JP3432477B2 - heatsink - Google Patents
heatsinkInfo
- Publication number
- JP3432477B2 JP3432477B2 JP2000088042A JP2000088042A JP3432477B2 JP 3432477 B2 JP3432477 B2 JP 3432477B2 JP 2000088042 A JP2000088042 A JP 2000088042A JP 2000088042 A JP2000088042 A JP 2000088042A JP 3432477 B2 JP3432477 B2 JP 3432477B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- plate
- heat sink
- flat
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
【0001】
【発明の属する技術分野】本発明は、冷媒を使用して熱
発生体から受け取った熱を外部に放散するヒートシンク
に関し、特にコンピュータ、通信、自動車の分野で広く
使用されている発熱体からの放熱に好適なフラットヒー
トパネル型ヒートシンクの改良に関するものである。
【0002】
【従来の技術】コンピュータ、通信、自動車等の分野で
高密度実装品が使用されているが、この高密度実装品か
らの熱を放散するために、冷媒を使用するフラットヒー
トパネル型ヒートシンクが使用されている。
【0003】この種のヒートシンクは、図2に示すよう
に、基板12と冷媒通路22を形成する相互に連通する
突部14aを有する上部凹凸板14との間をろう付け部
16Bで接合して形成されている。ろう付けは、基板1
2と上部凹凸板14との間に低融点のアルミニウム合金
と通常のアルミニウムとの2層構造の特殊なろう板を使
用し、低融点アルミニウム合金面を加圧接触状態で高温
槽に入れて低融点アルミニウム合金を溶融して接合する
が、高温槽内の温度は、アルミニウムが完全焼鈍される
のに必要な温度以上であることが要求されるため、上部
凹凸板14に曲がり、うねり等を生ずる上に基板12も
焼鈍されて平面状態を維持することができないで液密性
が低下し、また基板12の焼鈍によって基板12を発熱
体に取り付けるねじの締め付け強度が低下する欠点があ
った。
【0004】このように、現在のフラットヒートパネル
型ヒートシンクは、放熱部材にうねりや曲がりを生じた
り、基板の平面度が低下する欠点を有するにも拘わら
ず、実装密度が高度化しコンパクト化されて発熱量が増
大している実装品にそのまま使用されているが、このヒ
ートシンクは、このような実装品からの多量の熱を有効
に放熱することができない欠点があった。
【0005】
【発明が解決しようとする課題】本発明が解決しようと
する課題は、基板の平面度を低下することがなく、また
高い機械的強度と高い熱伝導性とを維持しつつ形成する
ことができるフラットパネル型ヒートシンクを提供する
ことにある。
【0006】
【課題を解決するための手段】本発明の課題解決手段
は、熱伝導性材料から成る複数の放熱部材を備え、これ
らの複数の放熱部材はレーザ溶接接合部によって相互に
接合され、複数の放熱部材は、平板と、この平板との間
に冷媒が貫流すべき冷媒通路を形成すべき多数の浮き上
がり部を形成するように点在して平板に接合する多数の
へこみと平板に接合する周縁のフランジとを有する凹凸
板とから成り、レーザ溶接接合部は、平板と凹凸板のへ
こみの周縁及びフランジとを接合するように形成されて
いることを特徴とするヒートシンクを提供することにあ
る。
【0007】このように、フラットヒートパネル型ヒー
トシンクを構成する放熱部材である平板と凹凸板のへこ
みの周縁及びフランジとがレーザ溶接接合部によって相
互に接合されていると、従来技術のかしめやろう付けで
接合する場合に比べて放熱部材の相互の高い熱伝導性と
高い接合強度とを維持することができる。また、ろう付
けのように熱変形を伴うことがないので、ヒートシンク
の取り付け面の高い平面度を維持することができ、ヒー
トシンクの熱放散効果を減殺することがない。
【0008】
【発明の実施の形態】本発明の実施の形態を図面を参照
して詳細に述べると、図1は、冷媒を使用するフラット
ヒートシンク10H1の1つの形態であるフラットヒー
トパネル型のヒートシンク10H11を示し、このヒー
トシンク10H11は、一方の放熱部材12であるアル
ミニウム製の平坦な基板(平板)121と他の放熱部材
14であるアルミニウム製の上部凹凸板(凹凸体)14
1とから成っている。
【0009】凹凸板141は、特に図1(C)に示すよ
うに、基板121に平面的に接触するように下に向けて
へこませて形成された多数のへこみ18を有し、このへ
こみ部18以外の部分は基板121から間隔をあけて浮
き上がっている浮き上がり部20となっている。従っ
て、凹凸板141は、へこみ部18が凹部で浮き上がり
部20が凸部の板の形態であり、基板121と浮き上が
り部20との間で冷媒通路22を形成している。へこみ
18は、適宜に点在して形成することができるが、図示
の形態では、図1(A)に示すように、縦横に整列して
形成されており、従って、冷媒通路22は、格子状の形
態となっている。凹凸板141の周縁は、冷媒注入口2
4を形成する部分を除いて基板121に平面的に接触す
るフランジ26を形成している。なお、符号25は、基
板121の縁と凹凸板121のフランジ26とに整列し
て形成された取り付けねじ貫通孔である。
【0010】ヒートシンク10H11のレーザ溶接接合
部161は、図1(A)及び図1(C)に示すように、
基板121とこの基板121に平面的に接触する凹凸板
141部分のまわりに沿ってYAGレーザ溶接機の如き
レーザ溶接機からレーザビームを照射しつつてシーム溶
接して形成される。
【0011】更に詳細に述べると、レーザ溶接接合部1
61は、凹凸板141のフランジ26の全長(冷媒注入
口24を除く周縁部分)に沿ってシーム溶接し、また凹
凸板141のすべてのへこみ部18のまわりに沿って楕
円形状にリング溶接することによって形成される。ま
た、冷媒注入口24は、冷媒通路22に冷媒を注入した
後、その開口壁が基板121に接触するように閉じ、こ
の接触部を同様にレーザ溶接によって液密に接合して閉
じられる。フランジ26の溶接とへこみ部18のまわり
の溶接とは、いずれが先であってもよいが、基板121
と凹凸板141との相互の位置決めを考慮すると、フラ
ンジ26の溶接を先に行うのが好ましい。
【0012】このように、平板と凹凸板の如き熱伝導性
材料から成る複数の放熱部材12、14がレーザ溶接接
合部16によって相互に接合されていると、放熱部材1
2、14がレーザ溶接接合部16によって物理的に一体
化して恰も一体成形されたのと同じ状態となるため、放
熱部材12、14相互間の熱伝導性を向上することがで
き、また相互間の機械的接合強度も著しく向上すること
ができる。
【0013】
【発明の効果】本発明によれば、上記のように、フラッ
トヒートパネル型ヒートシンクは、平板と凹凸板のへこ
みの周縁及びフランジとの接合面をレーザ溶接接合部に
よって相互に接合して形成するので、従来技術のかしめ
やろう付けで接合する場合に比べて、放熱部材の相互の
高い熱伝導性と高い機械的接合強度とを維持することが
できる。
【0014】また、ヒートシンクは、ろう付けによる場
合のように熱変形を伴うことがないので、ヒートシンク
の取り付け面の高い平面度を維持することができ、ヒー
トシンクの熱放散効果を減殺することがない。Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a heat sink for dissipating heat received from a heat generating body to the outside by using a refrigerant, and more particularly to a computer, a communication, and an automobile. Flat heater suitable for heat dissipation from widely used heating elements
The present invention relates to improvement of a top panel type heat sink. 2. Description of the Related Art High-density packaging products are used in the fields of computers, communications, automobiles, and the like. In order to dissipate heat from the high-density packaging products, a flat heater using a refrigerant is used.
A top panel heat sink is used. In this type of heat sink, as shown in FIG. 2 , a brazing portion 16B joins a substrate 12 and an upper concavo-convex plate 14 having a projecting portion 14a communicating with each other to form a coolant passage 22. Is formed. Brazing is for substrate 1
A special brazing plate having a two-layer structure of a low-melting aluminum alloy and normal aluminum is used between the upper and lower concave and convex plates 2 and 14 and the low-melting aluminum alloy surface is put into a high-temperature bath in a pressure contact state to reduce the temperature. The melting point of the aluminum alloy is melted and joined, but the temperature in the high-temperature bath is required to be higher than the temperature required for complete annealing of the aluminum, so that the upper uneven plate 14 bends and undulates. On the other hand, the substrate 12 is also annealed, so that it cannot maintain a planar state, and thus the liquid-tightness is reduced, and the annealing strength of the substrate 12 lowers the fastening strength of the screw for attaching the substrate 12 to the heating element. [0004] Thus, the current flat heat panel
Despite the drawbacks of swelling and bending of the heat dissipating member and the lowering of the flatness of the board , the type heat sink is used as it is for mounting products where the mounting density is higher, the size is more compact, and the heat generation is increasing. Has been
The heat sink has a drawback that a large amount of heat from such a mounted product cannot be effectively dissipated. [0005] An object of the present invention is to form a substrate without lowering the flatness of a substrate and maintaining high mechanical strength and high thermal conductivity. And a flat panel heat sink. Means for Solving the Problems A means for solving the problems of the present invention comprises a plurality of heat dissipating members made of a heat conductive material, and these plural heat dissipating members are joined to each other by a laser welding joint. a plurality of heat dissipating members, the flat plate and a number of indentations and the flat plate bonded refrigerant dotted joined to flat plate so as to form a plurality of floating portions to form the refrigerant passage to be flow between the flat plate irregularities and a peripheral edge of the flange
The laser welded joint is formed so as to join the flat plate to the peripheral edge of the dent of the concave and convex plate and the flange, and to provide a heat sink. [0007] As described above, the flat heat panel type heat sink and the flat plate and the concave and convex plate, which are the heat radiating members, are provided.
When the peripheral edge and the flange are joined to each other by the laser welding joint, the heat dissipation member maintains higher mutual thermal conductivity and higher joint strength than the conventional technique of joining by caulking or brazing. it is as possible out to be. Also, since there is no thermal deformation unlike brazing, a high flatness of the heat sink mounting surface can be maintained, and the heat dissipation effect of the heat sink is not diminished. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail with reference to the drawings . FIG. 1 shows a flat heat sink 10H1 using a refrigerant, which is a form of a flat heat sink 10H1.
A heat sink 10H11 of a top panel type is shown. This heat sink 10H11 is composed of a flat substrate (flat plate) 121 made of aluminum, which is one of the heat dissipating members 12, and an upper concave-convex plate 14 made of aluminum, which is another heat dissipating member 14.
Consists of one and one. As shown in FIG. 1C, the concavo-convex plate 141 has a large number of depressions 18 formed by being recessed downward so as to come into contact with the substrate 121 in a plane. The portion other than the portion 18 is a raised portion 20 that is raised at an interval from the substrate 121. Therefore, the concave and convex plate 141 is in the form of a plate in which the concave portion 18 is a concave portion and the raised portion 20 is a convex portion, and the refrigerant passage 22 is formed between the substrate 121 and the raised portion 20. Although the dents 18 can be formed to be appropriately scattered, in the illustrated embodiment, as shown in FIG. 1A, the dents 18 are formed so as to be aligned vertically and horizontally. It is in the shape of a letter. The periphery of the concave and convex plate 141 is the refrigerant injection port 2
Except for the portion forming 4, a flange 26 is formed which comes into contact with the substrate 121 in a planar manner. Reference numeral 25 denotes a mounting screw through hole formed in alignment with the edge of the substrate 121 and the flange 26 of the uneven plate 121. As shown in FIGS. 1A and 1C, the laser welding joint 161 of the heat sink 10H11
It is formed by seam welding while irradiating a laser beam from a laser welding machine such as a YAG laser welding machine along the substrate 121 and the portion of the uneven plate 141 which comes into planar contact with the substrate 121. [0011] More specifically, the laser welded joint 1
Reference numeral 61 denotes seam welding along the entire length of the flange 26 of the uneven plate 141 (peripheral portion excluding the refrigerant injection port 24), and ring welding in an elliptical shape around all the recesses 18 of the uneven plate 141. Formed by After the coolant is injected into the coolant passage 22, the coolant inlet 24 is closed so that the opening wall thereof contacts the substrate 121, and the contact portion is similarly closed in a liquid-tight manner by laser welding. Either the welding of the flange 26 or the welding around the recess 18 may be performed first,
In consideration of mutual positioning between the flange 26 and the uneven plate 141, it is preferable that the welding of the flange 26 be performed first. As described above, when the plurality of heat dissipating members 12, 14 made of a heat conductive material such as a flat plate and a concavo-convex plate are joined to each other by the laser welding joint 16, the heat dissipating members 1
2 and 14 are physically integrated by the laser welding joint portion 16 to be in the same state as if they were integrally molded, so that the thermal conductivity between the heat radiating members 12 and 14 can be improved, and Can also remarkably improve the mechanical joining strength. According to the present invention, as described above, flash
The heat panel type heat sink is made of flat plate and uneven plate .
Since the joint surface with the peripheral edge and the flange is joined together by a laser welding joint, compared to the case of joining by caulking or brazing of the prior art, the mutual heat conductivity of the heat dissipating member and high Mechanical bonding strength can be maintained. Further, the heat sink, since no accompanied by thermal deformation as is the case by brazing, it is possible to maintain a high flatness of the mounting surface of the heat sink, it is not to diminish the heat dissipation effect of the heat sink .
【図面の簡単な説明】
【図1】本発明の実施の形態であるフラットヒートパネ
ル型ヒートシンクを示し、同図(A)は、その平面図、
同図(B)は、そのB−B線断面図、同図(C)は、図
1(B)の一部の拡大断面図である。
【図2】従来技術のフラットヒートパネル型ヒートシン
クの一部の拡大横断面図である。
【符号の説明】
10H1 フラットヒートシンク
12 放熱部材
14 放熱部材
16 レーザ溶接接合部
18 へこみ部
20 浮き上がり部
22 冷媒通路
24 冷媒注入口
26 フランジ
121 アルミニウム製の平坦な基板
141 アルミニウム製の上部凹凸板
161 レーザ溶接接合部BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows a flat heat panel type heat sink according to an embodiment of the present invention, and FIG.
FIG. 1B is a cross-sectional view taken along the line BB, and FIG. 1C is an enlarged cross-sectional view of a part of FIG. FIG. 2 is an enlarged cross-sectional view of a part of a conventional flat heat panel type heat sink. [Description of Signs] 10H1 Flat heat sink 12 Heat radiating member 14 Heat radiating member 16 Laser welded joint 18 Indented portion 20 Floating portion 22 Refrigerant passage 24 Refrigerant inlet 26 Flange 121 Flat substrate 141 made of aluminum Aluminum upper uneven plate 161 Laser Weld joint
フロントページの続き (56)参考文献 特開 平6−275747(JP,A) 特開 平11−40715(JP,A) 特開 平10−125831(JP,A) 特開 平8−172150(JP,A) 特開 平7−318282(JP,A) 特開 平10−38484(JP,A) 特表 平11−505372(JP,A) (58)調査した分野(Int.Cl.7,DB名) H01L 23/34 - 23/473 Continuation of the front page (56) References JP-A-6-275747 (JP, A) JP-A-11-40715 (JP, A) JP-A-10-125831 (JP, A) JP-A-8-172150 (JP, A) , A) JP-A-7-318282 (JP, A) JP-A-10-38484 (JP, A) Table 11-11-505372 (JP, A) (58) Fields studied (Int. Cl. 7 , DB (Name) H01L 23/34-23/473
Claims (1)
備え、前記複数の放熱部材はレーザ溶接接合部によって
相互に接合され、前記複数の放熱部材は、平板と、前記
平板との間に冷媒が貫流すべき冷媒通路を形成すべき多
数の浮き上がり部を形成するように点在して前記平板に
接合する多数のへこみと前記平板に接合する周縁のフラ
ンジとを有する凹凸板とから成り、前記レーザ溶接接合
部は、前記平板と前記凹凸板の前記へこみの周縁及び前
記フランジとを接合するように形成されていることを特
徴とするヒートシンク。(57) Claims 1. A plurality of heat dissipating members made of a heat conductive material are provided, and the plurality of heat dissipating members are joined to each other by a laser welding joint. periphery of the flange to be joined to a number of indentations and the flat plate scattered to joined to the plates such refrigerant to form a number of floating portions to form the refrigerant passage to be flow between the flat plate, and the plate consists of a concave-convex plate having bets, the laser weld joint, a heat sink, characterized in that it is formed so as to join the said indentation of the periphery and the flange of the uneven plate and the flat plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000088042A JP3432477B2 (en) | 2000-03-28 | 2000-03-28 | heatsink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000088042A JP3432477B2 (en) | 2000-03-28 | 2000-03-28 | heatsink |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001274297A JP2001274297A (en) | 2001-10-05 |
JP3432477B2 true JP3432477B2 (en) | 2003-08-04 |
Family
ID=18603971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000088042A Expired - Fee Related JP3432477B2 (en) | 2000-03-28 | 2000-03-28 | heatsink |
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Country | Link |
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JP (1) | JP3432477B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD904322S1 (en) | 2019-08-28 | 2020-12-08 | Carbice Corporation | Flexible heat sink |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009188032A (en) * | 2008-02-04 | 2009-08-20 | Fuji Electric Systems Co Ltd | Power converting device |
CN107046794A (en) * | 2017-03-07 | 2017-08-15 | 上海嘉熙科技有限公司 | Hot superconduction gilled radiator and machine box of electric equipment |
JP6939068B2 (en) * | 2017-05-09 | 2021-09-22 | 三菱電機株式会社 | How to manufacture heat sinks, lighting fixtures, and heat sinks |
CN107979949A (en) * | 2017-11-13 | 2018-05-01 | 山东同创汽车散热装置股份有限公司 | The radiator and technique manufacturing method of install convenient and stabilized structure |
CN109341401B (en) * | 2018-12-07 | 2023-11-17 | 常州恒创热管理有限公司 | Radiating fin and cascade caulking groove radiator |
DE112019006927B4 (en) | 2019-02-26 | 2022-12-29 | Mitsubishi Electric Corporation | Semiconductor device, manufacturing method for a semiconductor device, and power converter |
JP7420631B2 (en) | 2020-04-15 | 2024-01-23 | 古河電気工業株式会社 | Heat sink and its manufacturing method |
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-
2000
- 2000-03-28 JP JP2000088042A patent/JP3432477B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD904322S1 (en) | 2019-08-28 | 2020-12-08 | Carbice Corporation | Flexible heat sink |
Also Published As
Publication number | Publication date |
---|---|
JP2001274297A (en) | 2001-10-05 |
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