令心轴呈對稱 狀。其他的部分全部鱼 夕 第一十五應用例相同。 第 125A〜125R 闰 &amp; - 圖所示的第二十八應用例,係與第二 七應用例大體相同,相 相/、處在於後合部的形狀。亦即,菩 眼至鋁型材730、a d ’紹型材730的端面係向下的斜面, 銘型材733的端面係向上的斜面。而將銘箱703夾在中間 而使銘里材730的斜面與銘型材733的斜面接觸,由外側 使接合治具7 0 4作用於祖品 &gt;用於斜面,而接合鋁型材73()與鋁型 7 3 3。以同樣的方式,蔣 將鋁型材依序迴轉,而將四個部分的 斜面接觸部全部接人。甘^ a 、 ° /、他的邛为全部與第二十七應用例 相同。 雖然本發明已以動;往每 孕乂仏只靶例揭路如上,然其並非用以 限定本發明’任何熟習士 曰有,在不脫離本發明之精神 和範圍内,當可作些許之更動與潤飾,因此本發明之保嘆 範圍當視後附之申請專利範圍所界定者為準。 # 產業上的可利用性 發明,將各金屬元件的重 ’鄰近接合治具之一側的 度’而使接合治具的壓應 而能夠在金屬元件間形成 點焉於鋁元件的銅元件之 如上所述,藉由第一群組的 合部上升至接合所必要的溫度時 金屬元件仍然能保持高抗形變強 力能夠有效率地傳達到重合面, 無縫隙且具南接合強度之接合。 又’因為將接合治具壓入溶 側而作摩擦震動接合,即使在兩.元伴时合面,達到共晶溫 度以上時,銅元件的抗%變強度相對較λ,可使來自壓力 159The application examples are generally the same. The difference between the heat sink and the cover is 2036-5808B-PF 155 1270429 copper. That is, a plurality of grooves 719a are formed on the sheet side surface of the heat-dissipating plate 719 made of copper, and a cover plate 718 made of copper is superposed on the surface of the side of each of the grooves of the heat-dissipating plate 719. At this time, in the overlapping portion between the heat radiating plate 719 and the cover plate 718, the aluminum foil 703 is interposed therebetween. Then, the heat sink 719 and the cover 718 are joined by the joint 704 from the side of the sill plate 718 or the heat sink 719, and the recesses 71 9a sealed by the cover 718 become water-cooled holes. . The other parts are the same as the nineteenth and twentyth application examples. Φ The twenty-second application example shown in Fig. 11 shows that the bottom surface of the container 7 21 is joined to the stainless steel plate 722 to form an electromagnetic conditioner. The joint jig can be used as described above, and the upper surface of the jig body 723a (the surface orthogonal to the rotating shaft 723b) which is rotated at a high speed in the circumferential direction around the rotating shaft 垂直 is vertically pressed to The surface of the stainless steel plate 22 and the fixture body 723a are privately moved along the surface of the stainless steel plate 722 at a predetermined travel rate, and the heat is prevented by the frictional contact with the fixture body. The vessel 721 which is in contact with the unrecorded steel plate 722 is partially eutectic and melted, and after cooling, a eutectic layer is obtained between the unrecorded steel plate 722 and the aluminum container 721 to join the two. In the twenty-third application example shown by the 帛120®, a tubular storage unit (basket eeU) is manufactured by combining and joining the inscription profiles 724 and 725 of the substantially mad type cross section in a pair of right and left. The inside of the storage tank unit stores the used nuclear fuel rods, and collects the storage tank units to form a storage basket, and the storage tanks are for the delivery, and the storage and the shovel are all contained in the aluminum 724 and 725. Twenty percent by weight (2% by weight) of 2036-5808B-PF 156 1270429 carbon carbide shed (boron carbide). The end of the aluminum profile 724 is formed with a fitting convex portion 724a and an enemy concave portion 724b. ^ End portion formation = fitting convex portion 725a and funneling concave portion 725b. The commemorative convex portion is embedded in the concave portion (four), and the sinus convex portion 7 is blocked into the funnel portion 724b. The commissure convex portion 724a is outside the enemy convex portion 725a. In addition, the aluminum alloy pig 7〇3 was sandwiched in the fitting portion of the 725. Then, the joint jig 704 is provided from the outer side of the fitting projections...&amp;, and the inscription profile is joined. At this time, the downward pressing stress of the jig 704 causes the fitting portion to be bent downward, and the joint is poor in order to prevent the metal from leaking under the joint during the joining. Here, the trolley-type internal component is disposed in the hollow portion of the cylindrical body. (10) and internal broadcast board 727. The inner baffle 727 is a long plate disposed along the lower surface of the joint. Further, the trolley type internal component 726 is a jack ((10)) 726b that is expandable and contractable in the downward direction, and the inner disc 727 is placed under the joint to the lower surface of the joint portion, and the hollow portion of the tubular body is made by a roller (r〇ller) 726a. Moves synchronously with the joint fixture 7〇4. Therefore, the lower surface of the joint portion from the upper (four) force of the joint jig 704 is occupied by the inner plate 4 by the plate 727, so that the joint portion is hardly bent and metal is not leaked. The twenty-fourth application life shown in Figure 121 is roughly the same as the twentieth case. The difference is that the enemy department is like you. shape. That is, the end face of the aluminum profile 724 is a downward slope, and the end face of the profile #725 is an upward slope. In the middle, the 7G3 is sandwiched so that the inclined surface of the profiled material 724 is in contact with the inclined surface of the profile 725, and the bonding fixture 7〇4 is applied to the inclined surface from the outside, and the saturated profile 724 and the inscription profile 725 are joined. The other departments are all the same. 2036-5808B-PF 157 1270429 The twenty-fifth application example shown in Fig. 122 is a method in which the aluminum profiles 728 and 729 of the cross-section are combined into one sub-piece 5 to produce a cylindrical crucible. The fitting portion having a substantially L-shaped cross section can be disposed directly under the joint jig 7.4. The "T-Bare" does not require the trolley-type internal component of the second application. An application example ^ other (four) points all (four) twenty-three. The twenty-sixth application example shown in Figure 123 is roughly the same as the twenty-fifth shore use case, and the difference is in the shape of the fitting application ΛΛ ^ ^ ^. That is, the aluminum profile 728 = the face of the downward slope of the facet (4) 729 is end faced and will be sandwiched in the middle so that the slope of the profile 728 is in contact with the slope of the profiled profile, and the joint fixture 7〇4 acts from the outside. On the bevel, Ming profile 728 and 1 Lu profile 729. The other parts are all the same as the twentieth use case. The twenty-seventh application example of the 124th figure 124β is a combination of four aluminum 730, 731, 732, and 733 to produce a cylindrical shape (basket ce (1). The L-shaped section is embedded. The joint portion may be located at any corner portion. As shown in the figure, the outer side of the end portion of the 'fourth material 73G is formed with an embedded convex portion (10), and the upper portion of the end portion of the (four) material 733 is formed with support from 7 (10). The fitting portion 703 is inserted into the fitting portion. Thereafter, by the action of the jig body 7〇4a of the joint jig 〇4 from the outer side of the rearward convex portion 730a of the sizing material 73〇, the pair of (4) 7〇 3 heating and pressurization, but the joint profiles (4), 733 joint. Because the downward compressive stress from the joint treatment $ m is 730 ^ 733;, with 734 absorbed '· fittings will not spread, also It does not bend downwards. The fitting portion of the four 2036-5808B-PF 158 1270429 is symmetrical with respect to the mandrel of the cylindrical body. The other parts are the same as the first fifteenth application example. 125A~125R 闰&amp; - The twenty-eighth application example shown in the figure is substantially the same as the second seven application example, and the phase/phase is The shape of the rear joint portion, that is, the end face of the pontoon to aluminum profile 730, the ad's profile 730 is a downward slope, and the end face of the profile 733 is an upward slope. The name box 703 is sandwiched in the middle to make the name The inclined surface of the lining material 730 is in contact with the inclined surface of the inscription profile 733, and the bonding fixture 704 is applied to the ancestor by the outer side for the inclined surface, and the aluminum profile 73 () is bonded to the aluminum type 733. In the same manner. Jiang will rotate the aluminum profiles in sequence, and all the four-part bevel contact parts will be connected. Gan ^ a , ° /, his 邛 are all the same as the twenty-seventh application. Although the invention has been activated; The invention is not disclosed to limit the scope of the present invention, and the invention may be modified and retouched without departing from the spirit and scope of the invention. The scope of the sigh is subject to the definition of the patent application scope attached to the following. #Industrial usability invention, the weight of each metal component is 'adjacent to the side of the jig' Pressure can form copper between the metal components As described above, the metal component can still be efficiently conveyed to the coincident surface by the rise of the first group of joints to the temperature necessary for the joint, and the seamless joint can be joined to the joint strength. And 'because the friction tool is pressed into the solution side to make the frictional vibration joint, even when the surface is combined with the two elements, when the eutectic temperature is above, the anti-% strength of the copper element is relatively λ, which can be from the pressure. 159

2036-5808B-PF 1270429 充分地傳達至重合面,並能夠行確實地接合。 又,因接合治具與銅元件的摩擦接觸所產生的熱量為 恰好合適的值時,可以行良好的接合。 又’接合治具的壓應力為恰好適當的值時,銅元件與 鋁7L件的重合面就不會產生縫隙而能夠接合,銅元件表面 的凹痕亦可以較小。 又,接合治具的行進速率、圓周速率、銅元件厚度的 _ 關係為恰好適當時,就可以有效率地行高接合強度的摩擦 震動接合。 又,基板與傳熱板的重合面沒有缝隙可以形成以更高 強度接合的散熱元件。 又,因為散熱器材料係由鋁擠型所成形,散熱器材料 的加工精度高。 又,因為與接合治具接觸的銅元件不易熔融而在高溫 下能保持高抗形變強度,接合條件(接合治具的轉動數、行 # 進速率等)的容許範圍大,接合效率好。 又,藉由第二群組的發明,無論元件的材質為何,可 以容易地將複數個相互間隔的板材立設接合於基板的一表 面特別可以將厚度溥、南度焉的板材,以短間隔強固地 立設接合於基板上。 又’藉由本發明散熱元件的製造方法,可以容易地以 低成本製造具有相互間隔的複數個鰭片立設接合於基板之 一表面的散熱元件;特別是可以以低成。本製。造具有高高度/ 間隔比的高散熱性能的散熱元件。此時如果使用本發明之 2036-5808B-PF 160 1270429 :熱元件製造用治具,於摩擦震動接合時能夠確實地固定 片或鰭片構成材、間隔物、與基板。 〜更者,本發明之散熱元件係散熱性能高、製造成本便 且° 益又’藉由第三群組的發明,因為散熱元件是由銅基板 :鋼籍片、料片、或㈣板摩擦震動接合而成,可以確 霄地以較習知物品為低的成本製造。 • 又,因為具有以風扇將散熱元件的熱作強制性地冷卻 的構造’而有高散熱性能。 更者,將#熱體與銅基板以導熱管連接時,冑熱元件 與風扇可以配置在遠離發熱體的位置,使得例如薄型的筆 記型電腦等要在發熱體的附近裝設散熱構造有空間上的困 難之情況,有了可供對應的方案。 -又,藉由第四群組的發明,可以簡易且確實地將各金 雌屬疋件相互重合並接合;又,可以簡易且確實地將複數個 屬製板材立設並接合於金屬製基板。更者,藉由本發明 '、、、元件的製以方法’可以簡易地製造複數個韓片強固地 立設接合於基板的散熱元件。 人又’藉由第五群組的發明’可以以少步驟、短時間接 合各金屬元件’亦可以將各金屬元件作高強度地接合。又, :乂應用此金屬元件接合方法之散熱元件的製造方法所得的 散熱元件’係以少步驟、短時間’更確實地以高強度將散 熱籍片等搂合於基板上’其成本較習,物品脅低…㈣ 2036-5808B-PF 161 1270429 又,藉由第六群組的發明,因為在基板上係形成有連 、、'。各韓片的凸條,基板可以更有效率地將發熱體的熱量傳 各,’、、a片而提升散熱性能。因此,可以在不降低散熱性 :的情形下,將散熱元件輕量化。又,藉由本發明之散熱 器,係可以更上一層地提升散熱性能。 又,藉由本發明之散熱元件的製造方法,凸條與縛片 不會造成麻煩’可以簡單且確實地接合基板與藉片,亦可 以自由地設定鰭片的間隔與高度/間隔比。 L圖式簡單說明】 —弟U〜1C圖係顯示本發明之金屬元件接合方法之一 實施型態各步驟,其中第u 卜 /、 1B為正面剖面圖,第} c圖 為弟1B圖之側視圖。 第2A〜2C圖為一系列之剖面圖,係顯示第圖之 銘蝴鋼元件之重合部之塑性變形的過程。' -方::為:正面剖面圖,係顯示本發明之金屬元件接 口万去之另一貫施型態。 弟4圖為一斜視圖,係顯示本發明之散熱元件之一與 施型態。 十之 貝 面圖,係顯示本 5Α圖為底面視 第5A〜5C圖為一系列之底面視圖與剖 發明之散熱元件之另一實施型態,其冲第 圖,第5β、5C圖為剖面圖。 弟bA〜6C圖為一系列之剖 元件的製造方法之一實施型態〖2036-5808B-PF 1270429 is fully conveyed to the coincident surface and can be reliably joined. Further, when the heat generated by the frictional contact between the bonding jig and the copper member is just a suitable value, good bonding can be performed. Further, when the compressive stress of the joining jig is just an appropriate value, the overlapping surface of the copper member and the aluminum 7L member can be joined without causing a gap, and the dent of the surface of the copper member can be made small. Further, when the relationship between the traveling speed of the joining jig, the circumferential speed, and the thickness of the copper member is just right, the frictional vibration joining with high joint strength can be efficiently performed. Further, there is no gap between the substrate and the heat transfer plate, and a heat dissipating member joined at a higher strength can be formed. Further, since the heat sink material is formed by an aluminum extrusion type, the heat sink material has high processing precision. Further, since the copper member that is in contact with the bonding jig is less likely to be melted and maintains high deformation strength at a high temperature, the allowable range of the bonding condition (the number of rotations of the bonding jig, the running speed, etc.) is large, and the joining efficiency is good. Moreover, according to the invention of the second group, regardless of the material of the component, a plurality of mutually spaced sheets can be easily joined to one surface of the substrate, and in particular, the sheet having a thickness of 溥 and a south can be arranged at a short interval. Firmly erected and bonded to the substrate. Further, by the method for manufacturing a heat dissipating member of the present invention, it is possible to easily manufacture a heat dissipating member in which a plurality of fins which are spaced apart from each other are erected and bonded to one surface of the substrate at a low cost; in particular, it can be made low. This system. A heat dissipating component with high heat dissipation performance with high height/space ratio. At this time, if the jig of the invention of 2036-5808B-PF 160 1270429 is used, the sheet or the fin constituent material, the spacer, and the substrate can be surely fixed at the time of frictional vibration bonding. ~ Moreover, the heat dissipating component of the present invention has high heat dissipation performance, and the manufacturing cost is good and the invention of the third group is because the heat dissipating component is made of a copper substrate: steel sheet, web, or (4) plate friction. It is made by vibration and can be reliably manufactured at a lower cost than conventional items. • Also, it has a high heat dissipation performance because it has a structure in which the heat of the heat dissipating member is forcibly cooled by the fan. Furthermore, when the hot body and the copper substrate are connected by a heat transfer tube, the heat generating element and the fan can be disposed at a position away from the heat generating body, so that, for example, a thin notebook computer or the like is provided with a heat dissipating structure in the vicinity of the heat generating body. In the case of difficulties, there is a solution that can be used. - In addition, by the invention of the fourth group, each of the gold and female components can be easily and surely joined and joined to each other; and a plurality of constituting sheets can be easily and surely erected and joined to the metal substrate. . Further, according to the present invention, the method of manufacturing the device, it is possible to easily manufacture a plurality of heat dissipating members which are firmly erected and bonded to the substrate. By the invention of the fifth group, the metal elements can be joined in a small number of steps and in a short time, and the metal elements can be joined with high strength. Further, the heat dissipating member obtained by the method for manufacturing a heat dissipating member using the metal element bonding method is capable of more reliably bonding a heat dissipating film or the like to a substrate with a high strength in a small step and in a short time. (4) 2036-5808B-PF 161 1270429 Moreover, by the invention of the sixth group, the connection is formed on the substrate. Each of the ridges of the Korean film can more efficiently transfer the heat of the heat generating body, and the a sheet can improve the heat dissipation performance. Therefore, the heat dissipating component can be made lighter without reducing heat dissipation. Further, with the heat sink of the present invention, the heat dissipation performance can be improved further. Further, according to the method for manufacturing a heat dissipating member of the present invention, the ridges and the ribs are not troubled. The substrate and the slab can be simply and reliably bonded, and the interval and height/space ratio of the fins can be freely set. A simple description of the L-pattern shows that the U-1C diagram shows the steps of one embodiment of the metal component bonding method of the present invention, wherein the first u/, 1B is a front cross-sectional view, and the first c-figure is a 1B map. Side view. Figs. 2A to 2C are a series of sectional views showing the process of plastic deformation of the overlapping portion of the steel element of the figure. '-Part:: is: a front sectional view showing another embodiment of the metal component interface of the present invention. Figure 4 is a perspective view showing one of the heat dissipating elements of the present invention and the configuration. The top view of the tenth is shown in Fig. 5A to 5C as a series of bottom views and another embodiment of the heat dissipating component of the invention. The fifth figure and the fifth figure are the 5th and 5th views. Figure. The brothers bA~6C are one of the manufacturing methods of a series of cross-section components.

係顯不本發明 驟,其中第6 A 之散熱 、6B圖 2036-5808B-pp 162 1270429 為正面剖面圖,第6C圖為第6B圖之剖面圖。 第7A 7C圖為系列之剖面圖,係顯示本發明之散熱 元件的製造方法之另—實施型態。 第8A〜8C圖係顯示摩擦震動接合的順序,其中第8a、 8B為正面剖面圖,第8C圖為第8β圖之側視圖。 第9A〜9C圖為一系列之剖面圖,係顯示第8A〜8c圖之 鋁元件與銅元件之重合部之塑性變形的過程。 第10圖為一正面剖面圖,係顯示金屬元件之摩擦震動 接合之另'例子。 第11A〜11B圖為-系列之正面剖面圖,係顯示本發明 散熱元件的製造方法之第一實施型態。 第12A〜12B圖為一系列之正面剖面圖,係顯示接續於 第11A〜11B圖的步驟,其中第m圖係顯示摩擦震動接合 步驟,第1 2B圖係顯示間隔物脫離步驟。 第13圖為一分解斜視圖’係顯示本發明之散熱元件製 _ 造用治具之一實施型態。 第14圖為-斜視圖’係顯示本發明之散熱元件之—實 施型態。 第15A〜15C圖為-系列之斜視圖,係顯示第m圖所 示之:擦震動接合步驟之接合治具的移動執跡的例子。 第16圖為一正面剖面圖,係顯示第12A圖所示之摩擦In the present invention, the heat dissipation of the 6th A, the 6B diagram 2036-5808B-pp 162 1270429 is a front sectional view, and the 6Cth is a sectional view of the 6B. Fig. 7A is a cross-sectional view showing a series of other embodiments of the method for manufacturing a heat dissipating member of the present invention. Figs. 8A to 8C show the order of frictional vibration engagement, in which the 8a, 8B are front cross-sectional views, and the 8Cth is a side view of the 8th. Figs. 9A to 9C are a series of sectional views showing the process of plastic deformation of the overlapping portion of the aluminum member and the copper member in Figs. 8A to 8c. Figure 10 is a front cross-sectional view showing another example of frictional vibration engagement of a metal component. 11A to 11B are front cross-sectional views of the series, showing a first embodiment of the method of manufacturing the heat dissipating member of the present invention. Figs. 12A to 12B are a series of front cross-sectional views showing the steps following Fig. 11A to 11B, in which the mth figure shows the frictional vibration joining step, and the 12th second figure shows the spacer separating step. Fig. 13 is an exploded perspective view showing an embodiment of the heat-dissipating member of the present invention. Fig. 14 is a perspective view showing the embodiment of the heat dissipating member of the present invention. Figs. 15A to 15C are oblique views of the series, showing an example of the movement of the joint jig of the rubbing engagement step shown in the mth figure. Figure 16 is a front cross-sectional view showing the friction shown in Figure 12A.

震動接合步驟之另一例子。 T 第π圖為一正面剖面圖,係&quot;顯,示本發明之散熱元件之 另一實施型態。 2036-5808B-PF 163 1270429 第1 8A〜1 8C圖為,系列之正面剖面圖,係顯示第I?圖 所不之散熱兀件的製造順序,其中第丨8A圖為第一樣態, 第18B、18C圖為第二樣態。 所不之散熱7L件的製造順序,其中第19A〜19C圖為第三樣 態’第1 9 D〜1 9 G圖為第四樣態。Another example of a vibration bonding step. T π is a front cross-sectional view showing another embodiment of the heat dissipating component of the present invention. 2036-5808B-PF 163 1270429 The first 8A~1 8C is a front cross-sectional view of the series, showing the manufacturing sequence of the heat-dissipating components of the first drawing, wherein the Figure 8A is the first state, The 18B and 18C pictures are in the second form. The manufacturing sequence of the heat-dissipating 7L piece is not shown in the figure 19A to 19C. The figure is the fourth state.

第20A 20E圖為一系列之正面剖面圖,係顯示本發明 之散熱7G件的製造方法之第二實施型態,其中第2〇A〜2〇c 圖係顯示元件接合步驟,第2GD圖係顯示摩擦震動接合步 驟,第20E圖係顯示間隔物脫離步驟。 第21A〜21D圖係顯示本發明之散熱元件的製造方法之 第三實施型態,其中第21A圖係顯示鰭片配置步驟之正 剖面圖’第21B、21C圖係顯示基板配置步驟之正面与 圖,第20D圖係顯示第21c圖之部分放大圖。 面 第m〜22B圖為-系列之正面剖面圖,係顯 第则d圖的步驟,其中第22A圖係顯示摩 = 步驟,第22B圖係顯示間隔物脫離步驟。 接5 第23A〜23E圖為-系列之正面剖面圖 之散㈣的製造方法之第四實施型態之元件接合步本:明 弟24A〜24B圖為一系列之正面剖面圖,係顯 第23A〜现圖的步驟,其中第24A圖係顯示摩捧震^於 步驟,第24B圖係顯示間隔物脫離步驟。 合 第25A〜25B圖為-系列之斜.,視霄、,係顧示 熱元件其他的實施型態。 β之政20A 20E is a series of front cross-sectional views showing a second embodiment of the method for manufacturing a heat dissipating 7G member of the present invention, wherein the second 〇A to 2〇c diagram shows the component bonding step, and the second GD image system The frictional vibration bonding step is shown, and the 20E is a spacer separation step. 21A to 21D are views showing a third embodiment of the method for manufacturing a heat dissipating member of the present invention, wherein FIG. 21A is a front sectional view showing a step of disposing the fins. FIGS. 21B and 21C are diagrams showing the front side of the substrate disposing step. Fig. 20D is a partial enlarged view of Fig. 21c. Surfaces m to 22B are front cross-sectional views of the series, showing the steps of the second graph, in which the 22A is a step = 2 and the 22B is a spacer. 5th 23A to 23E is a series of front cross-sectional views of the series (four) manufacturing method of the fourth embodiment of the component joint step: Mingdi 24A ~ 24B picture is a series of frontal sectional view, showing the 23A ~ The steps of the current drawing, wherein the 24A figure shows the step of the vibration, and the 24B shows the step of the spacer separation. The picture of the 25A~25B is the series of the oblique. The view is the other embodiment of the thermal element. Rule of law

2036-5808B-PF 164 1270429 弟2 6 A〜2 6 C圖為一糸列之斜視圖,係顯示本發明之散 熱元件其他的實施型態。 弟27A〜2 7B圖係顯示貫際製造的散熱元件之鰭片與基 板的接合部,其中第27A圖為部分放大剖面圖,第27β圖 為第2 7 A圖之部分放大圖。 第28A〜28C圖係顯示摩擦震動接合的順序,其中第 28A、28B圖為正面剖面圖,第28C圖為第28B圖之侧視圖。 第29A〜29C圖為一系列之剖面圖,係顯示第28a〜28C 圖之紹元件與銅元件之重合部之塑性變形的過程。 第30圖為一正面剖面圖,係顯示金屬元件之摩擦震動 接合之另一例子。 第31圖為一斜視圖,係顯示本發明之散熱元件之一實 施型態。 弟32A〜32E圖為一系列之正而立丨|而同 ^ ^ ^ 丁 n &lt;止曲剖面圖,係顯示第31圖 之散熱元件之製造方法。 苐33A〜33C圖為一系列之斜滿I [51,总# — &amp; 丁 &lt;针視圖,係顯不第32D圖所 示之接合治具的移動執跡的例子。 第34圖為一斜視圖,係顯示本發明之散熱元件之另一 實施型態。 34圖 第35A〜35D圖為一系列之正面剖面圖,係顯示第 之散熱元件之製造方法。 第36A~36B圖係顯示本發明散熱器之第一實施型態, 其中第圖為分解斜視圖’第爾霄為崎後的斜視圖 第37A圖為第36A〜36B圖之散熱器之俯視圖。 2036-5808B-PF 165 1270429 第3 7B 3 7C圖分別為第36A〜36B圖之散熱器之χ方向 側視圖與Υ方向側視圖。 第38圖為一組裝後的斜視圖,係顯示本發明散熱器之 第二實施型態。 第39Α〜39Β圖係顯示本發明散熱器之第三實施型態, 其中第39Α圖為分解斜視圖,第3叩圖為組裝後的斜視圖。 第40Α圖為第39Α〜39β圖之散熱器之俯視圖。 φ 第4〇B、4〇C圖分別為第39Α〜39Β圖之散熱器之χ方向 側視圖與Υ方向側視圖。 第41圖為一組裝後的斜視圖,係顯示本發明散熱器之 弟四實施型態。 第42Α〜42Β圖係顯示本發明散熱器之第五實施型態, 其中第42Α圖為分解斜視圖,第㈣圖為組裝後的斜視圖。 第43Α圖為第42Α〜42Β圖之散熱器之俯視圖。 第43Β 43C圖分別為第42Α〜42Β圖之散熱器之χ方向 •φ 侧視圖與Υ方向側視圖。 第4 4圖為一組裝後的斜視圖’係顯示本發明散熱器之 第六實施型態。 第45Α〜45Β圖係顯示本發明散熱器之第七實施型態, 其中第45Α圖為分解斜視圖,f 45β圖為組裝後的斜視圖。 第46Α圖為第45Α〜45Β圖之散熱器之俯視圖。 第46Β、46C圖分別為第45Α〜45Β圖之散熱器之χ方向 側視圖與Υ方向側視圖。 第47圖為一組裝後的斜視圖,係顯示本發明散熱器之 2036-5808B-PF 166 1270429 第八實施型態。 第48A〜48C圖係顯示本發明金屬元件接合方法之第一 實施型態之順序,其中第48A、48B圖為正面剖面圖,第 48C圖為第48B圖之側視圖。 第49A〜49C圖為一系列之剖面圖,係顯示第48A〜48C 圖之铭元件與銅元件之重合部之塑性變形的過程。 第50A圖係顯示第48A〜48C圖之接合治具之部分放大 圖。 第50B〜50D圖係顯示第48A〜48C圖之接合治具之圓周 面的凹槽的其他例子。 第51圖為一正面剖面圖,係顯示金屬元件的摩擦震動 接合的其他例子。 弟52A〜52B圖為一系列之正面剖面圖 之金屬元件接合方法之第二實 々第53A 53B圖為一系列之正面剖面圖,係顯示接續於 第52A〜52B圖的步驟,其中第53A圖係顯示摩擦震動接合 步驟’第53B圖係顯示間隔物脫離步驟。 、…第54圖為一分解斜視圖,係顯示本發明之散熱元件製 這用治具之一實施型態。 第55圖為—斜視圖,係顯示本發明之散熱元件之― 施型態。 Ά 第 56Α〜56C 圖;4 — ^ -c* …糸列之斜視圖,係顯示第53Α圖所 不之摩擦震動接合步 之接a 具的移動軌跡的例子。 第57圖為一 Π: ; &quot; 面°lJ面圖,係顯示第53Α圖所示之摩擦2036-5808B-PF 164 1270429 Brother 2 6 A~2 6 C is a perspective view of a column showing other embodiments of the heat radiating element of the present invention. The brothers 27A to 2B show the joint portion of the fin and the substrate of the heat-dissipating member which is manufactured continuously, and Fig. 27A is a partially enlarged cross-sectional view, and Fig. 27β is a partially enlarged view of the 27th. Figs. 28A to 28C show the order of frictional vibration engagement, in which the 28A, 28B are front cross-sectional views and the 28Cth is the side view of Fig. 28B. Figs. 29A to 29C are a series of sectional views showing the process of plastic deformation of the overlapping portion of the element and the copper element in Figs. 28a to 28C. Figure 30 is a front cross-sectional view showing another example of frictional vibration engagement of a metal member. Fig. 31 is a perspective view showing an embodiment of the heat dissipating member of the present invention. The brothers 32A to 32E are a series of positive and vertical 丨 而 而 而 而 ^ & & & & & & 止 止 止 止 止 止 止 止 止 止 止 止 止 止 止 止 止 止 止 止 止 止 止苐33A to 33C are a series of oblique full I [51, total # — &amp; ding &lt; pin view, showing an example of the movement of the jig of the jig shown in Fig. 32D. Figure 34 is a perspective view showing another embodiment of the heat dissipating member of the present invention. 34. Figures 35A to 35D are a series of front cross-sectional views showing the method of manufacturing the first heat dissipating member. 36A to 36B are views showing a first embodiment of the heat sink of the present invention, wherein the figure is an exploded perspective view, and the third embodiment of the heat sink is shown in Fig. 37A to Fig. 36A to Fig. 36B. 2036-5808B-PF 165 1270429 3rd 7B 3 7C are the χ direction of the heat sink of the 36A~36B, respectively. Side view and side view of the Υ direction. Figure 38 is a perspective view showing an assembled second embodiment of the heat sink of the present invention. The 39th to 39th drawings show a third embodiment of the heat sink of the present invention, wherein the 39th drawing is an exploded perspective view, and the 3rd drawing is an assembled oblique view. Figure 40 is a top view of the heat sink of the 39th to 39th figure. φ The 4th, 4th, 4th and 4th Cth views are the χ direction of the radiator of the 39th to 39th , the side view and the side view of the Υ direction. Fig. 41 is a perspective view showing the assembled embodiment of the heat sink of the present invention. The fourth embodiment of the heat sink of the present invention is shown in Figs. 42 to 42, wherein the 42nd drawing is an exploded perspective view, and the fourth drawing is an assembled oblique view. Figure 43 is a top view of the radiator of the 42nd to 42nd drawings. Page 43 Β 43C is the χ direction of the radiator of the 42nd Α 42 42 • • 侧视图 side view and side view of the Υ direction. Fig. 4 is a perspective view of an assembled view showing a sixth embodiment of the heat sink of the present invention. The 45th to 45th drawings show the seventh embodiment of the heat sink of the present invention, wherein the 45th drawing is an exploded oblique view, and the f 45β drawing is an assembled oblique view. Figure 46 is a top view of the radiator of the 45th to 45th drawings. The 46th and 46thth views are the direction of the radiator of the 45th to 45th, respectively, and the side view and the side view of the Υ direction. Figure 47 is an assembled perspective view showing the eighth embodiment of the heat sink 2036-5808B-PF 166 1270429 of the present invention. 48A to 48C are views showing the sequence of the first embodiment of the metal element bonding method of the present invention, wherein the 48A, 48B are front cross-sectional views, and the 48Cth is a side view of the 48B. Figs. 49A to 49C are a series of sectional views showing the process of plastic deformation of the overlapping portion of the inscription element and the copper member in Figs. 48A to 48C. Fig. 50A is a partially enlarged view showing the jig of the 48A to 48C. The 50B to 50D drawings show other examples of the grooves of the circumferential faces of the jigs of Figs. 48A to 48C. Fig. 51 is a front sectional view showing another example of frictional vibration engagement of a metal member. The second embodiment of the metal element joining method of a series of front cross-sectional views is shown in Fig. 53A 53B as a series of front cross-sectional views showing the steps following the steps 52A to 52B, wherein Fig. 53A A frictional vibration engagement step is shown 'Fig. 53B showing the spacer detachment step. Fig. 54 is an exploded perspective view showing one embodiment of the jig for the heat dissipating member of the present invention. Fig. 55 is a perspective view showing the mode of the heat dissipating member of the present invention. Ά 56th ~ 56C Figure; 4 - ^ -c* ... slanted view of the , column, showing an example of the movement trajectory of the frictional vibration joint step of Fig. 53. Figure 57 is a Π: ; &quot; face °lJ surface, showing the friction shown in Figure 53

2036-5808B-PF 167 1270429 震動接合步驟之另一例子 ’係顯示本發明之散熱元件之 第58圖為一正面剖面圖 另一實施型態。 面剖面圖,係顯示第58圖 中第59A圖為第一樣態, 第59A〜59C圖為〜έ r 糸列之正 所示之散熱元件的製造順序,其 第5 9B、5 9C圖為第二樣熊。 第60A〜60G圖為一备μ 糸列之正面剖面圖,係顯示第58圖2036-5808B-PF 167 1270429 Another example of the vibration bonding step is shown in Fig. 58 which is a front cross-sectional view of another embodiment of the heat dissipating member of the present invention. In the cross-sectional view, FIG. 59A shows the first state, and FIGS. 59A to 59C show the manufacturing sequence of the heat dissipating component shown in the έr 糸 column, and the 5th 5th and 5th 9th are The second kind of bear. Figure 60A~60G is a front cross-sectional view of a preparation μ, showing Figure 58

所示之散熱元件的製造迤 '^ ^ 、順序,其中第60Α〜6〇C圖為第三樣 態’第60D〜60G圖為第四樣熊。 第61Α〜61Ε圖為—备&amp; &gt; 糸列之正面剖面圖,係顯示本發明 之金屬元件接合方法之窜—^ t弟二貫施型態,其中第61Α〜61C圖 係顯示元件接合步驟,筮β η η θ ^ 弟61D圖係顯不接合步驟,第61Ε 圖係顯示間隔物脫離步驟。 第62Α〜62D圖係顯示本發明之金屬元件接合方法之第 四實施型態,其中第62Α圖係顯示縛片配置步驟之正面剖 面圖,第62Β、62C圖係顯示基板配置步驟之正面剖面圖’ 苐62D圖係顯示第62C圖之部分放大圖。 第63Α〜63Β圖為一系列之正面剖面圖,係顯示接續於 第62Α〜62D圖的步驟,其中第63Α圖係顯示摩擦震動接合 步驟’第63Β圖係顯示間隔物脫離步驟。 弟64Α〜64Ε圖為一系列之正面剖面圖,係顯示本發明 之散熱元件的製造方法之第一實施型態之元件接合步驟。 第65Α〜65Β圖為一系列之正面剖實厨,係傭示、接續於 第64A〜64E圖的步驟,其中第65A圖係顯示摩擦震動接合 2036-5808B-PF 168 1270429 步驟’第65B圖係顯示間隔物脫離步驟。 第66A〜66C圖係顯示特許文獻一所揭示的摩擦震動接 合的順序,其中第66A、66B圖為正面剖面圖,第66C圖為 第66B圖之侧視圖。 第67A~67D圖為一系列之部分斜視圖,係顯示特許文 獻一所揭示的接合治具。 第68A〜68C圖係顯示第一實施型態之金屬元件接合方 # 法之摩擦接合的順序,其中第68A、68B圖為正面剖面^, 第68C圖為第68B圖之側視圖。 第69A〜69C圖為一系列之剖面圖,係顯示第68A〜68(: 圖之紹元件與銅元件之重合部之塑性變形的過程。 第70圖係顯示第68圖之接合治具之部分放大圖。 第71A〜71C圖係顯示第二實施型態之金屬元件接合方 法所使用的接合治具,其中第71A圖為斜視圖,第71B、 71C為其他例子的底面視圖。 • 第72A〜72B圖為一系列之斜視圖,係顯示第二實施型 恶之金屬70件接合方法所使用的接合治具之其他例子。 第73A〜73B圖為一系列之剖面圖,係顯示第二實施型 悲之金屬元件接合方法之摩擦接合的步驟。 第74A圖為一斜視圖,係顯示一散熱元件。 第74B〜74C圖為一系列之剖面圖,係顯示第74人圖所 示之散熱元件的製造步驟。 第75A〜75B圖為一系列之剖货,1 示之散熱元件的製造步驟。 2036-5808B-PF 169 1270429 第7 β圖為一剖面圖,係顯示散熱元件之另一例子。 第77圖為一斜視圖,係顯示第76圖之散熱元件構成 中之散熱鱗片。 第78圖為一斜視圖,係顯示第76圖之散熱元件製造 時所使用的支持治具。 第79A〜79C圖為一系列之剖面圖,係顯示第76圖所示 之散熱元件的製造步驟。 φ 第8〇A〜80D圖為一系列之剖面圖與一斜視圖,係顯示 第76圖所示之散熱元件的變形例。 第81A〜81B圖係顯示本發明之散熱元件之第一實施型 L,其中第81A圖為斜視圖,第81β圖為分解斜視圖。 第82A圖為第81A圖沿AA線之剖面圖。 第82B圖為第81A圖沿Ββ線之剖面圖。 第82C圖為第81A圖之底部視圖。 第83A〜83B圖為一系列之剖面圖,係顯示第81A〜81B • 圖之散熱元件的製造方法之一例。 第84A〜84B圖係顯示接續於第83A〜83β圖的步驟,其 中第j4A圖為側視圖,帛84B圖為要部放大剖面圖。 弟85圖為一斜視圖,係顯示接續於第84A〜84B圖的步 驟。 係顯示第81A〜81B ,徐顯示接讀於第 第86A〜86E圖為—系列之剖面圖 圖之散熱元件的製造方法之另—例。 第&quot;A〜87B圖為一系列,之剖面圖The manufacturing of the heat dissipating component shown is '^^, the order, wherein the 60th to 6th C is the third state', and the 60th to 60th is the fourth bear. The 61st to 61th drawings are a front cross-sectional view of the &&gt; 糸 , , , , , , 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属In the step, the 筮β η η θ ^ brother 61D system shows no bonding step, and the 61st image shows the spacer detachment step. Figures 62 to 62D show a fourth embodiment of the metal component bonding method of the present invention, wherein the 62nd drawing shows a front sectional view of the bonding step, and the 62nd, 62C shows a front sectional view of the substrate configuration step. The '苐62D image shows a partial enlarged view of Fig. 62C. Sections 63 to 63 are a series of front cross-sectional views showing the steps following Fig. 62 to 62D, wherein Fig. 63 shows the frictional vibration engagement step. Fig. 63 shows the spacer detachment step. The drawings are a series of front cross-sectional views showing the element bonding step of the first embodiment of the method for manufacturing the heat dissipating member of the present invention. The 65th to 65th drawings are a series of front-facing kitchens, which are the steps of the 64A-64E diagram, wherein the 65A diagram shows the frictional vibration joint 2036-5808B-PF 168 1270429. The spacer separation step is displayed. The drawings of Figs. 66A to 66C show the order of the frictional vibration engagement disclosed in Patent Document 1, wherein the 66A and 66B are front sectional views, and the 66C is a side view of the 66B. Figures 67A-67D are a series of oblique views showing the joint fixture disclosed in the franchise document. Figs. 68A to 68C show the order of the frictional engagement of the metal element joining method of the first embodiment, wherein the 68A, 68B is a front cross section ^, and the 68C is a side view of the 68B drawing. Figures 69A to 69C are a series of sectional views showing the process of plastic deformation of the overlapping portions of the elements and the copper elements of Figs. 68A to 68. Fig. 70 shows the part of the bonding fixture of Fig. 68. Fig. 71A to Fig. 71C show the joint jig used in the metal element joining method of the second embodiment, wherein Fig. 71A is a perspective view, and Figs. 71B and 71C are bottom views of other examples. • 72A~ 72B is a series of oblique views showing other examples of the joining jig used in the joining method of the 70th metal of the second embodiment. Figs. 73A to 73B are a series of sectional views showing the second embodiment. The step of frictional engagement of the sorrowful metal component joining method. Fig. 74A is a perspective view showing a heat dissipating component. Figs. 74B to 74C are a series of sectional views showing the heat dissipating component shown in Fig. 74. Manufacturing steps. Figures 75A to 75B are a series of cut goods, and 1 shows the manufacturing steps of the heat dissipating component. 2036-5808B-PF 169 1270429 The 7th graph is a cross-sectional view showing another example of the heat dissipating component. Figure 77 is an oblique view showing Fig. 78 is a perspective view showing a support jig used in the manufacture of the heat dissipating member of Fig. 76. Figs. 79A to 79C are a series of sectional views, The manufacturing steps of the heat dissipating member shown in Fig. 76 are shown. φ Fig. 8A to Fig. 80D are a series of sectional views and oblique views showing a modification of the heat dissipating member shown in Fig. 76. 81B shows a first embodiment L of the heat dissipating member of the present invention, wherein FIG. 81A is a perspective view, and FIG. 81β is an exploded perspective view. FIG. 82A is a cross-sectional view taken along line AA of FIG. 81A. Fig. 81A is a cross-sectional view taken along line Β. Fig. 82C is a bottom view of Fig. 81A. Figs. 83A to 83B are a series of sectional views showing an example of a method of manufacturing the heat dissipating member of Figs. 81A to 81B. Figures 84A to 84B show the steps following the 83A to 83β map, wherein the j4A picture is a side view, and the 帛84B picture is an enlarged view of the main part. The brother 85 picture is a perspective view, which is shown in the following section 84A~ Steps of the 84B diagram. The system displays the 81A~81B, and the Xu display reads the 8th. 6A~86E is a cross-sectional view of the series. Another example of the manufacturing method of the heat dissipating component of the figure. The &quot;A~87B is a series of sectional views.

86A〜86E圖的步驟。 2036-5808B-PF 170 1270429 第88A〜88B圖為一李列之料3 糸夕j之斜視圖,係分別顯示本發明 之散熱元件#第二實施㉟態與第三實施型態。 第89A〜89C圖為一李列之斜相 糸夕〗之斜視圖,係分別顯示本發明 之散熱元件的第四實施型態至第六實施型態。 第90A〜90C圖為一李列之料$ 糸夕】之斜視圖,係分別顯示本發明 之散熱元件的第七實施型態至第九實施型態。 第91A〜91B圖為一季列展、 糸夕彳之斜視圖,係分別顯示本發明 之散熱元件的第十實施型態與第十一實施型態。 第92H2B圖為一系列之斜視圖,係分別顯示本發明 之散熱器的第一實施型態與第二實施型態。 第93A~93B圖為一系列之剖面圖,係顯示實施例^之 各樣品的斷面形狀與尺寸。 第93C圖為-柱狀圖,係顯示實施例1之模擬結果。 弟94A〜94B圖為-系列之柱狀圖,係顯示實施例 核擬結果。 第95A〜95C圖為一系列之剖面圖,係顯示實施例3之 各樣品的斷面形狀與尺寸。 第95D〜95E圖為一系列之柱狀圖,係顯示實施例3 模擬結果。 第9 6圖為一折線圖 第97圖為一折線圖 苐98圖為一剖面圖 應用例。 第99圖為一剖面圖 係顯不貫施例4之模擬結果。 係顯示實施例4之模擬結果。 係顯示摩擦震動接合方法之第— 係顯不摩擦震動接合方法之Steps of the 86A~86E diagram. 2036-5808B-PF 170 1270429 The drawings of Figs. 88A to 88B are oblique views of a row of materials, and the heat dissipation elements of the present invention are respectively shown in the second embodiment of the third embodiment and the third embodiment. Figs. 89A to 89C are oblique views of a diagonal line of the Lie column, showing the fourth to sixth embodiments of the heat dissipating member of the present invention, respectively. The 90th to 90thth views are oblique views of a material of the Lie column, showing the seventh embodiment to the ninth embodiment of the heat dissipating member of the present invention, respectively. Figs. 91A to 91B are oblique views of a season and an empire, showing a tenth embodiment and an eleventh embodiment of the heat dissipating member of the present invention, respectively. Fig. 92H2B is a series of oblique views showing the first embodiment and the second embodiment of the heat sink of the present invention, respectively. Figures 93A-93B are a series of cross-sectional views showing the cross-sectional shapes and dimensions of the samples of Example ^. Fig. 93C is a histogram showing the simulation results of Example 1. The pictures 94A to 94B are a histogram of the series, showing the results of the example verification. Figs. 95A to 95C are a series of sectional views showing the sectional shape and size of each sample of Example 3. Figures 95D to 95E are a series of histograms showing the simulation results of Example 3. Fig. 9 is a line diagram. Fig. 97 is a line diagram. Fig. 98 is a section diagram. Figure 99 is a cross-sectional view showing the simulation results of Example 4. The simulation results of Example 4 are shown. The first method of the frictional vibration bonding method is shown.

2036-5808B-PF 171 1270429 應用例。 第100圖為一剖面圖,係顯示摩擦震動接合方法之第 三應用例。 第1 01圖為一剖面圖,係顯示摩擦震動接合方法之第 四應用例。 第102A〜102B圖為一系列之剖面圖,,係顯示摩擦震 動接合方法之第五應用例。 第103A〜103B圖為一系列之剖面圖,,係顯示摩擦震 w 動接合方法之第六應用例。 第1 04圖為一剖面圖,係顯示摩擦震動接合方法之第 七應用例。 第105A〜105B圖為一系列之剖面圖,,係顯示摩擦震 動接合方法之第八應用例。 第1 0 6 A〜1 0 6 B圖為一系列之剖面圖,,係顯示摩擦震 動接合方法之第九應用例。 • 第107圖為一剖面圖,係顯示摩擦震動接合方法之第 十應用例。 第1 08圖為一剖面圖,係顯示摩擦震動接合方法之第 十一應用例。 第1 09圖為一剖面圖,係顯示摩擦震動接合方法之第 十二應用例。 第11 0圖為一剖面圖,係顯示摩擦震動接合方法之第 十三應用例。 第111圖為一剖面圖,係顯示摩擦震動接合方法之第 2036-5808B-PF 172 1270429 十四應用例。 第11 2圖為一剖面圖,係顯示摩擦震動接合方法之第 十五應用例。 第11 3圖為一剖面圖,係顯示摩擦震動接合方法之第 十六應用例。 第114圖為一剖面圖,係顯示摩擦震動接合方法之第 十七應用例。 第11 5圖為一剖面圖,係顯示摩擦震動接合方法之第 0十八應用例。 第11 6圖為一剖面圖,係顯示摩擦震動接合方法之第 十九應用例。 第11 7圖為一剖面圖,係顯示摩擦震動接合方法之第 二十應用例。 第118圖為一剖面圖,係顯示摩擦震動接合方法之第 二Η 應用例。 φ 第119圖為一剖面圖,係顯示摩擦震動接合方法之第 二十二應用例。 第120圖為一剖面圖,係顯示摩擦震動接合方法之第 二十三應用例。 第121圖為一剖面圖,係顯示摩擦震動接合方法之第 二十四應用例。 第122圖為一剖面圖,係顯示摩擦震動接合方法之第 二十五應用例。 第123圖為一剖面圖,係顯示摩擦震動接合方法之第 2036-5808B-PF 173 1270429 二十六應用例。 第124A〜124B圖為一剖面圖,係顯示摩擦震動接合方 法之第二十七應用例。 第125A〜125B圖為一剖面圖,係顯示摩擦震動接合方 法之第二十八應用例。 【主要元件符號說明】 101〜鋁元件; 102〜銅元件; 102b〜段部; 103’〜接合治具; 1 0 3 b〜轉動軸; 105〜散熱器材料; 105b〜散熱鰭片; 106a〜表面; 108〜散熱鰭片支持具 201’〜鋁元件; 202a〜表面; 203〜接合治具; 203b〜轉動轴; 204’〜鰭片; 2 0 4 a〜基端部; 204B〜平面波形的鰭片 205’〜間隔物; 101,〜鋁元件; 102a〜表面; 103〜接合治具; 103a〜治具本體; 104〜散熱元件; 1 0 5 a〜基板; 106〜傳熱板; 107〜接合治具桌; 201〜鋁元件; 202〜銅元件; 202b〜段部; 203a〜治具本體; 204〜鰭片; 204’ ’〜梳子狀鰭片; 204A〜圓筒形狀的鰭片; ;205〜間隔物; 206〜基板; 2036-5808B-PF 174 12704292036-5808B-PF 171 1270429 Application example. Fig. 100 is a cross-sectional view showing a third application example of the frictional vibration joining method. Fig. 1 01 is a cross-sectional view showing a fourth application example of the frictional vibration joining method. Figs. 102A to 102B are a series of sectional views showing a fifth application example of the frictional vibration bonding method. Figs. 103A to 103B are a series of sectional views showing a sixth application example of the frictional vibration joining method. Fig. 1 04 is a cross-sectional view showing a seventh application example of the frictional vibration joining method. Figs. 105A to 105B are a series of sectional views showing an eighth application example of the frictional vibration joining method. The first 0 6 A to 1 0 6 B is a series of sectional views showing a ninth application example of the frictional vibration bonding method. • Fig. 107 is a cross-sectional view showing a tenth application example of the frictional vibration joining method. Fig. 1 08 is a cross-sectional view showing an eleventh application example of the frictional vibration joining method. Fig. 09 is a cross-sectional view showing the twelfth application example of the frictional vibration joining method. Fig. 10 is a cross-sectional view showing a thirteenth application example of the frictional vibration joining method. Figure 111 is a cross-sectional view showing the application example of the frictional vibration joining method of 2036-5808B-PF 172 1270429. Fig. 11 is a cross-sectional view showing a fifteenth application example of the frictional vibration joining method. Fig. 13 is a cross-sectional view showing a sixteenth application example of the frictional vibration joining method. Fig. 114 is a cross-sectional view showing the seventeenth application example of the frictional vibration joining method. Fig. 15 is a cross-sectional view showing the application example of the vibration vibration joining method. Fig. 11 is a cross-sectional view showing the nineteenth application example of the frictional vibration joining method. Fig. 11 is a cross-sectional view showing a twentieth application example of the frictional vibration joining method. Figure 118 is a cross-sectional view showing the second application example of the frictional vibration joining method. Fig. 119 is a cross-sectional view showing the twenty-second application example of the frictional vibration joining method. Fig. 120 is a cross-sectional view showing the twenty-third application example of the frictional vibration joining method. Fig. 121 is a cross-sectional view showing the twenty-fourth application example of the frictional vibration joining method. Fig. 122 is a cross-sectional view showing the twenty-fifth application example of the frictional vibration joining method. Figure 123 is a cross-sectional view showing the twenty-sixth application example of the frictional vibration bonding method of 2036-5808B-PF 173 1270429. Figs. 124A to 124B are cross-sectional views showing a twenty-seventh application example of the frictional vibration joining method. Figs. 125A to 125B are a cross-sectional view showing a twenty-eighth application example of the frictional vibration joining method. [Main component symbol description] 101~aluminum component; 102~copper component; 102b~section; 103'~joint fixture; 1 0 3 b~rotation axis; 105~heat sink material; 105b~ heat sink fin; 106a~ Surface; 108~ heat sink fin support 201'~aluminum component; 202a~surface; 203~joint fixture; 203b~rotation axis; 204'~fin; 2 0 4 a~base end; 204B~planar waveform Fin 205'~ spacer; 101, ~ aluminum element; 102a~ surface; 103~ joint fixture; 103a~ fixture body; 104~ heat dissipation element; 1 0 5 a~ substrate; 106~ heat transfer plate; Bonding fixture table; 201~aluminum component; 202~copper component; 202b~section; 203a~ fixture body; 204~fin; 204''-comb fin; 204A~cylindrical fin; 205~ spacer; 206~substrate; 2036-5808B-PF 174 1270429

206’〜基板; 206B〜半圓筒基板; 21卜箱型治具本體; 211a〜蜾絲孔; 213〜壓板; 215〜基板固定板; 215b〜螺絲孔; 220〜間隔物治具; 2 5 0〜散熱元件; 2 51〜散熱元件; 253〜散熱元件; 2 5 5〜散熱元件; 30Γ〜鋁元件; 302a〜表面; 303〜接合治具; 303b〜轉動軸; 3 0 4 a〜夾溝; 305a〜突起; 306a〜間隔物; 307a〜鋁製基板; 310A〜散熱器; 310C〜散熱元件; 310E〜散熱器; 310G〜散熱器; 206A〜基板; 207〜反應層; 210〜散熱元件製造用治具; 212〜元件設定部; 214〜緊閉螺栓; 21 5 a〜凹槽; 216〜緊閉螺栓; 23卜鋁合金製的薄板材; 2 5 0 ’〜散熱元件; 252〜散熱元件; 2 5 4〜散熱元件; 301〜鋁元件; 302〜銅元件; 302b〜容器; 303a〜治具本體; 304〜鋁製的鰭片; 3 0 5〜銅製的基板; 306〜間隔物治具; 307〜鋁散熱部; 307b〜鰭片; 310B〜散熱元件; 310D〜散熱元件; 310 F〜散熱器; 310H〜散熱元件;206'~substrate; 206B~semi-cylindrical substrate; 21-box type jig body; 211a~蜾 wire hole; 213~ platen; 215~substrate fixing plate; 215b~screw hole; 220~spacer fixture; 2 5 0 ~ heat sink component; 2 51 ~ heat sink component; 253 ~ heat sink component; 2 5 5 ~ heat sink component; 30 Γ ~ aluminum component; 302a ~ surface; 303 ~ joint fixture; 303b ~ rotating shaft; 305a~protrusion; 306a~spacer; 307a~aluminum substrate; 310A~heat sink; 310C~ heat dissipating component; 310E~heat sink; 310G~heat sink; 206A~substrate; 207~reactive layer; Fixture; 212~component setting section; 214~tight bolt; 21 5 a~groove; 216~tight bolt; 23 aluminum alloy thin plate; 2 5 0 '~ heat dissipating component; 252~ heat dissipating component; 2 5 4~ heat dissipating component; 301~aluminum component; 302~copper component; 302b~container; 303a~ fixture body; 304~ aluminum fin; 3 0 5~ copper substrate; 306~ spacer jig; 307~ aluminum heat sink; 307b~ fin; 310B~ heat sink; 31 0D~ heat dissipating component; 310 F~ heat sink; 310H~ heat dissipating component;

2036-5808B-PF 175 12704292036-5808B-PF 175 1270429

3 2 0〜風扇; 321’〜風扇裝設元件; 3 21 a〜上板部; 3 21 c〜空氣孔; 321e〜裝設孔; 321g〜夾溝; 322a〜風扇箱型物; 330〜導熱管; 340〜CPU ; 341a〜嵌合溝; 3 4 3〜插槽; 344〜門形裝設夾; 3 5 0〜散熱元件; 360〜散熱元件; 401〜鋁元件; 402a〜表面; 403〜接合治具; 403a〜治具本體; 403c〜凹槽; 404a〜基端部; 405’〜間隔物; 406’〜基板; 411〜箱型治具本體; 41 la〜螺絲孔; 321〜風扇裝設元件; 321’ ’〜風扇裝設元件; 321b〜侧板部; 32Id〜小型螺絲孔; 321f〜小型螺絲; 3 2 2〜風扇; 322b〜裝設孔; 331〜基底; 3 41〜受熱元件; 342〜金屬裝設元件; 343a〜突起; 344a〜裝設孔; 3 5 0 ’〜散熱元件; 360’〜散熱元件; 402〜銅元件; 402b〜段部; 403’〜接合治具; 403b〜轉動轴; 404〜鰭片; 405〜間隔物; 4 0 6〜基板; 406a〜另一表面; 4ΊΌ〜散熱元件製、造用、治具 412〜元件設定部; 2036-5808B-PF 17 6 1270429 41 3〜壓板; 415〜基板固定板; 41 5b〜螺絲孔; 420〜間隔物治具; 450〜散熱元件; 4 5 0 ’〜散熱元件; 4 6 2a〜表面; ^ 463a〜治具本體; 4 6 3 b〜細條; 4 6 3 c〜突起; 463d〜突起; 464a〜基端部; 464c〜前端部; 502〜銅元件; 502b〜段部; • 503〜接合治具; 503b〜轉動軸; 504〜接合治具; 504b〜轉動轴; 507〜基板; 508a〜散熱鰭片; 509a〜底部; 509c〜開口; 510a〜凹部; 414〜緊閉螺栓; 415a〜凹槽; 41 6〜緊閉螺栓; 4 3 0〜鰭片構成材, 4 31〜紹合金製的薄板材; 4 6 2〜基板; 463〜接合治具; 4 6 3 B〜接合治具; 463C〜接合治具; 463D〜接合治具; 464〜鰭片; 464b〜散熱面; 501〜鋁元件; 502a〜表面; 5 0 2 c〜狹缝; 503a〜治具本體; 503c〜凹槽; 504a〜治具本體; 5 0 6〜散熱元件; 5 0 8〜散熱元件; 509〜下部鍛造模具; 509b〜内部空間; 5Τα〜上部鍛造模具; 511〜切削器具; 2036-5808B-PF 177 1270429 511a〜刀具; 512〜散熱元件; 512b〜基板; 513〜支持器具; 514a〜箱型治具本體; 514b〜緊閉螺栓; 601B〜散熱元件; 0 6 01D〜散熱元件; 601F〜散熱元件; 601H〜散熱元件; 601J〜散熱元件; 6 0 2〜基板; 602 b〜表面; 603〜鰭片; 603a〜基端部; • 605-CPU ; 606a〜凹部; 607a〜間隔部; 608〜接合治具; 6 0 8 b〜轉動轴; 610〜間隔物; 61 2a〜元件設定部; 613〜固定工具; 620A〜散熱器;3 2 0~fan; 321'~fan mounting component; 3 21 a~ upper plate section; 3 21 c~ air hole; 321e~ mounting hole; 321g~ grooving; 322a~fan box type; 330~ heat conduction Tube; 340~CPU; 341a~fitting groove; 3 4 3~slot; 344~gate-shaped mounting clip; 3 5 0~ heat dissipating component; 360~ heat dissipating component; 401~aluminum component; 402a~surface; Bonding fixture; 403a~ fixture body; 403c~groove; 404a~base end; 405'~ spacer; 406'~substrate; 411~ box fixture body; 41 la~ screw hole; 321~fan Set the components; 321' 'fan assembly components; 321b ~ side plate parts; 32Id ~ small screw holes; 321f ~ small screws; 3 2 2 ~ fan; 322b ~ mounting holes; 331 ~ base; 3 41 ~ heating elements ; 342~ metal mounting component; 343a~protrusion; 344a~ mounting hole; 3 5 0 '~ heat dissipating component; 360'~ heat dissipating component; 402~copper component; 402b~section; 403'~joint fixture; ~ rotating shaft; 404 ~ fin; 405 ~ spacer; 4 0 6 ~ substrate; 406a ~ another surface; 4 ΊΌ ~ scattered Component manufacturing, manufacturing, fixture 412 to component setting section; 2036-5808B-PF 17 6 1270429 41 3~ pressure plate; 415~ substrate fixing plate; 41 5b~ screw hole; 420~ spacer jig; 450~ heat dissipating component 4 5 0 '~heat dissipating component; 4 6 2a~surface; ^ 463a~ fixture body; 4 6 3 b~ strip; 4 6 3 c~protrusion; 463d~protrusion; 464a~ base end; 464c~ front end ; 502 ~ copper element; 502b ~ section; • 503~ joint fixture; 503b~ rotation axis; 504~ joint fixture; 504b~ rotation axis; 507~ substrate; 508a~ heat sink fin; 509a~ bottom; 509c~ Opening; 510a~recess; 414~tight bolt; 415a~groove; 41 6~tight bolt; 4 3 0~fin sheet, 4 31~ thin alloy plate; 4 6 2~substrate; 463 ~ joint fixture; 4 6 3 B ~ joint fixture; 463C ~ joint fixture; 463D ~ joint fixture; 464 ~ fin; 464b ~ heat sink; 501 ~ aluminum components; 502a ~ surface; 5 0 2 c~ Slit; 503a~ fixture body; 503c~groove; 504a~ fixture body; 5 0 6~ heat dissipation component; 5 0 8~ Thermal element; 509~lower forging die; 509b~internal space; 5Τα~upper forging die; 511~cutting tool; 2036-5808B-PF 177 1270429 511a~tool; 512~heating element; 512b~substrate; 513~supporting device; 514a ~ box type fixture body; 514b ~ tight bolt; 601B ~ heat sink component; 0 6 01D ~ heat sink component; 601F ~ heat sink component; 601H ~ heat sink component; 601J ~ heat sink component; 6 0 2 ~ substrate; 602 b~ Surface; 603~fin; 603a~base end; • 605-CPU; 606a~recess; 607a~spacer; 608~joint fixture; 6 0 8 b~rotation axis; 610~ spacer; 61 2a~ component Setting section; 613~ fixing tool; 620A~ heat sink;

2036-5808B-PF 511b〜支持轴; 512a〜散熱鰭片; 512c〜緣部; 51 3 a〜狹缝; 514〜散熱元件製造用治具; 601A〜散熱元件; 601C〜散熱元件; 601E〜散熱元件; 601G〜散熱元件; 6011〜散熱元件; 601K〜散熱元件; 6 0 2 a〜表面; 602c〜凸條; 6 0 3 ’〜紹合金製的薄板材; 6 0 4〜散熱片; 6 0 6〜縛片構成材; 607〜間隔物治具; 607b〜間隙; 608a〜接合本體; 609〜共晶層; 610’〜間隔物; 612〜散熱元件製造用洽具; 614^風翁; 620B〜散熱器; 178 12704292036-5808B-PF 511b~ support shaft; 512a~ heat sink fin; 512c~edge; 51 3 a~slit; 514~ heat sink manufacturing fixture; 601A~ heat sink component; 601C~ heat sink component; 601E~ heat sink Component; 601G~ heat dissipating component; 6011~ heat dissipating component; 601K~ heat dissipating component; 6 0 2 a~ surface; 602c~ rib; 6 0 3 '~ thin alloy plate; 6 0 4~ heat sink; 6~Blocking material; 607~ spacer jig; 607b~gap; 608a~joining body; 609~ eutectic layer; 610'~ spacer; 612~heating element manufacturing arranging; 614^风翁; 620B ~ radiator; 178 1270429

701〜銅板; 701b〜彼合凹部; 703〜鋁箔; 7〇4a〜治具本體; 7 0 5〜鋁板; 705b〜嵌合凹部; 706b〜嵌合凹部; 7 0 8〜銅板; 709a〜嵌合凸部; 710a〜嵌合凸部; 71 2〜鋁網體; 714〜銅棒; 714b〜嵌合凹部; 715a〜嵌合凸部; 716〜銅棒; 717a〜凹溝; 719〜銅製的散熱板; 720〜铭製的蓋板; 722〜不銹鋼板; 723a〜治具本體; 724〜鋁型材; 724b〜嵌合凹部; 725a〜嵌合凸部; 726〜台車式内部元件; 701a〜嵌合凸部; 702〜銅板; 704〜接合治具; 704b〜轉動軸; 705a〜後合凸部; 706〜鋁板; 707〜銅板; 7 0 9〜鋁棒; 71 0〜鋁棒; 711〜銅環; 71 3〜銅棒; 714a〜嵌合凸部; 71 5〜鋁棒; 715b〜嵌合凹部; 717〜鋁製的散熱板; 718〜銅製的蓋板; 71 9 a〜凹溝; 721〜鋁容器; 723〜接合治具; 723b〜轉動軸; 724a〜嵌合凸部; 725〜鋁型材; 7251〜嵌合凹部^ 726a〜滾子; 2036-5808B-PF 179 1270429701~ copper plate; 701b~concave recess; 703~aluminum foil; 7〇4a~ fixture body; 7 0 5~ aluminum plate; 705b~ fitting recess; 706b~ fitting recess; 7 0 8~ copper plate; 709a~ Projection; 710a~fitting protrusion; 71 2~aluminum mesh; 714~copper rod; 714b~fitting recess; 715a~fitting protrusion; 716~copper rod; 717a~glot; 719~ copper heat sink Plate; 720~Ming cover; 722~stainless steel plate; 723a~ fixture body; 724~aluminum profile; 724b~fitting recess; 725a~fitting projection; 726~trailer internal component; 701a~ Projection; 702~copper plate; 704~joining fixture; 704b~rotating shaft; 705a~posting convex portion; 706~aluminum plate; 707~copper plate; 7 0 9~aluminum rod; 71 0~aluminum rod; 711~copper ring 71 3 ~ copper rod; 714a ~ fitting convex; 71 5 ~ aluminum rod; 715b ~ fitting recess; 717 ~ aluminum heat sink; 718 ~ copper cover; 71 9 a ~ groove; Aluminum container; 723~joint fixture; 723b~rotation shaft; 724a~fitting projection; 725~aluminum profile; 7251~fitting recess^726a~roller; 203 6-5808B-PF 179 1270429

726b〜千斤頂; 728〜鋁型材; 730〜鋁型材; 732〜鋁型材; 734〜展開制約治具; b〜突起; G〜細溝; 0S〜偏移量的長度; V〜行進速率; 240〜斷面凹字型鰭片 440〜斷面凹字型鰭片 611〜斷面凹字型鰭片 727〜内檔板; 729〜鋁型材; 731〜鋁型材; 733〜鋁型材; Αχ〜轉動中心 DS〜下表面; J〜接合體; R〜圓周速率; US〜上表面; 構成材製造治具 構成材製造治具 構成材製造治具726b~jack; 728~aluminum profile; 730~aluminum profile; 732~aluminum profile; 734~expanding fixture; b~protrusion; G~fine groove; 0S~ offset length; V~ travel rate; Cross-section concave fin 440 ~ cross-section concave fin 611 ~ cross-section concave fin 727 ~ inner baffle; 729 ~ aluminum profile; 731 ~ aluminum profile; 733 ~ aluminum profile; Αχ ~ rotation center DS~lower surface; J~joined body; R~circular velocity; US~upper surface; constituent material manufacturing jig component manufacturing jig manufacturing material manufacturing fixture

2036-5808B-PF 1802036-5808B-PF 180

Claims (1)

1270429 十、申請專利範圍·· 1 · 一種金屬元件接合方法,包含: 提供複數個金屬元件,依照熔點的高低順序相互重合 排列;以及 在該些金屬元件中熔點最高的金屬元件之一側,對該 些金屬元件之重合部加熱及加壓,而使該些金屬元件相互 接合。 φ 2· 一種金屬元件接合方法,包含: 一第一步驟,將一第一金屬元件與熔點高於該第一金 屬元件的熔點的一第二金屬元件重合;以及 一第二步驟,由該第二金屬元件向該第一金屬元件加 壓亚加熱,而使該第一金屬元件與該第二金屬元件相互接 合。 3 · 一種散熱元件,包含: 複數個散熱鰭片,由斷面呈現匚字形的板材所構成, 其材質為第一金屬;以及 P基板’其材質為第二金屬,且該第二金屬的熔點高 於該第一金屬的溶點; ⑽#中該些散㈣片與該基板之接合,係制中請專利 範圍第2項所記載的金屬元件接合方法。 4· 一種散熱元件,包含·· 複數個散熱鱗片,由斯面呈目 ^田斷由呈現L字形的板材所構成, 其材質為第一金屬;以及 -基板,其材質為第二金屬’且該第二金屬的熔點高 181 2036-5808B-PF 1270429 於該第一金屬的熔點; 其中該些散熱鰭片與該基板之接人 ^ 々 双 &lt; 丧σ,係使用申請專利 範圍第2項所記載的金屬元件接合方法。 5. —種散熱元件,包含: 複數個㈣(wgate),鰭片,其材f為第—金屬;以 及 屬,且該第二金屬的熔點高於 一基板,其材質為第二 該第一金屬的熔點; 〜其中该些散熱鰭片與該基板之接合,係使用申請專利 範圍第2項所記載的金屬元件接合方法。 6· —種散熱元件,包含·· 複數個散熱柱狀體,其材質為第一金屬,·以及 Γ基板’其材質為第二金屬’且該第二金屬的熔點高 於該第一金屬的溶點; &amp; 2中該些散熱鰭片與該基板之接合,係使用申請專利 範圍第2項所記載的金屬元件接合方法。 7. 一種散熱器,包含-散熱元件與-風扇,並具有下列 特徵: π广幻 該散熱元件具右t 有銅基板與複數個銅鰭片或鋁鰭片, 其中該銅基板係導敎从 …丨生連接於一發熱體,該些銅鰭片或 鰭片係相互之間星右〜日日 ^ I、有―疋間隔且立設於該基板之一表 以及 矿囬, :圓周轉動的圓板狀接合治具的圓周面壓入該銅 基板之另-表面,並沿著該銅基板之另一表面移動,而藉 2036-5808B-PF 182 1270429 由摩擦振動接合法,接合該銅基板與該些鋼韓片或銘轉片。 8· 一種散熱器,包含一散熱元件與一風扇,並具有下列 特徵: /放”、、元件具有一銅基板、一鋁基板、與複數個鋁鰭 片,其中該銅基板係導熱性連接於一發熱體,該鋁基板係 重$配置於該銅基板之一表面,該些鋁鰭片係相互之間具 有一定間隔且立設於該鋁基板中,與該銅基板之相對側之 面; 該鋁基板與該些鋁鰭片係藉由擠型(extrusi〇n)而一 體成形;以及 將一沿圓周轉動的圓板狀接合治具的圓周面壓入該銅 基板之另一表面,並沿著該銅基板之另一表面移動,而藉 由摩擦振動接合法,接合該銅基板與該鋁基板。 9.如申請專利範圍第7或8項所述之散熱器,其中係以 一導熱管(heatpipe),而該發熱體與該銅基板作導熱性連 φ 接。 10 · —種散熱元件的製造方法,包含: 提供一銅基板,該銅基板一表面上形成有一凸條,在 形成有該凸條的表面上,以橫跨該凸條的方式,立設、配 置複數個鋁鰭片;以及 由該銅基板之另一表面,對該銅基板及該些铭鰭片的交界 面加熱及加壓,而使該些鋁鰭片接合於該銅基板。 11 ·如中請專利範圍第1 〇項所述·之散食允^ 法,其中對該銅基板及該些鋁鰭片的交界面加熱及加壓 2036-5808B-PF 183 1270429 時,係將一沿圓周轉動的圓板狀接合治具的圓周面壓入該 銅基板之另一表面,並使該圓周面沿著該基板之另一表面 移動。1270429 X. Patent application scope · 1 · A metal component bonding method, comprising: providing a plurality of metal components, which are arranged one another in accordance with the order of the melting point; and one side of the metal component having the highest melting point among the metal components, The overlapping portions of the metal members are heated and pressurized to bond the metal members to each other. Φ 2· A metal component bonding method comprising: a first step of superposing a first metal component with a second metal component having a melting point higher than a melting point of the first metal component; and a second step by the first The two metal elements pressurize the first metal element subheat, and the first metal element and the second metal element are joined to each other. 3 · A heat dissipating component, comprising: a plurality of heat dissipating fins, the plate is made of a U-shaped plate, the material is a first metal; and the P substrate is made of a second metal, and the melting point of the second metal (10) The bonding of the scattered (four) sheets to the substrate in (10) #, and the method of joining the metal elements described in the second aspect of the patent. 4· A heat dissipating component comprising: a plurality of heat dissipating scales, wherein the material is a first metal; and the substrate is made of a second metal; The melting point of the second metal is 181 2036-5808B-PF 1270429 at the melting point of the first metal; wherein the heat sink fins and the substrate are connected to each other, and the sigma is used. The metal element bonding method described. 5. A heat dissipating component comprising: a plurality of (four) (wgate) fins, wherein the material f is a first metal; and a genus, and the second metal has a melting point higher than a substrate, and the material is the second first The melting point of the metal; wherein the heat dissipating fins are bonded to the substrate, the metal element bonding method described in claim 2 is used. 6. A heat dissipating component comprising: a plurality of heat dissipating columnar bodies, the material of which is a first metal, and the crucible substrate 'the material of which is a second metal' and the melting point of the second metal is higher than the first metal In the melting point; the bonding of the heat dissipating fins to the substrate in the &amp; 2 is the metal element bonding method described in claim 2 of the patent application. 7. A heat sink comprising: a heat dissipating component and a fan, and having the following features: π 广幻 The heat dissipating component has a right substrate having a copper substrate and a plurality of copper fins or aluminum fins, wherein the copper substrate is guided by ...the twins are connected to a heating element, and the copper fins or fins are star-to-right between each other. ~I. There is a spacing between the two sides of the substrate and the mine back. The circumferential surface of the disc-shaped bonding fixture is pressed into the other surface of the copper substrate and moved along the other surface of the copper substrate, and the copper substrate is bonded by friction vibration bonding by 2036-5808B-PF 182 1270429 With these pieces of steel Korean or Ming Rotary. 8) A heat sink comprising a heat dissipating component and a fan, and having the following features: /, the component has a copper substrate, an aluminum substrate, and a plurality of aluminum fins, wherein the copper substrate is thermally coupled to a heating element, the aluminum substrate is disposed on a surface of the copper substrate, and the aluminum fins are spaced apart from each other and are erected on the surface of the aluminum substrate opposite to the copper substrate; The aluminum substrate and the aluminum fins are integrally formed by extrusion; and a circumferential surface of a circumferentially rotating disk-shaped bonding fixture is pressed into the other surface of the copper substrate, and The copper substrate and the aluminum substrate are bonded by the frictional vibration bonding method along the other surface of the copper substrate. The heat sink according to claim 7 or 8, wherein the heat sink is thermally conductive. a heat pipe, wherein the heat generating body is thermally connected to the copper substrate. 10 - A method for manufacturing a heat dissipating component, comprising: providing a copper substrate, a copper strip is formed on a surface thereof, and is formed Surface with the rib And erecting and arranging a plurality of aluminum fins across the ridges; and heating and pressurizing the interface between the copper substrate and the slabs by the other surface of the copper substrate The aluminum fins are bonded to the copper substrate. 11 · The food processing method described in the first aspect of the patent, wherein the interface between the copper substrate and the aluminum fins is heated and pressurized 2036-5808B-PF 183 1270429, the circumferential surface of a circumferentially rotating disc-shaped joining jig is pressed into the other surface of the copper substrate, and the circumferential surface is moved along the other surface of the substrate. 骞 2036-5808B-PF 184骞 2036-5808B-PF 184
TW95100741A 2002-08-29 2003-08-07 Method of joining members, method of joining metallic members, radiation member, process for manufacturing the same, jig for the manufacturing and heat sink TWI270429B (en)

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JP2002249983A JP2004088014A (en) 2002-08-29 2002-08-29 Heat sink
JP2003150205A JP4222108B2 (en) 2003-05-28 2003-05-28 Metal member joining method
JP2003162488A JP4211499B2 (en) 2003-06-06 2003-06-06 Metal member joining method
JP2003203752A JP4337441B2 (en) 2003-07-30 2003-07-30 Heat dissipation member, method for manufacturing the same, and heat sink

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CN101772394B (en) * 2007-08-10 2013-04-10 日本轻金属株式会社 Joining method and method of manufacturing joint structure
WO2009078126A1 (en) * 2007-12-14 2009-06-25 Akim Corporation In-vacuum welding treatment apparatus
CN102056700B (en) * 2008-06-27 2013-08-14 日本轻金属株式会社 Heat exchange plate manufacturing method and heat exchange plate
JP5531573B2 (en) * 2008-12-09 2014-06-25 日本軽金属株式会社 Method for joining resin member and metal member, method for manufacturing liquid cooling jacket, and liquid cooling jacket
KR101278290B1 (en) * 2011-10-20 2013-06-21 포항공과대학교 산학협력단 Method of manufacturing spiral layered composities using compression-torsion
CN104332724B (en) * 2014-10-24 2016-08-24 江苏万奇电器集团有限公司 A kind of copper aluminium docking adds the busbar that splices
JP6938295B2 (en) * 2017-09-13 2021-09-22 株式会社マキタ Electric tool
JP7024573B2 (en) * 2018-04-20 2022-02-24 日本軽金属株式会社 Manufacturing method of heat transfer plate and friction stir welding method
JP7066543B2 (en) 2018-06-20 2022-05-13 株式会社マキタ Power tools
DE102019134024A1 (en) * 2019-12-11 2021-06-17 Eckold Gmbh & Co. Kg Process for joining two metal sheets with a variable total thickness
CN113709977B (en) * 2020-05-22 2022-11-11 深南电路股份有限公司 Circuit board processing method and circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3147255C2 (en) * 1981-11-28 1986-08-28 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Device for welding components using ultrasound, in particular solar cell contacts and solar cell connectors
JPH09203595A (en) * 1996-01-26 1997-08-05 Sansha Electric Mfg Co Ltd Radiator device
CN2370378Y (en) * 1999-04-08 2000-03-22 富准精密工业(深圳)有限公司 Fin fixing clamp for heat radiator
CN1095413C (en) * 2000-06-12 2002-12-04 富准精密工业(深圳)有限公司 Technology for manufacturing heat radiator
JP3918517B2 (en) * 2001-11-07 2007-05-23 日本軽金属株式会社 Radiator and manufacturing method thereof
JP4134569B2 (en) * 2002-02-07 2008-08-20 日本軽金属株式会社 Heat dissipation member and manufacturing method thereof
JP4134580B2 (en) * 2002-03-19 2008-08-20 日本軽金属株式会社 Member joining method, radiator manufacturing method and radiator manufacturing jig

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