1264988 九、發明說明： 【發明所屬之技術領域】 、本么月係有關一種散熱片、散熱器結構及其製造方法 ’尤指-種由熱管及散熱片所組成的散熱器結構及其相關 :製造主要係由複數特殊設計的散熱片與熱管組成 7散熱器結構’該散熱器結構與一裝置組合後，可提供該 农置達d队〜的散熱，又其製造方法係提供此一散熱器結 構可產生更佳的散熱效率。 【先前技術】 隨著資訊時代 鬲，尤以一般辦公 常態性的使用需求 唯，隨著效能提高 亦必需提昇其運轉 异、顯示卡、硬碟 隨之而來的散熱需 課題；以目前大多 高發熱的組件上， 方t设散熱結構， 央處理器所產生的 帶離並散去，藉此 不同的裝置需求， 計’最常見的散熱 的來臨，資訊設備的使用需求亦隨之提 室中的電腦硬體設備最為常見，以目前 而言，高效能的運作已是基本的要求， 的使用要求，硬體設冑本身白勺各項功能 中的負，例如，中央處理器的高頻運 的運轉效能等，皆不可忽視之。然而， 求，卻成為另一個產品極待突破的重要 數的硬體設備而t，其係在於主機内部 加裝散熱結構。例如，於中央處理器上 再於散熱結構上加裝風扇，以達到使中 熱透過傳導及冑流的以能夠十夬速的被 以達到降低作業溫度的目的；而因應 散熱結構的設計也隨之有不同變化的設 器類型包括堆疊式的散熱鳍片組、風扇 3 1264988 搭配散執隸Μ《發 生二片組寺’而其中關於散熱鰭片的種類就數以千 ;亞年兩，熱管的應用’開始普及於各種散熱結構中， 執源傳Γ在於熱管的熱傳速度相當的快，可以迅速的將 ，、·、’、 ν至熱的發散區域（如散熱片），故目前市面上已可 看到由熱官與鰭片作結合的散熱器結構。 =中華民國專利公報公告帛侧17號「散熱韓片 一構」新型專利案中即揭示有相關之結構，如第1 5 =所不’該專利案所揭露之内容主要係在於，鰭# 2上形成 穿孔3,供熱f !穿置，又該穿孔3上方形成一口徑較小 的細孔5 ’以供-金屬絲6穿設（如第16圖所示），铖過 熱炼的加工程序後，金屬絲6將炼化並透過毛細現“至 穿孔3中的熱管2間使二者能夠產生黏合。唯， :種加工方法係對組合後的鰭片2、熱管，及金屬絲6同 时進仃加熱’為確保金屬絲6能夠熱熔，其所需的工作溫 度較高’當熱# 1採用與金屬、絲6炫點相近的材料（該專 利，案說明書中指稱金屬絲與熱管、轉片均可採用銅），該 熱管即非常容易於加工過程中受損。 再請芩閱中華民國專利公報公告第568261號「導熱 官與散熱鰭片結構改良」新型專利案，其内容所揭示主要 係在於一扁平狀的熱導管與若干鰭片之組合結構，如第1 7 圖所示，其係於鰭片41上形成穿孔44供導熱管45穿設 ，並於穿孔44的上緣設一口徑較小的錫膏加入孔43，當 導熱管45穿設至鰭片41的穿孔44後，再於錫膏加入孔 4 3中注入錫τ，用熱熔方式使導熱管4 5與散熱鰭片4] 1264988 形成緊密結合狀態。該專利案以膏狀黏著劑作為介質 的在於可採用較低溫的熱炫方式，對埶瞢 、 八耵熟s的扣壞影響亦相 對降低。 # 儘管前述專利案可採用較低溫的熱炫方式以降低u 熱管的可能性，且其鰭片在穿孔上緣形成錫膏加入孔貝二 方便錫膏的施加μ旦由於錫膏加入孔孔徑微小 -〇--、、、日乃併 排後使錫膏加入孔孔深加長，對於施加錫膏的工具而士 不論伸入或施加錫膏作業均十方不便。且因散熱片、組：的 錫膏加入孔孔深長，㉟膏施加與披覆的狀況無法掌握，因 而在加熱後1膏流入穿孔與熱管之間的量與質 影響。 又 【發明内容】 本發明主要所欲解決的問題在於如何使熱管與散熱鰭 片可以有效的結合，使其達到最佳的散熱效能，並提供二 可確保作業品質的製造方法。 有鑑於上述的需求，本發明的主要目的在於提供一種 結散熱及導熱性良好的散熱結構及其製造方法。 ^為達成前述目的採行的主要技術手段散熱片、散熱器 屢及其製造方法係利用介質預留與翻轉熱熔的加工方法 、社使熱官與散熱片間能產生緊密的結合，並令整個散熱器 構月b具有良好的散熱及導熱性，其主要係由一熱管 '複 數：散熱片所組合而成，其+，係於散熱片上形成有穿孔 仏熱g牙设，又穿孔孔緣處形成一可容置流體狀熱傳介 1264988 貝u至4艮 '錫貧）的空間《以使熱傳介質注入時，可斬 空間中，而在散熱片穿孔内穿置熱管後而進行孰： 刖再將散熱片上下翻轉，以便在熱炫過程中 介質沿埶管自妒4 …、的熱傳 :;自然下’攸而使熱管與散熱片可完全的緊密 ^者，一後再經冷卻即可完成。 〃 披覆==係在㈣片未穿設熱管前，先將熱傳介質 ' ^…、片的牙孔孔緣處，故施加熱傳介質時 ㈣牙孔本身提供較大的空間以方便作業，: 掌握熱傳介質在穿孔内的披覆狀況；再者，散 進行熱熔前予以上下翻轉，以便在; =:、體狀的熱傳介質利用引力及熱管表面的毛細作 %^下，亚充滿於熱管與穿孔之間，藉此可確保孰管盘 散熱片的緊密接合，從而可提升散熱效率。一、 【貫施方式】 為使貴塞志未。 ' —委貝能清楚了解本發明之内容，謹以下 °兄月私配圖不’敬請參閱。 敬請參閱第1图 _ 構的第-較佳實施例二’：_中：示係為本發明散熱器結 用於散熱器的製作，：中所：的散熱片10,主要係可應 等方彳^ . 列如以堆璺、扣合、黏著、模具組設 寺方式，將钹數片散哉 如圖所示的散鼓片1n、、、片組5後，即可形成-散熱片組； 穿孔術的底緣則形成101上成形—穿孔102’而 成為-個可供容置的：：一凹槽1〇3,此凹槽1。3主要係 二間’用以作為膏狀熱傳介質的暫存 6 1264988 空間。 又請參閱第2圖所示，為一散熱器結構的製造方法及 百先’係令複數的散熱片以其片μ 上的穿 去相對’並利用形成於片體101周邊的組扣部（圖中 ^以相互組合，此時穿孔⑽上的凹槽103係位於下 孔=’接著將膏狀的熱傳介質201經由散熱片10的穿 的=中注入，並使熱傳介質201披覆在穿孔術下孔缘 =槽⑽上，令熱傳介質201能部份填入於凹槽103中 t，二再：―熱管202穿設過各散熱片10的穿孔102 執其2〇2適胃位置處，接著利用㈣方式使散熱片10盘 熱官202得以呈現密合狀態。 構上下翻轉，並將之晋先將元成熱官202插設的散熱器結 熔，此日士 置入於一烘烤裝置中加熱，以進行埶 ^ 此守散熱片1〇穿β μ ^ ^ …、 ，當溫度上昇播牙孔1〇2上的凹槽103係位於上孔緣 流體狀，並利用引：槽1〇3内的熱傳介質201即開始呈現 2〇2與穿孔102/及熱f 2〇2表面的毛細現象沿著熱管 ⑽與穿孔102=的間隙向下流動，隨之即可填滿熱管 後，各散熱片10與苴的間隙，經取出散熱器結構使其冷卻 結合。 一"上共同穿置的熱管202即可緊密的 仍請參閱第2 係披覆於散熱# 1f/ U ’由於進行熱溶前熱傳介質201 ^ ^ 、 的穿孔1 02中時，因λ苴ί丨給老+丄 凹槽1〇3提供_ 才u為/、孔緣處存在 於凹槽1〇3巾::間，故部份的熱傳介質201會填入 §熱管202穿過穿孔時，縱使將部份熱 1264988 傳介質201往前刮除，缺 ^ …、'而，通過母一個凹槽103時，被 熱吕2 0 2刮除的敎僂介 的凹槽W3中；I:: 2〇1會再被刮回下-散熱片1。 使敎管20…： 寺，即有充分的熱傳介質2〇1 使‘“ 202與放熱片1〇1得以產生緊密的結合。 由乂上所述可知，本埶、^ ^ 程係包括·· 肤-……口耩的製造方法及過 Π)將一膏狀熱傳介質由 該埶傳|所斬勿 田月文…月、、且的牙孔f注入，使 …傳"貝暫留於穿孔的下孔緣處； (2) 令熱管穿過該散熱片組中各散熱片上的穿孔· (3) 將該散熱片組上下翻轉； ， :)加熱散熱片組，使各散熱片暫存於 處的熱傳介質孔緣 間的空隙； 乂真滿该熱官與各散熱片之 (5 )降溫冷卻。 種二亡所述’其製造過程中所使用的膏狀熱傳介質為一 屢具黏著性的膏狀金屬…為 式係可利用 *銀或錫賞’ i其注入的方 緣處。注射器，將熱傳介質注入至散熱片的穿孔孔 圖中：==圖所示係為本發明的第二較佳實施例，如 所不的散熱片30係應用於夂括此义口。 以堆最、4 A 〜用於σ種狀熱益的製作，例如 且 扣5 、黏著、模具4a設笨古斗4 > 熱片同時由至小一埶^人、、式、，且成’並令複數散 所示的:吕 即可形成—散熱片組；如圖 、放…、片30，係於其片體3〇1 穿孔、 a菔叫1上形成一穿孔302，而 沿孔緣延伸形成-環狀的接合部3〇3，而於接合 1264988 部303的内底面上 作為一個可供流質 谷置貧狀的熱傳介 形成有—凹槽304，該凹槽 預留的空間（請參照第5圖 質。 304主 所示）， 要係 用以1264988 Nine, invention description: [Technical field of invention], this month is related to a heat sink, heat sink structure and manufacturing method thereof, especially the heat sink structure composed of heat pipe and heat sink and related: The main manufacture consists of a plurality of specially designed heat sinks and heat pipes. 7 Heatsink structure. After the heat sink structure is combined with a device, the heat dissipation of the farm can be provided, and the manufacturing method is to provide the heat sink. The structure produces better heat dissipation efficiency. [Prior Art] With the age of information, especially the general office use requirements, as the performance is improved, it is necessary to improve the heat dissipation requirements of the operation, display cards, and hard disks. On the hot components, the heat dissipation structure is set, and the central processor generates the separated and scattered parts. With the different device requirements, the most common heat dissipation comes, and the use of information equipment is also in the room. Computer hardware devices are the most common. At present, high-performance operation is the basic requirement. The use requirements are negative in the functions of the hardware itself. For example, the high-frequency operation of the central processing unit. The performance of the operation, etc., can not be ignored. However, the demand is another important hardware device that needs to be broken through, and the system is equipped with a heat dissipation structure inside the host. For example, a fan is added to the heat dissipation structure on the central processing unit to achieve the purpose of reducing the operating temperature by allowing the medium heat to transmit and turbulence; and the design of the heat dissipation structure is also There are different types of fixtures including stacked heat sink fins, fan 3 1264988, and the singularity of the "two-piece temples". Among them, there are thousands of types of heat-dissipating fins; The application 'is beginning to be popularized in various heat dissipation structures. The source of the heat transfer is that the heat transfer speed of the heat pipe is quite fast, and it can quickly transfer the area, such as the heat sink, to the heat, so the market is currently on the market. The heat sink structure combined with the heat and the fins can be seen on the top. = The Republic of China Patent Gazette announced on the side of the 17th "heat-dissipation of the Korean film" new patent case reveals the relevant structure, such as the 15th = Nothing. The content of the patent is mainly based on the fin # 2 A perforation 3 is formed on the upper surface, and a heat supply f! is formed, and a fine hole 5' having a smaller diameter is formed above the perforation 3 for the wire 6 to be pierced (as shown in FIG. 16). After that, the wire 6 will be refining and passing through the capillary "to the heat pipe 2 in the perforation 3 to enable the two to bond. However, the seed processing method is for the combined fin 2, the heat pipe, and the wire 6 at the same time. In order to ensure that the wire 6 can be hot melted, the required working temperature is higher. When the heat #1 is made of a material similar to the metal and the wire 6 (the patent, the specification refers to the wire and the heat pipe, The rotor can be made of copper. The heat pipe is very easy to be damaged during processing. Please refer to the new patent case of “Thermal Officer and Heat Sink Structure Improvement” in the Republic of China Patent Bulletin No. 568261, the contents of which are disclosed. Mainly in a flat heat pipe with several fins The combined structure, as shown in FIG. 7 , is formed on the fin 41 to form a through hole 44 for the heat pipe 45 to be pierced, and a small-diameter solder paste is added to the hole 43 at the upper edge of the hole 44 to conduct heat. After the tube 45 is inserted into the through hole 44 of the fin 41, the tin τ is injected into the solder paste adding hole 4 3, and the heat transfer tube 45 is thermally bonded to the heat dissipating fin 4] 1264988. In the patent case, the paste adhesive is used as a medium to adopt a lower temperature heat-shrinking method, and the damage effect on the 埶瞢 and 八耵 cooked s is relatively reduced. # Although the aforementioned patents can use a lower temperature heat-shrinking method to reduce the possibility of u heat pipes, and the fins form a solder paste on the upper edge of the perforations, and the application of the solder paste is facilitated by the application of the solder paste. -〇,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Moreover, since the solder paste of the heat sink and the group is added to the hole, the condition of the application and the coating of the 35 paste cannot be grasped, and therefore the amount and quality of the paste flow between the perforation and the heat pipe after heating. SUMMARY OF THE INVENTION The main problem to be solved by the present invention is how to effectively combine a heat pipe and a heat dissipating fin to achieve optimum heat dissipation performance, and provide a manufacturing method that ensures work quality. In view of the above needs, it is a primary object of the present invention to provide a heat dissipating structure having a good heat dissipation and thermal conductivity and a method of manufacturing the same. ^ The main technical means for achieving the above-mentioned purposes: heat sinks, heat sinks and their manufacturing methods are based on the use of medium reservation and reverse hot melt processing methods, the society can create a close combination between the heat officer and the heat sink, and The entire heat sink structure b has good heat dissipation and thermal conductivity. It is mainly composed of a heat pipe 'plural: heat sink. The + is formed on the heat sink with perforated heat and teeth. Forming a space for accommodating fluid-like heat transfer 1264988 to 4艮's tin-poor" so that when the heat transfer medium is injected, it can be in the space, and after the heat pipe is inserted into the heat pipe, the heat pipe is placed. : 刖Reversely flip the heat sink up and down, so that the heat transfer of the medium along the 埶 tube in the process of heat squeezing:; naturally, the heat pipe and the heat sink can be completely tight, and then It can be done by cooling. 〃 Draping == Before the (four) piece is not placed with the heat pipe, the heat transfer medium ' ^..., the edge of the hole of the piece of the hole, so when the heat transfer medium is applied (4) the hole itself provides a larger space to facilitate the operation , : Master the coverage of the heat transfer medium in the perforation; in addition, the top and bottom are turned upside down before the hot melt, so that the heat transfer medium of the body shape uses the gravity and the capillary of the heat pipe surface as %2, Sub-filled between the heat pipe and the perforation, thereby ensuring the tight joint of the manifold disk heat sink, thereby improving heat dissipation efficiency. First, [the way of implementation] In order to make you singer. '—Beibei can clearly understand the contents of this invention, and I would like to see below. Please refer to FIG. 1 for the first embodiment of the present invention. FIG. 1 is a heat sink for the manufacture of a heat sink. The heat sink 10 of the present invention is mainly capable of being used. Fang 彳 ^ . Columns such as stacking, snapping, bonding, mold set up the temple way, the 钹 片 哉 哉 哉 哉 哉 哉 哉 哉 哉 散 散 散 散 散 散 散 散 散 散 散 散 散 散 散 散 散 散The bottom edge of the perforation is formed into a 101-formed perforation 102' and becomes a suffix: a groove 1 〇 3, which is mainly used as a paste. Temporary storage of heat transfer media 6 1264988 space. Please also refer to FIG. 2, which is a manufacturing method of a heat sink structure, and a plurality of heat sinks in which a plurality of heat sinks are worn relative to each other on the sheet μ and utilize a clasp portion formed around the periphery of the sheet body 101 ( In the figure, ^ is combined with each other, at this time, the groove 103 on the perforation (10) is located in the lower hole = 'then the paste-like heat transfer medium 201 is injected through the through hole of the heat sink 10, and the heat transfer medium 201 is covered. On the hole edge = groove (10) of the perforation, the heat transfer medium 201 can be partially filled in the groove 103, and then: the heat pipe 202 is pierced through the perforation 102 of each fin 10, and the 2nd 2 is suitable. At the stomach position, the heat sink 10 is then brought into a close state by means of (4). The structure is turned upside down, and the heat sink is inserted into the heat sink 202, and the sunshield is placed. Heating in a baking device to perform 埶^ the defensive fin 1 〇 β μ ^ ^ ..., when the temperature rises, the groove 103 on the vent hole 1 〇 2 is located in the upper hole edge fluid, and utilizes引引: The heat transfer medium 201 in the groove 1〇3 begins to exhibit the capillary phenomenon of the surface of the 2〇2 and the perforation 102/ and the heat f 2〇2 along the heat pipe (10) The gap of the hole 102= flows downward, and then the heat pipe can be filled, and the gap between each fin 10 and the crucible is cooled and combined by taking out the heat sink structure. The heat pipe 202 that is placed together can be tightly closed. Still see the 2nd series covered in heat dissipation # 1f / U 'Because of the hot melt before the heat transfer medium 201 ^ ^, the perforation of the 02 2, because λ苴ί丨 to the old +丄 groove 1〇3 _ 才 u is /, the edge of the hole exists in the groove 1〇3 towel::, so part of the heat transfer medium 201 will be filled into the § heat pipe 202 through the perforation, even if part of the heat 1264988 transfer medium 201 Before the scraping, the lack of ^ ..., 'and, through the mother a groove 103, is scraped by the hot Lu 2 0 2 in the groove W3; I:: 2〇1 will be scraped back again - Heat sink 1. Make the manifold 20...: Temple, that is, there is sufficient heat transfer medium 2〇1 to make the '202 and the heat release sheet 1〇1 to be tightly combined. As can be seen from the above, this section, ^ ^ The system includes ····································································································· Bay is temporarily worn (2) Let the heat pipe pass through the perforations on the heat sinks in the heat sink group. (3) Turn the heat sink group upside down; , :) Heat the heat sink group so that the heat sinks are temporarily stored in The gap between the hole edges of the heat transfer medium; 乂 满 该 该 该 该 该 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热Adhesive paste metal... can be used * silver or tin to appreciate the edge of its injection. Syringe, the heat transfer medium is injected into the perforated hole of the heat sink: == In a second preferred embodiment of the invention, the heat sink 30 is used to cover the mouthpiece. The most piled, 4 A ~ for the production of σ seed heat, for example, buckle 5, adhesive, mold 4a set up stupid 4 > hot film from the small one to ^ people, style, and 'And let the plural number appear: Lu can be formed - heat sink group; as shown in the figure, put ..., piece 30, is attached to its body 3〇1 perforation, a 菔 1 is formed a perforation 302, and along the hole The edge extension forms a ring-shaped joint portion 3〇3, and on the inner bottom surface of the joint 1264988 portion 303, a heat transfer medium for the liquid valley is formed with a groove 304, the space reserved for the groove (Please refer to Figure 5 for the main picture.)
敬請㈣第6圖所示，係利用前述散熱片3 散熱器結構的製造方半月、Α λ 、、且成— 方法及過程，首先，係令複數散埶片3η 的片體301以其接合邻| 月又’、、、片30 ^ , Ρ 03對正並排，又將膏狀的熱傳介 貝401經由各散熱片 ’丨 的牙孔302中注入，而彼覆在接 W 3〇3内底面的凹槽3G4上方，使熱傳介f仙能 地填入於凹槽3Q4 ^接著，再將熱管術穿過各散" 30的穿孔302,直到適當位置處；請參閱f 7圖所示，在 進仃熱炫作業則，先將完成熱f 4〇2插設的散熱器結構上 下翻轉’ i將之置入於一烘烤裝置中加熱，以進行熱熔， 當溫度上昇後，熱傳介質401即開始呈流體狀，由於地心 引力及熱f 402表面的毛細作用，將使熱傳介f 4Q1沿著 熱管4Ό2與穿孔302之間的間隙向下流動，隨即填滿熱管 402與穿孔302之間的間隙；經取出前述散熱片組並予冷 卻後’其上熱管402與散熱片30即可緊密的結合。 請參閱第8圖及第9圖所示，係為本發明的第三較佳 實施例，如圖所示的散熱片50可應用於各種散熱器的製 作，例如以堆疊、扣合、黏著、模具組設等方式，其將複 數片散熱片組合後即可構成一散熱片組；如圖所示的散熱 片5 0 ’其片體5 01上形成一穿孔5 0 2，而穿孔5 0 2沿孔 緣向片體5 01的其中一面延伸以形成一接合部5 〇 3，而於 接合部5 0 3的内環壁面上形成有一環槽5 0 4，該環槽5 0 4 ΐ2δ4988 例如以堆疊、扣纟、黏著、模具組設 、— 熱片組合後即可構成一散埶片；冑複數片散 其片體701上成形一穿孔，;0: 所示㈣ 错7。4,又穿T V 孔702底緣形成有-凹 拉入Α 孔7〇2孔緣延伸形成有—接合部703，心 口邛703的平面上形成有一環槽 为、士心士匕 口豕玉衣槽7 0 5仍竹 二*肢曰存的空間’用以容置膏狀的熱傳介質，同時亦呈 7二流道狀，又接合# 703上形成-貫通環槽m的開口 ⑴該開σ 7的1係相對於前述凹槽7Q4的開口 7〇41。 &敬請參閱第13圖所示，當製造散熱器結構時，係將 I狀的熱傳介質8G1，經由散熱片7Q的穿孔7〇2中注入 ，並使熱傳介質801披覆在穿孔702下緣的凹槽7〇4^， 使熱傳介f 801能部份填入於凹槽7Q4巾；再請參閱第 14圖所示，將一熱管8〇2穿設過各散熱片7〇的穿孔7〇2 中’直到適當位置處；進行熱熔前，先將完成熱管8〇2插 ^又的散熱器結構上下翻轉，並將之置入於一烘烤裝置中力 熱’以進行熱熔，當溫度上昇後，熱傳介質8〇1即開始呈 現流體狀，並會因地心引力及熱管8〇2表面的毛細作用， 由凹槽704沿著接合部703上由環槽705所構成的流道向 下流動’隨之即可填滿熱管8〇2與穿孔702之間的間隙； 組·取出散熱器結構予以冷卻後，其上的熱管802與散熱片 70即可緊密的結合。 μ 如上所述，其設計是藉由凹槽704的空間儲存部份的 熱傳介質801，再利用環槽705的設計，以使熱熔時的熱 傳介質801可以順著環槽705流下，可使流體狀熱傳介質 11 1264988 8〇1更快速的填滿熱管802 ik I敎μ 7λ /、放熱片70之間的間隙。 由以上所述可知，佑储士义 φ 备明所製造的散熱器結構， 主要係於散熱片的穿孔周緣， 值八所^ % 形成有一可供容置膏體狀熱 傳"貝的空間或凹槽，以使埶值 1史熟傳介質可於注入後，暫存於 此空間或凹槽中，當熱管穿 ^ , … σ後，再將整個散熱器結構翻 轉，並進行加溫，以使埶傳介 、◊ ^ ^ …得；丨貝叉熱後，呈流體狀而沿著 熱官與散熱片之間的間隙汚下 、 门丨卓极下，亚填滿間隙，經冷卻後， 即可完成緊密性良好的散熱器結構。 依據本發明所實行德戶斤# a 貝叮俊所I成的散熱器結構，其至少可 產生下列數項優點： 1 _本發明係在散敎片去空士凡 々々、， 月又…月禾穿5又熱官丽，先將熱傳介質披 覆預留在散熱片的穿》丨3丨@ + , 芽L孔緣處，故施加熱傳介質時，可利 用牙孔本身提供較大的空問以古 w工间以方便作業，同時更可方便掌 握熱傳介質在穿孔内的披覆狀況。 2.由於熱傳介質係呈賞狀，當散熱片進行熱熔前將先 予翻轉卩便在加熱過程中使受熱呈流體狀的熱傳介質利 用引力及熱管表面的毛細作用而流下，並充滿於熱管與穿 孔之間，藉此可確保熱管與散熱片的緊密接合，從而可提 升散熱效率。 3. 賞狀的熱傳介質，可使工作溫度的需求降低，以確 保熱管品質及結構不受損害。 4. 熱傳介質呈膏狀，易於保存及使用，且可應用於不 同尺寸的熱管與散熱片的加工。 綜上所述可知，本發明散熱片、散熱器結構及其製造 12 1264988 其據以實施後，確實可達到提供一種散埶及導 良好的散埶处碰 ^ 政…及V熱性 月文熱結構及其製造方法之目的。According to Fig. 6, the manufacturing method of the heat sink 3 heat sink structure is half-moon, Α λ, and the method and process. First, the sheet body 301 of the plurality of heat sinking sheets 3η is joined by the same. Neighbors | Month, ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Above the groove 3G4 of the inner bottom surface, the heat transfer can be filled into the groove 3Q4. Then, the heat pipe is passed through the perforations 302 of the respective "30" until the appropriate position; see Figure f7 As shown in the figure, in the hot-hot operation, the heat sink structure that has been inserted into the heat f 4〇2 is turned upside down. i is placed in a baking device for heating, and when the temperature rises. The heat transfer medium 401 starts to be fluid. Due to the gravitational force of the gravity and the capillary action of the surface of the heat f 402, the heat transfer f 4Q1 flows downward along the gap between the heat pipe 4Ό2 and the perforation 302, and then fills the heat pipe. a gap between the 402 and the through hole 302; after the heat sink group is taken out and cooled, the upper heat pipe 402 and the heat sink 30 can be Close combination. Referring to FIG. 8 and FIG. 9 , which is a third preferred embodiment of the present invention, the heat sink 50 as shown in the drawing can be applied to the fabrication of various heat sinks, for example, by stacking, snapping, adhering, The mold assembly or the like, which combines a plurality of heat sinks to form a heat sink group; as shown in the heat sink 50', a punch 5 0 2 is formed on the sheet 5 01, and the perforation 5 0 2 A ring groove 504 is formed on one side of the sheet body 511 along the edge of the hole to form a joint portion 5 43, and a ring groove 504 is formed on the inner ring wall surface of the joint portion 503, and the ring groove 5 0 4 ΐ 2δ4988 is for example Stacking, buckle, adhesive, mold set, - heat film combination can form a loose sheet; 胄 a plurality of pieces of the sheet 701 form a perforation; 0: shown (four) wrong 7.4, wear The bottom edge of the TV hole 702 is formed with a concave pull hole. The hole 7 is formed with a joint portion 703. A ring groove is formed in the plane of the core opening 703, and the heart of the heart is 士 豕 衣 7 7 7 7 5 The space of the bamboo and the limbs is still used to accommodate the paste-like heat transfer medium. It is also in the shape of a 7-channel flow, and is joined to the #703 on the through-ring groove m. The opening (1) of the opening σ 7 is relative to the opening 7〇41 of the aforementioned groove 7Q4. &Please refer to Fig. 13, when manufacturing the heat sink structure, the I-shaped heat transfer medium 8G1 is injected through the through hole 7〇2 of the heat sink 7Q, and the heat transfer medium 801 is covered in the perforation. The groove 7〇4^ of the lower edge of the 702 enables the heat transfer f 801 to partially fill the groove 7Q4; again, as shown in Fig. 14, a heat pipe 8〇2 is passed through each heat sink 7 The perforation of the crucible 7〇2 is 'until the proper position; before the hot melt is performed, the heat sink structure of the heat pipe 8〇2 is turned upside down and placed in a baking device to heat The heat is melted. When the temperature rises, the heat transfer medium 8〇1 starts to appear in a fluid state, and due to the gravity of the gravity and the capillary action of the surface of the heat pipe 8〇2, the groove 704 is grooved along the joint portion 703 by the ring groove. The flow path formed by the 705 flows downwards, which can then fill the gap between the heat pipe 8〇2 and the through hole 702. After the heat sink structure is removed and cooled, the heat pipe 802 and the heat sink 70 thereon can be tightly closed. Combination of. As described above, it is designed to pass through the heat transfer medium 801 of the space of the recess 704, and the design of the ring groove 705 is utilized, so that the heat transfer medium 801 during hot melt can flow down the ring groove 705. The fluid heat transfer medium 11 1264988 8〇1 can fill the gap between the heat pipe 802 ik I敎μ 7λ / and the heat release sheet 70 more quickly. It can be seen from the above that the structure of the heat sink manufactured by Yusuke φ φ is mainly based on the perforated circumference of the heat sink, and the value of eight is formed into a space or concave for accommodating paste-like heat transfer. The trough, so that the 埶 value 1 history of the medium can be temporarily stored in this space or groove after the injection, when the heat pipe wears ^, ... σ, then the entire radiator structure is turned over and heated, so that埶传介,◊ ^ ^ ...得; 丨 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉 叉The heat sink structure with good tightness can be completed. According to the invention, the heat sink structure of the German-made a 斤 a a a a , , , , , , , , 成 成 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器Wo wears 5 and is also hot Guan Li. First, the heat transfer medium is covered in the heat sink. 丨3丨@ + , the edge of the bud L hole, so when the heat transfer medium is applied, the hole itself can be used to provide a larger The empty space is convenient for the work in the ancient w workshop, and it is also convenient to grasp the drape of the heat transfer medium in the perforation. 2. Since the heat transfer medium is in a shape, the heat sink will be turned over before being heat-melted, and the heat-transferred heat transfer medium will flow down by the gravitational force and the capillary action of the heat pipe surface during the heating process. Between the heat pipe and the perforation, the tight junction of the heat pipe and the heat sink can be ensured, thereby improving the heat dissipation efficiency. 3. The heat transfer medium of the viewing shape can reduce the demand for working temperature to ensure that the quality and structure of the heat pipe are not damaged. 4. The heat transfer medium is paste-like, easy to store and use, and can be applied to the processing of heat pipes and heat sinks of different sizes. In summary, the heat sink and the heat sink structure of the present invention and the manufacture thereof 12 1264988 can be implemented to provide a divergence and a good divergence of the heat sink and the V heat monthly heat structure. And the purpose of its manufacturing method.
非用戈上所述者僅為本發明其中的較佳實施例而已，1 非用來限定士 a U iE 圍所作的均^ΓΓ實施範®;即凡依本發明中請專利範 -文舁修飾，皆為本發明專利範圍所涵蓋。 【圖式簡單說明】 :圖，’丁、本奄明第一實施例的立體外觀圖。 :2圖係本發明第-實施例的-製造過程示意圖。 :3圖係本發明第一實施例又一製造過程示意圖。 固係本發明弟二實施例的立體外觀圖。 第5圖係本發明第二實施例的側視剖面圖。 2 6圖係本發明第二實施例的一製造過程示意圖。 第7圖係本發明第二實施例又一製造過程示意圖。 第8圖係本發明第三實施例的側視圖。 第9圖係本發明第三實施例的側視剖面圖。 =1 〇圖係本發明第三實施例的一製造過程示意圖。 第11圖係本發明第三實施例又一製造過程示意圖。 第1 2圖係本發明第四實施例的立體外觀圖。 第1 3圖係本發明第四實施例的正視圖。 第1 4圖係本發明第四實施例的製造過程示意圖。 第1 5圖係我國專利公報公告第491 51 7號專利案之結 構示意圖。 第16圖係我國專利公報公告第491517號專利案之局 13 1264988 部放大示意圖。 第1 7圖係我國專利公報公告第568261號專利案之結 構示意圖。 【主要元件符號說明】The above description is only the preferred embodiment of the present invention, and 1 is not used to limit the implementation of the a a U iE 围 范 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Modifications are covered by the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS: Fig., a perspective view of a first embodiment of the first embodiment of the present invention. Fig. 2 is a schematic view showing the manufacturing process of the first embodiment of the present invention. Fig. 3 is a schematic view showing still another manufacturing process of the first embodiment of the present invention. The stereoscopic appearance of the second embodiment of the present invention is fixed. Figure 5 is a side cross-sectional view showing a second embodiment of the present invention. Figure 6 is a schematic view of a manufacturing process of a second embodiment of the present invention. Figure 7 is a schematic view showing still another manufacturing process of the second embodiment of the present invention. Figure 8 is a side view of a third embodiment of the present invention. Figure 9 is a side cross-sectional view showing a third embodiment of the present invention. =1 is a schematic view of a manufacturing process of a third embodiment of the present invention. Figure 11 is a schematic view showing still another manufacturing process of the third embodiment of the present invention. Fig. 1 is a perspective view showing a fourth embodiment of the present invention. Figure 13 is a front elevational view of a fourth embodiment of the present invention. Fig. 14 is a schematic view showing the manufacturing process of the fourth embodiment of the present invention. Figure 15 is a schematic diagram of the structure of the Patent No. 491 51 7 of the Patent Gazette. The 16th picture is an enlarged view of the section 13 1264988 of the Patent No. 491517 of the Patent Gazette. Fig. 17 is a schematic diagram showing the structure of Patent Patent Publication No. 568261. [Main component symbol description]
1 〇散熱片 101片體 102穿孔 103凹槽 201熱傳介質 202熱管 30散熱片 301片體 302穿孔 303接合部 304凹槽 401熱傳介質 402熱管 50散熱片 501片體 502穿孔 503接合部 504環槽 601熱傳介質 602熱管 7 0散熱片 701片體 702穿孔 703接合部 704環槽 7041 開口 705環槽 7051 開口 801熱傳介質 802熱管 141 〇 heat sink 101 sheet 102 perforation 103 groove 201 heat transfer medium 202 heat pipe 30 heat sink 301 sheet 302 perforation 303 joint portion 304 groove 401 heat transfer medium 402 heat pipe 50 heat sink 501 sheet 502 perforation 503 joint portion 504 Ring groove 601 heat transfer medium 602 heat pipe 70 heat sink 701 sheet body 702 perforation 703 joint portion 704 ring groove 7041 opening 705 ring groove 7051 opening 801 heat transfer medium 802 heat pipe 14