200829139 九、發明說明： 【發明所屬之技術領域】 本發明涉及-種散熱裝置之製造方法，尤係指一 於電子元件上之散熱裝置之製造方法。 【先前技術】 隨著電子產業之飛速發展，電腦中央處理器之運 度越來越快，其產生之熱量也隨之劇增，而過多之熱：若 無法及時排&，將嚴重影響巾央處理^行時之穩定性。 為此，業界通常在中央處理器頂面裝設—散熱裝置，利用 風扇與散熱器之組合來協助排出熱量，叫保 在適當溫度下正常工作。 to 、習知散熱裝置往往包括一貼附於中央處理器上之基座 以及焊接在基座上之散熱鰭片，並^基座上設有複數貫 孔以結合螺絲將散熱裝置固定於中央處理器上。但是在美 座與散熱鰭片之焊接過程中，哕I处 土 〇貝牙孔谷易被錫貧與松香 堵住，影響散熱裝置之安裝。 基於上述不足，業界在焊接前使用螺絲螺鎖進該螺 孔基座與散熱鰭片焊接完畢以後再將螺絲取出，從而防 止焊接過程中錫膏與松香落入 仗而防 锆π祕％ 一私曰洛入堵住貝牙孔。然而，若螺絲 2 m貫穿孔仍然、會被堵塞；若螺絲鎖得較深，合穿 2座表面將散熱鰭片顺，影響基座錢㈣片之^傳 【發明内容】 200829139 散執Git提供一種操作簡便、易於實施且用於避免 政…、衣置之貝牙孔堵塞之製造方法。 -種散熱裳置之製造方法，包括如下步驟： 直产基座、複數散熱鰭片、複數薄片及焊接劑，其 有焊接面，焊接面上同時設有複數上下貫穿之 孔該政熱鰭片具有焊接部； * M片牢固_附在基座之焊接面上以覆蓋該貫 牙孔； 塗附該焊㈣於基座之焊接面與散熱W之焊接部之 間，並組裝整個散熱裝置； 加熱該放熱裝置，使焊接劑熔融塗布於基座之焊接面 及散熱鰭片之桿接部； 冷卻該政熱裝置，通過焊接劑冷卻凝固使基座、散埶 鰭片緊密焊接在一起。 … • 與技術相比，本發明散熱裝置之製造方法通過在 基座之貝牙孔上貼附耐高溫薄片，以避免錫膏進入貫穿孔 發生堵塞操作簡便易於實施。 【實施方式】 凊參閱圖1至圖3,本發明提供一種散熱裝置之製造方 法，主要步驟包括： (一）備置該散熱裝置之基座1〇、二熱管2〇、複數散熱 ，片30、複數薄片4〇以及焊接劑（圖未示），其中該焊接劑 具有助焊劑（如松香)用以輔助焊接； 200829139 該基座ίο呈一板狀體，其底面為光滑平面，與一電子 元件（圖未示）表面接觸。該基座10上表面為焊接面15，其 頂部設有二容置熱管20之凹槽12,該二凹槽12縱向延伸， 其前端相互平行且鄰接，末端分叉，共同形成一“Y”狀結 構。基板10上設有貫穿焊接面15與下表面之帶有内螺紋 之四貫穿孔14,以供螺絲（圖未示）將其螺鎖固定於電子元 件上。 _ 熱管20之橫截面大致呈橢圓形，其形狀與凹槽12對 應呈“Y”狀。二熱管20包括靠近之吸熱段21及連接吸熱段 之分開之放熱段22。熱管20置於凹槽12内後，其上表面 與基座10上表面平齊。其中熱管20之吸熱段21置於貫穿 孔14之中間以接近電子元件，放熱段22離電子元件較遠。 薄片40由耐高溫材料組成，以克服焊接過程中高溫之 影響。薄片40形狀不限，在本實施例中大致呈正方形。薄 片40 —表面帶有粘性，以牢固粘附在基座10之貫穿孔14 ⑩之上，防止焊接過程中焊接劑流入貫穿孔14内引起堵塞。 每一散熱鰭片30為一片狀金屬體，各散熱鰭片30相 互平行並垂直於基座10上表面，並於其底部彎折形成複數 平行基座10之折緣，以形成散熱鰭片30之焊接部33。該 散熱鰭片30橫向垂直熱管20放置。 (二） 將薄片40牢固地粘附在基座10焊接面15上，並 使薄片40覆蓋於貫穿孔14上； (三） 組裝該散熱裝置，在基座10之焊接面15及基座 200829139 10之凹槽12表面塗抹糊狀之焊接劑，然後將熱管20對應 放置於凹槽12内，並在熱管20上表面也塗抹焊接劑後將 散熱鰭片30放置於基座10及熱管20上； (四） 對該組裝後之散熱裝置進行加熱，使焊接劑熔融塗 布於基座10、熱管20、散熱鰭片30之間； (五) 冷卻該散熱裝置，焊接劑冷卻凝固即可將熱管20 焊接至凹槽12内、將散熱鰭片30緊密焊接於基座10及熱 p管20表面。 至此，本發明散熱裝置之製造過程完畢，最後基座上 形成了深度與基座相等之孔，孔之開口朝下，便於螺絲從 下方旋入。 與習知技術相比，該散熱裝置之製造方法使用薄片40 粘附於貫穿孔14上有效避免了在焊接過程中焊接劑流入貫 穿孔14中，由此在焊接之前不需在貫穿孔14内預先安裝 螺絲，從而避免了在焊接前安裝螺絲以及焊接後拆卸螺絲 鲁之繁瑣過程，操作簡便易於實施，並保證了散熱鰭片30與 基座10之平穩焊接，使整個散熱裝置焊接後牢固緊靠。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 200829139 圖2係圖1散熱裝 圖3係圖1散熱裝 【主要元件符號說明】 基座 10 貫穿孔 14 熱管 20 放熱段 22 焊接部 33 置之局部組合圖。 置之組合圖。 凹槽 12 焊接面 15 吸熱段 21 散熱鰭片 30 薄片 40BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a heat dissipating device, and more particularly to a method of manufacturing a heat dissipating device on an electronic component. [Prior Art] With the rapid development of the electronics industry, the computer central processor has become faster and faster, and the heat generated by it has also increased dramatically. Too much heat: if it cannot be discharged in time, it will seriously affect the towel. The stability of the central processing. To this end, the industry usually installs a heat sink on the top surface of the central processor, using a combination of a fan and a heat sink to help dissipate heat, and to ensure proper operation at an appropriate temperature. To, conventional heat sinks often include a base attached to the central processing unit and heat sink fins soldered to the base, and a plurality of through holes are provided on the base to fix the heat sink to the center with screws On the device. However, during the welding process between the constellation and the fins, the oysters of the oysters are easily blocked by tin and rosin, which affects the installation of the heat sink. Based on the above deficiencies, the industry uses screws to lock the screw hole base and the heat sink fins before soldering, and then remove the screws to prevent the solder paste and rosin from falling into the 焊接 during the soldering process.曰洛入堵贝贝孔. However, if the screw 2 m is still through the hole, it will be blocked; if the screw is locked deeper, the two holes will be worn to make the heat sink fins smooth, affecting the base money (four) piece of the film [invention] 200829139 by Git A manufacturing method which is simple in operation, easy to implement, and used for avoiding clogging of the teeth of the government and clothing. - a manufacturing method for heat sinking, comprising the following steps: a direct production base, a plurality of heat radiating fins, a plurality of thin sheets and a soldering agent, wherein the welding surface has a plurality of holes running through the upper and lower sides of the welding fin Having a welded portion; * M piece is firmly _ attached to the welding surface of the base to cover the through hole; coated with the welding (4) between the welding surface of the base and the welded portion of the heat sink W, and assembling the entire heat sink; The heat releasing device is heated to melt-coat the solder on the soldering surface of the pedestal and the rod portion of the heat dissipating fin; the cooling device is cooled, and the susceptor and the enthalpy fin are tightly welded together by cooling and solidifying by a solder. ... Compared with the technology, the heat-dissipating device manufacturing method of the present invention attaches a high-temperature resistant sheet to the bead opening of the pedestal to prevent the solder paste from entering the through-hole. The clogging operation is simple and easy to implement. [Embodiment] Referring to FIG. 1 to FIG. 3, the present invention provides a method for manufacturing a heat dissipating device. The main steps include: (1) preparing a pedestal 1 〇, a heat pipe 2 〇, a plurality of heat dissipating devices, and a sheet 30 of the heat dissipating device; a plurality of sheets 4 〇 and a soldering agent (not shown), wherein the solder has a flux (such as rosin) for assisting soldering; 200829139 the base ίο is a plate-like body having a smooth flat surface and an electronic component (not shown) surface contact. The upper surface of the base 10 is a welding surface 15, and the top portion thereof is provided with two recesses 12 for accommodating the heat pipes 20. The two recesses 12 extend longitudinally, and the front ends thereof are parallel and adjacent to each other, and the ends are bifurcated to form a "Y". Structure. The substrate 10 is provided with four through holes 14 having internal threads extending through the welding surface 15 and the lower surface for screws (not shown) to be screwed to the electronic components. The heat pipe 20 has a substantially elliptical cross section and has a shape corresponding to the groove 12 in a "Y" shape. The two heat pipes 20 include a heat absorbing section 21 adjacent thereto and a separate heat releasing section 22 connected to the heat absorbing section. After the heat pipe 20 is placed in the recess 12, its upper surface is flush with the upper surface of the base 10. The heat absorbing section 21 of the heat pipe 20 is placed in the middle of the through hole 14 to approach the electronic component, and the heat releasing section 22 is far from the electronic component. Sheet 40 is comprised of a high temperature resistant material to overcome the effects of high temperatures during the soldering process. The shape of the sheet 40 is not limited and is substantially square in this embodiment. The sheet 40 is viscous on the surface to be firmly adhered to the through hole 14 10 of the susceptor 10 to prevent the solder from flowing into the through hole 14 during the soldering process to cause clogging. Each of the heat dissipation fins 30 is a piece of metal body, and the heat dissipation fins 30 are parallel to each other and perpendicular to the upper surface of the base 10, and are bent at the bottom thereof to form a folded edge of the plurality of parallel bases 10 to form heat dissipation fins. 30 welded portion 33. The heat sink fins 30 are placed transversely to the heat pipe 20. (2) The sheet 40 is firmly adhered to the welding surface 15 of the base 10, and the sheet 40 is covered on the through hole 14; (3) The heat dissipating device is assembled, and the welding surface 15 of the base 10 and the base 200829139 The surface of the groove 12 of the 10 is coated with a paste-like solder, and then the heat pipe 20 is correspondingly placed in the groove 12, and the heat-dissipating fins 30 are placed on the base 10 and the heat pipe 20 after the upper surface of the heat pipe 20 is also coated with a soldering agent. (4) heating the assembled heat dissipating device to melt the coating agent between the susceptor 10, the heat pipe 20, and the heat dissipating fins 30; (5) cooling the heat dissipating device, and cooling the solidifying agent to heat the tube 20 soldered into the recess 12 to tightly weld the heat sink fins 30 to the surface of the base 10 and the heat p-tube 20. So far, the manufacturing process of the heat dissipating device of the present invention is completed, and finally the hole having the same depth as the pedestal is formed on the pedestal, and the opening of the hole is downward, so that the screw can be screwed from below. Compared with the prior art, the manufacturing method of the heat dissipating device uses the sheet 40 to adhere to the through hole 14 to effectively prevent the solder from flowing into the through hole 14 during the soldering process, thereby eliminating the need for the through hole 14 before soldering. Pre-installed screws, thus avoiding the cumbersome process of installing screws before welding and removing screws after welding, the operation is simple and easy to implement, and the smooth welding of the heat-dissipating fins 30 and the base 10 is ensured, so that the entire heat-dissipating device is tightly welded after welding. by. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of the present invention. 200829139 Figure 2 is the heat dissipation of Figure 1. Figure 3 is the heat dissipation of Figure 1. [Main component symbol description] Base 10 through hole 14 Heat pipe 20 Heat release section 22 Welding part 33 Partial combination diagram. Set the combination chart. Groove 12 Welding surface 15 Endothermic section 21 Heat sink fins 30 Sheet 40
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